TWI659838B - Cover film and electronic component package using the same - Google Patents

Cover film and electronic component package using the same Download PDF

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Publication number
TWI659838B
TWI659838B TW104126472A TW104126472A TWI659838B TW I659838 B TWI659838 B TW I659838B TW 104126472 A TW104126472 A TW 104126472A TW 104126472 A TW104126472 A TW 104126472A TW I659838 B TWI659838 B TW I659838B
Authority
TW
Taiwan
Prior art keywords
mass
layer
heat
cover film
resin
Prior art date
Application number
TW104126472A
Other languages
English (en)
Chinese (zh)
Other versions
TW201613761A (en
Inventor
佐佐木彰
岩崎貴之
阿津坂高範
弘岡忠昭
坂本繁
Original Assignee
日商電化股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商電化股份有限公司 filed Critical 日商電化股份有限公司
Publication of TW201613761A publication Critical patent/TW201613761A/zh
Application granted granted Critical
Publication of TWI659838B publication Critical patent/TWI659838B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38—Packaging materials of special type or form
    • B65D65/40—Applications of laminates for particular packaging purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/105—Metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/21—Anti-static
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/31—Heat sealable

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Wrappers (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
TW104126472A 2014-08-15 2015-08-14 Cover film and electronic component package using the same TWI659838B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-165353 2014-08-15
JP2014165353 2014-08-15

Publications (2)

Publication Number Publication Date
TW201613761A TW201613761A (en) 2016-04-16
TWI659838B true TWI659838B (zh) 2019-05-21

Family

ID=55304158

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104126472A TWI659838B (zh) 2014-08-15 2015-08-14 Cover film and electronic component package using the same

Country Status (5)

Country Link
JP (1) JP6694387B2 (ja)
KR (1) KR102337822B1 (ja)
CN (1) CN106604816B (ja)
TW (1) TWI659838B (ja)
WO (1) WO2016024529A1 (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018101295A1 (ja) * 2016-12-02 2018-06-07 大日本印刷株式会社 透明導電性カバーテープ
WO2018225825A1 (ja) * 2017-06-08 2018-12-13 日産化学株式会社 フレキシブルデバイス用基板の製造方法
JP7138651B2 (ja) * 2017-10-31 2022-09-16 デンカ株式会社 カバーフィルム
JP6763421B2 (ja) * 2018-09-18 2020-09-30 大日本印刷株式会社 電子部品包装用カバーテープおよび包装体
JP2022013968A (ja) 2018-11-14 2022-01-19 デンカ株式会社 放熱基板を収容するパッケージおよび梱包箱
SG11202105744QA (en) * 2018-12-19 2021-07-29 Denka Company Ltd Cover film and electronic component package using same
WO2020195713A1 (ja) * 2019-03-26 2020-10-01 三井・ダウ ポリケミカル株式会社 積層体、包装体、フレキシブルコンテナ内袋及びフレキシブルコンテナ
WO2021006208A1 (ja) * 2019-07-11 2021-01-14 デンカ株式会社 カバーフィルム及びそれを用いた電子部品包装体
CN114502482B (zh) * 2019-10-11 2023-10-24 大日本印刷株式会社 电子部件包装用盖带、包装体和包装体用套组
CN110948985A (zh) * 2019-11-28 2020-04-03 江门市蓬江区华龙包装材料有限公司 一种电子载带抗静电易揭膜及其制备方法
JP7469914B2 (ja) * 2020-03-05 2024-04-17 住友ベークライト株式会社 電子部品包装用カバーテープおよび電子部品包装体
JP7289816B2 (ja) * 2020-03-30 2023-06-12 住友ベークライト株式会社 カバーテープおよび電子部品包装体
CN113650384A (zh) * 2021-07-26 2021-11-16 江阴宝柏新型包装材料有限公司 一种易剥离吹膜及其制备方法
WO2023145919A1 (ja) * 2022-01-31 2023-08-03 大日本印刷株式会社 吸湿性フィルムおよび吸湿性積層体

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006327624A (ja) * 2005-05-26 2006-12-07 Dainippon Printing Co Ltd カバーテープおよびその製造方法
JP2010173673A (ja) * 2009-01-28 2010-08-12 Denki Kagaku Kogyo Kk カバーフィルム
CN102348609A (zh) * 2009-03-13 2012-02-08 电气化学工业株式会社 覆盖膜

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3241220B2 (ja) 1994-10-28 2001-12-25 住友ベークライト株式会社 チップ型電子部品包装用カバーテープ
JP3201507B2 (ja) * 1995-05-30 2001-08-20 住友ベークライト株式会社 電子部品包装用カバーテープ
JPH09175592A (ja) * 1995-12-26 1997-07-08 Du Pont Mitsui Polychem Co Ltd 電子部品包装用カバーテープ
JP3801296B2 (ja) 1997-03-13 2006-07-26 信越ポリマー株式会社 トップカバーテープ
JP2000327024A (ja) 1999-05-17 2000-11-28 Shin Etsu Polymer Co Ltd カバーテープ
JP4712502B2 (ja) * 2005-09-29 2011-06-29 電気化学工業株式会社 カバーフィルム
WO2011158550A1 (ja) * 2010-06-15 2011-12-22 電気化学工業株式会社 カバーテープ
EP2600391A1 (en) * 2010-07-28 2013-06-05 Du Pont-Mitsui Polychemicals Co., Ltd. Laminate film, and film for use in production of semiconductor comprising same
JP2012214252A (ja) * 2010-09-30 2012-11-08 Sumitomo Bakelite Co Ltd 電子部品包装用カバーテープ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006327624A (ja) * 2005-05-26 2006-12-07 Dainippon Printing Co Ltd カバーテープおよびその製造方法
JP2010173673A (ja) * 2009-01-28 2010-08-12 Denki Kagaku Kogyo Kk カバーフィルム
CN102348609A (zh) * 2009-03-13 2012-02-08 电气化学工业株式会社 覆盖膜

Also Published As

Publication number Publication date
WO2016024529A1 (ja) 2016-02-18
JP6694387B2 (ja) 2020-05-13
KR102337822B1 (ko) 2021-12-09
KR20170044661A (ko) 2017-04-25
TW201613761A (en) 2016-04-16
CN106604816B (zh) 2020-07-24
JPWO2016024529A1 (ja) 2017-06-01
CN106604816A (zh) 2017-04-26

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