WO2006073168A1 - ハードディスクドライブ内部部品 - Google Patents
ハードディスクドライブ内部部品 Download PDFInfo
- Publication number
- WO2006073168A1 WO2006073168A1 PCT/JP2006/300062 JP2006300062W WO2006073168A1 WO 2006073168 A1 WO2006073168 A1 WO 2006073168A1 JP 2006300062 W JP2006300062 W JP 2006300062W WO 2006073168 A1 WO2006073168 A1 WO 2006073168A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- hard disk
- disk drive
- parts
- internal
- polyphenylene ether
- Prior art date
Links
- 229920005989 resin Polymers 0.000 claims abstract description 73
- 239000011347 resin Substances 0.000 claims abstract description 73
- 229920001955 polyphenylene ether Polymers 0.000 claims abstract description 67
- 239000011342 resin composition Substances 0.000 claims abstract description 45
- 238000000034 method Methods 0.000 claims description 33
- 238000000465 moulding Methods 0.000 claims description 31
- 229920000728 polyester Polymers 0.000 claims description 28
- 238000004519 manufacturing process Methods 0.000 claims description 24
- 239000004973 liquid crystal related substance Substances 0.000 claims description 23
- 150000001875 compounds Chemical class 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims description 20
- 125000003118 aryl group Chemical group 0.000 claims description 17
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 15
- 239000001301 oxygen Substances 0.000 claims description 15
- 229910052760 oxygen Inorganic materials 0.000 claims description 15
- 229920000642 polymer Polymers 0.000 claims description 15
- 238000004898 kneading Methods 0.000 claims description 13
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 11
- 238000006116 polymerization reaction Methods 0.000 claims description 11
- 239000002904 solvent Substances 0.000 claims description 10
- 238000001746 injection moulding Methods 0.000 claims description 9
- 239000002994 raw material Substances 0.000 claims description 8
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 5
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 5
- 239000011261 inert gas Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 5
- 244000309464 bull Species 0.000 claims 2
- 238000011109 contamination Methods 0.000 abstract description 44
- 239000000843 powder Substances 0.000 abstract description 21
- 238000004506 ultrasonic cleaning Methods 0.000 abstract description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 19
- 230000005484 gravity Effects 0.000 abstract description 18
- 238000010521 absorption reaction Methods 0.000 abstract description 16
- 239000002245 particle Substances 0.000 abstract description 14
- 239000000047 product Substances 0.000 description 31
- -1 polyoxymethylene Polymers 0.000 description 24
- 238000010943 off-gassing Methods 0.000 description 23
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 22
- 150000002500 ions Chemical class 0.000 description 22
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 18
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 14
- 229920001577 copolymer Polymers 0.000 description 14
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 13
- 238000011156 evaluation Methods 0.000 description 12
- 239000008188 pellet Substances 0.000 description 12
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 11
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 10
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 10
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 10
- 229920002554 vinyl polymer Polymers 0.000 description 10
- 239000011777 magnesium Substances 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 8
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 8
- 239000011701 zinc Substances 0.000 description 8
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 7
- 239000005977 Ethylene Substances 0.000 description 7
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000011787 zinc oxide Substances 0.000 description 7
- OMIHGPLIXGGMJB-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]hepta-1,3,5-triene Chemical compound C1=CC=C2OC2=C1 OMIHGPLIXGGMJB-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000004698 Polyethylene Substances 0.000 description 6
- 229920000573 polyethylene Polymers 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 5
- 239000004793 Polystyrene Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- QQOMQLYQAXGHSU-UHFFFAOYSA-N 2,3,6-Trimethylphenol Chemical compound CC1=CC=C(C)C(O)=C1C QQOMQLYQAXGHSU-UHFFFAOYSA-N 0.000 description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 230000003749 cleanliness Effects 0.000 description 4
- 239000011256 inorganic filler Substances 0.000 description 4
- 229910003475 inorganic filler Inorganic materials 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- KAUQJMHLAFIZDU-UHFFFAOYSA-N 6-Hydroxy-2-naphthoic acid Chemical compound C1=C(O)C=CC2=CC(C(=O)O)=CC=C21 KAUQJMHLAFIZDU-UHFFFAOYSA-N 0.000 description 3
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 229920001400 block copolymer Polymers 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 210000001520 comb Anatomy 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical group CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 150000001242 acetic acid derivatives Chemical class 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229920006038 crystalline resin Polymers 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 238000007306 functionalization reaction Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000004817 gas chromatography Methods 0.000 description 2
- 238000002290 gas chromatography-mass spectrometry Methods 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 150000004679 hydroxides Chemical class 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 150000002484 inorganic compounds Chemical class 0.000 description 2
- IVSZLXZYQVIEFR-UHFFFAOYSA-N m-xylene Chemical group CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 238000011002 quantification Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 238000013022 venting Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- PFHTYDZPRYLZHX-UHFFFAOYSA-N 2-(2,5-dihydroxyphenyl)benzene-1,4-diol Chemical compound OC1=CC=C(O)C(C=2C(=CC=C(O)C=2)O)=C1 PFHTYDZPRYLZHX-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- KUNNUNBSGQSGDY-UHFFFAOYSA-N 2-butyl-6-methylphenol Chemical compound CCCCC1=CC=CC(C)=C1O KUNNUNBSGQSGDY-UHFFFAOYSA-N 0.000 description 1
- GVLZQVREHWQBJN-UHFFFAOYSA-N 3,5-dimethyl-7-oxabicyclo[2.2.1]hepta-1,3,5-triene Chemical compound CC1=C(O2)C(C)=CC2=C1 GVLZQVREHWQBJN-UHFFFAOYSA-N 0.000 description 1
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- VYLJAYXZTOTZRR-BTPDVQIOSA-N CC(C)(O)[C@H]1CC[C@@]2(C)[C@H]1CC[C@]1(C)[C@@H]2CC[C@@H]2[C@@]3(C)CCCC(C)(C)[C@@H]3[C@@H](O)[C@H](O)[C@@]12C Chemical compound CC(C)(O)[C@H]1CC[C@@]2(C)[C@H]1CC[C@]1(C)[C@@H]2CC[C@@H]2[C@@]3(C)CCCC(C)(C)[C@@H]3[C@@H](O)[C@H](O)[C@@]12C VYLJAYXZTOTZRR-BTPDVQIOSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 208000030984 MIRAGE syndrome Diseases 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 102100023195 Nephrin Human genes 0.000 description 1
- 239000004419 Panlite Substances 0.000 description 1
- 239000005662 Paraffin oil Substances 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 229920010524 Syndiotactic polystyrene Polymers 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229920013629 Torelina Polymers 0.000 description 1
- 239000004742 Torelina™ Substances 0.000 description 1
- 229920004747 ULTEM® 1000 Polymers 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 238000001467 acupuncture Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000004103 aminoalkyl group Chemical group 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004587 chromatography analysis Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 239000007857 degradation product Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- IMHDGJOMLMDPJN-UHFFFAOYSA-N dihydroxybiphenyl Natural products OC1=CC=CC=C1C1=CC=CC=C1O IMHDGJOMLMDPJN-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- LRMHFDNWKCSEQU-UHFFFAOYSA-N ethoxyethane;phenol Chemical compound CCOCC.OC1=CC=CC=C1 LRMHFDNWKCSEQU-UHFFFAOYSA-N 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
- 229920005669 high impact polystyrene Polymers 0.000 description 1
- 239000004797 high-impact polystyrene Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- VYLJAYXZTOTZRR-UHFFFAOYSA-N hopane-6alpha,7beta,22-triol Natural products C12CCC3C4(C)CCCC(C)(C)C4C(O)C(O)C3(C)C1(C)CCC1C2(C)CCC1C(C)(O)C VYLJAYXZTOTZRR-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002431 hydrogen Chemical group 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 238000004255 ion exchange chromatography Methods 0.000 description 1
- UEGPKNKPLBYCNK-UHFFFAOYSA-L magnesium acetate Chemical compound [Mg+2].CC([O-])=O.CC([O-])=O UEGPKNKPLBYCNK-UHFFFAOYSA-L 0.000 description 1
- 239000011654 magnesium acetate Substances 0.000 description 1
- 235000011285 magnesium acetate Nutrition 0.000 description 1
- 229940069446 magnesium acetate Drugs 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- MNZMMCVIXORAQL-UHFFFAOYSA-N naphthalene-2,6-diol Chemical compound C1=C(O)C=CC2=CC(O)=CC=C21 MNZMMCVIXORAQL-UHFFFAOYSA-N 0.000 description 1
- 108010027531 nephrin Proteins 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229940078552 o-xylene Drugs 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- FMIORWSKZKIJQZ-UHFFFAOYSA-N phenol;pyrrole-2,5-dione Chemical compound OC1=CC=CC=C1.O=C1NC(=O)C=C1 FMIORWSKZKIJQZ-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920005678 polyethylene based resin Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- TVLSRXXIMLFWEO-UHFFFAOYSA-N prochloraz Chemical compound C1=CN=CN1C(=O)N(CCC)CCOC1=C(Cl)C=C(Cl)C=C1Cl TVLSRXXIMLFWEO-UHFFFAOYSA-N 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000003039 volatile agent Substances 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
- G11B33/121—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules the apparatus comprising a single recording/reproducing device
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1446—Reducing contamination, e.g. by dust, debris
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
Definitions
- the present invention relates to a polyphenylene ether-based resin excellent in low outgassing, ultrasonic cleaning resistance, low ion contamination, fine particle contamination, repeated detachability, heat resistance, specific gravity, and water absorption. It relates to internal components of the hard disk drive.
- Hard disk drives are 3.5 inches, 2.5 inches, 1 with the advent of digital home appliances such as personal computers, hard disk DVD drive recorders, digital video cameras, portable digital music players, and mobile phones. 8 inches, 1.0 inches, and 0.85 inches, downsizing is progressing along with large capacity. Therefore, many of the hard disk drive internal parts are strongly required to be reduced in size because of demands for miniaturization and cost.
- polyoxymethylene resin for example, see International Publication No. 03-055945
- polyphenylene sulfide resin for example, Japanese Patent Application Laid-Open No. 2003-335871. It is proposed to use the publication! RU
- brackets, latches, combs, boilers, bushes, mount plates, hooks, etc. Used. However, these are not sufficient in terms of the balance of low outgas, cleanliness (not including silicon, halogen and sulfur elements), cost, specific gravity and water absorption.
- a resin composition in which liquid crystalline resin is alloyed with polyethylene terephthalate (PET) or polyamide has been proposed.
- PET polyethylene terephthalate
- HDD parts are only one line, and specific HDD internal parts are also described in terms of residual volatile components, low outgas, low ion contamination, and repeated desorption of polyphenylene ether. (For example, see Japanese Patent Laid-Open No. 11 263829)
- Thermoplastic resin is a force proposed for antistatic materials for hard disk drive disks and magnetic heads. It is a description of a substantially polycarbonate resin, and a specific alloy of a polyurethane-polyether. In addition, there is no description of residual volatile components, low outgas, low ion contamination, and repeated detachability (see, for example, JP-A-2002-275276).
- modified polyphenylene ether is used for the base (casing) of hard disk drives.
- residual volatile content of polyphenylene ether, low outgas, low ion contamination and repeated There is no mention of detachability! (For example, JP-A-3-280271) (See the publication).
- the present invention is a resinous noble having excellent balance of low outgassing property, ultrasonic cleaning resistance, low ion contamination property, particle powder contamination property, repeated detachability, heat resistance, specific gravity, and water absorption. It is to provide internal disk drive components.
- the present inventors have found that an internal component of a hard disk drive obtained by molding a resin composition containing a poly (phenylene ether) resin, The present invention has been completed by finding that it is excellent in the balance of low outgassing property, ultrasonic cleaning resistance, low ion contamination property, particle powder contamination property, repeated detachability, heat resistance, specific gravity and water absorption.
- the resin composition comprising (A) a polyphenylene ether-based resin contains less than 3000 ppm of residual volatile components having a polyphenylene ether polymerization solvent and / or a styrene monomer power.
- the hard disk drive internal component force The internal component of the hard disk drive according to any one of [1] to [5] above, which has a detachable part,
- the resin composition comprising the (A) polyphenylene ether-based resin contains a residual volatile component composed of a polyphenylene ether polymerization solvent and Z or styrene monomer in an amount of less than 3000 ppm. 8) or a resin composition for internal parts of a hard disk drive according to [9],
- a method for producing a resin composition as a raw material for internal components of a hard disk drive comprising: (A) a polyphenylene ether-based resin, (B) a liquid crystal polyester, (C) a Zn element and a Z or Mg element At least one or more components selected from the contained compounds are melt-kneaded by an extruder, and at least one vent is provided in the kneading zone, and the front vent is devolatilized at a vacuum level of ⁇ 40 kPa or less, At the same time, an inert gas is blown into the feed port, A method for producing a rosin composition, the degree of which is 5% or less,
- the present invention is based on the use of a resin composition containing a polyphenylene ether-based resin as an internal component of a hard disk drive. Therefore, the present invention provides
- the resin composition comprising the (A) polyphenylene ether-based resin contains less than 3000 ppm of residual volatile components comprising a polyphenylene ether polymerization solvent and Z or a styrene monomer. 19) or use of the rosin composition according to [20],
- the inside of a noble resin disk drive excellent in the balance of low outgassing, ultrasonic cleaning resistance, low ion contamination, particulate powder contamination, repeated attachment / detachment, heat resistance, specific gravity and water absorption Parts can be provided.
- the (A) polyphenylene ether-based resin used in the present invention also has a repeating unit structural force of the following formula 1, and has a reduced viscosity (0.5 gZdl, black-form solution, measured at 30 ° C.) of 0.15: ⁇ 1. Homopolymers and Z or copolymers in the range of OdlZg. A more preferred reduced viscosity is in the range of 0.20 to 0.70 dlZg, and still more preferably in the range of 0.40 to 0.60.
- R and R are each independently hydrogen, primary or secondary lower alkyl
- R aminoalkyl, hydrocarbon oxy.
- R and R are independently hydrogen
- polyphenylene ether-based resin examples include poly (2,6 dimethyl-1,4 phenylene ether), poly (2-methyl-6 ethyl 1,4 phenylene ether), poly (2— Methyl 6-phenol 1,4 phenol ether), poly (2,6 dichloro-1,4-phenol ether) and the like, and 2, 6 dimethyl phenol and other phenols (for example, Polyphenylene ether copolymers such as copolymers with 2, 3, 6 trimethylphenol and 2-methyl-6-butylphenol).
- Polyphenylene ether copolymers such as copolymers with 2, 3, 6 trimethylphenol and 2-methyl-6-butylphenol.
- a copolymer of 2,6 dimethylphenol and 2,3,6 trimethylphenol is preferred.
- -Lenether is more preferred.
- the (A) polyphenylene ether-based resin of the present invention may be used as a powder after polymerization, or devolatilized in a nitrogen gas atmosphere or a non-nitrogen gas atmosphere using an extruder or the like.
- Pellet toy can be used by melting and kneading under or non-devolatilization.
- the (A) polyphenylene ether-based resin of the present invention also includes polyphenylene ethers functionalized with various dienophile compounds.
- Various dienophile compounds include, for example, maleic anhydride, maleic acid, fumaric acid, phenol maleimide, itaconic acid, acrylic acid, methacrylic acid, methyl allylate, methyl metatalylate, glycidyl atylate, glycidyl Examples include compounds such as metatalylate, stearyl acrylate and styrene.
- an extruder may be used in the presence or absence of a radical generator, and functionalization may be performed in a molten state under devolatilization or non-devolatilization. .
- the functionalization may be performed in a non-molten state, that is, in a temperature range from room temperature to the melting point in the presence or absence of a radical generator.
- the melting point of the polyphenylene ether is the peak top of the peak observed in the temperature heat flow graph obtained when the temperature is raised at 20 ° CZ in the differential thermal scanning calorimeter (DSC). When there are multiple peak top temperatures, the highest temperature is defined.
- the (A) poly (phenylene ether) resin of the present invention is a polyphenylene ether resin alone or a mixture of a polyphenylene ether resin and an aromatic bulle polymer. A mixture of these resins is also included.
- Aromatic bulle polymer is, for example, Examples include tactic polystyrene, high impact polystyrene, syndiotactic polystyrene, and acrylonitrile monostyrene copolymer. In the case of using a mixture of polyphenylene ether resin and aromatic bulle polymer, from the viewpoint of low outgas and heat resistance, the total amount of polyphenylene ether resin and aromatic bulle polymer is used.
- the amount of the polyethylene ether resin is 30 parts by mass or more, preferably 50 parts by mass or more, more preferably 70 parts by mass or more, and even more preferably 80 parts by mass or more. That is, (A) the proportion of the poly (phenylene ether) resin containing the aromatic vinyl polymer is preferably less than 70 parts by mass, more preferably less than 50 parts by mass, further preferably less than 30 parts by mass, More preferably, it is less than 20 parts by mass.
- the lower limit is not particularly limited, but is preferably 0.5 parts by mass or more from the viewpoint of flow.
- a polymer obtained by cation polymerization can be preferably used from the viewpoint of thermal stability, that is, from the viewpoint of residual volatile components.
- the hard disk drive internal component according to the present invention is a hard disk drive internal component obtained by molding a resin composition containing (A) a polyphenylene ether-based resin. As illustrated in Fig. 1, it is a resin component mounted inside a hard disk drive.
- Each function can be used according to the size and design of the node disk drive. Specific examples include brackets, latches, combs, boilers, bushes, mount plates, hooks, and lamps. In particular, brackets, latches, combs, boilers, bushes, mount plates, and hooks that do not require slidability are suitable.
- the internal component of the hard disk drive according to the present invention is an internal component of the hard disk drive having an attaching / detaching portion, and examples thereof include a mount plate, a hook, and a blanket. Further, parts that do not require transparency, specifically, mount plates, hooks, and brackets are suitable. Furthermore, a mount plate and a hook are more suitable.
- Figure 2 shows an enlarged view of the mount plate and hook.
- the mount plate has a function of reinforcing a flexible printed circuit (FPC) terminal and a function of an insulating plate.
- the hook has a function of fitting and fixing these mount plate, metal plate (mainly stainless steel plate) and flexible printed circuit board.
- the bracket is mainly L-shaped and has a base function to support the IC.
- Resin composition power comprising polyphenylene ether-based resin of the present invention
- Polyethylene ether polymerization solvent and residual volatile component having Z or styrene monomer power may be contained in less than 30 OOppm. preferable.
- This residual volatile component is preferably less than 3000 ppm, more preferably less than 2000 ppm, particularly preferably less than 1000 ppm, particularly preferably less than 500 ppm, and more particularly less than 250 ppm, from the viewpoint of low outgassing of hard disk drive internal components.
- Improved low outgassing reduces the amount of accumulation at the tip of the magnetic head and improves the operational reliability, stability, and long-life characteristics of hard disk drive products. It is a very important property for the
- the residual volatile component of the present invention is (A) a solvent component contained in the poly (phenylene ether) resin when polymerizing the poly (phenylene ether) resin.
- a decomposition product derived from polystyrene resin produced by heat may be contained in the resin composition, and these are also the residue of the present invention. Included in volatile components.
- Specific examples of the residual solvent component include ethylbenzene, o-xylene, m-xylene, p-xylene and toluene.
- a specific example of the degradation product derived from polystyrene-based resin is styrene monomer.
- (A) a resin composition containing polyphenylene ether-based resin is prepared using an internal standard and a calibration curve is prepared by gas chromatography. can do.
- the resin composition for molding internal components of a hard disk drive of the present invention contains (B) component, (C) component and other components described later in addition to (A) component, the residual volatile component
- the quantification is a value obtained by quantifying the residual volatile components composed of the polyphenylene ether polymerization solvent and Z or styrene monomer with respect to the total amount in the resin composition.
- the (B) liquid crystal polyester of the present invention is a polyester called a thermopick liquid crystal polymer, and known ones can be used.
- thermopick liquid crystal polymer a polyester called a thermopick liquid crystal polymer
- p-hydroxybenzoic acid and polyethylene Thermotopic liquid crystalline polyester with terephthalate as the main structural unit p-hydroxybenzoic acid and 2-hydroxy 6-naphthoic acid with thermotomatic pick-up liquid crystal polyester, p-hydroxybenzoic acid and 4,4'-dihydroxybiphenol And thermopick liquid crystal polyester having terephthalic acid as the main structural unit, and there is no particular limitation.
- the (B) liquid crystalline polyester used in the present invention those composed of the following structural units (i) and Z or (mouth) and, if necessary, the following structural units (c) and Z or (2) are preferable.
- structural units (i) and (mouth) are respectively a structural unit of polyester produced from p-hydroxybenzoic acid and a structural unit produced from 2-hydroxy-6-naphthoic acid. is there.
- structural units (i) and (mouth) it is possible to obtain the thermoplastic resin composition of the present invention having excellent heat resistance, mechanical properties such as fluidity and rigidity, and excellent lances.
- X in the structural units (c) and (2) is independently one or two from the following (formula 2) More than one species can be selected.
- a structural unit in which each of ethylene glycol, hydroquinone, 4,4 'dihydroxybiphenyl, 2,6 dihydroxynaphthalene and bisphenol A is also formed is more preferable.
- structural units formed from ethylene glycol, 4,4'-dihydroxybiphenyl, and hydroquinone, respectively, and particularly preferred are ethylene glycol and 4,4'-dihydroxybiphenyl, respectively.
- U is preferably a structural unit formed from each of terephthalic acid, isophthalic acid and 2,6-dicarboxynaphthalene, and more preferably terephthalic acid and It is a structural unit generated from each of isophthalic acid.
- the structural formula (c) and the structural formula (2) at least one or two or more of the structural units listed above can be used in combination. Specifically, when two or more types are used in combination, in the structural formula (c), 1) ethylene glycol force generated structural unit Z hydroquinone Force generated structural unit, 2) Structural unit also generated ethylene glycol force Z4, 4 '— Structural unit generated from dihydroxybiphenyl, 3) Hydroquinone force Generated structural unit Z 4, 4' — Dihydroxybiphenyl And structural units generated from
- a structural unit produced from terephthalic acid Z a structural unit produced from isophthalic acid
- a structural unit produced from terephthalic acid Z2, 6 dicarboxyl Examples include structural units that also generate naphthalene force.
- the amount of terephthalic acid in the two components is preferably 40 wt% or more, more preferably 60 wt% or more, and still more preferably 80 wt% or more.
- the proportion of structural units (i), (mouth), (c) and (2) in the liquid crystal polyester (B) component is not particularly limited. However, the structural units (2) and (2) are basically in equimolar amounts.
- the following structural unit (e) consisting of structural units (c) and (2) can also be used as the structural unit in component (B). Specifically, 1) a structural unit generated from ethylene glycol and terephthalic acid, 2) a structural unit generated from hydroquinone and terephthalic acid, and 3) a structural unit generated from 4,4'-dihydroxybiphenyl and terephthalic acid 4) Structural units formed from 4,4'-dihydroxydiphenyl and isophthalic acid, and 5) Structural units formed from bisphenol A and terephthalic acid.
- the (B) liquid crystal polyester component of the present invention may contain other aromatic dicarboxylic acids, aromatic diols, aromatic hydroxycarboxylic acids in a small amount within a range that does not impair the characteristics and effects of the present invention, if necessary. Structural units that generate acid forces can be introduced.
- the temperature at which the liquid crystal state at the time of melting of the component (B) of the present invention (hereinafter referred to as the liquid crystal start temperature) is preferably 150 to 350 ° C, more preferably 180 to 320 ° C. Setting the liquid crystal starting temperature within this range is preferable from the viewpoint of peeling after ultrasonic cleaning of the obtained molded product.
- (C) a compound containing a Zn element and a Z or Mg element is contained.
- the compound is an inorganic or organic compound containing a metal.
- the component (C) of the present invention is a compound essentially comprising a Zn element and a Z or Mg element as main constituent components.
- oxides, hydroxides, aliphatic carbonates and acetates of the above metal elements are preferable.
- preferred oxides include ZnO and MgO.
- preferred hydroxides include Zn (OH), Mg (OH) and the like.
- Examples of such aliphatic carboxylates include zinc stearate and magnesium stearate.
- Examples of preferred acetates include zinc acetate and magnesium acetate.
- Component (C) may contain impurities as long as the effects of the present invention are not impaired.
- the blending amount of the (A) polyphenylene ether-based resin is 30 parts per 100 parts by mass in total from the viewpoints of particulate contamination, ultrasonic cleaning resistance, and water absorption. More than 50 parts by mass is preferred, more preferably 60 parts by mass or more, still more preferably 70 parts by mass or more, and particularly preferably 80 parts by mass or more.
- the blending amount of the (A) polyphenylene ether-based resin is 100 parts by mass in total of the components (A) and (B), from the viewpoint of specific gravity, repeated detachability, and cost. From the viewpoint of fluidity and mold releasability, it is 99.5 parts by mass or less, preferably 60 to 98 parts by mass, more preferably 70 to 96 parts by mass, and still more preferably. Is 80-95 parts by mass.
- the blending amount of the (B) liquid crystal polyester in the present invention is 49 parts by mass or less from the viewpoint of specific gravity, repeated detachability, and cost with respect to 100 parts by mass in total of the component (A) and the component (B). From the viewpoint of fluidity and mold releasability, it is 0.5 parts by mass or more, preferably 40-2 parts by mass, more preferably 30-4 parts by mass, and further preferably 20-5 parts by mass. is there.
- the blending amount of the component (C) is based on 100 parts by mass of (A) and (B) in total. 0.1 parts by mass or more from the viewpoint of ultrasonic cleaning resistance, particle powder contamination, and repeated detachability of the internal parts of the hard disk drive, and 10 parts by mass or less from the viewpoint of the specific gravity and heat resistance of the composition. 0.2-5 parts by mass is preferred, and 0.4-3 parts by mass is more preferred.
- an inorganic filler can be added as necessary within the range not impairing the characteristics and effects of the present invention.
- strength imparting agents glass fiber, metal fiber, potassium titanate, carbon fiber, carbonized carbide, ceramic, nitrided silicon, my strength, nephrin cinnite, talc, wollastonite, slag fiber, ferrite, glass beads
- Inorganic compounds such as glass powder, glass balloon, quartz, quartz glass, fused silica, titanium oxide, and calcium carbonate.
- the shape of these inorganic fillers is not limited, and can be arbitrarily selected from a fiber shape, a plate shape, a spherical shape, and the like.
- Two or more of these inorganic fillers can be used in combination. If necessary, it can be pretreated with a coupling agent such as silane or titanium.
- the kneading order is not particularly limited. From the viewpoint of simplicity of the process and improvement of physical properties, it is desirable to top-knead the whole amount. However, in the case of inorganic fillers, if you do not want to crush by kneading, It can also be kneaded by dofeed or the like.
- the resin composition according to the present invention can be produced by various methods. For example, a single-screw extruder, twin-screw extruder, roll, kneader, Brabender plastograph, vannori mixer, etc. can be mentioned. Favored ,.
- the melt kneading temperature at this time is not particularly limited, but a medium force of 200 to 350 ° C. can be arbitrarily selected.
- the manufacturing method of the present invention is a method for improving the outgas performance of hard disk drive internal components, by thoroughly venting and increasing the degree of vacuum during manufacturing, by increasing the temperature of the resin during extrusion, by rotating A method of increasing the number, a method of reducing the discharge amount, a method of reducing the amount of residual polymerization solvent in the polyfylene ether contained in the raw material (strengthening the drying process, etc.), and the like.
- the following production methods are more preferable from the viewpoint of reducing the outgas component in the composition.
- the production method of the present invention is a method for producing a resin composition used as a raw material of a component for the purpose of improving the outgas performance of the internal component of the hard disk drive, and comprises (A) a polyphenylene-based system. At least one component selected from fat, (B) liquid crystal polyester, (C) a compound component containing Zn element and Z or Mg element is melt-kneaded by an extruder, and at least one vent is provided in the kneading zone.
- the front vent is devolatilized at a vacuum level of -40 kPa or less, and an inert gas is blown into the feed port to reduce the oxygen concentration to 5% or less.
- an inert gas is blown into the feed port, and the oxygen concentration is measured at a site approximately 7 cm closest to the screw of the extruder, so that the oxygen concentration is 5% or less, more preferably 3 It is preferable to adjust to not more than%, more preferably not more than 1%, from the viewpoint of particulate powder contamination and repeated detachability of internal components of the hard disk drive.
- Inert gas Specific examples of nitrogen include nitrogen, argon, helium and the like. Nitrogen is preferred from the viewpoint of cost.
- the L / D of the extruder is 30 to: LOO force, more preferably 40 to 80, and further preferably 50 to 70. If the LZD is too small, the low ion contamination tends to deteriorate. Conversely, if LZD is too large, productivity will only decrease. Where L is the length of the extruder screw and D is the barrel inner diameter of the extruder. Therefore, LZD is the ratio of these. Low ion contamination is an extremely important characteristic for hard disk internal parts. If these deteriorate, ions eluted from the oil will accumulate at the tip of the magnetic head and the disk, resulting in malfunction and reduced product life. May lead to
- the internal component of the hard disk drive of the present invention is a force that can form the above-described resin composition by various conventionally known methods such as injection molding, extrusion molding, and hollow molding. Is preferred.
- injection molding is performed so that the mold temperature is 130 ° C or higher and the resin temperature is 350 ° C or lower.
- the mold temperature is preferably 130 ° C. or higher, more preferably 150 ° C. or higher, and further preferably 160 ° C. or higher, from the viewpoint of mold transfer property and ultrasonic cleaning resistance.
- the upper limit is preferably 210 ° C or lower.
- the resin temperature may be around 0 to 20 ° C relative to the cylinder set temperature depending on the molding conditions.
- the resin temperature is measured by separating the nozzle from the mold after injection molding and then releasing the resin from the nozzle tip when injected at the same molding cycle and injection speed as during molding. Is the temperature actually measured by a thermometer.
- This resin temperature is 350 ° C. or less, preferably 340 ° C. or less, more preferably 335 ° C. or less, and further preferably 330 ° C. or less from the viewpoint of low outgassing and repeated attachment / detachment.
- the hard disk drive internal parts of the present invention are excellent in low outgassing properties, low outgassing properties, ultrasonic cleaning resistance, low ion contamination properties, particulate contamination properties, repeated detachability, heat resistance, Excellent balance between specific gravity and water absorption.
- Low outgas, ultrasonic cleanliness, low ionic contamination, and particulate contamination affect the internal talinity of hard disk drive products, and are extremely important in ensuring product life and reliability. It is a characteristic. Repeated attachment / detachment may cause disassembly and reuse of parts if there is a product operation abnormality unique to the hard disk drive.In the case of a hook, it is possible to attach / detach to / from the mating material multiple times. Required as a part.
- liquid crystal polyester (LCP-1) having the following theoretical structural formula.
- the component ratio of a composition represents molar ratio.
- Pellets obtained by melt-kneading are used with an injection molding machine (EC60, manufactured by Toshiba Machine Co., Ltd.), cylinder setting temperature: 335 ° C, mold temperature: 150 ° C, injection speed: 300mmZ seconds (projection) Maximum pressure: 260 MPa), holding pressure: 250 MPa (0.2 seconds) Z200 MPa (l. 0 seconds).
- Mount plate simulated molded products Fig. 3, 6mm x l lmm x O. 3mm, approximate dimensions
- hook simulated products Fig. 4, 6mm x 2mm x 3mm, approximate dimensions
- ⁇ The total amount of outgas is less than 500 ngZ, and none of the above preferred components is detected.
- the mount plate simulated molded product obtained in (1) above is ultrasonically cleaned with a surfactant aqueous solution (28 kHz), then with pure water (5 batches), and then vacuum dried at 65 ° C. Was implemented. After that, the surface condition of the mock-up molded article was observed at a magnification of 40 times with a real microscope, the surface irregularities were observed, and the ultrasonic cleaning resistance was judged based on the following criteria. Conducted in pieces.
- ⁇ n out of 3 pieces, 1 to 2 pieces, fuzz and peeling of the surface were observed.
- Image analysis device [microscope part: Nikon E600L, camera part: Sony XC-003, image processing software: -Reco LUZEX SE] was used to measure the number of foreign objects over 1 micron per 2mm x 2mm and converted to per square centimeter. n The number is 2 and the average value is taken
- particle powder contamination was determined.
- ⁇ The number of foreign objects is less than 1000 Zcm2.
- the number of foreign matter is 1000 or more and less than 5000 and less than Zcm2.
- the number of foreign objects is 5000 or more.
- the simulated hook product obtained in (1) above was removed after sandwiching the mount plate and stainless steel as shown in Fig. 2.
- the attachment / detachment operation was repeated three times, and the surface state of the hook bend was observed, and the repeatability was determined based on the following criteria.
- the hook simulation molded product obtained in (1) above is subjected to ultrasonic cleaning by the same method as in (3) above, and then dried. These molded products were weighed in lg (corresponding to 100 to 150 pieces), put in a plastic bottle, covered with 5 ml of pure water, capped, and left in a thermostatic bath at 75 ° C. for 30 minutes. After cooling, the supernatant was taken out and the amount of dissolved ammonium ion (NH4 +) in water was quantified by ion chromatography. Unit is ⁇ g / ml 0
- the obtained pellets were developed using an injection molding machine [IS-80EPN: manufactured by Toshiba Machine Co., Ltd.] set at a cylinder temperature of 330Z330Z320Z310 ° C, a firing speed of 85%, and a mold temperature of 130 ° C.
- ASTM tanzania specimens having a thickness of 3.2 mm, a length of 127 mm, and a width of 12.7 mm were obtained.
- the deflection temperature under load of 1.82 MPa was measured according to ASTM D648.
- Thickness obtained in (7) above 3.2 mm X length 127 mm X width 12.7 mm ASTM Tanzaku test piece was cut out, and using an electronic hydrometer (ED-120T, Mirage Trading Co., Ltd.), 23 The specific gravity at ° C was measured. Small value! /, Better.
- Thickness obtained in (7) above 3.2 mm X length 127 mm X width 12.7 mm ASTM Tanzaku test piece was cut out and in accordance with ASTM D570, water absorption after 24 hours at 23 ° C, 50% RH was measured. A smaller value is preferred.
- the gauge pressure of the vent is shown in Table 1.
- the amount of residual volatile components in the pellets was measured according to (9) above, and the results are shown in Table 1.
- Polyethylene ether (PPE-1), liquid crystal polyester (LCP-1) and zinc oxide (ZnO, UnionPay A (registered trademark), manufactured by Toho Zinc Co., Ltd.) are blended in the proportions (parts by mass) shown in Table 1.
- the procedure was the same as Example 1 except that.
- the oxygen concentration was 2%.
- Hard disk drive The resin temperature when molding internal components was 335 ° C, the same as the cylinder set temperature.
- the evaluation results are shown in Table 1.
- the total outgas amount was 210 ngZ.
- the release of the simulated molded product from the mold was very good.
- the mold temperature was set to 90 ° C.
- Example 3 Polyethylene ether (PPE-2), liquid crystal polyester (LCP-1) and zinc oxide (ZnO, UnionPay A (registered trademark), manufactured by Toho Zinc Co., Ltd.) are blended in the proportions (parts by mass) shown in Table 1. Then, the same procedure as in Example 1 was performed, except that the vent was provided with two power outlets, and the front vent was adjusted to 80 kPa and the rear vent to 60 kPa. The oxygen concentration was 1%. The resin temperature during molding of the internal parts of the hard disk drive was 335 ° C, the same as the cylinder set temperature. The evaluation results are shown in Table 1. The low outgassing of the mounting plate was 3 12 ngZ, and any components that were not preferred were detected and not powerful. The release of the simulated molded product from the mold was very good.
- Example 3 The same procedure as in Example 3 was performed except that the vent of the front stage of the extruder was adjusted to ⁇ 50 kPa and the vent of the rear stage was adjusted to ⁇ 70 kPa.
- the oxygen concentration was 1%.
- the resin temperature when molding the internal components of the hard disk drive was 335 ° C, the same as the cylinder set temperature.
- the evaluation results are shown in Table 1.
- the low outgas of the mount plate was 610 ngZ, and any undesirable components were not detected.
- the release of the simulated molded product from the mold was very good.
- Example 2 The same procedure as in Example 2 was performed except that each component was blended in the proportions (parts by mass) shown in Table 1.
- the oxygen concentration was 2%.
- the resin temperature during molding was 335 ° C.
- the evaluation results are shown in Table 1. Mold release of the molded product with mold force was very good.
- Polycarbonate resin (PC, Panlite L— 1250Y (registered trademark), manufactured by Teijin Chemicals Ltd.) Were molded and evaluated in the same manner as in Example 1 except that the molding temperature was set to 300 ° C and the mold temperature was set to 120 ° C in the molding machines shown in (1) and (7) above. Carried out. When taking out the mold force of the hard disk drive internal parts simulated molded product, the mold release force was sometimes bad. The evaluation results are shown in Table 1. Chlor element was detected in the low outgassing of the mounting plate. Compared to the examples, the specific gravity was relatively large and the water absorption rate was large.
- Example 3 The same procedure as in Example 3 was performed, except that the front vent of the extruder was adjusted to ⁇ 20 kPa and the rear vent adjusted to ⁇ 40 kPa.
- the oxygen concentration was 1%.
- the resin temperature when molding the internal components of the hard disk drive was 335 ° C, the same as the cylinder set temperature.
- the evaluation results are shown in Table 1.
- the low outgassing of the mounting plate was 1540 ngZ, and no unfavorable components were detected. About hook, it was 890ngZ.
- Example 5 The same procedure as in Example 5 was performed except that each component was blended in the proportions (parts by mass) shown in Table 1.
- the oxygen concentration was 2%.
- the resin temperature during molding was 335 ° C.
- the evaluation results are shown in Table 1. After the ultrasonic cleaning resistance, only one piece was found to be peeled off from the surface of the simulated molded product. Both the particle powder contamination and the repeated detachability were ⁇ .
- TEM 58SS twin screw extrusion Machine
- Pellets were obtained by melt-kneading in the same manner as in Example 8 except that the raw materials and their blending were the same as in Example 2.
- the total outgas amount for the mount plate simulated molded product was 256 ng Z pieces. Comparison with Example 2 shows that the size of the extruder is effective for low ion contamination.
- Example 3 The raw materials and their blends were the same as in Example 3, except that the former vent was opened to the atmosphere and the latter vent port was completely sealed.
- the total outgas amount for the mount plate mock-up was 3250 ngZ. From a comparison between Example 3, Example 4 and Example 10, it can be seen that the degree of venting at the time of melt kneading the composition with an extruder affects low outgassing, repeated detachability, and low ion contamination.
- the internal parts of the hard disk drive obtained by molding have excellent low outgas resistance, ultrasonic cleaning resistance, low ion contamination, particulate powder contamination, repeated attachment / detachment, heat resistance, specific gravity, and water absorption balance. Power.
- melt-kneading with an extruder When melt-kneading with an extruder, the same procedure as in Example 2 was performed, except that the flow rate of nitrogen gas at the feed port was zero and melt-kneading was performed in an air atmosphere.
- the oxygen concentration was 21%.
- the low outgassing of the mock-up product of the mount plate and hook was 2850 ngZ and 4100 ngZ, respectively.
- the ultrasonic cleaning resistance, the particle powder contamination property, and the repeated attachment / detachment property were ⁇ .
- Example 2 The same procedure as in Example 2 was performed except that the oxygen concentration at the feed port of the extruder was adjusted to 6%. For low outgas, both the mount plate and the hook were ⁇ . The ultrasonic cleaning resistance, particle powder contamination property, and repeated detachability were all ⁇ . From a comparison between Example 2, Example 11 and Example 12, it can be seen that the oxygen concentration has an effect on low outgas, anti-ultrasonic cleaning resistance, particle powder contamination, and repeated detachability.
- Example 2 Using the pellets obtained in Example 2, a simulated molded product of the mount plate was obtained in the same manner as in Example 2 except that the cylinder setting temperature of the molding machine of (1) was set to 360 ° C. The resin temperature at the time of purge was measured and found to be 362 ° C. During molding, a large amount of gas, which was thought to be derived from polymer decomposition, was generated. The low outgas of the mount plate and hook was 4 500 ngZ and 3600 ngZ, respectively. Ultrasonic cleaning resistance and particle dust contamination were X. Repeated detachability was ⁇ .
- the internal parts of the polyethylene-based resin node disc drive of the present invention are low gas, ultrasonic cleaning resistance, low ion contamination, particulate powder contamination, repeated detachability, and heat resistance. Excellent balance of specific gravity and water absorption. And hard disk drives are digital With the spread of home appliances, downsizing and increasing capacity are the trends. For downsizing, low outgassing, cleanliness and lightness of internal parts are strongly required. Therefore, the present invention can provide a highly reliable hard disk drive internal component that is excellent in low outgassing, cleanliness, light weight, and low water absorption rate and matches the trend, and its industrial value is extremely high.
- FIG. 1 Schematic diagram of a 5-inch hard disk drive (HDD).
- the mount plate (1), hook (2), and lamp (3) are listed as typical hard disk drive internal components.
- FIG. 2 Enlarged view of the mounting plate and hook mounted.
- the mount plate comes into contact with the SUS plate.
- the mount plate / SUS plate and FPC flexible printed circuit board
- the mount plate / SUS plate and FPC are bundled with a hook.
- FIG.3 Schematic view of the mount plate simulated molded product.
- FIG. 4 Schematic view of simulated hook product 1: Mount plate, 2: Hook, 3: Lamp, 4: Mount plate, 5: Hook
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06702038A EP1835505B1 (en) | 2005-01-07 | 2006-01-06 | Inner part of hard disk drive |
DE602006016728T DE602006016728D1 (de) | 2005-01-07 | 2006-01-06 | Innenteil eines festplattenlaufwerks |
CN200680001907.3A CN101103414B (zh) | 2005-01-07 | 2006-01-06 | 硬盘驱动器内部部件、硬盘驱动器内部部件用树脂组合物及该树脂组合物的制造方法 |
JP2006550899A JP4606423B2 (ja) | 2005-01-07 | 2006-01-06 | ハードディスクドライブ内部部品 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005-002536 | 2005-01-07 | ||
JP2005002536 | 2005-01-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006073168A1 true WO2006073168A1 (ja) | 2006-07-13 |
Family
ID=36647644
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2006/300062 WO2006073168A1 (ja) | 2005-01-07 | 2006-01-06 | ハードディスクドライブ内部部品 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7932315B2 (ja) |
EP (1) | EP1835505B1 (ja) |
JP (1) | JP4606423B2 (ja) |
CN (1) | CN101103414B (ja) |
DE (1) | DE602006016728D1 (ja) |
WO (1) | WO2006073168A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080166523A1 (en) | 2007-01-04 | 2008-07-10 | Asahi Kasei Chemicals Corporation | Tab leader tape made of polyphenylene ether-based resin |
SG155080A1 (en) * | 2008-02-25 | 2009-09-30 | Cal Comp Technology Pte Ltd | Surface coating for hard disk drive cavity |
US8094409B2 (en) * | 2008-05-28 | 2012-01-10 | Hitachi Global Storage Technologies, Netherlands B.V. | Method and system for monitoring gas in sealed hard disk drives with feedback |
JP2013033577A (ja) * | 2011-07-01 | 2013-02-14 | Ntn Corp | 記録ディスク駆動装置およびその樹脂部品 |
EP2938677A4 (en) * | 2012-12-31 | 2016-08-03 | Sabic Global Technologies Bv | HIGH FLUIDITY REINFORCED POLYIMIDE COMPOSITIONS WITH VERY LOW RESIDUAL CONTAMINATION FOR HARD DISK ENCLOSURES |
IN2015DN02777A (ja) * | 2012-12-31 | 2015-09-04 | Sabic Innovative Plastics Ip |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0349925A (ja) * | 1989-07-17 | 1991-03-04 | Sumitomo Chem Co Ltd | 熱可塑性重合体組成物の脱揮押出方法 |
JPH09251733A (ja) * | 1996-03-18 | 1997-09-22 | Toshiba Corp | 磁気ディスク装置 |
JP2003073468A (ja) * | 2001-09-06 | 2003-03-12 | Mitsui Chemicals Inc | ポリカーボネート共重合体およびその用途 |
JP2004040895A (ja) * | 2002-07-02 | 2004-02-05 | Seiko Epson Corp | 永久磁石、モータ用部品およびモータ |
Family Cites Families (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE635349A (ja) | 1962-07-24 | |||
NL295699A (ja) | 1962-07-24 | |||
US3257357A (en) | 1963-04-01 | 1966-06-21 | Du Pont | Copolymers of polyphenylene ethers |
US3257358A (en) | 1963-07-02 | 1966-06-21 | Du Pont | 2, 6-dichloro-1, 4-polyphenylene ether |
JPS5238596B2 (ja) | 1973-09-06 | 1977-09-29 | ||
JPS5217880B2 (ja) | 1974-05-25 | 1977-05-18 | ||
JPS5217880A (en) | 1975-07-31 | 1977-02-10 | Mitsubishi Heavy Ind Ltd | Method to walk inside tube |
CA1298451C (en) | 1985-08-02 | 1992-04-07 | Hiromi Shigemoto | Surface-roughened film and sheet, and process for production and use thereof |
JPS63152628A (ja) | 1986-12-17 | 1988-06-25 | Asahi Chem Ind Co Ltd | 色調の優れたポリフエニレンエ−テル系樹脂の製造法 |
JP2790330B2 (ja) | 1989-08-15 | 1998-08-27 | 三井化学株式会社 | プリント配線板製造用の離型フィルムおよびその製造方法 |
JPH03280271A (ja) | 1990-03-28 | 1991-12-11 | Toshiba Corp | 磁気記録再生装置 |
BR9005132A (pt) | 1990-10-12 | 1992-04-14 | Petroleo Brasileiro Sa | Sistema de conexao submarina e conector ativo utilizado no referido sistema |
JP3029487B2 (ja) | 1991-05-13 | 2000-04-04 | 住友ベークライト株式会社 | 銅張積層板の製造方法 |
JP3286724B2 (ja) | 1994-08-23 | 2002-05-27 | ポリプラスチックス株式会社 | 射出成形品 |
JP3280271B2 (ja) | 1997-04-09 | 2002-04-30 | 河西工業株式会社 | 積層成形体の成形方法 |
US6046300A (en) | 1997-12-26 | 2000-04-04 | Toray Industries, Inc. | Liquid-crystalline resin and thermoplastic resin composition |
JP3747667B2 (ja) | 1997-12-26 | 2006-02-22 | 東レ株式会社 | 液晶性樹脂および熱可塑性樹脂組成物 |
JPH11349703A (ja) | 1998-06-04 | 1999-12-21 | Marusho Kk | 離型フィルム |
JP3943254B2 (ja) | 1998-07-24 | 2007-07-11 | 出光興産株式会社 | 離型フィルム |
KR100595791B1 (ko) | 1999-01-08 | 2006-07-03 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 고 아크 트랙킹 지수를 갖는 폴리(페닐렌 옥시드)-액정중합체 블렌드 조성물 |
JP3710316B2 (ja) | 1999-03-19 | 2005-10-26 | 三井化学株式会社 | プリント基板製造用離型フィルム及びその製造方法 |
JP2000272055A (ja) | 1999-03-26 | 2000-10-03 | Sumitomo Bakelite Co Ltd | 離型多層フィルム |
JP3676644B2 (ja) | 2000-02-22 | 2005-07-27 | 積水化学工業株式会社 | 離型フィルム及びその製造方法 |
JP2001246635A (ja) | 2000-03-03 | 2001-09-11 | Mitsubishi Plastics Ind Ltd | 離形用フィルム及びプリント基板の製造方法 |
JP2001310422A (ja) | 2000-04-28 | 2001-11-06 | Idemitsu Petrochem Co Ltd | 離型フィルム |
JP2001335646A (ja) | 2000-05-30 | 2001-12-04 | Asahi Kasei Corp | 官能化ポリフェニレンエーテル樹脂シートおよびフィルム |
JP2002275276A (ja) | 2001-01-15 | 2002-09-25 | Yuka Denshi Co Ltd | 導電性成形品 |
JP4716585B2 (ja) | 2001-02-20 | 2011-07-06 | 旭化成ケミカルズ株式会社 | 樹脂組成物製シート |
JP2002241601A (ja) | 2001-02-20 | 2002-08-28 | Asahi Kasei Corp | 難燃樹脂組成物製シート |
DE10209521B4 (de) | 2001-03-08 | 2004-04-08 | Asahi Kasei Kabushiki Kaisha | Harzzusammensetzung |
JP4727090B2 (ja) | 2001-09-06 | 2011-07-20 | 旭化成ケミカルズ株式会社 | 特異なモルフォロジーを形成しうる樹脂組成物 |
JP2003001772A (ja) | 2001-06-26 | 2003-01-08 | Mitsui Chemicals Inc | 4−メチル−1−ペンテン共重合体多層フィルム |
JP2003012829A (ja) | 2001-06-29 | 2003-01-15 | Sekisui Chem Co Ltd | 離型フィルム |
JP4766796B2 (ja) | 2001-08-14 | 2011-09-07 | 藤森工業株式会社 | 離型フィルム |
JP2003082245A (ja) | 2001-09-17 | 2003-03-19 | Bridgestone Corp | 熱可塑性エラストマー組成物及び放熱シート |
JP2003082244A (ja) | 2001-09-17 | 2003-03-19 | Bridgestone Corp | 熱可塑性エラストマー組成物及び放熱シート |
JP2003246019A (ja) | 2001-12-20 | 2003-09-02 | Sumitomo Bakelite Co Ltd | 離型フィルム及びカバーレイ成形方法 |
KR100552023B1 (ko) | 2001-12-25 | 2006-02-14 | 아사히 가세이 케미칼즈 가부시키가이샤 | 폴리옥시메틸렌 수지제 램프 |
JP2003236870A (ja) | 2002-02-14 | 2003-08-26 | Sumitomo Bakelite Co Ltd | プレス工程用リリースフィルム |
JP2003313313A (ja) | 2002-02-22 | 2003-11-06 | Sekisui Chem Co Ltd | 離型フィルム |
JP2003276139A (ja) | 2002-03-25 | 2003-09-30 | Sumitomo Bakelite Co Ltd | 離型フィルム及びカバーレイ成形方法 |
JP3705241B2 (ja) | 2002-05-23 | 2005-10-12 | 油化電子株式会社 | 導電性摺動性樹脂成形品 |
JP4216010B2 (ja) | 2002-07-17 | 2009-01-28 | 出光興産株式会社 | 接着用樹脂組成物及び積層体 |
JP2004075881A (ja) | 2002-08-20 | 2004-03-11 | Idemitsu Petrochem Co Ltd | 光学部品 |
CN100572449C (zh) * | 2003-04-18 | 2009-12-23 | 旭化成化学株式会社 | 制造印刷电路板用的脱模薄膜 |
US7205354B2 (en) * | 2003-09-04 | 2007-04-17 | Asahi Kasei Kabushiki Kaisha | Resin-made mechanical element with excellent heat resistance and dimensional precision for optical disk drive |
JP2005255941A (ja) | 2004-03-15 | 2005-09-22 | Asahi Kasei Chemicals Corp | リサイクル性の改良された樹脂組成物 |
JP4456916B2 (ja) | 2004-04-05 | 2010-04-28 | 株式会社クレハ | 低汚染性の射出成形体 |
-
2006
- 2006-01-06 US US11/792,492 patent/US7932315B2/en active Active
- 2006-01-06 CN CN200680001907.3A patent/CN101103414B/zh active Active
- 2006-01-06 EP EP06702038A patent/EP1835505B1/en active Active
- 2006-01-06 DE DE602006016728T patent/DE602006016728D1/de active Active
- 2006-01-06 WO PCT/JP2006/300062 patent/WO2006073168A1/ja active Search and Examination
- 2006-01-06 JP JP2006550899A patent/JP4606423B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0349925A (ja) * | 1989-07-17 | 1991-03-04 | Sumitomo Chem Co Ltd | 熱可塑性重合体組成物の脱揮押出方法 |
JPH09251733A (ja) * | 1996-03-18 | 1997-09-22 | Toshiba Corp | 磁気ディスク装置 |
JP2003073468A (ja) * | 2001-09-06 | 2003-03-12 | Mitsui Chemicals Inc | ポリカーボネート共重合体およびその用途 |
JP2004040895A (ja) * | 2002-07-02 | 2004-02-05 | Seiko Epson Corp | 永久磁石、モータ用部品およびモータ |
Non-Patent Citations (1)
Title |
---|
See also references of EP1835505A4 * |
Also Published As
Publication number | Publication date |
---|---|
EP1835505A1 (en) | 2007-09-19 |
US7932315B2 (en) | 2011-04-26 |
EP1835505B1 (en) | 2010-09-08 |
JP4606423B2 (ja) | 2011-01-05 |
EP1835505A4 (en) | 2009-03-25 |
US20070290391A1 (en) | 2007-12-20 |
JPWO2006073168A1 (ja) | 2008-08-07 |
CN101103414A (zh) | 2008-01-09 |
DE602006016728D1 (de) | 2010-10-21 |
CN101103414B (zh) | 2010-09-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2006073168A1 (ja) | ハードディスクドライブ内部部品 | |
EP1801160B1 (en) | Resin composition | |
JP2006291054A (ja) | 樹脂組成物 | |
JP2007262295A (ja) | 熱伝導性樹脂組成物およびそれからなる成形体 | |
JP2010031283A (ja) | スチレン系樹脂組成物 | |
JP5005161B2 (ja) | ポリフェニレンエ−テル系樹脂製シート | |
JP2007146129A (ja) | 樹脂組成物、それからなる錠剤の製造方法、および成形品 | |
JP2007031519A (ja) | 樹脂組成物、成形品およびicトレー | |
JP2005264124A (ja) | ポリフェニレンスルフィド樹脂組成物 | |
JP2004268391A (ja) | 樹脂製筐体 | |
JP6091875B2 (ja) | 樹脂組成物 | |
JP2005255941A (ja) | リサイクル性の改良された樹脂組成物 | |
JP4618685B2 (ja) | 樹脂組成物 | |
JP2007145016A (ja) | ポリフェニレンエーテル系樹脂製フィルム及びその製造方法 | |
WO2024004603A1 (ja) | 熱可塑性樹脂組成物および成形品 | |
JP4518383B2 (ja) | ポリフェニレンエ−テル系樹脂製tabリードテープ | |
JP2005060529A (ja) | 精密成型品用難燃樹脂組成物 | |
JP4854095B2 (ja) | ポリフェニレンエ−テル系樹脂製tabリードテープ | |
JP5121550B2 (ja) | 樹脂組成物 | |
JP5188073B2 (ja) | 熱可塑性樹脂組成物 | |
JP4286726B2 (ja) | ポリフェニレンエ−テル系樹脂製tabスペーサーテープ | |
JP2007246893A (ja) | 熱可塑性樹脂組成物 | |
JP4093535B2 (ja) | 低アウトガス液晶ポリエステル組成物の製造方法 | |
JP5004595B2 (ja) | ポリフェニレンエーテル系樹脂製トレー及びその製造方法 | |
JP2007182480A (ja) | 樹脂組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 2006519712 Country of ref document: JP |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DPE1 | Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101) | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2006550899 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 11792492 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2006702038 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 200680001907.3 Country of ref document: CN |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWP | Wipo information: published in national office |
Ref document number: 2006702038 Country of ref document: EP |
|
DPE1 | Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101) |