TWI676183B - 導電糊、連接構造體及連接構造體之製造方法 - Google Patents

導電糊、連接構造體及連接構造體之製造方法 Download PDF

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Publication number
TWI676183B
TWI676183B TW104131036A TW104131036A TWI676183B TW I676183 B TWI676183 B TW I676183B TW 104131036 A TW104131036 A TW 104131036A TW 104131036 A TW104131036 A TW 104131036A TW I676183 B TWI676183 B TW I676183B
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TW
Taiwan
Prior art keywords
electrode
conductive paste
solder
connection
target member
Prior art date
Application number
TW104131036A
Other languages
English (en)
Chinese (zh)
Other versions
TW201616519A (zh
Inventor
石澤英亮
Hideaki Ishizawa
齋藤諭
Satoshi Saitou
上野山伸也
Shinya Uenoyama
Original Assignee
日商積水化學工業股份有限公司
Sekisui Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商積水化學工業股份有限公司, Sekisui Chemical Co., Ltd. filed Critical 日商積水化學工業股份有限公司
Publication of TW201616519A publication Critical patent/TW201616519A/zh
Application granted granted Critical
Publication of TWI676183B publication Critical patent/TWI676183B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Insulated Conductors (AREA)
TW104131036A 2014-09-18 2015-09-18 導電糊、連接構造體及連接構造體之製造方法 TWI676183B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014190049 2014-09-18
JP2014-190049 2014-09-18
JP2015-079269 2015-04-08
JP2015079269 2015-04-08

Publications (2)

Publication Number Publication Date
TW201616519A TW201616519A (zh) 2016-05-01
TWI676183B true TWI676183B (zh) 2019-11-01

Family

ID=55533301

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104131036A TWI676183B (zh) 2014-09-18 2015-09-18 導電糊、連接構造體及連接構造體之製造方法

Country Status (5)

Country Link
JP (1) JP6577867B2 (ja)
KR (1) KR102411356B1 (ja)
CN (1) CN106463200B (ja)
TW (1) TWI676183B (ja)
WO (1) WO2016043265A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017188327A (ja) * 2016-04-06 2017-10-12 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
KR20180132031A (ko) * 2016-04-12 2018-12-11 세키스이가가쿠 고교가부시키가이샤 도전 재료 및 접속 구조체
JP6517754B2 (ja) * 2016-07-12 2019-05-22 日本碍子株式会社 配線基板接合体
KR20220146692A (ko) * 2016-09-09 2022-11-01 세키스이가가쿠 고교가부시키가이샤 도전 재료, 접속 구조체 및 접속 구조체의 제조 방법
JP6726070B2 (ja) 2016-09-28 2020-07-22 エルジー ディスプレイ カンパニー リミテッド 電子部品の実装方法、電子部品の接合構造、基板装置、ディスプレイ装置、ディスプレイシステム
JP6956475B2 (ja) * 2016-09-28 2021-11-02 エルジー ディスプレイ カンパニー リミテッド 電子部品の実装方法、電子部品の接合構造、基板装置、ディスプレイ装置、ディスプレイシステム
KR102248989B1 (ko) * 2016-09-30 2021-05-06 세키스이가세이힝코교가부시키가이샤 도전성 수지 입자 및 그 용도
KR20200098485A (ko) * 2017-12-22 2020-08-20 세키스이가가쿠 고교가부시키가이샤 땜납 입자, 도전 재료, 땜납 입자의 보관 방법, 도전 재료의 보관 방법, 도전 재료의 제조 방법, 접속 구조체 및 접속 구조체의 제조 방법
WO2020251043A1 (ja) * 2019-06-13 2020-12-17 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP7389657B2 (ja) * 2020-01-21 2023-11-30 積水化学工業株式会社 導電ペースト及び接続構造体
KR102556928B1 (ko) * 2021-03-31 2023-07-20 주식회사 노피온 자가 조립형 이방성 도전 접착제 및 이를 이용한 부품 실장 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201315787A (zh) * 2007-08-08 2013-04-16 Hitachi Chemical Co Ltd 黏著劑組成物，薄膜狀黏著劑及電路構件之連接構造
TW201418310A (zh) * 2010-04-13 2014-05-16 Dexerials Corp 硬化性樹脂組成物、接著性環氧樹脂糊、晶粒接合劑、非導電性糊、接著性環氧樹脂膜、非導電性環氧樹脂膜、異向性導電糊及異向性導電膜
TW201425397A (zh) * 2012-10-15 2014-07-01 Sekisui Chemical Co Ltd 有機無機混合粒子、導電性粒子、導電性材料及連接構造體
JP2014130808A (ja) * 2012-11-30 2014-07-10 Sekisui Chem Co Ltd 導電材料及び接続構造体
TW201430098A (zh) * 2013-01-28 2014-08-01 Hitachi Chemical Co Ltd 導體元件接著用樹脂糊組成物以及半導體裝置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3769688B2 (ja) 2003-02-05 2006-04-26 独立行政法人科学技術振興機構 端子間の接続方法及び半導体装置の実装方法
JP3955302B2 (ja) 2004-09-15 2007-08-08 松下電器産業株式会社 フリップチップ実装体の製造方法
WO2008023452A1 (fr) 2006-08-25 2008-02-28 Sumitomo Bakelite Co., Ltd. Bande adhésive, structure de jonction, et ensemble semi-conducteur
JP2008109115A (ja) 2006-09-26 2008-05-08 Sekisui Chem Co Ltd 半導体チップ積層体及びその製造方法
CN101578345A (zh) * 2007-01-12 2009-11-11 积水化学工业株式会社 电子部件用粘合剂
JP5386837B2 (ja) * 2007-03-23 2014-01-15 住友ベークライト株式会社 半導体封止用樹脂組成物及び半導体装置
JP5093482B2 (ja) 2007-06-26 2012-12-12 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電材料、接続構造体及びその製造方法
JP4998732B2 (ja) * 2007-10-22 2012-08-15 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電接着剤
US20110311790A1 (en) * 2008-09-05 2011-12-22 Sumitomo Bakelite Co., Ltd. Conductive connecting material, method for connecting terminals using the conductive connecting material, and method for producing a connecting terminal
JP5602743B2 (ja) * 2009-08-26 2014-10-08 積水化学工業株式会社 異方性導電材料、接続構造体及び接続構造体の製造方法
JP5771084B2 (ja) * 2010-07-21 2015-08-26 積水化学工業株式会社 半導体チップ実装体の製造方法及び封止樹脂
JP5916423B2 (ja) 2011-02-17 2016-05-11 積水化学工業株式会社 異方性導電材料のｂステージ化物、異方性導電材料のｂステージ化物の製造方法、接続構造体及び接続構造体の製造方法
JP6066158B2 (ja) * 2012-01-27 2017-01-25 Dic株式会社 エポキシ樹脂、硬化性樹脂組成物、その硬化物、半導体封止材料、及び半導体装置
JP2014056816A (ja) * 2012-08-10 2014-03-27 Sekisui Chem Co Ltd 導電材料及び接続構造体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201315787A (zh) * 2007-08-08 2013-04-16 Hitachi Chemical Co Ltd 黏著劑組成物，薄膜狀黏著劑及電路構件之連接構造
TW201418310A (zh) * 2010-04-13 2014-05-16 Dexerials Corp 硬化性樹脂組成物、接著性環氧樹脂糊、晶粒接合劑、非導電性糊、接著性環氧樹脂膜、非導電性環氧樹脂膜、異向性導電糊及異向性導電膜
TW201425397A (zh) * 2012-10-15 2014-07-01 Sekisui Chemical Co Ltd 有機無機混合粒子、導電性粒子、導電性材料及連接構造體
JP2014130808A (ja) * 2012-11-30 2014-07-10 Sekisui Chem Co Ltd 導電材料及び接続構造体
TW201430098A (zh) * 2013-01-28 2014-08-01 Hitachi Chemical Co Ltd 導體元件接著用樹脂糊組成物以及半導體裝置

Also Published As

Publication number Publication date
TW201616519A (zh) 2016-05-01
CN106463200A (zh) 2017-02-22
CN106463200B (zh) 2019-05-31
KR102411356B1 (ko) 2022-06-22
JPWO2016043265A1 (ja) 2017-07-06
JP6577867B2 (ja) 2019-09-18
WO2016043265A1 (ja) 2016-03-24
KR20170058884A (ko) 2017-05-29

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