TWI798394B - 黏著劑組合物、黏著片及加工物的製造方法 - Google Patents

黏著劑組合物、黏著片及加工物的製造方法 Download PDF

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Publication number
TWI798394B
TWI798394B TW108110003A TW108110003A TWI798394B TW I798394 B TWI798394 B TW I798394B TW 108110003 A TW108110003 A TW 108110003A TW 108110003 A TW108110003 A TW 108110003A TW I798394 B TWI798394 B TW I798394B
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TW
Taiwan
Prior art keywords
meth
acrylate
adhesive sheet
adhesive
group
Prior art date
Application number
TW108110003A
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English (en)
Chinese (zh)
Other versions
TW201940633A (zh
Inventor
高岡慎弥
垣内康彦
阿久津高志
Original Assignee
日商琳得科股份有限公司
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Publication of TW201940633A publication Critical patent/TW201940633A/zh
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Publication of TWI798394B publication Critical patent/TWI798394B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
TW108110003A 2018-03-26 2019-03-22 黏著劑組合物、黏著片及加工物的製造方法 TWI798394B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-058130 2018-03-26
JP2018058130 2018-03-26

Publications (2)

Publication Number Publication Date
TW201940633A TW201940633A (zh) 2019-10-16
TWI798394B true TWI798394B (zh) 2023-04-11

Family

ID=68061934

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108110003A TWI798394B (zh) 2018-03-26 2019-03-22 黏著劑組合物、黏著片及加工物的製造方法

Country Status (5)

Country Link
JP (1) JP7304847B2 (ko)
KR (1) KR102644545B1 (ko)
CN (1) CN111742027B (ko)
TW (1) TWI798394B (ko)
WO (1) WO2019188819A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021095449A (ja) * 2019-12-13 2021-06-24 日東電工株式会社 粘着シート剥離方法
CN115702204A (zh) * 2020-06-15 2023-02-14 日产化学株式会社 层叠体、剥离剂组合物及经加工的半导体基板的制造方法
WO2023195445A1 (ja) * 2022-04-06 2023-10-12 日東電工株式会社 表面保護用組成物、表面保護シート、及び、電子部品装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201307503A (zh) * 2011-06-02 2013-02-16 Dainippon Ink & Chemicals 易解體性黏著劑組成物及易解體性黏著帶
TW201802212A (zh) * 2016-03-29 2018-01-16 琳得科股份有限公司 玻璃切割用黏著板片及其製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005054176A (ja) * 2003-07-18 2005-03-03 Oji Paper Co Ltd シート状発泡体およびその製造方法
JP4800694B2 (ja) * 2005-07-26 2011-10-26 日東電工株式会社 ダイシング・ダイボンドフィルム
JP5519971B2 (ja) * 2008-11-26 2014-06-11 日東電工株式会社 ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP2010145428A (ja) * 2008-12-16 2010-07-01 Oji Paper Co Ltd 光学シートおよびその製造方法、照明装置、投影装置、看板並びに画像表示装置
JP5491049B2 (ja) * 2009-03-11 2014-05-14 日東電工株式会社 半導体ウエハ保護用基材レス粘着シート、その粘着シートを用いた半導体ウエハ裏面研削方法及びその粘着シートの製造方法
JP5174217B2 (ja) * 2010-06-10 2013-04-03 公立大学法人大阪市立大学 易解体性粘着剤組成物及び易解体性粘着テープ
JP2012007047A (ja) * 2010-06-23 2012-01-12 Nitto Denko Corp 再剥離粘着テープおよびその製造方法
GB201413222D0 (en) * 2014-07-25 2014-09-10 Ionex Sg Ltd Treatment of liquid waste
WO2017149981A1 (ja) * 2016-02-29 2017-09-08 株式会社イーテック 粘着剤組成物及び粘着シート
WO2017149982A1 (ja) * 2016-02-29 2017-09-08 株式会社イーテック 粘着剤組成物並びに粘着シート及びその製造方法
JP6661438B2 (ja) * 2016-03-29 2020-03-11 リンテック株式会社 ガラスダイシング用粘着シートおよびその製造方法
JP6703430B2 (ja) * 2016-03-29 2020-06-03 リンテック株式会社 ガラスダイシング用粘着シートおよびその製造方法
JP2017193624A (ja) * 2016-04-20 2017-10-26 Dic株式会社 易解体性粘着テープ、物品及び物品の解体方法
JP6831725B2 (ja) * 2017-03-17 2021-02-17 リンテック株式会社 ワーク加工用粘着シートおよびその製造方法
JP6436199B2 (ja) * 2017-08-21 2018-12-12 日立化成株式会社 ダイシング・ダイボンディング一体型テープの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201307503A (zh) * 2011-06-02 2013-02-16 Dainippon Ink & Chemicals 易解體性黏著劑組成物及易解體性黏著帶
TW201802212A (zh) * 2016-03-29 2018-01-16 琳得科股份有限公司 玻璃切割用黏著板片及其製造方法

Also Published As

Publication number Publication date
TW201940633A (zh) 2019-10-16
WO2019188819A1 (ja) 2019-10-03
CN111742027B (zh) 2022-04-15
CN111742027A (zh) 2020-10-02
KR20200132853A (ko) 2020-11-25
JPWO2019188819A1 (ja) 2021-04-01
KR102644545B1 (ko) 2024-03-08
JP7304847B2 (ja) 2023-07-07

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