TWI720238B - 洗淨裝置及洗淨方法 - Google Patents

洗淨裝置及洗淨方法 Download PDF

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Publication number
TWI720238B
TWI720238B TW106126872A TW106126872A TWI720238B TW I720238 B TWI720238 B TW I720238B TW 106126872 A TW106126872 A TW 106126872A TW 106126872 A TW106126872 A TW 106126872A TW I720238 B TWI720238 B TW I720238B
Authority
TW
Taiwan
Prior art keywords
shaped body
plate
cleaning
nozzle
cleaning device
Prior art date
Application number
TW106126872A
Other languages
English (en)
Chinese (zh)
Other versions
TW201827132A (zh
Inventor
千葉正樹
Original Assignee
日商東京應化工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京應化工業股份有限公司 filed Critical 日商東京應化工業股份有限公司
Publication of TW201827132A publication Critical patent/TW201827132A/zh
Application granted granted Critical
Publication of TWI720238B publication Critical patent/TWI720238B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Liquid Crystal (AREA)
TW106126872A 2016-10-20 2017-08-09 洗淨裝置及洗淨方法 TWI720238B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016206344A JP2018065109A (ja) 2016-10-20 2016-10-20 洗浄装置および洗浄方法
JP2016-206344 2016-10-20

Publications (2)

Publication Number Publication Date
TW201827132A TW201827132A (zh) 2018-08-01
TWI720238B true TWI720238B (zh) 2021-03-01

Family

ID=62081233

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106126872A TWI720238B (zh) 2016-10-20 2017-08-09 洗淨裝置及洗淨方法

Country Status (3)

Country Link
JP (1) JP2018065109A (ja)
KR (1) KR20180043727A (ja)
TW (1) TWI720238B (ja)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW386913B (en) * 1997-08-01 2000-04-11 Tokyo Electron Ltd Apparatus for removing coated film from peripheral portion of substrate
JP2000153209A (ja) * 1998-11-18 2000-06-06 Tokyo Electron Ltd 被処理体の液処理装置及び液処理方法
JP2005268247A (ja) * 2004-03-16 2005-09-29 Dainippon Screen Mfg Co Ltd 基板処理装置
CN101055833A (zh) * 2006-04-12 2007-10-17 东京应化工业株式会社 基板处理装置
JP2008147490A (ja) * 2006-12-12 2008-06-26 Toppan Printing Co Ltd フォトレジスト端面剥離・洗浄装置及び方法
TW201026405A (en) * 2008-10-15 2010-07-16 Dainippon Screen Mfg Apparatus for treating a substrate
CN102194657A (zh) * 2010-03-18 2011-09-21 大日本网屏制造株式会社 基板清洗处理装置
JP2013001593A (ja) * 2011-06-15 2013-01-07 Febacs:Kk 基板処理装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07318878A (ja) * 1994-05-26 1995-12-08 Mitsubishi Electric Corp 液晶表示装置の製法およびその製造装置
JP2004074021A (ja) * 2002-08-19 2004-03-11 Dainippon Screen Mfg Co Ltd 基板処理装置及び基板洗浄ユニット
JP2013045877A (ja) * 2011-08-24 2013-03-04 Tokyo Electron Ltd 基板処理装置
JP2015202997A (ja) * 2014-04-16 2015-11-16 旭硝子株式会社 基板、基板製造システム、剥離装置、基板製造方法および剥離方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW386913B (en) * 1997-08-01 2000-04-11 Tokyo Electron Ltd Apparatus for removing coated film from peripheral portion of substrate
JP2000153209A (ja) * 1998-11-18 2000-06-06 Tokyo Electron Ltd 被処理体の液処理装置及び液処理方法
JP2005268247A (ja) * 2004-03-16 2005-09-29 Dainippon Screen Mfg Co Ltd 基板処理装置
CN101055833A (zh) * 2006-04-12 2007-10-17 东京应化工业株式会社 基板处理装置
JP2008147490A (ja) * 2006-12-12 2008-06-26 Toppan Printing Co Ltd フォトレジスト端面剥離・洗浄装置及び方法
TW201026405A (en) * 2008-10-15 2010-07-16 Dainippon Screen Mfg Apparatus for treating a substrate
CN102194657A (zh) * 2010-03-18 2011-09-21 大日本网屏制造株式会社 基板清洗处理装置
JP2013001593A (ja) * 2011-06-15 2013-01-07 Febacs:Kk 基板処理装置

Also Published As

Publication number Publication date
JP2018065109A (ja) 2018-04-26
KR20180043727A (ko) 2018-04-30
TW201827132A (zh) 2018-08-01

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