US20210105891A1 - Metal member-equipped circuit board, circuit assembly, and electrical junction box - Google Patents

Metal member-equipped circuit board, circuit assembly, and electrical junction box Download PDF

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Publication number
US20210105891A1
US20210105891A1 US16/605,082 US201816605082A US2021105891A1 US 20210105891 A1 US20210105891 A1 US 20210105891A1 US 201816605082 A US201816605082 A US 201816605082A US 2021105891 A1 US2021105891 A1 US 2021105891A1
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US
United States
Prior art keywords
circuit board
hole
metal member
shaft portion
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US16/605,082
Other languages
English (en)
Inventor
Koki Uchida
Yukinori Kita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd, AutoNetworks Technologies Ltd, Sumitomo Electric Industries Ltd filed Critical Sumitomo Wiring Systems Ltd
Assigned to SUMITOMO ELECTRIC INDUSTRIES, LTD., AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD. reassignment SUMITOMO ELECTRIC INDUSTRIES, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KITA, YUKINORI, UCHIDA, Koki
Publication of US20210105891A1 publication Critical patent/US20210105891A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Definitions

  • the present specification discloses a technique related to a metal member-equipped circuit board.
  • a technique for attaching a metal member to a through hole in a circuit board is known.
  • a circuit assembly disclosed in JP 2015-46479A is provided with a printed circuit board in which a rectangular positioning through hole is formed, and a bus bar that is overlaid on this printed circuit board, and an inlay that is fixed to the bus bar is press-fitted into the positioning through hole in the printed circuit board.
  • the inlay is press-fitted into the positioning through hole in the printed circuit board, and thus there is a problem in that high accuracy is required for dimensions of the inlay and the positioning through hole, and that manufacturing costs are likely to be high.
  • the technique disclosed in the present specification has been made in view of the above circumstances, and an object thereof is to reduce manufacturing costs of a metal member-equipped circuit board, a circuit assembly, and an electrical junction box.
  • a metal member-equipped circuit board disclosed in the present specification includes: a printed circuit board including a through hole; a metal member including a shaft portion that is inserted into the through hole, and a head portion that is arranged outside the through hole, the head portion having a diameter larger than a diameter of the through hole, and a conductive bonding material for bonding the shaft portion and an inner wall of the through hole to each other.
  • the shaft portion of the metal member and the inner wall of the through hole of the printed circuit board are bonded to each other with the conductive bonding material, and high dimensional accuracy is not necessarily required compared to a configuration, for example, in which the shaft portion of the metal member and the inner wall of the through hole of the printed circuit board are joined only by press-fitting. Thus it is possible to reduce manufacturing costs.
  • an end face of the shaft portion on the opposite side of the head portion may also be formed at the same height as a surface of a conductive path on which an electric component of the printed circuit board is mounted.
  • the bonding material may also bond a face of the printed circuit board that is opposed to the head portion and the head portion of the metal member to each other.
  • the contact area of the bonding material becomes larger, and thus it is possible to reduce electric resistance while enhancing bonding strength between the circuit board and the metal member.
  • An outer circumference of the shaft portion may also include a press-fitting portion that is press-fitted into the hole wall of the through hole, and a non-press-fitting portion that faces the hole wall of the through hole and that is not press-fitted into the hole wall.
  • the shaft portion due to the outer circumference of the shaft portion having a press-fitting portion that is press-fitted into the hole wall of the through hole, the shaft portion can be engaged in the hole wall of the through hole at the time of attaching the metal member, and thus the work for bonding using the bonding material can be readily performed, making it possible to reduce manufacturing costs. Furthermore, due to the outer circumference of the shaft portion having the non-press-fitting portion, high dimensional accuracy is not required compared to a configuration in which the whole outer circumferential face of the shaft portion is press-fitted into the hole wall of the through hole, and thus manufacturing costs can be reduced.
  • a circuit assembly may also include the metal member-equipped circuit board, an electric component connected to an end face of the shaft portion that is on the opposite side of the head portion, a heat dissipation member placed on the metal member-equipped circuit board, and a spacer portion that keeps a space between the printed circuit board and the heat dissipation member.
  • the spacer portion may also be provided in one piece with the heat dissipation member.
  • An electrical junction box may also include the metal member-equipped circuit board, and a case configured to cover the metal member-equipped circuit board.
  • FIG. 1 is a cross-sectional view showing an electrical junction box according to a first embodiment.
  • FIG. 2 is a partial enlarged view of FIG. 1 .
  • FIG. 3 is a plan view showing a state where a shaft portion of a metal member has been inserted into a through hole of a circuit board.
  • FIG. 4 is a perspective view showing the metal member.
  • FIG. 5 is a plan view showing the metal member.
  • FIG. 6 is a side view showing the metal member.
  • FIG. 7 is a plan view showing a state where a shaft portion of a metal member according to a second embodiment has been inserted into the through hole of the printed circuit board.
  • FIG. 8 is a perspective view showing the metal member.
  • FIG. 9 is a plan view showing the metal member.
  • FIG. 10 is a side view showing the metal member.
  • FIG. 11 is a plan view showing how a shaft portion of a metal member according to a third embodiment has been inserted into the through hole of the printed circuit board.
  • FIG. 12 is a perspective view showing the metal member.
  • FIG. 13 is a plan view showing the metal member.
  • FIG. 14 is a side view showing the metal member.
  • FIG. 15 is a cross-sectional view showing an electrical junction box according to a fourth embodiment.
  • FIG. 16 is a partial enlarged view of FIG. 15 .
  • FIG. 17 is a partial enlarged cross-sectional view of an electrical junction box according to a fifth embodiment, corresponding to FIG. 2 .
  • FIG. 18 is a partial enlarged cross-sectional view of the electrical junction box according to the fifth embodiment, corresponding to FIG. 16 .
  • FIGS. 1 to 6 a first embodiment will be described with reference to FIGS. 1 to 6 .
  • An electrical junction box 10 is, for example, arranged in an electric power supply path between a power source such as a vehicle battery and loads constituted by in-vehicle electric components such as a lamp, a wiper, and the like, or a motor and the like, and can be used in a DC-DC converter, an inverter, and the like.
  • a power source such as a vehicle battery
  • loads constituted by in-vehicle electric components such as a lamp, a wiper, and the like, or a motor and the like
  • DC-DC converter an inverter, and the like.
  • this electrical junction box 10 can be arranged in any orientation, for the sake of simplifying the description, the following description will be given assuming that the X direction shown in FIG. 3 corresponds to the front direction, the Y direction shown in FIG. 1 corresponds to the left direction, and the Z direction shown in FIG. 1 corresponds to the upper direction.
  • the electrical junction box 10 includes a circuit assembly 20 and a case 11 for covering the circuit assembly 20 .
  • the case 11 is shaped like a box that is open downward, and made of metal such as aluminum or an aluminum alloy, or a synthetic resin.
  • the circuit assembly 20 includes a metal member-equipped circuit board 21 , and a heat dissipation member 40 that is arranged below the metal member-equipped circuit board 21 and configured to dissipate heat in the metal member-equipped circuit board 21 to the outside.
  • the metal member-equipped circuit board 21 includes a printed circuit board 22 , and a metal member 30 that is attached to a through hole 25 of the printed circuit board 22 .
  • the printed circuit board 22 is a thick copper circuit board that includes thick conductive paths 24 , and a comparatively large current can flow in the conductive paths 24 .
  • the conductive paths 24 which are made of metal such as copper, are formed on the upper and lower faces of an insulative plate 23 formed by an insulative material, by printed wiring.
  • the through hole 25 passes through the printed circuit board 22 in the vertical direction (thickness direction). Although the through hole 25 is shaped in a perfect circle in the present embodiment, the shape of the through hole 25 is not limited to this, and may also be ellipsoidal, oval, polygonal, or the like.
  • a conductive path is not formed on the hole wall of the through hole 25 , and the conductive paths 24 on the upper and lower faces of the printed circuit board 22 are electrically connected with each other via the later-described conductive bonding material 35 in the present embodiment, there is no limitation to this.
  • a configuration is also possible, for example, in which a conductive path is formed on the entire hole wall of the through hole 25 using a silver foil or the like, such that the conductive paths 24 on the upper and lower faces of the printed circuit board 22 are electrically connected with each other via the conductive path on the hole wall of the through hole 25 .
  • An electric component 27 serving as a heat-generating component is mounted in one of the conductive paths 24 of the printed circuit board 22 and the metal member 30 .
  • the electric component 27 includes a main body 27 A shaped in a flat cuboid, and a plurality of terminals 27 B formed on the bottom face of the main body 27 A.
  • the lower faces of the plurality of terminals 27 B are arranged on the same plane, and connected with a plurality of lands serving as the conductive paths 24 formed on a surface of the printed circuit board 22 . As shown in FIG.
  • the conductive paths 24 (lands) connected to the terminals 27 B of the electric component 27 includes a land 24 A ( 24 ) provided in a rectangular region that substantially surrounds the circuit board through hole 25 , and a plurality of lands 24 B ( 24 ) arranged in a row at a position spaced apart from the aforementioned region.
  • the plurality of terminals 27 B of the electric component 27 in the present embodiment are soldered to the conductive paths 24 (lands 24 A, 24 B) on the upper face of the printed circuit board 22 and to the upper face 31 A of the metal member 30 .
  • the electric component 27 is a FET (Field Effect Transistor) in the present embodiment, the electric component 27 may also be a register such as a shunt resistor, a heat generating component such as a coil, a capacitor, or the like.
  • the metal member 30 is made of metal such as copper, a copper alloy, aluminum, an aluminum alloy, steel, or stainless steel. As shown in FIGS. 4 and 5 , the metal member 30 includes a cylindrical shaft portion 31 that is inserted into the through hole 25 , and a prismatic head portion 32 that protrudes from the shaft portion 31 in a step-like manner. In the present embodiment, a rivet is used as the metal member 30 . As shown in FIG. 3 , the shaft portion 31 has a flat cross section shaped in a perfect circle, and has a diameter B 1 that is smaller than a diameter A 1 of the through hole 25 . When the shaft portion 31 is inserted into the through hole 25 , a gap G 1 into which a solder serving as a bonding material 35 can be placed is formed between an outer circumferential face of the shaft portion 31 and the hole wall of the through hole 25 .
  • the length of the shaft portion 31 in the vertical direction (axial direction) is larger than the thickness of the printed circuit board 22 by a dimension of a gap G 2 (thickness of the bonding material 35 ).
  • an upper end face 31 A of the shaft portion 31 is at the same height as (level with) the upper face of the conductive path 24 on the upper face of the printed circuit board 22 .
  • the head portion 32 is shaped in a rectangular plate, and as shown in FIG. 3 , the minimum diameter B 2 passing through the central axis of the head portion 32 is larger than the hole diameter A 1 of the through hole 25 .
  • the gap G 2 between the upper face 32 A of the head portion 32 and the lower face of the printed circuit board 22 , and the gap G 1 between the outer circumferential face of the shaft portion 31 and the hole wall of the through hole 25 are filled with the bonding material 35 .
  • a heat conductive material 36 is arranged between the lower face of the head portion 32 and the upper face 40 A of the heat dissipation member 40 .
  • a material having high heat conductivity and insulation property such as silicone grease, is used as the heat conductive material 36 .
  • the heat conductive material 36 is arranged in close contact with the entire lower face of the head portion 32 and the upper face 40 A of the heat dissipation member 40 . Accordingly, heat in the metal member 30 is transferred to the heat dissipation member 40 via the heat conductive material 36 , and is dissipated from the heat dissipation member 40 to the exterior.
  • the heat dissipation member 40 is made of metal having high heat conductivity, such as aluminum, or an aluminum alloy, and as shown in FIG. 1 , includes a flat upper face 40 A, and a plurality of heat dissipation fins 41 arranged in a row on the lower surface in a comb-like manner.
  • a plurality of spacer portions 42 protruding upward are provided on the upper surface 40 A of the heat dissipation member 40 .
  • the plurality of spacer portions 42 are provided near the circumferential edge portion on the upper face of the heat dissipation member 40 .
  • a predetermined gap (whose dimension obtained by adding the thickness of the head portion 32 to the thickness of the heat conductive material 36 ) is kept between the lower face of the printed circuit board 22 and the upper face 40 A of the heat dissipation member 40 .
  • the insulation layer formed of an insulative adhesive agent or the like is formed on the upper face of the spacer portions 42 and insulates the printed circuit board 22 from the spacer portions 42 .
  • the circuit assembly 20 is formed by fixing the heat dissipation member 40 and the metal member-equipped circuit board 21 to each other with a fixing means such as a screw (not shown), and an electrical junction box 10 ( FIG. 1 ) is formed by covering the circuit assembly 20 with the case 11 .
  • the metal member-equipped circuit board 21 includes: the printed circuit board 22 having the through hole 25 , the metal member 30 having the shaft portion 31 that is inserted into the through hole 25 , and the head portion 32 having the diameter B 2 that is larger than the diameter A 1 of the through hole 25 and arranged outside the through hole 25 , and the conductive bonding material 35 that bonds the shaft portion 31 and the inner wall of the through hole 25 to each other.
  • the shaft portion 31 of the metal member 30 and the inner wall of the through hole 25 of the printed circuit board 22 are bonded to each other with the conductive bonding material 35 , high dimensional accuracy is not necessarily required compared to a configuration, for example, in which the shaft portion 31 of the metal member 30 and the inner wall of the through hole 25 of the printed circuit board 22 are joined with each other only by press-fitting, and thus manufacturing costs can be reduced.
  • the metal member 30 since the metal member 30 includes the head portion 32 , which has a diameter B 2 that is larger than the hole diameter A 1 of the through hole 25 , it is possible to readily perform positioning of the shaft portion 31 in the direction in which the shaft portion 31 is inserted into the through hole 25 .
  • the metal member 30 since the metal member 30 includes the head portion 32 , the heat capacity of the metal member 30 can be enhanced compared to a case in which the head portion 32 is not provided, making it possible to enhance heat dissipation performance.
  • the upper end face 31 A of the shaft portion 31 (end face on the opposite side of the head portion 32 ) is formed at the same height as the surface of the conductive path 24 of the printed circuit board 22 on which the electric component 27 is mounted.
  • the bonding material 35 bonds a face of the printed circuit board 22 that is opposed to the head portion 32 and the head portion 32 of the metal member 30 to each other.
  • the contact area of the bonding material 35 becomes large, the electrical resistance can be reduced while enhancing the fixing strength between the printed circuit board 22 and the metal member 30 . Furthermore, the conductive path 24 of the lower face of the printed circuit board 22 (face opposed to the head portion 32 ) and the head portion 32 can be electrically bonded to each other with the bonding material 35 .
  • the circuit assembly 20 includes: the metal member-equipped circuit board 21 , the electric component 27 connected to the upper end face 31 A of the shaft portion 31 (end face on the opposite side of the head portion 32 ), and the heat dissipation member 40 that can be placed on the metal member-equipped circuit board 21 , and the spacer portions 42 that keep the space between the printed circuit board 22 and the heat dissipation member 40 .
  • heat in the electric component 27 can be dissipated by the heat dissipation member 40 , and due to the spacer portions 42 , positioning of the shaft portion 31 of the metal member 30 relative to the depth of insertion into the through hole 25 can be suitably performed.
  • the spacer portions 42 are provided in one piece with the heat dissipation member 40 .
  • FIGS. 7 to 10 a second embodiment will be described with reference to FIGS. 7 to 10 .
  • the head portion 32 of the metal member 30 is rectangular in the first embodiment, as shown in FIG. 8 , a head portion 52 of a metal member 50 is circular in the second embodiment.
  • Other structural aspects are the same as in the first embodiment, and therefore the same structures as in the first embodiment are denoted with the same reference signs, and the description thereof is omitted.
  • a diameter B 3 of a head portion 52 that is shaped like a circular disc and that is arranged below the through hole 25 of the printed circuit board 22 is larger than the diameter A 1 of the through hole 25 .
  • the gap between the through hole 25 of the printed circuit board 22 and the shaft portion 31 is filled with the conductive bonding material 35
  • the gap between the lower face of the printed circuit board 22 and the upper face 52 A of the head portion 52 is also filled with the conductive bonding material 35 .
  • FIGS. 11 to 14 a third embodiment will be described with reference to FIGS. 11 to 14 .
  • the flat cross-section of the shaft portion 31 of the metal member 30 is shaped in a perfect circle
  • a shaft portion 61 of a metal member 60 is not shaped in a circle in the third embodiment.
  • Other structural aspects are the same as in the above embodiments, and therefore the same structures as in the above embodiments are denoted with the same reference signs, and the description thereof is omitted.
  • the flat cross-section of the shaft portion 61 of the metal member 60 is approximately shaped in a triangle, and an upper end face 61 A of the shaft portion 61 is level with the conductive path 24 in the upper face of the printed circuit board 22 .
  • the outer circumference of the shaft portion 61 includes tapered press-fitting portions 62 for press-fitting into the hole wall of the through hole 25 , and non-press-fitting portions 63 that are arranged opposed to the hole wall of the through hole 25 and that are not press-fitted into the hole wall of the through hole 25 . As shown in FIG.
  • gaps G 3 in which the bonding material 35 is filled are formed between the non-press-fitting portions 63 and the hole wall of the through hole 25 , and by the gaps G 3 being filled with the bonding material 35 , the metal member 60 and the printed circuit board 22 are bonded to each other.
  • the metal member 60 can be temporarily locked on the hole wall of the through hole 25 , and thus the work for bonding with the bonding material 35 can be readily performed, and manufacturing costs can be reduced. Furthermore, due to the non-press-fitting portions 63 being provided, high dimensional accuracy is not required compared to a configuration in which the whole outer circumferential surface of the shaft portion 61 is press-fitted into the hole wall of the through hole 25 , and manufacturing costs can be reduced.
  • a fourth embodiment will be described with reference to FIGS. 15 and 16 .
  • the heat dissipation member 40 is laid under the printed circuit board 22
  • the heat dissipation member 40 is not laid under the metal member-equipped circuit board 21
  • the metal member-equipped circuit board 21 is housed in a case 80 in a state of being supported from below by a supporting member 71 .
  • the supporting member 71 is a frame made of a synthetic resin or metal, and includes a mounting portion 72 on which the circumferential edge portion of the printed circuit board 22 is mounted, and an engaged portion 73 that protrudes toward the case 80 and is engaged in the case 80 .
  • the case 80 is made of metal or a synthetic resin and includes an upper case 81 and a lower case 82 , and an engaging portion 84 into which the engaged portion 73 is to be inserted and engaged penetrates through the case 80 .
  • a fifth embodiment will be described with reference to FIGS. 17 and 18 .
  • the gap G 2 that is filled with the bonding material 35 is formed between the printed circuit board 22 and the head portion 32
  • a shaft portion 91 of a metal member 90 shown in FIGS. 17 and 18 is shorter than the shaft portion 31 of the first to third embodiments, and the upper face 32 A of the head portion 32 is in contact with the conductive path 24 on the lower face of the printed circuit board 22 .
  • Other structural aspects are the same as in the above embodiments, and therefore the same structures as in the above embodiments are denoted with the same reference signs, and the description thereof is omitted.
  • the terminals 27 B are arranged on the bottom face of the main body 27 A, there is no limitation to this.
  • a configuration is also possible in which, for example, the terminals 27 B protrude from the side or the like of the main body 27 A and are soldered to the conductive path 24 of the printed circuit board 22 , the metal member 30 , or the like.
  • the head portion 32 of the metal members 30 , 50 , and 60 is shaped like a plate, there is no limitation to this.
  • the metal members 30 , 50 , and 60 include a head portion having a semispherical or spherical shape, for example.
  • the head portion has a protruding shape which partially protrudes, or a recessing shape which partially recesses.
  • the shaft portion 31 of the metal member 60 has a cross section which is approximately shaped in a triangle, there is no limitation to this.
  • a configuration is also possible in which the cross section of the shaft portion 31 is shaped in a polygon other than a triangle, and the corners of the polygon are the press-fitting portions that are fitted into the hole wall of the through hole 25 .
  • a configuration is also possible in which the cross section of the shaft portion is shaped in an oval, an ellipse, or the like that has long and short diameters, and the diameter varies in accordance with the position in the circumferential direction.
  • the number of the electric component 27 and the metal member 30 is not limited to the number as in the above embodiments, and a plurality of these components and members can also be provided in accordance with the conductive paths 24 and the like.
  • the metal member 30 is described as a rivet, there is no limitation to this.
  • the metal member 30 may also be a screw in which a thread portion is formed in the shaft portion, for example.
  • the bonding material 35 is described as a solder, there is no limitation to this.
  • the bonding material 35 may also be a material such as a brazing filler material or a conductive adhesive agent (conductive resin), for example.
  • the metal member 30 is temporarily fixed to the printed circuit board 22 (e.g., the upper face 32 A of the head portion is fixed to the printed circuit board 22 with an adhesive agent), and thereafter, the metal member 30 is bonded to the printed circuit board 22 with the bonding material.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Connection Or Junction Boxes (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
US16/605,082 2017-04-18 2018-04-03 Metal member-equipped circuit board, circuit assembly, and electrical junction box Abandoned US20210105891A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017081746A JP2018182147A (ja) 2017-04-18 2017-04-18 金属部材付き基板、回路構成体及び電気接続箱
JP2017-081746 2017-04-18
PCT/JP2018/014201 WO2018193827A1 (ja) 2017-04-18 2018-04-03 金属部材付き基板、回路構成体及び電気接続箱

Related Parent Applications (1)

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PCT/JP2018/014201 A-371-Of-International WO2018193827A1 (ja) 2017-04-18 2018-04-03 金属部材付き基板、回路構成体及び電気接続箱

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US17/652,149 Continuation US11665812B2 (en) 2017-04-18 2022-02-23 Metal member-equipped circuit board, circuit assembly, and electrical junction box

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US20210105891A1 true US20210105891A1 (en) 2021-04-08

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US16/605,082 Abandoned US20210105891A1 (en) 2017-04-18 2018-04-03 Metal member-equipped circuit board, circuit assembly, and electrical junction box
US17/652,149 Active US11665812B2 (en) 2017-04-18 2022-02-23 Metal member-equipped circuit board, circuit assembly, and electrical junction box

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US17/652,149 Active US11665812B2 (en) 2017-04-18 2022-02-23 Metal member-equipped circuit board, circuit assembly, and electrical junction box

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US (2) US20210105891A1 (ja)
JP (3) JP2018182147A (ja)
CN (3) CN116133236A (ja)
DE (1) DE112018002063T5 (ja)
WO (1) WO2018193827A1 (ja)

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WO2023065411A1 (zh) * 2021-10-22 2023-04-27 智恩电子(大亚湾)有限公司 一种高多层pcb新型压合定位结构
US20230337353A1 (en) * 2022-04-14 2023-10-19 Hamilton Sundstrand Corporation Devices and methods to improve thermal conduction from smt and chip on board components to chassis heat sinking

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JP6522841B6 (ja) 2018-09-27 2019-07-17 大和製罐株式会社 撥液性フィルムまたはシート、およびそれを用いた包装材
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CN117320271A (zh) 2023-12-29
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CN110506455A (zh) 2019-11-26
JP2021101493A (ja) 2021-07-08

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