TWI623480B

TWI623480B - Manufacturing system

Info

Publication number: TWI623480B
Application number: TW106136141A
Authority: TW
Inventors: Tomohide Hamada; Tohru Kiuchi
Original assignee: Nikon Corp
Priority date: 2011-02-24
Filing date: 2012-02-22
Publication date: 2018-05-11
Also published as: TWI606970B; KR101652674B1; JP6065954B2; CN105836510B; HK1181021A1; HK1221701A1; TW201242878A; JPWO2012115037A1; CN103153830B; CN105836510A; TWI560127B; TW201702161A; JP5821944B2; KR20130143024A; TW201827321A; KR101608565B1; JP2016026370A; TWI701206B; TW201803792A; CN103153830A

Abstract

搬送裝置，其具備：供應滾筒，送出形成為帶狀且具有可撓性之基板；回收滾筒，捲取從前述供應滾筒送出之前述基板；以及驅動部，將供應滾筒與回收滾筒驅動於相對從供應滾筒往回收滾筒之基板之運送方向交叉之方向。 The conveying device includes: a supply roller that feeds a substrate that is formed in a strip shape and has flexibility; a recovery roller that winds up the substrate that is fed from the supply roller; and a driving unit that drives the supply roller and the recovery roller to each other The direction in which the supply rollers are routed to the substrate of the recovery roller.

Description

製造系統 Manufacturing system

本發明係關於搬送裝置。 The present invention relates to a conveying device.

本申請係根據2011年2月24日申請之美國臨時申請61/446,150號主張優先權，並將其內容援引於此。 Priority is claimed on U.S. Provisional Application Serial No. 61/446, filed on Jan. 24, 2011, which is hereby incorporated by reference.

作為構成顯示器裝置等顯示裝置之顯示元件，例如有液晶顯示元件、有機電致發光(有機EL)元件等。目前，此等顯示元件係以對應各畫素在基板表面形成被稱為薄膜電晶體(Thin Film Transistor：TFT)之主動元件(Active device)漸為主流。 Examples of the display element constituting the display device such as a display device include a liquid crystal display element, an organic electroluminescence (organic EL) element, and the like. At present, these display elements are becoming mainstream with the formation of an active device called a Thin Film Transistor (TFT) on the surface of the substrate corresponding to each pixel.

近年來，提出了一種在片狀之基板(例如薄膜構件等)上形成顯示元件之技術。作為此種技術，例如有一種被稱為捲軸對捲軸(roll to roll)方式(以下，簡記為「捲軸方式」)之手法廣為人知(例如，參照專利文獻1)。捲軸方式，係將捲繞在基板供應側之供應用滾筒之1片片狀基板(例如，帶狀之薄膜構件)送出且一邊將送出之基板以基板回收側之回收用滾筒加以捲取，一邊藉由設置於供應用滾筒與回收用滾筒間之處理裝置對基板施加所欲加工者。 In recent years, a technique of forming a display element on a sheet-like substrate (for example, a film member or the like) has been proposed. As such a technique, for example, a method called a roll to roll method (hereinafter, abbreviated as "reel method") is widely known (for example, refer to Patent Document 1). In the reel method, one sheet-like substrate (for example, a strip-shaped film member) wound around a supply roller on the substrate supply side is fed, and the substrate to be fed is taken up by the recovery roller on the substrate recovery side. The desired processor is applied to the substrate by a processing device disposed between the supply roller and the recovery roller.

在基板送出至被捲取為止之期間，例如一邊使用複數個搬送滾筒等搬送基板、一邊使用複數個處理裝置(單元)來形成構成TFT之閘極電極、閘極絕緣膜、半導體膜、源極-汲極電極等，在基板之被處理面上依序形成可撓性顯示器用之顯示元件之構成要件。例如，在形成有機EL元件之情形時，係於基板上依序形成發光層、陽極、陰極、電路等。 During the transfer of the substrate to the winding, for example, a plurality of processing devices (units) are used to transport the substrate, and the gate electrode, the gate insulating film, the semiconductor film, and the source of the TFT are formed using a plurality of processing devices (units). - a drain electrode, etc., on the treated surface of the substrate The components form the constituent elements of the display element for the flexible display. For example, in the case of forming an organic EL element, a light-emitting layer, an anode, a cathode, a circuit, and the like are sequentially formed on a substrate.

專利文獻1：國際公開第2006/100868號 Patent Document 1: International Publication No. 2006/100868

然而，上述構成中，由於從送出至捲取為止被橫掛之基板之尺寸較長，因此基板之管理係困難。 However, in the above configuration, since the size of the substrate that is traversed from the time of delivery to the winding is long, the management of the substrate is difficult.

本發明之態樣之目的在於提供一種能減低搬送時之基板之管理負擔之搬送裝置。 An aspect of the present invention is to provide a transport apparatus capable of reducing the management load of a substrate during transport.

根據本發明之態樣，提供一種搬送裝置，其具備：供應滾筒，送出形成為帶狀且具有可撓性之基板；回收滾筒，捲取從前述供應滾筒送出之前述基板；以及驅動部，將供應滾筒與回收滾筒驅動於相對從供應滾筒往回收滾筒之基板之運送方向交叉之方向。 According to an aspect of the present invention, a conveying apparatus includes: a supply roller that feeds a substrate that is formed in a strip shape and has flexibility; a recovery roller that winds up the substrate that is fed from the supply roller; and a driving unit that The supply roller and the recovery roller are driven in a direction intersecting with respect to the conveying direction of the substrate from the supply roller to the recovery roller.

根據本發明之態樣，能減低搬送時之基板之管理負擔。 According to the aspect of the invention, the management load of the substrate during transportation can be reduced.

1‧‧‧搬送裝置 1‧‧‧Transporting device

2‧‧‧基台 2‧‧‧Abutment

3‧‧‧第一軌 3‧‧‧First track

3A~3D‧‧‧單位軌 3A~3D‧‧‧unit rail

4‧‧‧第二軌 4‧‧‧second track

4A~4D‧‧‧單位軌 4A~4D‧‧‧unit rail

5b‧‧‧供應滾筒 5b‧‧‧Supply roller

6b‧‧‧回收滾筒 6b‧‧‧Recycling roller

7‧‧‧軌驅動機構(第三驅動部) 7‧‧‧ rail drive mechanism (third drive unit)

7r‧‧‧導引軌 7r‧‧‧ Guide rail

8‧‧‧滾筒驅動部 8‧‧‧Drum drive department

9‧‧‧升降機構 9‧‧‧ Lifting mechanism

9c‧‧‧致動器 9c‧‧‧Actuator

20A~20D‧‧‧支承台 20A~20D‧‧‧support table

83‧‧‧第一驅動部 83‧‧‧First Drive Department

84‧‧‧第二驅動部 84‧‧‧Second drive department

100A‧‧‧上部單元 100A‧‧‧Upper unit

100B‧‧‧下部單元 100B‧‧‧lower unit

CONT‧‧‧控制裝置 CONT‧‧‧ control device

CONT2‧‧‧第二控制裝置 CONT2‧‧‧Second control device

D1‧‧‧第一距離 D1‧‧‧First distance

D2‧‧‧第三距離 D2‧‧‧ third distance

PA(PA1、PA2、PA3)‧‧‧處理裝置 PA (PA1, PA2, PA3) ‧‧‧Processing device

S‧‧‧基板 S‧‧‧Substrate

Sf‧‧‧基板S之前端 Sf‧‧‧ front end of substrate S

Se‧‧‧基板S之後端 Se‧‧‧ back end of substrate S

圖1係顯示本發明之實施形態之搬送裝置整體構成之立體圖。 Fig. 1 is a perspective view showing the overall configuration of a conveying apparatus according to an embodiment of the present invention.

圖2係顯示本實施形態之搬送裝置一部分構成之立體圖。 Fig. 2 is a perspective view showing a part of the configuration of the conveying apparatus of the embodiment.

圖3係顯示本實施形態之搬送裝置之動作之樣子之俯視圖。 Fig. 3 is a plan view showing the operation of the conveying device of the embodiment.

圖4係顯示本實施形態之搬送裝置之動作之樣子之圖。 Fig. 4 is a view showing the operation of the conveying apparatus of the embodiment.

圖5係顯示本實施形態之搬送裝置之動作之樣子之圖。 Fig. 5 is a view showing the operation of the conveying apparatus of the embodiment.

圖6係顯示本發明之搬送裝置其他例之俯視圖。 Fig. 6 is a plan view showing another example of the conveying device of the present invention.

圖7係顯示本發明之搬送裝置其他例之前視圖。 Fig. 7 is a front view showing another example of the conveying apparatus of the present invention.

圖8係顯示本發明之搬送裝置其他例之圖。 Fig. 8 is a view showing another example of the conveying apparatus of the present invention.

以下，參照圖式說明本發明之實施形態。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

圖1係顯示本實施形態之搬送裝置1之整體構成的立體圖。圖2係顯示從與圖1不同之視點觀看搬送裝置1之一部分構成時之狀態之立體圖。 Fig. 1 is a perspective view showing the overall configuration of the conveying device 1 of the embodiment. Fig. 2 is a perspective view showing a state in which a part of the conveying device 1 is viewed from a different viewpoint from Fig. 1;

如圖1及圖2所示，搬送裝置1係搬送形成為帶狀且具有可撓性之基板S之裝置，設於例如製造工廠之地面FL。搬送裝置1具有基台(基座)ST、第一軌3、第二軌4、基板送出機構5、基板捲取機構6、作為第三驅動部之軌驅動機構7、滾筒驅動部8及控制裝置CONT。 As shown in FIG. 1 and FIG. 2, the conveyance apparatus 1 is a device which conveys the board|substrate which is formed in the strip shape, and is flexible, and is provided in the floor-surface FL of the manufacturing factory, for example. The conveying device 1 includes a base (base) ST, a first rail 3, a second rail 4, a substrate feeding mechanism 5, a substrate winding mechanism 6, a rail driving mechanism 7 as a third driving portion, a drum driving portion 8, and control Device CONT.

搬送裝置1，係對形成為帶狀且具有可撓性之基板S之表面執行各種處理之捲軸對捲軸方式(以下，簡記為「捲軸方式」)之裝置。此種捲軸方式之系統，可使用於在基板S上形成例如有機EL元件、液晶顯示元件等顯示元件(電子元件)之情形。當然，在形成此等元件以外之元件(例如太陽能單元、彩色濾光器、觸控面板等)之系統使用搬送裝置1亦可。 The conveying device 1 is a reel-to-reel method (hereinafter, abbreviated as "reel method") for performing various processes on the surface of the substrate S having a strip shape and having flexibility. Such a reel type system can be used for forming a display element (electronic element) such as an organic EL element or a liquid crystal display element on the substrate S. Of course, the transport apparatus 1 may be used in a system that forms components other than these components (for example, a solar cell, a color filter, a touch panel, etc.).

以下，在說明本實施形態之搬送裝置1構成時，設定XYZ正交座標系統，一邊參照此XYZ正交座標系統一邊說明各構件之位置關係。以下圖中，設XYZ正交座標系統中與地面FL平行之平面為XY平面。設XY平面中基板S藉由捲軸方式移動之方向(長邊方向)為Y方向，與Y方向正交之方向為X方向。又，設與地面FL(XY平面)垂直之方向為Z軸方向。 Hereinafter, in describing the configuration of the transport apparatus 1 of the present embodiment, the XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to the XYZ orthogonal coordinate system. In the following figure, the plane parallel to the ground FL in the XYZ orthogonal coordinate system is assumed to be the XY plane. In the XY plane, the direction in which the substrate S is moved by the reel method (longitudinal direction) is the Y direction, and the direction orthogonal to the Y direction is the X direction. Further, it is assumed that the direction perpendicular to the floor surface FL (XY plane) is the Z-axis direction.

作為在基板處理裝置PA成為處理對象之基板S，可使用例如樹脂膜或不鏽鋼等之箔(foil)。樹脂膜可使用例如聚乙烯樹脂、聚丙烯樹脂、聚酯樹脂、乙烯乙烯基共聚物(Ethylene vinyl copolymer)樹脂、聚氯乙烯基樹脂、纖維素樹脂、聚醯胺樹脂、聚醯亞胺樹脂、聚碳酸酯樹脂、聚苯乙烯樹脂、乙酸乙烯基樹脂、聚對苯二甲酸乙二酯、聚二甲酸乙二醇酯、不鏽箔等材料。 As a substrate S to be processed by the substrate processing apparatus PA, a usable example is used. A foil such as a resin film or stainless steel. As the resin film, for example, a polyethylene resin, a polypropylene resin, a polyester resin, an ethylene vinyl copolymer resin, a polyvinyl chloride resin, a cellulose resin, a polyamide resin, a polyimide resin, or the like may be used. Polycarbonate resin, polystyrene resin, vinyl acetate resin, polyethylene terephthalate, polyethylene dicarboxylate, stainless foil and the like.

基板S之短邊方向之尺寸係形成為例如50cm~2m程度、長邊方向之尺寸(1捲量之尺寸)則形成為例如10m以上。當然，此尺寸僅為一例，並不限於此例。例如基板S之短邊方向之尺寸為1m以下或50cm以下亦可、亦可為2m以上。本實施形態中，亦可使用短邊方向之尺寸超過2m之基板S。又，基板S之長邊方向之尺寸亦可在10m以下。 The dimension of the short side direction of the substrate S is, for example, about 50 cm to 2 m, and the dimension in the longitudinal direction (the size of one roll) is, for example, 10 m or more. Of course, this size is only an example and is not limited to this example. For example, the dimension of the short side direction of the substrate S may be 1 m or less or 50 cm or less, or may be 2 m or more. In the present embodiment, the substrate S having a dimension in the short-side direction of more than 2 m may be used. Further, the dimension of the substrate S in the longitudinal direction may be 10 m or less.

基板S係形成為例如具有1mm以下之厚度且具有可撓性。此處，所謂可撓性，係指例如對基板施加至少自重程度之既定力亦不會斷裂或破裂、而能將該基板加以彎折之性質。此外，例如因上述既定力而彎折之性質亦包含於可撓性。又，上述可撓性會隨著該基板材質、大小、厚度、或温度、濕度等之環境等而改變。此外，基板S可使用一片帶狀之基板、亦可使用將複數個單位基板加以連接而形成為帶狀之構成。 The substrate S is formed to have a thickness of, for example, 1 mm or less and has flexibility. Here, the term "flexibility" refers to a property of applying a predetermined force to the substrate at least to its own weight without breaking or breaking, and bending the substrate. Further, for example, the property of being bent by the predetermined force described above is also included in the flexibility. Moreover, the above-mentioned flexibility changes depending on the material, size, thickness, environment of temperature, humidity, and the like of the substrate. Further, the substrate S may be a strip-shaped substrate, or a plurality of unit substrates may be connected to form a strip.

基板S，以承受較高溫(例如200℃程度)之熱其尺寸亦實質上無變化(熱變形小)之熱膨脹係數較小者較佳。例如可將無機填料混於樹脂膜以降低熱膨脹係數。作為無機填料，例如有氧化鈦、氧化鋅、氧化鋁、氧化矽等。 It is preferable that the substrate S is subjected to a relatively high temperature (for example, about 200 ° C), and the size thereof is substantially unchanged (the thermal deformation is small), and the coefficient of thermal expansion is small. For example, an inorganic filler may be mixed in the resin film to lower the coefficient of thermal expansion. Examples of the inorganic filler include titanium oxide, zinc oxide, aluminum oxide, cerium oxide, and the like.

基台2具有底座部2a、腳部2b及支承台2c。底座部2a載置於地面FL。腳部2b於底座部2a上設有複數個，支承支承台2c。支承台 2c形成為例如矩形，於X方向設有安裝處理裝置PA之開口部與設成夾著該開口部之3個開口部2d。亦即，於支承台2c沿X方向設有3個開口部2d。於3個開口部2d內設有與Y軸方向平行延伸之導引軌7r。導引軌7r係於各開口部2d在X方向平行並列設有2個。 The base 2 has a base portion 2a, a leg portion 2b, and a support base 2c. The base portion 2a is placed on the floor surface FL. The leg portion 2b is provided in plurality on the base portion 2a, and supports the support base 2c. Support table The 2c is formed, for example, in a rectangular shape, and an opening portion to which the processing device PA is attached and an opening 3d in which the opening portion is interposed is provided in the X direction. That is, three opening portions 2d are provided in the X direction on the support base 2c. A guide rail 7r extending in parallel with the Y-axis direction is provided in the three openings 2d. The guide rails 7r are provided in parallel with each other in the X direction in the respective opening portions 2d.

第一軌3沿支承台2c之+Y側之邊配置。第一軌3分割成3個單位軌3A~3C。各單位軌3A~3C配置於與支承台2c之3個開口部2d分別對應之位置。單位軌3A~3C之X方向尺寸為與各開口部2d之X方向尺寸對應之值。 The first rail 3 is disposed along the side of the +Y side of the support table 2c. The first rail 3 is divided into three unit rails 3A to 3C. Each of the unit rails 3A to 3C is disposed at a position corresponding to each of the three opening portions 2d of the support base 2c. The X-direction dimension of the unit rails 3A to 3C is a value corresponding to the X-direction dimension of each of the openings 2d.

第二軌4沿支承台2c之-Y側之邊配置。第2軌4分割成3個單位軌4A~4C。各單位軌4A~4C與上述單位軌3A~3C同樣地配置於與支承台2c之3個開口部2d分別對應之位置。單位軌4A~4C之X方向尺寸為與各開口部2d之X方向尺寸對應之值，為與上述單位軌3A~3C之X方向尺寸相同之尺寸。 The second rail 4 is disposed along the side of the -Y side of the support table 2c. The second track 4 is divided into three unit rails 4A to 4C. Each of the unit rails 4A to 4C is disposed at a position corresponding to each of the three openings 2d of the support base 2c in the same manner as the above-described unit rails 3A to 3C. The X-direction dimension of the unit rails 4A to 4C is a value corresponding to the X-direction dimension of each of the opening portions 2d, and is the same size as the X-direction dimension of the unit rails 3A to 3C.

第一軌3之單位軌3A~3C及第二軌4之單位軌4A~4C設於各開口部2d，且分別被延伸於Y方向之導引軌7r支承。圖1所示之構成中，單位軌3A~3C被導引軌7r之+Y側端部支承，單位軌4A~4C被導引軌7r之-Y側端部支承。 The unit rails 3A to 3C of the first rail 3 and the unit rails 4A to 4C of the second rail 4 are provided in the respective opening portions 2d, and are supported by the guide rails 7r extending in the Y direction. In the configuration shown in Fig. 1, the unit rails 3A to 3C are supported by the +Y side end portions of the guide rails 7r, and the unit rails 4A to 4C are supported by the -Y side end portions of the guide rails 7r.

第一軌3之單位軌3A~3C與第二軌4之單位軌4A~4C分別與X軸方向平行配置。又，由於導引軌7r與Y軸方向平行延伸，因此單位軌3A~3C及單位軌4A~4C設成能一邊維持彼此平行之狀態一邊在導引軌7r上移動於Y方向。如此，第一軌3及第二軌4為能藉由導引軌7r在與XY平面平行之平面上直線狀移動之構成。 The unit rails 3A to 3C of the first rail 3 and the unit rails 4A to 4C of the second rail 4 are arranged in parallel with the X-axis direction, respectively. Further, since the guide rail 7r extends in parallel with the Y-axis direction, the unit rails 3A to 3C and the unit rails 4A to 4C are arranged to move in the Y direction on the guide rail 7r while maintaining the parallel state. Thus, the first rail 3 and the second rail 4 are configured to be linearly movable by a guide rail 7r on a plane parallel to the XY plane.

基板送出機構5配置於第一軌3上。基板送出機構5具有滾筒支承部5a及供應滾筒5b。滾筒支承部5a連接於第一軌3上，設成能沿第一軌3移動(導引)於X方向。滾筒支承部5a能移動於構成第一軌3之單位軌3A~3C。 The substrate feeding mechanism 5 is disposed on the first rail 3. The substrate delivery mechanism 5 has a roller support portion 5a and a supply roller 5b. The drum support portion 5a is coupled to the first rail 3 so as to be movable (guided) along the first rail 3 in the X direction. The drum support portion 5a is movable to the unit rails 3A to 3C constituting the first rail 3.

供應滾筒5b被滾筒支承部5a能旋轉地支承。供應滾筒5b被支承成旋轉軸之方向一致於與X方向平行之方向。於供應滾筒5b捲纏基板S成捲軸狀。藉由供應滾筒5b旋轉，捲纏於前述供應滾筒5b之基板S被往-Y方向送出。供應滾筒5b能藉由馬達等而旋轉。 The supply roller 5b is rotatably supported by the roller support portion 5a. The supply roller 5b is supported such that the direction of the rotation axis coincides with the direction parallel to the X direction. The substrate S is wound around the supply roller 5b in a reel shape. By the rotation of the supply roller 5b, the substrate S wound around the supply roller 5b is sent out in the -Y direction. The supply roller 5b can be rotated by a motor or the like.

基板捲取機構6配置於第二軌4上。基板捲取機構6具有滾筒支承部6a及回收滾筒6b。滾筒支承部6a連接於第二軌4上，設成能沿第二軌4移動(導引)於X方向。滾筒支承部6a能移動於構成第二軌4之單位軌4A~4C。 The substrate take-up mechanism 6 is disposed on the second rail 4. The substrate take-up mechanism 6 has a roller support portion 6a and a recovery roller 6b. The drum support portion 6a is coupled to the second rail 4 so as to be movable (guided) along the second rail 4 in the X direction. The roller support portion 6a is movable to the unit rails 4A to 4C constituting the second rail 4.

回收滾筒6b被滾筒支承部6a能旋轉地支承。回收滾筒6b被支承成旋轉軸之方向一致於與X方向平行之方向。於回收滾筒6b捲纏基板S成捲軸狀。藉由回收滾筒6b旋轉，將基板S捲纏於此回收滾筒6b。回收滾筒6b能藉由馬達等而旋轉。 The recovery drum 6b is rotatably supported by the drum support portion 6a. The recovery drum 6b is supported such that the direction of the rotation axis coincides with the direction parallel to the X direction. The substrate S is wound around the recovery drum 6b in a reel shape. The substrate S is wound around the recovery drum 6b by the rotation of the recovery drum 6b. The recovery drum 6b can be rotated by a motor or the like.

軌驅動機構7係沿導引軌7r使第一軌3及第二軌4移動於Y方向。軌驅動機構7能將第一軌3依單位軌3A~3C驅動，且將第二軌4依單位軌4A~4C驅動。控制裝置CONT能控制軌驅動機構7之驅動量、驅動速度及驅動之時點等。軌驅動機構7能沿導引軌7r使單位軌3A與單位軌4A彼此接近或彼此分離。又，軌驅動機構7能沿導引軌7r使單位軌3B與單位軌4B彼此接近或彼此分離。又，軌驅動機構7能沿導引軌7r使單位軌 3C與單位軌4C彼此接近或彼此分離。 The rail drive mechanism 7 moves the first rail 3 and the second rail 4 in the Y direction along the guide rail 7r. The rail drive mechanism 7 can drive the first rail 3 according to the unit rails 3A to 3C, and drive the second rail 4 according to the unit rails 4A to 4C. The control unit CONT can control the driving amount of the rail drive mechanism 7, the driving speed, and the timing of driving. The rail drive mechanism 7 can bring the unit rail 3A and the unit rail 4A close to each other or separated from each other along the guide rail 7r. Further, the rail drive mechanism 7 can bring the unit rail 3B and the unit rail 4B close to each other or separated from each other along the guide rail 7r. Moreover, the rail drive mechanism 7 can make the unit rail along the guide rail 7r The 3C and the unit rail 4C are close to each other or separated from each other.

滾筒驅動部8具有第一驅動部83及第二驅動部84。第一驅動部83係使滾筒支承部5a沿第一軌3移動於X方向且使供應滾筒5b旋轉。第二驅動部84係使滾筒支承部6a沿第二軌4移動於X方向且使回收滾筒6b旋轉。控制裝置CONT能將第一驅動部83及第二驅動部84個別或同步控制。又，控制裝置CONT能控制第一驅動部83及第二驅動部84之驅動量、驅動速度及驅動之時點等。 The drum drive unit 8 has a first drive unit 83 and a second drive unit 84. The first drive unit 83 moves the drum support portion 5a along the first rail 3 in the X direction and rotates the supply drum 5b. The second drive unit 84 moves the drum support portion 6a along the second rail 4 in the X direction and rotates the recovery drum 6b. The control device CONT can individually or synchronously control the first drive unit 83 and the second drive unit 84. Further, the control unit CONT can control the driving amount of the first driving unit 83 and the second driving unit 84, the driving speed, the timing of driving, and the like.

其次，參照圖3等說明如上述構成之搬送裝置1之動作。圖3係顯示搬送裝置1之動作之俯視圖。 Next, the operation of the transport apparatus 1 configured as described above will be described with reference to FIG. 3 and the like. FIG. 3 is a plan view showing the operation of the transport device 1.

首先，說明進行於供應滾筒5b與回收滾筒6b間橫掛基板S之動作之情形。 First, the operation of traversing the substrate S between the supply roller 5b and the recovery roller 6b will be described.

此情形下，控制裝置CONT係使基板送出機構5配置於第一軌3之單位軌3A上，使基板捲取機構6配置於第二軌4之單位軌4A上。藉由此動作，配置成供應滾筒5b與回收滾筒6b於Y方向對向且平行。 In this case, the control device CONT arranges the substrate feeding mechanism 5 on the unit rail 3A of the first rail 3, and arranges the substrate winding mechanism 6 on the unit rail 4A of the second rail 4. By this operation, the supply roller 5b and the recovery roller 6b are arranged to face each other in the Y direction.

其次，於供應滾筒5b安裝捲成捲軸狀之基板S。於基板S之前端Sf雖安裝有例如圖3所示構成之導頭Lf，但亦可係省略此導頭Lf之構成。於供應滾筒5b安裝捲軸狀之基板S後，控制裝置CONT使第二軌4之單位軌4A往+Y方向移動。藉由此動作，供應滾筒5b與回收滾筒6b彼此接近。 Next, the substrate S wound in a roll shape is mounted on the supply roller 5b. For example, the lead Lf having the configuration shown in FIG. 3 is attached to the front end Sf of the substrate S, but the configuration of the lead Lf may be omitted. After the reel-shaped substrate S is mounted on the supply roller 5b, the control unit CONT moves the unit rail 4A of the second rail 4 in the +Y direction. By this action, the supply roller 5b and the recovery roller 6b are close to each other.

控制裝置CONT，在供應滾筒5b與回收滾筒6b之距離成為第一距離D1之情形下，藉由第一驅動部83使供應滾筒5b旋轉。藉由此動作，基板S之前端Sf往回收滾筒6b側送出，基板S之前端Sf到達回收滾筒6b而捲掛於此回收滾筒6b。此外，將基板S之前端Sf捲掛於回收滾筒6b之操作雖亦可自動化，但亦可藉由人手使用固定帶等將前端Sf貼附於回收滾筒6b。 The control device CONT rotates the supply roller 5b by the first drive unit 83 when the distance between the supply roller 5b and the recovery roller 6b becomes the first distance D1. By this action, the front end Sf of the substrate S is sent to the side of the recovery drum 6b, and the front end Sf of the substrate S reaches the recovery roll. The drum 6b is wound around the recovery drum 6b. Further, the operation of winding the front end Sf of the substrate S on the recovery drum 6b may be automated, but the front end Sf may be attached to the recovery drum 6b by a human hand using a fixing belt or the like.

控制裝置CONT在基板S之前端Sf掛於回收滾筒6b後，使供應滾筒5b旋轉，且使單位軌4A往-Y方向移動至供應滾筒5b與回收滾筒6b之距離成為第二距離(基板捲取機構6到達原本位置之距離)為止。藉由此動作，基板S之前端Sf在掛於回收滾筒6b之狀態下往-Y方向拉出。 After the control device CONT is hung on the recovery roller 6b at the front end Sf of the substrate S, the supply roller 5b is rotated, and the unit rail 4A is moved in the -Y direction to a distance between the supply roller 5b and the recovery roller 6b to become a second distance (substrate winding) The distance between the mechanism 6 and the original position). By this action, the front end Sf of the substrate S is pulled out in the -Y direction while being hung on the recovery roller 6b.

基板捲取機構6到達原本位置後，控制裝置CONT即使此基板捲取機構6之移動停止。其後，控制裝置CONT如圖4所示，藉由第一驅動部83及第二驅動部84使基板送出機構5及基板捲取機構6同步分別往單位軌3B上及單位軌4B上移動。此外，在此動作前係於單位軌3B與單位軌4B間配置處理裝置PA。此時，係將基板送出機構5與基板捲取機構6控制成供應滾筒5b與回收滾筒6b間橫掛之基板S被賦予於Y方向之適度張力而平坦地伸張。 After the substrate take-up mechanism 6 reaches the original position, the control device CONT stops even if the substrate winding mechanism 6 moves. Thereafter, as shown in FIG. 4, the control unit CONT moves the substrate feeding mechanism 5 and the substrate winding unit 6 to the unit rail 3B and the unit rail 4B in synchronization with each other by the first driving unit 83 and the second driving unit 84. Further, before this operation, the processing device PA is disposed between the unit rail 3B and the unit rail 4B. At this time, the substrate feeding mechanism 5 and the substrate winding mechanism 6 are controlled so that the substrate S traversed between the supply roller 5b and the recovery roller 6b is applied with a moderate tension in the Y direction and stretched flat.

此處理裝置PA具有用以對基板S之被處理面Sa形成例如有機EL元件之各種處理部。作為此種處理部可舉出例如用以在被處理面Sa上形成分隔壁之分隔壁形成裝置、用以形成用以驅動有機EL元件之電極之電極形成裝置、用以形成發光層之發光層形成裝置等。 This processing apparatus PA has various processing sections for forming, for example, an organic EL element on the processed surface Sa of the substrate S. Examples of such a treatment portion include a partition wall forming device for forming a partition wall on the surface to be processed Sa, an electrode forming device for forming an electrode for driving the organic EL element, and a light emitting layer for forming a light emitting layer. Form a device or the like.

更具體而言，可舉出例如液滴塗布裝置(例如噴墨型塗布裝置、噴塗型塗布裝置、凹版印刷機等)、蒸鍍裝置、濺鍍裝置等成膜裝置、曝光裝置、顯影裝置、表面改質裝置、洗淨裝置等。作為處理裝置PA不限於用以形成有機EL元件之處理部，當然亦可配置具有形成其他元件之處理部之處理裝置。 More specifically, for example, a film forming apparatus such as a droplet applying apparatus (for example, an inkjet coating apparatus, a spray coating apparatus, or a gravure printing machine), a vapor deposition apparatus, and a sputtering apparatus, an exposure apparatus, and a developing apparatus, Surface modification device, cleaning device, and the like. The processing device PA is not limited to the processing portion for forming the organic EL element, and of course, it is also possible to configure the processing for forming other elements. Department of processing equipment.

控制裝置CONT，在使基板送出機構5及基板捲取機構6分別配置於單位軌3B及4B上後，配合處理裝置PA之處理時點使供應滾筒5b及回收滾筒6b旋轉。藉由此動作，成為從供應滾筒5b如箭頭K2所示送出基板S並以回收滾筒6b捲取基板S之狀態，在此狀態下處理裝置PA之處理對基板S之被處理面Sa進行。 The control device CONT rotates the supply roller 5b and the recovery roller 6b at the processing timing of the processing device PA after the substrate feeding mechanism 5 and the substrate winding mechanism 6 are disposed on the unit rails 3B and 4B, respectively. By this operation, the substrate S is fed from the supply roller 5b as indicated by an arrow K2, and the substrate S is taken up by the recovery roller 6b. In this state, the processing of the processing apparatus PA is performed on the processed surface Sa of the substrate S.

控制裝置CONT依照處理裝置PA之處理速度調整從供應滾筒5b往回收滾筒6b移動之基板S之移動速度。例如依照捲於供應滾筒5b之基板S之捲繞徑R1與捲於回收滾筒6b之基板S之捲繞徑R2調整第一驅動部83及第二驅動部84之驅動速度。藉由此動作，在搬送速度為一定之狀態下搬送基板S。 The control unit CONT adjusts the moving speed of the substrate S moving from the supply roller 5b to the recovery roller 6b in accordance with the processing speed of the processing device PA. For example, the driving speeds of the first driving portion 83 and the second driving portion 84 are adjusted in accordance with the winding diameter R1 of the substrate S wound on the supply roller 5b and the winding diameter R2 of the substrate S wound around the recovery roller 6b. By this operation, the substrate S is transported while the transport speed is constant.

控制裝置CONT亦可依照處理裝置PA之處理位置或Y方向尺寸等調整供應滾筒5b與回收滾筒6b之距離。此情形下，控制裝置CONT係藉由軌驅動機構7使例如單位軌3B或單位軌4B分別移動於Y方向。藉由處理裝置PA將顯示元件之構成要件一部分或全部依序形成於基板S上。 The control device CONT can also adjust the distance between the supply roller 5b and the recovery roller 6b in accordance with the processing position of the processing device PA or the Y-direction size or the like. In this case, the control unit CONT moves the unit rail 3B or the unit rail 4B to the Y direction by the rail drive mechanism 7, for example. A part or all of the constituent elements of the display element are sequentially formed on the substrate S by the processing device PA.

對基板S之處理結束後，控制裝置CONT藉由第一驅動部83及第二驅動部84使基板送出機構5及基板捲取機構6同步，分別往單位軌3C上及單位軌4C上移動。如圖5所示，基板送出機構5及基板捲取機構6配置於單位軌3C上及單位軌4C上後，使基板送出機構5及基板捲取機構6之移動停止。此時，橫掛於供應滾筒5b與回收滾筒6b間之基板S最好係無彎曲地水平伸張。 After the processing of the substrate S is completed, the control unit CONT synchronizes the substrate feeding mechanism 5 and the substrate winding mechanism 6 by the first driving unit 83 and the second driving unit 84, and moves on the unit rail 3C and the unit rail 4C. As shown in FIG. 5, after the substrate feeding mechanism 5 and the substrate winding mechanism 6 are disposed on the unit rail 3C and the unit rail 4C, the movement of the substrate feeding mechanism 5 and the substrate winding mechanism 6 is stopped. At this time, the substrate S traversed between the supply roller 5b and the recovery roller 6b is preferably horizontally stretched without bending.

控制裝置CONT，在使基板送出機構5及基板捲取機構6 之移動停止後，一邊使回收滾筒6b旋轉一邊使單位軌4C往+Y方向移動。藉由此動作，回收滾筒6b捲取基板S之同時，供應滾筒5b與回收滾筒6b再度接近。 Control device CONT, in which substrate feeding mechanism 5 and substrate winding mechanism 6 are provided After the movement is stopped, the unit rail 4C is moved in the +Y direction while the recovery drum 6b is rotated. By this action, the recovery roller 6b winds up the substrate S, and the supply roller 5b and the recovery roller 6b come close again.

控制裝置CONT在供應滾筒5b與回收滾筒6b之距離成為第三距離D2後，如圖5所示，藉由第一驅動部83使供應滾筒5b旋轉。此情形下，能使第三距離D2例如與上述之第一距離D1為相等之距離。藉由此動作，基板S之後端Se往回收滾筒6b側送出，基板S之後端Se到達回收滾筒6b而捲掛於此回收滾筒6b。此外，於基板S之後端Se，雖在例如圖5所示構成中安裝有導頭Le，但亦可係省略此導頭Le之構成。 After the distance between the supply roller 5b and the recovery roller 6b becomes the third distance D2, the control device CONT rotates the supply roller 5b by the first drive unit 83 as shown in Fig. 5 . In this case, the third distance D2 can be made equal, for example, to the first distance D1 described above. By this operation, the rear end Se of the substrate S is sent to the side of the recovery drum 6b, and the rear end Se of the substrate S reaches the recovery drum 6b and is wound around the recovery drum 6b. Further, at the rear end Se of the substrate S, the lead Le is attached to the configuration shown in, for example, FIG. 5, but the configuration of the lead Le may be omitted.

控制裝置CONT在基板S之後端Se掛於回收滾筒6b後，使單位軌4C往-Y方向移動至供應滾筒5b與回收滾筒6b之距離成為第二距離(基板捲取機構6到達原本位置之距離)。基板捲取機構6到達原本位置後，捲於回收滾筒6b之捲軸狀之基板S往次一處理裝置移動。或著，已對基板S進行所有處理時，可從前述回收滾筒6b卸除並回收。 After the control device CONT is hung on the recovery roller 6b at the rear end Se of the substrate S, the unit rail 4C is moved in the -Y direction until the distance between the supply roller 5b and the recovery roller 6b becomes the second distance (the distance from which the substrate take-up mechanism 6 reaches the original position) ). After the substrate take-up mechanism 6 reaches the original position, the reel-shaped substrate S wound on the recovery roller 6b moves to the next processing device. Alternatively, when all the processing has been performed on the substrate S, it can be removed and recovered from the recovery drum 6b.

如以上所述，根據本實施形態，由於於基台2設有第一軌3及第二軌4，於第一軌3設有能在前述第一軌3上移動之供應滾筒5b，於第二軌4設有能在前述第二軌4上移動之回收滾筒6b，第一軌3及第二軌4能藉由軌驅動機構7(第三驅動部)驅動，因此能在供應滾筒5b與回收滾筒6b之間將基板S不占空間地搬送。藉此，由於能抑制送出至被捲取為止橫掛之基板S之尺寸變長，因此能減低搬送時之基板S之管理負擔。 As described above, according to the present embodiment, since the first rail 3 and the second rail 4 are provided on the base 2, the supply rail 5b which is movable on the first rail 3 is provided in the first rail 3, The two rails 4 are provided with a recovery roller 6b movable on the second rail 4, and the first rail 3 and the second rail 4 can be driven by the rail drive mechanism 7 (third drive portion), so that the supply roller 5b can be The substrate S is transported between the recovery rolls 6b without occupying a space. Thereby, since the size of the substrate S which is traversed until being taken up by the winding up can be suppressed, the management load of the substrate S at the time of conveyance can be reduced.

本發明之技術範圍並不限於上述實施形態，在不脫離本發明之趣旨之範圍內可施加適當變更。 The technical scope of the present invention is not limited to the above-described embodiments, and may be appropriately modified without departing from the spirit and scope of the invention.

上述實施形態中，雖舉第一軌3及第二軌4往與XY平面平行之方向移動之構成為例進行了說明，但並不限於此。例如，亦可係第一軌3及第二軌4能移動於Z方向之構成。 In the above embodiment, the configuration in which the first rail 3 and the second rail 4 move in the direction parallel to the XY plane has been described as an example, but the invention is not limited thereto. For example, the first rail 3 and the second rail 4 can be configured to move in the Z direction.

圖6係顯示搬送裝置1之其他例之俯視圖，圖7係顯示圖6之搬送裝置1之例之側視圖。 Fig. 6 is a plan view showing another example of the conveying device 1, and Fig. 7 is a side view showing an example of the conveying device 1 of Fig. 6.

如圖6及圖7所示，相當於搬送裝置1之基台2之構成在本例中為具有4個支承台20A~20D之構成。於支承台20A配置有單位軌3A及4A。於單位軌3A與單位軌4A之間連接有第一處理裝置PA1。 As shown in FIGS. 6 and 7, the configuration of the base 2 corresponding to the conveying device 1 has a configuration in which four support stages 20A to 20D are provided in this example. The unit rails 3A and 4A are disposed on the support base 20A. A first processing device PA1 is connected between the unit rail 3A and the unit rail 4A.

於支承台20B配置有單位軌3B及單位軌4B。支承台20B與支承台20A、支承台20C及支承台20D分離。支承台20B設成能藉由升降機構9單獨移動於Z方向。升降機構9具有支承柱9a、導引柱9b及致動器9c。藉由致動器9c之驅動，支承台20B在被支撐於支承柱9a之狀態下沿導引柱9b移動於Z方向。致動器9c之驅動量、驅動速度及驅動之時點例如能藉由第二控制裝置CONT2控制。此外，亦可在控制裝置CONT一起進行。 The unit rail 3B and the unit rail 4B are disposed on the support base 20B. The support base 20B is separated from the support base 20A, the support base 20C, and the support base 20D. The support table 20B is provided to be individually movable in the Z direction by the elevating mechanism 9. The elevating mechanism 9 has a support post 9a, a guide post 9b, and an actuator 9c. By the driving of the actuator 9c, the support table 20B is moved in the Z direction along the guide post 9b while being supported by the support post 9a. The driving amount, driving speed and timing of the driving of the actuator 9c can be controlled, for example, by the second control unit CONT2. Furthermore, it can also be carried out together with the control unit CONT.

支承台20C及支承台20D排列配置於Z方向。支承台20C設於+Z側，支承台20D設於-Z側。於支承台20C設有單位軌3C及4C。於此單位軌3C與單位軌4C之間能連接第二處理裝置PA2。在第二處理裝置PA2進行例如第一處理裝置PA1之後製程處理。 The support base 20C and the support base 20D are arranged in the Z direction. The support table 20C is provided on the +Z side, and the support table 20D is provided on the -Z side. Unit rails 3C and 4C are provided on the support base 20C. The second processing device PA2 can be connected between the unit rail 3C and the unit rail 4C. The processing is performed after the second processing device PA2 performs, for example, the first processing device PA1.

於支承台20D設有單位軌3D及4D。於此單位軌3D與單位軌4D之間能連接第三處理裝置PA3。在第三處理裝置PA3進行與第二處理裝置PA2相同之處理(此處為第一處理裝置PA1之後製程處理)。 Unit rails 3D and 4D are provided on the support table 20D. The third processing device PA3 can be connected between the unit rail 3D and the unit rail 4D. The same processing as the second processing device PA2 (here, the processing after the first processing device PA1) is performed in the third processing device PA3.

此外，圖6及圖7所示之實施形態中，雖舉了在第二處理裝置PA2及第三處理裝置PA3進行相同之處理(第一處理裝置PA1之後製程處理)之例來說明，但並不限於此。例如，亦可為在第二處理裝置PA2及第三處理裝置PA3分別進行個別之處理之構成。 In addition, in the embodiment shown in FIG. 6 and FIG. 7, although the same processing (process processing after the first processing apparatus PA1) is performed by the second processing apparatus PA2 and the third processing apparatus PA3, an example is described. Not limited to this. For example, it is also possible to perform separate processing for each of the second processing device PA2 and the third processing device PA3.

再者，亦可將第二處理裝置PA2與第三處理裝置PA3作成構成上完全相同之裝置，並視裝置設定不同處理條件(溫度或濕度、處理時間、基板之運送速度、張力量等)之構成。 Furthermore, the second processing device PA2 and the third processing device PA3 may be configured to be identical in configuration, and different processing conditions (temperature or humidity, processing time, substrate transport speed, tension amount, etc.) may be set depending on the device. Composition.

支承台20B設成能藉由升降機構9分別移動至與支承台20C及支承台20D相等之Z位置。在支承台20B與支承台20C配置於相等之Z位置時，單位軌3B及4B、單位軌3C及4C能連接。此情形下，控制裝置CONT係將單位軌3B與單位軌4B之距離調整成與單位軌3C與單位軌4C之距離相等。 The support table 20B is provided to be movable by the elevating mechanism 9 to the Z position equal to the support base 20C and the support base 20D. When the support base 20B and the support base 20C are disposed at the same Z position, the unit rails 3B and 4B and the unit rails 3C and 4C can be connected. In this case, the control unit CONT adjusts the distance between the unit rail 3B and the unit rail 4B to be equal to the distance between the unit rail 3C and the unit rail 4C.

同樣地，在支承台20B與支承台20D配置於相等之Z位置時，單位軌3B及4B、單位軌3D及4D能連接。此情形下，控制裝置CONT係將單位軌3B與單位軌4B之距離調整成與單位軌3D與單位軌4D之距離相等。 Similarly, when the support base 20B and the support base 20D are disposed at the same Z position, the unit rails 3B and 4B and the unit rails 3D and 4D can be connected. In this case, the control unit CONT adjusts the distance between the unit rail 3B and the unit rail 4B to be equal to the distance between the unit rail 3D and the unit rail 4D.

在使此種構成之搬送裝置1作動時，與上述實施形態同樣地，使基板送出機構5配置於第一軌3，使基板捲取機構6配置於第二軌4，於供應滾筒5b與回收滾筒6b之間橫掛基板S而在此兩個滾筒間搬送基板S。 When the conveying device 1 having such a configuration is actuated, the substrate feeding mechanism 5 is placed on the first rail 3, and the substrate winding mechanism 6 is placed on the second rail 4 in the supply roller 5b and recovered in the same manner as in the above embodiment. The substrate S is traversed between the rollers 6b, and the substrate S is transferred between the two rollers.

此情形下，由於支承台20B係能選擇地連接於支承台20C及支承台20D之兩者之構成，因此能將基板S之移動目的地設定為經由第一處理裝置PA1之基板S會往第二處理裝置PA2與第三處理裝置PA3交互移動。藉此，例如當在第二處理裝置PA2及第三處理裝置PA3之基板S之搬送速度較在第一處理裝置PA1之基板S之搬送速度慢時，能防止基板S在第二處理裝置PA2及第三處理裝置PA3前成為等待處理之狀態。 In this case, since the support base 20B is selectively connectable to both the support base 20C and the support base 20D, the destination of the substrate S can be set to be The substrate S of a processing device PA1 moves to the second processing device PA2 and the third processing device PA3. Thereby, for example, when the transport speed of the substrate S of the second processing apparatus PA2 and the third processing apparatus PA3 is slower than the transport speed of the substrate S of the first processing apparatus PA1, the substrate S can be prevented from being in the second processing apparatus PA2 and The third processing device PA3 is in a state of waiting for processing.

此外，藉由在基板送出機構5及基板捲取機構6分別設置調節供應滾筒5b、回收滾筒6b之高度之升降機，而能調整從基板送出機構5至基板捲取機構6之基板S之高度或傾斜。此外，將於供應滾筒5b與回收滾筒6b間橫掛基板S之狀態稱為基板組(滾筒組)。 Further, by providing the elevators for adjusting the heights of the supply roller 5b and the recovery roller 6b in the substrate feeding mechanism 5 and the substrate winding mechanism 6, the height of the substrate S from the substrate feeding mechanism 5 to the substrate winding mechanism 6 can be adjusted or tilt. Further, a state in which the substrate S is traversed between the supply roller 5b and the recovery roller 6b is referred to as a substrate group (roller group).

如上所述，能在第一處理裝置PA1結束對第1基板組之基板S之處理，使第1基板組之回收滾筒及供應滾筒移動至支承台20B上後，將作為新的處理對象之第2基板組之供應滾筒及回收滾筒搬入第一處理裝置PA1。 As described above, the processing of the substrate S of the first substrate group can be completed in the first processing apparatus PA1, and the recovery drum and the supply roller of the first substrate group can be moved to the support table 20B, and the new processing target can be used. The supply roller and the recovery roller of the substrate group are carried into the first processing device PA1.

亦即，由於能調整將第1基板組搬入第二處理裝置PA2或第三處理裝置PA3之任一方之時點與將第2基板組搬入第一處理裝置PA1之時點，因此能依序處理複數個基板組。 In other words, since it is possible to adjust the timing at which the first substrate group is carried into the second processing device PA2 or the third processing device PA3 and the time when the second substrate group is carried into the first processing device PA1, it is possible to sequentially process a plurality of Substrate group.

又，藉由在第二處理裝置PA2、第三處理裝置PA3後亦設置如支承台20B之構成，而能將基板組搬入次一處理步驟之裝置(PA4)。 Further, by providing the support unit 20B after the second processing unit PA2 and the third processing unit PA3, the substrate group can be carried into the apparatus (PA4) of the next processing step.

進而，本實施形態之構成中，能在於基板送出機構5與基板捲取機構6之間橫掛基板S之狀態下使基板S在處理裝置PA(PA1、PA2、PA3)間移動於X方向。此情形下，作為各處理裝置(PA)之一例，係如圖8所示，為能分離成上部單元100A與下部單元100B之構成，在被施加Y方向之張力之狀態下，橫掛於基板送出機構5與基板捲取機構6間之基板S 能於X方向通過上部單元100A與下部單元100B間之空間之形態。 Further, in the configuration of the present embodiment, the substrate S can be moved between the processing devices PA (PA1, PA2, PA3) in the X direction while the substrate S is traversed between the substrate feeding mechanism 5 and the substrate winding mechanism 6. In this case, as an example of each processing device (PA), as shown in FIG. 8, the upper unit 100A and the lower unit 100B can be separated, and the tension is applied to the substrate while the tension in the Y direction is applied. Substrate S between the delivery mechanism 5 and the substrate take-up mechanism 6 It can pass through the space between the upper unit 100A and the lower unit 100B in the X direction.

於上部單元100A，下部單元100B之基板S之投入口側與退出口側設有用以導引基板S之滾筒101a,101b、102a,102b。各處理裝置PA中，上部單元100A與下部單元100B之任一方或兩方能藉由未圖示之升降機構於Z方向移動必要量。作為此種處理裝置PA，能使用印刷機(亦包含噴墨印表機)、電漿裝置、蒸鍍裝置、曝光裝置等。 In the upper unit 100A, the input port side and the exit port side of the substrate S of the lower unit 100B are provided with rollers 101a, 101b, 102a, 102b for guiding the substrate S. In each of the processing apparatuses PA, either or both of the upper unit 100A and the lower unit 100B can be moved by a necessary amount in the Z direction by an elevating mechanism (not shown). As such a processing apparatus PA, a printing machine (including an inkjet printer), a plasma apparatus, a vapor deposition apparatus, an exposure apparatus, or the like can be used.

Claims

一種製造系統，係將具有可撓性之長條片狀基板依序送至複數個處理裝置之各個，以於該片狀基板形成顯示元件或電子電路，其具備：基板送出機構，具有捲繞有前述片狀基板之供應滾筒，用以往前述複數個處理裝置中之第一處理裝置，將來自前述供應滾筒之前述片狀基板送出於沿著長條方向之第一方向；基板捲取機構，具有捲取前述片狀基板之回收滾筒，用於回收經前述第一處理裝置處理後之前述片狀基板；第一驅動部，使前述基板送出機構移動於與前述第一方向交叉之第二方向；第二驅動部，使前述基板捲取機構移動於前述第二方向；第三驅動部，使前述基板送出機構與前述基板捲取機構之至少一方移動於前述第一方向；以及控制部，在將前述片狀基板從前述第一處理裝置移至在前述第二方向分離之第二處理裝置時，係以前述基板送出機構與前述基板捲取機構均往前述第二方向移動之方式同步控制前述第一驅動部與前述第二驅動部，在依據前述處理裝置在前述第一方向之尺寸而改變前述基板送出機構與前述基板捲取機構在前述第一方向之間隔時，係控制前述第三驅動部。 A manufacturing system for sequentially feeding a flexible strip-shaped substrate to each of a plurality of processing devices for forming a display element or an electronic circuit on the sheet substrate, comprising: a substrate feeding mechanism having a winding a supply roller having the above-mentioned sheet substrate, wherein the first processing device of the plurality of processing devices is used to feed the sheet substrate from the supply roller in a first direction along a strip direction; a substrate take-up mechanism; a recovery roller having a sheet-like substrate wound thereon for recovering the sheet substrate processed by the first processing device; and a first driving portion for moving the substrate feeding mechanism in a second direction crossing the first direction a second driving unit that moves the substrate winding mechanism in the second direction; and a third driving unit that moves at least one of the substrate feeding mechanism and the substrate winding mechanism in the first direction; and the control unit When the sheet substrate is moved from the first processing device to the second processing device separated in the second direction, the substrate feeding mechanism and the substrate are fed out Simultaneously controlling the first driving unit and the second driving unit in such a manner that the substrate winding mechanism moves in the second direction, the substrate feeding mechanism and the substrate roll are changed according to the size of the processing device in the first direction. The picking mechanism controls the third driving portion when the first direction is spaced.

如申請專利範圍第1項之製造系統，其中，在藉由前述第三驅動部改變前述基板送出機構與前述基板捲取機構之前述間隔時，前述控制部，係以對橫掛於前述供應滾筒與前述回收滾筒間之前述片狀基板賦予張力之方式，控制前述基板送出機構與前述基板捲取機構。 The manufacturing system of claim 1, wherein the control unit is traversed by the supply roller when the interval between the substrate feeding mechanism and the substrate winding mechanism is changed by the third driving unit The substrate feeding mechanism and the substrate winding mechanism are controlled such that tension is applied to the sheet substrate between the recovery rolls.

如申請專利範圍第2項之製造系統，其中，前述控制部，在將捲繞於前述供應滾筒之前述片狀基板之前端捲繞於前述回收滾筒時，係以使前述基板送出機構與前述基板捲取機構接近之方式控制前述第三驅動部。 The manufacturing system of the second aspect of the invention, wherein the control unit is configured to cause the substrate feeding mechanism and the substrate to be wound around the front end of the sheet substrate wound around the supply roller The third drive unit is controlled in such a manner that the take-up mechanism approaches.

如申請專利範圍第1至3項中任一項之製造系統，其中，前述複數個處理裝置之各個，構成為能分離成位於前述片狀基板表側之上部單元與位於前述片狀基板背側之下部單元；前述控制部，在將前述片狀基板從前述第一處理裝置移至前述第二處理裝置時，係以前述片狀基板通過藉由前述上部單元與前述下部單元之分離而形成之空間內的方式，同步控制前述第一驅動部與前述第二驅動部。 The manufacturing system according to any one of claims 1 to 3, wherein each of the plurality of processing devices is configured to be separable to be located on an upper portion of the front side of the sheet substrate and on a back side of the sheet substrate. a lower unit; wherein the control unit moves the sheet substrate from the first processing device to the second processing device, and the sheet substrate passes through a space formed by separation of the upper unit and the lower unit In the internal mode, the first driving unit and the second driving unit are synchronously controlled.

如申請專利範圍第1至3項中任一項之製造系統，其具備：支承台，在前述第二方向配置於前述第一處理裝置與前述第二處理裝置之間，支承前述基板送出機構與前述基板捲取機構並能藉由升降機構在高度方向移動。 The manufacturing system according to any one of claims 1 to 3, further comprising: a support base disposed between the first processing device and the second processing device in the second direction, and supporting the substrate feeding mechanism and The substrate take-up mechanism can be moved in the height direction by the elevating mechanism.

如申請專利範圍第5項之製造系統，其中，前述複數個處理裝置包含相對前述第二處理裝置配置於在高度方向之不同位置之第三處理裝置；為了將經前述第一處理裝置處理後之前述片狀基板移至前述第二處理裝置與前述第三處理裝置之任一方，前述控制部係控制前述升降機構使前述支承台移動於高度方向。 The manufacturing system of claim 5, wherein the plurality of processing devices include a third processing device disposed at a different position in a height direction from the second processing device; for processing by the first processing device The sheet substrate is moved to one of the second processing device and the third processing device, and the control unit controls the lifting mechanism to move the support table in the height direction.