CN111826619A - 一种塑胶金属化的电镀预镀工艺 - Google Patents
一种塑胶金属化的电镀预镀工艺 Download PDFInfo
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Abstract
本发明公开了一种塑胶金属化的电镀预镀工艺，其是采用电弧离子镀或磁控溅射工艺于塑胶工件表面依次形成金属结合层和金属过渡层，然后采用电弧离子镀于金属过渡层上沉积金属导电层；其中至少金属导电层的制备工艺包括：于金属靶材和放置塑胶工件的真空室之间设置磁过滤装置，使由靶材产生的带正电荷的金属离子通过磁过滤装置偏转后进入真空室并沉积到所述塑胶工件表面。本发明通过使金属靶材蒸发出来的粒子通过带电磁场偏转的磁过滤装置，中性粒子团无法沉积到工件表面，不存在传统PVD工艺中聚集的金属粒子团(大颗粒)沉积到膜层表面的情况，使膜更为平整，金属化后的塑胶工件可经电镀获得高品质镜面外观。
Description
技术领域
本发明涉及塑胶金属化的技术领域，尤其涉及一种塑胶金属化的电镀预镀工艺。
背景技术
塑胶金属化的目的是为了让原本不导电的塑胶工件表面沉积一层可导电的金属膜层，塑胶金属镀膜技术包括喷涂、物理气相沉积(PVD)、电镀等工艺。现有运用喷涂加物理气相沉积的方式获得电镀铬外观工件，这种工艺适用于产品形状比较简单的平面形工件，对于较复杂的工件形状存在漆膜及PVD膜层厚度不均匀的缺点，该工艺也会产生VOC等有机物排放，并不是完全绿色环保。电镀工艺具有能给产品带来高品质的外观、高耐用性等其他技术难以比拟的优势，但电镀工艺只能直接用于有限的几种塑胶表面，且电镀前处理工序对环境污染严重，因此需要进行预处理。
可选的电镀预处理工艺包括PVD等，PVD工艺原理是通过氩离子轰击使靶材表面产生瞬时高温使材料蒸发，部分材料会以聚集的金属粒子团(大颗粒)形态沉积到工件表面，聚集的粒子团经过后续电镀工序的放大，导致工件表面存在大量可见的颗粒，无法媲美传统电镀高品质外观标准。
发明内容
本发明的目的在于克服现有技术存在的不足，提供一种塑胶金属化的电镀预镀工艺。
为了实现以上目的，本发明的技术方案为：
一种塑胶金属化的电镀预镀工艺，包括以下步骤：
1)对塑胶工件进行离子源清洗；
2)采用电弧离子镀或磁控溅射工艺于塑胶工件表面形成金属结合层；
3)采用电弧离子镀或磁控溅射工艺于金属结合层上形成金属过渡层；
4)采用电弧离子镀于金属过渡层上形成金属导电层；
其中，步骤2)、3)和4)中，至少步骤4)的工艺包括：于金属靶材和放置塑胶工件的真空室之间设置磁过滤装置，使由靶材产生的带正电荷的金属离子通过磁过滤装置偏转后进入真空室并沉积到所述塑胶工件表面。
可选的，所述金属结合层为铬、锆、钛中的一种，厚度为40～150nm。
可选的，所述金属过渡层是通过共沉积的方式，将与所述金属结合层相同的金属靶材和与所述金属导电层相同的金属靶材共沉积形成混合金属镀层，厚度为40～150nm。
可选的，步骤3)中，至少与所述金属导电层相同的金属靶材和所述真空室之间设有所述磁过滤装置。
可选的，所述金属导电层为铜、镍、铝中的一种，厚度为100～1000nm。
可选的，步骤1)中，将塑胶工件放入真空室内，开启转架，抽真空至低于0.005Pa，通入氩气使真空度下降到0.1～2Pa，离子源设定1000-3000V清洗200-600s后恢复真空同时所述塑胶工件降温。
可选的，所述磁过滤装置包括弯管和磁产生装置，所述靶材设于所述弯管的入口，所述真空室设于所述弯管的出口，所述入口的法线和所述出口的法线互相垂直，所述磁产生装置通过调节线圈的电流大小使磁力线平行于弯管。
可选的，还包括向所述弯管上施加100～500V的正偏压。
可选的，所述塑胶工件的材料包括ABS、PC、PMMA和PET。
可选的，步骤4)之后进行电镀工艺，所述电镀的工序为焦铜——酸铜——半光镍——全光镍——光亮铬，或者焦铜——酸铜——全光镍——光亮铬；其中所述光亮铬是三价铬或六价铬。
本发明的有益效果为：
采用电弧离子镀或磁控溅射工艺使金属靶材蒸发，蒸发出来的粒子通过带电磁场偏转的磁过滤装置，中性粒子团无法沉积到工件表面，带正电荷的金属离子在洛伦磁力作用下偏转后进入到真空室沉积到工件表面形成金属膜层，由于膜层几乎都是由金属离子沉积而来，不存在传统PVD工艺中聚集的金属粒子团(大颗粒)沉积到膜层表面的情况，使膜更为平整，金属化后的塑胶工件可经电镀获得高品质镜面外观。
附图说明
图1为实施例的磁过滤装置的原理示意图；
图2为实施例1和对比例得到的电镀膜层表面的电镜照片。
具体实施方式
以下结合附图和具体实施例对本发明做进一步解释。
以下具体说明一种塑胶金属化的电镀预镀工艺的步骤。
步骤1)，对塑胶工件进行离子源清洗增加工件表面活性、增强金属膜层与塑胶基底结合力。具体，将塑胶工件放入PVD设备的真空室内，开启转架，抽真空至低于0.005Pa，通入氩气使真空度下降到0.1～2Pa，离子源设定1000-3000V清洗200-600s后恢复真空同时所述塑胶工件降温。塑胶工件的材料包括但不限于ABS、PC、PMMA和PET等。
步骤2)，采用电弧离子镀或磁控溅射工艺于塑胶工件表面形成金属结合层。金属结合层选用铬、锆、钛等高熔点金属以增强金属膜层与塑胶基底的结合力。金属结合层的厚度约为40-150nm。
步骤3)，采用电弧离子镀或磁控溅射工艺于金属结合层上形成金属过渡层。金属过渡层是通过共沉积的方式，将与金属结合层相同的金属靶材和与金属导电层相同的金属靶材共沉积形成混合金属镀层。金属过渡层的厚度为40-150nm。
步骤4)，采用电弧离子镀工艺于金属过渡层上形成金属导电层。金属导电层选用铜、镍、铝等良导电金属以提供高导电特性，便于后续电镀工艺的进行。金属导电层的厚度为100-1000nm。
上述步骤2)、3)和4)中，至少步骤4)的工艺包括：于金属靶材和放置塑胶工件的真空室之间设置磁过滤装置，使由金属靶材产生的带正电荷的金属离子通过磁过滤装置偏转后进入真空室并沉积到所述塑胶工件表面。
参考图1，一实施例的磁过滤装置是弯管结构并设有磁产生装置，靶材设于弯管的入口，真空室设于弯管的出口，入口的法线和出口的法线优选互相垂直，即弯管是90°偏转，此外，也可根据实际情况设置其他角度。由磁产生装置产生的磁场磁力线平行于弯管，从而洛伦磁力平行弯管，由金属靶材蒸发出来的粒子通过磁过滤装置，带正电荷的金属离子在洛伦磁力作用下沿着弯管偏转后由出口进入到真空室，沉积到工件表面形成金属膜层，中性粒子团(大颗粒)无法沉积到工件表面，从而控制形成的金属膜层具有平整、致密、均匀的外观。向所述弯管上施加100～500V的正偏压避免金属离子沉积到弯管上。
本发明中，至少金属导电层的制备工艺使用磁过滤装置，确保整个预镀工艺形成的金属层表面平整、致密、均匀的外观，此外，根据实际需求，金属结合层、金属过渡层制备工艺的部分或全部也可以使用磁过滤装置。
预镀工艺完成后，进行电镀工艺，电镀工艺包括焦铜——酸铜——半光镍——全光镍——光亮铬，可根据实际生产需要，调整酸铜后的工艺，例如焦铜——酸铜——全光镍——光亮铬，光亮铬可以是三价铬、六价铬。传统的电镀工艺还包括粗化——催化——解胶——化学镍等一系列前处理工艺，粗化废水含大量重铬酸废液，本发明省略了上述前工艺。
实施例1
在塑胶花洒表面进行塑胶金属化的电镀工艺。
步骤1)工件清洗并烘干，放入真空室内，开启转架，抽真空至低于0.005Pa，通入氩气使真空度下降到0.3Pa，离子源设定1500V清洗300s后恢复真空同时工件降温；
步骤2)磁控溅射铬靶，电流设定20A，沉积180s后恢复真空同时工件降温，形成厚度约40nm的铬层；
步骤3)磁控溅射铬靶，电流设定20A；采用磁过滤装置，电弧铜靶，电流设定150A；600s内逐渐降低磁控溅射铬靶电流至10A后恢复真空同时工件降温，形成厚度约50nm的铬铜合金层；
步骤4)采用磁过滤装置，电弧铜靶，电流设定150A沉积铜层厚度约至300nm后结束镀膜。
步骤5)电镀具体工艺：焦铜——酸铜——半光镍——全光镍——光亮铬。上述工序可参考常规电镀工艺。工件进行电镀处理得到镜面铬外观。
对比例
与实施例1的差别在于，对比例全部不采用磁过滤装置，其余参数相同。
参考图2，实施例1(A)和对比例(B)得到的电镀膜层表面的电镜照片可见，实施例1得到了镜面外观的电镀层，膜层平整、致密，品质高。而对比例外观麻点较多，不能达到高品质产品要求。
实施例1得到的电镀膜层经检测，具有与传统电镀膜层相近的机械性能和耐用性能。
上述实施例仅用来进一步说明本发明的一种塑胶金属化的电镀预镀工艺，但本发明并不局限于实施例，凡是依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰，均落入本发明技术方案的保护范围内。
Claims (10)
1.一种塑胶金属化的电镀预镀工艺，其特征在于包括以下步骤：
1)对塑胶工件进行离子源清洗；
2)采用电弧离子镀或磁控溅射工艺于塑胶工件表面形成金属结合层；
3)采用电弧离子镀或磁控溅射工艺于金属结合层上形成金属过渡层；
4)采用电弧离子镀于金属过渡层上形成金属导电层；
其中，步骤2)、3)和4)中，至少步骤4)的工艺包括：于金属靶材和放置塑胶工件的真空室之间设置磁过滤装置，使由靶材产生的带正电荷的金属离子通过磁过滤装置偏转后进入真空室并沉积到所述塑胶工件表面。
2.根据权利要求1所述的电镀预镀工艺，其特征在于：所述金属结合层为铬、锆、钛中的一种，厚度为40～150nm。
3.根据权利要求1所述的电镀预镀工艺，其特征在于：所述金属过渡层是通过共沉积的方式，将与所述金属结合层相同的金属靶材和与所述金属导电层相同的金属靶材共沉积形成混合金属镀层，厚度为40～150nm。
4.根据权利要求3所述的电镀预镀工艺，其特征在于：步骤3)中，至少与所述金属导电层相同的金属靶材和所述真空室之间设有所述磁过滤装置。
5.根据权利要求1所述的电镀预镀工艺，其特征在于：所述金属导电层为铜、镍、铝中的一种，厚度为100～1000nm。
6.根据权利要求1所述的电镀预镀工艺，其特征在于：步骤1)中，将塑胶工件放入真空室内，开启转架，抽真空至低于0.005Pa，通入氩气使真空度下降到0.1～2Pa，离子源设定1000-3000V清洗200-600s后恢复真空同时所述塑胶工件降温。
7.根据权利要求1所述的电镀预镀工艺，其特征在于：所述磁过滤装置包括弯管和磁产生装置，所述靶材设于所述弯管的入口，所述真空室设于所述弯管的出口，所述入口的法线和所述出口的法线互相垂直，所述磁产生装置通过调节线圈的电流大小使磁力线平行于弯管。
8.根据权利要求7所述的电镀预镀工艺，其特征在于：还包括向所述弯管上施加100～500V的正偏压。
9.根据权利要求1所述的电镀预镀工艺，其特征在于：根据权利要求1所述的电镀预镀工艺，其特征在于：所述塑胶工件的材料包括ABS、PC、PMMA和PET。
10.根据权利要求1所述的电镀预镀工艺，其特征在于：步骤4)之后进行电镀工艺，所述电镀的工序为焦铜——酸铜——半光镍——全光镍——光亮铬，或者焦铜——酸铜——全光镍——光亮铬；其中所述光亮铬是三价铬或六价铬。
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