MY191597A - Stencil concept and inspection - Google Patents
Stencil concept and inspectionInfo
- Publication number
- MY191597A MY191597A MYPI2017704521A MYPI2017704521A MY191597A MY 191597 A MY191597 A MY 191597A MY PI2017704521 A MYPI2017704521 A MY PI2017704521A MY PI2017704521 A MYPI2017704521 A MY PI2017704521A MY 191597 A MY191597 A MY 191597A
- Authority
- MY
- Malaysia
- Prior art keywords
- semiconductor dies
- station
- untested
- stencil
- test
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2896—Testing of IC packages; Test features related to IC packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
A hard docking test system (1), comprising: at least one buffer cavity station (10) receiving a plurality of untested semiconductor dies (12) of an upstream process therefrom, returning tested semiconductor dies (12T) thereto, supplying untested semiconductor dies (12) and receiving tested semiconductor dies (12T) of a stencil station (20) therefrom and thereto, comprising at least one pick up head (11) capable of transporting the untested and tested semiconductor dies (12, 12T) to a buffer cavity (14) comprising a plurality of cavities; at least one test site station (30) receiving untested semiconductor dies (12) and returning tested semiconductor dies (12T) of the stencil station (20) therefrom and thereto, comprising at least one test arm (32) capable of transporting the untested and tested semiconductor dies (12, 12T) to a test site (34) to perform probe mark test; at least one vision camera (16) disposed the buffer cavity station (10) and the stencil station (20) therebetween. (FIG. 4)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MYPI2017704521A MY191597A (en) | 2017-11-27 | 2017-11-27 | Stencil concept and inspection |
PH12018000378A PH12018000378A1 (en) | 2017-11-27 | 2018-11-16 | Stencil concept and inspection |
TW107140974A TWI678758B (en) | 2017-11-27 | 2018-11-19 | The hard docking test system |
KR1020180146209A KR102103086B1 (en) | 2017-11-27 | 2018-11-23 | Stencil concept and inspection |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MYPI2017704521A MY191597A (en) | 2017-11-27 | 2017-11-27 | Stencil concept and inspection |
Publications (1)
Publication Number | Publication Date |
---|---|
MY191597A true MY191597A (en) | 2022-06-30 |
Family
ID=66844632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2017704521A MY191597A (en) | 2017-11-27 | 2017-11-27 | Stencil concept and inspection |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR102103086B1 (en) |
MY (1) | MY191597A (en) |
PH (1) | PH12018000378A1 (en) |
TW (1) | TWI678758B (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000111613A (en) * | 1998-10-07 | 2000-04-21 | Nippon Eng Kk | Loader unloader device for burn-in board |
JP5040538B2 (en) * | 2007-09-05 | 2012-10-03 | セイコーエプソン株式会社 | Electronic component temperature control device, electronic component temperature control method, and IC handler |
JP2013167474A (en) * | 2012-02-14 | 2013-08-29 | Seiko Epson Corp | Handler and component inspection apparatus |
TWM439797U (en) * | 2012-04-02 | 2012-10-21 | Fittech Co Ltd | Defect inspection device for LED die |
JP6351623B2 (en) * | 2013-12-03 | 2018-07-04 | 株式会社ハッピージャパン | Electronic device handler |
-
2017
- 2017-11-27 MY MYPI2017704521A patent/MY191597A/en unknown
-
2018
- 2018-11-16 PH PH12018000378A patent/PH12018000378A1/en unknown
- 2018-11-19 TW TW107140974A patent/TWI678758B/en active
- 2018-11-23 KR KR1020180146209A patent/KR102103086B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20190062233A (en) | 2019-06-05 |
PH12018000378A1 (en) | 2019-07-24 |
TW201926526A (en) | 2019-07-01 |
KR102103086B1 (en) | 2020-04-23 |
TWI678758B (en) | 2019-12-01 |
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