M439797 五、新型說明： 【新型所屬之技術領域】 本新型是有關於一種檢測機，特別是指一種LED晶粒 瑕疵檢測機。 【先前技術】 現有的一種LED晶粒瑕疫檢測機，包括一承載一晶圓 的承載盤、一可移動地對該晶圓的其中一 LED晶粒進行檢 測的檢測單元，及一可對該LED晶粒進行拍攝的攝像模組 ，該檢測單元具有二探針，及二可驅動該等探針移動的探 針模組。 進行檢測時，是以該等探針對欲檢測的LED晶粒通電 ，並透過該攝像模組對發光的LED晶粒進行影像拍攝，以 取得該LED晶粒的光學特性，當全部的LED晶粒都檢測完 畢後，另外再分別對每個LED晶粒拍攝沒有受到該等探針 阻擋的外觀影像，以完成所有LED晶粒的光學及外觀檢測 〇 然而，前述的檢測機在檢測時必須以兩次作業分別對 光學特性及外觀進行拍攝影像，相當花費時間，而無法降 低檢測成本。 【新型内容】 因此，本新型之目的，即在提供一種可以同時檢測外 觀及光學特性的LED晶粒瑕疵檢測機。 於是，本新型LED晶粒瑕庇檢測機，包含一基座單元 '一攝像單元、一檢測單元及一控制單元。 3 該基座單元包括一板體及一設置於該板體並朝上延伸 的立架，該攝像單元包括設置於該立架並分別朝下拍攝影 像的一第一攝像模組及一第二攝像模組，該檢測單元包括 一設置於該板體並朝下延伸的探針模組，該控制單元電連 接並驅動該攝像單元及該檢測單元運作。 本新型之功效在於：該第一攝像模組及該第二攝像模 組可於同一時間分別對LED晶粒的光學特性及外觀進行檢 測’大幅減化檢測成本。 【實施方式】 有關本新型之前述及其他技術内容、特點與功效，在 以下配合參考圖式之一個較佳實施例的詳細說明中將可 清楚的呈現。 參閱圖1、2、3’本新型LED晶.粒瑕疵檢測機之第一 較佳實施例包含一基座單元2、一攝像單元3、一檢測單元 4、一控制單元5,及一承載單元6。 參閱圖1、2'4’該基座單元2包括一板體21，及一 設置於該板體21並朝上延伸後朝前方延伸的立架22。 該板體21具有一穿設孔211。 該攝像單元3包括設置於該立架22且對應該穿設孔 211 置並为別朝下拍攝影像的一第一攝像模組3 1及一第 二攝像模組32 » 該檢測單元4包括二設置於該板體21頂部且朝下延伸 並穿過該穿設孔211的探針模組41。 該等探針模組41對應設置於該第一攝像模組31的下 M439797 方，每—探針模組41具有一設置於該板體21且可朝三個 相互垂直的方向移動的移動台411，及—連接並被該移動台 411連動的探針412。 參閱圖1、2、3，該控制單元5電連接並驅動該攝像單 元3及该檢測單元4運作。 該承載單元6可移動地設置於該板體21下方且電連接 該控制單元5，且包括一可移動地設置於該板體21下方的 承載盤61，及一電連接該控制單元5以驅動該承載盤μ移 動的承載盤驅動台（圖未示）。 於本實施例中，該等探針模組41的移動台411及該承 載單元6的承載盤驅動台皆為一般所熟知的三軸移動平台 ’所屬技術領域中具有通常知識者應可輕易了解，因此不 再進一步說明相關元件的動作。 使用時’將一具有複數lED晶粒的晶圓（圖未示）放 置於該承载盤61，並使該控制單元5驅使該等移動台411 帶動該等探針412移動至所欲進行檢測的LED晶粒的測試 點，經由該等探針412導電後，該LED晶粒即會發光，此 時透過位於上方的該第一攝像模組31即可進行拍攝，以取 得該LED晶粒的光學特性資料，若該LED晶粒不會發光， 也可取得該LED晶粒為故障的電性資料。 在此同時’相鄰該第一攝像模組31的該第二攝像模组 32亦可受控制而同時對前述[ED晶粒旁邊的其他LED晶 粒進行拍攝’由於該第二攝像模組32所拍攝的影像範圍不 會被該等探針412擋住’因此可以獲得外觀影像以判斷是 5 M439797 否有外觀瑕疵。 當前述操作流程結束後，可使該控制單元5驅使該承 載盤驅動台帶動該承載盤61及該晶圓移動，而對另一個 led晶粒重新進行上述檢測，直到將該晶圓上的所有 晶粒都進行檢測後即完成檢測。 综上所述，該第一攝像模組31及該第二攝像模組32 ΊΓ於同時間分別對LED晶粒的光學特性及外觀進行檢測 ，相較於現有的檢測機必須進行兩次檢測，本新型大幅減 化檢測流程，因此可以降低檢測成本，故確實能達成本新 型之目的。 惟以上所述者’僅為本新型之較佳實施例而已，當不 能以此限定本新型實施之範圍，即大凡依本新型申請專利 範圍及新型說明内容所作之簡單的等效變化與修飾，皆仍 屬本新型專利涵蓋之範圍内。 【圖式簡單說明】 圖1是本新型LED晶粒瑕疵檢測機的一較佳實施例的 立體圖； 圖2是該較佳實施例的前視圖； 圖3是該較佳實施例的電氣方塊圖；及 圖4是該較佳實施例的右側視圖。 M439797 【主要元件符號說明】 2 ..........基座單元 21 .........板體 211 .......穿設礼 22 .........立架 3 ..........攝像單元 31 .........第一攝像模組 32 .........第二攝像模組 4 ..........檢測單元 41.........探針模組 411 .......移動台 412 .......探針 5 ..........控制單元 6 ..........承載單元 61.........承載盤M439797 V. New description: [New technology field] The new type is related to a detector, especially an LED chip defect detector. [Prior Art] A conventional LED grain plaque detecting machine includes a carrier carrying a wafer, a detecting unit movably detecting one of the LED dies of the wafer, and a detecting unit The camera module for shooting the LED die has two probes and two probe modules that can drive the probes to move. When the detection is performed, the LED chips to be detected are energized by the probes, and the LED dies of the illuminating LEDs are imaged through the camera module to obtain the optical characteristics of the LED dies, and all the LED dies are obtained. After the detection is completed, each LED chip is separately photographed without being blocked by the probes to complete the optical and appearance detection of all the LED dies. However, the aforementioned detector must be two when detecting. The secondary operation separately images the optical characteristics and appearance, which takes a considerable amount of time and cannot reduce the detection cost. [New content] Therefore, the object of the present invention is to provide an LED chip defect detector capable of simultaneously detecting appearance and optical characteristics. Therefore, the novel LED chip shelter detection machine comprises a base unit 'an image unit, a detecting unit and a control unit. The base unit includes a plate body and a vertical frame disposed on the plate body and extending upwardly. The camera unit includes a first camera module and a second device disposed on the stand and respectively shooting images downwards. The camera module includes a probe module disposed on the board and extending downward, the control unit electrically connecting and driving the camera unit and the detecting unit to operate. The effect of the novel is that the first camera module and the second camera module can respectively detect the optical characteristics and appearance of the LED die at the same time, thereby greatly reducing the detection cost. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments. Referring to Figures 1, 2, and 3', a first preferred embodiment of the present invention relates to a base unit 2, an imaging unit 3, a detecting unit 4, a control unit 5, and a carrying unit. 6. Referring to Figures 1, 2'4', the base unit 2 includes a plate body 21, and a stand 22 disposed on the plate body 21 and extending upwardly and extending forward. The plate body 21 has a through hole 211. The camera unit 3 includes a first camera module 3 1 and a second camera module 32 disposed on the vertical frame 22 and corresponding to the hole 211 and facing the image. The detection unit 4 includes two The probe module 41 is disposed on the top of the plate body 21 and extends downward and passes through the through hole 211. The probe modules 41 are disposed on the lower M439797 side of the first camera module 31. Each probe module 41 has a mobile station disposed on the board 21 and movable in three mutually perpendicular directions. 411, and - a probe 412 that is connected and linked by the mobile station 411. Referring to Figures 1, 2, and 3, the control unit 5 electrically connects and drives the camera unit 3 and the detecting unit 4 to operate. The carrying unit 6 is movably disposed under the board 21 and electrically connected to the control unit 5, and includes a carrying tray 61 movably disposed under the board 21, and electrically connected to the control unit 5 to drive The carrier disk drive table (not shown) on which the carrier disk μ moves. In this embodiment, the mobile station 411 of the probe module 41 and the carrier drive table of the carrier unit 6 are all commonly known three-axis mobile platforms. Those skilled in the art should be able to easily understand Therefore, the action of the related components will not be further explained. When in use, a wafer (not shown) having a plurality of lED grains is placed on the carrier 61, and the control unit 5 drives the mobile stations 411 to move the probes 412 to the desired detection. After the LED dies are electrically conducted through the probes 412, the LED dies are illuminated. At this time, the first camera module 31 located above can be photographed to obtain the optical of the LED dies. Characteristic data, if the LED die does not emit light, the electrical data of the LED die can also be obtained. At the same time, the second camera module 32 adjacent to the first camera module 31 can also be controlled while simultaneously capturing the other LED dies next to the ED die. The captured image range is not blocked by the probes 412' so that the appearance image can be obtained to determine whether the 5 M439797 has an appearance. After the foregoing operation flow ends, the control unit 5 can drive the carrier drive table to drive the carrier 61 and the wafer to move, and perform the above detection on the other LED die until all the wafers are on the wafer. The detection is completed after the crystal grains are detected. In summary, the first camera module 31 and the second camera module 32 detect the optical characteristics and appearance of the LED die at the same time, and must perform two tests compared with the existing detector. The new type greatly reduces the detection process, so the detection cost can be reduced, so the purpose of the novel can be achieved. However, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the simple equivalent changes and modifications made by the novel application scope and the novel description. All remain within the scope of this new patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a preferred embodiment of the present invention. FIG. 2 is a front view of the preferred embodiment; FIG. 3 is an electrical block diagram of the preferred embodiment. And Figure 4 is a right side view of the preferred embodiment. M439797 [Description of main component symbols] 2 .......... base unit 21 ......... board body 211 ....... wearing a gift 22 ..... .... stand 3 .......... camera unit 31 ......... first camera module 32 ......... second camera module 4 ..........detection unit 41.........probe module 411.......mobile station 412.......probe 5 ... .......control unit 6 ..........bearer unit 61.........carrier tray