TWI702262B - 金屬奈米微粒子製造用組合物 - Google Patents

金屬奈米微粒子製造用組合物 Download PDF

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Publication number
TWI702262B
TWI702262B TW105118451A TW105118451A TWI702262B TW I702262 B TWI702262 B TW I702262B TW 105118451 A TW105118451 A TW 105118451A TW 105118451 A TW105118451 A TW 105118451A TW I702262 B TWI702262 B TW I702262B
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TW
Taiwan
Prior art keywords
composition
metal nanoparticle
metal
oxalate
acid
Prior art date
Application number
TW105118451A
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English (en)
Chinese (zh)
Other versions
TW201710416A (zh
Inventor
川村謙輔
森崇充
Original Assignee
日商大阪曹達股份有限公司
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Publication of TW201710416A publication Critical patent/TW201710416A/zh
Application granted granted Critical
Publication of TWI702262B publication Critical patent/TWI702262B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/07—Metallic powder characterised by particles having a nanoscale microstructure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nanotechnology (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Powder Metallurgy (AREA)
TW105118451A 2015-06-15 2016-06-13 金屬奈米微粒子製造用組合物 TWI702262B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-120304 2015-06-15
JP2015120304 2015-06-15

Publications (2)

Publication Number Publication Date
TW201710416A TW201710416A (zh) 2017-03-16
TWI702262B true TWI702262B (zh) 2020-08-21

Family

ID=57545305

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105118451A TWI702262B (zh) 2015-06-15 2016-06-13 金屬奈米微粒子製造用組合物

Country Status (5)

Country Link
JP (1) JP6673352B2 (ja)
KR (1) KR20180018485A (ja)
CN (1) CN107614164A (ja)
TW (1) TWI702262B (ja)
WO (1) WO2016204105A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018168004A1 (ja) * 2017-03-15 2018-09-20 Dic株式会社 金属微粒子分散体、導電性インク、および電子デバイス
JP2018154806A (ja) * 2017-03-15 2018-10-04 Dic株式会社 金属微粒子分散体、導電性インク、および電子デバイス
JP6939015B2 (ja) * 2017-03-29 2021-09-22 住友金属鉱山株式会社 積層セラミックコンデンサ内部電極用のグラビア印刷用導電性ペースト
JP7257738B2 (ja) * 2017-10-10 2023-04-14 Dic株式会社 オフセット印刷用金属微粒子インク
JP2019108593A (ja) * 2017-12-19 2019-07-04 Dic株式会社 銀微粒子分散体の製造方法
TWI819082B (zh) * 2018-09-03 2023-10-21 日商大阪曹達股份有限公司 銀奈米粒子、導電性接著劑、燒結體、及構件間具備燒結體的裝置
US20240052213A1 (en) * 2021-02-18 2024-02-15 The School Corporation Kansai University Electrically conductive adhesive, sintered body of electrically conductive adhesive, method for producing sintered body, electronic component, and method for producing electronic component

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009270146A (ja) * 2008-05-02 2009-11-19 Shoei Chem Ind Co 銀超微粒子の製造方法
JP2013151753A (ja) * 2013-03-04 2013-08-08 Dowa Electronics Materials Co Ltd 極性媒体との親和性に優れた銀微粉および銀インク
TW201425520A (zh) * 2012-10-12 2014-07-01 Bando Chemical Ind 接合用組成物
TW201637994A (zh) * 2015-04-17 2016-11-01 阪東化學股份有限公司 銀微粒子組成物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009097074A (ja) * 2007-09-27 2009-05-07 Mitsuboshi Belting Ltd 金属ナノ粒子ペーストおよびパターン形成方法
KR101681046B1 (ko) * 2009-11-26 2016-11-30 주식회사 동진쎄미켐 입자를 형성하지 않는 전도성 잉크 조성물 및 이의 제조방법
KR101700615B1 (ko) * 2010-03-30 2017-01-31 주식회사 동진쎄미켐 금속 나노입자의 제조방법, 이에 의해 제조된 금속 나노입자 및 이를 포함하는 금속 잉크 조성물
JP5311147B2 (ja) * 2010-08-25 2013-10-09 株式会社豊田中央研究所 表面被覆金属ナノ粒子、その製造方法、およびそれを含む金属ナノ粒子ペースト
JP2012251222A (ja) * 2011-06-03 2012-12-20 Tokyo Printing Ink Mfg Co Ltd 銀ナノ粒子の製造方法およびインク
JP6140189B2 (ja) * 2012-11-30 2017-05-31 ナミックス株式会社 導電ペースト及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009270146A (ja) * 2008-05-02 2009-11-19 Shoei Chem Ind Co 銀超微粒子の製造方法
TW201425520A (zh) * 2012-10-12 2014-07-01 Bando Chemical Ind 接合用組成物
JP2013151753A (ja) * 2013-03-04 2013-08-08 Dowa Electronics Materials Co Ltd 極性媒体との親和性に優れた銀微粉および銀インク
TW201637994A (zh) * 2015-04-17 2016-11-01 阪東化學股份有限公司 銀微粒子組成物

Also Published As

Publication number Publication date
WO2016204105A1 (ja) 2016-12-22
JP6673352B2 (ja) 2020-03-25
KR20180018485A (ko) 2018-02-21
CN107614164A (zh) 2018-01-19
TW201710416A (zh) 2017-03-16
JPWO2016204105A1 (ja) 2018-03-29

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