TWI680555B - 電子模組 - Google Patents
電子模組 Download PDFInfo
- Publication number
- TWI680555B TWI680555B TW107123860A TW107123860A TWI680555B TW I680555 B TWI680555 B TW I680555B TW 107123860 A TW107123860 A TW 107123860A TW 107123860 A TW107123860 A TW 107123860A TW I680555 B TWI680555 B TW I680555B
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- Prior art keywords
- substrate
- electronic component
- extension
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- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 173
- 239000004020 conductor Substances 0.000 claims description 27
- 238000004806 packaging method and process Methods 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 description 21
- 230000001070 adhesive effect Effects 0.000 description 21
- 230000000694 effects Effects 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000191 radiation effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
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- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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Abstract
本發明的電子模組,包括:基板(11、21);設置在所述基板(11、21)的另一側的另一側電子部件(18、23);設置在所述基板(11、21)的一側的一側電子部件(13、28);在所述基板(11、21)的另一側延伸至所述基板(11、21)的邊緣外部的另一側延伸部(119a、129a);在所述基板(11、21)的一側延伸至所述基板(11、21)的邊緣外部的一側延伸部(119b、129b);在所述基板(11、21)的邊緣外部的所述延伸部(119a、129a);以及與所述一側延伸部(119b、129b)連接的連接部(118、128);進一步包括具有連接部(118、128)的連接端子(11、125)。
Description
本發明涉及一種具備電子部件的電子模組。
以往,在封裝樹脂內配置有多個電子部件的電子模組已被普遍認知(例如,參照特開2014-45157號)。這種電子模組一般是被連接在控制基板等外部裝置上的。
例如將控制基板等外部裝置配置在電子模組的一側(表面側)的情況下,電子模組的端子朝著一側延伸,並與外部裝置相連接。在這種形態下,佈線距離將會變長,電阻或者電抗也會隨之增加,從而導致因噪音產生故障的情況。
鑒於上述情況,本發明的目的在於提供一種電子模組,其能夠防止上述提到過的因電阻或電抗的增加,從而導致因噪產生的故障。
本發明涉及的電子模組,可以包括:
基板;
另一側電子部件,配置在所述基板的另一側上;
一側電子部件,配置在所述基板的一側上;以及
連接端子,具有:在所述基板的另一側延伸至所述基板邊緣外部的另一側延伸部、在所述基板的一側延伸至所述基板邊緣外部的一側延伸部、以及在所述基板的邊緣外部將所述另一側延伸部與所述一側延伸部相連接的連接部,並且所述連接端子將所述另一側電子部件與所述一側電子部件電連接。
在本發明涉及的電子模組中,可以是:
所述基板具有第一基板、以及配置在所述第二基板的一側上的第二基板,
所述另一側電子部件具有配置在所述第二基板的另一側上的另一側第二電子部件,
所述一側電子部件具有:配置在所述第二基板的一側上的一側第二電子部件,
所述連接端子具有:在所述第二基板的另一側上延伸至所述第二基板的邊緣外部的另一側第二延伸部、在所述第二基板一側上延伸至所述第二基板的邊緣外部的一側第二延伸部、以及在所述第二基板的邊緣外部將所述另一側第二延伸部與所述一側第二延伸部相連接的第二連接部、並且具有將所述另一側第二電子部件與所述一側第二電子部件電連接的第二連接端子。
在本發明涉及的電子模組中,進一步包括:
設置在第一基板的一側上的第一電子部件;以及
設置在所述第一基板側上,並且與所述第一電子部件電連接的第一端子部,
其中,所述第一端子部具有:沿所述第一基板的面方向延伸的第一面方向延伸部、以及設置在所述第一面方向延伸部的端部上的,並且向一側或者另一側延伸的第一法線方向延伸部。
在本發明涉及的電子模組中,可以是:
所述第一法線方向延伸部,在比所述第二連接部更靠近邊緣外部的位置上朝一側延伸。
在本發明涉及的電子模組中,可以是:
所述基板具有:第一基板、以及設置在所述第一基板的一側上的第二基板,
所述另一側電子部件具有:設置在所述第一基板的另一側上的另一側第一電子部件,
所述一側電子部件具有:設置在所述第一基板的一側上的一側第一電子部件,
所述連接端子具有:在所述第一基板的另一側延伸到所述第一基板的邊緣外部的另一側第一延伸部、在所述第一基板的一側延伸至所述第一基板的邊緣外部的一側第一延伸部、以及在所述第一基板的邊緣外部將所述另一側第一延伸部與所述一側第一延伸部連接的第一連接部,並且還具有:將所述另一側第一電子部件與所述一側第一電子部件電連接的第一連接端子。
在本發明發明涉及的電子模組中,可以是:
所述基板具有:第一基板、以及設置在所述第一基板的一側上的第二基板,
電子模組進一步具有:設置在所述第二基板側上的、與所述第二電子部件電連接的第二端子部,
所述第二端子部具有:沿所述第二基板的面方向延伸的第二面方向延伸部、以及設置在所述第二面方向延伸部的端部上的,並且向一側或另一側延伸的第二法線方向延伸部。
發明效果
藉由利用本發明的連接端子,就能夠使用基板的一側的面與另一側的面兩方面進行電子部件的配置。還有,由於可以將這些電子部件用連接端子連接,因此能夠縮短電子部件間的距離,從而防止因電阻與電抗的增加,引起的因噪音導致的故障。再有,由於不用在第二基板上設置類似於連接第二基板一側與另一側的通孔,所以對於製造製程的簡化也是很有幫助的。
第一實施方式
《構成》
在本實施方式中,“一側”指的是第1圖中的上方側,“另一側”指的是第1圖中的下方側。另外,將第1圖中的上下方向稱為“第一方向”、 左右方向稱為“第二方向”、紙面的表裡方向稱為“第三方向”。將包含第二方向以及第三方向的面內方向稱為“面方向”,將從一側的方向進行觀看稱為“從平面看”。
如本實施方式及後述其他的實施方式所示,電子部件具有:配置在基板11、21的另一側的另一側電子部件18、23,以及配置在基板11、21的一側的一側電子部件13、28。在採用這種方式的情況下,還可以配置有連接端子115、125,連接端子115、125具有:在基板11、21的另一側延伸至基板11、21邊緣外部的另一側延伸部119a、129a,在基板11、21的一側延伸至基板11、21邊緣外部的一側延伸部119a、129b以及在基板11、21的邊緣外部將另一側延伸部119a、129a與一側延伸部119b、129b相連接的連接部118、128,並且連接端子將另一側電子部件18、23與一側電子部件13、28電連接。其中,可以將另一側延伸部119a、129a與一側延伸部119b、129b配置為在面方向上完全重合,也可以將另一側延伸部119a、129a與一側延伸部119b、129b配置為在面方向上部分重合。
後述封裝在封裝部90內的電子部件13、23為開關元件等功率元件,沒有封裝在封裝部90內的電子部件18、28可以為控制元件。不僅限於此,封裝在封裝部90內的電子部件13、23也可以為控制元件,沒有封裝在封裝部90內的電子部件18、28也可以為開關元件等功率元件。另外,電子部件13、18、23、28,可以是電容器、電阻、線圈等(可參照第12圖),電子部件13、23包含了開關元件,當開關元件的開關頻率為高頻的情況下,從抑制噪音的觀點來說在電子部件13、18、23、28中包含線圈是很有幫助的,也可以藉由電子部件13、18、23、28來構成變壓器。
以下說明的實施方式中的電子模組可以具有第一電子單元、以及第二電子單元。
如第1圖所示,第一單子單元具有:第一基板11、設置在第一基板11的一側上的多個一側第一導體層12、以及設置在一側第一導體層12上的一側第一電子部件13。一側第一電子部件13可以是開關元件,也可以是控制元件。當一側第一電子部件13為開關元件的情況下,一側第一電子部件13也可以是MOSFET或IGBT等。一側第一電子部件13、後述的另一側第一電子部件18、另一側第二電子部件23、以及一側第二電子部件28可以各自由半導體元件構成,作為半導體材料。可以是矽、碳化矽、氮化鎵等。一側第一電子部件13的另一側的面可藉由焊錫等的導電性黏合劑(未圖示)與一側第一導體層12相連接。
可以在一側第一電子部件13的一側上設置第一連接體60,第一連接體60也可藉由焊錫等的導電性黏合劑與一側第一電子部件13相連接。
如第1圖所示,可在第一連接體60的一側上設置第二電子單元,第二電子單元具有設置在第一連接體60的一側上的另一側第二電子部件23。另外,第二電子單元還具有第二基板21、以及設置在第二基板21的另一側上的另一側第二導體層22。第二連接體70可設置在另一側第二導體層22上。第二連接體70能夠藉由焊錫等的導電性黏合劑與另一側第二電子部件23的一側面及另一側第二導體層22的另一側面相連接。
另一側第二電子部件23既可以是開關元件,也可以是控制元件。當另一側第二電子部件23成為開關元件的情況下,另一側第二電子部件23也成為MOSFET或IGBT等。
可將一側第二導體層27設置在第二基板21的一側上。也可將一側第二電子部件28設置在一側第二導體層27上。
第一連接體60具有:第一頭部61、以及從第一頭部61向另一側延伸的第一柱部62。第二連接體70具有:第二頭部71、以及從第二頭部71向另一側延伸的第二柱部72。第一連接體60的截面大致呈T字狀,第二連接體70的截面也大致呈T字狀。
可採用陶瓷基板11、21或絕緣樹脂層等作為第一基板11及第二基板21。作為導電性黏合劑,除了焊錫以外,也可以使用Ag或Cu來作為主要成分。Cu等金屬同樣可作為第一連接體60及第二連接體70的材料使用。此外,作為基板11、21,例如可以使用經過將電路圖案化後的金屬基板。此情況下,基板11、21可以兼做導體層12、22。
如前述般,電子模組具有封裝部90,封裝部90由將一側第一電子部件13、另一側第二電子部件23、第一連接體60、第二連接體70、一側第一導體層12、另一側第二導體層22等封裝的封裝樹脂構成。
作為本實施方式中的一例,將採用在第二基板21側設置第二連接端子125、並且在第一基板11側未設置有連接端子(後述的第一連接端子115)的形態來進行說明。但是,不僅限於此形態,也可以如後述般,在第一基板11側設置有第一連接端子115,此情況下,在第二基板21側未設置有連接端子。
在本實施方式中,另一側電子部件具有:在第二基板21的另一側設置的另一側第二電子部件23、一側電子部件具有:在第二基板21的一側設置的一側第二電子部件28。所述第二連接端子125具有:在第二基板21的另一側延伸至第二基板21的邊緣外部的另一側第二延伸部129a、在第二基板21的一側延伸至第二基板21的邊緣外部的一側第二延伸部129b、以及在第二基板21的邊緣外部將另一側第二延伸部129a與一側第二延伸部129b相連接的第二連接部128。第二連接端子125能將另一側第二電子部件23與一側第二電子部件28電連接。在圖1所示的形態中,雖然是第二連接端子125的一側第二延伸部129b與一側第二導體層27相連接的形態,但是不限於此形態,第二連接端子125的一側第二延伸部129b可與一側第二電子部件28直接連接。雖然未圖示,但是一側第二電子部件28與一側第二導體層27間可設置導電性黏合劑、一側第二延伸部129b與一側第二導體層27間也可設置導電性黏合劑。
如第2圖所示,在第二基板21側,可設置與另一側第二電子部件23電連接的第二端子部120。第二端子部120具有:沿著第二基板21的面方向延伸的第二面方向延伸部124、以及設置在第二面方向延伸部124的端部的,並且向一側延伸的第二法線方向延伸部123。
在第一基板11側,可設置與一側第一電子部件13電連接的第一端子部110。第一端子部110具有:沿第一基板11的面方向延伸的第一面方向延伸部114、以及設置在第一面方向延伸部114的端部的,並且向一側延伸的第一法線方向延伸部113。
第一法線方向延伸部113在比第二連接部128及第二法線方向延伸部123更靠近邊緣外部的位置上向一側延伸。在這種情況下,第一方向延伸部114比另一側第二延伸部129a及第二面方向延伸部124延伸至更加靠近邊緣外部的位置上。當沿第二方向(從第1圖及第2圖的右側)觀看時,第二連接部128及第二法線方向延伸部123與第一法線方向延伸部113完全或部分重合。但又不僅限於此,當沿第二方向觀看時,第二連接部128及第二法線方向延伸部123也可以與第一法線方向延伸部113完全不重合。
本實施方式中的端子部100包含了:上述第一端子部110、第二端子部120、第一連接端子115、以及後述第二連接端子125。
第一法線方向延伸部113的一側端部可以與第二法線方向延伸部123的一側端部延伸至大致相同的位置上。“延伸至大致相同的位置上”指的是:兩者之間的長度差在:第一法線方向延伸部113以及第二法線方向延伸部123中長度中較短的法線方向延伸部(在本實施方式中為第二法線方向延伸部123)的整體長度的5%以內。
可以設置多個第一端子部110。同樣的,也可設置多個第二端子部120。另外,第一端子部110的數量可以與第二端子部120和第二連接端子125的總數相同。當第一端子部的數量與第二端子部120和第二連接端子125的總數相同的情況下,在各個第一面方向延伸部114的一側上可設置第二面方向延伸部124或另一側第二延伸部129a(參照圖5)。
如第1圖所示,第一端子部110具有:與一側第一導體層12連接的第一端子基端部111、上述第一面方向延伸部114、以及設置在第一端子基端部111與第一面方向延伸部114之間的,在第一端子基端部111側向另一側彎曲的第一屈曲部112。第一端子基端部111可藉由導電性黏合劑與一側第一導體層12的一側的面相連接。
如第2圖所示,第二端子部120具有:與另一側第二導體層22連接的第二端子基端部121、上述第二面方向延伸部124、以及設置在第二端子基端部121與第二面方向延伸部124之間的,在第二端子基端部121側向一側彎曲的第二屈曲部122。第二端子基端部121可藉由導電性黏合劑與另一側第二導體層22的另一側的面相連接。
如第1圖所示,第二連接端子125具有:與另一側第二導體層22連接的第二連接端子基端部126、上述另一側第二延伸部129a、以及設置在第二連接端子基端部126與另一側第二延伸部129a之間的,在第二連接端子基端部126側向一側彎曲的第二屈曲部127。第二連接端子基端部126可藉由導電性黏合劑與另一側第二導體層22的另一側的面相連接。
在封裝部90的外部,第一面方向延伸部114與第二面方向延伸部124以及另一側第二延伸部129a之間可以在第一方向上隔開不小於閾值的距離。閾值的數值可以根據安全規格來決定。例如將電子部件在600V電壓的環境下使用時,第一面方向延伸部114與第二面方向延伸部124以及另一側第二延伸部129a的之間距離必須不低於3.6mm。這種情況下,閾值即為3.6mm。
如第3圖所示,在第一頭部61的一側的面上可設置第一溝部64。第一溝部64,在平面圖(面方向)上,雖然是設置在第一柱部62的邊緣外部的,但也可設置在邊緣外部的一部分上,或設置在第一柱部62的整個邊緣外部上。在第一頭部61的一側的面上的,第一溝部64的邊緣內部,可設置焊錫等的導電性黏合劑,也可藉由導電性黏合劑設置另一側第二電子部件23。
如第1圖所示,可使用與另一側第二電子部件23的後述第二閘極端子23g等端子相連接的連接件85。不僅限於此形態,也可如第4圖所示使用第三連接體80。第三連接體80具有:第三頭部81、以及從第三頭部81向另一側延伸的第三柱部82。第三連接體80,可藉由焊錫等導電性黏合劑與另一側第二導體層22的另一側的面以及另一側第二電子部件23的一側的面相連接。
第3圖所示的一側第一電子部件13,是在一側的面上具有第一閘極端子13g及第一源極端子13s的開關元件,第3圖所示的另一側第二電子部件23,是在一側的面上具有第二閘極端子23g及第二源極端子23s的開關元件。這種情況下,第二連接體70與另一側第二電子部件23的第二源極端子23s可藉由導電性黏合劑相連接,連接件85與另一側第二電子部件23的第二閘極端子23g可藉由導電性黏合劑相連接。此外,第一連接體60可藉由藉由導電性黏合劑將一側第一電子部件13的第一源極端子13s與設置在另一側第二電子部件23的另一側的第二漏極端子連接。設置在一側第一電子部件13的另一側的第一漏極端子可藉由導電性黏合劑與一側第一導體層12相連接。一側第一電子部件13的第一閘極端子13g可藉由導電性黏合劑與連接件95(參照第1圖)相連接,該連接件95可藉由導電性黏合劑與一側第一導體層12相連接。
當一側第一電子部件13與另一側第二電子部件23中的任一方為開關元件的情況下,可以考慮將放置在第一連接體60上的另一側第二電子部件23設置為發熱量較低的控制元件,並且將一側第一電子部件13設置成為開關元件。反之,也可以考慮將放置在第一連接體60上的另一側第二電子部件23設置為開關元件,並且將一側第一電子部件13設置為發熱量較低的控制元件。
端子部100與導體層12、22間的接合,不僅能使用焊錫等導電性黏合劑來進行,還能使用雷射焊接、以及超音波接合來進行。
《作用・效果》
接下來,將對由上述結構構成的本實施方式的作用以及效果進行說明。另外,可以將在《作用・效果》中說明的任何形態適用於上述結構中。
如第1圖所示,第二連接端子125具有:在第二基板21的另一側延伸至第二基板21的邊緣外部的另一側第二延伸部129a、在第二基板21的一側延伸至第二基板21的邊緣外部的一側第二延伸部129b、以及在第二基板21的邊緣外部的另一側第二延伸部129a以及與一側第二延伸部129b連接的第二連接部128,當採用將另一側第二電子部件23與一側第二電子部件28電連接的情況下,第二基板21的一側的面以及另一側的面上都可設置電子部件。此外,由於可以利用第二連接端子125將這些電子部件連接,因此能夠縮短電子部件間的距離,從而防止因電阻與電抗的增加,引起的因噪音導致的故障。再有,根據本實施方式,由於不必設置用於連接第二基板21的一側與另一側的通孔,因此對於製造製程的簡化也是很有幫助的。
此外,當另一側第二電子部件23包含了開關元件等功率元件的情況下,一側第二電子部件28也可包含用於控制相關該功率元件的控制元件。另外,在設置了多個另一側第二電子部件23的情況下,另一側第二電子部件23的可以全部為功率元件。這種情況下,可以設置多個一側第二電子部件28,並且一側第二電子部件28的可以全部為控制元件。另外,不僅限於此形態,被設置有多個的另一側第二電子部件23種的一部分可以為功率元件,其餘一部分可以為控制元件或其他的電子部件(電阻、電容器、線圈等)。同樣,被設置有多個的一側第二電子部件28的中一部可以為控制元件,其餘一部分可以為功率元件或其他的電子部件(電阻、電容器、線圈等)。藉由在封裝部90內設置開關元件,對於利用開關元件來降低噪音所帶來的影響是有幫助的。當一側第二電子部件28或另一側第二電子部件23包含功率元件以及控制元件的情況下,由於可藉由控制元件來控制功率元件,因此在本實施方式中的電子模組可不與控制基板相連接。
如第2圖所示,當採用在第二基板21上設置與另一側第二電子部件23電連接的第二端子部120,並且第二端子部120具有:沿第二基板21的面方向延伸的第二面方向延伸部124、以及設置在第二面方向延伸部124的端部,沿一側延伸的第二法線方向延伸部123的形態下,對於可利用第二端子部120來與類似控制基板這樣的外部裝置連接是有幫助的。另外,控制基板是用來控制電子模組的。
如第1圖以及第2圖所示,當採用在第一基板11上設置有與一側第一電子部件13電連接的第一端子部110,並且第一端子部110具有:沿第一基板11的面方向延伸的第一面方向延伸部114、以及設置在第一面方向延伸部114的端部的,沿一側延伸的第一法線方向延伸部113的形態情況下,對於可利用第一端子部110來與類似控制基板這樣的外部裝置連接是有幫助的。
當採用第一法線方向延伸部113在比第二連接部128更靠近邊緣外部的位置上向一側延伸的形態情況下,就能夠效防止第二連接部128與第一端子部110間的相互接觸,此外由於還能夠在不受沿第三方向的空間限制的情況下,來利用第二連接部128以及第一端子部110,因此有益於提高設計的自由度。
當採用第一法線方向延伸部113在比第二連接部123更靠近邊緣外部的位置上向一側延伸的形態情況下,能有效防止第二端子部120與第一端子部110間的相互接觸,此外由於還能夠在不受沿第三方向的空間限制的情況下,來利用第二連接部128以及第一端子部110,因此有益於提高設計的自由度。
當採用第一法線方向延伸部113以及第二法線方向延伸部123向同一方向延伸,即如第1圖所示向一側延伸的情況下,有助於將第一端子部110以及第二端子部120與相同的外部裝置連接。
藉由採用第一法線方向延伸部113的一側端部與第二法線方向延伸部123的一側端部延伸至大致相同的位置上的形態,有助於更容易地將第一端子部110以及第二端子部120與控制基板等相同的外部裝置相連接。
第二實施方式
接下來,對本發明的第二實施方式進行說明。
在第一實施方式中,雖然是在第二基板21的兩面上設置電子部件,但是在本實施方式中,是在第一基板11的兩面設置電子部件。具體來說,如第6圖所示,另一側電子部件具有在第一基板11的另一側上設置的另一側第一電子部件18,一側電子部件具有在第二基板21的一側上設置的一側第一電子部件13。另外,連接端子具有第一連接端子115。第一連接端子115具有:在第一基板11的另一側延伸至第一基板11的邊緣外部的另一側第一延伸部119a、在第一基板11的一側延伸至第一基板11的邊緣外部的一側第一延伸部119b、以及在第一基板11的邊緣外部將另一側第一延伸部119a與一側第一延伸部119b連接的第一連接部118。第一連接端子115是用來電連接另一側第一電子部件18與一側第一電子部件13的。在第6圖所示的形態中,雖然第一連接端子115的另一側第一延伸部119a是與另一側第一導體層17相連接的,但是不僅限於此形態,也可以是第一連接端子115的另一側第一延伸部119a與另一側第二電子部件18直接連接。雖無圖示,但可在另一側第二電子部件18與另一側第一導體層17之間設置導電性黏合劑,也可在另一第一延伸部119a與另一側第一導體層17之間設置導電性黏合劑。在本實施方式中,上述各實施方式中說明的所有方式。關於上述各實施方式中說明過的構件用相同符號加以說明。
根據本實施方式,第一基板11側也可實現上述第二基板21側的功能效果。因此,能夠根據需要,採用本實施方式中的形態,而非第一實施方式中的形態。
在本實施方式中,如第7圖所示,第一端子部110的第一法線方向延伸部113可向另一側延伸。此外,第二端子部120的第二法線方向延伸部123也可向另一側延伸。在採用這種形態的情況下,可藉由第一端子部110以及第二端子部120來與設置在第一基板11的另一側的類似控制基板這樣的外部裝置相連接。
第三實施方式
接下來,將對本發明的第三實施方式加以說明。
在本實施方式中,如第8圖以及第10圖所示,第一連接端子115以及第二連接端子125這兩個連接端子均被設置。此外,在本實施方式中,如第9圖及第10圖所示,第一端子部110的第一法線方向延伸部113向另一側延伸,第二端子部120的第二法線方向延伸部123向一側延伸。在本實施方式中,也可採用上述各實施方式種說明過的所有形態。關於上述各實施方式中說明過的部件用相同符號加以說明。
在本實施方式中,可以在第一基板11以及第二基板21的這個基板上均設置連接端子115、125。此外,可藉由第一端子部110與設置在另一側的控制基板等外部裝置相連接,還可藉由第二端子部120與設置在一側的控制基板等外部裝置相連接。
另外,在本實施方式中,如第10(b)圖所示,在包含第一方向以及第三方向的面內方向上,連接端子115、125以及端子部110、120不重合。因此,無需將端子部110、120中的任意一個端子部延伸至邊緣外部,這樣一來,就可以縮短沿第二方向的長度,進而抑制在面方向的尺寸變大。
第四實施方式
接下來,將對本發明的第四實施方式進行說明。
在本實施方式中,如第11圖所示,儘管在第二基板21側設置有第二連接端子125,但未設置有第二端子部120。同樣的,雖在第一基板11側設置有第一連接端子115,但未設置有第一端子部110。在本實施方式中,也可採用上述各實施方式中說明過的所有形態。關於上述各實施方式中說明過的部件用相同符號加以說明。
根據本實施方式,因未設置有第一端子部110以及第二端子部120,因此能夠在第一方向(厚度方向)上減小電子模組的尺寸。在採用這種形態的情況下,設置在第一基板11的另一側的另一側第一電子部件18包含控制元件,並且設置在第一基板11的一側的,被封裝部90封裝的一側第一電子部件13包含開關元件等功率元件。此外,設置在第二基板21的另一側的,被封裝部90封裝的另一側第一電子部件18包含開關元件等功率元件,並且設置在第二基板21的一側的一側第二電子部件28包含控制元件。
此外,如本實施方式般,可以在基板11、12上設置功率元件以及控制該功率元件的控制元件這兩個元件,並且僅依靠電子模組來控制功率元件,在未連接類似控制基板這樣的外部裝置的情況下,相比以往利用控制基板的結構來說,能夠在很大程度上使裝置的尺寸變得更小。
第五實施方式
接下來,將對本發明的第五實施方式加以說明。
在上述的各實施方式中,第一端子部110以及第二端子部120在電子模組的一個側面上露出至封裝部90的外部的,即所謂的SIP(Single Inline Package)型構造。而在本實施方式中,如第12圖以及第13圖所示,第一端子部110以及第二端子部120是在與電子模組相向的兩個側面上露出至封裝部90向外部的,即所謂的DIP(Dual Inline Package)型構造。在本實施方式中,上述的各實施方式中說明過的所有形態都可採用。關於上述各實施方式中說明過的部件用相同符號加以說明。
根據本實施方式,由於是利用兩個側面來使端子部100露出至封裝部90的外部,因此有助於增加端子部100的數量以及增加端子部100的寬度。在電流強度增大的情況下,就有必要增加端子部100的寬度。藉由採用本實施方式,有助於滿足上述這些要求。
在第12圖所示的方式中,設置在第12(b)圖的紙面下方側的端子部100中位於第三方向的兩端以及中央的三個端子部100為第二連接端子125,並且在這些端子之間設置有第二端子部120。此外,在設置在第12(b)圖的紙面上方側的端子部100中位於第三方向的兩端設置有第二端子部120,在這些第二端子部120之間設置有五個第二連接端子125。
另外,在本實施方式中,如第13圖所示,第一端子部110的一側端部與第二端子部120的一側端部並沒有位於大致相同的位置上,第二端子部120的一側端部位於比第一端子部110的一側端部更靠近一側的位置上。
第六實施方式
接下來,將對本發明的第六實施方式加以說明。
在上述各實施的方式中,雖使用了截面呈大致T字型的第一連接體60,但在本實施方式中,第一連接體60,如第14圖所示,具有從第一頭部61向另一側延伸的四個支撐部65(65a-65d)。支撐部65與一側第一導體層12或是與第一基板11相抵接。在本實施方式中,上述的各實施方式中說明過的所有形態都可採用。關於上述各實施方式中說明過的部件用相同符號加以說明。
在本實施方式中,雖然對利用四個支撐部65的形態加以了說明,但不僅限於此,也可使用一個、兩個、三個或是五個以上的支撐部65。
如本實施方式般,在設置有從第一頭部61延伸的支撐部65的情況下,就能夠在安裝另一側第二電子部件23時或安裝另一側第二電子部件23後,防止因另一側第二電子部件23的重量而導致第一連接體60傾斜。此外,藉由支撐部65與第一基板11或一側第一導體層12相抵接,就能夠提高散熱性。特別是當支撐部65與一側第一導體層12相抵接的情況下,有助於進一步提高散熱效果。
此外,如本實施方式中設置有多個支撐部65的情況下,就能夠更穩定地來設置第一連接體60,並有助於實現更高的散熱效果。
第七實施方式
接下來,將對本發明的第七實施方式加以說明。
在上述各實施方式中雖使用了由具有第二柱部72的,並且截面呈大致T字型的第二連接體70加以了說明,但在本實施方式中,如第15圖所示,第二連接體70具有從第二頭部71向另一側延伸的延伸部75(75a、75b)。在本實施方式中,上述的各實施方式中說明過的所有形態都可採用。關於上述各實施方式中說明過的部件用相同符號加以說明。
雖在本實施方式中對使用兩個延伸部75的形態加以了說明,但不僅限於此方式,也可使用一個或三個以上的延伸部75。
根據本實施方式,因設置有延伸部75,因此可以將另一側第二電子部件23的熱量有效地進行散熱,從而藉由第二連接體70實現高散熱效果。
另外,如本實施方式般在設置有多個延伸部75的情況下,有助於實現更高的散熱效果。
第八實施方式
接下來,將對本發明的第八實施方式加以說明。
上述實施方式中,雖然對使用第一連接體60以及第二連接體70的形態加以了說明,但不僅限於此方式。如第16圖所示,也可不設置第一連接體60以及第二連接體70。在本實施方式中,上述的各實施方式中說明過的所有形態都可採用。關於上述各實施方式中說明過的部件用相同符號加以說明。
在本實施方式中,同樣能夠獲得包含有關於連接端子115、125的說明中所提到的效果等已述效果。
此外,也可以在無需使用兩個以上的基板的情況下,如第17圖所示般,僅設置一個基板(在第17圖所示的方式中只設置有第二基板21)。
上述各實施方式種的記載以及圖式中所展示的內容,僅為用於說明申請專利範圍中記載的發明的一個例子,本發明不受上述記載的實施方式以及圖式中所展示的內容所限制。另外,本發明最初申請的申請專利範圍僅為一例,可根據說明書、圖式的記載,對申請專利範圍進行適宜地修改。
11‧‧‧第一基板(基板)
12‧‧‧導體層
13‧‧‧一側第一電子部件(一側電子部件、第一電子部件)
13g‧‧‧第一閘極端子
13s‧‧‧第一源極端子
17‧‧‧第一導體層
18‧‧‧另一側第一電子部件(另一側電子部件、第一電子部件)
21‧‧‧第二基板(基板)
22‧‧‧導體層
23‧‧‧另一側第二電子部件(另一側電子部件、第二電子部件)
23g‧‧‧第二閘極端子
23s‧‧‧第二源極端子
27‧‧‧第二導體層
28‧‧‧一側第二電子部件(一側電子部件、第二電子部件)
60‧‧‧第一連接體
61‧‧‧第一頭部
62‧‧‧第一柱部
64‧‧‧第一溝部
65a、65b、65c、65d‧‧‧支撐部
70‧‧‧第二連接體
71‧‧‧第二頭部
72‧‧‧第二柱部
75a、75b、75c、75d‧‧‧延伸部
80‧‧‧第三連接體
81‧‧‧第三頭部
82‧‧‧第三柱部
85‧‧‧連接件
90‧‧‧封裝部
95‧‧‧連接件
100‧‧‧端子部
110‧‧‧第一端子部
111‧‧‧第一端子基端部
112‧‧‧第一屈曲部
113‧‧‧第一法線方向延伸部
114‧‧‧第一面方向延伸部
115‧‧‧第一連接端子(連接端子)
118‧‧‧第一連接部(連接部)
119a‧‧‧另一側第一延伸部(另一側延伸部)
119b‧‧‧一側第一延伸部(一側延伸部)
120‧‧‧第二端子部
121‧‧‧第二端子基端部
122‧‧‧第二屈曲部
123‧‧‧第二法線方向延伸部
124‧‧‧第二面方向延伸部
125‧‧‧第二連接端子(連接端子)
126‧‧‧第二連接端子基端部
127‧‧‧第二屈曲部
128‧‧‧第二連接部(連接部)
129a‧‧‧另一側第二延伸部(另一側延伸部)
129b‧‧‧一側第二延伸部(一側延伸部)
第1圖是可在本發明第一實施方式中使用的電子模組的縱截面圖。
第2圖是與第1圖在不同部位下切割的電子模組的縱截面圖。
第3圖是可在本發明第一實施方式中使用的所示第一連接體等的平面圖。
第4圖是可在所示本發明第一實施方式中使用的另一例電子模組的縱截面圖。
第5(a)圖是可在本發明第一實施方式中使用的電子模組的平面圖,第5(b)圖是沿第5(a)圖的B-B直線切割後的截面圖。
第6圖是沿與第1圖相對應的部位切割後的,可在本發明第二實施方式中使用的電子模組的縱截面圖。
第7圖是與第6圖在不同部位下切割的電子模組的縱截面圖、圖中導體層及電子部件的配置與第2圖的形態不同。
第8圖是沿與第1圖相對應的部位切割後的,可在本發明第三實施方式中使用的電子模組的縱截面圖。
第9圖是與第8圖在不同部位下切割的電子模組的縱截面圖,圖中導體層、電子部件等的配置與第2圖及第7圖的形態不同。
第10(a)圖是本發明第三實施方式中使用的電子模組的平面圖,第10(b)圖是對應第5(b)圖的截面圖。
第11(a)圖是本發明第四實施方式中使用的電子模組的平面圖,第11(b)圖是對應第5(b)圖的截面圖。
第12(a)圖是本發明第五實施方式中使用的電子模組的斜面圖,第12(b)圖是本發明第五實施方式中使用的電子模組的平面圖。
第13(a)圖是本發明第五實施方式中使用的電子模組的側面圖,第13(b)圖是從別的方向觀看本發明第五實施方式中使用的電子模組時側面圖。
第14圖是本發明第六實施方式中使用的所示第一連接體的平面圖。
第15圖是本發明第七實施方式中使用的所示第二連接體的縱截面圖。
第16圖是本發明第八實施方式中使用的電子模組的縱截面圖。
第17圖是本發明第八實施方式中使用的其他的電子模組的縱截面圖。
Claims (6)
- 一種電子模組,其包括: 基板; 另一側電子部件,配置在該基板的另一側; 一側電子部件,配置在該基板的一側; 封裝部,將該另一側電子部件封裝;以及 連接端子,具有:在該基板的另一側延伸至該基板的邊緣外部的在該封裝部向外部露出的另一側延伸部、在該封裝部外部的該基板的一側延伸至該基板的邊緣外部的一側延伸部、以及在該封裝部外部的該基板的邊緣外部與該另一側延伸部以及該一側延伸部連接的連接部,並且該連接端子將該封裝部內的該另一側電子部件與該封裝部外的該一側電子部件電連接, 其中,該一側延伸部、該另一側延伸部以及該連接部是一體構成的, 在該基板的另一側上設置的另一側導體層上設置有該另一側延伸部,並在該基板的一側上設置的一側導體層上設置有該一側延伸部,或該另一側延伸部設置在由金屬基板構成的基板另一側的面上,並且該一側延伸部設置在由金屬基板構成的基板一側的面上, 該基板的另一側的整個面被設置在該封裝部內,該基板的一側的面未被封裝在封裝部內。
- 如申請專利範圍第1項所述的電子模組,其中,該基板具有:第一基板、以及設置在該第一基板的一側上的第二基板, 該另一側電子部件具有:設置在該第二基板的另一側上的另一側第二電子部件, 該一側電子部件具有:設置在該第二基板的一側上的一側第二電子部件, 該連接端子具有:在該第二基板的另一側延伸至該第二基板的邊緣外部的另一側第二延伸部、在該第二基板的一側延伸至該第二基板的邊緣外部的一側第二延伸部、以及在該第二基板的邊緣外部將該另一側第二延伸部與該一側第二延伸部連接的第二連接部,並且具有將該另一側第二電子部件與該一側第二電子部件電連接的第二連接端子。
- 如申請專利範圍第2項所述的電子模組,其進一步包括: 設置在該第一基板的一側上的第一電子部件;以及 設置在該第一基板側上的,與該第一電子部件電連接的第一端子部, 其中,該第一端子部具有沿該第一基板的面方向延伸的第一面方向延伸部、以及設置在該第一面方向延伸部的端部上的,並且向一側或另一側延伸的第一法線方向延伸部。
- 如申請專利範圍第3項所述的電子模組,其中,在比該第一法線方向延伸部更靠近邊緣外部的位置上向一側延伸。
- 如申請專利範圍第1項所述的電子模組,其中,該基板具有:第一基板,以及設置在該第一基板的一側上的第二基板, 該另一側電子部件具有:設置在該第一基板的另一側上的另一側第一電子部件, 該一側電子部件具有:設置在該第一基板的一側上的一側第一電子部件, 其中,該連接端子具有:在該第一基板的另一側延伸至該第一基板的邊緣外部的另一側第一延伸部、在該第一基板的一側延伸至該第一基板的邊緣外部的一側第一延伸部、以及在該第一基板的邊緣外部將該另一側第一延伸部與該一側第一延伸部連接的第一連接部,並且具有將該另一側第一電子部件與該一側第一電子部件電連接的第一連接端子。
- 如申請專利範圍第1項所述的電子模組,其中,該基板具有:第一基板、以及設置在該第一基板的一側上的第二基板, 該電子模組進一步具備:設置在該第二基板側的,與該第二電子部件電連接的第二端子部; 其中,該第二端子部具有:沿該第二基板的面方向延伸的第二面方向延伸部、以及設置在該第二面方向延伸部的端部的,向一側或另一側延伸的第二法線方向延伸部。
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