CN110048027B - 干燥装置和干燥处理方法 - Google Patents

干燥装置和干燥处理方法 Download PDF

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Publication number
CN110048027B
CN110048027B CN201910012458.1A CN201910012458A CN110048027B CN 110048027 B CN110048027 B CN 110048027B CN 201910012458 A CN201910012458 A CN 201910012458A CN 110048027 B CN110048027 B CN 110048027B
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substrate
support plate
plate group
drying
processing container
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Chinese (zh)
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CN110048027A (zh
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岛村明典
林辉幸
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J11/00—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
    • B41J11/0015—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/811—Controlling the atmosphere during processing

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Solid Materials (AREA)
  • Electroluminescent Light Sources (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
CN201910012458.1A 2015-09-29 2016-09-26 干燥装置和干燥处理方法 Active CN110048027B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015191651A JP6639175B2 (ja) 2015-09-29 2015-09-29 乾燥装置及び乾燥処理方法
JP2015-191651 2015-09-29
CN201610849761.3A CN106972114B (zh) 2015-09-29 2016-09-26 干燥装置和干燥处理方法

Related Parent Applications (1)

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CN201610849761.3A Division CN106972114B (zh) 2015-09-29 2016-09-26 干燥装置和干燥处理方法

Publications (2)

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CN110048027A CN110048027A (zh) 2019-07-23
CN110048027B true CN110048027B (zh) 2021-09-28

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CN201910012458.1A Active CN110048027B (zh) 2015-09-29 2016-09-26 干燥装置和干燥处理方法
CN201610849761.3A Active CN106972114B (zh) 2015-09-29 2016-09-26 干燥装置和干燥处理方法

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Country Status (4)

Country Link
JP (1) JP6639175B2 (ko)
KR (2) KR101874521B1 (ko)
CN (2) CN110048027B (ko)
TW (1) TWI637656B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6886866B2 (ja) * 2017-05-31 2021-06-16 東京エレクトロン株式会社 減圧乾燥装置
CN107676498B (zh) * 2017-09-25 2019-05-07 武汉华星光电技术有限公司 软烤设备的排气阀组件
JP7119617B2 (ja) * 2018-06-15 2022-08-17 東京エレクトロン株式会社 塗布膜形成方法及び塗布膜形成装置
JP7076135B2 (ja) * 2018-07-27 2022-05-27 株式会社Joled 有機ｅｌ表示パネルの製造方法
CN110328975A (zh) * 2019-07-01 2019-10-15 深圳市华星光电半导体显示技术有限公司 真空干燥装置
CN112254504B (zh) * 2020-10-19 2023-10-17 西安圣华农业科技股份有限公司 隔板可调的农产品烘干设备
CN112880307B (zh) * 2021-01-12 2022-11-22 扬州大学 多片晶圆干燥用的多孔介质型稳定可调节气悬浮流场的装置及实现方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1639855A (zh) * 2002-02-25 2005-07-13 东京毅力科创株式会社 半导体处理***中的基板支持机构
CN1758142A (zh) * 2004-10-07 2006-04-12 大日本网目版制造株式会社 减压干燥装置及减压干燥方法
CN103247564A (zh) * 2012-02-06 2013-08-14 东京毅力科创株式会社 基板处理装置和基板处理方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3920699B2 (ja) * 2001-09-19 2007-05-30 東京エレクトロン株式会社 減圧乾燥装置及び塗布膜形成方法
CN102290364B (zh) * 2004-06-09 2016-01-13 尼康股份有限公司 基板保持装置、具备其之曝光装置、元件制造方法
JP2007073833A (ja) * 2005-09-08 2007-03-22 Dainippon Screen Mfg Co Ltd 減圧乾燥装置及び基板乾燥方法
JP2007253043A (ja) * 2006-03-22 2007-10-04 Toshiba Corp 液滴噴射装置及び塗布体の製造方法
JP5172132B2 (ja) 2006-11-01 2013-03-27 凸版印刷株式会社 カラーフィルタの製造方法
JP4272230B2 (ja) * 2006-12-22 2009-06-03 東京エレクトロン株式会社 減圧乾燥装置
JP2008311250A (ja) * 2007-06-12 2008-12-25 Tokyo Electron Ltd リフローシステムおよびリフロー方法
JP2010272382A (ja) * 2009-05-22 2010-12-02 Panasonic Corp 機能性素子の製造方法および装置
JP6181358B2 (ja) * 2012-07-25 2017-08-16 東京エレクトロン株式会社 ベーク処理システム及び有機ｅｌ素子の有機機能膜の積層体の製造方法
JP6328434B2 (ja) * 2013-03-14 2018-05-23 東京エレクトロン株式会社 乾燥装置及び乾燥処理方法
US9053917B2 (en) 2013-03-29 2015-06-09 Agilent Technologies, Inc. Vacuum fired and brazed ion pump element

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1639855A (zh) * 2002-02-25 2005-07-13 东京毅力科创株式会社 半导体处理***中的基板支持机构
CN1758142A (zh) * 2004-10-07 2006-04-12 大日本网目版制造株式会社 减压干燥装置及减压干燥方法
CN103247564A (zh) * 2012-02-06 2013-08-14 东京毅力科创株式会社 基板处理装置和基板处理方法

Also Published As

Publication number Publication date
CN110048027A (zh) 2019-07-23
CN106972114B (zh) 2019-01-04
KR101874521B1 (ko) 2018-07-04
KR20180079263A (ko) 2018-07-10
JP2017067343A (ja) 2017-04-06
CN106972114A (zh) 2017-07-21
KR20170038161A (ko) 2017-04-06
TW201728230A (zh) 2017-08-01
KR101973016B1 (ko) 2019-04-26
TWI637656B (zh) 2018-10-01
JP6639175B2 (ja) 2020-02-05

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