WO2008066137A1 - Procédé et dispositif de correction d'erreur de caractéristique haute fréquence de composant électronique - Google Patents

Procédé et dispositif de correction d'erreur de caractéristique haute fréquence de composant électronique Download PDF

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Publication number
WO2008066137A1
WO2008066137A1 PCT/JP2007/073110 JP2007073110W WO2008066137A1 WO 2008066137 A1 WO2008066137 A1 WO 2008066137A1 JP 2007073110 W JP2007073110 W JP 2007073110W WO 2008066137 A1 WO2008066137 A1 WO 2008066137A1
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Prior art keywords
measurement system
electronic component
correction data
measured
data acquisition
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PCT/JP2007/073110
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English (en)
Japanese (ja)
Inventor
Naoki Fujii
Gaku Kamitani
Taichi Mori
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Murata Manufacturing Co., Ltd.
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Publication date
Priority claimed from PCT/JP2007/067378 external-priority patent/WO2008065791A1/fr
Application filed by Murata Manufacturing Co., Ltd. filed Critical Murata Manufacturing Co., Ltd.
Priority to DE112007002891.2T priority Critical patent/DE112007002891B4/de
Priority to JP2008547039A priority patent/JP5126065B2/ja
Priority to CN2007800440531A priority patent/CN101542299B/zh
Publication of WO2008066137A1 publication Critical patent/WO2008066137A1/fr
Priority to US12/474,389 priority patent/US8423868B2/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/28—Measuring attenuation, gain, phase shift or derived characteristics of electric four pole networks, i.e. two-port networks; Measuring transient response
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
    • G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references

Definitions

  • the present invention relates to a method for correcting high-frequency characteristic errors of electronic components, and more particularly to a method for correcting errors in a measurement system in measuring high-frequency characteristics of a two-terminal impedance component.
  • the electrical characteristics of the electronic parts have been measured using an automatic characteristic sorter. Since the measurement system with the automatic characteristic sorter has different circuit characteristics from the standard measurement system, by correcting the measurement value with the automatic characteristic sorter and estimating the measurement value with the standard measurement system, Yield can be improved. As a method for performing such correction, techniques called SOLT, TRL calibration, and RRRR / TRRR calibration are known.
  • TRL calibration is the most effective technique that can be used to measure the true value of the scattering coefficient matrix of a surface-mounted component that is the subject.
  • SOLT calibration Another widely used conventional technology is SOLT calibration. These will be briefly described.
  • Figure 1 shows the error model used in a typical error elimination method (calibration method).
  • the electronic component 2 as the subject is connected on a transmission path formed on the upper surface of the measurement jig 10.
  • Connectors 51a and 61 provided at one end of the coaxial cables 50 and 60 are connected to the connectors 11a and ib provided at both ends of the transmission line of the measuring jig 10, and the other ends of the coaxial cables 50 and 60 are Connected to the network analyzer measurement port (not shown).
  • Arrows 51s and 61s indicate the calibration plane.
  • Figure 1 (b) is an error model for TRL correction, expressed as scattering coefficients S 1, S 2, S 3, and S 2.
  • Figure 1 (c) shows the error of the SOLT correction, which is measured by the scattering coefficients S 1, S 2, S 3, and S 2.
  • One measurement port represented by scattering coefficients E, E, ⁇ , ⁇ on both sides of the fixture circuit 14
  • Circuit 54 on the other side and circuit 64 on the other measurement port side represented by the scattering coefficients ⁇ and ⁇
  • TRL calibration instead of a standard device with a difficult device shape, several types of transmission lines (Lines) with different lengths are used, with direct connection between ports (Through), total reflection (Reflection usually short-circuited), and different lengths. Used as a standard device.
  • the transmission path of the standard device can be expected to be the most accurate, especially in a waveguide environment, as soon as a relatively known scattering coefficient is manufactured and the total reflection is short-circuited.
  • FIG. 3 shows the TRL calibration error factor derivation method.
  • the transmission line is hatched.
  • the calibration surface is the connection with the device as shown by arrows 2s and 2t.
  • the board 86 directly connected between the ports (Through), the board 83 of total reflection (normally short-circuited), and boards 84 and 85 of several types of transmission lines (Lines) of different lengths are used. Use as a standard device. In this example, Through is so-called Zero-Through.
  • the subject 2 is connected in series to a measurement substrate 87 that is longer by the size of the subject.
  • Fig. 4 shows the TRRR calibration error model, which is the same as the SOLT calibration error model shown in Fig. 1 (c).
  • Figure 5 shows the RRRR calibration error model, which is the same as the TRL calibration error model shown in Figure 1 (b).
  • the point of the RRRR / TRRR calibration method is the measurement method of “standard measurement value” used for calibration.
  • the measurement value of the standard device in SOLT and the standard transmission line in TRL is “standard measurement value”.
  • the measurement value measured by changing the position of the short-circuit reference on the measurement substrate 10a is taken as the “standard measurement value”. Since there is no influence of the connector, it can be said that this is a more accurate and effective method for desktop measurement than SOLT calibration and TRL calibration.
  • the jig transmission line 10s, 10t is connected to the short circuit reference (short chip). (2s) is used as a calibration reference because of the change in the reflection coefficient caused by the difference in the connection position, so if the wavelength of the signal to be measured is long (the frequency is low), the connection position of the short-circuit reference must be changed significantly. Since T and T in the figure need to be lengthened,
  • the jig 10a should be provided with a GND terminal for correction, and the short chip 2s can be positioned accurately. (For example, see Patent Documents 1 and 2).
  • Patent Document 1 WO2005 / 101033 Publication
  • Patent document 2 WO2005 / 101034
  • Non-Patent Document 1 Application Note 1287-9: In- Fixture Measurements Using Vector Net work Analyzers, ((1999 1999 Hewlett-Packard Company)
  • the test pins 32a and 32b protruding from the measurement terminal part 30 are connected to the test object.
  • the electrodes 2a and 2b of an electronic component 2 are pressed against each other and connected in series between the measurement pins 32a and 32b, and the measurement pins 32a and 32b are connected to the measuring device (not shown) via coaxial cables 34 and 36. It is connected to the. If the space is small enough to connect the electronic component 2 around the measurement terminal section 30 and it cannot be secured, the sample on the measurement terminal section 30 is substantially the same as the mass production device itself or the mass production device. Measurement system error correction must be performed under the restriction that it cannot be connected. In such a case, the following problem arises.
  • SOLT calibration requires measurement of 1-port devices at each port. That is, as shown in the plan view of the measurement board 10b in Fig. 7, when measuring two-terminal electronic parts in series connection between the slits 10k of one signal line ⁇ , it is not necessary for the measurement and is grounded to the terminal part. The terminal is V. However, since one-port devices cannot be measured without a ground conductor in SOLT calibration, it is necessary to provide a ground terminal only for calibration in order to apply SOLT calibration.
  • the present invention corrects the high-frequency characteristic error of an electronic component that can be calibrated for a two-terminal impedance component while the measurement system to be corrected remains in the same state as at the time of actual measurement. Is to provide a method.
  • the present invention provides a method for correcting a high-frequency characteristic error of an electronic component configured as follows.
  • the method of correcting the high-frequency characteristic error of an electronic component may be obtained by measuring the electronic component, which is a two-terminal impedance component, using an actual measurement system and measuring the electronic component using a reference measurement system. This is a method of calculating an estimated value of the high frequency characteristics of the electronic component.
  • the sub-component high-frequency characteristic error correction method includes: (1) a first step of preparing at least three first correction data acquisition samples with different high-frequency characteristics, which are priced in the reference measurement system; ) At least three first correction data acquisition samples, or at least three second correction data acquisition samples that can be regarded as having the same high frequency characteristics as the first correction data acquisition sample, And (3) pricing data in the reference measurement system of the first correction data acquisition sample prepared in the first step and the actual measurement in the second step.
  • the first correction data acquisition sample prepared in the first step may be pre-valued by other methods even if it is pre-valued by actually measuring with a reference measurement system. May be. For example, for a large number of samples that can be regarded as equivalent characteristics, only some of the samples may actually be measured with a reference measurement system, and the measured values may be used for pricing other samples.
  • the first and second steps can be executed using the correction data acquisition sample having substantially the same shape and size as the electronic component.
  • the force that could only be calibrated up to the tip of the coaxial connector in the measurement system of the automatic characteristic sorter The compensation up to the tip of the terminal to which the electronic component is connected can be performed by the above method.
  • the first correction data acquisition sample and the electronic component or the first correction data acquisition sample and the second correction data acquisition are used.
  • the sample for use and the electronic component are connected in series.
  • the above formula is expressed in terms of terminals 1 and 2 where impedance Z is measured when an electronic component is measured by the reference measurement system, and
  • Terminals 1 and 2 where impedance Z is measured when electronic components are measured using the actual measurement system described in mmm Are derived on the basis of an error model connected between and.
  • the error model is such that impedances Z and Z are connected in series between the terminal 1 and the terminal 1, and the impedance Z and Z An impedance Z is connected between the connection point and the ground, an impedance Z is connected between the terminal 2 and the terminal 2, and an impedance Z is connected between the terminal 2 and the ground.
  • the impedances Z, Z, Z, Z, Z are
  • Z fl -[ ⁇ (Z 22 + (Z 21 + Z 0 )) Z dl + ((Z 21 + Z.) + Z 12 ) Z 22 + Z 12 (Z 21 + Z 0 ) ⁇ Z m
  • Z / 2 -[ ⁇ (Z 22 + (Z 21 + Z.)) Z d2 + ((Z 21 + Z 0 ) + Z 12 ) Z 22 + Z 12 (Z 21 + Z 0 ) ⁇ Z ml2
  • Z 3 -[ ⁇ (Z 22 + (Z 21 + Z.)) Z rf3 + ((Z 21 + Z 0 ) + Z 12 ) Z 22 + Z n (Z 21 + z 0 ) ⁇ z ml3
  • the measurement result in the reference measurement system can be estimated by correcting the error in the transmission path for the measurement result in the series connection actual measurement system.
  • the first correction data acquisition sample and the electronic component, or the first correction data acquisition sample and the second correction data acquisition are shunt connected.
  • the above formulas are terminals 1 and 2 at which admittance Y is measured when measuring an electronic component in the reference measurement system, and terminals at which admittance Y is measured when measuring an electronic component in the above-mentioned mmm actual measurement system. Derived based on an error model connected between 1, 2 and ddd. Admittan m seen from the terminal 1 force m
  • Y is connected, and a signal is connected between the connection point between the terminal 1 and the admittance ⁇ and the ground.
  • Admittance Y is connected, and the connection point between the admittance Y and the terminal 1 is connected to the ground.
  • An admittance Y is connected between the terminals 2 and 2, and an admittance Y is connected between the terminals 2 and 2, and an admittance Y is connected between the connection point of the admittance Y and the terminal 2 and the ground.
  • the admittance Y, Y, Y, Y, Y is the first step
  • Tjl ⁇ [Satichi] ⁇ One ⁇ ⁇ ⁇
  • Y f -+ (Y 2l + Y 0 )) + ((+) + + Yn (Y +) ⁇
  • the measurement result in the reference measurement system can be estimated by correcting the error in the transmission path for the measurement result in the actual measurement system for shunt connection.
  • At least three of the first correction data acquisition sample or the second correction data acquisition sample are measured using an admittance ⁇ ⁇ , ,, ⁇
  • the first correction data acquisition sample and the electronic component, or the first correction data acquisition sample and the second correction data acquisition are connected in series.
  • the third step includes pricing in the reference measurement system of at least three samples for obtaining the first correction data having different high frequency characteristics prepared in the first step, and the second step. Acquire at least three second correction data that can be regarded as having the same high frequency characteristics as at least three of the first correction data acquisition samples or the first correction data acquisition samples that have different high frequency characteristics.
  • the mathematical formula is obtained when the electronic component is measured with two ports in the actual measurement system, compared to the impedance when the electronic component is measured in the reference measurement system.
  • Impedance is related through a two-port error model, which has only one port to which two-port differential signals are input that measure impedance when measuring electronic components in the reference measurement system 1 Derived based on the port error model.
  • the 2-port error model is converted by paying attention to the differential impedance component, and the mathematical expression for the 1-port error model is used for high-frequency characteristic error correction.
  • the formula for the 1-port error model can be uniquely determined without considering the sign from the data of the actual measurement system and the reference measurement system of at least three correction data acquisition samples with different high-frequency characteristics. As a result, the correction accuracy is improved, and effects such as mitigation of the influence of noise on the correction accuracy and simplification of the calculation algorithm can be obtained.
  • the first correction data acquisition sample and the electronic component, or the first correction data acquisition sample and the second correction data are used.
  • the sample for acquisition and the electronic component are shunt connected.
  • the third step includes pricing the at least three first correction data acquisition samples prepared in the first step, which have different high-frequency characteristics, in the reference measurement system, and the second step. At least three of the second correction data acquisition samples having different high frequency characteristics obtained in the step or at least three of the second correction data acquisition samples having the same high frequency characteristics as the first correction data acquisition sample.
  • the mathematical formula relates the admittance when an electronic component is measured with two ports in the actual measurement system to the admittance when the electronic component is measured with the reference measurement system through a two-port error model.
  • the admittance when the electronic component is measured by the reference measurement system is derived based on a one-port error model having only one port to which the in-phase signal of two ports is input.
  • the 2-port error model is converted by focusing on the in-phase admittance component, and the mathematical expression for the 1-port error model is used for high-frequency characteristic error correction.
  • the formula for the 1-port error model can be uniquely determined without considering the sign from the data of the actual measurement system and the reference measurement system of at least three correction data acquisition samples with different high-frequency characteristics. , Correction accuracy is improved, noise influence on correction accuracy is reduced, and And effects such as simplification of the calculation algorithm can be obtained.
  • the present invention also provides an electronic component high-frequency characteristic error correction apparatus used in at least the fifth step of the above-described electronic component high-frequency characteristic error correction method.
  • the high-frequency characteristic error correction apparatus for an electronic component uses (a) the mathematical expression determined in step V in the third step and the arbitrary electronic component obtained in the fourth step in the actual measurement system.
  • the present invention it is possible to perform the calibration work for the two-terminal impedance component while the measurement system to be corrected remains in the same state as that at the time of actual measurement.
  • the automatic characteristic sorter which has not had an effective calibration method, can perform sorting after performing accurate calibration. The user can guarantee the characteristics.
  • the conventional error correction technique requires work that is not in the original measurement, such as removing a terminal from the connector and connecting a standard device for error correction. For this purpose, it is necessary to provide a grounding terminal or to have a structure capable of pressing the short-circuit standard.
  • the measurement for correction may be performed by the same operation as the normal measurement.
  • there is no need for a GND terminal and a short-circuit mechanism for correction and the terminal section only needs to have a function that allows normal measurement.
  • FIG. L (a) An explanatory diagram of a measurement system, (b) a circuit diagram of an error model for TRL calibration, and (c) a circuit diagram of an error model for SOLT calibration. (Conventional example)
  • FIG. 2 is an explanatory diagram of a method for deriving an error factor in SOLT calibration. (Conventional example)
  • FIG. 3 is an explanatory diagram of a TRL calibration error factor derivation method. (Conventional example)
  • FIG. 4 is a circuit diagram of an error model for TRRR calibration. (Conventional example)
  • FIG. 5 is a circuit diagram of an error model for RRRR calibration.
  • FIG. 6 is an explanatory diagram of measurement positions in TRRR calibration and RRRR calibration.
  • Sono 7 It is a plan view of a series-connected measurement board.
  • Fig. 8 is a plan view of a measurement board for shunt connection. (Conventional example)
  • Fig. 9 is a cross-sectional configuration diagram of a main part showing a configuration of a measurement terminal unit. (Example)
  • FIG. 10 (a) Configuration diagram of measurement system, (b) Front view of measurement substrate. (Example 1)
  • FIG. 13 is a graph showing measurement results of chip resistance. (Example 2)
  • Example 17 is a circuit diagram of an equivalent circuit viewed from the port 1 side. (Example 1)
  • FIG. 21 is a circuit diagram of an equivalent circuit viewed from the port 1 side. (Example 2)
  • Fig. 23 is a circuit diagram of an equivalent circuit viewed from the port 1 side. (Example 2)
  • G. 24 is a circuit diagram of an equivalent circuit viewed from the port 1 side. (Example 2)
  • G. 26 is a circuit diagram showing a Z-parameter model of a 2-port circuit. (Examples 3 and 4) Sono 27]
  • FIG. 26 is a circuit diagram showing the T-type equivalent circuit of FIG. (Examples 3 and 4)
  • FIG. 28 is a circuit diagram showing an equivalent circuit at the time of differential signal input in FIG. 26.
  • Sono 29 is a circuit diagram showing a T-type equivalent circuit of the Z parameter of the 2-port error model. (Example 3)
  • FIG. 30 is a circuit diagram showing an equivalent circuit at the time of differential signal input of FIG. (Example 3) Sono 31]
  • FIG. 30 is a circuit diagram showing an equivalent circuit of FIG. (Example 3)
  • FIG. 32 is a circuit diagram showing a ⁇ -type equivalent circuit.
  • FIG. 33 is a circuit diagram showing an equivalent circuit when an in-phase signal is input in FIG. 31. (Example 4)
  • FIG. 34 is a circuit diagram showing a ⁇ -type equivalent circuit of the Y parameter of the 2-port error model. (Example 4)
  • FIG. 35 is a circuit diagram showing an equivalent circuit when the in-phase signal in FIG. 33 is input. (Example 4)
  • FIG. 36 is a circuit diagram showing an equivalent circuit of FIG. 34. (Example 4)
  • FIG. 37 is a block diagram of a 2-port probe. (Example 3)
  • the electrical characteristics of electronic components are usually represented by the scattering coefficient matrix. If it is a parameter that can be used, V is easier to use depending on the purpose.
  • an impedance T-type connection circuit is used here, and its error model is shown in Fig. 14. In the figure, the part enclosed by a dotted line is the error model for each port.
  • the error model is the terminals 1 and 2 where the object is measured in the reference measurement system, and the correction target.
  • the three impedance values for the correction data acquisition sample are Z, Z, and Z.
  • the error factor can be calculated by the following equation [Equation 5b] obtained from the equation [Equation 5a]. Which solution to choose from among the different soils in the equation will be described later.
  • Equation [5b] Z can be obtained by substituting Z and Z in Equation [5b] into Equation [5a] according to the following Equation [5c].
  • Z can be obtained by substituting Z and ⁇ found in the mathematical formula 6b] into the mathematical formula 6a].
  • Equation 6c can be obtained by using ZZ or ZZ ⁇ 21 dl ⁇ 22 d2 m23 d3 instead of ZZ.
  • the error model in FIG. 19 is that impedance Z and Z are connected in series between terminal 1 and terminal 1.
  • Impedance Z is connected between the connection point of impedance Z and Z and the ground
  • Impedance z is connected between
  • the impedance seen from port 1 represents the state in which the port 2 side is anti-reflective terminated (that is, normally connected to 50 ⁇ ) in the error model of Fig. 19. Is the force s that can be obtained from the set of the sample value Z for correction data acquisition and the measured value Z when it is connected.
  • Z is the characteristic impedance
  • Z / 2 -[ ⁇ (+ (Z 21 + Z 0 )) Z, 2 + ((Z 21 + Z 0 ) + Z, 2 ) Z 22 + Z 12 (Z 21 + Z 0 ) ⁇ Z ml2
  • Z Bed 3 - [ ⁇ (Z 22 + (Z 21 + Z 0)) Z rf3 + ((Z 21 + Z 0) + Z 12) Z 22 + Z 12 (Z 21 + Z 0) ⁇ Z ml3
  • the correction data acquisition sample is a series connection of two-terminal impedance elements, if the correction is performed based on the error model of FIG. 19, the same result as the correction based on FIG. 14 can be obtained.
  • the variable represents admittance.
  • the circuit model is different from that of series measurement, but they can be converted to each other.
  • the part displayed as DUT is the subject. Since it is a shunt measurement of a two-terminal impedance element, the subject can be modeled as a two-terminal impedance element.
  • the purpose of correction is to derive the value of the error model parameter in the figure from the measurement result of the correction data acquisition sample.
  • the correction data acquisition sample should be connected only in the state shown in the figure, so that the measurement jig is complicated and does not cause any problems!
  • port 2 is merely a terminal admittance, so the equivalent circuit of FIG. 21 is obtained.
  • Y is the equivalent admittance of port 2.
  • the error factor can be calculated by the following mathematical formula 8b] obtained from the mathematical formula 8a].
  • Equation 8c the mathematical formula [Equation 8c] can be obtained by using ⁇ ⁇ instead of ⁇ ⁇ , or ⁇ ⁇
  • the power can be obtained using mil dl ml2 d2 ml3 d.
  • this mathematical expression 8b] is substantially the same mathematical expression as in the case of series measurement. Which solution to choose from among the different soils in the equation will be described later.
  • the error factor can be calculated by the following mathematical formula 9b] obtained from the mathematical formula 9a].
  • Y can be obtained by substituting Y and Y obtained by the formula [Equation 9b] into the formula [Equation 9a].
  • Equation 9c uses Y, ⁇ instead of Y, ⁇ , or ⁇ , ⁇ ⁇ 21 dl ⁇ 22 d2 m23 d, The power to seek s.
  • Y and Y which are error factors that have not yet been obtained by the above procedure, are used for obtaining correction data.
  • admittance Y is connected between terminal 1 and terminal 1, and terminal 1
  • Admittance Y is connected between the connection point of admittance Y and ground and admittance m 12 11
  • the admittance Y is connected between the connection point between the terminal Y and the terminal 1 and the ground, and the terminal 2 and the terminal
  • admittance Y is connected to admittance Y, and the connection point between admittance ⁇ and terminal 2 and ground m 22 22 m
  • the impedance viewed from port 1 represents the state in which the port 2 side is anti-reflective terminated (that is, normally connected to 50 ⁇ ) in the error model of Fig. 23. Can be obtained from the set of the correction data acquisition sample value ⁇ and the measurement value ⁇ when it is connected. This is also the same as in the case of series measurement, and it is possible to calculate the following mathematical formula [10] -CY. Y in the formula indicates the characteristic admittance.
  • ⁇ -[ ⁇ (3 ⁇ 4 + (7 21 + Y 0 w dl + ((r 2 , + Y Q ) + Y U ) Y 22 + negligence+ ⁇ (-3 ⁇ 4-r 11 ) (7 21 +7 0 ) - ⁇ 1 3 ⁇ 4 ⁇ r 22 -7 11 3 ⁇ 4 (7 21 + r 0 )]
  • Y f3 -[ ⁇ ( 22 + (7 21 + Y 0 )) + (( 21 + ⁇ 0 ) + ⁇ ⁇ ) ⁇ 22 tens Y i2 (Y 21 + ⁇ ⁇ ) ⁇ 7 ml3
  • Equation 10 Since there is only one value of ⁇ , ⁇ , ⁇ , and ⁇ ⁇ obtained in Equation 10 should have the same value
  • Y and Y are error factors that form Y by connecting them in parallel.
  • Example 1 A case of series connection will be described with reference to FIG. 10 and FIG. Series connection is a method of connecting a device under test between two ports of a measuring machine.
  • the electronic component 2 as the subject is placed on the measurement board 20. It is arranged so as to straddle the slit 22x between the transmission lines 22a and 22b formed on the upper surface, and is connected in series between the transmission lines 22a and 22b.
  • SMA connectors 56 66 are soldered to both ends of the transmission lines 22a, 22b; 24 on the upper and lower surfaces of the measurement board 20, and are connected to the network analyzer 70 via coaxial cables 58, 68.
  • the network analyzer 70 uses an Agilent network analyzer 8753D, and the measurement board 20 is designed with a characteristic impedance of 50 ⁇ .
  • the measurement board 20 has a length L of 50 mm and a width W of 30 mm.
  • the electronic component 2 that is the subject is a 56 nH chip inductor of 1.0 mm X 0.5 mm size.
  • the three correction data acquisition samples include
  • Resistors of 2.2 ⁇ , 51 ⁇ , and 510 ⁇ were used.
  • the correction coefficient is calculated from the measurement data of the reference measuring instrument (4291) and the measuring instrument (8753D) actually used for measurement on a personal computer based on the principle 1> described above.
  • the procedure up to this point is the measurement system correction procedure.
  • the corrected measurement is calculated by a personal computer.
  • FIG. 11 is a graph showing the results of measurement and correction processing performed on a 1005 size chip inductor (52 nH).
  • Figure 11 (a) is a graph of the reference value, the measurement value before correction, and the measurement value after correction.
  • the “reference value” is a value measured with a reference measuring machine.
  • Before correction is the measurement result itself with the measuring instrument that is actually used for measurement, and is corrected, measured, and measured value.
  • “After correction” is a value obtained by correcting the measured value of the measuring instrument actually used for measurement (estimated value of the measured value when measured with the reference measuring instrument).
  • Fig. 1 l (b-1) is a graph of measured values before correction, Fig.
  • Fig. 11 (a) is a graph of measured values after correction
  • Fig. 11 (c) is a graph of reference values. It is. [0109] As shown in Fig. 11 (a), “reference value” and “after correction” agree well enough that they cannot be distinguished in the figure, but “before correction” is different from “reference value”. There is a big shift. In other words, if correction is not performed, only measurement values that are significantly different from those measured with the reference measurement device can be obtained, but by performing correction, measurement values that are very close to the measurement values obtained with the reference measurement device can be obtained. Power S can be.
  • Shunt connection is a method of connecting a device under test between one port of the measuring instrument and the ground.
  • the electronic component 2 that is the subject is placed on the upper surface of the measurement substrate 21, as shown in the overall configuration diagram of FIG. It is connected between the formed signal conductor 24 and the ground conductor 25.
  • the measurement board 21 has SMA connectors 56 and 66 soldered to both ends of the signal conductor 24 and the ground conductor 25, and is connected to the network analyzer 70 via coaxial cables 58 and 68.
  • a network analyzer 8753D manufactured by Agilent is used as the network analyzer 70, and the measurement board 20 is designed with a characteristic impedance of 50 ⁇ .
  • the measurement board 20 has a length L of 50 mm and a width W of 30 mm.
  • the reference measurement system is the Agilent impedance analyzer 4291 attached to the Agilent measurement jig 16192A and measured.
  • the electronic component 2 which is the subject is a 50 ⁇ chip resistor of l.Omm ⁇ 0.5mm size.
  • the correction coefficient is calculated from the measurement data of the reference measuring instrument (4291) and the measuring instrument (8753D) actually used for measurement on a personal computer based on the principle 2> described above. The procedure up to this point is the correction procedure.
  • FIG. 13 is a graph showing the results of measurement and correction processing performed on a 1005 chip resistance (50 ⁇ ).
  • Figure 13 (a) is a graph of the reference value, the measurement value before correction, and the measurement value after correction.
  • the “reference value” is a value measured with a reference measuring machine.
  • “Before correction” is the measurement result of the measuring instrument that is actually used for measurement, and is the measurement value that has not been corrected.
  • “After correction” is a value obtained by correcting the measured value of the measuring instrument actually used for the measurement (estimated value of the measured value when measured with the reference measuring instrument).
  • Fig. 13 (b-1) is a graph of measured values before correction
  • Fig. 13 (b-2) is a graph of measured values after correction
  • Fig. 13 (c) is a graph of reference values. .
  • FIG. 26 An error correction method for high frequency characteristics of an electronic component according to a second type of embodiment of the present invention will be described with reference to FIGS. 26 to 37.
  • FIG. 26 An error correction method for high frequency characteristics of an electronic component according to a second type of embodiment of the present invention will be described with reference to FIGS. 26 to 37.
  • the combination of codes as in the first type embodiment of the present invention can be realized. No selection is required. This improves the accuracy of deriving error correction parameters and the accuracy of measurement error correction. Details will be described below.
  • FIG. 26 shows a circuit diagram of a model in which a 2-port circuit is represented by Z parameters.
  • the relationship shown in Fig. 26 can be expressed as a determinant as shown in the following equation 11].
  • the correction model is as follows.
  • FIG. 29 is a circuit diagram showing a two-port error model using a T-type equivalent circuit when two-terminal impedance elements are connected in series using a measurement jig.
  • the 2-port error model is the part enclosed by the dotted line, and when measuring electronic components with the reference measurement system. Impedance Z and impedance when measuring electronic components with the actual measurement system. It is connected between two specified ports (Portl, Port2).
  • Z ' Ze-Ze + "e-Ze' ( Zg 22- Ze i2 + ⁇ -Ze ⁇ + d ) x (Ze 12 + Ze ⁇ )
  • This mathematical model 14] is equivalent to the differential impedance component Zt of the Z parameter measured by connecting two-terminal impedance elements in series using a measurement jig. That is, the formula [
  • Equation 14 is an actual measurement for impedance Z when an electronic component is measured with a reference measurement system.
  • Equation 14 shows that the circuit of FIG. 30 is equivalent to the circuit shown in FIG.
  • Fig. 31 the impedance components in the circuit are combined into three, which is the same as the one-port error model in which the error of the measurement tool is represented by a T-type equivalent circuit. This indicates that the impedance of the DUT can be derived by performing measurement and correction in the following steps (1) to (4) in the case of series connection!
  • Measurement jigs for three correction samples (chip resistance, etc.) whose characteristics (impedance) are priced, or three correction samples that can be considered to have high frequency characteristics equivalent to these three correction samples Use to measure the Z parameter.
  • a network or impedance analyzer is used for the measurement.
  • the circuit diagram of Fig. 32 shows a circuit diagram of a ⁇ -type equivalent circuit using the ⁇ parameter. If Fig. 32 is transformed into an equivalent circuit when a common-mode signal is input, the parallel admittance component of ports 1 and 2 in the ⁇ -type equivalent circuit is ⁇ in Equation 13] as shown in the circuit diagram of Fig. 33. I understand.
  • the 2-port error model in the case where a 2-terminal impedance element is shunt-connected to the circuit diagram of Fig. 34 using a measurement jig is measured as a ⁇ -type equivalent. This is shown using a circuit.
  • the 2-port error model is the part enclosed by the dotted line. Two ports (the admittance ⁇ ⁇ when measuring electronic components with the reference measurement system and the admittance when measuring electronic components with the actual measurement system) Portl and Port2).
  • the circuit in Fig. 34 is transformed into an equivalent circuit when an in-phase signal is input, the circuit diagram in Fig. 35 is obtained.
  • Yt d ⁇ Ye n -Ye 12 + Ye ⁇ -Ye M + ⁇ —— ⁇ —— -——- ⁇ — ⁇ ————— d Ye 22 -Ye l2 + Ye 33 -Ye M + Y d + Ye 12 + Ye 34
  • Equation 15 is equivalent to the in-phase admittance component Yt of the Y parameter measured by shunting a two-terminal impedance element using a measurement jig.
  • Equation [15] shows that the circuit of FIG. 34 is equivalent to the circuit shown in FIG.
  • FIG. 35 there are three admittance components in the circuit, which is the same as the one-port error model in which the error of the measurement jig is represented by a ⁇ -type equivalent circuit. This is because, as with the series-connected vertical type equivalent circuit, the balance conversion of the vertical parameter measured using the measurement jig is performed, and then 1-port correction is performed for the common-mode admittance component. Demonstrate that DUT admittance can be derived! /
  • Example 3 A measurement error correction procedure when a two-terminal impedance element is connected in series in an actual measurement system will be described.
  • Next V connect the standard 2-port sample or a sample that can be regarded as having high-frequency characteristics equivalent to the standard 2-port sample to the two ports of the actual measurement system, and measure the S parameter.
  • the error parameter of the 1-port error model is calculated from the relationship between the impedance values determined for the three standard 2-port samples and the converted differential Z parameter.
  • the three unknowns shown in Figure 31 as error parameters, namely Ze — Ze + Ze — Ze and Ze — Ze + Ze — Ze.
  • the error parameter is not uniquely determined, and no problem arises. The effects of variations and measuring instrument trace noise are alleviated.
  • Example 4 A measurement error correction procedure when a two-terminal impedance element is shunt-connected in an actual measurement system will be described.
  • the S parameter measurement result is converted into an in-phase Y parameter using the following mathematical model 17].
  • This mathematical model 17] uses the S parameter for the Y parameter on the right side of the mathematical model 15] described above. Derived by converting to a parameter.
  • the relationship between the priced value of the standard 2-port sample and the converted in-phase Y parameter is expressed using a 1-port error model.
  • the one-port error model can be converted into a reflection coefficient instead of the one shown in Fig. 36, and the relationship can be modeled.
  • the error parameter of the 1-port error model is calculated from the relationship between the admittance values of the three standard 2-port samples and the converted in-phase Y parameter.
  • the error parameters are uniquely derived by replacing the relationship with the priced values of the standard 2-port sample with the 1-port error model using balance conversion for the actual 2-port measurement system. Is done.
  • the error parameter is not uniquely determined as in the AAA correction method (Example 2), and no problem arises. The effects of variations and measuring instrument trace noise are alleviated.
  • Table 3 shows the results of correcting the chip resistance (100 ⁇ , 392 ⁇ ) using the method of Example 3 and the AAA correction (Example 1) using the 1-port error model in Fig. 31. .
  • Table 3 shows the average correction error and 3 ⁇ . Except for the average value of the resistance of 392 ⁇ , which is marked with “*” to the value with the smallest correction error, all values show the values with the smallest correction error. Also, in AAA correction method, measured value S of port 1 and port
  • Example 3 shows that the method of Example 3 can be corrected more accurately than the AAA correction method (Example 1).
  • the present invention can be applied not only to a measurement system using a measurement substrate but also to a measurement system using a measurement pin.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measurement Of Resistance Or Impedance (AREA)

Abstract

L'invention concerne un procédé de correction d'erreur de caractéristique haute fréquence de composant électronique pouvant effectuer le calibrage d'un composant d'impédance à deux bornes pendant qu'un système de mesure à corriger est dans le même état que dans la mesure réelle. Au moins 3 échantillons acquérant des données de correction ayant des caractéristiques haute fréquence différentes sont mesurés dans un système de mesure de référence et dans un système de mesure réel. Une expression permettant de mettre en corrélation une valeur de mesure obtenue dans le système de mesure réel avec une valeur de mesure obtenue dans le système de mesure de référence est choisie en utilisant un coefficient de correction d'erreur de voie de transmission. Un composant électronique arbitraire (2) est évalué dans le système de mesure réel et une valeur estimée de la caractéristique haute fréquence du composant électronique qui serait obtenue en évaluant le composant électronique dans le système de mesure de référence est calculée en utilisant l'expression choisie.
PCT/JP2007/073110 2006-11-30 2007-11-29 Procédé et dispositif de correction d'erreur de caractéristique haute fréquence de composant électronique WO2008066137A1 (fr)

Priority Applications (4)

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DE112007002891.2T DE112007002891B4 (de) 2006-11-30 2007-11-29 Verfahren und Vorrichtung zum Korrigieren eines Hochfrequenzcharakteristik-Fehlers elektronischer Komponenten
JP2008547039A JP5126065B2 (ja) 2006-11-30 2007-11-29 電子部品の高周波特性誤差補正方法及び装置
CN2007800440531A CN101542299B (zh) 2006-11-30 2007-11-29 电子部件的高频特性误差修正方法
US12/474,389 US8423868B2 (en) 2006-11-30 2009-05-29 Method for correcting high-frequency characteristic error of electronic component

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JP2006324975 2006-11-30
JP2006-324975 2006-11-30
JPPCT/JP2007/067378 2007-09-06
PCT/JP2007/067378 WO2008065791A1 (fr) 2006-11-30 2007-09-06 Procédé de correction d'erreur de caractéristiques hautes fréquences d'un composant électronique

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1082808A (ja) * 1996-08-01 1998-03-31 Hewlett Packard Co <Hp> 伝送測定誤差補正方法
JP2003240827A (ja) * 2001-12-10 2003-08-27 Murata Mfg Co Ltd 測定誤差の補正方法、電子部品の良否判定方法および電子部品特性測定装置
JP2004512504A (ja) * 2000-09-18 2004-04-22 アジレント・テクノロジーズ・インク 複数端子不平衡又は平衡装置の線形同定方法及び装置
WO2005101033A1 (fr) * 2004-03-31 2005-10-27 Murata Manufacturing Co., Ltd. Procede et dispositif pour mesurer une caracteristique electrique de haute frequence de composant electronique et procede d’etalonnage d’un dispositif de mesure de caracteristique electrique de haute frequence
WO2006030547A1 (fr) * 2004-09-16 2006-03-23 Murata Manufacturing Co., Ltd. Méthode de correction d’erreur de mesure et dispositif pour mesurer une caractéristique d’un composant électronique
WO2006090550A1 (fr) * 2005-02-22 2006-08-31 Murata Manufacturing Co., Ltd. Procede de mesure de constante dielectrique d'un materiau de ligne de transmission et procede de mesure de la caracteristique electrique d'un composant electronique en utilisant le procede de mesure de constante dielectrique
JP2006242799A (ja) * 2005-03-04 2006-09-14 Murata Mfg Co Ltd 測定誤差の補正方法及び電子部品特性測定装置
JP2006300928A (ja) * 2005-03-22 2006-11-02 Murata Mfg Co Ltd 補正データ取得用試料、測定誤差補正方法及び電子部品特性測定装置
JP2007285890A (ja) * 2006-04-17 2007-11-01 Agilent Technol Inc ネットワークアナライザの再校正方法、および、ネットワークアナライザ

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1082808A (ja) * 1996-08-01 1998-03-31 Hewlett Packard Co <Hp> 伝送測定誤差補正方法
JP2004512504A (ja) * 2000-09-18 2004-04-22 アジレント・テクノロジーズ・インク 複数端子不平衡又は平衡装置の線形同定方法及び装置
JP2003240827A (ja) * 2001-12-10 2003-08-27 Murata Mfg Co Ltd 測定誤差の補正方法、電子部品の良否判定方法および電子部品特性測定装置
WO2005101033A1 (fr) * 2004-03-31 2005-10-27 Murata Manufacturing Co., Ltd. Procede et dispositif pour mesurer une caracteristique electrique de haute frequence de composant electronique et procede d’etalonnage d’un dispositif de mesure de caracteristique electrique de haute frequence
WO2006030547A1 (fr) * 2004-09-16 2006-03-23 Murata Manufacturing Co., Ltd. Méthode de correction d’erreur de mesure et dispositif pour mesurer une caractéristique d’un composant électronique
WO2006090550A1 (fr) * 2005-02-22 2006-08-31 Murata Manufacturing Co., Ltd. Procede de mesure de constante dielectrique d'un materiau de ligne de transmission et procede de mesure de la caracteristique electrique d'un composant electronique en utilisant le procede de mesure de constante dielectrique
JP2006242799A (ja) * 2005-03-04 2006-09-14 Murata Mfg Co Ltd 測定誤差の補正方法及び電子部品特性測定装置
JP2006300928A (ja) * 2005-03-22 2006-11-02 Murata Mfg Co Ltd 補正データ取得用試料、測定誤差補正方法及び電子部品特性測定装置
JP2007285890A (ja) * 2006-04-17 2007-11-01 Agilent Technol Inc ネットワークアナライザの再校正方法、および、ネットワークアナライザ

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