TWI781208B - 濕氣硬化型樹脂組成物、電子零件用接著劑及顯示元件用接著劑 - Google Patents

濕氣硬化型樹脂組成物、電子零件用接著劑及顯示元件用接著劑 Download PDF

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TWI781208B
TWI781208B TW107127963A TW107127963A TWI781208B TW I781208 B TWI781208 B TW I781208B TW 107127963 A TW107127963 A TW 107127963A TW 107127963 A TW107127963 A TW 107127963A TW I781208 B TWI781208 B TW I781208B
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Taiwan
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moisture
curable resin
meth
resin composition
acrylate
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TW107127963A
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Chinese (zh)
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TW201920521A (zh
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結城彰
高橋徹
木田拓身
玉川智一
徐坤
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日商積水化學工業股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0041—Optical brightening agents, organic pigments
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/10—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C09J201/10—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW107127963A 2017-08-18 2018-08-10 濕氣硬化型樹脂組成物、電子零件用接著劑及顯示元件用接著劑 TWI781208B (zh)

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JP2017158034 2017-08-18
JPJP2017-158034 2017-08-18

Publications (2)

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TW201920521A TW201920521A (zh) 2019-06-01
TWI781208B true TWI781208B (zh) 2022-10-21

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JP (1) JP7088838B2 (ko)
KR (1) KR102598369B1 (ko)
CN (1) CN110832034B (ko)
TW (1) TWI781208B (ko)
WO (1) WO2019035411A1 (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020188985A1 (ja) * 2019-03-15 2020-09-24 日東電工株式会社 粘着シート、粘着シートの製造方法、中間積層体の製造方法および中間積層体
CN113613894B (zh) * 2019-03-15 2022-12-30 日东电工株式会社 粘合片、粘合片的制造方法、中间层叠体的制造方法以及中间层叠体
WO2020189390A1 (ja) * 2019-03-15 2020-09-24 日東電工株式会社 粘着剤組成物、粘着剤層及び粘着シート
WO2020188986A1 (ja) * 2019-03-15 2020-09-24 日東電工株式会社 粘着シート、粘着シートの製造方法、中間積層体の製造方法および中間積層体
SG11202110096QA (en) * 2019-03-15 2021-10-28 Nitto Denko Corp Pressure-sensitive adhesive composition, pressure-sensitive adhesive layer and pressure-sensitive adhesive sheet
WO2020188984A1 (ja) * 2019-03-15 2020-09-24 日東電工株式会社 粘着剤、中間積層体の製造方法および中間積層体
WO2021054374A1 (ja) * 2019-09-19 2021-03-25 日東電工株式会社 粘着シートおよび粘着シート付き部材の製造方法
WO2021075401A1 (ja) * 2019-10-18 2021-04-22 日東電工株式会社 粘着シートおよび中間積層体
US11960688B2 (en) 2020-07-09 2024-04-16 Hideep Inc. Touch sensor and touch input device comprising same
KR20230066335A (ko) * 2020-09-10 2023-05-15 닛토덴코 가부시키가이샤 적층체, 적층체의 제조 방법, 및 가변색 점착 시트
JP2022046283A (ja) * 2020-09-10 2022-03-23 日東電工株式会社 粘着シート貼付品の製造方法
KR20230064610A (ko) * 2020-09-10 2023-05-10 닛토덴코 가부시키가이샤 가변색 점착 시트
JP2022046282A (ja) * 2020-09-10 2022-03-23 日東電工株式会社 可変色粘着シート
JP7237900B2 (ja) * 2020-09-10 2023-03-13 日東電工株式会社 可変色粘着シート
JP7296931B2 (ja) * 2020-09-10 2023-06-23 日東電工株式会社 可変色粘着シート

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013241578A (ja) * 2012-04-26 2013-12-05 Cemedine Co Ltd 硬化性組成物
JP2016108503A (ja) * 2014-12-09 2016-06-20 協立化学産業株式会社 光硬化性樹脂組成物及び遮光性樹脂層の製造方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4038293A (en) * 1972-07-26 1977-07-26 Minnesota Mining And Manufacturing Company Silicone-compatible tris(trimethylsilyloxy)silylalkylamino-substituted quinoncid dyestuffs
JP3340962B2 (ja) * 1998-06-19 2002-11-05 横浜ゴム株式会社 一液型湿気硬化性ウレタン樹脂組成物
JP5142309B2 (ja) * 2003-12-25 2013-02-13 Ｄｉｃ株式会社 湿気硬化性ポリウレタンホットメルト樹脂組成物
JP4847019B2 (ja) * 2005-01-18 2011-12-28 コニシ株式会社 常温湿気硬化性樹脂組成物及び常温湿気硬化型接着剤
US7597723B2 (en) 2007-02-09 2009-10-06 Milliken & Company Unsubstituted and polymeric triphenymethane colorants for coloring consumer products
JPWO2010058684A1 (ja) * 2008-11-18 2012-04-19 コニカミノルタホールディングス株式会社 表示素子
JP5715380B2 (ja) * 2010-06-30 2015-05-07 富士フイルム株式会社 着色硬化性組成物、カラーフィルタ、その製造方法、固体撮像素子、液晶表示装置、および色素多量体
KR20150017384A (ko) * 2010-12-24 2015-02-16 아사히 가세이 이-매터리얼즈 가부시키가이샤 감광성 수지 조성물
JP2013199027A (ja) * 2012-03-23 2013-10-03 Nippon Paper Industries Co Ltd 感熱記録体
JP2014025021A (ja) 2012-07-30 2014-02-06 Toyo Ink Sc Holdings Co Ltd 光硬化性着色接着剤
KR102352334B1 (ko) * 2013-10-18 2022-01-17 세키스이가가쿠 고교가부시키가이샤 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제
WO2015174371A1 (ja) 2014-05-13 2015-11-19 積水化学工業株式会社 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤
WO2015190499A1 (ja) * 2014-06-11 2015-12-17 積水化学工業株式会社 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤
WO2016051914A1 (ja) * 2014-09-29 2016-04-07 株式会社スリーボンド 光硬化性樹脂組成物
JP6510788B2 (ja) * 2014-10-03 2019-05-08 積水化学工業株式会社 光湿気硬化型樹脂組成物
JP2016074891A (ja) * 2014-10-03 2016-05-12 積水化学工業株式会社 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤
JP2016089174A (ja) * 2014-11-04 2016-05-23 積水化学工業株式会社 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤
CN107108773B (zh) * 2014-11-04 2019-05-17 三键有限公司 光固化性树脂组合物及其固化物、以及固化物的制造方法
JP6751238B2 (ja) 2015-02-09 2020-09-02 株式会社スリーボンド 光硬化性樹脂組成物の硬化方法および硬化物
JP6504346B2 (ja) 2015-02-13 2019-04-24 株式会社スリーボンド 隣接電極間の短絡を抑制する光硬化性樹脂組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013241578A (ja) * 2012-04-26 2013-12-05 Cemedine Co Ltd 硬化性組成物
JP2016108503A (ja) * 2014-12-09 2016-06-20 協立化学産業株式会社 光硬化性樹脂組成物及び遮光性樹脂層の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
網路文獻 冨田 裕子 光着色化技術 three bond technical news 2016 p1-8 *

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CN110832034A (zh) 2020-02-21
JP7088838B2 (ja) 2022-06-21
TW201920521A (zh) 2019-06-01
KR20200042876A (ko) 2020-04-24
WO2019035411A1 (ja) 2019-02-21
KR102598369B1 (ko) 2023-11-03
CN110832034B (zh) 2022-10-18
JPWO2019035411A1 (ja) 2020-07-27

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