WO2006076615A1 - Impression a jet d'encre d'elements non uniformes du point de vue de la composition - Google Patents
Impression a jet d'encre d'elements non uniformes du point de vue de la composition Download PDFInfo
- Publication number
- WO2006076615A1 WO2006076615A1 PCT/US2006/001303 US2006001303W WO2006076615A1 WO 2006076615 A1 WO2006076615 A1 WO 2006076615A1 US 2006001303 W US2006001303 W US 2006001303W WO 2006076615 A1 WO2006076615 A1 WO 2006076615A1
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- WIPO (PCT)
- Prior art keywords
- ink
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- dots
- electrical
- dot
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
- H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0269—Non-uniform distribution or concentration of particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Definitions
- the present invention relates to ink-jet printing of electrical components. More particularly, the invention relates to a method and apparatus for printing electrical components onto a substrate using electronic inks that takes operational and environmental parameters into account in determining a positional layout of the electronic inks.
- the electronics, display and energy industries rely on the formation of coatings and patterns of conductive materials to form circuits on organic and inorganic substrates.
- the primary methods for generating these patterns are screen printing for features larger than about 100 ⁇ m and thin film and etching methods for features smaller than about 100 ⁇ m.
- Other subtractive methods to attain fine feature sizes include the use of photo- patternable pastes and laser trimming.
- Non- vacuum, additive methods generally entail lower costs than vacuum and subtractive approaches.
- Some of these printing approaches utilize high viscosity flowable liquids.
- Screen- printing for example, uses flowable mediums with viscosities of thousands of centipoise.
- low viscosity compositions can be deposited by methods such as ink-jet printing.
- ink-jet printing of conductors has been explored, but the approaches to date have been inadequate for producing well-defined features with good electrical properties, particularly at relatively low temperatures.
- compositions for the fabrication of electrical conductors for use in electronics, displays, and other applications there exists a need for compositions that have low processing temperatures to allow deposition onto organic substrates and subsequent thermal treatment. It would also be advantageous if the compositions could be deposited with a fine feature size, such as not greater than about 100 ⁇ m, while still providing electronic features with adequate electrical and mechanical properties.
- An advantageous metallic ink and its associated deposition technique for the fabrication of electrically electrical conductors would combine a number of attributes.
- the electrical conductor would have high conductivity, preferably close to that of the pure bulk metal.
- the processing temperature would be low enough to allow formation of conductors on a variety of organic substrates (polymers).
- the deposition technique would allow deposition onto surfaces that are non-planar (e.g., not flat).
- the conductor would also have good adhesion to the substrate.
- the composition would desirably be ink- jet printable, allowing the introduction of cost-effective material deposition for production of devices such as flat panel displays (PDP, AMLCD, OLED).
- the composition would desirably also be flexo, gravure, or offset printable, again enabling lower cost and higher yield production processes as compared to screen printing.
- the invention provides a process for fabricating an electrical component having at least one anisotropic electrical quality.
- the process includes the step of ink-jet printing a plurality of droplets of each of at least two electronic inks in a predetermined pattern such that the anisotropic electrical quality is manifested.
- the ink- jet printing step may further include the steps of: selecting a first electronic ink having a known first electrical characteristic; selecting a second electronic ink having a known second electrical characteristic; determining a positional layout for each of a plurality of droplets for each of the first and second electronic inks such that the determined positional layout provides a response of the electrical component in accordance with the anisotropic electrical quality; and printing each of the plurality of droplets of each of the first and second electronic inks onto a substrate according to the determined positional layout.
- the positional layout may be three-dimensional.
- the step of determining a positional layout may further include providing a unique set of three coordinates to each droplet of each of the first and second electronic inks, wherein a first coordinate and a second coordinate jointly specify a unique position on the substrate and a third coordinate specifies an ink layer. In this instance, when two droplets have matching first and second coordinates, the droplet having a greater third coordinate is positioned directly above the droplet having a lesser third coordinate.
- the anisotropic electrical quality may be selected from the group consisting of directional conductivity; graded resistivity; directional inductance; graded inductance; and graded permittivity.
- the known first and second electrical characteristics may be selected from the group consisting of conductivity, resistivity, permittivity, and dielectric constant.
- the step of printing may include using an ink-jet printer having at least two ink-jet heads to print each of the plurality of droplets of the first electronic ink using a first ink-jet head and to print each of the plurality of droplets of the second electronic ink using a second ink-jet head.
- Figures Ia, Ib, and Ic illustrate a positional layout of a directional conductor fabricated using an ink-jet printer according to a preferred embodiment of the invention.
- Figures 2a, 2b, and 2c illustrate a positional layout of a directional dielectric device fabricated using an ink-jet printer according to a preferred embodiment of the invention.
- Figures 3a, 3b, and 3c illustrate a positional layout of a directional inductor fabricated using an ink-jet printer according to a preferred embodiment of the invention.
- Figures 4a, 4b, and 4c illustrate a positional layout of a printed resistor fabricated using an ink-jet printer according to a preferred embodiment of the invention.
- Figure 5 illustrates a positional layout of a resistor having a resistivity gradient that is fabricated using an ink-jet printer according to a preferred embodiment of the invention.
- Figure 6 illustrates a positional layout of another exemplary resistor having a resistivity gradient that is fabricated using an ink-jet printer according to a preferred embodiment of the invention.
- Figure 7 illustrates a positional layout of a dielectric device having a dielectric constant gradient that is fabricated using an ink-jet printer according to a preferred embodiment of the invention.
- Figure 8 illustrates a positional layout of an inductor having an inductance gradient that is fabricated using an ink-jet printer according to a preferred embodiment of the invention.
- Digital ink-jet printing of electronic materials enables printing of electronic features that have compositions that are non-uniform and/or functionally graded, including compositions with anisotropic electrical properties.
- two or more electronic ink materials are patterned onto a substrate.
- the resolution or positional accuracy of the placement of the materials should be at most 100 ⁇ m. Preferably, this resolution is at most 50 ⁇ m, and even more preferably, the resolution is at most 25 ⁇ m.
- Other printing techniques such as screen printing or fiexo-printing, may also be used to accomplish this with a material to material registration accuracy better than 100 ⁇ m.
- the method of digital printing of electronic ink materials to form electrical elements enables a circuit designer to be extremely precise in producing an element having a desired electrical characteristic.
- the circuit designer can accomplish this precision by choosing electronic ink materials having specific electrical characteristics when cured, and by controlling both the print layout of the electronic inks used and the thickness of those inks. Such precision enables the circuit designer a high degree of predictability with respect to the electrical characteristics of the printed circuit.
- an ink-jet printer is used to deposit at least two different electronic ink materials by using two ink-jet print heads.
- the two electronic ink materials are carefully chosen on the basis of the electrical characteristics of each ink when cured.
- a dot pattern can be printed using a conductive material such as silver ink, represented by the symbol A, and an insulative material such as polyimide ink, represented by the symbol B. Every symbol represents a single dot of ink-jet printed material printed onto a substrate.
- a dot may be a single droplet of ink, or a dot may include a group of droplets having a predetermined droplet pattern.
- Figure Ia illustrates a first layer of deposited electronic ink; i.e., this first layer is printed directly onto the substrate surface.
- Figure Ib illustrates a second layer of deposited electronic ink; i.e., this second layer is printed on top of the first layer, in correspondingly respective positions.
- Figure Ic represents a third layer of deposited electronic ink, which is printed on top of the second layer. It is noted that any number of additional layers of electronic ink may be printed, each successively on top of the previous layer.
- a Z-axis conductor is printed with a high electrical conductivity in the Z direction, and a low electrical conductivity in the X and Y directions.
- every dot of conductive silver ink is abutted by a dot of insulative polyimide ink, and every dot of insulative polyimide ink is abutted by a dot of conductive silver ink.
- every dot of conductive silver ink is deposited directly on top of a previously deposited dot of conductive silver ink, and every dot of insulative polyimide ink is deposited directly on top of a previously deposited dot of insulative polyimide ink.
- current will tend to flow in the Z direction, from silver ink dot to silver ink dot, and not in the X or Y directions, where there are no abutting conductive silver ink dots.
- the conductive device can be produced such that the direction of conductivity is either the X direction or the Y direction instead of the Z direction, by selecting an appropriate ink dot layout such that the abutting conductive silver ink dots are arranged in the desired direction.
- FIG. 2a another exemplary ink dot layout includes a material with high dielectric constant, represented by the symbol C, and a material with a low dielectric constant, represented by the symbol D.
- a first layer which is deposited directly onto the substrate surface, is illustrated in Figure 2a; a second layer, which is deposited on top of the first layer in corresponding positions, is illustrated in Figure 2b; and a third layer, which is deposited directly on top of the second layer, is illustrated in Figure 2c.
- any number of additional layers having the same ink dot layout may be printed, each successively on top of the previously deposited layer, hi this example, an anisotropic electronic device having a high dielectric constant in the Z direction and a low dielectric constant in the X and Y directions is produced.
- the dielectric device can be produced such that the direction having a high dielectric constant is either the X direction or the Y direction instead of the Z direction, by selecting an appropriate ink dot layout such that the abutting ink droplets having a high dielectric constant are arranged in the desired direction.
- a third exemplary ink dot layout includes a relatively highly magnetic material, such as nickel, cobalt, iron, or a composition containing one or more of these metals, and a material with relatively low magnetization properties, such as a dielectric material.
- the highly magnetic ink is represented by the symbol F and the ink having low magnetization is represented by the symbol G.
- a first layer, which is deposited directly onto the substrate surface, is illustrated in Figure 3 a; a second layer, which is deposited on top of the first layer in corresponding positions, is illustrated in Figure 3b; and a third layer, which is deposited directly on top of the second layer, is illustrated in Figure 3c.
- any number of additional layers having the same ink dot layout may be printed, each successively on top of the previously deposited layer.
- an anisotropic device having a high inductance in the Z direction and a low inductance in the X and Y directions is produced.
- such a device exhibits lower magnetic loss than an isotropic material.
- the inductive device can be produced such that the direction of high inductance is either the X direction or the Y direction instead of the Z direction, by selecting an appropriate ink dot layout such that the abutting highly magnetic ink dots are arranged in the desired direction.
- a fourth exemplary ink dot layout uses the same inks as shown in Figures 3 a, 3b, and 3 c.
- a first layer, which is deposited directly onto the substrate surface, is illustrated in Figure 4a;
- the second layer has the ink dot positions exactly reversed from each of the first and third layers.
- any number of additional layers having the same ink dot layout may be printed, with each successive layer having the exact reverse ink layout as the previously deposited layer.
- the resulting device is isotropic, and it exhibits a checkerboard magnetization characteristic.
- a device having a resistivity gradient includes two electronic inks, represented by Q and R respectively.
- the first ink Q has a relatively low resistivity value when cured, and the second ink R has a relatively high resistivity value when cured. Therefore, because there are more Q dots toward the left side of the device, and the number of R dots gradually increases from left to right, accordingly the resistivity gradient increases from low to high.
- This type of device may be useful as a signal line termination application.
- FIG. 6 another exemplary ink dot layout uses the same two inks as shown in Figure 5.
- the resistivity gradient starts at left with a low resistivity, increases to a high resistivity at the center of the device, then decreases back to a low resistivity at the right side of the device.
- This device may be used as a standard resistor to enhance the tolerance of the printed resistor component when there is poor registration between the resistor material and the resistor electrodes.
- a device having a graded dielectric constant has a similar ink dot layout as that shown in Figure 5.
- the two inks used are a, material with high dielectric constant, represented by the symbol C, and a material with a low dielectric constant, represented by the symbol D.
- the resulting device has a relatively high dielectric constant at the left side, and the dielectric constant gradually decreases from left to right.
- An application for a graded dielectric device is as a gate dielectric for use in a metal-oxide-semiconductor field effect transistor (MOSFET).
- MOSFET metal-oxide-semiconductor field effect transistor
- the gate is located at the high-K end of the gate dielectric device (i.e., the left side of Figure 7), and the source and drain of the MOSFET are located at the low-K end of the gate dielectric device (i.e., the right side of Figure 7).
- a device having a graded inductance constant has a similar ink dot layout as those shown in Figures 5 and 6.
- the two inks used are a highly magnetic material, represented by the symbol F, and a material having low magnetization, such as a dielectric material, represented by the symbol G.
- the resulting device has a relatively high inductance at the left side, and the inductance gradually decreases from left to right.
- variation in the thickness of the selected electronic inks can be used to produce desired electrical characteristics.
- a conductive element having a tapering thickness can be fabricated for use as an RFID antenna.
- Such an application is useful, because an RFID antenna may be quite lengthy, but typically, the antenna does not require uniform thickness throughout its entire length.
- material can be conserved. This may translate into cost savings, for example, if a conductive silver ink is used.
- Thickness variations may also be used to tailor circuit elements based on characteristics such as a desired voltage rating.
- the ink dots can be interlaced in various ways.
- two inks that do not blend are used, such as a water-based ink and an oil-based ink. This creates a matrix of two discrete components.
- a first ink can be printed first and can be cured, either partially or completely, before the second ink is printed.
- blendable inks can be partially blended on the substrate. Blending of inks can be accomplished by printing "wet on wet", i.e., printing the second ink while the first ink is still wet and has not yet cured. Blending may also be accomplished by printing "wet next to wet”, i.e., printing the second ink in positions that directly abut dots of the first ink within the same layer prior to curing. The quality of such blends is enhanced by selecting inks formulations that can be blended easily.
- inks may be selectively chosen such that the gradient is smoothed out because the electrical characteristics of the chosen inks are relatively close in magnitude.
- inks may be chosen such that the gradient is smoothed out because the electrical characteristics of the chosen inks are relatively close in magnitude.
- inks having sharply distinct characteristic values may be chosen to accentuate the desired application.
- an anisotropic circuit element may include the use of a conductive silver ink in conjunction with a semiconductive silicon ink.
- a third ink such as a nickel ink to be used as a barrier layer between the silver ink and the silicon ink, may also be employed.
- a user has tremendous leeway in selecting any number and any types of inks that provide the desired characteristics for the printed element.
Abstract
L'invention porte sur un procédé de fabrication de composantes électriques possédant au moins une qualité électrique anisotrope. Ce procédé consiste à effectuer une impression à jet d'encre d'une pluralité de points constitués chacun d'au moins deux encres électroniques selon un motif prédéfini de sorte que la qualité électrique anisotrope soit évidente. L'étape d'impression à jet d'encre peut également consister à sélectionner une première encre électronique possédant une première caractéristique électrique connue ; déterminer un agencement des positions pour chacun des points de la pluralité de points constitués chacun des première et seconde encres électroniques de sorte que l'agencement déterminé des positions génère une réponse de la composante électrique conformément à la qualité électrique anisotrope ; et imprimer chaque point de la pluralité de points constitués chacun des première et seconde encres électroniques sur un substrat conformément à l'agencement déterminé des positions.
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
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US64362905P | 2005-01-14 | 2005-01-14 | |
US64357705P | 2005-01-14 | 2005-01-14 | |
US64357805P | 2005-01-14 | 2005-01-14 | |
US60/643,629 | 2005-01-14 | ||
US60/643,577 | 2005-01-14 | ||
US60/643,578 | 2005-01-14 | ||
US69542105P | 2005-07-01 | 2005-07-01 | |
US60/695,421 | 2005-07-01 |
Publications (1)
Publication Number | Publication Date |
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WO2006076615A1 true WO2006076615A1 (fr) | 2006-07-20 |
Family
ID=36216959
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/US2006/001303 WO2006076615A1 (fr) | 2005-01-14 | 2006-01-13 | Impression a jet d'encre d'elements non uniformes du point de vue de la composition |
Country Status (2)
Country | Link |
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US (1) | US20060158497A1 (fr) |
WO (1) | WO2006076615A1 (fr) |
Cited By (1)
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EP1983530A1 (fr) * | 2006-02-03 | 2008-10-22 | Murata Manufacturing Co. Ltd. | Composant electronique et son procede de fabrication |
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WO2006076605A2 (fr) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Modelisation de circuit et projection selective |
US8383014B2 (en) | 2010-06-15 | 2013-02-26 | Cabot Corporation | Metal nanoparticle compositions |
TW200642785A (en) | 2005-01-14 | 2006-12-16 | Cabot Corp | Metal nanoparticle compositions |
US7824466B2 (en) | 2005-01-14 | 2010-11-02 | Cabot Corporation | Production of metal nanoparticles |
WO2006076607A1 (fr) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Impression au jet d'encre de composants electriques passifs |
WO2006076606A2 (fr) | 2005-01-14 | 2006-07-20 | Cabot Corporation | Impression multicouches optimisee de dispositifs electroniques et d'afficheurs |
WO2006076604A2 (fr) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Procedes pour planariser des substrats et pour encapsuler des elements electroniques imprimables |
WO2006076609A2 (fr) | 2005-01-14 | 2006-07-20 | Cabot Corporation | Elements electroniques imprimables sur un substrat non uniforme et procedes de fabrication associes |
KR100649445B1 (ko) * | 2005-10-17 | 2006-11-27 | 삼성전기주식회사 | 배선형성 방법 및 장치 |
US20070279182A1 (en) * | 2006-05-31 | 2007-12-06 | Cabot Corporation | Printed resistors and processes for forming same |
US20080075863A1 (en) * | 2006-08-16 | 2008-03-27 | Lexmark International, Inc. | Tunable dielectric compositions and methods |
KR20140051312A (ko) * | 2011-08-19 | 2014-04-30 | 후지필름 가부시키가이샤 | 도전 패턴, 그 형성 방법, 프린트 배선판 및 그 제조 방법 |
JP5529835B2 (ja) * | 2011-11-22 | 2014-06-25 | 富士フイルム株式会社 | 導電性パターン形成方法及び導電性パターン形成システム |
US20150197062A1 (en) * | 2014-01-12 | 2015-07-16 | Zohar SHINAR | Method, device, and system of three-dimensional printing |
US20150201500A1 (en) * | 2014-01-12 | 2015-07-16 | Zohar SHINAR | System, device, and method of three-dimensional printing |
EP3060031B1 (fr) * | 2015-02-19 | 2017-05-31 | voestalpine Stahl GmbH | Procédé d'enduction de bandes en continu |
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