TWI799618B - 切割用黏著帶及半導體晶片之製造方法 - Google Patents
切割用黏著帶及半導體晶片之製造方法 Download PDFInfo
- Publication number
- TWI799618B TWI799618B TW108125200A TW108125200A TWI799618B TW I799618 B TWI799618 B TW I799618B TW 108125200 A TW108125200 A TW 108125200A TW 108125200 A TW108125200 A TW 108125200A TW I799618 B TWI799618 B TW I799618B
- Authority
- TW
- Taiwan
- Prior art keywords
- dicing
- adhesive tape
- semiconductor wafer
- manufacturing semiconductor
- manufacturing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018164411 | 2018-09-03 | ||
JP2018-164411 | 2018-09-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202020094A TW202020094A (zh) | 2020-06-01 |
TWI799618B true TWI799618B (zh) | 2023-04-21 |
Family
ID=69721630
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108125200A TWI799618B (zh) | 2018-09-03 | 2019-07-17 | 切割用黏著帶及半導體晶片之製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP7374909B2 (zh) |
KR (1) | KR102632461B1 (zh) |
CN (1) | CN112602172A (zh) |
TW (1) | TWI799618B (zh) |
WO (1) | WO2020050167A1 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021124725A1 (ja) * | 2019-12-19 | 2021-06-24 | マクセルホールディングス株式会社 | ダイシング用粘着テープおよび半導体チップの製造方法 |
WO2021124724A1 (ja) * | 2019-12-20 | 2021-06-24 | マクセルホールディングス株式会社 | ダイシング用粘着テープおよび半導体チップの製造方法 |
JPWO2021220929A1 (zh) * | 2020-04-30 | 2021-11-04 | ||
CN113320036B (zh) * | 2021-06-18 | 2024-02-13 | 常州时创能源股份有限公司 | 条状硅材的开方截断工艺及其应用 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5952397A (en) * | 1996-09-25 | 1999-09-14 | Shin-Etsu Chemical Co., Ltd. | Photo-curable liquid silicone rubber compositions for templating mother molds |
TW201520295A (zh) * | 2013-08-30 | 2015-06-01 | Hitachi Maxell | 切割用黏著帶及半導體晶片之製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005093503A (ja) | 2003-09-12 | 2005-04-07 | Hitachi Cable Ltd | ダイシング方法 |
JP2013038408A (ja) | 2011-07-14 | 2013-02-21 | Nitto Denko Corp | 半導体ウェハ固定用粘着テープ、半導体チップの製造方法及び接着フィルム付き粘着テープ |
JP5880399B2 (ja) | 2012-11-13 | 2016-03-09 | 信越化学工業株式会社 | シリコーンゴム成形物の製造方法 |
KR20150112851A (ko) | 2014-03-28 | 2015-10-07 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 실리콘 점착제 조성물, 그의 제조 방법 및 점착 필름 |
JP6395597B2 (ja) * | 2014-12-25 | 2018-09-26 | マクセルホールディングス株式会社 | ダイシング用粘着テープおよび半導体チップの製造方法 |
US9777203B2 (en) * | 2015-06-08 | 2017-10-03 | Momentive Performance Materials | Silicone pressure sensitive adhesive compositions and protective films containing the same |
-
2019
- 2019-07-17 TW TW108125200A patent/TWI799618B/zh active
- 2019-08-30 CN CN201980055642.2A patent/CN112602172A/zh active Pending
- 2019-08-30 WO PCT/JP2019/034126 patent/WO2020050167A1/ja active Application Filing
- 2019-08-30 KR KR1020217005574A patent/KR102632461B1/ko active IP Right Grant
- 2019-08-30 JP JP2020541187A patent/JP7374909B2/ja active Active
-
2023
- 2023-07-14 JP JP2023115978A patent/JP2023138530A/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5952397A (en) * | 1996-09-25 | 1999-09-14 | Shin-Etsu Chemical Co., Ltd. | Photo-curable liquid silicone rubber compositions for templating mother molds |
TW201520295A (zh) * | 2013-08-30 | 2015-06-01 | Hitachi Maxell | 切割用黏著帶及半導體晶片之製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2020050167A1 (ja) | 2021-08-26 |
TW202020094A (zh) | 2020-06-01 |
KR102632461B1 (ko) | 2024-02-02 |
KR20210056334A (ko) | 2021-05-18 |
JP2023138530A (ja) | 2023-10-02 |
CN112602172A (zh) | 2021-04-02 |
WO2020050167A1 (ja) | 2020-03-12 |
JP7374909B2 (ja) | 2023-11-07 |
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