WO2005112531A1 - 回路基板及びこの回路基板を用いた電子機器 - Google Patents
回路基板及びこの回路基板を用いた電子機器 Download PDFInfo
- Publication number
- WO2005112531A1 WO2005112531A1 PCT/JP2005/009001 JP2005009001W WO2005112531A1 WO 2005112531 A1 WO2005112531 A1 WO 2005112531A1 JP 2005009001 W JP2005009001 W JP 2005009001W WO 2005112531 A1 WO2005112531 A1 WO 2005112531A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- hole
- center
- electronic component
- lead
- circuit board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Definitions
- the present invention relates to a circuit board having a through hole and an electronic device using the circuit board, and more particularly, to a circuit board suitable for soldering and mounting an insertion type electronic component with lead-free solder.
- the present invention relates to an electronic device having an insertion type electronic component mounted on a circuit board.
- FIG. 7 (a) is a top view showing a structure of a mounting portion of the insertion type electronic component of the conventional circuit board on which the insertion type electronic component is mounted
- FIG. 7 (b) is a view of A in FIG. 7 (a).
- -It is sectional drawing by the A line.
- a through hole is a snorle hole that has a wall surface of a through hole covered with a conductive film, such as a plated through hole.
- a circuit board used for mounting electronic components is usually manufactured through the following steps.
- a glass cloth substrate is impregnated with a resin such as an epoxy resin or a polyimide resin.
- a wiring board having a predetermined number of inner layer patterns is manufactured by patterning the copper foil by a photoetching method or the like using a copper-clad laminate on which the copper foil is subjected to pressure and heat treatment.
- the surface of the copper foil is subjected to a surface roughening treatment (blackening treatment), and then the wiring board and the copper-clad laminate are laminated with the copper foil.
- the layers are laminated via a pre-preder so as to form an outer layer, and are integrated by pressurizing and heating to produce a substrate having the inner layer wiring 3 in the resin laminate 2.
- the resin in the inner wiring is cleaned (desmeared) and then activated.
- through-hole 4 is formed by performing electroless plating and electrolytic plating.
- the through-hole is protected by the hole filling method or the tenting method, and the outermost copper layer is patterned.
- lands 6 are formed around the through holes on the front and back surfaces of the substrate.
- the through-hole 4, the outer wiring 5, and the land 6 are formed by a pattern plating method.
- solder resist (not shown) is formed on the front and back surfaces of the substrate except for the soldered portion, and the manufacturing process of the multilayer circuit board 1 is completed.
- FIG. 7 a line passing through the center of the housing of the electronic component after mounting the electronic component is indicated by O.
- the through holes 4 are arranged at equal intervals. That is, even in the vicinity of the central through hole 4a where the lead closest to the center of the housing of the electronic component is inserted, the outermost end hole 4b where the outermost lead of the housing of the electronic component is inserted is also provided. In the vicinity, they are arranged at equal pitches.
- the process of soldering electronic components using the multilayer circuit board 1 thus manufactured is generally performed by a reflow process of mounting surface mount components such as chip components and QFPs. Is performed, a flow step of mounting the insertion-type electronic component is performed.
- Patent Document 1 Japanese Utility Model Publication No. 57-037276
- Patent Document 2 Japanese Patent Application Laid-Open No. 2001-156420
- Patent Document 3 JP 2003-218534 A
- Patent Document 4 Japanese Patent Application Laid-Open No. 08-148790
- Patent Document 5 JP-A-04-261087
- Patent Document 6 Japanese Patent Application Laid-Open No. 03-009594 Disclosure of the invention
- This lead-free solder contains tin as a main component and silver, copper, zinc, bismuth, indium, antimony, nickel, germanium, and the like as additional components. Compared to Pb), it has metal properties such as high tensile strength and creep strength and low ductility of metal.
- the melting temperature of the lead-free solder is 190-230 ° C, compared to 183 ° C for tin-lead eutectic solder.
- FIG. 8 is a cross-sectional view showing a state where electronic components are soldered to the conventional multilayer circuit board 1 shown in FIG. 7 using lead-free solder.
- the cross-sectional view shows a circuit board made of FR-4, a housing made of polyamide, and an 8-pin, single-row connector with lead-free solder (Sn-3.0 mass% Ag-O.5 mass% It is a drawing based on a cross-sectional photograph when soldering using Cu).
- the lead 8 inserted into the outermost through hole 4b is positioned at the center of the outermost through hole 4b.
- the reason for mounting in this manner is due to the difference in the coefficient of thermal expansion due to the difference in the material of the housing 7 of the electronic component and the material of the multilayer circuit board 1.
- FIG. 9 is a cross-sectional view showing a state before an electronic component is mounted on a circuit board and soldering is performed. Before the soldering process, the centers of all the through holes including the outermost through hole 4b and the center of the lead 8 are almost coincident. This state force is also preheated, and when immersed in the solder bath, if the linear thermal expansion coefficient of the electronic component housing 7 is larger than the linear thermal expansion coefficient of the multilayer circuit board 1, the electronic component housing The thermal expansion of the body 7 is larger than that of the multilayer circuit board 1, and the further away from the center of the housing 7 of the electronic component, the more the difference in the amount of thermal expansion between the housing 7 of the electronic component and the multilayer circuit board 1 becomes.
- the center of the outermost end lead 8 is shifted in the direction opposite to the direction of the center force of the outermost end through hole 4b toward the center of the housing 7 when electronic components are mounted.
- the through holes are filled with molten solder, and the multilayer circuit board is lifted from the solder bath.
- the housing 7 of the electronic component thermally shrinks more than the multilayer circuit board 1, so that the leads 8 move upward in the figure to the It is bent toward the center.
- the solder is soldered at a position shifted from the center of the outermost through hole 4b toward the center of the housing 7 of the electronic component at the time of mounting, and It is soldered in a state where it is bent in the direction opposite to the center direction of the housing 7 of the electronic component.
- FIG. 10 is an enlarged cross-sectional view showing the outermost through hole 4b at the left end in FIG.
- the outermost end lead 8 is soldered with the center force of the outermost end through hole 4b displaced in the direction opposite to the center direction of the housing 7 when electronic components are mounted. Therefore, the amount of solder in the area opposite to the center direction of the electronic component housing between the through-hole leads 8 (part A: the area shaded in the figure) is reduced. Then, the lead 8 is bent toward the center of the housing 7 with an upward force in the figure.
- lead-free solder has lower stress relaxation ability of the solder itself than tin-lead eutectic solder.
- An object of the present invention is to provide a highly reliable circuit board which does not cause through-hole corner cracks and through-hole peeling even when an insertion-type electronic component is mounted using lead-free solder. To provide electronic devices.
- the circuit board according to the first invention of the present application has a through hole into which a lead of an electronic component with a lead is inserted and soldered, and an electrical connection through the through hole around the through hole on the front and back surfaces of the board. Connected to the land.
- the linear expansion coefficient of the housing part material of the electronic component is OC
- the linear expansion coefficient of the substrate material of the circuit board is ⁇ 8
- the outermost lead of the electronic component of the circuit board is The distance between the center of the outermost through hole to be inserted and the center of the through hole closest to this outermost through hole! ⁇
- the distance between the center of the center through hole into which the lead closest to the center of the electronic component is inserted and the center of the through hole closest to the center through hole is P,
- the circuit board according to the second invention of the present application has leads with leads arranged at equal intervals. And a land electrically connected via the through hole to the periphery of the through hole on the front and back surfaces of the substrate. And this circuit board sets the linear expansion coefficient of the housing part material of the electronic component to ⁇
- the coefficient of linear expansion of the substrate material of the circuit board is
- Distance from the center of the hall! 3 , the pitch of the leads arranged in the direction connecting the leads of the electronic component inserted into the outermost through hole and the through hole closest to the outermost through hole is defined as ⁇ .
- the coefficient of linear expansion of the material of the housing part of the electronic component is defined as j8 and the coefficient of linear expansion of the material of the circuit board is j8, in the case of ⁇ > ⁇ , the distance between the through hole and the lead is reduced.
- the amount of solder in the area opposite to the center direction of the electronic component housing can be suppressed, so that the through-holes in the direction opposite to the center direction of the housing when mounting the electronic components at the outermost end through holes
- the stress acting on the substrate can be reduced.
- the amount of solder in the region of the electronic component housing in the direction of the center between the through-hole and the lead can be suppressed from being reduced, so that the outermost end through-hole can be mounted on the electronic component.
- the stress applied to the through-hole in the center direction of the housing at the time can be reduced. For this reason, it is possible to prevent corner cracks generated at the corners of the through-holes and peel-off of the through-holes generated at the through-hole plating layer, and maintain electrical conduction of the electronic component.
- the electronic component with a lead is mounted on any of the circuit boards described above, the lead of the electronic component is inserted into a through hole of the circuit board, and the lead is soldered with a lead-free solder. It is characterized by being attached.
- the distance between the center of the center through hole into which the lead closest to the center of the electronic component is inserted and the center of the through hole closest to the center through hole, or The pitch of the leads arranged in the direction connecting the leads of the electronic component inserted into the outer end through hole and the through hole closest to the outermost end through hole is ⁇
- the center of the housing of the electronic component is The distance from the center of the outermost through hole is L
- front The difference between the melting point of lead-free solder and room temperature (25 ° C) is ⁇ T,
- the outermost through hole when the electronic component is mounted on the circuit board and soldered, the outermost through hole has a region in a direction opposite to the center of the housing of the electronic component from the center of the outermost through hole.
- the amount of solder filled in the region The amount of solder filled in the region in the direction opposite to the center of the housing of the electronic component is larger than the center of the through hole other than the outermost through hole.
- the stress applied to the corner portion and the inner wall of the through hole in the direction opposite to the center of the electronic component in the outermost through hole is opposite to the center of the electronic component.
- the occurrence of the through-hole corner crack of the outermost through-hole and the peeling of the through-hole can be suppressed. Therefore, according to the present invention, even when soldering is performed using lead-free solder, the occurrence of electrical continuity failure of electronic components is suppressed, and soldering with high connection reliability can be performed.
- FIG. 1 (a) and (b) are a top view and a sectional view, respectively, of a multilayer circuit board according to a first embodiment of the present invention.
- FIG. 2 is a cross-sectional view showing a state where electronic components are mounted on the multilayer circuit board according to the first embodiment of the present invention.
- FIG. 3 is a partially enlarged view of FIG. 2.
- FIG. 4 is a top view showing a multilayer circuit board according to a second embodiment of the present invention.
- FIG. 5 is a top view showing a multilayer circuit board according to a third embodiment of the present invention.
- FIG. 6 is a top view showing a multilayer circuit board according to a fourth embodiment of the present invention.
- FIGS. 7 (a) and 7 (b) are a top view and a cross-sectional view, respectively, of a conventional multilayer circuit board.
- FIG. 8 is a cross-sectional view showing a state where electronic components are mounted on a conventional multilayer circuit board.
- FIGS. 10 (a) to 10 (c) are cross-sectional views showing the problems of the conventional example.
- FIG. 1A is a top view of the circuit board according to the first embodiment of the present invention as viewed from the component mounting surface side, and FIG. It is sectional drawing by a line.
- Many surface-mounted electronic components or insertion-type electronic components are mounted on the multilayer circuit board.
- FIG. 1 shows only a mounting position of one insertion-type electronic component. The same applies to the drawings showing other embodiments.
- a multilayer circuit board 1 is formed using a resin laminate 2 as a substrate, and has an inner layer wiring 3 therein. Through holes 4 (4a to 4d) are formed at the positions where the leads of the electronic components of the multilayer circuit board 1 are inserted. Land 6 is formed around one hole. Outer layer wirings 5 are also formed on the front and back surfaces of the substrate.
- a center line O passing through the center of the housing when the electronic component is mounted is indicated by a chain line.
- the through holes 4 the one near the center line O is the center through hole 4a, the one farthest away is the outermost through hole 4b, and the nearest through hole closest to the center through hole 4a is the adjacent through hole.
- the adjacent through hole closest to the hole 4c and the outermost through hole 4b is the adjacent through hole 4d.
- FR-4 is used as the base material of the multilayer circuit board, and that the material of the housing part of the electronic component is polyamide.
- the spacing (pitch) between the through holes is wider at the outermost end than at the center. That is, the center distance between the outermost through hole 4b and the nearest through hole 4d closest to it is ⁇ !, and the center distance between the central through hole 4a and the nearest adjacent through hole 4c is P, P '> P.
- the lead of the electronic component is located closer to the center of the housing of the electronic component than the center of the outermost through hole immediately before the solidification of the solder.
- L is the distance between the center of the housing and the center of the outermost through hole 4b
- the linear expansion coefficient of the housing of the electronic component is a (ppmZ ° C)
- the linear expansion coefficient of the multilayer circuit board is
- ⁇ ⁇ is the ⁇ maximum temperature of the housing of the electronic component during the soldering process (about 200 ° C), normal temperature (about 25 ° C) ⁇ .
- ⁇ ⁇ may be replaced with (solder melting point normal temperature). Also, assuming that the linear expansion coefficient of the housing part material of the electronic component is smaller than the linear expansion coefficient of the substrate material of the multilayer circuit board, the above equation becomes
- center distance between the outermost through-hole 4b and the nearest adjacent through-hole 4d is determined using the lead pitch of the electronic component instead of ⁇ , and the center through-hole is determined. 4a and closest to this !, center distance between adjacent through holes 4c p may be the lead pitch of the electronic component.
- Electronic components are mounted on the multilayer circuit board 1 configured as described above by performing a flow process using lead-free solder.
- the flow step is performed, for example, as follows.
- the main process conditions of the flow step are set as follows, for example, so that the lead-free solder is also formed on the lands 6 on the component mounting surface side and a solder fillet can be formed.
- Preheating temperature 100 ° C ⁇ 120 ° C
- FIG. 2 is a cross-sectional view showing a state in which electronic components are mounted on the multilayer circuit board of the first embodiment shown in FIG.
- This is a multi-layer circuit board using FR-4 (linear expansion coefficient: 10 to 25 ppm) as the board material, and a housing part made of polyamide (linear expansion coefficient: 50 to 85 ppm) with a rectangular planar shape as an electronic component.
- 7 is a drawing made based on a cross-sectional photograph of a state after soldering an 8-pin connector having 7 using lead-free solder (Sn-3.OAg-O.5Cu). As shown in FIG.
- an electronic component having a housing 7 and a lead 8 is mounted on the multilayer circuit board 1, and a solder fillet 9 is formed in the through hole and on the land 6.
- the center distance P ′ between the outermost through hole 4b into which the outermost lead of the electronic component is inserted and the adjacent through hole 4d P ′ force
- the center distance where the lead closest to the center of the housing is inserted is larger than the center distance P between the through-hole 4a and the adjacent through-hole 4c (that is, P '> P).
- the amount of lead-free solder filled in the area opposite to the center increases.
- FIG. 3 is an enlarged cross-sectional view showing the outermost through hole 4b at the left end in FIG. Since the center position of the outermost through hole 4b satisfies the above equation (1), the lead 8 of the electronic component is placed just before the multilayer circuit board is put into the solder bath and the solder solidifies. It is located on the right side of the center of the outermost through hole 4b, that is, near the center of the housing of the electronic component. In that state, the solder starts to solidify first, and then the multilayer circuit board and the housing 7 contract.
- 8 of the substrate material of the multilayer circuit board is smaller than the linear thermal expansion coefficient ⁇ of the housing 7 (a> j8), the upper part of the lead is pulled toward the center of the electronic component. Therefore, the lead 8 is fixed with its upper part inclined leftward. As a result, the inner wall and the corner on the side away from the center of the housing 7 of the outermost through hole 4b receive stress, but the outermost through hole 4b has a portion opposite to the center of the housing. As the amount of lead-free solder filled in (shown by A in the figure) increases, these stresses received by the outermost through hole 4b are alleviated. As a result, the occurrence of corner cracks and peeling of through holes shown in FIGS. 10 (b) and 10 (c) is suppressed, and high electrical conductivity and reliability can be secured.
- FIG. 4 is a partial top view of the circuit board according to the second embodiment of the present invention as viewed from the component mounting surface side.
- the same parts as those of the first embodiment shown in FIG. 1 are denoted by the same reference numerals, and the duplicate description will be omitted.
- the difference between the multilayer circuit board of the present embodiment and that of the first embodiment shown in FIG. 1 is that the planar shape of the through hole 4 in the first embodiment is circular. Is a rectangular shape that is long in the longitudinal direction of the housing of the electronic component to be mounted.
- the center distance between the outermost through hole 4b and the adjacent through hole 4d! ⁇ Force Closest to the center of the housing of the electronic component! It is larger than the center distance P between the center through hole 4a where the lead is inserted and the adjacent through hole 4c.
- Modifications to the second embodiment may be made such that the planar shape of the through hole is an elliptical shape that is long in the longitudinal direction of the housing, a gourd shape, or a shape obtained by dividing a circle into two and inserting a rectangle between them. Good. Further, the shape may be a square or a regular hexagon.
- FIG. 5 is a partial top view of the circuit board according to the third embodiment of the present invention as viewed from the component mounting surface side.
- the same parts as those in the first embodiment shown in FIG. 1 are denoted by the same reference numerals, and overlapping description will be omitted.
- Diagram of a multilayer circuit board according to the present embodiment The difference from the first embodiment shown in FIG. 1 is that in the first embodiment, the center-to-center distance between the outermost through hole 4b and the adjacent through hole 4d! Although only ⁇ is longer than the distance between the centers of the other through holes, in the present embodiment, the distance between the through holes is gradually increased as the center force of the housing at the time of mounting electronic components increases. That is, as shown in FIG. 5, the distance between the through holes closest to the center of the housing is Pl, and the distance between the second and third through holes from the center of the housing is P2.
- FIG. 6 is a partial top view of the circuit board according to the fourth embodiment of the present invention as viewed from the component mounting surface side.
- the same parts as those in the first embodiment shown in FIG. 1 are denoted by the same reference numerals, and overlapping description will be omitted.
- the difference between the multilayer circuit board of the present embodiment and the multilayer circuit board of the first embodiment shown in FIG. 1 is that in the first embodiment, the electronic components to be mounted are such that the planar shape of the housing part thereof is different.
- the leads are radially arranged in the center of the housing, whereas the leads are arranged in a line in a rectangular shape.
- the outermost through hole 4b and the adjacent through hole 4b closest to the outermost through hole 4b on the radiation connecting the center of the housing of the electronic component and the outermost lead of the electronic component are ⁇ Center distance between the through hole 4d and the center hole and the nearest through hole 4c on the radiation connecting the center of the electronic component housing and the outermost lead of the electronic component. Is larger than the center distance p, the same effect as in the first embodiment can be obtained.
- This embodiment can be combined with the second embodiment and the third embodiment.
- the occurrence of electrical conduction failure of electronic components is suppressed before soldering with lead-free solder, so that a circuit board with high connection reliability can be obtained.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2005800156362A CN1954651B (zh) | 2004-05-17 | 2005-05-17 | 电路基板和使用了该电路基板的电子设备 |
JP2006513612A JP4735538B2 (ja) | 2004-05-17 | 2005-05-17 | 電子機器 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-145913 | 2004-05-17 | ||
JP2004145913 | 2004-05-17 |
Publications (1)
Publication Number | Publication Date |
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WO2005112531A1 true WO2005112531A1 (ja) | 2005-11-24 |
Family
ID=35394556
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2005/009001 WO2005112531A1 (ja) | 2004-05-17 | 2005-05-17 | 回路基板及びこの回路基板を用いた電子機器 |
Country Status (3)
Country | Link |
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JP (1) | JP4735538B2 (ja) |
CN (1) | CN1954651B (ja) |
WO (1) | WO2005112531A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2422491A (en) * | 2004-12-10 | 2006-07-26 | Keihin Corp | Printed circuit board |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5726869U (ja) * | 1980-07-18 | 1982-02-12 | ||
JPS57201856U (ja) * | 1981-06-17 | 1982-12-22 | ||
JPH0165173U (ja) * | 1987-10-21 | 1989-04-26 | ||
JPH08125323A (ja) * | 1994-10-27 | 1996-05-17 | Matsushita Electric Works Ltd | 混成集積回路基板モジュール |
JP2001156420A (ja) * | 1999-11-30 | 2001-06-08 | Optrex Corp | プリント基板 |
JP2002252452A (ja) * | 2000-12-19 | 2002-09-06 | Nec Corp | 回路基板及びそれを用いた電子機器 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57201856A (en) * | 1981-06-06 | 1982-12-10 | Rohm Co Ltd | Drive alarm device for car |
JPS5726869A (en) * | 1981-06-19 | 1982-02-13 | Canon Inc | Electrophotographic method |
JPS6465173A (en) * | 1987-09-04 | 1989-03-10 | Nippon Paint Co Ltd | Preparation of aqueous dispersion of fine cationic gel particle |
JPH11219762A (ja) * | 1998-02-02 | 1999-08-10 | Sony Corp | 電子部品及び基板 |
-
2005
- 2005-05-17 JP JP2006513612A patent/JP4735538B2/ja not_active Expired - Fee Related
- 2005-05-17 CN CN2005800156362A patent/CN1954651B/zh not_active Expired - Fee Related
- 2005-05-17 WO PCT/JP2005/009001 patent/WO2005112531A1/ja active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5726869U (ja) * | 1980-07-18 | 1982-02-12 | ||
JPS57201856U (ja) * | 1981-06-17 | 1982-12-22 | ||
JPH0165173U (ja) * | 1987-10-21 | 1989-04-26 | ||
JPH08125323A (ja) * | 1994-10-27 | 1996-05-17 | Matsushita Electric Works Ltd | 混成集積回路基板モジュール |
JP2001156420A (ja) * | 1999-11-30 | 2001-06-08 | Optrex Corp | プリント基板 |
JP2002252452A (ja) * | 2000-12-19 | 2002-09-06 | Nec Corp | 回路基板及びそれを用いた電子機器 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2422491A (en) * | 2004-12-10 | 2006-07-26 | Keihin Corp | Printed circuit board |
GB2422491B (en) * | 2004-12-10 | 2007-05-16 | Keihin Corp | Printed Circuit Board |
US7544899B2 (en) | 2004-12-10 | 2009-06-09 | Keihin Corporation | Printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
CN1954651A (zh) | 2007-04-25 |
JP4735538B2 (ja) | 2011-07-27 |
CN1954651B (zh) | 2010-05-12 |
JPWO2005112531A1 (ja) | 2008-03-27 |
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