TWI678758B - 硬對接測試系統 - Google Patents

硬對接測試系統 Download PDF

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Publication number
TWI678758B
TWI678758B TW107140974A TW107140974A TWI678758B TW I678758 B TWI678758 B TW I678758B TW 107140974 A TW107140974 A TW 107140974A TW 107140974 A TW107140974 A TW 107140974A TW I678758 B TWI678758 B TW I678758B
Authority
TW
Taiwan
Prior art keywords
station
template
semiconductor die
test
test system
Prior art date
Application number
TW107140974A
Other languages
English (en)
Chinese (zh)
Other versions
TW201926526A (zh
Inventor
光榮 胡
Kuang Eng Oh
Original Assignee
馬來西亞商正齊科技有限公司
Mi Equipment (M) Sdn. Bhd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 馬來西亞商正齊科技有限公司, Mi Equipment (M) Sdn. Bhd. filed Critical 馬來西亞商正齊科技有限公司
Publication of TW201926526A publication Critical patent/TW201926526A/zh
Application granted granted Critical
Publication of TWI678758B publication Critical patent/TWI678758B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW107140974A 2017-11-27 2018-11-19 硬對接測試系統 TWI678758B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
MYPI2017704521 2017-11-27
??PI2017704521 2017-11-27
MYPI2017704521A MY191597A (en) 2017-11-27 2017-11-27 Stencil concept and inspection

Publications (2)

Publication Number Publication Date
TW201926526A TW201926526A (zh) 2019-07-01
TWI678758B true TWI678758B (zh) 2019-12-01

Family

ID=66844632

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107140974A TWI678758B (zh) 2017-11-27 2018-11-19 硬對接測試系統

Country Status (4)

Country Link
KR (1) KR102103086B1 (ko)
MY (1) MY191597A (ko)
PH (1) PH12018000378A1 (ko)
TW (1) TWI678758B (ko)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM439797U (en) * 2012-04-02 2012-10-21 Fittech Co Ltd Defect inspection device for LED die

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000111613A (ja) * 1998-10-07 2000-04-21 Nippon Eng Kk バーンインボード用ローダアンローダ装置
JP5040538B2 (ja) * 2007-09-05 2012-10-03 セイコーエプソン株式会社 電子部品の温度制御装置、電子部品の温度制御方法及びｉｃハンドラ
JP2013167474A (ja) * 2012-02-14 2013-08-29 Seiko Epson Corp ハンドラー、及び部品検査装置
JP6351623B2 (ja) * 2013-12-03 2018-07-04 株式会社ハッピージャパン 電子デバイスのハンドラ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM439797U (en) * 2012-04-02 2012-10-21 Fittech Co Ltd Defect inspection device for LED die

Also Published As

Publication number Publication date
KR20190062233A (ko) 2019-06-05
PH12018000378A1 (en) 2019-07-24
TW201926526A (zh) 2019-07-01
KR102103086B1 (ko) 2020-04-23
MY191597A (en) 2022-06-30

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