TWI721120B - 半導體加工用黏著膠帶、及半導體裝置之製造方法 - Google Patents

半導體加工用黏著膠帶、及半導體裝置之製造方法 Download PDF

Info

Publication number
TWI721120B
TWI721120B TW106107050A TW106107050A TWI721120B TW I721120 B TWI721120 B TW I721120B TW 106107050 A TW106107050 A TW 106107050A TW 106107050 A TW106107050 A TW 106107050A TW I721120 B TWI721120 B TW I721120B
Authority
TW
Taiwan
Prior art keywords
adhesive tape
adhesive
semiconductor wafer
meth
buffer layer
Prior art date
Application number
TW106107050A
Other languages
English (en)
Chinese (zh)
Other versions
TW201741419A (zh
Inventor
富永知親
堀米克彦
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW201741419A publication Critical patent/TW201741419A/zh
Application granted granted Critical
Publication of TWI721120B publication Critical patent/TWI721120B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
TW106107050A 2016-03-03 2017-03-03 半導體加工用黏著膠帶、及半導體裝置之製造方法 TWI721120B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-041261 2016-03-03
JP2016041261 2016-03-03

Publications (2)

Publication Number Publication Date
TW201741419A TW201741419A (zh) 2017-12-01
TWI721120B true TWI721120B (zh) 2021-03-11

Family

ID=59744260

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106107050A TWI721120B (zh) 2016-03-03 2017-03-03 半導體加工用黏著膠帶、及半導體裝置之製造方法

Country Status (5)

Country Link
JP (2) JP7149487B2 (ja)
KR (2) KR102365799B1 (ja)
CN (1) CN108701601B (ja)
TW (1) TWI721120B (ja)
WO (1) WO2017150676A1 (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110240869B (zh) * 2018-03-09 2022-07-29 三菱化学株式会社 活性能量射线固化性剥离型粘合剂组合物和剥离型粘合片
JP2018100423A (ja) * 2018-03-20 2018-06-28 リンテック株式会社 粘着テープおよび半導体装置の製造方法
JP2018115332A (ja) * 2018-03-20 2018-07-26 リンテック株式会社 粘着テープおよび半導体装置の製造方法
JP2018115333A (ja) * 2018-03-20 2018-07-26 リンテック株式会社 粘着テープおよび半導体装置の製造方法
KR20200133209A (ko) * 2018-03-20 2020-11-26 린텍 가부시키가이샤 가공품의 제조 방법 및 점착성 적층체
WO2020003919A1 (ja) * 2018-06-26 2020-01-02 リンテック株式会社 半導体加工用粘着テープおよび半導体装置の製造方法
JP6616558B1 (ja) * 2018-06-26 2019-12-04 リンテック株式会社 半導体加工用粘着テープおよび半導体装置の製造方法
WO2020003920A1 (ja) 2018-06-26 2020-01-02 リンテック株式会社 半導体加工用粘着テープおよび半導体装置の製造方法
KR102630909B1 (ko) * 2018-08-08 2024-01-30 린텍 가부시키가이샤 단자 보호용 테이프 및 전자파 쉴드막을 가지는 반도체 장치의 제조 방법
JPWO2020189568A1 (ja) * 2019-03-15 2020-09-24
KR20210148102A (ko) * 2019-03-28 2021-12-07 린텍 가부시키가이샤 점착 시트, 점착 시트의 제조 방법 및 반도체 장치의 제조 방법
JPWO2020203437A1 (ja) * 2019-03-29 2020-10-08
JPWO2020203438A1 (ja) * 2019-03-29 2020-10-08
JPWO2022097420A1 (ja) * 2020-11-06 2022-05-12
KR102292205B1 (ko) * 2020-11-11 2021-08-23 (주)이녹스첨단소재 웨이퍼 처리용 점착 필름
CN112967928B (zh) * 2020-12-16 2022-07-29 重庆康佳光电技术研究院有限公司 芯片的切割方法及芯片的转移方法
KR102660802B1 (ko) * 2021-08-11 2024-04-26 (주)이녹스첨단소재 웨이퍼 처리용 점착 필름
CN115703950A (zh) * 2021-08-12 2023-02-17 利诺士尖端材料有限公司 晶圆背面研磨用粘结膜
WO2023188272A1 (ja) * 2022-03-31 2023-10-05 リンテック株式会社 半導体加工用粘着テープ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005343997A (ja) * 2004-06-02 2005-12-15 Lintec Corp 半導体加工用粘着シートおよび半導体チップの製造方法
JP2008214386A (ja) * 2007-02-28 2008-09-18 Lintec Corp 粘着シート

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3527800B2 (ja) * 1995-09-19 2004-05-17 日東電工株式会社 粘着テープ
JP2003273042A (ja) * 2002-03-13 2003-09-26 Lintec Corp 半導体装置の製造方法
US7935424B2 (en) * 2006-04-06 2011-05-03 Lintec Corporation Adhesive sheet
JP5491049B2 (ja) * 2009-03-11 2014-05-14 日東電工株式会社 半導体ウエハ保護用基材レス粘着シート、その粘着シートを用いた半導体ウエハ裏面研削方法及びその粘着シートの製造方法
JP2012062345A (ja) * 2010-09-14 2012-03-29 Nitto Denko Corp 光学用粘着シート
KR101363123B1 (ko) * 2012-03-06 2014-02-13 유상길 점착테이프 적층체 및 이를 포함하는 디스펜서
JP5912772B2 (ja) * 2012-03-30 2016-04-27 リンテック株式会社 基材レス両面粘着テープおよびその製造方法、ならびに粘着ロールおよびその製造方法
KR102344987B1 (ko) * 2013-12-24 2021-12-30 닛토덴코 가부시키가이샤 다이싱·다이 본드 필름, 반도체 장치의 제조 방법 및 반도체 장치
JP6378501B2 (ja) * 2014-03-05 2018-08-22 日東電工株式会社 粘着シート
JP6322013B2 (ja) * 2014-03-20 2018-05-09 リンテック株式会社 粘着シート
JP2015185691A (ja) * 2014-03-24 2015-10-22 古河電気工業株式会社 半導体ウェハ加工用粘着テープ、該粘着テープの製造方法および半導体ウェハの加工方法
US10388556B2 (en) * 2014-04-11 2019-08-20 Lintec Corporation Base for back grind tapes, and back grind tape

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005343997A (ja) * 2004-06-02 2005-12-15 Lintec Corp 半導体加工用粘着シートおよび半導体チップの製造方法
JP2008214386A (ja) * 2007-02-28 2008-09-18 Lintec Corp 粘着シート

Also Published As

Publication number Publication date
JP7207778B2 (ja) 2023-01-18
TW201741419A (zh) 2017-12-01
KR20180122610A (ko) 2018-11-13
JPWO2017150676A1 (ja) 2018-12-27
KR102365799B1 (ko) 2022-02-21
JP7149487B2 (ja) 2022-10-07
KR20220025261A (ko) 2022-03-03
CN108701601A (zh) 2018-10-23
WO2017150676A1 (ja) 2017-09-08
KR102543780B1 (ko) 2023-06-14
JP2022009012A (ja) 2022-01-14
CN108701601B (zh) 2023-06-02

Similar Documents

Publication Publication Date Title
TWI721120B (zh) 半導體加工用黏著膠帶、及半導體裝置之製造方法
TWI724116B (zh) 半導體加工用黏著膠帶、以及半導體裝置之製造方法
TWI754674B (zh) 半導體加工用黏著膠帶以及半導體裝置之製造方法
JP6322013B2 (ja) 粘着シート
TWI794450B (zh) 黏著膠帶及半導體裝置的製造方法
TW202016234A (zh) 半導體加工用黏著帶及半導體裝置的製造方法
JP7381448B2 (ja) 粘着テープおよび半導体装置の製造方法
TWI744468B (zh) 半導體加工用黏著帶以及半導體裝置的製造方法
KR102642081B1 (ko) 점착 테이프 및 반도체 장치의 제조 방법
TWI822670B (zh) 背磨膠帶用基材
WO2023188272A1 (ja) 半導体加工用粘着テープ
TW202237779A (zh) 半導體加工用黏著帶及半導體裝置的製造方法