KR102365799B1 - 반도체 가공용 점착 테이프, 및 반도체 장치의 제조 방법 - Google Patents
반도체 가공용 점착 테이프, 및 반도체 장치의 제조 방법 Download PDFInfo
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- KR102365799B1 KR102365799B1 KR1020187023871A KR20187023871A KR102365799B1 KR 102365799 B1 KR102365799 B1 KR 102365799B1 KR 1020187023871 A KR1020187023871 A KR 1020187023871A KR 20187023871 A KR20187023871 A KR 20187023871A KR 102365799 B1 KR102365799 B1 KR 102365799B1
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- South Korea
- Prior art keywords
- adhesive tape
- semiconductor
- meth
- adhesive
- acrylate
- Prior art date
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 211
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 142
- 238000012545 processing Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims description 89
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 239000010410 layer Substances 0.000 claims abstract description 143
- 238000000227 grinding Methods 0.000 claims abstract description 52
- 239000012790 adhesive layer Substances 0.000 claims abstract description 49
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 111
- 239000000203 mixture Substances 0.000 claims description 76
- -1 polyethylene terephthalate Polymers 0.000 claims description 63
- 239000000463 material Substances 0.000 claims description 53
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 43
- 150000001875 compounds Chemical class 0.000 claims description 40
- 230000008569 process Effects 0.000 claims description 33
- 125000000217 alkyl group Chemical group 0.000 claims description 32
- 230000015572 biosynthetic process Effects 0.000 claims description 30
- 239000000178 monomer Substances 0.000 claims description 27
- 125000000524 functional group Chemical group 0.000 claims description 22
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 22
- 239000004925 Acrylic resin Substances 0.000 claims description 13
- 229920000178 Acrylic resin Polymers 0.000 claims description 13
- 125000002723 alicyclic group Chemical group 0.000 claims description 11
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 10
- 238000003860 storage Methods 0.000 claims description 10
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 9
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 9
- 125000000623 heterocyclic group Chemical group 0.000 claims description 8
- 125000006413 ring segment Chemical group 0.000 claims description 8
- 125000006273 (C1-C3) alkyl group Chemical group 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 24
- 235000012431 wafers Nutrition 0.000 description 132
- 230000001070 adhesive effect Effects 0.000 description 38
- 239000000853 adhesive Substances 0.000 description 36
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- 239000000654 additive Substances 0.000 description 11
- 238000011156 evaluation Methods 0.000 description 11
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- 238000000576 coating method Methods 0.000 description 10
- 239000012948 isocyanate Substances 0.000 description 10
- 229920005862 polyol Polymers 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
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- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 7
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 7
- 125000004432 carbon atom Chemical group C* 0.000 description 7
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- 125000004429 atom Chemical group 0.000 description 6
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 6
- 125000003700 epoxy group Chemical group 0.000 description 6
- 230000001678 irradiating effect Effects 0.000 description 6
- 229920000728 polyester Polymers 0.000 description 6
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 125000003277 amino group Chemical group 0.000 description 5
- 230000001588 bifunctional effect Effects 0.000 description 5
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- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 4
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 4
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- 244000028419 Styrax benzoin Species 0.000 description 4
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- 229910052799 carbon Inorganic materials 0.000 description 4
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- 238000006243 chemical reaction Methods 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
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- 125000003118 aryl group Chemical group 0.000 description 3
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 3
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- 150000002009 diols Chemical class 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 3
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 3
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
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- QWUWMCYKGHVNAV-UHFFFAOYSA-N 1,2-dihydrostilbene Chemical group C=1C=CC=CC=1CCC1=CC=CC=C1 QWUWMCYKGHVNAV-UHFFFAOYSA-N 0.000 description 2
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- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 2
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- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
- Laminated Bodies (AREA)
- Paints Or Removers (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020227005038A KR102543780B1 (ko) | 2016-03-03 | 2017-03-02 | 반도체 가공용 점착 테이프, 및 반도체 장치의 제조 방법 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2016041261 | 2016-03-03 | ||
JPJP-P-2016-041261 | 2016-03-03 | ||
PCT/JP2017/008314 WO2017150676A1 (ja) | 2016-03-03 | 2017-03-02 | 半導体加工用粘着テープ、及び半導体装置の製造方法 |
Related Child Applications (1)
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KR1020227005038A Division KR102543780B1 (ko) | 2016-03-03 | 2017-03-02 | 반도체 가공용 점착 테이프, 및 반도체 장치의 제조 방법 |
Publications (2)
Publication Number | Publication Date |
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KR20180122610A KR20180122610A (ko) | 2018-11-13 |
KR102365799B1 true KR102365799B1 (ko) | 2022-02-21 |
Family
ID=59744260
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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KR1020187023871A KR102365799B1 (ko) | 2016-03-03 | 2017-03-02 | 반도체 가공용 점착 테이프, 및 반도체 장치의 제조 방법 |
KR1020227005038A KR102543780B1 (ko) | 2016-03-03 | 2017-03-02 | 반도체 가공용 점착 테이프, 및 반도체 장치의 제조 방법 |
Family Applications After (1)
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KR1020227005038A KR102543780B1 (ko) | 2016-03-03 | 2017-03-02 | 반도체 가공용 점착 테이프, 및 반도체 장치의 제조 방법 |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP7149487B2 (ja) |
KR (2) | KR102365799B1 (ja) |
CN (1) | CN108701601B (ja) |
TW (1) | TWI721120B (ja) |
WO (1) | WO2017150676A1 (ja) |
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CN110240869B (zh) * | 2018-03-09 | 2022-07-29 | 三菱化学株式会社 | 活性能量射线固化性剥离型粘合剂组合物和剥离型粘合片 |
JP2018100423A (ja) * | 2018-03-20 | 2018-06-28 | リンテック株式会社 | 粘着テープおよび半導体装置の製造方法 |
JP2018115332A (ja) * | 2018-03-20 | 2018-07-26 | リンテック株式会社 | 粘着テープおよび半導体装置の製造方法 |
JP2018115333A (ja) * | 2018-03-20 | 2018-07-26 | リンテック株式会社 | 粘着テープおよび半導体装置の製造方法 |
KR20200133209A (ko) * | 2018-03-20 | 2020-11-26 | 린텍 가부시키가이샤 | 가공품의 제조 방법 및 점착성 적층체 |
WO2020003919A1 (ja) * | 2018-06-26 | 2020-01-02 | リンテック株式会社 | 半導体加工用粘着テープおよび半導体装置の製造方法 |
JP6616558B1 (ja) * | 2018-06-26 | 2019-12-04 | リンテック株式会社 | 半導体加工用粘着テープおよび半導体装置の製造方法 |
WO2020003920A1 (ja) | 2018-06-26 | 2020-01-02 | リンテック株式会社 | 半導体加工用粘着テープおよび半導体装置の製造方法 |
KR102630909B1 (ko) * | 2018-08-08 | 2024-01-30 | 린텍 가부시키가이샤 | 단자 보호용 테이프 및 전자파 쉴드막을 가지는 반도체 장치의 제조 방법 |
JPWO2020189568A1 (ja) * | 2019-03-15 | 2020-09-24 | ||
KR20210148102A (ko) * | 2019-03-28 | 2021-12-07 | 린텍 가부시키가이샤 | 점착 시트, 점착 시트의 제조 방법 및 반도체 장치의 제조 방법 |
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CN112967928B (zh) * | 2020-12-16 | 2022-07-29 | 重庆康佳光电技术研究院有限公司 | 芯片的切割方法及芯片的转移方法 |
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CN115703950A (zh) * | 2021-08-12 | 2023-02-17 | 利诺士尖端材料有限公司 | 晶圆背面研磨用粘结膜 |
WO2023188272A1 (ja) * | 2022-03-31 | 2023-10-05 | リンテック株式会社 | 半導体加工用粘着テープ |
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CN108701601A (zh) | 2018-10-23 |
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