US20120193241A1 - Method for applying semi-dry electroplating method on surface of plastic substrate - Google Patents

Method for applying semi-dry electroplating method on surface of plastic substrate Download PDF

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Publication number
US20120193241A1
US20120193241A1 US13/356,642 US201213356642A US2012193241A1 US 20120193241 A1 US20120193241 A1 US 20120193241A1 US 201213356642 A US201213356642 A US 201213356642A US 2012193241 A1 US2012193241 A1 US 2012193241A1
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Prior art keywords
plastic substrate
electroplating
plating
layer
nickel
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US13/356,642
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English (en)
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Xue-biao Ke
Yong-liang Qiao
Bo Yang
Min-Zen Lee
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Xiamen Runner Industrial Corp
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Xiamen Runner Industrial Corp
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Assigned to XIAMEN RUNNER INDUSTRIAL CORPORATION reassignment XIAMEN RUNNER INDUSTRIAL CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: Lee, Min-zen, QIAO, Yong-liang, WU, Zi-bao, YANG, BO
Publication of US20120193241A1 publication Critical patent/US20120193241A1/en
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Definitions

  • the present invention is related to an electroplating method, and more particularly to a method for applying a semi-dry electroplating method on a surface of plastic substrate.
  • Chinese Patent, CN03104647.9 discloses a method for spraying electrically conductive medium on plastic pieces and cooperating electrolytic plating to conduct electroplating of a plastic surface.
  • Chinese Patent, CN02127419.3, used a method for roughening with dichromic acid content and activation of noble metal to metalize different kinds of plastics.
  • Chinese Patent, CN200410018367.2 used a vacuum sputtering method, which form a thin layer of basic metallic coating by sputtering on a surface of non-metallic material to conduct metallization.
  • the insufficiency of the foregoing methods 1) and 2) is that using dichromic acid and spraying electrically conductive paint result in serious environmental pollution problem and has higher cost of production.
  • Using metallization technology with vacuum evaporation coating on a plastic substrate is more environmentally friendly when compared to the foregoing methods 1) and 2).
  • such simple way of vacuum evaporation coating leads to poor adhesion between the plastic substrate and PVD metallic layer. After electroplating, abscission layer, foaming or other phenomena would occur between the plastic substrate and PVD metallic layer or the final electroplating products confront failure in the thermal cycling test or other problems.
  • the objective of the present invention is, in view of disadvantages and insufficiency existing in the conventional plastic electroplating procedure, to provide a method for applying a semi-dry electroplating method on a surface of a plastic substrate, which realizes surface metallization of plastic materials, simplifies an electroplating procedure, dramatically reduces the amount of waste water, reduces the pollution to environment and expands electroplatable range of a plastic substrate.
  • the present invention includes the following steps:
  • said plastic substrate can use a plastic substrate produced by injection molding or extrusion molding.
  • Said plastic substrate can use engineering-plastics, glass fibers or mineral-powder reinforcing plastics or the like.
  • Said engineering-plastics can be selected from one of ABS, PC, PC/ABS blends, PA6, PETG, PBT, PA66, TPU, TPU/ABS blends or the like.
  • Said glass fiber reinforcing plastics can be selected from one of PA6+glass fiber, PBT+glass fiber, PC+glass fiber, PA66+glass fiber, PP+glass fiber or the like.
  • Said mineral-powder reinforcing plastics can be selected from one of PA6+mineral powder, PP+mineral powder or the like.
  • Said water-free cleaning can use the following methods: First, Electrostatic precipitation of the product surface, then wipe the surface of the product with anhydrous alcohol, And then using ion-source glow cleaning or bias glow cleaning in a PVD oven or corona activated treatment, washing with water first to remove oil then drying if the product surface is severely contaminated with greasy dirt, And then using ion-source glow cleaning or bias glow cleaning in a PVD oven or corona activated treatment.
  • said first-time activated treatment can use following methods: plasma glow modification using ion-source glow or bias glow mode to conduct the activated treatment, or corona activated treatment.
  • said metallic base layer can be a metallic base layer or an alloy base layer using chromium, titanium, aluminum, nickel, iron, zirconium or the like.
  • Said metallic base layer can use arc ion plating or magnetron sputter plating to produce the PVD base layer.
  • Said alloy transition layer is an alloy layer with at least one metal selected from chromium, titanium, aluminum, nickel, iron, zirconium, copper or the like and can be produced by arc ion plating or magnetron sputter plating.
  • Said metallic electrically conductive layer can be a metallic electrically conductive layer of copper, nickel or other metal. Said metallic electrically conductive layer can use arc ion plating or magnetron sputter plating to produce the PVD base layer.
  • said ultrasonic water washing comprises transferring the plastic substrate treated in the step 3) into water galvanization line to conduct the ultrasonic water washing.
  • Activating solution used in said second-time activated treatment can use sulfuric acid solution or the like.
  • step 5 if the surface of the plastic substrate is not flat, electroplating starts from plating acid copper.
  • Said nickel electroplating can use at least one of semi-bright nickel, fully-bright nickel, microporous nickel or the like. If the surface of the plastic substrate is flat, electroplating directly starts from electroplating a semi-bright nickel layer, then electroplating a fully-bright nickel layer or a microporous nickel layer or the like.
  • the present invention uses improved PVD surface plating technology to treat the surface of the substrate with the water-free clean, the activated treatment and PVD multilayer technology, to plate the electrically conductive layer on the plastic surface first with physical vapor deposition (PVD), then to transfer the plastic substrate into traditional electroplating procedure to metalize the surface of the plastic material, and to incorporate simplified electroplating to prepare a semi-dry electroplated product with high quality.
  • PVD physical vapor deposition
  • Pretreatment before electroplating is not required and therefore traditional chemical degreasing, roughening, naturalization, sensitization, chemical nickel-plating and so forth can be ignored.
  • the procedures of electroplating the copper layer, electroplating the nickel layer and electroplating the chromium layer are directly conducted or electroplating chromium can be conducted in a PVD stove. As a result, the semi-dry electroplated product with high quality can be produced. Additionally, the amount of wastewater discharge in the present invention is merely a half of that in the traditional electroplating procedure.
  • FIG. 1 is a cross-sectional side view of the product prepared by example 1 of the present invention.
  • a plastic substrate from the bottom to the top, there are a plastic substrate, a vacuum vapor deposited layer (PVD Cr/CrCu/Cu), an electroplated acid copper layer, an electroplated semi-bright nickel layer, an electroplated fully-bright nickel, an electroplated microporous nickel layer, and a electroplated bright chromium layer.
  • PVD Cr/CrCu/Cu vacuum vapor deposited layer
  • electroplated acid copper layer an electroplated semi-bright nickel layer, an electroplated fully-bright nickel, an electroplated microporous nickel layer, and a electroplated bright chromium layer.
  • Step 1 injection molding: PC+ABS engineering plastic resin was dried at 80° C. for 4 h, and then was injection molded to form a plastic piece of car-door handle. The surface of plastic piece was flat.
  • Step 2 cleaning of plastic piece and plasma surface modification:
  • the cleaning (dry cleaning) procedure before plating comprises wiping the surface with anhydrous alcohol and plasma glow cleaning in a PVD stove.
  • Parameters for the plasma glow cleaning comprise: Ar flux being 65 sccm, time for glow cleaning being 5 min, bias voltage being 70V, bias vacuum ratio being 70%, and ion source current being 0.3 A.
  • Parameters for the plasma glow surface modification comprise: O 2 100 sccm, ion source current being 0.3 A, time for surface modification being 10 min, bias voltage being 70V, and bias vacuum ratio being 70%.
  • Step 3 PVD metallic base layer and alloy transition layer:
  • the target was metallic Cr target and arc ion plating was used for plating.
  • Ar flux was 50 sccm
  • Cr target current was 50 A
  • bias voltage was 60V
  • bias vacuum ratio was 75%
  • time for plating was 5 min
  • vacuum pressure for plating was 0.13 Pa.
  • the alloy transition layer was CrCu alloy transition layer using arc Cr target and sputtering Cu target to form a CrCu alloy membrane with arc Cr target current being 50 A, copper target current for magnetron sputter plating from 2 A gradually raised to 8 A, bias voltage being 60V, bias vacuum ratio being 75%, time for plating being 8 min, Ar flux being 130 sccm, and vacuum pressure for plating being 0.3 Pa.
  • Step 4 PVD electrically conductive layer: A magnetic sputter plating copper target was used for plating with copper target current being 8 A, bias voltage being 70V, bias vacuum ratio being 70%, time for plating being 40 min, Ar gas flux being 130 sccm, and vacuum pressure for plating being 0.3 Pa.
  • Step 5 galvanic plating: The product was transferred to hang on plating racks and was started to be plated from water washing and activation before contacting acid copper. Plated layers in turn comprise acid copper, semi-bright nickel, fully-bright nickel, microporous nickel, and bright chromium.
  • Step 1 injection molding: Polyamide modified engineering plastic powder was dried at 120° C. for 4 h, and then was injection molded to form a plastic piece of faucet knob. Since the ingredients for modification comprise glass fibers, the surface of plastic piece has little orange peel.
  • Step 2 cleaning of plastic piece and plasma surface modification
  • the cleaning (dry cleaning) procedure before plating comprises wiping the surface with anhydrous alcohol and plasma glow cleaning in a PVD stove.
  • Parameters for the plasma glow cleaning comprise: Ar gas flux being 65 sccm, time for glow cleaning being 5 min, ion source current being 0.3 A, bias voltage being 70V, bias vacuum ratio being 70%, and ion source current being 0.3 A. If the surface of the product is contaminated severely, washing with water would be required to remove oil, time for oil-removal and water-washing is 5 min and then the surface of the product would be dried under 120° C.
  • Parameters for the plasma glow surface modification comprise: O 2 gas flux being 100 sccm, time for surface modification being 10 min, bias voltage being 70V, and bias vacuum ratio being 70%.
  • Step 3 PVD metallic base layer and alloy transition layer:
  • the target was metallic Cr target and physical sputter plating was used for plating with Ar flux being 130 sccm, Cr target current being 8 A, bias voltage being 60V, bias vacuum ratio being 75%, time for plating being 5 min, and vacuum pressure for plating being 0.29 Pa.
  • the alloy transition layer was CrCu alloy transition layer using medium frequency magnetron sputter plating Cr target and magnetron sputter plating Cu target to form a CrCu alloy membrane.
  • Step 4 PVD electrically conductive layer: A copper target was used and a magnetic sputter plating was used for plating with copper target current being 8 A, bias voltage being 60V, bias vacuum ratio being 75%, time for plating being 40 min, Ar 130 sccm, and vacuum pressure for plating being 0.3 Pa.
  • Step 5 galvanic plating: The product was transferred to hang on plating racks and was started to be plated from water washing and activation before contacting acid copper. Plated layers in turn comprise acid copper, semi-bright nickel, fully-bright nickel, microporous nickel, and bright chromium.
  • Step 1 injection molding: Polyamide modified engineering plastic powder was dried at 120° C. for 4 h, and then was injection molded to form a plastic piece of high-density ball head. The surface of the plastic piece was flat.
  • Step 2 cleaning of plastic piece and surface modification:
  • the dried plastic piece was put into a vacuum oven to conduct plasma glow cleaning and plasma surface modification.
  • Parameters for the plasma glow cleaning comprise: Ar gas flux being 65 sccm, time for glow cleaning being 5 min, ion source current being 0.3 A, bias voltage being 70V, bias vacuum ratio being 70%, and ion source current being 0.3 A.
  • Parameters for the plasma surface modification comprise: O 2 gas flux being 100 sccm, time for gloss surface modification being 10 min, bias voltage being 70V, and bias vacuum ratio being 70%.
  • Step 3 PVD metallic base layer and alloy transition layer:
  • the target was Cr target and arc ion plating was used for plating with Ar flux being 50 sccm, Cr target current being 50 A, bias voltage being 60V, bias vacuum ratio being 75%, time for plating being 5 min, and vacuum pressure for plating being 0.13 Pa.
  • the alloy transition layer was CrCu alloy transition layer using arc Cr target and sputtering Cu target to form a CrCu alloy membrane with arc Cr target current being 50 A, copper target current for magnetron sputter plating from 2 A gradually raised to 8 A, bias voltage being 60V, bias vacuum ratio being 75%, time for plating being 8 min, Ar flux being 130 sccm, and vacuum pressure for plating being 0.3 Pa.
  • Step 4 PVD electrically conductive layer: A copper target was used as the target and a magnetic sputter plating was used for plating with copper target current being 8 A, bias voltage being 60V, bias vacuum ratio being 75%, time for plating being 40 min, Ar 130 sccm, and vacuum pressure for plating being 0.3 Pa.
  • Step 5 galvanic plating: The product was transferred to hang on plating racks and was started to be plated from water washing and activation before forming semi-bright nickel. Plated layers in turn comprise semi-bright nickel, fully-bright nickel, microporous nickel, and bright chromium.
  • Example 1 2 3 Plastic substrate ABS + PC PA6 + 30% GF + PA6 + iron iron powder powder plating types CP CP CP CP Product Car handle Cover of faucet Ball head Appearance of Flat Little orange peel Flat plastic piece Surface cleaning Anhydrous Water washing and Plasma glow alcohol wipe oil removal cleaning Surface Plasma glow Plasma glow Plasma glow modification modification modification modification Metallic base Arc Cr Sputtering Cr Arc Cr layer Alloy transition CrCu CrCu CrCu Electrically-conduc- Cu 1 ⁇ m Cu 1 ⁇ m Cu 1 ⁇ m tive layer Acid copper 15 ⁇ 20 ⁇ m 15 ⁇ 20 ⁇ m 0 ⁇ m Semi-bright nickel 6 ⁇ m 6 ⁇ m 6 ⁇ m Fully-bright 9 ⁇ m 9 ⁇ m 9 ⁇ m nickel Microporous 1 ⁇ m 1 ⁇ m 1 ⁇ m nickel Bright chromium 0.25 ⁇ m 0.25 ⁇ m 0.25 ⁇ m Copper-accelerated pass pass pass acetic acid-salt spray corrosion test 8 h corrosion test Thermal cycling pass pass pass pass

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  • Engineering & Computer Science (AREA)
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CN2011100308324A CN102127764B (zh) 2011-01-28 2011-01-28 一种在塑胶基材表面实施半干法电镀的方法
CN201110030832.4 2011-01-28

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