TWI646151B - 樹脂組成物、硬化膜及其製造方法、以及電子零件 - Google Patents

樹脂組成物、硬化膜及其製造方法、以及電子零件 Download PDF

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Publication number
TWI646151B
TWI646151B TW103125024A TW103125024A TWI646151B TW I646151 B TWI646151 B TW I646151B TW 103125024 A TW103125024 A TW 103125024A TW 103125024 A TW103125024 A TW 103125024A TW I646151 B TWI646151 B TW I646151B
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TW
Taiwan
Prior art keywords
group
formula
carbon atoms
resin composition
mass
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TW103125024A
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English (en)
Chinese (zh)
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TW201510082A (zh
Inventor
小野敬司
榎本哲也
大江匡之
鈴木桂子
副島和也
鈴木越晴
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日立化成杜邦微系統股份有限公司
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Publication of TW201510082A publication Critical patent/TW201510082A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW103125024A 2013-07-23 2014-07-22 樹脂組成物、硬化膜及其製造方法、以及電子零件 TWI646151B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-152759 2013-07-23
JP2013152759 2013-07-23

Publications (2)

Publication Number Publication Date
TW201510082A TW201510082A (zh) 2015-03-16
TWI646151B true TWI646151B (zh) 2019-01-01

Family

ID=52392958

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103125024A TWI646151B (zh) 2013-07-23 2014-07-22 樹脂組成物、硬化膜及其製造方法、以及電子零件

Country Status (3)

Country Link
JP (1) JP6414060B2 (ja)
TW (1) TWI646151B (ja)
WO (1) WO2015011893A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017170600A1 (ja) * 2016-03-31 2017-10-05 旭化成株式会社 感光性樹脂組成物、硬化レリーフパターンの製造方法及び半導体装置
WO2018043262A1 (ja) * 2016-08-31 2018-03-08 富士フイルム株式会社 パターン形成方法、積層体の製造方法および電子デバイスの製造方法
KR102266086B1 (ko) 2017-03-29 2021-06-17 후지필름 가부시키가이샤 감광성 수지 조성물, 경화막, 적층체, 경화막의 제조 방법 및 반도체 디바이스
WO2020080217A1 (ja) * 2018-10-19 2020-04-23 富士フイルム株式会社 樹脂組成物、硬化膜、積層体、硬化膜の製造方法、および半導体デバイス
CN109946925A (zh) * 2019-04-08 2019-06-28 深圳先进技术研究院 一种化合物在促进聚酰亚胺低温固化中的应用、聚酰亚胺前体组合物及其用途
JP7335217B2 (ja) 2020-09-24 2023-08-29 信越化学工業株式会社 感光性樹脂組成物、パターン形成方法、硬化被膜形成方法、層間絶縁膜、表面保護膜、及び電子部品

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003255535A (ja) * 2002-03-06 2003-09-10 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、パターン製造法及びこれを用いた電子部品
JP2010090386A (ja) * 1999-03-30 2010-04-22 Asahi Kasei E-Materials Corp 感光性樹脂組成物
TW201129867A (en) * 2009-12-04 2011-09-01 Toray Industries Photosensitive resin composition, laminate using the same and solid-state image pick-up device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4592999B2 (ja) * 2001-04-26 2010-12-08 新日鐵化学株式会社 新規な末端修飾したポリアミック酸及びそれを含む感光性樹脂組成物
JP2003345012A (ja) * 2002-05-28 2003-12-03 Hitachi Chemical Dupont Microsystems Ltd 感光性組成物、及びこれを用いた電子部品
JP4464396B2 (ja) * 2003-06-06 2010-05-19 フジフィルム・エレクトロニック・マテリアルズ・ユーエスエイ・インコーポレイテッド 新規な感光性樹脂組成物
JP5747437B2 (ja) * 2009-04-14 2015-07-15 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物及びこれを用いた回路形成用基板
JP2011123219A (ja) * 2009-12-09 2011-06-23 Asahi Kasei E-Materials Corp 感光性ポリアミド樹脂組成物、硬化レリーフパターンの形成方法及び半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010090386A (ja) * 1999-03-30 2010-04-22 Asahi Kasei E-Materials Corp 感光性樹脂組成物
JP2003255535A (ja) * 2002-03-06 2003-09-10 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、パターン製造法及びこれを用いた電子部品
TW201129867A (en) * 2009-12-04 2011-09-01 Toray Industries Photosensitive resin composition, laminate using the same and solid-state image pick-up device

Also Published As

Publication number Publication date
WO2015011893A1 (ja) 2015-01-29
JPWO2015011893A1 (ja) 2017-03-02
TW201510082A (zh) 2015-03-16
JP6414060B2 (ja) 2018-10-31

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