TWI637656B - 乾燥裝置及乾燥處理方法 - Google Patents

乾燥裝置及乾燥處理方法 Download PDF

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Publication number
TWI637656B
TWI637656B TW105131096A TW105131096A TWI637656B TW I637656 B TWI637656 B TW I637656B TW 105131096 A TW105131096 A TW 105131096A TW 105131096 A TW105131096 A TW 105131096A TW I637656 B TWI637656 B TW I637656B
Authority
TW
Taiwan
Prior art keywords
substrate
pressure
height position
drying
processing container
Prior art date
Application number
TW105131096A
Other languages
English (en)
Chinese (zh)
Other versions
TW201728230A (zh
Inventor
島村明典
林輝幸
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW201728230A publication Critical patent/TW201728230A/zh
Application granted granted Critical
Publication of TWI637656B publication Critical patent/TWI637656B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J11/00—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
    • B41J11/0015—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/811—Controlling the atmosphere during processing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Solid Materials (AREA)
  • Electroluminescent Light Sources (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
TW105131096A 2015-09-29 2016-09-26 乾燥裝置及乾燥處理方法 TWI637656B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015191651A JP6639175B2 (ja) 2015-09-29 2015-09-29 乾燥装置及び乾燥処理方法
JP2015-191651 2015-09-29

Publications (2)

Publication Number Publication Date
TW201728230A TW201728230A (zh) 2017-08-01
TWI637656B true TWI637656B (zh) 2018-10-01

Family

ID=58492131

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105131096A TWI637656B (zh) 2015-09-29 2016-09-26 乾燥裝置及乾燥處理方法

Country Status (4)

Country Link
JP (1) JP6639175B2 (ko)
KR (2) KR101874521B1 (ko)
CN (2) CN110048027B (ko)
TW (1) TWI637656B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6886866B2 (ja) * 2017-05-31 2021-06-16 東京エレクトロン株式会社 減圧乾燥装置
CN107676498B (zh) * 2017-09-25 2019-05-07 武汉华星光电技术有限公司 软烤设备的排气阀组件
JP7119617B2 (ja) * 2018-06-15 2022-08-17 東京エレクトロン株式会社 塗布膜形成方法及び塗布膜形成装置
JP7076135B2 (ja) * 2018-07-27 2022-05-27 株式会社Joled 有機ｅｌ表示パネルの製造方法
CN110328975A (zh) * 2019-07-01 2019-10-15 深圳市华星光电半导体显示技术有限公司 真空干燥装置
CN112254504B (zh) * 2020-10-19 2023-10-17 西安圣华农业科技股份有限公司 隔板可调的农产品烘干设备
CN112880307B (zh) * 2021-01-12 2022-11-22 扬州大学 多片晶圆干燥用的多孔介质型稳定可调节气悬浮流场的装置及实现方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200632989A (en) * 2004-10-07 2006-09-16 Dainippon Screen Mfg Vacuum dryer and vacuum drying method
CN1928475A (zh) * 2005-09-08 2007-03-14 大日本网目版制造株式会社 减压干燥装置及基板干燥方法
TW200837515A (en) * 2006-12-22 2008-09-16 Tokyo Electron Ltd Decompression drying device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3920699B2 (ja) * 2001-09-19 2007-05-30 東京エレクトロン株式会社 減圧乾燥装置及び塗布膜形成方法
JP4244555B2 (ja) * 2002-02-25 2009-03-25 東京エレクトロン株式会社 被処理体の支持機構
CN102290364B (zh) * 2004-06-09 2016-01-13 尼康股份有限公司 基板保持装置、具备其之曝光装置、元件制造方法
JP2007253043A (ja) * 2006-03-22 2007-10-04 Toshiba Corp 液滴噴射装置及び塗布体の製造方法
JP5172132B2 (ja) 2006-11-01 2013-03-27 凸版印刷株式会社 カラーフィルタの製造方法
JP2008311250A (ja) * 2007-06-12 2008-12-25 Tokyo Electron Ltd リフローシステムおよびリフロー方法
JP2010272382A (ja) * 2009-05-22 2010-12-02 Panasonic Corp 機能性素子の製造方法および装置
JP2013161946A (ja) * 2012-02-06 2013-08-19 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP6181358B2 (ja) * 2012-07-25 2017-08-16 東京エレクトロン株式会社 ベーク処理システム及び有機ｅｌ素子の有機機能膜の積層体の製造方法
JP6328434B2 (ja) * 2013-03-14 2018-05-23 東京エレクトロン株式会社 乾燥装置及び乾燥処理方法
US9053917B2 (en) 2013-03-29 2015-06-09 Agilent Technologies, Inc. Vacuum fired and brazed ion pump element

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200632989A (en) * 2004-10-07 2006-09-16 Dainippon Screen Mfg Vacuum dryer and vacuum drying method
CN1928475A (zh) * 2005-09-08 2007-03-14 大日本网目版制造株式会社 减压干燥装置及基板干燥方法
TW200837515A (en) * 2006-12-22 2008-09-16 Tokyo Electron Ltd Decompression drying device

Also Published As

Publication number Publication date
CN110048027A (zh) 2019-07-23
CN106972114B (zh) 2019-01-04
KR101874521B1 (ko) 2018-07-04
KR20180079263A (ko) 2018-07-10
JP2017067343A (ja) 2017-04-06
CN106972114A (zh) 2017-07-21
CN110048027B (zh) 2021-09-28
KR20170038161A (ko) 2017-04-06
TW201728230A (zh) 2017-08-01
KR101973016B1 (ko) 2019-04-26
JP6639175B2 (ja) 2020-02-05

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