TWI701206B - Electronic component manufacturing system - Google Patents

Electronic component manufacturing system Download PDF

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Publication number
TWI701206B
TWI701206B TW107110611A TW107110611A TWI701206B TW I701206 B TWI701206 B TW I701206B TW 107110611 A TW107110611 A TW 107110611A TW 107110611 A TW107110611 A TW 107110611A TW I701206 B TWI701206 B TW I701206B
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TW
Taiwan
Prior art keywords
substrate
processing device
roller
recovery
rail
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TW107110611A
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Chinese (zh)
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TW201827321A (en
Inventor
濱田智秀
木內徹
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日商尼康股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H18/00—Winding webs
    • B65H18/08—Web-winding mechanisms
    • B65H18/10—Mechanisms in which power is applied to web-roll spindle
    • B65H18/103—Reel-to-reel type web winding and unwinding mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
    • B65H23/182—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in unwinding mechanisms or in connection with unwinding operations
    • B65H23/1825—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in unwinding mechanisms or in connection with unwinding operations and controlling web tension
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
    • B65H23/195—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in winding mechanisms or in connection with winding operations
    • B65H23/1955—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in winding mechanisms or in connection with winding operations and controlling web tension
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/50—Auxiliary process performed during handling process
    • B65H2301/51—Modifying a characteristic of handled material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2402/00—Constructional details of the handling apparatus
    • B65H2402/30—Supports; Subassemblies; Mountings thereof
    • B65H2402/32—Sliding support means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/17—Nature of material
    • B65H2701/173—Metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/17—Nature of material
    • B65H2701/175—Plastic
    • B65H2701/1752—Polymer film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2801/00—Application field
    • B65H2801/61—Display device manufacture, e.g. liquid crystal displays

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electroluminescent Light Sources (AREA)
  • Liquid Crystal (AREA)
  • Advancing Webs (AREA)
  • Registering, Tensioning, Guiding Webs, And Rollers Therefor (AREA)

Abstract

A transporting apparatus includes a supply roller which feeds a strip-shaped and flexible substrate, a recovery roller which winds the substrate fed from the supply roller, and a drive member which drives the supply roller and the recovery roller in a crossing direction against a direction the substrate is fed from the supply roller to the recovery roller.

Description

電子元件之製造系統 Electronic component manufacturing system

本發明係關於搬送裝置。 The present invention relates to a conveying device.

本申請係根據2011年2月24日申請之美國臨時申請61/446,150號主張優先權，並將其內容援引於此。 This application claims priority based on U.S. Provisional Application No. 61/446,150 filed on February 24, 2011, and the content is hereby cited.

作為構成顯示器裝置等顯示裝置之顯示元件，例如有液晶顯示元件、有機電致發光(有機EL)元件等。目前，此等顯示元件係以對應各畫素在基板表面形成被稱為薄膜電晶體(Thin Film Transistor：TFT)之主動元件(Active device)漸為主流。 Examples of display elements constituting display devices such as display devices include liquid crystal display elements, organic electroluminescence (organic EL) elements, and the like. At present, for these display elements, active devices called thin film transistors (TFTs) formed on the surface of the substrate corresponding to each pixel have gradually become the mainstream.

近年來，提出了一種在片狀之基板(例如薄膜構件等)上形成顯示元件之技術。作為此種技術，例如有一種被稱為捲軸對捲軸(roll to roll)方式(以下，簡記為「捲軸方式」)之手法廣為人知(例如，參照專利文獻1)。捲軸方式，係將捲繞在基板供應側之供應用滾筒之1片片狀基板(例如，帶狀之薄膜構件)送出且一邊將送出之基板以基板回收側之回收用滾筒加以捲取，一邊藉由設置於供應用滾筒與回收用滾筒間之處理裝置對基板施加所欲加工者。 In recent years, a technique for forming display elements on a sheet-like substrate (such as a thin film member, etc.) has been proposed. As such a technique, for example, a technique called a roll to roll method (hereinafter abbreviated as a "roll method") is widely known (for example, refer to Patent Document 1). The reel method is to send out a sheet of substrate (for example, a tape-shaped film member) wound on the supply roller on the substrate supply side, and wind the delivered substrate with the recovery roller on the substrate recovery side. The processing device provided between the supply roller and the recovery roller applies the desired processing to the substrate.

在基板送出至被捲取為止之期間，例如一邊使用複數個搬送滾筒等搬送基板、一邊使用複數個處理裝置(單元)來形成構成TFT之閘極電極、閘極絕緣膜、半導體膜、源極-汲極電極等，在基板之被處理面上依序形成可撓性顯示器用之顯示元件之構成要件。例如，在形成有機EL元件之情形時，係於基板上依序形成發光層、陽極、陰極、電路等。 During the period from when the substrate is sent out to when it is taken up, for example, while conveying the substrate using a plurality of conveying rollers, etc., a plurality of processing devices (units) are used to form the gate electrode, gate insulating film, semiconductor film, and source of the TFT. -Drain electrodes, etc., which form the constituent elements of display elements for flexible displays in sequence on the processed surface of the substrate. For example, in the case of forming an organic EL element, a light-emitting layer, an anode, a cathode, a circuit, etc. are sequentially formed on a substrate.

專利文獻1：國際公開第2006/100868號 Patent Document 1: International Publication No. 2006/100868

然而，上述構成中，由於從送出至捲取為止被橫掛之基板之尺寸較長，因此基板之管理係困難。 However, in the above configuration, since the size of the substrate to be hung horizontally from the delivery to the winding is relatively long, the management of the substrate is difficult.

本發明之態樣之目的在於提供一種能減低搬送時之基板之管理負擔之搬送裝置。 The object of the aspect of the present invention is to provide a transfer device that can reduce the management burden of substrates during transfer.

根據本發明之態樣，提供一種搬送裝置，其具備：供應滾筒，送出形成為帶狀且具有可撓性之基板；回收滾筒，捲取從前述供應滾筒送出之前述基板；以及驅動部，將供應滾筒與回收滾筒驅動於相對從供應滾筒往回收滾筒之基板之運送方向交叉之方向。 According to an aspect of the present invention, there is provided a conveying device including: a supply roller that sends out a flexible substrate formed in a strip shape; a recovery roller that winds up the substrate sent from the supply roller; and a drive unit The supply roller and the recovery roller are driven in a direction that crosses the conveying direction of the substrate from the supply roller to the recovery roller.

根據本發明之態樣，能減低搬送時之基板之管理負擔。 According to the aspect of the present invention, the management burden of the substrate during transportation can be reduced.

1‧‧‧搬送裝置 1‧‧‧Conveying device

2‧‧‧基台 2‧‧‧Abutment

3‧‧‧第一軌 3‧‧‧Track 1

3A~3D‧‧‧單位軌 3A~3D‧‧‧unit rail

4‧‧‧第二軌 4‧‧‧Second track

4A~4D‧‧‧單位軌 4A~4D‧‧‧unit rail

5b‧‧‧供應滾筒 5b‧‧‧Supply roller

6b‧‧‧回收滾筒 6b‧‧‧Recycling drum

7‧‧‧軌驅動機構(第三驅動部) 7‧‧‧Rail drive mechanism (third drive part)

7r‧‧‧導引軌 7r‧‧‧Guide rail

8‧‧‧滾筒驅動部 8‧‧‧Drum drive unit

9‧‧‧升降機構 9‧‧‧Lifting mechanism

9c‧‧‧致動器 9c‧‧‧Actuator

20A~20D‧‧‧支承台 20A~20D‧‧‧Supporting table

83‧‧‧第一驅動部 83‧‧‧First Drive

84‧‧‧第二驅動部 84‧‧‧Second Drive

100A‧‧‧上部單元 100A‧‧‧Upper unit

100B‧‧‧下部單元 100B‧‧‧Lower unit

CONT‧‧‧控制裝置 CONT‧‧‧Control device

CONT2‧‧‧第二控制裝置 CONT2‧‧‧Second control device

D1‧‧‧第一距離 D1‧‧‧First distance

D2‧‧‧第三距離 D2‧‧‧third distance

PA(PA1、PA2、PA3)‧‧‧處理裝置 PA(PA1, PA2, PA3)‧‧‧Processing device

S‧‧‧基板 S‧‧‧Substrate

Sf‧‧‧基板S之前端 Sf‧‧‧Substrate S front end

Se‧‧‧基板S之後端 Se‧‧‧Back end of substrate S

圖1係顯示本發明之實施形態之搬送裝置整體構成之立體圖。 Fig. 1 is a perspective view showing the overall structure of a conveying device according to an embodiment of the present invention.

圖2係顯示本實施形態之搬送裝置一部分構成之立體圖。 Fig. 2 is a perspective view showing a part of the structure of the conveying device of this embodiment.

圖3係顯示本實施形態之搬送裝置之動作之樣子之俯視圖。 Fig. 3 is a plan view showing the behavior of the conveying device of this embodiment.

圖4係顯示本實施形態之搬送裝置之動作之樣子之圖。 Fig. 4 is a diagram showing the behavior of the conveying device of this embodiment.

圖5係顯示本實施形態之搬送裝置之動作之樣子之圖。 Fig. 5 is a diagram showing the behavior of the conveying device of this embodiment.

圖6係顯示本發明之搬送裝置其他例之俯視圖。 Fig. 6 is a plan view showing another example of the conveying device of the present invention.

圖7係顯示本發明之搬送裝置其他例之前視圖。 Fig. 7 is a front view showing another example of the conveying device of the present invention.

圖8係顯示本發明之搬送裝置其他例之圖。 Fig. 8 is a diagram showing another example of the conveying device of the present invention.

以下，參照圖式說明本發明之實施形態。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

圖1係顯示本實施形態之搬送裝置1之整體構成的立體圖。圖2係顯示從與圖1不同之視點觀看搬送裝置1之一部分構成時之狀態之立體圖。 FIG. 1 is a perspective view showing the overall structure of the conveying device 1 of this embodiment. FIG. 2 is a perspective view showing the state when a part of the structure of the conveying device 1 is viewed from a different viewpoint from FIG. 1.

如圖1及圖2所示，搬送裝置1係搬送形成為帶狀且具有可撓性之基板S之裝置，設於例如製造工廠之地面FL。搬送裝置1具有基台(基座)ST、第一軌3、第二軌4、基板送出機構5、基板捲取機構6、作為第三驅動部之軌驅動機構7、滾筒驅動部8及控制裝置CONT。 As shown in FIGS. 1 and 2, the conveying device 1 is a device for conveying a substrate S formed in a strip shape and having flexibility, and is installed on the floor FL of a manufacturing plant, for example. The conveying device 1 has a base (base) ST, a first rail 3, a second rail 4, a substrate delivery mechanism 5, a substrate winding mechanism 6, a rail drive mechanism 7 as a third drive unit, a roller drive unit 8 and a control Device CONT.

搬送裝置1，係對形成為帶狀且具有可撓性之基板S之表面執行各種處理之捲軸對捲軸方式(以下，簡記為「捲軸方式」)之裝置。此種捲軸方式之系統，可使用於在基板S上形成例如有機EL元件、液晶顯示元件等顯示元件(電子元件)之情形。當然，在形成此等元件以外之元件(例如太陽能單元、彩色濾光器、觸控面板等)之系統使用搬送裝置1亦可。 The conveying device 1 is a device of a reel-to-reel method (hereinafter, abbreviated as "reel method") that performs various treatments on the surface of a substrate S formed in a strip shape and has flexibility. This type of reel system can be used in the case of forming display elements (electronic elements) such as organic EL elements and liquid crystal display elements on the substrate S. Of course, the conveying device 1 may also be used in a system that forms components other than these components (for example, solar cells, color filters, touch panels, etc.).

以下，在說明本實施形態之搬送裝置1構成時，設定XYZ正交座標系統，一邊參照此XYZ正交座標系統一邊說明各構件之位置關係。以下圖中，設XYZ正交座標系統中與地面FL平行之平面為XY平面。設XY平面中基板S藉由捲軸方式移動之方向(長邊方向)為Y方向，與Y方向正交之方向為X方向。又，設與地面FL(XY平面)垂直之方向為Z軸方向。 Hereinafter, when describing the structure of the conveying device 1 of the present embodiment, an XYZ orthogonal coordinate system is set, and the positional relationship of each member is explained while referring to this XYZ orthogonal coordinate system. In the following figure, let the plane parallel to the ground FL in the XYZ orthogonal coordinate system be the XY plane. It is assumed that the direction in which the substrate S moves by the reel method (the longitudinal direction) in the XY plane is the Y direction, and the direction orthogonal to the Y direction is the X direction. Also, let the direction perpendicular to the ground FL (XY plane) be the Z-axis direction.

作為在基板處理裝置PA成為處理對象之基板S，可使用例如樹脂膜或不鏽鋼等之箔(foil)。樹脂膜可使用例如聚乙烯樹脂、聚丙烯樹脂、聚酯樹脂、乙烯乙烯基共聚物(Ethylene vinyl copolymer)樹脂、聚氯乙烯基樹脂、纖維素樹脂、聚醯胺樹脂、聚醯亞胺樹脂、聚碳酸酯樹脂、聚苯乙烯樹脂、乙酸乙烯基樹脂、聚對苯二甲酸乙二酯、聚二甲酸乙二醇酯、不鏽箔等材料。 As the substrate S to be processed by the substrate processing apparatus PA, for example, a resin film or a stainless steel foil can be used. The resin film can use, for example, polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer (Ethylene vinyl copolymer) resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, Polycarbonate resin, polystyrene resin, vinyl acetate resin, polyethylene terephthalate, polyethylene dicarboxylate, stainless foil and other materials.

基板S之短邊方向之尺寸係形成為例如50cm~2m程度、長邊方 向之尺寸(1捲量之尺寸)則形成為例如10m以上。當然，此尺寸僅為一例，並不限於此例。例如基板S之短邊方向之尺寸為1m以下或50cm以下亦可、亦可為2m以上。本實施形態中，亦可使用短邊方向之尺寸超過2m之基板S。又，基板S之長邊方向之尺寸亦可在10m以下。 The size of the substrate S in the short-side direction is, for example, about 50 cm to 2 m, and the size in the long-side direction (the size of one roll) is, for example, 10 m or more. Of course, this size is only an example and is not limited to this example. For example, the size of the short side direction of the substrate S may be 1 m or less or 50 cm or less, or may be 2 m or more. In this embodiment, it is also possible to use a substrate S whose size in the short-side direction exceeds 2 m. Moreover, the dimension of the longitudinal direction of the board|substrate S may be 10m or less.

基板S係形成為例如具有1mm以下之厚度且具有可撓性。此處，所謂可撓性，係指例如對基板施加至少自重程度之既定力亦不會斷裂或破裂、而能將該基板加以彎折之性質。此外，例如因上述既定力而彎折之性質亦包含於可撓性。又，上述可撓性會隨著該基板材質、大小、厚度、或温度、濕度等之環境等而改變。此外，基板S可使用一片帶狀之基板、亦可使用將複數個單位基板加以連接而形成為帶狀之構成。 The substrate S is formed to have a thickness of 1 mm or less and flexibility, for example. Here, the term “flexibility” refers to, for example, the property that a predetermined force of at least its own weight is applied to the substrate, and the substrate can be bent without breaking or breaking. In addition, for example, the property of bending due to the aforementioned predetermined force is also included in flexibility. In addition, the above-mentioned flexibility may vary with the substrate material, size, thickness, or environment such as temperature and humidity. In addition, as the substrate S, a single strip-shaped substrate may be used, or a structure in which a plurality of unit substrates are connected to form a strip shape may be used.

基板S，以承受較高溫(例如200℃程度)之熱其尺寸亦實質上無變化(熱變形小)之熱膨脹係數較小者較佳。例如可將無機填料混於樹脂膜以降低熱膨脹係數。作為無機填料，例如有氧化鈦、氧化鋅、氧化鋁、氧化矽等。 The substrate S can withstand higher temperature (for example, about 200° C.) and its size is also substantially unchanged (small thermal deformation) and the thermal expansion coefficient is preferably smaller. For example, an inorganic filler can be mixed in the resin film to reduce the thermal expansion coefficient. Examples of inorganic fillers include titanium oxide, zinc oxide, aluminum oxide, and silicon oxide.

基台2具有底座部2a、腳部2b及支承台2c。底座部2a載置於地面FL。腳部2b於底座部2a上設有複數個，支承支承台2c。支承台2c形成為例如矩形，於X方向設有安裝處理裝置PA之開口部與設成夾著該開口部之3個開口部2d。亦即，於支承台2c沿X方向設有3個開口部2d。於3個開口部2d內設有與Y軸方向平行延伸之導引軌7r。導引軌7r係於各開口部2d在X方向平行並列設有2個。 The base 2 has a base part 2a, a leg part 2b, and a support stand 2c. The base portion 2a is placed on the ground FL. The leg portion 2b is provided with a plurality of legs on the base portion 2a, and supports the support stand 2c. The support stand 2c is formed in, for example, a rectangular shape, and is provided with an opening for attaching the processing device PA in the X direction and three openings 2d provided to sandwich the opening. That is, three openings 2d are provided in the support table 2c along the X direction. Guide rails 7r extending parallel to the Y-axis direction are provided in the three openings 2d. Two guide rails 7r are arranged in parallel in the X direction in each opening 2d.

第一軌3沿支承台2c之+Y側之邊配置。第一軌3分割成3個單位軌3A~3C。各單位軌3A~3C配置於與支承台2c之3個開口部2d分別對應之位置。單位軌3A~3C之X方向尺寸為與各開口部2d之X方向尺寸對應之值。 The first rail 3 is arranged along the +Y side of the support platform 2c. The first track 3 is divided into three unit tracks 3A~3C. The unit rails 3A to 3C are arranged at positions corresponding to the three openings 2d of the support stand 2c. The X-direction dimension of the unit rails 3A to 3C is a value corresponding to the X-direction dimension of each opening 2d.

第二軌4沿支承台2c之-Y側之邊配置。第2軌4分割成3個單位軌4A~4C。各單位軌4A~4C與上述單位軌3A~3C同樣地配置於與支承台2c之3 個開口部2d分別對應之位置。單位軌4A~4C之X方向尺寸為與各開口部2d之X方向尺寸對應之值，為與上述單位軌3A~3C之X方向尺寸相同之尺寸。 The second rail 4 is arranged along the side of the -Y side of the support table 2c. The second track 4 is divided into 3 unit tracks 4A~4C. The respective unit rails 4A to 4C are arranged at positions corresponding to the three openings 2d of the support stand 2c similarly to the above-mentioned unit rails 3A to 3C. The X-direction dimensions of the unit rails 4A to 4C are values corresponding to the X-direction dimensions of each opening 2d, and are the same dimensions as the X-direction dimensions of the above-mentioned unit rails 3A to 3C.

第一軌3之單位軌3A~3C及第二軌4之單位軌4A~4C設於各開口部2d，且分別被延伸於Y方向之導引軌7r支承。圖1所示之構成中，單位軌3A~3C被導引軌7r之+Y側端部支承，單位軌4A~4C被導引軌7r之-Y側端部支承。 The unit rails 3A to 3C of the first rail 3 and the unit rails 4A to 4C of the second rail 4 are provided in each opening 2d, and are respectively supported by guide rails 7r extending in the Y direction. In the configuration shown in Fig. 1, the unit rails 3A to 3C are supported by the +Y side end of the guide rail 7r, and the unit rails 4A to 4C are supported by the -Y side end of the guide rail 7r.

第一軌3之單位軌3A~3C與第二軌4之單位軌4A~4C分別與X軸方向平行配置。又，由於導引軌7r與Y軸方向平行延伸，因此單位軌3A~3C及單位軌4A~4C設成能一邊維持彼此平行之狀態一邊在導引軌7r上移動於Y方向。如此，第一軌3及第二軌4為能藉由導引軌7r在與XY平面平行之平面上直線狀移動之構成。 The unit rails 3A to 3C of the first rail 3 and the unit rails 4A to 4C of the second rail 4 are respectively arranged in parallel to the X-axis direction. In addition, since the guide rail 7r extends in parallel to the Y-axis direction, the unit rails 3A to 3C and the unit rails 4A to 4C are set to be able to move in the Y direction on the guide rail 7r while maintaining a state of being parallel to each other. In this way, the first rail 3 and the second rail 4 are configured to be linearly movable on a plane parallel to the XY plane by the guide rail 7r.

基板送出機構5配置於第一軌3上。基板送出機構5具有滾筒支承部5a及供應滾筒5b。滾筒支承部5a連接於第一軌3上，設成能沿第一軌3移動(導引)於X方向。滾筒支承部5a能移動於構成第一軌3之單位軌3A~3C。 The substrate delivery mechanism 5 is arranged on the first rail 3. The board|substrate delivery mechanism 5 has the roller support part 5a and the supply roller 5b. The roller support portion 5a is connected to the first rail 3 and is configured to be movable (guided) in the X direction along the first rail 3. The roller support part 5a can move to the unit rail 3A-3C which comprises the 1st rail 3.

供應滾筒5b被滾筒支承部5a能旋轉地支承。供應滾筒5b被支承成旋轉軸之方向一致於與X方向平行之方向。於供應滾筒5b捲纏基板S成捲軸狀。藉由供應滾筒5b旋轉，捲纏於前述供應滾筒5b之基板S被往-Y方向送出。供應滾筒5b能藉由馬達等而旋轉。 The supply roller 5b is rotatably supported by the roller support part 5a. The supply roller 5b is supported so that the direction of the rotation axis coincides with the direction parallel to the X direction. The substrate S is wound around the supply roller 5b into a reel shape. As the supply roller 5b rotates, the substrate S wound around the supply roller 5b is sent out in the -Y direction. The supply roller 5b can be rotated by a motor or the like.

基板捲取機構6配置於第二軌4上。基板捲取機構6具有滾筒支承部6a及回收滾筒6b。滾筒支承部6a連接於第二軌4上，設成能沿第二軌4移動(導引)於X方向。滾筒支承部6a能移動於構成第二軌4之單位軌4A~4C。 The substrate winding mechanism 6 is arranged on the second rail 4. The substrate winding mechanism 6 has a roller support portion 6a and a recovery roller 6b. The roller supporting portion 6a is connected to the second rail 4 and is configured to be movable (guided) in the X direction along the second rail 4. The roller support portion 6a can move on the unit rails 4A to 4C constituting the second rail 4.

回收滾筒6b被滾筒支承部6a能旋轉地支承。回收滾筒6b被支承成旋轉軸之方向一致於與X方向平行之方向。於回收滾筒6b捲纏基板S成捲軸狀。藉由回收滾筒6b旋轉，將基板S捲纏於此回收滾筒6b。回收滾筒6b能藉由 馬達等而旋轉。 The recovery roller 6b is rotatably supported by the roller support portion 6a. The recovery roller 6b is supported so that the direction of the rotation axis coincides with the direction parallel to the X direction. The substrate S is wound around the recovery roller 6b into a reel shape. By rotating the recovery roller 6b, the substrate S is wound around this recovery roller 6b. The recovery roller 6b can be rotated by a motor or the like.

軌驅動機構7係沿導引軌7r使第一軌3及第二軌4移動於Y方向。軌驅動機構7能將第一軌3依單位軌3A~3C驅動，且將第二軌4依單位軌4A~4C驅動。控制裝置CONT能控制軌驅動機構7之驅動量、驅動速度及驅動之時點等。軌驅動機構7能沿導引軌7r使單位軌3A與單位軌4A彼此接近或彼此分離。又，軌驅動機構7能沿導引軌7r使單位軌3B與單位軌4B彼此接近或彼此分離。又，軌驅動機構7能沿導引軌7r使單位軌3C與單位軌4C彼此接近或彼此分離。 The rail drive mechanism 7 moves the first rail 3 and the second rail 4 in the Y direction along the guide rail 7r. The rail driving mechanism 7 can drive the first rail 3 according to the unit rails 3A~3C, and drive the second rail 4 according to the unit rails 4A~4C. The control device CONT can control the driving amount, driving speed, and driving timing of the rail driving mechanism 7. The rail drive mechanism 7 can make the unit rail 3A and the unit rail 4A approach or separate from each other along the guide rail 7r. Furthermore, the rail drive mechanism 7 can make the unit rail 3B and the unit rail 4B close to or separate from each other along the guide rail 7r. In addition, the rail drive mechanism 7 can make the unit rail 3C and the unit rail 4C approach or separate from each other along the guide rail 7r.

滾筒驅動部8具有第一驅動部83及第二驅動部84。第一驅動部83係使滾筒支承部5a沿第一軌3移動於X方向且使供應滾筒5b旋轉。第二驅動部84係使滾筒支承部6a沿第二軌4移動於X方向且使回收滾筒6b旋轉。控制裝置CONT能將第一驅動部83及第二驅動部84個別或同步控制。又，控制裝置CONT能控制第一驅動部83及第二驅動部84之驅動量、驅動速度及驅動之時點等。 The drum drive unit 8 has a first drive unit 83 and a second drive unit 84. The first driving portion 83 moves the roller support portion 5a along the first rail 3 in the X direction and rotates the supply roller 5b. The second driving portion 84 moves the roller support portion 6a along the second rail 4 in the X direction and rotates the recovery roller 6b. The control device CONT can control the first drive unit 83 and the second drive unit 84 individually or synchronously. In addition, the control device CONT can control the driving amount, driving speed, and driving timing of the first driving unit 83 and the second driving unit 84.

其次，參照圖3等說明如上述構成之搬送裝置1之動作。圖3係顯示搬送裝置1之動作之俯視圖。 Next, the operation of the conveying device 1 constructed as described above will be described with reference to FIG. 3 and the like. FIG. 3 is a plan view showing the operation of the conveying device 1.

首先，說明進行於供應滾筒5b與回收滾筒6b間橫掛基板S之動作之情形。 First, a description will be given of a case where the operation of hanging the substrate S horizontally between the supply roller 5b and the recovery roller 6b is performed.

此情形下，控制裝置CONT係使基板送出機構5配置於第一軌3之單位軌3A上，使基板捲取機構6配置於第二軌4之單位軌4A上。藉由此動作，配置成供應滾筒5b與回收滾筒6b於Y方向對向且平行。 In this case, the control device CONT configures the substrate delivery mechanism 5 on the unit rail 3A of the first rail 3 and the substrate winding mechanism 6 on the unit rail 4A of the second rail 4. By this action, the supply roller 5b and the recovery roller 6b are arranged to face each other in the Y direction and are parallel.

其次，於供應滾筒5b安裝捲成捲軸狀之基板S。於基板S之前端Sf雖安裝有例如圖3所示構成之導頭Lf，但亦可係省略此導頭Lf之構成。於供應滾筒5b安裝捲軸狀之基板S後，控制裝置CONT使第二軌4之單位軌4A往+Y方向移動。藉由此動作，供應滾筒5b與回收滾筒6b彼此接近。 Next, the substrate S wound into a reel shape is mounted on the supply roller 5b. Although the leader Lf of the structure shown in FIG. 3 is mounted on the front end Sf of the substrate S, the structure of the leader Lf may be omitted. After mounting the reel-shaped substrate S on the supply roller 5b, the control device CONT moves the unit rail 4A of the second rail 4 in the +Y direction. With this action, the supply roller 5b and the recovery roller 6b approach each other.

控制裝置CONT，在供應滾筒5b與回收滾筒6b之距離成為第一距離D1之情形下，藉由第一驅動部83使供應滾筒5b旋轉。藉由此動作，基板S之前端Sf往回收滾筒6b側送出，基板S之前端Sf到達回收滾筒6b而捲掛於此回收滾筒6b。此外，將基板S之前端Sf捲掛於回收滾筒6b之操作雖亦可自動化，但亦可藉由人手使用固定帶等將前端Sf貼附於回收滾筒6b。 The control device CONT rotates the supply roller 5b by the first drive part 83 when the distance between the supply roller 5b and the recovery roller 6b becomes the first distance D1. By this operation, the front end Sf of the substrate S is sent to the recovery roller 6b side, and the front end Sf of the substrate S reaches the recovery roller 6b and is wound around the recovery roller 6b. In addition, although the operation of winding the front end Sf of the substrate S on the recovery roller 6b can be automated, it is also possible to attach the front end Sf to the recovery roller 6b by hand using a fixing tape or the like.

控制裝置CONT在基板S之前端Sf掛於回收滾筒6b後，使供應滾筒5b旋轉，且使單位軌4A往-Y方向移動至供應滾筒5b與回收滾筒6b之距離成為第二距離(基板捲取機構6到達原本位置之距離)為止。藉由此動作，基板S之前端Sf在掛於回收滾筒6b之狀態下往-Y方向拉出。 The control device CONT hooks the front end Sf of the substrate S on the recovery roller 6b, rotates the supply roller 5b, and moves the unit rail 4A in the -Y direction until the distance between the supply roller 5b and the recovery roller 6b becomes the second distance (substrate winding The mechanism 6 reaches the original position). With this action, the front end Sf of the substrate S is pulled out in the -Y direction while being hung on the recovery roller 6b.

基板捲取機構6到達原本位置後，控制裝置CONT即使此基板捲取機構6之移動停止。其後，控制裝置CONT如圖4所示，藉由第一驅動部83及第二驅動部84使基板送出機構5及基板捲取機構6同步分別往單位軌3B上及單位軌4B上移動。此外，在此動作前係於單位軌3B與單位軌4B間配置處理裝置PA。此時，係將基板送出機構5與基板捲取機構6控制成供應滾筒5b與回收滾筒6b間橫掛之基板S被賦予於Y方向之適度張力而平坦地伸張。 After the substrate winding mechanism 6 reaches the original position, the control device CONT even stops the movement of the substrate winding mechanism 6. After that, as shown in FIG. 4, the control device CONT uses the first drive portion 83 and the second drive portion 84 to synchronize the substrate sending mechanism 5 and the substrate winding mechanism 6 to the unit rail 3B and the unit rail 4B, respectively. In addition, the processing device PA is arranged between the unit rail 3B and the unit rail 4B before this operation. At this time, the substrate sending mechanism 5 and the substrate winding mechanism 6 are controlled so that the substrate S hanging horizontally between the supply roller 5b and the recovery roller 6b is given a moderate tension in the Y direction and stretches flatly.

此處理裝置PA具有用以對基板S之被處理面Sa形成例如有機EL元件之各種處理部。作為此種處理部可舉出例如用以在被處理面Sa上形成分隔壁之分隔壁形成裝置、用以形成用以驅動有機EL元件之電極之電極形成裝置、用以形成發光層之發光層形成裝置等。 The processing apparatus PA has various processing parts for forming, for example, organic EL elements on the processed surface Sa of the substrate S. Examples of such a processing section include a partition wall forming device for forming a partition wall on the processed surface Sa, an electrode forming device for forming electrodes for driving organic EL elements, and a light emitting layer for forming a light emitting layer. Forming devices, etc.

更具體而言，可舉出例如液滴塗布裝置(例如噴墨型塗布裝置、噴塗型塗布裝置、凹版印刷機等)、蒸鍍裝置、濺鍍裝置等成膜裝置、曝光裝置、顯影裝置、表面改質裝置、洗淨裝置等。作為處理裝置PA不限於用以形成有機EL元件之處理部，當然亦可配置具有形成其他元件之處理部之處理裝置。 More specifically, for example, droplet coating devices (for example, inkjet coating devices, spray coating devices, gravure printers, etc.), deposition devices, sputtering devices, and other film forming devices, exposure devices, developing devices, Surface modification device, cleaning device, etc. The processing device PA is not limited to the processing part for forming the organic EL element, of course, a processing device having a processing part for forming other elements can also be configured.

控制裝置CONT，在使基板送出機構5及基板捲取機構6分別配 置於單位軌3B及4B上後，配合處理裝置PA之處理時點使供應滾筒5b及回收滾筒6b旋轉。藉由此動作，成為從供應滾筒5b如箭頭K2所示送出基板S並以回收滾筒6b捲取基板S之狀態，在此狀態下處理裝置PA之處理對基板S之被處理面Sa進行。 The control device CONT disposes the substrate delivery mechanism 5 and the substrate winding mechanism 6 on the unit rails 3B and 4B, respectively, and rotates the supply roller 5b and the recovery roller 6b in accordance with the processing timing of the processing device PA. With this operation, the substrate S is sent out from the supply roller 5b as shown by the arrow K2 and the substrate S is wound up by the recovery roller 6b. In this state, the processing by the processing device PA is performed on the processed surface Sa of the substrate S.

控制裝置CONT依照處理裝置PA之處理速度調整從供應滾筒5b往回收滾筒6b移動之基板S之移動速度。例如依照捲於供應滾筒5b之基板S之捲繞徑R1與捲於回收滾筒6b之基板S之捲繞徑R2調整第一驅動部83及第二驅動部84之驅動速度。藉由此動作，在搬送速度為一定之狀態下搬送基板S。 The control device CONT adjusts the moving speed of the substrate S moving from the supply roller 5b to the recovery roller 6b in accordance with the processing speed of the processing device PA. For example, the driving speeds of the first driving part 83 and the second driving part 84 are adjusted according to the winding diameter R1 of the substrate S wound on the supply drum 5b and the winding diameter R2 of the substrate S wound on the recovery drum 6b. With this operation, the substrate S is conveyed under a constant conveying speed.

控制裝置CONT亦可依照處理裝置PA之處理位置或Y方向尺寸等調整供應滾筒5b與回收滾筒6b之距離。此情形下，控制裝置CONT係藉由軌驅動機構7使例如單位軌3B或單位軌4B分別移動於Y方向。藉由處理裝置PA將顯示元件之構成要件一部分或全部依序形成於基板S上。 The control device CONT can also adjust the distance between the supply roller 5b and the recovery roller 6b according to the processing position of the processing device PA or the size in the Y direction. In this case, the control device CONT uses the rail drive mechanism 7 to move, for example, the unit rail 3B or the unit rail 4B in the Y direction, respectively. A part or all of the constituent elements of the display element are sequentially formed on the substrate S by the processing device PA.

對基板S之處理結束後，控制裝置CONT藉由第一驅動部83及第二驅動部84使基板送出機構5及基板捲取機構6同步，分別往單位軌3C上及單位軌4C上移動。如圖5所示，基板送出機構5及基板捲取機構6配置於單位軌3C上及單位軌4C上後，使基板送出機構5及基板捲取機構6之移動停止。此時，橫掛於供應滾筒5b與回收滾筒6b間之基板S最好係無彎曲地水平伸張。 After the processing of the substrate S is completed, the control device CONT synchronizes the substrate delivery mechanism 5 and the substrate winding mechanism 6 through the first driving part 83 and the second driving part 84 to move on the unit rail 3C and the unit rail 4C, respectively. As shown in FIG. 5, after the substrate delivery mechanism 5 and the substrate winding mechanism 6 are arranged on the unit rail 3C and the unit rail 4C, the movement of the substrate delivery mechanism 5 and the substrate winding mechanism 6 is stopped. At this time, it is preferable that the substrate S hanging horizontally between the supply roller 5b and the recovery roller 6b is stretched horizontally without bending.

控制裝置CONT，在使基板送出機構5及基板捲取機構6之移動停止後，一邊使回收滾筒6b旋轉一邊使單位軌4C往+Y方向移動。藉由此動作，回收滾筒6b捲取基板S之同時，供應滾筒5b與回收滾筒6b再度接近。 The control device CONT, after stopping the movement of the substrate delivery mechanism 5 and the substrate winding mechanism 6, moves the unit rail 4C in the +Y direction while rotating the recovery roller 6b. With this operation, while the recovery roller 6b winds up the substrate S, the supply roller 5b and the recovery roller 6b approach again.

控制裝置CONT在供應滾筒5b與回收滾筒6b之距離成為第三距離D2後，如圖5所示，藉由第一驅動部83使供應滾筒5b旋轉。此情形下，能使第三距離D2例如與上述之第一距離D1為相等之距離。藉由此動作，基板S之後端Se往回收滾筒6b側送出，基板S之後端Se到達回收滾筒6b而捲掛於此回收滾 筒6b。此外，於基板S之後端Se，雖在例如圖5所示構成中安裝有導頭Le，但亦可係省略此導頭Le之構成。 After the distance between the supply roller 5b and the recovery roller 6b becomes the third distance D2, the control device CONT rotates the supply roller 5b by the first drive unit 83 as shown in FIG. 5. In this case, the third distance D2 can be made equal to the aforementioned first distance D1, for example. By this operation, the rear end Se of the substrate S is sent to the recovery roller 6b side, and the rear end Se of the substrate S reaches the recovery roller 6b and is wound on the recovery roller 6b. In addition, although the leader Le is attached to the rear end Se of the substrate S in the configuration shown in FIG. 5, the configuration of the leader Le may be omitted.

控制裝置CONT在基板S之後端Se掛於回收滾筒6b後，使單位軌4C往-Y方向移動至供應滾筒5b與回收滾筒6b之距離成為第二距離(基板捲取機構6到達原本位置之距離)。基板捲取機構6到達原本位置後，捲於回收滾筒6b之捲軸狀之基板S往次一處理裝置移動。或著，已對基板S進行所有處理時，可從前述回收滾筒6b卸除並回收。 The control device CONT is hung on the recovery roller 6b at the rear end Se of the substrate S, and moves the unit rail 4C in the -Y direction until the distance between the supply roller 5b and the recovery roller 6b becomes the second distance (the distance between the substrate winding mechanism 6 and the original position ). After the substrate winding mechanism 6 reaches the original position, the reel-shaped substrate S wound on the recovery roller 6b moves to the next processing device. Alternatively, when all the processing has been performed on the substrate S, it can be removed from the aforementioned recovery roller 6b and recovered.

如以上所述，根據本實施形態，由於於基台2設有第一軌3及第二軌4，於第一軌3設有能在前述第一軌3上移動之供應滾筒5b，於第二軌4設有能在前述第二軌4上移動之回收滾筒6b，第一軌3及第二軌4能藉由軌驅動機構7(第三驅動部)驅動，因此能在供應滾筒5b與回收滾筒6b之間將基板S不占空間地搬送。藉此，由於能抑制送出至被捲取為止橫掛之基板S之尺寸變長，因此能減低搬送時之基板S之管理負擔。 As described above, according to this embodiment, since the base 2 is provided with the first rail 3 and the second rail 4, the first rail 3 is provided with the supply roller 5b that can move on the first rail 3, and the The second rail 4 is provided with a recovery roller 6b that can move on the aforementioned second rail 4. The first rail 3 and the second rail 4 can be driven by the rail drive mechanism 7 (third drive unit), so the supply roller 5b can be The substrate S is transported between the collection rollers 6b without occupying a space. Thereby, since the size of the substrate S that is hung horizontally from being sent out to be wound can be suppressed from increasing, the management burden of the substrate S during transportation can be reduced.

本發明之技術範圍並不限於上述實施形態，在不脫離本發明之趣旨之範圍內可施加適當變更。 The technical scope of the present invention is not limited to the above-mentioned embodiment, and appropriate changes can be made without departing from the scope of the present invention.

上述實施形態中，雖舉第一軌3及第二軌4往與XY平面平行之方向移動之構成為例進行了說明，但並不限於此。例如，亦可係第一軌3及第二軌4能移動於Z方向之構成。 In the above-mentioned embodiment, although the configuration in which the first rail 3 and the second rail 4 move in the direction parallel to the XY plane has been described as an example, it is not limited to this. For example, it may also be a structure in which the first rail 3 and the second rail 4 can move in the Z direction.

圖6係顯示搬送裝置1之其他例之俯視圖，圖7係顯示圖6之搬送裝置1之例之側視圖。 6 is a plan view showing another example of the conveying device 1, and FIG. 7 is a side view showing an example of the conveying device 1 of FIG. 6.

如圖6及圖7所示，相當於搬送裝置1之基台2之構成在本例中為具有4個支承台20A~20D之構成。於支承台20A配置有單位軌3A及4A。於單位軌3A與單位軌4A之間連接有第一處理裝置PA1。 As shown in FIG. 6 and FIG. 7, the structure corresponding to the base 2 of the conveying apparatus 1 is a structure which has 4 support tables 20A-20D in this example. Unit rails 3A and 4A are arranged on the support table 20A. A first processing device PA1 is connected between the unit rail 3A and the unit rail 4A.

於支承台20B配置有單位軌3B及單位軌4B。支承台20B與支承 台20A、支承台20C及支承台20D分離。支承台20B設成能藉由升降機構9單獨移動於Z方向。升降機構9具有支承柱9a、導引柱9b及致動器9c。藉由致動器9c之驅動，支承台20B在被支撐於支承柱9a之狀態下沿導引柱9b移動於Z方向。致動器9c之驅動量、驅動速度及驅動之時點例如能藉由第二控制裝置CONT2控制。此外，亦可在控制裝置CONT一起進行。 The unit rail 3B and the unit rail 4B are arranged on the support stand 20B. The supporting table 20B is separated from the supporting table 20A, the supporting table 20C, and the supporting table 20D. The support stand 20B is provided so that it can be moved in the Z direction by the elevating mechanism 9 alone. The lifting mechanism 9 has a support column 9a, a guide column 9b, and an actuator 9c. Driven by the actuator 9c, the support table 20B moves in the Z direction along the guide column 9b while being supported by the support column 9a. The driving amount, driving speed, and driving timing of the actuator 9c can be controlled by, for example, the second control device CONT2. In addition, it can also be performed together in the control device CONT.

支承台20C及支承台20D排列配置於Z方向。支承台20C設於+Z側，支承台20D設於-Z側。於支承台20C設有單位軌3C及4C。於此單位軌3C與單位軌4C之間能連接第二處理裝置PA2。在第二處理裝置PA2進行例如第一處理裝置PA1之後製程處理。 The support stand 20C and the support stand 20D are arranged side by side in the Z direction. The support stand 20C is provided on the +Z side, and the support stand 20D is provided on the -Z side. Unit rails 3C and 4C are provided on the support table 20C. The second processing device PA2 can be connected between the unit rail 3C and the unit rail 4C. The second processing device PA2 performs, for example, the first processing device PA1 and subsequent process processing.

於支承台20D設有單位軌3D及4D。於此單位軌3D與單位軌4D之間能連接第三處理裝置PA3。在第三處理裝置PA3進行與第二處理裝置PA2相同之處理(此處為第一處理裝置PA1之後製程處理)。 Unit rails 3D and 4D are provided on the supporting table 20D. The third processing device PA3 can be connected between the unit rail 3D and the unit rail 4D. The third processing device PA3 performs the same processing as the second processing device PA2 (here, the processing after the first processing device PA1).

此外，圖6及圖7所示之實施形態中，雖舉了在第二處理裝置PA2及第三處理裝置PA3進行相同之處理(第一處理裝置PA1之後製程處理)之例來說明，但並不限於此。例如，亦可為在第二處理裝置PA2及第三處理裝置PA3分別進行個別之處理之構成。 In addition, in the embodiments shown in FIGS. 6 and 7, although the second processing device PA2 and the third processing device PA3 perform the same processing (process processing after the first processing device PA1) for description, they are not Not limited to this. For example, it may be a configuration in which the second processing device PA2 and the third processing device PA3 perform separate processing.

再者，亦可將第二處理裝置PA2與第三處理裝置PA3作成構成上完全相同之裝置，並視裝置設定不同處理條件(溫度或濕度、處理時間、基板之運送速度、張力量等)之構成。 Furthermore, the second processing device PA2 and the third processing device PA3 can also be made into devices with exactly the same structure, and different processing conditions (temperature or humidity, processing time, substrate conveying speed, tension force, etc.) can be set depending on the device. constitute.

支承台20B設成能藉由升降機構9分別移動至與支承台20C及支承台20D相等之Z位置。在支承台20B與支承台20C配置於相等之Z位置時，單位軌3B及4B、單位軌3C及4C能連接。此情形下，控制裝置CONT係將單位軌3B與單位軌4B之距離調整成與單位軌3C與單位軌4C之距離相等。 The support stand 20B is provided so that it can be moved to the Z position equal to the support stand 20C and the support stand 20D by the lifting mechanism 9 respectively. When the support base 20B and the support base 20C are arranged at the same Z position, the unit rails 3B and 4B and the unit rails 3C and 4C can be connected. In this case, the control device CONT adjusts the distance between the unit rail 3B and the unit rail 4B to be equal to the distance between the unit rail 3C and the unit rail 4C.

同樣地，在支承台20B與支承台20D配置於相等之Z位置時，單 位軌3B及4B、單位軌3D及4D能連接。此情形下，控制裝置CONT係將單位軌3B與單位軌4B之距離調整成與單位軌3D與單位軌4D之距離相等。 Similarly, when the support base 20B and the support base 20D are arranged at the same Z position, the unit rails 3B and 4B and the unit rails 3D and 4D can be connected. In this case, the control device CONT adjusts the distance between the unit rail 3B and the unit rail 4B to be equal to the distance between the unit rail 3D and the unit rail 4D.

在使此種構成之搬送裝置1作動時，與上述實施形態同樣地，使基板送出機構5配置於第一軌3，使基板捲取機構6配置於第二軌4，於供應滾筒5b與回收滾筒6b之間橫掛基板S而在此兩個滾筒間搬送基板S。 When the conveying device 1 with such a structure is operated, the substrate sending mechanism 5 is arranged on the first rail 3, and the substrate winding mechanism 6 is arranged on the second rail 4 in the same manner as in the above-mentioned embodiment. The substrate S is hung across the rollers 6b, and the substrate S is transported between the two rollers.

此情形下，由於支承台20B係能選擇地連接於支承台20C及支承台20D之兩者之構成，因此能將基板S之移動目的地設定為經由第一處理裝置PA1之基板S會往第二處理裝置PA2與第三處理裝置PA3交互移動。藉此，例如當在第二處理裝置PA2及第三處理裝置PA3之基板S之搬送速度較在第一處理裝置PA1之基板S之搬送速度慢時，能防止基板S在第二處理裝置PA2及第三處理裝置PA3前成為等待處理之狀態。 In this case, since the support table 20B can be selectively connected to both the support table 20C and the support table 20D, the movement destination of the substrate S can be set so that the substrate S through the first processing device PA1 will go to the first The second processing device PA2 and the third processing device PA3 move interactively. Thereby, for example, when the transfer speed of the substrate S in the second processing device PA2 and the third processing device PA3 is slower than the transfer speed of the substrate S in the first processing device PA1, it is possible to prevent the substrate S from being in the second processing device PA2 and The third processing device PA3 is in a waiting state before processing.

此外，藉由在基板送出機構5及基板捲取機構6分別設置調節供應滾筒5b、回收滾筒6b之高度之升降機，而能調整從基板送出機構5至基板捲取機構6之基板S之高度或傾斜。此外，將於供應滾筒5b與回收滾筒6b間橫掛基板S之狀態稱為基板組(滾筒組)。 In addition, by providing elevators for adjusting the heights of the supply roller 5b and the recovery roller 6b in the substrate delivery mechanism 5 and the substrate winding mechanism 6, respectively, the height or height of the substrate S from the substrate delivery mechanism 5 to the substrate winding mechanism 6 can be adjusted. tilt. In addition, the state where the substrate S is hung horizontally between the supply roller 5b and the recovery roller 6b is called a substrate group (roller group).

如上所述，能在第一處理裝置PA1結束對第1基板組之基板S之處理，使第1基板組之回收滾筒及供應滾筒移動至支承台20B上後，將作為新的處理對象之第2基板組之供應滾筒及回收滾筒搬入第一處理裝置PA1。 As described above, the processing of the substrate S of the first substrate group can be completed in the first processing device PA1, and after the recovery roller and the supply roller of the first substrate group are moved to the support table 20B, they will be the first processing target. 2 The supply roller and the recovery roller of the substrate group are carried into the first processing device PA1.

亦即，由於能調整將第1基板組搬入第二處理裝置PA2或第三處理裝置PA3之任一方之時點與將第2基板組搬入第一處理裝置PA1之時點，因此能依序處理複數個基板組。 That is, since the time when the first substrate group is transferred into either the second processing device PA2 or the third processing device PA3 and the time when the second substrate group is transferred into the first processing device PA1 can be adjusted, a plurality of substrate groups can be processed sequentially Substrate group.

又，藉由在第二處理裝置PA2、第三處理裝置PA3後亦設置如支承台20B之構成，而能將基板組搬入次一處理步驟之裝置(PA4)。 In addition, by arranging a structure like the support table 20B after the second processing device PA2 and the third processing device PA3, the substrate group can be carried into the device (PA4) of the next processing step.

進而，本實施形態之構成中，能在於基板送出機構5與基板捲取 機構6之間橫掛基板S之狀態下使基板S在處理裝置PA(PA1、PA2、PA3)間移動於X方向。此情形下，作為各處理裝置(PA)之一例，係如圖8所示，為能分離成上部單元100A與下部單元100B之構成，在被施加Y方向之張力之狀態下，橫掛於基板送出機構5與基板捲取機構6間之基板S能於X方向通過上部單元100A與下部單元100B間之空間之形態。 Furthermore, in the configuration of this embodiment, the substrate S can be moved in the X direction between the processing apparatuses PA (PA1, PA2, PA3) while the substrate S is hung horizontally between the substrate sending mechanism 5 and the substrate winding mechanism 6. In this case, as an example of each processing device (PA), as shown in FIG. 8, it has a structure that can be separated into an upper unit 100A and a lower unit 100B, and is horizontally hung on the substrate under tension in the Y direction. The substrate S between the feeding mechanism 5 and the substrate winding mechanism 6 can pass through the space between the upper unit 100A and the lower unit 100B in the X direction.

於上部單元100A，下部單元100B之基板S之投入口側與退出口側設有用以導引基板S之滾筒101a,101b、102a,102b。各處理裝置PA中，上部單元100A與下部單元100B之任一方或兩方能藉由未圖示之升降機構於Z方向移動必要量。作為此種處理裝置PA，能使用印刷機(亦包含噴墨印表機)、電漿裝置、蒸鍍裝置、曝光裝置等。 Rollers 101a, 101b, 102a, 102b for guiding the substrate S are provided on the upper unit 100A and the lower unit 100B of the substrate S on the input port side and the exit port side. In each processing apparatus PA, either or both of the upper unit 100A and the lower unit 100B can move a necessary amount in the Z direction by a lifting mechanism not shown. As such a processing device PA, a printer (including an inkjet printer), a plasma device, a vapor deposition device, an exposure device, etc. can be used.

1:搬送裝置 1: Conveying device

2:基台 2: Abutment

2a:底座部 2a: Base

2b:腳部 2b: feet

2c:支承台 2c: support table

2d:開口部 2d: opening

3:第一軌 3: first track

3A~3D:單位軌 3A~3D: unit track

4:第二軌 4: second track

4A~4D:單位軌 4A~4D: unit track

5:基板送出機構 5: Substrate delivery mechanism

6:基板捲取機構 6: Substrate take-up mechanism

7:軌驅動機構 7: Rail drive mechanism

7r:導引軌 7r: guide rail

8:滾筒驅動部 8: Drum drive

83:第一驅動部 83: The first drive part

84:第二驅動部 84: second drive part

CONT:控制裝置 CONT: control device

FL:地面 FL: Ground

S:基板 S: substrate

Claims (10)

一種電子元件之製造系統，係將具有可撓性之長條片狀基板依序搬送至複數個處理裝置之各個，以於前述片狀基板形成電子元件，其具備：第一處理裝置及第二處理裝置，前述片狀基板之搬入及搬出於與長邊方向交叉之短邊方向進行，且藉由前述片狀基板往長邊方向之搬送來處理前述片狀基板；基板供應機構，具有用以將前述片狀基板沿著長邊方向供應給前述第一處理裝置或前述第二處理裝置之供應滾筒；基板回收機構，具有用以回收於前述第一處理裝置或前述第二處理裝置處理完之前述片狀基板之回收滾筒；第一移動機構，用以在前述片狀基板橫掛於前述供應滾筒與前述回收滾筒間之狀態下，為了進行前述搬入及前述搬出而使前述基板供應機構與前述基板回收機構同步移動於前述短邊方向；以及第二移動機構，用以在前述片狀基板橫掛於前述供應滾筒與前述回收滾筒間之狀態下，於前述片狀基板從前述第一處理裝置搬出並搬入至前述第二處理裝置前，調整前述基板供應機構與前述基板回收機構在前述長邊方向之距離。 A manufacturing system for electronic components, in which a flexible long sheet substrate is sequentially transported to each of a plurality of processing devices to form electronic components on the aforementioned sheet substrate. It includes: a first processing device and a second processing device. Processing device, the sheet substrate is carried in and out of the short-side direction crossing the long-side direction, and the sheet-shaped substrate is processed by transporting the sheet-shaped substrate to the long-side direction; a substrate supply mechanism is provided for The sheet substrate is supplied to the supply roller of the first processing device or the second processing device along the longitudinal direction; the substrate recovery mechanism has a substrate to be recovered in the first processing device or the second processing device after processing The sheet substrate recovery roller; the first moving mechanism is used to make the substrate supply mechanism and the aforementioned substrate supply mechanism and the aforementioned sheet substrate in a state in which the sheet substrate is hung horizontally between the supply roller and the recovery roller in order to carry out the loading and unloading The substrate recovery mechanism synchronously moves in the short-side direction; and the second moving mechanism is used to move the sheet substrate from the first processing device when the sheet substrate is hung between the supply roller and the recovery roller. Before carrying out and carrying in the second processing device, the distance between the substrate supply mechanism and the substrate recovery mechanism in the longitudinal direction is adjusted. 如請求項1所述之電子元件之製造系統，其中，前述基板供應機構與前述基板回收機構之各者，具備用以使前述供應滾筒與前述回收滾筒之各者旋轉之旋轉驅動部；於藉由前述第二移動機構調整前述基板供應機構與前述基板回收機構在前述長邊方向之距離之期間，使前述旋轉驅動部動作。 The electronic component manufacturing system according to claim 1, wherein each of the substrate supply mechanism and the substrate recovery mechanism is provided with a rotation driving unit for rotating each of the supply roller and the recovery roller; The second moving mechanism is used to adjust the distance between the substrate supply mechanism and the substrate recovery mechanism in the longitudinal direction, and the rotation driving unit is operated. 如請求項2所述之電子元件之製造系統，其中，於藉由前述第二移動機構以前述基板供應機構與前述基板回收機構彼此接近之方式調整距離之期間，使前述旋轉驅動部動作，以消除橫掛於前述供應滾筒與前述回收滾筒間 之前述片狀基板之彎曲。 The electronic component manufacturing system according to claim 2, wherein during the period in which the second moving mechanism adjusts the distance so that the substrate supply mechanism and the substrate recovery mechanism are close to each other, the rotation driving part is operated to Eliminate the horizontal hanging between the aforementioned supply roller and the aforementioned recovery roller The bending of the aforementioned sheet substrate. 如請求項1至3中任一項所述之電子元件之製造系統，其中，前述基板供應機構之前述供應滾筒之旋轉軸與前述基板回收機構之前述回收滾筒之旋轉軸，係配置成於前述長邊方向分離且彼此平行。 The electronic component manufacturing system according to any one of claims 1 to 3, wherein the rotation axis of the supply roller of the substrate supply mechanism and the rotation axis of the recovery roller of the substrate recovery mechanism are arranged in the aforementioned The longitudinal directions are separated and parallel to each other. 如請求項4所述之電子元件之製造系統，其中，前述第一移動機構具備：第一驅動部，能使前述基板供應機構單獨移動於前述短邊方向；以及第二驅動部，能使前述基板回收機構單獨移動於前述短邊方向。 The electronic component manufacturing system according to claim 4, wherein the first moving mechanism includes: a first driving part capable of individually moving the substrate supply mechanism in the short-side direction; and a second driving part capable of causing the The substrate recovery mechanism independently moves in the aforementioned short-side direction. 如請求項5所述之電子元件之製造系統，其進而具備控制部，其在前述片狀基板橫掛於前述供應滾筒與前述回收滾筒間之狀態下使前述基板供應機構與前述基板回收機構移動於前述短邊方向時，同步控制前述第一驅動部與前述第二驅動部。 The electronic component manufacturing system according to claim 5, further comprising a control unit that moves the substrate supply mechanism and the substrate recovery mechanism in a state where the sheet substrate is hung between the supply roller and the recovery roller In the short-side direction, the first driving part and the second driving part are synchronously controlled. 如請求項4所述之電子元件之製造系統，其中，當將捲繞於前述供應滾筒之前述片狀基板之前端捲掛於前述回收滾筒時，控制前述第二移動機構以使前述基板供應機構與前述基板回收機構在前述長邊方向接近。 The electronic component manufacturing system according to claim 4, wherein when the front end of the sheet substrate wound on the supply roller is wound on the recovery roller, the second moving mechanism is controlled so that the substrate supply mechanism It is close to the substrate recovery mechanism in the longitudinal direction. 如請求項1至3中任一項所述之電子元件之製造系統，其進而具備升降機構，其設於前述片狀基板之從前述第一處理裝置至前述第二處理裝置之搬送途中，載置前述基板供應機構與前述基板回收機構，並使其等移動於相對於前述第一處理裝置或前述第二處理裝置設置之地面垂直之方向。 The electronic component manufacturing system according to any one of claims 1 to 3, which further includes a lifting mechanism, which is provided in the conveyance of the sheet substrate from the first processing device to the second processing device, and carries The substrate supply mechanism and the substrate recovery mechanism are arranged, and they are moved in a direction perpendicular to the ground where the first processing device or the second processing device is installed. 如請求項8所述之電子元件之製造系統，其中，前述第一處理裝置與前述第二處理裝置，配置成在與前述地面垂直之高度方向之位置不同。 The electronic component manufacturing system according to claim 8, wherein the first processing device and the second processing device are arranged at different positions in a height direction perpendicular to the ground. 如請求項9所述之電子元件之製造系統，其中，前述第二處理裝置有兩個，分別配置於在與前述地面垂直之高度方向之位置不同之兩處；前述升降機構，將高度方向之位置設定成，橫掛於前述基板供應機構與前 述基板回收機構間之前述片狀基板被搬入至配置於前述兩處之前述第二處理裝置之任一者。 The electronic component manufacturing system according to claim 9, wherein there are two second processing devices, which are respectively arranged at two different positions in the height direction perpendicular to the ground; The position is set to hang horizontally between the aforementioned substrate supply mechanism and the front The sheet substrate between the substrate recovery mechanisms is carried in to any one of the second processing devices arranged in the two places.
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