TWI678758B - 硬對接測試系統 - Google Patents
硬對接測試系統 Download PDFInfo
- Publication number
- TWI678758B TWI678758B TW107140974A TW107140974A TWI678758B TW I678758 B TWI678758 B TW I678758B TW 107140974 A TW107140974 A TW 107140974A TW 107140974 A TW107140974 A TW 107140974A TW I678758 B TWI678758 B TW I678758B
- Authority
- TW
- Taiwan
- Prior art keywords
- station
- template
- semiconductor die
- test
- test system
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2896—Testing of IC packages; Test features related to IC packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MYPI2017704521 | 2017-11-27 | ||
??PI2017704521 | 2017-11-27 | ||
MYPI2017704521A MY191597A (en) | 2017-11-27 | 2017-11-27 | Stencil concept and inspection |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201926526A TW201926526A (zh) | 2019-07-01 |
TWI678758B true TWI678758B (zh) | 2019-12-01 |
Family
ID=66844632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107140974A TWI678758B (zh) | 2017-11-27 | 2018-11-19 | 硬對接測試系統 |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR102103086B1 (ko) |
MY (1) | MY191597A (ko) |
PH (1) | PH12018000378A1 (ko) |
TW (1) | TWI678758B (ko) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM439797U (en) * | 2012-04-02 | 2012-10-21 | Fittech Co Ltd | Defect inspection device for LED die |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000111613A (ja) * | 1998-10-07 | 2000-04-21 | Nippon Eng Kk | バーンインボード用ローダアンローダ装置 |
JP5040538B2 (ja) * | 2007-09-05 | 2012-10-03 | セイコーエプソン株式会社 | 電子部品の温度制御装置、電子部品の温度制御方法及びicハンドラ |
JP2013167474A (ja) * | 2012-02-14 | 2013-08-29 | Seiko Epson Corp | ハンドラー、及び部品検査装置 |
JP6351623B2 (ja) * | 2013-12-03 | 2018-07-04 | 株式会社ハッピージャパン | 電子デバイスのハンドラ |
-
2017
- 2017-11-27 MY MYPI2017704521A patent/MY191597A/en unknown
-
2018
- 2018-11-16 PH PH12018000378A patent/PH12018000378A1/en unknown
- 2018-11-19 TW TW107140974A patent/TWI678758B/zh active
- 2018-11-23 KR KR1020180146209A patent/KR102103086B1/ko active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM439797U (en) * | 2012-04-02 | 2012-10-21 | Fittech Co Ltd | Defect inspection device for LED die |
Also Published As
Publication number | Publication date |
---|---|
KR20190062233A (ko) | 2019-06-05 |
PH12018000378A1 (en) | 2019-07-24 |
TW201926526A (zh) | 2019-07-01 |
KR102103086B1 (ko) | 2020-04-23 |
MY191597A (en) | 2022-06-30 |
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