JP7374909B2 - ダイシング用粘着テープおよび半導体チップの製造方法 - Google Patents
ダイシング用粘着テープおよび半導体チップの製造方法 Download PDFInfo
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- JP7374909B2 JP7374909B2 JP2020541187A JP2020541187A JP7374909B2 JP 7374909 B2 JP7374909 B2 JP 7374909B2 JP 2020541187 A JP2020541187 A JP 2020541187A JP 2020541187 A JP2020541187 A JP 2020541187A JP 7374909 B2 JP7374909 B2 JP 7374909B2
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- adhesive
- silicone
- adhesive tape
- dicing
- mass
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- Compositions Of Macromolecular Compounds (AREA)
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JP2014098068A (ja) | 2012-11-13 | 2014-05-29 | Shin Etsu Chem Co Ltd | シリコーンゴム組成物並びにシリコーンゴム成形物及びその製造方法 |
JP2015050216A (ja) | 2013-08-30 | 2015-03-16 | 日立マクセル株式会社 | ダイシング用粘着テープおよび半導体チップの製造方法 |
JP2018119153A (ja) | 2014-03-28 | 2018-08-02 | 信越化学工業株式会社 | シリコーン粘着剤組成物、その製造法及び粘着フィルム |
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JP2005093503A (ja) | 2003-09-12 | 2005-04-07 | Hitachi Cable Ltd | ダイシング方法 |
JP2013038408A (ja) | 2011-07-14 | 2013-02-21 | Nitto Denko Corp | 半導体ウェハ固定用粘着テープ、半導体チップの製造方法及び接着フィルム付き粘着テープ |
JP6395597B2 (ja) | 2014-12-25 | 2018-09-26 | マクセルホールディングス株式会社 | ダイシング用粘着テープおよび半導体チップの製造方法 |
US9777203B2 (en) * | 2015-06-08 | 2017-10-03 | Momentive Performance Materials | Silicone pressure sensitive adhesive compositions and protective films containing the same |
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JP2014098068A (ja) | 2012-11-13 | 2014-05-29 | Shin Etsu Chem Co Ltd | シリコーンゴム組成物並びにシリコーンゴム成形物及びその製造方法 |
JP2015050216A (ja) | 2013-08-30 | 2015-03-16 | 日立マクセル株式会社 | ダイシング用粘着テープおよび半導体チップの製造方法 |
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TW202020094A (zh) | 2020-06-01 |
KR20210056334A (ko) | 2021-05-18 |
WO2020050167A1 (ja) | 2020-03-12 |
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JPWO2020050167A1 (ja) | 2021-08-26 |
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