TWI689411B - 薄樹脂膜及其於疊層中之用途 - Google Patents
薄樹脂膜及其於疊層中之用途 Download PDFInfo
- Publication number
- TWI689411B TWI689411B TW104122633A TW104122633A TWI689411B TW I689411 B TWI689411 B TW I689411B TW 104122633 A TW104122633 A TW 104122633A TW 104122633 A TW104122633 A TW 104122633A TW I689411 B TWI689411 B TW I689411B
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- Taiwan
- Prior art keywords
- base layer
- layer
- planar surface
- circuit board
- resin
- Prior art date
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Abstract
本發明提供經改良樹脂膜產物,該樹脂膜產物包含厚度在1密耳至約10密耳之範圍內且安置於兩個保護層之間之經部分固化之b階段化樹脂膜;以及其製造方法及在生產用於製造印刷電路板之疊層中之用途。
Description
本申請案主張於2014年7月10號申請之臨時申請案第62/023,154號之優先權,其全文以引用方式併入本文中。
本發明係關於樹脂膜產物,其可用於製造用於製造印刷電路板之疊層且包含厚度在約1密耳至約10密耳之範圍內且安置於兩個保護層間之經部分固化之b階段化樹脂膜;以及其製造方法及用途。
隨著電子器件之需求增加,製造此等器件之速度亦必須增加。為了增加製造速度,生產中之步驟必須係有效的。大多數電子器件包括在製造製程期間需要細節注意之小的複雜電路板。由於薄樹脂壓層物之使用,使得生產電路板之製造製程尤其困難。具體而言,必要的係此等樹脂壓層物保持不含污染物且填充電路板組件間之所有間隙,使得電路板無空隙。此外,樹脂壓層物必須在製造製程期間在時間敏感階段固化。因此,仍需要印刷電路板產品及改良製造製程之速度及效率之方法。
在一廣泛態樣中,本發明提供樹脂膜產物,其包含具有第一平面表面及第二平面表面之b階段樹脂基底層、安置於該基底層之第一平面表面上之第一保護層及安置於該基底層之第二平面表面上之第二
保護層,其中該基底層具有約1密耳至約10密耳之厚度。
在另一態樣中,本發明提供製造樹脂膜產物之方法,其包含以下步驟:提供樹脂膜產物,其包含:具有第一平面表面及第二平面表面之b階段化樹脂基底層及安置於基底層之第一平面表面上之保護層,其中基底層具有約1密耳至約10密耳之厚度;將印刷電路板基板之暴露內層材料表面加熱;施加基底層之未經保護之第二平面表面抵靠印刷電路板基板之經加熱之暴露內層材料表面以形成印刷電路板疊層;及將印刷電路板疊層冷卻。
本發明之再另一態樣係製造樹脂膜產物之方法,其包含以下步驟:提供樹脂膜產物,其包含:具有第一平面表面及第二平面表面之b階段化樹脂基底層、安置於基底層之第一平面表面上之第一保護層及安置於基底層之第二平面表面上之第二保護層,其中基底層具有約1密耳至約10密耳之厚度;將印刷電路板基板之暴露內層材料表面加熱;自基底層之第二平面表面去除第二保護層;施加基底層之第二平面表面抵靠印刷電路板基板之經加熱之暴露內層材料表面以形成印刷電路板疊層;及將印刷電路板疊層冷卻。
10‧‧‧樹脂膜產物
11‧‧‧第一平面表面
12‧‧‧基底層
13‧‧‧第二平面表面
14‧‧‧第一保護層
16‧‧‧第二保護層
20‧‧‧疊層
22‧‧‧疊層
23‧‧‧間隙或通孔
24‧‧‧疊層
26‧‧‧疊層
27‧‧‧緩衝層
28‧‧‧印刷電路板基板
30‧‧‧印刷電路板基板
32‧‧‧基底層
33‧‧‧通孔
34‧‧‧保護層
36‧‧‧內層材料
37a‧‧‧銅跡線
37b‧‧‧銅跡線
37c‧‧‧銅跡線
37d‧‧‧銅跡線
40‧‧‧印刷電路板基板
42‧‧‧基底層
46‧‧‧內層材料
47‧‧‧銅箔層
50‧‧‧印刷電路板基板
52‧‧‧基底層
53‧‧‧通孔
56‧‧‧內層材料
57a‧‧‧銅箔層
57b‧‧‧銅箔層
60‧‧‧印刷電路板基板
62‧‧‧基底層
66‧‧‧內層材料
67a‧‧‧銅箔跡線
67b‧‧‧銅箔跡線
圖1係根據實例性實施例之樹脂膜產物(10)之側視圖,其包括含有經部分固化之b階段化樹脂膜之基底層(12),該基底層具有第一平面表面(11)及第二平面表面(13)且安置於第一保護層(14)及第二保護層(16)之間。
圖2A係根據實例性實施例之疊層(20)之側視圖,其包括具有基底層(12)及第一保護層(14)以及包括間隙或通孔(23)之印刷電路板基板(28)之內層材料表面之樹脂膜產物;圖2B係根據實例性實施例之疊層(22)之側視圖,其包括具有基底層(12)及第一保護層(14)以及印刷電路板基板(28)之內層材料表面之
樹脂膜產物,其中基底層(12)施加至內層材料表面;圖2C係根據實例性實施例之疊層(24)之側視圖,其包括具有基底層(12)及第一保護層(14)以及印刷電路板基板(28)之內層材料表面之樹脂膜產物,其中將內層材料表面加熱以允許基底層(12)填充位於內層材料表面上之間隙(23)中;圖2D係根據實例性實施例之疊層(26)之側視圖,其包括具有基底層(12)及印刷電路板基板(28)之內層材料表面之樹脂膜產物,其中已將第一保護層去除,位於內層材料上之間隙(23)已由基底層(12)填充,「緩衝層」(27)將印刷電路板基板(28)之內層材料與基底層(12)之頂部平面表面分離,且疊層(26)已冷卻且隨後固化基底層(12);圖3係根據實例性實施例之印刷電路板基板(30)之側剖視圖,其包括用於填充銅跡線(37a、37b、37c、37d)間之通孔(33)之基底層(32)、呈經玻璃強化之環氧核心材料形式之內層材料(36)及呈經樹脂系統預浸漬之經強化織物(「預浸體」)形式之保護層(34);圖4係根據實例性實施例之印刷電路板基板(40)之側剖視圖,其包括作為銅箔層(47)、呈經玻璃強化之環氧核心材料形式之內層材料(46)間之黏合板之基底層(42)及呈預浸體形式之保護層(44);圖5係根據實例性實施例之印刷電路板基板(50)之側剖視圖,其包括已填充銅箔層(57a、57b)與呈經玻璃強化之環氧核心材料形式之內層材料(56)間之通孔(53)之基底層(52);及圖6係根據實例性實施例之印刷電路板基板(60)之側剖視圖,其包括已填充銅箔跡線(67a、67b、67c、67d)與呈經玻璃強化之環氧核心材料形式之內層材料(66)間之間隙之基底層(62)。
本發明係關於包含基底層(12)之樹脂膜產物,其包括基於各種樹脂系統(例如環氧樹脂、經填充、未填充、高Tg、中等Tg、導熱、無
鹵素、溴化等)之樹脂膜。樹脂膜經部分固化至b階段化狀態且位於第一保護層(14)(例如第一聚酯膜)與第二保護層(16)(例如第二聚酯膜)之間,如圖1中所示。本發明亦係關於使用樹脂膜產物以製造用於生產印刷電路板之疊層之方法。
圖1係本發明樹脂膜產物(10)之側視圖,其包括含有經部分固化之b階段化樹脂膜之基底層(12)、第一保護層(14)及第二保護層(16)。本發明樹脂膜產物可形成為個別板或捲材,該等板隨後可切割為期望形狀。在一些實例性實施例中,第一保護層(14)及第二保護層(16)之長度及/或寬度超出基底層(12)之長度及/或寬度。該等板及捲材在X及Y維度之一或二者中可具有自僅幾英吋至3或4英尺或更大之任何有用尺寸。
或者,可將樹脂膜產物以基底層(12)之僅一個表面(例如第二平面表面(13))將需要第一保護層(14)之此方式捲起。在實例構形中,當未捲起時,基底層(12)之第一平面表面(11)將保持暴露,而基底層(12)之第二平面表面(13)由第二保護層(16)保護。然後,當捲起時,第二保護層(16)將用以保護基底層(12)之第一平面表面(11)及第二平面表面(13)二者。
含有經部分固化之b階段化樹脂膜之基底層(12)可基於許多不同之樹脂系統,該等可與用於製造印刷電路板(PCB)之預浸漬複合纖維(「預浸體」)及壓層物結合使用。此等樹脂系統可尤其包括(但不限於)環氧、經填充、未填充、高Tg、中等Tg、導熱、無鹵素及鹵化之樹脂系統。
於本申請案之上下文中使用術語「樹脂」以一般指現在或將來可用於製造印刷電路板之壓層物之生產及其他電子應用之任何可固化樹脂系統。更經常地,使用環氧樹脂以製得此等壓層物。術語「環氧樹脂」一般指含有環氧乙烷環之化合物之可固化組合物,如在C.A.
May,Epoxy Resins,第2版,(New York & Basle:Marcel Dekker Inc.),1988中所述。將一或多種環氧樹脂添加至樹脂系統以提供經固化樹脂及自其製得之壓層物之期望基本機械及熱性質。有用之環氧樹脂係彼等為熟習此項技術者已知可用於製造電子複合物及壓層物之樹脂系統者。
在較佳實施例中,樹脂膜係基於環氧樹脂系統。可使用各種環氧樹脂。舉例而言,環氧樹脂可係酚型環氧樹脂、胺型環氧樹脂、酚醛型環氧樹脂及脂肪族型環氧樹脂。其他類型環氧樹脂同樣係可用的。有用之環氧樹脂之一些實例包括酚型環氧樹脂,例如彼等基於雙酚A之二縮水甘油基醚、基於酚-甲醛酚醛或甲酚-甲醛酚醛之聚縮水甘油醚、基於叁(對-羥基苯酚)甲烷之三縮水甘油基醚或基於四苯基乙烷之四縮水甘油基醚者;胺型環氧樹脂,例如彼等基於四縮水甘油基-亞甲基二苯胺或基於p-胺基乙二醇之三縮水甘油基醚者;及環脂肪族型,例如彼等基於3,4-環氧環己烷甲酸3,4-環氧環己基甲基酯者。術語「環氧樹脂」亦代表含有過量環氧樹脂(例如上文所提及類型)之化合物與芳香族二羥基化合物之反應產物。此等化合物可經鹵素-取代。較佳者係雙酚A之衍生物之環氧樹脂、尤其FR-4。FR-4係藉由將過量雙酚A二縮水甘油基醚與四溴雙酚A之推進反應製得。亦可應用環氧樹脂與雙馬來醯亞胺樹脂、氰酸酯樹脂及/或雙馬來醯亞胺三嗪樹脂之混合物。
在如本文所述本發明之某些實例中,基底層(12)可含有填充劑,例如有機填充劑。當使用填充劑時,其可以在無溶劑或乾燥基礎上併入樹脂系統之成份之約5重量%至55重量%之範圍內之量存在於基底層(12)中。在替代實施例中,填充劑可以約15重量%至40重量%之範圍內之量存在於基底層(12)中。在再其他實施例中,填充劑可以約25重量%至約55重量%之範圍內之量存在於基底層(12)中。另外,基底層
(12)可含有無機惰性微粒填充劑,例如氫氧化鎂、矽酸鎂(滑石(talcum,talc))、二氧化矽及三水合鋁。併入基底層(12)之無機惰性微粒填充劑(例如滑石)之量可在5重量%至約20重量%之範圍內。在其他實施例中,基底層(12)亦可包括導熱填充劑及無機/有機纖維,例如氮化硼或氮化鋁。此等導熱填充劑在發光二極體(LED)技術中係尤其有用的,此乃因其存在消除對於傳導絕緣體之需要,因此延長LED之壽命。在再其他實施例中,基底層(12)可包括上文所提及填充劑之任何組合。
基底層(12)亦可包括起始劑或觸媒、一或多種可選阻燃劑及溶劑。阻燃劑可係已知可用於用於製造用於製造印刷電路板之預浸體及壓層物之樹脂組合物中之任何阻燃劑材料。該(等)阻燃劑可含有鹵素或其可不含鹵素。或者,或另外,樹脂可在其主鏈結構中包括鹵素(例如溴)以賦予經固化樹脂阻燃性質。
在基底層(12)之製造期間,可使用溶解適當樹脂組合物成份、控制樹脂黏度或將樹脂成份維持呈懸浮分散液之一或多種溶劑。可使用為熟習此項技術者已知之可與熱固性樹脂系統結合使用之任何溶劑。尤其有用之溶劑包括甲基乙基酮、甲苯、二甲基甲醯胺、二異丁基酮、丙二醇甲醚、丙二醇甲醚乙酸酯、丙二醇正丁基醚或其混合物。在製造製程期間,然後可將此等溶劑自樹脂系統去除以形成基底層(12)。去除可藉助使用熱、紫外光或紅外光而發生。因此,當在本文列示基底層(12)之重量百分比量時,除非另外說明,否則其係在乾燥-無溶劑之基礎上報告。
樹脂組合物亦可包括聚合起始劑或觸媒。當使用觸媒時,其可以約0.05重量%至約0.20重量%之範圍內之量存在於基底層(12)中。一些有用起始劑或觸媒之實例包括(但不限於)過氧化物或偶氮型聚合起始劑。一般而言,所選起始劑或觸媒可係已知可用於樹脂合成或固化
中(不論其是否執行此等功能中之一者)之任何化合物。
樹脂組合物可包括多種其他可選成份,其包括填充劑、增韌劑、助黏劑、消泡劑、整平劑、染料及顏料。此等可選成份當使用時可以5%至約10%之範圍內之量存在於基底層(12)中。舉例而言,可將螢光染料以痕量添加至樹脂組合物以使自其製備之壓層物當暴露於電路板商店之光學檢查設備中之UV光時發螢光。為熟習此項技術者已知之可用於製造印刷電路板壓層物之樹脂中之其他可選成份亦可包括於本發明樹脂組合物中。
本發明之一實施例係包含約70重量%至約90重量%樹脂基質、約6重量%至約10重量%增韌劑及約5重量%至約20重量%填充劑之基底層(12)。
基底層(12)之厚度可有所變化。在實例性實施例中,基底層(12)之厚度可在約0.1密耳至約3密耳之範圍內。在某些實施例中,厚度可超過3密耳且可達到13密耳之厚度。在實例性實施例中,基底層(12)之厚度可在0.1密耳至1密耳之範圍內。在再其他實施例中,基底層
(12)之厚度可在約1密耳至2密耳之範圍內。最後,在其他實施例中,基底層(12)之厚度可在約2密耳至約3密耳之範圍內。在較佳實施例中,樹脂膜之厚度係1、2或3密耳。當加熱時,基底層(12)之黏度亦可尤其基於樹脂膜之厚度來控制。一般而言,基底層(12)之黏度將隨基底層(12)之厚度增加而增加。
如上文所述,保護層(14、16)係與基底層(12)之第一平面表面(11)及第二平面表面(13)結合。第一保護層(14)及第二保護層(16)可係相同或不同類型之板材料。在某些實施例中,保護層(14、16)較佳係保護基底層(12)免於損壞、污染及進一步交聯之便宜之可棄式材料。
在實例性實施例中,保護層(14、16)包含聚酯板或材料。在再其他實例性實施例中,第一保護層(14)或第二保護層(16)可係金屬箔。舉例而言,保護層(14、16)可係由銅箔、鋁箔、錫箔、或金箔或其混合物構成。熟習此項技術者將理解其他金屬及非金屬箔同樣係可用的。此外,其他聚合或板材料(例如經聚合物塗佈或浸漬之紙板及經樹脂系統預浸漬之經強化織物(「預浸體」))係可用的。在較佳實施例中,保護層(14、16)之一或二者包含聚對苯二甲酸乙二酯(PET)。舉例而言,可使用由聚對苯二甲酸乙二酯製得之雙軸定向膜(例如Hostaphan®)。在再其他實施例中,第一保護層(14)可係由聚酯板構成,同時第二保護層(16)可係金屬箔。其他組合同樣係可用的。
保護層(14、16)之厚度可有所變化。舉例而言,在一實施例中,第一保護層(14)及/或第二保護層(16)之厚度可在約1密耳至約5密耳或更大之範圍內。在實例性實施例中,在用於形成保護層(14、16)之材料係聚酯板或膜之情況下,厚度可在約3密耳至4密耳之範圍內。第一保護層(14)及/或第二保護層(16)之厚度可大於或小於基底層(12)之厚度。此外,保護層(14,16)之厚度可彼此不同。
構成保層(14、16)之材料可選自可易於自基底層(12)去除而不損
壞第一平面表面(11)及/或第二平面表面(13)之材料。在其他實施例中,第一保護層(14)或第二保護層(16)可係不可去除之材料,例如「預浸體」,其係已經b階段化樹脂系統預浸漬之經強化織物。預浸體可尤其包括經樹脂浸漬之編織或非編織強化物,例如玻璃纖維、碳纖維及聚芳醯胺。同樣,預浸體可係熱固性預浸體或熱塑性預浸體。舉例而言,熱固性預浸體可包括主要樹脂基質(例如環氧樹脂),其完全浸漬纖維強化系統(例如玻璃布)。樹脂可經固化以產生完全固化之樹脂背襯層,或經部分固化以產生經凝固之預浸體板。亦可使用包括經聚合物塗佈或浸漬之紙板之其他聚合材料或板材料。
如上所述之包括基底層(12)、第一保護層(14)及可選第二保護層(16)之樹脂膜產物(10)可分批或以連續製程製造。在實例性實施例中,基底層(12)可經形成並b階段化,然後將其與第一保護層(14)及/或第二保護層(16)合併。基底層(12)可使用熟習此項技術者瞭解之多種方法來製備。舉例而言,基底層(12)可藉由將期望之樹脂成份(例如彼等上文所述者)與溶劑組合以形成樹脂系統來形成。然後,樹脂系統可藉助使用熱、紅外光或紫外光經部分固化至b階段化狀態以形成基底層(12)。在一實施例中,當經部分固化至b階段化狀態時,約0.5%至約3%之範圍內之溶劑可保留在基底層(12)中。最後,可施加保護層(14、16)。其他固化方法同樣係可用的。部分固化可係有利的,此乃因其使得基底層(12)在冷卻時係非黏性的且觸摸不發黏。
在替代實施例中,可形成基底層(12)並在將基底層(12)與第一保護層(14)或第二保護層(16)合併後b階段化。舉例而言,基底層(12)可藉由將期望之樹脂成份與溶劑組合以形成樹脂系統來形成。然後,可使用狹縫式模具或其他相關塗佈技術以受控之厚度將樹脂系統施加至第一保護層(14)或第二保護層(16)之表面。然後樹脂系統可經部分固化至b階段化狀態以形成基底層(12)。最後,可將剩餘之保護層(14、
16)施加於基底層(12)之暴露表面上。
在用於製造樹脂膜產物(10)之實例性製程中,可將樹脂系統之薄層施加至自驅動輥連續解繞之第一保護層(14)之表面以形成基底層(12)。然後,使經組合之基底層(12)及第一保護層(14)穿過固化站,在此處熱或光係引導至基底層(12)處以自基底層(12)去除大部分溶劑,使得基底層(12)含有0.5重量%至約3重量%之溶劑,由此使得基底層(12)在「B」階段部分固化。一旦基底層(12)已部分固化,則可將第二保護層(16)施加至基底層(12)之暴露平面表面上,以此消除灰塵或其他材料以污染基底層(12)之表面之任何機會。在一實施例中,使用作為第二保護層之材料係預浸體。
本發明之另一態樣係樹脂膜產物(10)在生產用於製造印刷電路板之疊層中之用途。特定而言,可使用基底層(12)用於重銅填充、通孔填充、作為黏合膜或作為用於印刷電路板之高導熱黏合膜。
如在圖1中所圖解說明,形成本發明之樹脂膜產物(10)。該樹脂膜產物包括包含b階段化樹脂膜之基底層(12),該基底層具有(例如)在1密耳與10密耳間之厚度且在室溫下可係觸摸不發黏的。基底層(12)係安置於第一保護層(14)與第二保護層(16)之間。
在某些實施例中,樹脂膜產物(10)經切割成期望之形狀或幾何圖形以覆蓋位於印刷電路板上之所選擇組件。當切割樹脂膜產物時,基底層(10)周圍之保護層(14、16)之存在抑制灰塵之散發、基底層(12)之破裂或基底層(12)被外來材料污染之風險。保護層(14、16)亦提供基底層(12)之安全及方便處置。
一旦樹脂膜產物經切割或形成為期望之形狀,則可將基底層(12)施加至電路板基板(例如內層材料表面),該電路板基板可包括或不包括一或多個三維特徵,例如間隙、通孔、電路、跡線及/或其他電子組件。在某些實施例中,內層材料可包含經玻璃強化之環氧核心材料
(例如多層預浸體)。
在實例性實施例中,位於電路板基板之內層材料表面上之一或多個三維特徵可包括由在約0.5oz至12oz之範圍內之銅箔製得之銅箔跡線。該等銅箔跡線之厚度基於用於形成其之銅箔重量而有所變化。舉例而言,1oz銅箔具有35微米之厚度,10oz銅箔具有350微米之厚度,且12oz銅箔具有400微米之厚度。其他重量及厚度同樣係可用的。一般而言,越重之銅箔且由此越厚之銅箔跡線提供印刷電路板之越好的溫度控制。亦可使用位於電路板基板之內層材料表面上之其他類型之電子組件。
當在電路板之內層材料表面上製造電路時,亦可在銅去除之位置中形成三維特徵(例如間隙或通孔)。舉例而言,在圖2A中圖解說明間隙(23)。本發明基底層(12)之一種用途係將基底層(12)施加至內層材料以填充及/或覆蓋位於電路板基板(28)之內層材料表面上之間隙、通孔或任何其他類型之三維特徵。
如在圖2A中所示,為了將基底層(12)黏附至電路板基板(28)之內層材料表面,可自基底層(12)去除第一保護層(14)或第二保護層(16)以暴露基底層(12)之未經保護之表面。在實例性實施例中,此步驟可在即將將樹脂膜產物(20)施加至印刷電路板基板(28)時發生。此使材料保持潔淨且免於污染。
如在圖2B中所示,可將樹脂膜產物(22)定位於印刷電路板基板(28)之暴露內層材料表面上並施加至其。為確保基底層(12)黏附至印刷電路板基板(28)之內層材料表面上,當將基底層(12)施加至印刷電路板基板(28)時,內層材料表面可充分升溫以使基底層(12)液化及變黏。建議將內層材料表面加熱至約40℃至90℃且較佳地50℃至60℃之溫度。此外,可將壓力施加至樹脂膜產物以確保至印刷電路板基板之黏附。
如在圖2C中所示,電路板基板(28)之經升溫內層材料將基底層(12)之b階段化樹脂液化且使其流動並黏附至內層材料表面。基底層(12)之經液化b階段化樹脂亦可覆蓋及填充位於印刷電路板基板(28)之內層材料表面上之間隙(23)、通孔及其他三維特徵。間隙、通孔或其他三維特徵可實質上經填充,使得90%或更多空隙三維空間由流動基底層樹脂填充。一旦流動基底層樹脂填充間隙、通孔或三維特徵,則其基本上係無空隙的。同樣地,電子組件可實質上經覆蓋,使得不暴露電子組件之剖面。剩餘之保護層(14)或預浸體可保留在基底層(12)上。使所得疊層冷卻至室溫,此時基底層(12)保持黏附至內層表面,但觸摸不再發黏。
當加熱時,由於基底層(12)正黏附至電路板基板(28)之內層材料表面,故可藉由將壓力施加至基底層(12)來幫助基底層樹脂之流動。舉例而言,施加更多壓力至基底層(12)可使基底層樹脂之流動增加。同樣地,基底層樹脂之流動可藉由自上面加熱基底層(12)來幫助。舉例而言,可將熱空氣引導朝向基底層(12)以加熱基底層樹脂,以此增加流動。在某些實施例中,將所有熱自上面施加至基底層(12)。
如在圖2D中所示,基底層(12)上剩餘之保護層可保留或去除,留下黏附至電路板基板(28)之特定切割之非黏性b階段化樹脂層。在較佳實施例中,基底層(12)一旦黏附,則產生後續層可黏附至其之稱作「緩衝層」(27)的平面表面。「緩衝層」之厚度可有所變化,但應足夠厚以在隨後黏附至基底層(12)之平面表面之任何材料(例如預浸體)與電路板基板(28)(尤其銅跡線)之間充當分隔層。舉例而言,可將黏合板施加至基底層(12)之新暴露表面或「緩衝層」之頂部平面表面,使得黏合板不與電路板基板接觸。在其他實施例中,在不存在間隙或通孔之情況下,基底層(12)可用作黏合板。
樹脂膜產物在印刷電路板基板中之用途之實例係在圖3-6中圖解
說明。
舉例而言,圖3係印刷電路板基板(30)之側剖視圖,其包括用於填充位於銅跡線(37c、37d)間之通孔之經部分固化b階段化基底層(32)。呈經玻璃強化之環氧核心材料形式之內層材料(36)係位於銅跡線(37a、37b、37c、37d)之間。最後,將呈經樹脂系統預浸漬之經強化織物形式之保護層(34)黏附至基底層之表面。
圖4係印刷電路板基板(40)之側剖視圖,其包括在銅箔層(47)、呈經玻璃強化之環氧核心材料形式之內層材料(46)之間作為黏合板之基底層(42)與呈預浸體形式之保護層(44)。基底層(42)亦可用於填充在印刷電路板基板中所產生之任何間隙或通孔。基底層(42)可進一步藉由「C」-階段化如本文所述之樹脂膜產物之「B」-階段化樹脂基底層來固化。
圖5係印刷電路板基板(50)之側剖視圖,據此其包括用於填充在銅箔層(57a、57b)間之通孔之經部分固化b階段化基底層(52)。同樣,呈經玻璃強化之環氧核心材料形式之內層材料(56)係夾在兩個銅箔層之間。在印刷電路板基板上形成銅電路期間,可產生通孔。一旦經部分固化之「B」階段化基底層(52)填充通孔,其可隨後經完全固化或「C」-階段化。
最後,在圖6中圖解說明印刷電路板基板(60)之側剖視圖印刷電路板基板(60)包括用於填充銅箔跡線(67a、67b)與呈經玻璃強化之環氧核心材料形式之內層材料(66)間之間隙之經部分固化之b階段化基底層(62)。類似於上文所說明之實例,一旦印刷電路板基板中之間隙或通孔經填充,則隨後經部分固化「B」-階段化樹脂基底層(62)可經完全固化或「C」-階段化。
10‧‧‧樹脂膜產物
11‧‧‧第一平面表面
12‧‧‧基底層
13‧‧‧第二平面表面
14‧‧‧第一保護層
16‧‧‧第二保護層
Claims (19)
- 一種樹脂膜產物,其包含:具有第一平面表面及第二平面表面之b階段化樹脂基底層,其中該基底層具有1密耳至2密耳之厚度;安置於該基底層之該第一平面表面上之第一保護層;及安置於該基底層之該第二平面表面上之第二保護層;其中該第一保護層及該第二保護層包含雙軸定向之聚對苯二甲酸乙二酯,並具有約1密耳至約5密耳之厚度,且該第一保護層及該第二保護層係經組態而可與該基底層分離。
- 如請求項1之樹脂膜產物,其中該基底層係由選自由以下組成之群之樹脂製得:環氧樹脂、經填充樹脂、未填充樹脂、高Tg樹脂、中等Tg樹脂、導熱樹脂、經鹵素取代之樹脂、非鹵化樹脂或其混合物。
- 如請求項1或2之樹脂膜產物,其中該基底層係由包括增韌劑之樹脂製得。
- 如請求項1或2之樹脂膜產物,其中該基底層係由包括填充劑材料之樹脂製得。
- 如請求項4之樹脂膜產物,其中該填充劑材料係滑石。
- 一種製造樹脂膜產物之方法,其包含包括以下步驟:提供樹脂膜產物,其包含:具有第一平面表面及第二平面表面之b階段化樹脂基底層;及安置於該基底層之該第一平面表面上之保護層,其中該基底層具有約1密耳至約3密耳之厚度;加熱印刷電路板基板之暴露內層材料表面至約50℃至約60℃之溫度; 施加該基底層之該未經保護之第二平面表面抵靠該印刷電路板基板之該經加熱之暴露內層材料表面以形成印刷電路板疊層;及冷卻該印刷電路板疊層。
- 如請求項6之方法,其進一步包含將安置於該基底層之該第一平面表面上之該保護層去除之步驟。
- 如請求項6或7之方法,其進一步包含在將該基底層之該未經保護之第二平面表面施加至該印刷電路板基板之該經加熱之暴露內層材料表面之後,將黏合板黏附至該第一平面表面之步驟。
- 如請求項6或7之方法,其進一步包含將該樹脂膜完全固化至「C」階段化狀態之步驟。
- 如請求項6或7之方法,其中該基底層之該第二平面表面係於加壓下施至該印刷電路板基板之該經加熱暴露內層材料表面。
- 如請求項6或7之方法,其進一步包含以該基底層填充位於該印刷電路板基板中之至少一個間隙之步驟,其中該填充至少一個間隙之步驟係在將該基底層之該未經覆蓋之第二平面表面施加至該印刷電路板基板之該經加熱層材料表面後發生。
- 如請求項11之方法,其中該至少一個間隙係用該基底層實質上填充。
- 一種製造樹脂膜產物之方法,其包含包括以下步驟:提供樹脂膜產物,其包含:具有第一平面表面及第二平面表面之b階段化樹脂基底層;安置於該基底層之該第一平面表面上之第一保護層;及安置於該基底層之該第二平面表面上之第二保護層,其中該基底層具有約1密耳至約3密耳之厚度;加熱印刷電路板基板之暴露內層材料表面至約50℃至約60℃之溫度; 自該基底層之該第二平面表面去除該第二保護層;施加該基底層之該第二平面表面抵靠該印刷電路板基板之該經加熱之暴露內層材料表面以形成印刷電路板疊層;及冷卻該印刷電路板疊層。
- 如請求項13之方法,其進一步包含在施加該基底層之該第二平面表面抵靠該印刷電路板基板之該經加熱之暴露內層材料表面後,將安置於該基底層之該第一平面表面上之該第一保護層去除之步驟。
- 如請求項13或14之方法,其進一步包含在將安置於該基底層之該第一平面表面上之該第一保護層去除後,將黏合板黏附至該第一平面表面之步驟。
- 如請求項15之方法,其中該黏合板係預浸體材料。
- 如請求項13或14之方法,其中該基底層之該第二平面表面至該印刷電路板基板之該經加熱之暴露內層材料表面之該施加係使用壓力實施。
- 如請求項13或14之方法,其進一步包含將位於該印刷電路板基板中之至少一個間隙用該基底層填充之步驟,其中填充至少一個間隙之該步驟係在將該基底層之該未經覆蓋之第二平面表面施加至該印刷電路板基板之該經加熱層材料表面後發生。
- 如請求項18之方法,其中該至少一個間隙係用該基底層實質上填充。
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