TWI623475B - Disposer and parts inspection device - Google Patents

Abstract

本發明之零件檢查裝置包含：基台，其包含按壓電子零件之檢查用插座；搬送單元，其搭載於基台且將電子零件搬送至檢查用插座；及垂直移動臂，其設置於搬送單元且將電子零件按壓在檢查用插座。上述零件檢查裝置包含連結於基台之受壓臂機構，該受壓臂機構係與按壓電子零件之按壓缸接觸，並阻止按壓缸相對於基台之變位。 The component inspection device of the present invention includes: a base including an inspection socket for pressing electronic parts; a transport unit mounted on the base and transporting electronic parts to the inspection socket; and a vertical moving arm provided on the transport unit and Press the electronic parts against the inspection socket. The above-mentioned part inspection device includes a pressure arm mechanism connected to the abutment. The pressure arm mechanism is in contact with a pressing cylinder that presses the electronic component, and prevents displacement of the pressing cylinder relative to the base.

Description

處置器、及零件檢查裝置 Disposer and parts inspection device

本發明係關於一種對搬送對象進行搬送之處置器(handler)，尤其係關於一種將搬送對象搬送至按壓區域並於該按壓區域進行按壓之處置器及包含該處置器之零件檢查裝置。 The present invention relates to a handler for transferring a transported object, and more particularly, to a handler that transports a transported object to a pressing area and presses on the pressing area, and a component inspection device including the handler.

自先前以來，已知有例如專利文獻1中記載般之檢查電子零件之電特性之零件檢查裝置。於此種零件檢查裝置中使用有如下之處置器，該處置器將作為搬送對象之電子零件搬送至成為按壓區域之檢查用插座(socket)為止，並將電子零件嵌入該檢查用插座。 Conventionally, a component inspection device for inspecting the electrical characteristics of electronic components, such as described in Patent Document 1, has been known. In such a part inspection device, a handler is used which transports electronic parts as a transfer target to an inspection socket which is a pressing area, and embeds the electronic parts in the inspection socket.

於上述處置器中，搭載有用以吸附電子零件之吸附部、及用以將吸附於該吸附部之電子零件嵌入檢查用插座之按壓用之馬達。而且，於將檢查前之電子零件利用檢查用插座進行檢查時，於電子零件吸附於吸附部之狀態下驅動上述馬達，將電子零件之端子嵌入檢查用插座之端子。此時，為了將電子零件之端子與檢查用插座之端子電性連接，需要對電子零件施加特定之按壓力，上述之按壓力係由上述馬達施加。 The handler is equipped with a suction part for sucking electronic parts and a motor for pressing the electronic parts sucked into the suction part into an inspection socket. In addition, when inspecting the electronic parts before inspection using the inspection socket, the motor is driven while the electronic parts are adsorbed on the adsorption part, and the terminals of the electronic parts are fitted into the terminals of the inspection socket. At this time, in order to electrically connect the terminal of the electronic component and the terminal of the inspection socket, a specific pressing force needs to be applied to the electronic component, and the aforementioned pressing force is applied by the motor.

另一方面，近年來，有嵌入於檢查用插座之電子零件之個數增加之傾向，因此將無法利用上述馬達之輸出，對複數個電子零件之各者施加足以連接上述端子間之按壓力。因此，於上述之處置器中搭載有按壓用之氣壓缸(pneumatic cylinder)，並且大於上述馬達之按壓力係自該氣壓缸施加至電子零件。根據利用如上所述之氣壓缸之電子零件 之按壓，由於將上述端子間確實連接，故可高精度地進行電子零件之檢查。 On the other hand, in recent years, the number of electronic parts embedded in inspection sockets has tended to increase. Therefore, the output of the motor cannot be used to apply a pressing force sufficient to each of the plurality of electronic parts to connect the terminals. Therefore, a pneumatic cylinder for pressing is mounted in the above-mentioned handler, and a pressing force greater than that of the motor is applied from the pneumatic cylinder to the electronic component. Based on electronic parts using pneumatic cylinders as described above Since the terminals are surely connected by pressing, the inspection of electronic components can be performed with high accuracy.

[先前技術文獻] [Prior technical literature]

[特許文獻] [Chartered Literature]

[專利文獻1]日本專利特開2010-101776號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2010-101776

然而，如上所述，為了形成於電子零件之各端子之連接而需要特定之按壓力，因此若電子零件之端子數或電子零件之個數增加，則上述氣壓缸所期望之按壓力亦變大。另一方面，若如此氣壓缸之按壓力變大，則來自檢查用插座之反作用力亦自動變大。而且，對於支撐上述氣壓缸之構件或用以使氣壓缸移動之軌道，需要具有不因上述反作用力而變形之程度之剛性。然而，為了提高上述構件及軌道之剛性，無法避免包含該構件及軌道之搬送部之大型化或重量化。 However, as described above, a specific pressing force is required in order to form a connection to each terminal of an electronic component. Therefore, if the number of terminals of the electronic component or the number of electronic components increases, the desired pressing force of the pneumatic cylinder also increases. . On the other hand, if the pressing force of the pneumatic cylinder is increased, the reaction force from the inspection socket is automatically increased. Furthermore, it is necessary for the member supporting the above-mentioned pneumatic cylinder or the track for moving the pneumatic cylinder to have a degree of rigidity not to be deformed by the above-mentioned reaction force. However, in order to increase the rigidity of the above-mentioned members and rails, it is unavoidable to increase the size and weight of the transport section including the members and the rails.

再者，上述問題並不限定於如上述般使用馬達與氣壓缸按壓電子零件之處置器，而為使用設置於搬送部之1個以上之按壓部來按壓搬送對象之處置器所共通之問題。 Furthermore, the above-mentioned problems are not limited to the processor for pressing electronic parts using a motor and a pneumatic cylinder as described above, but are a problem common to a processor that uses one or more pressing sections provided in the transport section to press a transport target.

本發明係鑒於上述實際情況而完成者，其目的在於提供一種於藉由對搬送對象進行搬送之搬送部按壓搬送對象之處置器中，可抑制搬送部之大型化或重量化之處置器、及包含該處置器之零件檢查裝置。 The present invention has been made in view of the above-mentioned actual circumstances, and an object thereof is to provide a disposer capable of suppressing an increase in size or weight of the conveying unit in a disposer that presses the conveyed object by a conveying unit that conveys the conveying object, and A part inspection device including the processor.

本發明之態樣之一為，處置器包含基台、對搬送對象進行搬送之搬送部、及連結於上述基台之受壓部，於上述搬送部設有將上述搬送對象朝向上述基台按壓之按壓部，於上述受壓部設有與上述按壓部之一部分接觸之接觸部。 One aspect of the present invention is that the disposer includes a base, a transporting unit that transports a transported object, and a pressure receiving unit connected to the base, and the transporting unit is provided with a function of pressing the transported object toward the base The pressing portion is provided with a contact portion in contact with a part of the pressing portion on the pressure receiving portion.

於按壓部之按壓力作用於搬送對象時，抵抗該按壓力之反作用力 將作用於搬送部。根據上述態樣，按壓力之反作用力中之一部分作用於搬送部，而其剩餘部分經由設置於受壓部之接觸部而作用於基台。 即，並非按壓力之反作用力之全部作用於搬送部，而該反作用力之一部分將向基台分散。藉此，以所期望之按壓力而搬送對象被按壓，而搬送部所要求之剛性為可耐受按壓力之反作用力之一部分者即可。因此，可抑制搬送部之大型化或重量化。 When the pressing force of the pressing part acts on the conveyed object, resist the reaction force of the pressing force Will act on the transport section. According to the aspect described above, one part of the reaction force of the pressing force acts on the conveying part, and the remaining part acts on the abutment via the contact part provided on the pressure receiving part. That is, not all of the reaction force of the pressing force acts on the conveying section, and a part of the reaction force is dispersed to the abutment. Thereby, the conveyed object can be pressed with a desired pressing force, and the rigidity required by the conveying section can be a part that can withstand the reaction force of the pressing force. Therefore, it is possible to suppress an increase in size and weight of the transport section.

本發明之態樣之一較佳為，上述按壓部包含將上述搬送對象朝向上述基台按壓之第1按壓部、及將上述第1按壓部朝向上述基台按壓之第2按壓部，上述受壓部之上述接觸部以與設置於上述第2按壓部之一部分之突出部接觸之方式可動。 In one aspect of the present invention, it is preferable that the pressing portion includes a first pressing portion that presses the conveyed object toward the base and a second pressing portion that presses the first pressing portion toward the base. The contact portion of the pressing portion is movable so as to be in contact with a protruding portion provided in a part of the second pressing portion.

根據上述構成，構成按壓部之第1按壓部與第2按壓部中受壓部之接觸部係以與設置於第2按壓部之一部分之突出部接觸之方式可動。 因此，藉由上述接觸可抑制第2按壓部因第1按壓部之按壓力而退回。 而且，施加至搬送對象之按壓力因受壓部與第2按壓部之機械性之接觸而固定，故亦可抑制該按壓力發生變動。 According to the above configuration, the contact portion between the first pressing portion and the pressure receiving portion of the second pressing portion is movable so as to be in contact with a protruding portion provided in a portion of the second pressing portion. Therefore, by the contact, the second pressing portion can be prevented from being returned by the pressing force of the first pressing portion. Furthermore, since the pressing force applied to the conveyed object is fixed by the mechanical contact between the pressure receiving portion and the second pressing portion, it is also possible to suppress the pressing force from changing.

本發明之態樣之一較佳為，上述按壓部包含將上述搬送對象朝向上述基台按壓之第1按壓部、及將上述第1按壓部朝向上述基台按壓之第2按壓部，上述受壓部之上述接觸部以解除與設置於上述第2按壓部之一部分之突出部之接觸之方式可動。 In one aspect of the present invention, it is preferable that the pressing portion includes a first pressing portion that presses the conveyed object toward the base and a second pressing portion that presses the first pressing portion toward the base. The contact portion of the pressing portion is movable so as to release contact with a protruding portion provided on a part of the second pressing portion.

根據上述構成，構成按壓部之第1按壓部與第2按壓部中受壓部之接觸部係以解除與設置於第2按壓部之一部分之突出部之接觸之方式可動。因此，藉由上述接觸可抑制第2按壓部因第1按壓部之按壓力而退回，又，藉由該接觸之解除，按壓部之移動將不易受突出部影響。 而且，施加至搬送對象之按壓力因受壓部與第2按壓部之機械性之接觸而固定，故亦可抑制該按壓力發生變動。 According to the above configuration, the contact portion of the first pressing portion and the pressure receiving portion of the second pressing portion is movable so as to release contact with a protruding portion provided in a portion of the second pressing portion. Therefore, it is possible to prevent the second pressing portion from returning due to the pressing force of the first pressing portion by the contact, and by releasing the contact, the movement of the pressing portion is not easily affected by the protruding portion. Furthermore, since the pressing force applied to the conveyed object is fixed by the mechanical contact between the pressure receiving portion and the second pressing portion, it is also possible to suppress the pressing force from changing.

本發明之態樣之一較佳為，上述第1按壓部為按壓缸，上述第2按 壓部包含使上述按壓缸上升及下降之馬達，上述第1按壓部之按壓力大於上述第2按壓部之按壓力。 In one aspect of the present invention, it is preferable that the first pressing portion is a pressing cylinder, and the second pressing portion is The pressing portion includes a motor for raising and lowering the pressing cylinder, and a pressing force of the first pressing portion is greater than a pressing force of the second pressing portion.

由按壓缸施加之按壓力通常藉由使按壓缸之作動壓增大，例如提高供給至按壓缸之壓縮空氣之壓力而變大。於上述態樣中，需要相對較大之按壓力之第1按壓部包含此種按壓缸。因此，與藉由馬達之驅動而施加相對較大之按壓力之構成相比，可簡化搬送部之構成，進而可簡化處置器之構成。又，與第1按壓部包含馬達之情形相比，亦更容易使施加至搬送對象之按壓力增大。 The pressing pressure applied by the pressing cylinder is generally increased by increasing the operating pressure of the pressing cylinder, for example, by increasing the pressure of the compressed air supplied to the pressing cylinder. In the above aspect, the first pressing portion that requires a relatively large pressing force includes such a pressing cylinder. Therefore, compared with a configuration in which a relatively large pressing force is applied by driving of a motor, the configuration of the conveying section can be simplified, and the configuration of the handler can be simplified. Moreover, compared with the case where a motor is included in a 1st pressing part, it becomes easier to increase the pressing force applied to a conveyance target.

本發明之態樣之一較佳為，包含控制上述馬達之驅動之馬達控制部，上述馬達控制部於上述按壓缸按壓上述搬送對象之狀態下，藉由轉矩控制驅動上述馬達。 One aspect of the present invention preferably includes a motor control unit that controls driving of the motor, and the motor control unit drives the motor by torque control in a state where the pressing cylinder presses the conveying object.

使用馬達之搬送對象之按壓可藉由馬達之位置控制及轉矩控制之至少一個而進行。再者，所謂位置控制，係指以按壓缸之位置成為特定之位置之方式，控制馬達之旋轉位置。另一方面，所謂轉矩控制，係指以對搬送對象施加特定之按壓力之方式，控制馬達之產生轉矩。 The pressing of the conveyed object using the motor can be performed by at least one of position control and torque control of the motor. The position control refers to controlling the rotation position of the motor in such a manner that the position of the pressing cylinder becomes a specific position. On the other hand, the so-called torque control refers to controlling the torque generated by the motor by applying a specific pressing force to the conveyed object.

此處，上述按壓缸之按壓力越大，則對於該按壓缸之支撐側之反作用力、即對於上述馬達之負載越大。此時，若藉由上述之位置控制而驅動馬達，則只要馬達之輸出不超過上述反作用力，則馬達之旋轉位置不會到達目標之旋轉位置。而且，馬達之驅動電流會持續增大，對馬達之內部施加過量之負載。 Here, the larger the pressing force of the pressing cylinder, the greater the reaction force to the supporting side of the pressing cylinder, that is, the larger the load on the motor. At this time, if the motor is driven by the above-mentioned position control, as long as the output of the motor does not exceed the above-mentioned reaction force, the rotational position of the motor will not reach the target rotational position. In addition, the driving current of the motor continues to increase, and an excessive load is applied to the inside of the motor.

就該方面而言，於上述態樣中，於按壓缸之按壓力施加至搬送對象之狀態下，藉由轉矩控制而驅動馬達。因此，即便因按壓缸之伸長而該按壓缸之支撐側退回，馬達亦輸出特定之轉矩，既然如此便不會對該馬達施加過量之負載。 In this aspect, in the above aspect, the motor is driven by torque control in a state where the pressing force of the pressing cylinder is applied to the conveyed object. Therefore, even if the support side of the pressing cylinder is retracted due to the extension of the pressing cylinder, the motor outputs a specific torque. In this case, no excessive load is applied to the motor.

本發明之態樣之一較佳為，包含控制上述馬達之驅動之馬達控制部，上述馬達控制部於上述按壓缸按壓上述搬送對象之前，藉由轉矩 控制而驅動上述馬達。 One aspect of the present invention preferably includes a motor control unit that controls the driving of the motor, and the motor control unit applies torque before the pressing cylinder presses the conveying object. Control to drive the motor.

根據上述態樣，於按壓缸對搬送對象施加按壓力時，藉由轉矩控制而驅動馬達。因此，不會對馬達施加過量之負載，而且施加至搬送對象之按壓力亦變得穩定。 According to the aspect described above, when the pressing cylinder applies a pressing force to the conveyed object, the motor is driven by torque control. Therefore, an excessive load is not applied to the motor, and the pressing force applied to the conveyed object becomes stable.

本發明之態樣之一較佳為，上述接觸部為相互對向之一對可動臂，上述一對可動臂變位至與上述突出部接觸之位置、及自上述突出部離開之位置。 In one aspect of the present invention, it is preferable that the contact portion is a pair of movable arms facing each other, and the pair of movable arms is displaced to a position in contact with the protruding portion, and a position separated from the protruding portion.

根據上述態樣，相互對向之一對可動臂與設置於按壓部之突出部接觸，來自按壓部之按壓力之反作用力作用於相互對向之一對可動臂之各者。因此，與來自按壓部之按壓力之反作用力作用於一個部位之態樣相比，可擴大該反作用力分散之範圍，進而可抑制受壓部或基台所要求之剛性。 According to the above aspect, one pair of movable arms facing each other is in contact with the protruding portion provided on the pressing portion, and the reaction force of the pressing force from the pressing portion acts on each of the pair of movable arms facing each other. Therefore, compared with the case where the reaction force of the pressing force from the pressing portion acts on one part, the range of dispersion of the reaction force can be enlarged, and the rigidity required by the pressure receiving portion or the abutment can be suppressed.

本發明之態樣之一較佳為，上述搬送部具有吸附複數個上述搬送對象之狀態，上述按壓部具有按壓複數個上述搬送對象之狀態。 In one aspect of the present invention, it is preferable that the conveyance unit has a state in which a plurality of the conveyance objects are adsorbed, and the pressing unit has a state in which a plurality of the conveyance objects are pressed.

於具有按壓複數個搬送對象之狀態之態樣中，具有隨著搬送對象之個數變大，施加至複數個搬送對象之整體之按壓力亦自動變大之狀態。此時，具有相應於施加至連接對象之整體之按壓力，而該按壓力之反作用力亦自動變大之狀態。就該點而言，根據上述態樣，如上述般變大之反作用力之一部分將向基台分散。因此，抑制搬送部之大型化或重量化之效果變得更加顯著。 In a state in which a plurality of conveyance objects are pressed, as the number of conveyance objects becomes larger, a pressing force applied to the entirety of the plurality of conveyance objects also automatically increases. At this time, there is a state in which the pressing force corresponding to the entirety of the connection target is applied, and the reaction force of the pressing force is automatically increased. In this regard, according to the aspect described above, a part of the reaction force that becomes larger as described above will be dispersed to the abutment. Therefore, the effect of suppressing the increase in size or weight of the conveying section becomes more significant.

本發明之態樣之一為，零件檢查裝置包含基台、搬送電子零件之搬送部、連結於上述基台之受壓部、及設置於上述基台之檢查用插座，於上述搬送部設置有將上述電子零件朝向上述檢查用插座按壓之按壓部，於上述受壓部設置有與上述按壓部之一部分接觸之接觸部。 According to one aspect of the present invention, the component inspection device includes a base, a transfer unit for transferring electronic parts, a pressure receiving unit connected to the base, and an inspection socket provided on the base, and the transfer unit is provided with A pressing portion that presses the electronic component toward the inspection socket, and a contact portion that is in contact with a part of the pressing portion is provided in the pressure receiving portion.

於按壓部之按壓力作用於電子零件時，抵抗該按壓力之反作用力作用於搬送部。根據上述態樣，按壓力之反作用力中之一部分作用於 搬送部，而其剩餘部分經由設置於受壓部之接觸部而作用於基台。 即，並非按壓力之反作用力之全部作用於搬送部，而該反作用力之一部分將向基台分散。藉此，以所期望之按壓力而搬送對象被按壓，然而搬送部所要求之剛性為可耐受按壓力之反作用力之一部分者即可。 因此，可抑制搬送部之大型化或重量化。 When the pressing force of the pressing portion acts on the electronic component, a reaction force against the pressing force acts on the conveying portion. According to the above aspect, a part of the reaction force of the pressing force acts on The conveyance part, and the remaining part acts on the abutment via the contact part provided in the pressure receiving part. That is, not all of the reaction force of the pressing force acts on the conveying section, and a part of the reaction force is dispersed to the abutment. As a result, the conveyed object is pressed with the desired pressing force, but the rigidity required by the conveying section may be a part that can withstand the reaction force of the pressing force. Therefore, it is possible to suppress an increase in size and weight of the transport section.

10‧‧‧處置器 10‧‧‧ Disposer

11‧‧‧基台 11‧‧‧ abutment

11a‧‧‧搭載面 11a‧‧‧ Mounting surface

12‧‧‧蓋構件 12‧‧‧ cover member

20‧‧‧供給機械手 20‧‧‧ supply robot

21‧‧‧供給側固定導件 21‧‧‧ Supply side fixing guide

22‧‧‧供給側可動導件 22‧‧‧ Supply side movable guide

23‧‧‧供給用手單元 23‧‧‧ Supply Hand Unit

31‧‧‧搬送導件 31‧‧‧ transport guide

32‧‧‧第1梭子 32‧‧‧ the first shuttle

32a‧‧‧供給用梭盤 32a‧‧‧ supply shuttle

37a‧‧‧供給用梭盤 37a‧‧‧ supply shuttle

32b‧‧‧回收用梭盤 32b‧‧‧Recycling shuttle

37b‧‧‧回收用梭盤 37b‧‧‧Recycling shuttle

32c‧‧‧第1導梭板 32c‧‧‧1st shuttle

33‧‧‧檢查用插座 33‧‧‧ Inspection socket

33a‧‧‧檢查用凹穴 33a‧‧‧Inspection pocket

34‧‧‧第1搬送單元 34‧‧‧The first transfer unit

35‧‧‧受壓臂機構 35‧‧‧Pressed arm mechanism

36‧‧‧受壓臂機構 36‧‧‧Pressed arm mechanism

35a‧‧‧支撐體 35a‧‧‧ support

36a‧‧‧支撐體 36a‧‧‧ support

35b‧‧‧受壓臂 35b‧‧‧Pressed arm

36b‧‧‧受壓臂 36b‧‧‧compressed arm

35s‧‧‧臂缸 35s‧‧‧arm cylinder

36s‧‧‧臂缸 36s‧‧‧arm cylinder

37‧‧‧第2梭子 37‧‧‧ 2nd shuttle

37c‧‧‧第1導梭板 37c‧‧‧1st shuttle

38‧‧‧第2搬送單元 38‧‧‧ 2nd transfer unit

40‧‧‧回收機械手 40‧‧‧Recycling robot

41‧‧‧回收側固定導件 41‧‧‧Recycling side fixing guide

42‧‧‧回收側可動導件 42‧‧‧Removable side movable guide

43‧‧‧回收用手單元 43‧‧‧Recycling hand unit

51‧‧‧水平移動臂 51‧‧‧horizontal moving arm

51M‧‧‧按壓馬達 51M‧‧‧Press motor

52‧‧‧垂直移動臂 52‧‧‧Vertical mobile arm

52a‧‧‧被受壓片 52a‧‧‧ compressed

53‧‧‧按壓缸 53‧‧‧Press cylinder

54‧‧‧吸附部 54‧‧‧ Adsorption Department

60‧‧‧控制裝置 60‧‧‧Control device

61‧‧‧輸送機驅動部 61‧‧‧Conveyor Drive

62‧‧‧導件驅動部 62‧‧‧Guide Driver

63‧‧‧梭子驅動部 63‧‧‧ Shuttle drive unit

64‧‧‧手單元驅動部 64‧‧‧Hand unit driver

64a‧‧‧手馬達驅動部 64a‧‧‧Hand motor drive unit

64b‧‧‧抽吸閥驅動部 64b‧‧‧suction valve driving unit

65‧‧‧搬送單元驅動部 65‧‧‧Transport unit drive unit

65a‧‧‧搬送馬達驅動部 65a‧‧‧Transport motor drive unit

65b‧‧‧按壓馬達驅動部 65b‧‧‧Press motor drive

65c‧‧‧按壓缸驅動部 65c‧‧‧Press cylinder drive

65d‧‧‧抽吸閥驅動部 65d‧‧‧suction valve driving unit

66‧‧‧受壓臂驅動部 66‧‧‧Pressed arm drive section

C1‧‧‧輸送機 C1‧‧‧Conveyor

C2‧‧‧輸送機 C2‧‧‧ conveyor

C3‧‧‧輸送機 C3‧‧‧ conveyor

C4‧‧‧輸送機 C4‧‧‧ conveyor

C1a‧‧‧輸送機托盤 C1a‧‧‧Conveyor tray

C2a‧‧‧輸送機托盤 C2a‧‧‧ conveyor tray

C3a‧‧‧輸送機托盤 C3a‧‧‧conveyor tray

C4a‧‧‧輸送機托盤 C4a‧‧‧conveyor tray

E51M‧‧‧編碼器 E51M‧‧‧ Encoder

EMC‧‧‧編碼器 EMC‧‧‧ Encoder

EMS‧‧‧編碼器 EMS‧‧‧ Encoder

EMX‧‧‧編碼器 EMX‧‧‧ Encoder

EMY‧‧‧編碼器 EMY‧‧‧ Encoder

EMZ‧‧‧編碼器 EMZ‧‧‧ Encoder

ESV1‧‧‧抽吸感測器 ESV1‧‧‧Suction sensor

ESV2‧‧‧抽吸感測器 ESV2‧‧‧Suction sensor

MC‧‧‧輸送機馬達 MC‧‧‧Conveyor motor

MS‧‧‧梭子馬達 MS‧‧‧ Shuttle motor

MX‧‧‧導件馬達 MX‧‧‧Guide Motor

MY‧‧‧搬送馬達 MY‧‧‧ transport motor

MZ‧‧‧手馬達 MZ‧‧‧Hand Motor

SV1‧‧‧抽吸閥 SV1‧‧‧Suction valve

SV2‧‧‧抽吸閥 SV2‧‧‧Suction valve

T‧‧‧電子零件 T‧‧‧electronic parts

圖1係表示本發明中之零件檢查裝置之一實施形態之整體構成之概略俯視圖。 FIG. 1 is a schematic plan view showing the overall configuration of an embodiment of a part inspection device according to the present invention.

圖2係該零件檢查裝置所包含之處置器中之第1搬送單元及受壓臂機構之側面構造之側視圖。 FIG. 2 is a side view of the side structure of the first transfer unit and the pressure arm mechanism in the handler included in the part inspection device.

圖3係表示該處置器之電性構成之方塊圖。 Fig. 3 is a block diagram showing the electrical configuration of the processor.

圖4係表示該處置器所包含之各種馬達之驅動態樣之時序圖。 FIG. 4 is a timing chart showing driving states of various motors included in the handler.

圖5係表示第1搬送單元與受壓臂機構之作動態樣之圖，且係使(a)第1搬送單元及受壓臂機構之平面構造與(b)端面構造相對應而表示之圖。 Fig. 5 is a diagram showing dynamic patterns of the first conveying unit and the pressure arm mechanism, and is a diagram showing (a) the planar structure of the first conveying unit and the pressure arm mechanism corresponding to (b) the end face structure .

圖6係表示第1搬送單元與受壓臂機構之作動態樣之圖，且係使(a)第1搬送單元及受壓臂機構之平面構造與(b)端面構造相對應而表示之圖。 Fig. 6 is a diagram showing the dynamics of the first transfer unit and the pressure arm mechanism, and is a diagram showing (a) the planar structure of the first transfer unit and the pressure arm mechanism corresponding to (b) the end surface structure .

圖7係表示第1搬送單元與受壓臂機構之作動態樣之圖，且係使(a)第1搬送單元及受壓臂機構之平面構造與(b)端面構造相對應而表示之圖。 Fig. 7 is a diagram showing the dynamics of the first transfer unit and the pressure arm mechanism, and is a diagram showing (a) the planar structure of the first transfer unit and the pressure arm mechanism corresponding to (b) the end face structure .

圖8係表示第1搬送單元與受壓臂機構之作動態樣之圖，且係使(a)第1搬送單元及受壓臂機構之平面構造與(b)端面構造相對應而表示之圖。 FIG. 8 is a diagram showing dynamic patterns of the first transfer unit and the pressure arm mechanism, and is a diagram showing (a) the planar structure of the first transfer unit and the pressure arm mechanism corresponding to (b) the end surface structure .

圖9係表示第1搬送單元與受壓臂機構之作動態樣之圖，且係使(a)第1搬送單元及受壓臂機構之平面構造與(b)端面構造相對應而表示 之圖。 FIG. 9 is a diagram showing the dynamics of the first transfer unit and the pressure arm mechanism, and shows (a) the planar structure of the first transfer unit and the pressure arm mechanism corresponding to (b) the end structure Figure.

圖10係表示第1搬送單元與受壓臂機構之作動態樣之圖，且係使(a)第1搬送單元及受壓臂機構之平面構造與(b)端面構造相對應而表示之圖。 FIG. 10 is a diagram showing the dynamics of the first transfer unit and the pressure arm mechanism, and is a diagram showing (a) the planar structure of the first transfer unit and the pressure arm mechanism corresponding to (b) the end surface structure .

圖11係表示第1搬送單元與受壓臂機構之作動態樣之圖，且係使(a)第1搬送單元及受壓臂機構之平面構造與(b)端面構造相對應而表示之圖。 FIG. 11 is a diagram showing the dynamics of the first transfer unit and the pressure arm mechanism, and is a diagram showing (a) the planar structure of the first transfer unit and the pressure arm mechanism corresponding to (b) the end surface structure .

圖12係表示第1搬送單元與受壓臂機構之作動態樣之圖，且係使(a)第1搬送單元及受壓臂機構之平面構造與(b)端面構造相對應而表示之圖。 Fig. 12 is a diagram showing dynamic patterns of the first transfer unit and the pressure arm mechanism, and is a diagram showing (a) the planar structure of the first transfer unit and the pressure arm mechanism corresponding to (b) the end surface structure .

以下，參照圖1~圖12對使本發明之處置器及零件檢查裝置具體化之一實施形態進行說明。首先，參照圖1對零件檢查裝置之構成進行說明。 Hereinafter, an embodiment of a treatment device and a component inspection device of the present invention will be described with reference to FIGS. 1 to 12. First, the structure of a part inspection apparatus is demonstrated with reference to FIG.

[零件檢查裝置之構成] [Configuration of parts inspection device]

如圖1所示，於零件檢查裝置所包含之處置器10之基台11，搭載有各種機械手之搭載面11a係作為上表面而設置，該搭載面11a之大部分由蓋構件12覆蓋。由該等蓋構件12與搭載面11a所包圍之空間即搬送空間藉由自零件檢查裝置之外部供給之乾空氣而將濕度與溫度維持為特定值。 As shown in FIG. 1, the mounting surface 11 a on which the various robots are mounted on the base 11 of the handler 10 included in the component inspection device is provided as an upper surface, and most of the mounting surface 11 a is covered by the cover member 12. The space enclosed by the cover members 12 and the mounting surface 11a, that is, the conveying space, maintains humidity and temperature at specific values by dry air supplied from the outside of the component inspection device.

於基台11之搭載面11a，沿一個方向延伸之4個輸送機排列於與該輸送機之搬送方向正交之方向上。4個輸送機中，於作為輸送機之排列方向之X方向之一側，敷設有2個供給用輸送機C1、C2，另一方面，於X方向之另一側，敷設有2個回收用輸送機C3、C4。而且，於供給用輸送機C1、C2中，供給用輸送機托盤C1a、C2a自蓋構件12之外側朝向內側搬運。又，於回收用輸送機C3、C4中，回收用輸送機 托盤C3a、C4a自蓋構件12之內側朝向外側搬運。再者，於供給用輸送機托盤C1a、C2a，收容有作為搬送對象之檢查前之複數個電子零件T，又，於回收用輸送機托盤C3a、C4a，收容有檢查後之複數個電子零件T。 On the mounting surface 11a of the base 11, four conveyors extending in one direction are arranged in a direction orthogonal to the conveying direction of the conveyor. Of the four conveyors, two supply conveyors C1 and C2 are laid on one side of the X direction which is the arrangement direction of the conveyors, and two collection conveyors are laid on the other side of the X direction. Conveyors C3, C4. In the supply conveyors C1 and C2, the supply conveyor trays C1a and C2a are conveyed from the outside of the cover member 12 toward the inside. Moreover, among the recycling conveyors C3 and C4, the recycling conveyor The trays C3a and C4a are carried from the inside to the outside of the cover member 12. In addition, the supply conveyor trays C1a and C2a contain a plurality of electronic components T before inspection as a transfer target, and the recovery conveyor trays C3a and C4a contain a plurality of electronic components T after inspection .

於上述基台11之搭載面11a上，搭載有於X方向上相互對向之供給機械手20與回收機械手40。供給機械手20配置於供給用輸送機C1、C2之Y方向上，又，回收機械手40配置於回收用輸送機C3、C4之Y方向上。 On the mounting surface 11 a of the base 11, a supply robot 20 and a recovery robot 40 that face each other in the X direction are mounted. The supply robot 20 is arranged in the Y direction of the supply conveyors C1 and C2, and the recovery robot 40 is arranged in the Y direction of the collection conveyors C3 and C4.

供給機械手20包含作為沿Y方向延伸之固定軸之供給側固定導件21、作為連結於供給側固定導件21之可動軸之供給側可動導件22、及連結於供給側可動導件22且沿著供給側可動導件22移動之供給用手單元23。 The supply robot 20 includes a supply-side fixed guide 21 as a fixed shaft extending in the Y direction, a supply-side movable guide 22 as a movable shaft connected to the supply-side fixed guide 21, and a supply-side movable guide 22. The supply hand unit 23 moves along the supply-side movable guide 22.

供給側可動導件22為自供給側固定導件21向回收機械手40側延伸之可動軸，其相對於供給側固定導件21，可沿Y方向進行往返移動地連結。供給用手單元23為配置於供給側可動導件22之搭載面11a側之末端效應器，其相對於供給側可動導件22，可沿X方向進行往返移動地連結。又，供給用手單元23可自供給側可動導件22朝向搭載面11a之下降且可自搭載面11a側朝向供給側可動導件22之上升地連結於供給側可動導件22。 The supply-side movable guide 22 is a movable shaft extending from the supply-side fixed guide 21 to the recovery robot 40 side, and is connected to the supply-side fixed guide 21 in a reciprocating manner in the Y direction. The supply hand unit 23 is an end effector disposed on the mounting surface 11a side of the supply-side movable guide 22, and is connected to the supply-side movable guide 22 in a reciprocating manner in the X direction. In addition, the supply hand unit 23 is connected to the supply-side movable guide 22 so as to be able to descend from the supply-side movable guide 22 toward the mounting surface 11 a and to rise from the mounting surface 11 a side toward the supply-side movable guide 22.

而且，供給側可動導件22沿著供給側固定導件21向供給用輸送機C1、C2側移動，並且供給用手單元23沿著供給側可動導件22移動至供給用輸送機托盤C1a、C2a之正上方為止。藉此，載置於供給用輸送機托盤C1a、C2a之電子零件T吸附於供給用手單元23，然後自供給用輸送機托盤C1a、C2a提昇。又，自該狀態起，供給側可動導件22沿著供給側固定導件21自供給用輸送機C1、C2上離開，藉此將吸附於供給用手單元23之電子零件T向上述搬送空間內之特定之位置供 給。 Further, the supply-side movable guide 22 moves along the supply-side fixed guide 21 toward the supply conveyors C1 and C2, and the supply hand unit 23 moves along the supply-side movable guide 22 to the supply conveyor tray C1a, Up to C2a. As a result, the electronic components T placed on the supply conveyor trays C1a and C2a are attracted to the supply hand unit 23 and then lifted from the supply conveyor trays C1a and C2a. From this state, the supply-side movable guide 22 moves away from the supply conveyors C1 and C2 along the supply-side fixed guide 21, thereby moving the electronic component T adsorbed to the supply hand unit 23 to the above-mentioned transport space. Specific location within give.

回收機械手40係與供給機械手20同樣地，包含作為沿Y方向延伸之固定軸之回收側固定導件41、作為連結於回收側固定導件41之可動軸之回收側可動導件42、及連結於回收側可動導件42且沿著回收側可動導件42於X方向上移動之回收用手單元43。 The recovery robot 40 is similar to the supply robot 20 and includes a recovery-side fixed guide 41 as a fixed shaft extending in the Y direction, and a recovery-side movable guide 42 as a movable shaft connected to the recovery-side fixed guide 41. And a recovery hand unit 43 connected to the recovery-side movable guide 42 and moving in the X direction along the recovery-side movable guide 42.

回收側可動導件42為自回收側固定導件41向供給機械手20側延伸之可動軸，其相對於回收側固定導件41，可沿Y方向進行往返移動地連結。回收用手單元43為配置於回收側可動導件42之搭載面11a側之末端效應器，其相對於回收側可動導件42，可沿X方向進行往返移動地連結。又，回收用手單元43可自回收側可動導件42朝向搭載面11a之下降且可自搭載面11a側朝向回收側可動導件42之上升地連結於回收側可動導件42。 The recovery-side movable guide 42 is a movable shaft extending from the recovery-side fixed guide 41 to the supply robot 20 side, and is connected to the recovery-side fixed guide 41 in a reciprocating manner in the Y direction. The recovery hand unit 43 is an end effector disposed on the mounting surface 11a side of the recovery-side movable guide 42 and is connected to the recovery-side movable guide 42 in a reciprocating manner in the X direction. In addition, the recovery hand unit 43 is connected to the recovery-side movable guide 42 so as to be able to descend from the recovery-side movable guide 42 toward the mounting surface 11 a and upward from the mounting surface 11 a toward the recovery-side movable guide 42.

而且，回收側可動導件42沿著回收側固定導件41向回收用輸送機C3、C4側移動，並且回收用手單元43沿著回收側可動導件42，移動至回收用輸送機托盤C3a、C4a之正上方為止。藉此，將吸附於回收用手單元43之電子零件T載置於回收用輸送機托盤C3a、C4a。 Further, the recovery-side movable guide 42 moves along the recovery-side fixed guide 41 toward the recovery conveyors C3 and C4, and the recovery hand unit 43 moves along the recovery-side movable guide 42 to the recovery conveyor tray C3a. , Just above C4a. As a result, the electronic components T adsorbed on the collection hand unit 43 are placed on the collection conveyor trays C3a and C4a.

於蓋構件12之內側面，沿Y方向延伸之搬送導件31固定於該內側面中之X方向之大致中央。於該搬送導件31中之兩端部之下方，配設有沿X方向延伸之第1梭子32與同樣地沿X方向延伸之第2梭子37。 On the inner side surface of the cover member 12, a transport guide 31 extending in the Y direction is fixed at approximately the center in the X direction of the inner side surface. A first shuttle 32 extending in the X direction and a second shuttle 37 extending in the X direction are disposed below both ends of the transport guide 31.

第1梭子32連結於固定設置於搭載面11a之沿X方向延伸之第1導梭板32c，以於X方向上，與供給側可動導件22及回收側可動導件42之任一者重疊之方式，沿X方向滑動。於第1梭子32中之上述供給機械手20側，固定有供給用梭盤32a，又，於第1梭子32中之上述回收機械手40側，固定有回收用梭盤32b。於供給用梭盤32a，收容有作為搬送對象之檢查前之複數個電子零件T，又，於回收用梭盤32b，收容有檢查後之複數個電子零件T。 The first shuttle 32 is connected to the first shuttle plate 32c extending in the X direction and fixedly provided on the mounting surface 11a so as to overlap with either the supply-side movable guide 22 or the recovery-side movable guide 42 in the X direction. Way, slide in the X direction. A supply shuttle 32a is fixed to the supply robot 20 side of the first shuttle 32, and a recovery shuttle 32b is fixed to the recovery robot 40 side of the first shuttle 32. The supply shuttle 32a contains a plurality of electronic components T before the inspection as a transfer target, and the recovery shuttle 32b contains a plurality of electronic components T after the inspection.

第2梭子37亦連結於固定設置於搭載面11a之沿X方向延伸之第2導梭板37c，以於X方向上，與供給側可動導件22及回收側可動導件42之任一者重疊之方式，沿X方向滑動。於第2梭子37中之上述供給機械手20側，固定有供給用梭盤37a，又，於第2梭子37中之上述回收機械手40側，固定有回收用梭盤37b。於供給用梭盤37a，收容有作為搬送對象之檢查前之複數個電子零件T，又，於回收用梭盤37b，收容有檢查後之複數個電子零件T。 The second shuttle 37 is also connected to the second shuttle plate 37c fixedly provided on the mounting surface 11a and extending in the X direction so as to be in the X direction with either the supply-side movable guide 22 or the recovery-side movable guide 42. To overlap, slide in the X direction. A supply shuttle 37a is fixed to the supply robot 20 side of the second shuttle 37, and a recovery shuttle 37b is fixed to the recovery robot 40 side of the second shuttle 37. The supply shuttle 37a contains a plurality of electronic components T before the inspection as a transfer target, and the recovery shuttle 37b contains a plurality of electronic components T after the inspection.

搭載面11a中，於搬送空間之大致中央，設置有貫通搭載面11a之矩形開口，並且，作為同時進行複數個電子零件T之檢查之連接對象之檢查用插座33係埋設於該矩形開口中。檢查用插座33為嵌入電子零件T之插座，其連結於用以檢查該電子零件T之未圖示之檢查單元。 檢查單元係與收容於基台11之內部之處置器不同之裝置，與處置器一併構成零件檢查裝置。 In the mounting surface 11a, a rectangular opening penetrating the mounting surface 11a is provided at approximately the center of the transport space, and an inspection socket 33 as a connection target for performing inspection of a plurality of electronic components T at the same time is buried in the rectangular opening. The inspection socket 33 is a socket into which the electronic component T is embedded, and is connected to an inspection unit (not shown) for inspecting the electronic component T. The inspection unit is a device different from the disposer housed inside the base 11 and constitutes a part inspection device together with the disposer.

於檢查用插座33之上表面，凹設有可同時收容複數個電子零件T之檢查用凹穴33a，又，於檢查用凹穴33a之底面，凹設有可與電子零件T之凸端子嵌合之複數個凹端子。而且，藉由將電子零件T所包含之凸端子嵌入檢查用凹穴33a之凹端子，可檢查該電子零件T之電特性。再者，檢查用凹穴33a包含之端子係連接於作為搭載於基台11內之不同體之檢查單元，電子零件T包含之端子係經由檢查用凹穴33a包含之端子而連接於檢查單元內之檢查電路。而且，利用檢查用插座33進行之檢查之結果自該檢查單元輸出至處置器10。 On the upper surface of the inspection socket 33, an inspection recess 33a capable of accommodating a plurality of electronic parts T at the same time is recessed, and on the bottom surface of the inspection recess 33a, a convex terminal which is recessed with the electronic terminal T is recessed. In combination, a plurality of concave terminals. Furthermore, by inserting the male terminal included in the electronic component T into the female terminal of the inspection recess 33a, the electrical characteristics of the electronic component T can be checked. In addition, the terminal included in the inspection cavity 33a is connected to an inspection unit as a different body mounted in the base 11, and the terminal included in the electronic component T is connected to the inspection unit via the terminal included in the inspection cavity 33a. Check the circuit. The result of the inspection performed by the inspection socket 33 is output from the inspection unit to the handler 10.

於上述搬送導件31，構成搬送部之第1搬送單元34與第2搬送單元38於Y方向上並排連結。 The first transfer unit 34 and the second transfer unit 38 constituting the transfer unit are connected to the transfer guide 31 side by side in the Y direction.

第1搬送單元34於第1梭子32與檢查用插座33之間，沿著Y方向進行往返移動。第1搬送單元34之下端部於搬送導件31與搭載面11a之間，沿著Z方向下降及上升。而且，第1搬送單元34利用該第1搬送單 元34之下端部保持收容於供給用梭盤32a之電子零件T，將所保持之電子零件T搬送至檢查用插座33為止，將該電子零件T嵌入檢查用插座33。又，第1搬送單元34利用該第1搬送單元34之下端部取出嵌入於檢查用插座33之電子零件T，將所取出之電子零件T載置於回收用梭盤32b。 The first transfer unit 34 moves back and forth between the first shuttle 32 and the inspection socket 33 in the Y direction. The lower end portion of the first transport unit 34 is lowered and raised in the Z direction between the transport guide 31 and the mounting surface 11a. The first transfer unit 34 uses the first transfer order. The lower end of the element 34 holds the electronic component T accommodated in the supply shuttle 32a, and the held electronic component T is transported to the inspection socket 33, and the electronic component T is fitted into the inspection socket 33. In addition, the first conveying unit 34 uses the lower end portion of the first conveying unit 34 to take out the electronic component T embedded in the inspection socket 33, and places the taken-out electronic component T on the recovery shuttle 32b.

第2搬送單元38於第2梭子37與檢查用插座33之間，沿著Y方向進行往返移動。第2搬送單元38之下端部於搬送導件31與搭載面11a之間，沿著Z方向下降及上升。而且，第2搬送單元38利用該第2搬送單元38之下端部保持載置於供給用梭盤37a之電子零件T，將所保持之電子零件T搬送至檢查用插座33為止，將該電子零件T嵌入檢查用插座33。又，第2搬送單元38利用該第2搬送單元38之下端部取出嵌入於檢查用插座33之電子零件T，將所取出之電子零件T載置於回收用梭盤37b。 The second transfer unit 38 moves back and forth between the second shuttle 37 and the inspection socket 33 in the Y direction. The lower end portion of the second transport unit 38 is lowered and raised in the Z direction between the transport guide 31 and the mounting surface 11a. Then, the second transfer unit 38 uses the lower end portion of the second transfer unit 38 to hold the electronic component T placed on the supply shuttle 37a, and transfers the held electronic component T to the inspection socket 33, and the electronic component T T-fitted inspection socket 33. In addition, the second transfer unit 38 uses the lower end portion of the second transfer unit 38 to take out the electronic component T embedded in the inspection socket 33, and places the taken-out electronic component T on the collection shuttle 37b.

又，搭載面11a中，於檢查用插座33之X方向上之兩側，固定設置有構成受壓部之一對受壓臂機構35、36。 In addition, on the mounting surface 11a, a pair of pressure receiving arm mechanisms 35, 36 constituting one pressure receiving portion are fixedly provided on both sides in the X direction of the inspection socket 33.

[零件檢查裝置之作用] [Role of parts inspection device]

於上述處置器10中，首先，檢查前之電子零件T自外部裝置移載至供給用輸送機托盤C1a、C2a。繼而，藉由驅動供給用輸送機C1、C2，將檢查前之電子零件T搬運至搬送空間內為止。繼而，當檢查前之電子零件T搬運至搬送空間內為止時，則供給側可動導件22沿著供給側固定導件21移動至供給用輸送機C1、C2上為止。繼而，當供給用手單元23移動至供給用輸送機托盤C1a、C2a之正上方為止而保持電子零件T時，供給側可動導件22沿著供給側固定導件21移動至第1梭子32上為止。 In the handler 10 described above, first, the electronic components T before inspection are transferred from an external device to the supply conveyor trays C1a and C2a. Then, the supply conveyors C1 and C2 are driven to transport the electronic components T before the inspection into the transfer space. Then, when the electronic component T before the inspection is transported into the transfer space, the supply-side movable guide 22 moves along the supply-side fixed guide 21 to the supply conveyors C1 and C2. Then, when the supply hand unit 23 moves to directly above the supply conveyor trays C1a and C2a and holds the electronic component T, the supply-side movable guide 22 moves along the supply-side fixed guide 21 to the first shuttle 32 until.

繼而，當供給側可動導件22到達第1梭子32上時，供給用手單元23移動至第1梭子32上為止，並且第1梭子32亦以供給用手單元23位於 供給用梭盤32a之正上方之方式滑動。繼而，將供給用手單元23保持之檢查前之電子零件T自供給用手單元23移載至供給用梭盤32a。 Then, when the supply-side movable guide 22 reaches the first shuttle 32, the supply hand unit 23 moves to the first shuttle 32, and the first shuttle 32 is also located with the supply hand unit 23 The supply shuttle 32a slides directly above it. Then, the electronic component T before the inspection held by the supply hand unit 23 is transferred from the supply hand unit 23 to the supply shuttle 32a.

當將檢查前之電子零件T移載至供給用梭盤32a時，則第1搬送單元34移動至第1梭子32上為止，並且第1梭子32亦以第1搬送單元34之下端部位於供給用梭盤32a之正上方之方式滑動。繼而，第1搬送單元34之下端部朝向供給用梭盤32a下降，將移載至供給用梭盤32a之檢查前之電子零件T保持於第1搬送單元34之下端部。繼而，第1搬送單元34移動至檢查用插座33上為止，將檢查前之電子零件T搬送至檢查用插座33之正上方為止。繼而，藉由檢查前之電子零件T與第1搬送單元34之下端部一併下降，對檢查用凹穴33a內之凹端子，嵌入電子零件T之凸端子。 When the electronic component T before the inspection is transferred to the supply shuttle 32a, the first transfer unit 34 is moved to the first shuttle 32, and the first shuttle 32 is also located at the lower end of the first transfer unit 34 at the supply Slide it directly above the shuttle 32a. Then, the lower end portion of the first transfer unit 34 is lowered toward the supply shuttle 32a, and the electronic components T before the inspection transferred to the supply shuttle 32a are held at the lower end portion of the first transfer unit 34. Then, the first transfer unit 34 is moved to the inspection socket 33, and the electronic component T before inspection is transported just above the inspection socket 33. Then, the electronic component T before the inspection is lowered together with the lower end of the first transfer unit 34, and the concave terminal in the inspection cavity 33a is fitted into the convex terminal of the electronic component T.

若如此般將檢查前之電子零件T嵌入檢查用插座33，則用以開始電子零件T之檢查之檢查開始信號自處置器10輸出至檢查單元，藉此，利用檢查單元開始電子零件T之檢查。 If the electronic component T before the inspection is inserted into the inspection socket 33 as described above, an inspection start signal for starting the inspection of the electronic component T is output from the handler 10 to the inspection unit, thereby starting the inspection of the electronic component T by the inspection unit. .

然後，當表示電子零件T之檢查結束之檢查結束信號自檢查單元輸出至處置器10時，於檢查後之電子零件T由第1搬送單元34保持之狀態下，第1搬送單元34之下端部上升，藉此自檢查用插座33取出檢查後之電子零件T。繼而，第1搬送單元34自檢查用插座33上移動至第1梭子32上為止，並且第1梭子32以第1搬送單元34位於回收用梭盤32b之正上方之方式滑動。繼而，當第1搬送單元34之下端部下降而解除電子零件T之保持時，自第1搬送單元34將檢查後之電子零件T移載至回收用梭盤32b。 Then, when the inspection completion signal indicating the end of the inspection of the electronic component T is output from the inspection unit to the disposer 10, the lower end portion of the first transport unit 34 is held by the first transport unit 34 after the inspected electronic parts T are held by the first transport unit 34. Ascending, the inspected electronic component T is taken out from the inspection socket 33. Then, the first transfer unit 34 moves from the inspection socket 33 to the first shuttle 32, and the first shuttle 32 slides so that the first transfer unit 34 is positioned directly above the recovery shuttle 32b. Then, when the lower end portion of the first transfer unit 34 is lowered and the holding of the electronic component T is released, the electronic component T after the inspection is transferred from the first transfer unit 34 to the collection shuttle 32b.

當將檢查後之電子零件T移載至回收用梭盤32b時，回收側可動導件42沿著回收側固定導件41移動至第1梭子32上為止。進而，當回收側可動導件42移動至第1梭子32上時，回收用手單元43移動至第1梭子32上為止，並且第1梭子32亦以回收用手單元43位於回收用梭盤32b之 正上方之方式滑動。繼而，將移載至回收用梭盤32b之檢查後之電子零件T保持於回收用手單元43。 When the inspected electronic component T is transferred to the collection shuttle 32b, the collection-side movable guide 42 moves along the collection-side fixed guide 41 to the first shuttle 32. Furthermore, when the collection-side movable guide 42 moves to the first shuttle 32, the collection hand unit 43 moves to the first shuttle 32, and the first shuttle 32 is also located on the collection shuttle 32b with the collection hand unit 43. Of Slide right above. Then, the inspected electronic component T transferred to the collection shuttle 32 b is held in the collection hand unit 43.

當將檢查後之電子零件T保持於回收用手單元43時，回收側可動導件42係自第1梭子32上移動至回收用輸送機C3、C4上為止。繼而，回收用手單元43移動至回收用輸送機托盤C3a、C4a之正上方為止，檢查後之電子零件T係於針對每一檢查結果而分類之狀態下，移載至回收用輸送機托盤C3a、C4a。 When the inspected electronic component T is held in the collection hand unit 43, the collection-side movable guide 42 is moved from the first shuttle 32 to the collection conveyors C3 and C4. Then, the recycling hand unit 43 is moved directly above the recycling conveyor trays C3a and C4a, and the electronic components T after the inspection are sorted for each inspection result and transferred to the recycling conveyor tray C3a. , C4a.

再者，與上述供給機械手20與第1梭子32之間同樣地，亦於供給機械手20與第2梭子37之間移載檢查前之電子零件T。又，與上述第1梭子32與第1搬送單元34之間同樣地，亦於第2梭子37與第2搬送單元38之間，移載檢查前之電子零件T及檢查後之電子零件T。進而，與上述第1梭子32與回收機械手40之間同樣地，亦於第2梭子37與回收機械手40之間，移載檢查後之電子零件T。 The electronic components T before inspection are transferred between the supply robot 20 and the second shuttle 37 in the same manner as described above. In addition, the electronic component T before inspection and the electronic component T after inspection are transferred between the second shuttle 37 and the second transport unit 38 in the same manner as between the first shuttle 32 and the first transport unit 34. Further, similarly between the first shuttle 32 and the recovery robot 40, the electronic component T after the inspection is transferred between the second shuttle 37 and the recovery robot 40.

[處置器之詳細構成] [Detailed structure of disposer]

繼而，參照圖2對處置器10所包含之第1搬送單元34及第2搬送單元38之構成進行詳細說明。再者，關於第1搬送單元34與第2搬送單元38，雖然與搬送導件31之連結位置或成為移動目標之梭子互不相同，但用以按壓電子零件T之構成相同，因此以下，對第1搬送單元34進行說明，而省略關於第2搬送單元38之說明。又，圖2係自輸送機側觀察第1搬送單元34之周邊構造所得之端視圖，表示第1搬送單元34配置於檢查用插座33之正上方之狀態。 Next, the configuration of the first transfer unit 34 and the second transfer unit 38 included in the handler 10 will be described in detail with reference to FIG. 2. In addition, the first conveying unit 34 and the second conveying unit 38 are different from each other in the connection position with the conveyance guide 31 or the shuttle to be moved, but the structure for pressing the electronic component T is the same. The first transfer unit 34 is described, and the description of the second transfer unit 38 is omitted. 2 is an end view of the peripheral structure of the first transfer unit 34 as viewed from the conveyor side, and shows a state where the first transfer unit 34 is disposed directly above the inspection socket 33.

於上述搬送導件31，連結有用以搬送檢查前之電子零件T之第1搬送單元34。構成第1搬送單元34之水平移動臂51係以可沿著搬送導件31進行往返移動之方式連結。於水平移動臂51之下端部，垂直移動臂52以可相對於水平移動臂51上升及下降之方式連結。垂直移動臂52藉由搭載於水平移動臂51內之按壓馬達51M進行旋轉，而相對於水平移 動臂51上升及下降。又，於垂直移動臂52之下端部，遍及Y方向之整個寬度而固定設置有作為於X方向上突出之突出部之被受壓片52a，又，於垂直移動臂52之下端部，朝向搭載面11a而連結有藉由氣壓而作動之按壓缸53。此處，按壓缸53構成第1按壓部，按壓馬達51M、垂直移動臂52及被受壓片52a構成第2按壓部。而且，第1按壓部與第2按壓部構成按壓部。 A first transfer unit 34 for transferring the electronic component T before inspection is connected to the transfer guide 31 described above. The horizontal moving arms 51 constituting the first conveyance unit 34 are connected so as to be able to move back and forth along the conveyance guide 31. At the lower end of the horizontal moving arm 51, the vertical moving arm 52 is connected in a manner capable of rising and falling relative to the horizontal moving arm 51. The vertical movement arm 52 is rotated relative to the horizontal movement by the pressing motor 51M mounted in the horizontal movement arm 51. The boom 51 is raised and lowered. Further, a pressed piece 52a as a protrusion protruding in the X direction is fixedly provided at the lower end portion of the vertical movement arm 52 over the entire width in the Y direction, and the lower end portion of the vertical movement arm 52 faces the mounting. The surface 11a is connected to a pressing cylinder 53 which is operated by air pressure. Here, the pressing cylinder 53 constitutes a first pressing portion, and the pressing motor 51M, the vertical movement arm 52, and the pressed piece 52a constitute a second pressing portion. The first pressing portion and the second pressing portion constitute a pressing portion.

於按壓缸53連接有未圖示之壓縮空氣供給部。壓縮空氣供給部包含例如設置有零件檢查裝置之設施所包含之氣體供給系統、及控制該氣體供給系統之壓縮空氣之供給之閥等者。氣體供給系統供給以大氣壓為基準壓力時之相對壓力為例如0.5MPa之壓縮空氣。而且，按壓缸53係藉由自壓縮空氣供給部供給壓縮空氣而於Z方向上伸長，藉由將該供給之壓縮空氣排出而於Z方向上收縮。 A compressed air supply unit (not shown) is connected to the pressing cylinder 53. The compressed air supply unit includes, for example, a gas supply system included in a facility provided with a component inspection device, and a valve that controls the supply of compressed air to the gas supply system. The gas supply system supplies compressed air having a relative pressure of, for example, 0.5 MPa when the atmospheric pressure is used as a reference pressure. Further, the pressing cylinder 53 is extended in the Z direction by supplying compressed air from a compressed air supply unit, and is contracted in the Z direction by discharging the supplied compressed air.

於按壓缸53之下端部，連結有可藉由例如真空吸附而吸附電子零件T之末端效應器即複數個吸附部54。吸附部54包含例如吸附用之噴嘴與連接於該噴嘴之真空泵等。 To the lower end of the pressing cylinder 53, a plurality of suction portions 54 that are end effectors capable of suctioning the electronic component T by, for example, vacuum suction, are connected. The adsorption unit 54 includes, for example, a nozzle for adsorption and a vacuum pump connected to the nozzle.

於上述搭載面11a中之檢查用插座33之X方向兩側，以夾住檢查用插座33之方式配設有相互對向之受壓臂機構35、36。受壓臂機構35、36包含：支撐體35a、36a，其固定設置於搭載面11a；及受壓臂35b、36b，其以於該支撐體35a、36a之上表面可沿X方向進行往返移動之方式連結。受壓臂35b、36b係與按壓部之一部分即被受壓片52a接觸之接觸部。 On the two sides in the X direction of the inspection socket 33 in the mounting surface 11a, pressure-receiving arm mechanisms 35 and 36 facing each other are arranged so as to sandwich the inspection socket 33. The pressure arm mechanisms 35, 36 include: support bodies 35a, 36a, which are fixedly disposed on the mounting surface 11a; and pressure arms 35b, 36b, which can move back and forth in the X direction on the upper surfaces of the support bodies 35a, 36a Way to link. The pressure-receiving arms 35b and 36b are contact portions that are in contact with a portion of the pressing portion, that is, the pressure-receiving piece 52a.

於受壓臂35b、36b上，連結有連接於未圖示之壓縮空氣供給部之臂缸。壓縮空氣供給部例如為與連接於上述按壓缸53之壓縮空氣供給部相同之構成。而且，於檢查用插座33之正上方配置有第1搬送單元34，且當將壓縮空氣供給至受壓臂35b、36b之臂缸時，受壓臂35b、36b於X方向上相互靠近，該受壓臂35b、35b變位至可接觸於被受壓 片52a之接觸位置。又，若自該狀態起，將臂缸內之壓縮空氣排出，則受壓臂35b、36b於X方向上相互分離，該受壓臂35b、36b變位至自被受壓片52a離開之離開位置。如此般，藉由受壓臂35b、36b可動之構造，可進行受壓臂35b、36b與被受壓片52a之接觸或可將該接觸解除。 An arm cylinder connected to a compressed air supply unit (not shown) is connected to the pressure receiving arms 35b and 36b. The compressed air supply unit has, for example, the same configuration as the compressed air supply unit connected to the pressing cylinder 53 described above. A first transfer unit 34 is disposed directly above the inspection socket 33, and when compressed air is supplied to the arm cylinders of the pressure-receiving arms 35b and 36b, the pressure-receiving arms 35b and 36b approach each other in the X direction. The pressure arms 35b, 35b are displaced so as to contact the pressured The contact position of the sheet 52a. When the compressed air in the arm cylinder is exhausted from this state, the pressure-receiving arms 35b and 36b are separated from each other in the X direction, and the pressure-receiving arms 35b and 36b are displaced until they leave from the pressure-receiving sheet 52a. position. As such, by the structure in which the pressure-receiving arms 35b and 36b are movable, the pressure-receiving arms 35b and 36b can be brought into contact with the pressure-receiving piece 52a or the contact can be released.

[處置器之電性構成] [Electrical composition of disposer]

參照圖3對上述處置器10之電性構成進行說明。上述處置器10所具備之控制裝置60係以包含中央處理裝置(CPU，Central Processing Unit，中央處理單元)、非揮發性記憶體(ROM，Read Only Memory，唯讀記憶體)及揮發性記憶體(RAM，Random Access Memory，隨機存取記憶體)之微電腦為中心而構成。控制裝置60根據儲存於上述ROM及RAM中之各種資料及程式，進行與處置器10之動作相關之各種控制。 The electrical configuration of the handler 10 will be described with reference to FIG. 3. The control device 60 included in the processor 10 includes a central processing unit (CPU, Central Processing Unit), non-volatile memory (ROM, Read Only Memory), and volatile memory. (RAM, Random Access Memory, random access memory) microcomputer as the center. The control device 60 performs various controls related to the operation of the processor 10 based on various data and programs stored in the ROM and RAM.

於控制裝置60，連接有使輸送機馬達MC旋轉驅動之輸送機驅動部61。於輸送機驅動部61，連接有檢測輸送機馬達MC之旋轉位置之編碼器EMC。輸送機驅動部61根據自控制裝置60輸入之位置指令與自編碼器EMC輸入之輸送機馬達MC之旋轉位置，生成輸送機馬達MC之驅動電流，並且將該驅動電流輸出至輸送機馬達MC。輸送機馬達MC藉由進行與上述驅動電流相對應之旋轉，而驅動上述輸送機C1~C4。 再者，上述輸送機驅動部61及輸送機馬達MC係針對每一輸送機C1~C4而設置，又，編碼器EMC係相對於各輸送機馬達MC而設置。 The control device 60 is connected to a conveyor driving unit 61 that rotates the conveyor motor MC. An encoder EMC that detects the rotation position of the conveyor motor MC is connected to the conveyor driving section 61. The conveyor driving section 61 generates a driving current of the conveyor motor MC according to the position command input from the control device 60 and the rotation position of the conveyor motor MC input from the encoder EMC, and outputs the driving current to the conveyor motor MC. The conveyor motor MC drives the conveyors C1 to C4 by rotating in accordance with the drive current. The conveyor driving unit 61 and the conveyor motor MC are provided for each of the conveyors C1 to C4, and the encoder EMC is provided for each conveyor motor MC.

於控制裝置60連接有使導件馬達MX旋轉驅動之可動導件驅動部62。於可動導件驅動部62，連接有檢測導件馬達MX之旋轉位置之編碼器EMX。可動導件驅動部62根據自控制裝置60輸入之位置指令與自編碼器EMX輸入之旋轉位置，生成導件馬達MX之驅動電流，並且將該驅動電流輸出至導件馬達MX。導件馬達MX藉由進行與所輸入之 上述驅動電流相對應之旋轉，使上述可動導件22、42沿著固定導件21、41進行往返移動。再者，上述可動導件驅動部62及導件馬達MX相對於供給側可動導件22及回收側可動導件42之各者而設置，又，編碼器EMX相對於各導件馬達MX而設置。 The control device 60 is connected to a movable guide driving portion 62 that rotates the guide motor MX. An encoder EMX that detects the rotation position of the guide motor MX is connected to the movable guide driving section 62. The movable guide driving unit 62 generates a driving current of the guide motor MX according to the position command input from the control device 60 and the rotational position input from the encoder EMX, and outputs the driving current to the guide motor MX. Guide Motor MX The rotation corresponding to the driving current causes the movable guides 22 and 42 to move back and forth along the fixed guides 21 and 41. The movable guide driving unit 62 and the guide motor MX are provided for each of the supply-side movable guide 22 and the recovery-side movable guide 42, and the encoder EMX is provided for each of the guide motors MX. .

於控制裝置60，連接有使梭子馬達MS旋轉驅動之梭子驅動部63。於梭子驅動部63，連接有檢測梭子馬達MS之旋轉位置之編碼器EMS。梭子驅動部63根據自控制裝置60輸入之位置指令與自編碼器EMS輸入之旋轉位置，生成梭子馬達MS之驅動電流，並且將該驅動電流輸出至梭子馬達MS。梭子馬達MS藉由進行與所輸入之上述驅動電流相對應之旋轉，而使梭子32、37沿著上述導件32c、37c滑動。再者，上述梭子驅動部63及梭子馬達MS相對於第1梭子32及第2梭子37之各者而設置，又，編碼器EMS相對於各梭子馬達MS而設置。 The control device 60 is connected to a shuttle driving unit 63 that rotates the shuttle motor MS. An encoder EMS for detecting the rotation position of the shuttle motor MS is connected to the shuttle driving section 63. The shuttle driving unit 63 generates a driving current of the shuttle motor MS according to the position command input from the control device 60 and the rotational position input from the encoder EMS, and outputs the driving current to the shuttle motor MS. The shuttle motor MS causes the shuttle 32, 37 to slide along the guides 32c, 37c by performing rotation corresponding to the input drive current. The shuttle driving unit 63 and the shuttle motor MS are provided for each of the first shuttle 32 and the second shuttle 37, and the encoder EMS is provided for each shuttle motor MS.

於控制裝置60，連接有包含手馬達驅動部64a與抽吸閥驅動部64b之手單元驅動部64。其中，於手馬達驅動部64a，連接有檢測手馬達MZ之旋轉位置之編碼器EMZ。手馬達驅動部64a根據自控制裝置60輸入之位置指令與自編碼器EMZ輸入之旋轉位置，生成手馬達MZ之驅動電流，並且將該驅動電流輸出至手馬達MZ。手馬達MZ係藉由進行與所輸入之上述驅動電流相對應之旋轉，使上述手單元23、43上升及下降。 A hand unit drive section 64 including a hand motor drive section 64 a and a suction valve drive section 64 b is connected to the control device 60. Among them, an encoder EMZ that detects the rotational position of the hand motor MZ is connected to the hand motor driving portion 64a. The hand motor driving section 64a generates a driving current of the hand motor MZ according to the position command input from the control device 60 and the rotation position input from the encoder EMZ, and outputs the driving current to the hand motor MZ. The hand motor MZ rotates the hand units 23 and 43 in response to the input drive current.

於抽吸閥驅動部64b，連接有檢測設置於手單元23、43之前端之抽吸閥SV1之開放量之抽吸感測器ESV1。抽吸閥驅動部64b根據自控制裝置60輸入之閥行程指令與自抽吸感測器ESV1輸入之開放量，生成抽吸閥SV1之驅動信號，並且將該驅動信號輸出至抽吸閥SV1。抽吸閥SV1藉由進行與所輸入之上述驅動信號相對應之開閉，利用與上述開放量相對應之抽吸力抽吸上述電子零件T。再者，上述手單元驅動部64、手馬達MZ及抽吸閥SV1相對於供給用手單元23及回收用手 單元43之各者而設置，又，編碼器EMZ、抽吸感測器ESV1相對於手馬達MZ及抽吸閥SV1之各者而設置。 A suction sensor ESV1 that detects the opening amount of the suction valve SV1 provided at the front ends of the hand units 23 and 43 is connected to the suction valve driving portion 64b. The suction valve driving section 64b generates a driving signal for the suction valve SV1 based on the valve stroke command input from the control device 60 and the opening amount input from the suction sensor ESV1, and outputs the driving signal to the suction valve SV1. The suction valve SV1 opens and closes the suction valve SV1 in response to the input drive signal, and sucks the electronic component T with a suction force corresponding to the opening amount. The hand unit driving unit 64, the hand motor MZ, and the suction valve SV1 are opposed to the supply hand unit 23 and the recovery hand. Each of the units 43 is provided, and the encoder EMZ and the suction sensor ESV1 are provided for each of the hand motor MZ and the suction valve SV1.

於控制裝置60，連接有包含搬送馬達驅動部65a、構成馬達控制部之按壓馬達驅動部65b、構成缸控制部之按壓缸驅動部65c及抽吸閥驅動部65d之搬送單元驅動部65。 The control device 60 is connected to a conveying unit driving section 65 including a conveying motor driving section 65a, a pressing motor driving section 65b constituting a motor control section, a pressing cylinder driving section 65c constituting a cylinder control section, and a suction valve driving section 65d.

於搬送馬達驅動部65a，連接有檢測搬送馬達MY之旋轉位置之編碼器EMY。搬送馬達驅動部65a根據自控制裝置60輸入之位置指令與自編碼器EMY輸入之旋轉位置，生成搬送馬達MY之驅動電流，並且將該驅動電流輸出至搬送馬達MY。搬送馬達MY藉由進行與所輸入之上述驅動電流相對應之旋轉，而使上述搬送單元34、38沿著上述搬送導件31進行往返移動。再者，上述搬送馬達驅動部65a相對於第1搬送單元34及第2搬送單元38之各者而設置，又，編碼器EMY亦相對於第1搬送單元34及第2搬送單元38之各者而設置。 An encoder EMY that detects the rotation position of the conveyance motor MY is connected to the conveyance motor drive portion 65a. The transport motor driving unit 65a generates a drive current of the transport motor MY based on the position command input from the control device 60 and the rotation position input from the encoder EMY, and outputs the drive current to the transport motor MY. The conveyance motor MY rotates in accordance with the input drive current to cause the conveyance units 34 and 38 to move back and forth along the conveyance guide 31. The transport motor driving unit 65a is provided for each of the first transport unit 34 and the second transport unit 38, and the encoder EMY is also disposed for each of the first transport unit 34 and the second transport unit 38. And set.

於按壓馬達驅動部65b，連接有檢測按壓馬達51M之旋轉位置之編碼器E51M。按壓馬達驅動部65b根據自控制裝置60輸入之位置指令與自編碼器E51M輸入之旋轉位置，生成按壓馬達51M之驅動電流，並且將該驅動電流輸出至按壓馬達51M。按壓馬達51M藉由進行與所輸入之上述驅動電流相對應之旋轉，使垂直移動臂52上升及下降。 An encoder E51M that detects the rotational position of the pressing motor 51M is connected to the pressing motor driving section 65b. The pressing motor driving unit 65b generates a driving current of the pressing motor 51M according to a position command input from the control device 60 and a rotating position input from the encoder E51M, and outputs the driving current to the pressing motor 51M. The pressing motor 51M causes the vertical movement arm 52 to rise and fall by performing rotation corresponding to the input drive current.

又，於按壓馬達驅動部65b，連接有計測按壓馬達51M中之驅動電流之實際值之電流計測部I51M。按壓馬達驅動部65b根據自控制裝置60輸入之轉矩指令與自電流計測部I51M輸入之計測值，生成按壓馬達51M之驅動電流，並且將該驅動電流輸出至按壓馬達51M。按壓馬達51M藉由進行與所輸入之上述驅動電流相對應之旋轉，而使垂直移動臂52上升及下降。 Further, a current measurement unit I51M that measures an actual value of the driving current in the pressing motor 51M is connected to the pressing motor driving unit 65b. The pressing motor driving unit 65b generates a driving current of the pressing motor 51M based on the torque command input from the control device 60 and the measurement value input from the current measuring unit I51M, and outputs the driving current to the pressing motor 51M. The pressing motor 51M causes the vertical moving arm 52 to rise and fall by performing rotation corresponding to the input drive current.

附帶說，控制裝置60選擇位置控制模式與轉矩控制模式作為按壓馬達51M之驅動控制之方法。其中，所謂位置控制模式，係指以連結 於上述搬送單元34、38之端部之吸附部54成為特定之位置之方式，根據上述位置指令控制按壓馬達51M之驅動之方法。另一方面，所謂轉矩控制模式，係指以將藉由按壓馬達51M之旋轉而產生之轉矩維持於特定之大小之方式，根據上述轉矩指令控制按壓馬達51M之驅動之方法。再者，上述按壓馬達驅動部65b相對於第1搬送單元34及第2搬送單元38之各者而設置，又，電流計測部I51M亦相對於第1搬送單元34及第2搬送單元38之各者而設置。 Incidentally, the control device 60 selects a position control mode and a torque control mode as a method of driving control of the pressing motor 51M. Among them, the so-called position control mode refers to the connection A method of controlling the driving of the pressing motor 51M according to the position command in a manner that the suction section 54 at the ends of the conveying units 34 and 38 becomes a specific position. On the other hand, the so-called torque control mode refers to a method of controlling the driving of the pressing motor 51M in accordance with the torque command in such a manner that the torque generated by the rotation of the pressing motor 51M is maintained at a specific magnitude. The pressing motor driving unit 65b is provided for each of the first transfer unit 34 and the second transfer unit 38, and the current measurement unit I51M is also provided for each of the first transfer unit 34 and the second transfer unit 38. Or set.

按壓缸驅動部65c根據自控制裝置60輸入之驅動指令，生成用以將作動壓供給至按壓缸53之驅動信號，並且將該各驅動信號輸出至按壓缸53。而且，按壓缸53係根據用以使其伸長之驅動信號而伸長，藉此對電子零件T施加按壓力，並且根據用以使其收縮之驅動信號而收縮，藉此解除對電子零件T之按壓力。再者，上述按壓缸驅動部65c相對於第1搬送單元34及第2搬送單元38之各者而設置。 The pressing cylinder driving unit 65 c generates a driving signal for supplying an operating pressure to the pressing cylinder 53 according to a driving instruction input from the control device 60, and outputs the driving signals to the pressing cylinder 53. Further, the pressing cylinder 53 is extended in accordance with a driving signal for extending it, thereby applying a pressing force to the electronic component T, and contracting in accordance with a driving signal for causing it to be contracted, thereby releasing the pressing of the electronic component T. pressure. The pressing cylinder driving unit 65c is provided for each of the first transfer unit 34 and the second transfer unit 38.

於抽吸閥驅動部65d，連接有檢測抽吸閥SV2之開放量之抽吸感測器ESV2。抽吸閥驅動部65d根據自控制裝置60輸入之閥行程指令與自抽吸感測器ESV2輸入之開放量，生成抽吸閥SV2之驅動信號，並且將該驅動信號輸出至抽吸閥SV2。而且，抽吸閥SV2利用與上述開放量相對應之抽吸力抽吸上述電子零件T。再者，抽吸閥驅動部65d相對於第1搬送單元34及第2搬送單元38之各者而設置。又，抽吸感測器ESV2相對於抽吸閥SV2之各者而設置。 A suction sensor ESV2 that detects the opening amount of the suction valve SV2 is connected to the suction valve driving portion 65d. The suction valve driving unit 65d generates a driving signal for the suction valve SV2 based on the valve stroke command input from the control device 60 and the opening amount input from the suction sensor ESV2, and outputs the driving signal to the suction valve SV2. The suction valve SV2 sucks the electronic component T by a suction force corresponding to the opening amount. The suction valve driving unit 65d is provided for each of the first transfer unit 34 and the second transfer unit 38. The suction sensor ESV2 is provided for each of the suction valves SV2.

於控制裝置60，連接有使上述受壓臂35b、36b變位之受壓臂驅動部66。受壓臂驅動部66根據自控制裝置60輸入之驅動指令，生成用以將作動壓供給至受壓臂35b、36b之臂缸35s、36s之驅動信號，並且將該驅動信號輸出至臂缸35s、36s。而且，臂缸35s、36s根據用以使受壓臂35b、36b變位之驅動信號而伸長，藉此使受壓臂35b、36b變位至上述接觸位置。另一方面，臂缸35s、36s根據用以使其收縮之驅動信 號而收縮，藉此使受壓臂35b、36b變位至上述離開位置。 The control device 60 is connected to a pressure receiving arm driving unit 66 for displacing the pressure receiving arms 35b and 36b. The pressure-arm driving unit 66 generates driving signals for supplying operating pressure to the arm cylinders 35s and 36s of the pressure-arms 35b and 36b according to the driving instruction input from the control device 60, and outputs the driving signals to the arm cylinder 35s. , 36s. Further, the arm cylinders 35s and 36s are extended in accordance with a driving signal for displacing the pressure-receiving arms 35b and 36b, thereby displacing the pressure-receiving arms 35b and 36b to the above-mentioned contact position. On the other hand, the arm cylinders 35s and 36s are No. and contraction, thereby displacing the pressure receiving arms 35b, 36b to the above-mentioned disengaged position.

[處置器之作用] [The role of the disposer]

繼而，根據上述構成，參照圖4~圖12對將由搬送單元保持之電子零件T嵌入檢查用插座33時之各種馬達之驅動態樣與各種缸之驅動態樣進行說明。再者，關於利用第1搬送單元34之嵌入態樣與利用第2搬送單元38之嵌入態樣，雖然電子零件T之供給源或電子零件T之搬送方向互不相同，但除此以外為相互相同之態樣，因此以下，僅例示第1搬送單元34中之上述態樣。 Next, based on the above-mentioned configuration, a driving state of various motors and a driving state of various cylinders when the electronic component T held by the transport unit is inserted into the inspection socket 33 will be described with reference to FIGS. 4 to 12. In addition, regarding the embedding aspect using the first conveying unit 34 and the embedding aspect using the second conveying unit 38, although the supply source of the electronic component T or the conveying direction of the electronic component T are different from each other, they are mutually Since it is the same aspect, only the said aspect in the 1st conveyance unit 34 is illustrated below.

再者，於圖4中，方便地表示對於搬送馬達MY之位置指令與第1搬送單元34之動作，又，方便地表示對於按壓馬達51M之位置指令或轉矩指令與垂直移動臂52之動作及控制模式。又，於圖5~圖12中，圖4所示之各時序T0~T10時之第1搬送單元34之驅動態樣及受壓臂機構35、36之驅動態樣係於使其等之平面構造與端面構造相互對應之狀態下而表示。 Furthermore, in FIG. 4, the position command for the transport motor MY and the operation of the first transport unit 34 are conveniently shown, and the position command or torque command for the pressing motor 51M and the motion of the vertical movement arm 52 are conveniently illustrated. And control modes. In FIGS. 5 to 12, the driving states of the first conveying unit 34 and the driving states of the pressure arm mechanisms 35 and 36 at the respective timings T0 to T10 shown in FIG. 4 are on the planes of which they are equal. The structure and the end surface structure are shown in a state corresponding to each other.

[搬送單元設置期間：T0-T1] [During transportation unit setting: T0-T1]

首先，如圖4所示，控制裝置60對搬送馬達驅動部65a輸出位置指令。此時，控制裝置60輸出之位置指令係用以使第1搬送單元34之吸附部54自供給用梭盤32a之正上方移動至檢查用插座33之正上方為止者。繼而，搬送馬達驅動部65a根據搬送馬達MY之旋轉位置與上述位置指令生成驅動電流，並將該驅動電流輸出至搬送馬達MY。藉此，搬送馬達MY自時序T0起開始朝向特定方向之旋轉，第1搬送單元34朝向檢查用插座33進行去向移動直至第1搬送單元34之吸附部54在保持電子零件T之狀態下到達檢查用插座33之正上方為止(參照圖5(a))。 First, as shown in FIG. 4, the control device 60 outputs a position command to the conveyance motor drive part 65a. At this time, the position command output by the control device 60 is used to move the suction section 54 of the first transfer unit 34 from directly above the supply shuttle 32a to directly above the inspection socket 33. Then, the conveyance motor drive unit 65a generates a drive current based on the rotation position of the conveyance motor MY and the position command, and outputs the drive current to the conveyance motor MY. Thereby, the transfer motor MY starts to rotate in a specific direction from the timing T0, and the first transfer unit 34 moves toward the inspection socket 33 until the suction portion 54 of the first transfer unit 34 reaches the inspection while holding the electronic component T. Use the socket 33 directly above it (see Figure 5 (a)).

再者，於上述搬送單元設置期間，為了使垂直移動臂52之下端部維持最高位置，而控制裝置60對按壓馬達驅動部65b輸出位置指令。繼而，按壓馬達驅動部65b根據按壓馬達51M之旋轉位置與上述位置 指令生成驅動電流，並將該驅動電流輸出至按壓馬達51M。藉此，按壓馬達驅動部65b抑制按壓馬達51M之旋轉。 Furthermore, during the installation period of the above-mentioned transport unit, in order to maintain the lower end portion of the vertical moving arm 52 at the highest position, the control device 60 outputs a position command to the pressing motor driving portion 65b. Then, the pressing motor driving section 65b is based on the rotation position of the pressing motor 51M and the above-mentioned position. The command generates a driving current and outputs the driving current to the pressing motor 51M. Thereby, the pressing motor driving section 65b suppresses the rotation of the pressing motor 51M.

又，於上述搬送單元設置期間，為了不對按壓缸53供給作動壓，而控制裝置60對按壓缸驅動部65c輸出按壓解除指令。藉此，按壓缸驅動部65c根據按壓解除指令生成驅動信號，藉此，藉由不對按壓缸53供給作動壓，而將按壓缸53之伸長量維持於最小值(參照圖5(b))。 In addition, during the installation period of the transfer unit, the control device 60 outputs a press release command to the press cylinder driving unit 65c so as not to supply the actuating pressure to the press cylinder 53. Thereby, the pressing cylinder driving unit 65c generates a driving signal based on the pressing release command, thereby maintaining the minimum amount of extension of the pressing cylinder 53 without supplying an operating pressure to the pressing cylinder 53 (see FIG. 5 (b)).

繼而，如上所述，將垂直移動臂52之下端部維持於最高位置，且將按壓缸53之伸長量維持於最小值，藉此將吸附部54配置於其之最高位置。再者，所謂吸附部54之最高位置，係指當水平移動臂51沿著搬送導件31移動時，吸附部54與其他構件不發生碰撞之位置。 Then, as described above, the lower end portion of the vertical moving arm 52 is maintained at the highest position, and the amount of elongation of the pressing cylinder 53 is maintained at the minimum value, thereby arranging the suction portion 54 at its highest position. It should be noted that the highest position of the suction section 54 refers to a position where the suction section 54 does not collide with other members when the horizontal moving arm 51 moves along the conveyance guide 31.

[下降、按壓期間：T1-T3] [Descent and compression period: T1-T3]

當吸附部54到達檢查用插座33之正上方時，為了將吸附於吸附部54之電子零件T收容於檢查用插座33，而控制裝置60如圖4所示，於時序T1對按壓馬達驅動部65b輸出位置指令。此時，控制裝置60輸出上述位置控制模式中之位置指令。繼而，按壓馬達驅動部65b根據按壓馬達51M之旋轉位置與上述位置指令生成驅動電流，並將該驅動電流輸出至按壓馬達51M。藉此，按壓馬達51M自時序T1起開始朝向特定方向之旋轉，垂直移動臂52進行下降直至將電子零件T收容於檢查用插座33為止。 When the suction part 54 reaches directly above the inspection socket 33, in order to store the electronic component T adsorbed on the suction part 54 in the inspection socket 33, the control device 60 as shown in FIG. 65b output position command. At this time, the control device 60 outputs a position command in the position control mode. Then, the pressing motor driving unit 65b generates a driving current based on the rotation position of the pressing motor 51M and the position command, and outputs the driving current to the pressing motor 51M. Accordingly, the pressing motor 51M starts to rotate in a specific direction from the timing T1, and the vertical moving arm 52 is lowered until the electronic component T is accommodated in the inspection socket 33.

繼而，當於時序T2，將電子零件T收容於檢查用插座33時，繼續進行按壓馬達51M之位置控制，吸附部54以吸附部54之位置成為特定位置之方式進一步下降。藉此，將來自按壓馬達51M之按壓力施加至電子零件T(參照圖6(a)(b))。 Then, when the electronic component T is accommodated in the inspection socket 33 at the timing T2, the position control of the pressing motor 51M is continued, and the suction portion 54 is further lowered so that the position of the suction portion 54 becomes a specific position. Thereby, the pressing force from the pressing motor 51M is applied to the electronic component T (refer to FIG. 6 (a) (b)).

再者，於上述下降、按壓期間，為了維持第1搬送單元34中之Y方向之位置，而控制裝置60對搬送馬達驅動部65a輸出位置指令。繼而，搬送馬達驅動部65a根據搬送馬達MY之旋轉位置與上述位置指令 生成驅動電流，並將該驅動電流輸出至搬送馬達MY而抑制該搬送馬達MY之旋轉。 Furthermore, in order to maintain the position in the Y direction in the first conveyance unit 34 during the above-mentioned lowering and pressing periods, the control device 60 outputs a position command to the conveyance motor driving portion 65a. Then, the conveyance motor driving unit 65a is based on the rotation position of the conveyance motor MY and the position command. A driving current is generated, and the driving current is output to the conveyance motor MY to suppress the rotation of the conveyance motor MY.

[受壓臂驅動期間：T3-T4] [During driving of pressure arm: T3-T4]

當電子零件T定位於檢查用插座33時，為了受壓臂機構35、36之受壓臂35b、36b變位至上述接觸位置，而控制裝置60如圖4所示，於時序T3，對受壓臂驅動部66輸出接觸指令。 When the electronic component T is positioned at the inspection socket 33, in order to shift the pressure arms 35b, 36b of the pressure arm mechanisms 35, 36 to the above-mentioned contact positions, the control device 60 is shown in FIG. The pressure arm driving unit 66 outputs a contact command.

繼而，受壓臂驅動部66根據上述接觸指令生成驅動信號，並將該驅動信號輸出至臂缸35s、36s。藉此，臂缸35s、36s伸長而受壓臂35b、36b變位至接觸位置(參照圖7(a)(b))。 Then, the pressure-receiving arm driving unit 66 generates a driving signal based on the contact instruction, and outputs the driving signal to the arm cylinders 35s and 36s. Thereby, the arm cylinders 35s and 36s are extended, and the pressure receiving arms 35b and 36b are displaced to the contact position (refer to FIG. 7 (a) (b)).

再者，於上述受壓臂驅動期間，為了維持第1搬送單元34中之Y方向之位置，而控制裝置60對搬送馬達驅動部65a輸出位置指令。繼而，搬送馬達驅動部65a根據搬送馬達MY之旋轉位置與上述位置指令生成驅動電流，並將該驅動電流輸出至搬送馬達MY而抑制搬送馬達MY之旋轉。 In addition, during the driving period of the pressure receiving arm, in order to maintain the position in the Y direction in the first conveying unit 34, the control device 60 outputs a position command to the conveying motor driving portion 65a. Next, the conveyance motor drive unit 65a generates a drive current based on the rotation position of the conveyance motor MY and the position command, and outputs the drive current to the conveyance motor MY to suppress the rotation of the conveyance motor MY.

又，於上述受壓臂驅動期間，為了對電子零件T施加來自按壓馬達51M之按壓力Fbase，而控制裝置60對按壓馬達驅動部65b輸出位置指令。繼而，按壓馬達驅動部65b根據按壓馬達51M之旋轉位置與上述位置指令生成驅動電流，並將該驅動電流輸出至按壓馬達51M而使吸附部54之位置下降至特定位置為止。再者，所謂上述之按壓力Fbase，係指藉由試驗等而預先設定者，按壓力Fbase係足夠用以將電子零件T定位於檢查用凹穴33a之力，且為電子零件T或檢查用插座33不因該按壓力Fbase而發生變形之程度者。 In addition, during the driving period of the pressure receiving arm, in order to apply the pressing force Fbase from the pressing motor 51M to the electronic component T, the control device 60 outputs a position command to the pressing motor driving unit 65b. Then, the pressing motor driving unit 65b generates a driving current based on the rotation position of the pressing motor 51M and the position command, and outputs the driving current to the pressing motor 51M to lower the position of the suction unit 54 to a specific position. In addition, the aforementioned pressing force Fbase refers to a person who is set in advance through experiments and the like. The pressing force Fbase is a force sufficient to position the electronic component T in the inspection cavity 33a, and is the electronic component T or inspection. The socket 33 is not deformed by the pressing force Fbase.

[轉矩控制期間：T4-T5] [During torque control: T4-T5]

當受壓臂35b、35b變位至接觸位置時，控制裝置60如圖4所示，於時序T4，對按壓馬達驅動部65b輸出轉矩控制模式中之轉矩指令。此時，為了對電子零件T施加大於上述按壓力Fbase之按壓力Fcon，而 控制裝置60輸出轉矩指令。繼而，按壓馬達驅動部65b根據電流計測部I51M之計測值與轉矩指令生成驅動電流，並將該驅動電流輸出至按壓馬達51M。 When the pressure receiving arms 35b, 35b are displaced to the contact position, the control device 60 outputs a torque command in the torque control mode to the pressing motor driving portion 65b at timing T4 as shown in FIG. At this time, in order to apply a pressing force Fcon which is larger than the pressing force Fbase to the electronic component T, and The control device 60 outputs a torque command. Next, the pressing motor driving unit 65b generates a driving current based on the measurement value and the torque command of the current measuring unit I51M, and outputs the driving current to the pressing motor 51M.

藉此，按壓馬達51M自時序T4起持續進行朝向特定方向之旋轉，按壓馬達51M輸出特定之轉矩並對電子零件T施加上述按壓力Fcon，相對於檢查用插座33而將電子零件T定位(參照圖8(a))。 Thereby, the pressing motor 51M continues to rotate in a specific direction from the timing T4, the pressing motor 51M outputs a specific torque and applies the pressing force Fcon to the electronic component T, and positions the electronic component T relative to the inspection socket 33 ( (See Fig. 8 (a)).

再者，於上述轉矩控制期間，為了維持第1搬送單元34中之Y方向之位置，而控制裝置60對搬送馬達驅動部65a輸出位置指令。又，為了維持臂缸35s、36s之伸長，而控制裝置60對受壓臂驅動部66輸出接觸指令。 In addition, during the torque control period, in order to maintain the position in the Y direction in the first conveyance unit 34, the control device 60 outputs a position command to the conveyance motor drive unit 65a. In order to maintain the extension of the arm cylinders 35s and 36s, the control device 60 outputs a contact instruction to the pressure receiving arm driving portion 66.

繼而，搬送馬達驅動部65a抑制搬送馬達MY之旋轉，並且受壓臂驅動部66維持臂缸35s、36s之伸長。繼而，按壓馬達驅動部65b持續以按壓力Fcon按壓電子零件T(參照圖8(b))。 Then, the conveyance motor drive section 65a suppresses the rotation of the conveyance motor MY, and the pressured arm drive section 66 maintains the extension of the arm cylinders 35s and 36s. Then, the pressing motor driving unit 65b continues to press the electronic component T with the pressing force Fcon (see FIG. 8 (b)).

[缸按壓期間：T5-T6] [During cylinder press: T5-T6]

當以按壓力Fcon按壓電子零件T時，為了將作動壓供給至按壓缸53，控制裝置60如圖4所示，於時序T5對按壓缸驅動部65c輸出按壓指令。繼而，按壓缸驅動部65c根據按壓指令生成驅動信號，並將該驅動信號輸出至壓縮空氣供給系統。藉此，按壓缸驅動部65c將作動壓供給至按壓缸53，並且對電子零件T進一步施加按壓力Fhigh。 When the electronic component T is pressed with the pressing force Fcon, in order to supply the operating pressure to the pressing cylinder 53, the control device 60 outputs a pressing instruction to the pressing cylinder driving unit 65c at timing T5 as shown in FIG. Then, the pressing cylinder driving unit 65c generates a driving signal in accordance with the pressing instruction, and outputs the driving signal to the compressed air supply system. Thereby, the pressing-cylinder driving unit 65c supplies the operating pressure to the pressing cylinder 53, and further applies a pressing force Fhigh to the electronic component T.

所謂該按壓力Fhigh係指大於上述按壓力Fbase之力，且為電子零件T或檢查用插座33不會因該按壓力Fhigh之按壓而發生變形之程度者。而藉由將如上所述之按壓力Fhigh施加至電子零件T，可確實地進行電子零件T之凸端子與檢查用插座33之凹端子之電性連接。 The pressing force Fhigh refers to a force that is greater than the aforementioned pressing force Fbase and is a degree to which the electronic component T or the inspection socket 33 will not be deformed by the pressing force Fhigh. By applying the pressing force Fhigh as described above to the electronic component T, the electrical connection between the male terminal of the electronic component T and the female terminal of the inspection socket 33 can be reliably performed.

繼而，當將作動壓供給至按壓缸53時，控制裝置60對檢查單元輸出用以開始檢查之檢查開始信號。 Then, when the operating pressure is supplied to the pressing cylinder 53, the control device 60 outputs an inspection start signal to the inspection unit to start the inspection.

此時，對第1搬送單元34中之支撐側即垂直移動臂52施加抵抗按 壓力Fhigh之反作用力。藉此，藉由使垂直移動臂52退回至搬送導件31側，該被受壓片52a與受壓臂35b、36b接觸(參照圖9(a)(b))。 At this time, a resistive pressure is applied to the supporting side in the first conveying unit 34, that is, the vertical moving arm 52. The reaction force of pressure Fhigh. Thereby, by returning the vertical moving arm 52 to the conveyance guide 31 side, the pressed piece 52a is brought into contact with the pressed arms 35b and 36b (see FIGS. 9 (a) and (b)).

因此，按壓缸53之按壓力之反作用力之一部分作用於第1搬送單元34，而其餘部分會經由受壓臂機構35、36而作用於基台11。即，雖然垂直移動臂52因按壓缸53之伸長而被推回，但與按壓缸53之伸長被受壓臂機構35、36抑制相應地，垂直移動臂52之退回程度亦受到不小之抑制。因此，雖然將大於垂直移動臂52之按壓力Fcon之按壓力施加至電子零件T，但並非電子零件T受到之按壓力之反作用力全部作用於第1搬送單元34，該反作用力之一部分會向基台11分散。藉此，雖然以所期望之按壓力按壓電子零件T，但對於第1搬送單元34所要求之剛性為可耐受該按壓力之反作用力之一部分者即已足夠。因此，可抑制第1搬送單元34之大型化或重量化。 Therefore, part of the reaction force of the pressing force of the pressing cylinder 53 acts on the first conveying unit 34, and the remaining part acts on the base 11 via the pressure arm mechanisms 35 and 36. That is, although the vertical movement arm 52 is pushed back due to the extension of the pressing cylinder 53, corresponding to the suppression of the extension of the pressing cylinder 53 by the pressure arm mechanisms 35 and 36, the degree of retreat of the vertical movement arm 52 is also greatly suppressed. . Therefore, although a pressing force greater than the pressing force Fcon of the vertical moving arm 52 is applied to the electronic component T, not all the reaction force of the pressing force received by the electronic component T acts on the first transfer unit 34, and a part of the reaction force is The abutment 11 is scattered. Thereby, although the electronic component T is pressed with a desired pressing force, it is sufficient that the rigidity required for the first transfer unit 34 is a part that can withstand the reaction force of the pressing force. Therefore, it is possible to suppress an increase in size and weight of the first transfer unit 34.

附帶說明，於按壓缸53之伸長量未由受壓臂機構35、36強制地規定之態樣下，根據按壓馬達51M之驅動之態樣，按壓缸53之伸長量亦有所變化。而且，雖然按壓馬達51M之驅動為轉矩控制模式，但若與在被受壓片52a與受壓臂35b、36b之機械性之接觸下使按壓力固定之態樣相比，對於電子零件T之按壓力亦會有所變動。就該點而言，若為上述態樣，由於按壓缸53之伸長量在被受壓片52a與受壓臂35b、36b之接觸下固定為特定值，故對於電子零件T之按壓力亦變得穩定。 Incidentally, in a state where the elongation of the pressing cylinder 53 is not compulsorily specified by the pressure arm mechanisms 35 and 36, the elongation of the pressing cylinder 53 also changes according to the driving state of the pressing motor 51M. Moreover, although the driving of the pressing motor 51M is in the torque control mode, compared with the state where the pressing force is fixed under the mechanical contact between the pressed piece 52a and the pressed arms 35b, 36b, the electronic component T The pressing pressure will also change. In this regard, if it is the above state, since the elongation of the pressing cylinder 53 is fixed to a specific value under the contact between the pressed piece 52a and the pressed arms 35b and 36b, the pressing force on the electronic component T also changes. Be stable.

再者，於上述缸按壓期間，與之前之轉矩控制期間同樣地，為了維持第1搬送單元34之Y方向之位置，控制裝置60對搬送馬達驅動部65a輸出位置指令。又，為了維持臂缸35s、36s之伸長，控制裝置60對受壓臂驅動部66輸出接觸指令。進而，如上所述，為了按壓馬達51M能夠以按壓力Fcon對按壓缸53進行按壓，而控制裝置60對按壓馬達驅動部65b輸出轉矩指令。 In addition, during the above-mentioned cylinder pressing period, the control device 60 outputs a position command to the transport motor driving unit 65a in order to maintain the position in the Y direction of the first transport unit 34 in the same manner as the previous torque control period. In order to maintain the extension of the arm cylinders 35s and 36s, the control device 60 outputs a contact command to the pressure receiving arm driving portion 66. Furthermore, as described above, in order for the pressing motor 51M to press the pressing cylinder 53 with the pressing force Fcon, the control device 60 outputs a torque command to the pressing motor driving section 65b.

繼而，搬送馬達驅動部65a抑制搬送馬達MY之旋轉，並且受壓臂 驅動部66維持臂缸35s、36s之伸長。繼而，按壓馬達驅動部65b持續以按壓力Fcon按壓按壓缸53。 Then, the conveyance motor driving section 65a suppresses the rotation of the conveyance motor MY, and the pressure arm The driving portion 66 maintains the extension of the arm cylinders 35s and 36s. Then, the pressing motor driving unit 65b continues to press the pressing cylinder 53 with the pressing force Fcon.

附帶說，使用按壓馬達51M之電子零件T之按壓可藉由按壓馬達51M之位置控制及轉矩控制之至少一個而進行。此處，按壓缸53之按壓力越大，則對於該按壓缸53之支撐側之反作用力即對於按壓馬達51M之負載亦越大。此時，當藉由上述位置控制模式驅動按壓馬達51M時，只要按壓馬達51M之輸出不超過上述反作用力，按壓馬達51M之旋轉位置便不會到達目標之旋轉位置。而且，按壓馬達51M之驅動電流持續增大，對按壓馬達51M之內部施加過量之負載。 Incidentally, pressing of the electronic component T using the pressing motor 51M can be performed by at least one of position control and torque control of the pressing motor 51M. Here, the larger the pressing force of the pressing cylinder 53 is, the larger the reaction force to the supporting side of the pressing cylinder 53 is, ie, the greater the load on the pressing motor 51M. At this time, when the pressing motor 51M is driven by the above-mentioned position control mode, as long as the output of the pressing motor 51M does not exceed the above-mentioned reaction force, the rotation position of the pressing motor 51M will not reach the target rotation position. Furthermore, the driving current of the pressing motor 51M continues to increase, and an excessive load is applied to the inside of the pressing motor 51M.

就該點而言，於上述缸按壓期間，在按壓缸53之按壓力施加至電子零件T之狀態下，藉由轉矩控制模式驅動按壓馬達51M。因此，即便因按壓缸53之伸長而垂直移動臂52退回，按壓馬達51M亦輸出特定之轉矩，既然如此便不會對該按壓馬達51M施加過量在負載。 In this regard, during the above-mentioned cylinder pressing, in a state where the pressing force of the pressing cylinder 53 is applied to the electronic component T, the pressing motor 51M is driven in a torque control mode. Therefore, even if the vertical movement arm 52 is retracted due to the extension of the pressing cylinder 53, the pressing motor 51M outputs a specific torque. In this case, an excessive load is not applied to the pressing motor 51M.

[缸按壓解除期間：T6-T7] [During cylinder release: T6-T7]

當於檢查單元中電子零件T之檢查結束時，將用以開始電子零件T之回收之檢查結束信號自檢查單元輸出至控制裝置60。繼而，為了按壓缸53進行收縮，控制裝置60如圖4所示，於時序T6，對按壓缸驅動部65c輸出按壓解除指令。藉此，按壓缸驅動部65c藉由根據按壓解除指令生成驅動信號，而將因按壓缸53之伸長所致之按壓力解除。藉此，對於第1搬送單元34之反作用力變小，因此亦將垂直移動臂52之被受壓片52a與受壓臂35b、36b之接觸解除(參照圖10(a)(b))。 When the inspection of the electronic component T in the inspection unit is completed, an inspection end signal for starting the recovery of the electronic component T is output from the inspection unit to the control device 60. Then, in order to contract the pressing cylinder 53, the control device 60 outputs a pressing release command to the pressing cylinder driving unit 65 c at timing T6 as shown in FIG. 4. With this, the pressing cylinder driving unit 65c generates a driving signal in accordance with the pressing release command, and releases the pressing force caused by the extension of the pressing cylinder 53. As a result, the reaction force to the first conveying unit 34 is reduced, so the contact between the pressed piece 52a of the vertical moving arm 52 and the pressed arms 35b and 36b is also released (see FIG. 10 (a) (b)).

再者，於上述缸按壓解除期間，為了維持第1搬送單元34中之Y方向之位置，而控制裝置60對搬送馬達驅動部65a輸出位置指令。 又，為了維持臂缸35s、36s之伸長，控制裝置60對受壓臂驅動部66輸出接觸指令。進而，如上所述，為了按壓馬達51M能夠以按壓力Fcon按壓電子零件T，而控制裝置60對按壓馬達驅動部65b輸出轉矩指令。 In addition, during the above-mentioned cylinder depressing period, in order to maintain the position in the Y direction in the first transport unit 34, the control device 60 outputs a position command to the transport motor driving unit 65a. In order to maintain the extension of the arm cylinders 35s and 36s, the control device 60 outputs a contact command to the pressure receiving arm driving portion 66. Furthermore, as described above, in order that the pressing motor 51M can press the electronic component T with the pressing force Fcon, the control device 60 outputs a torque command to the pressing motor driving unit 65b.

繼而，搬送馬達驅動部65a抑制搬送馬達MY之旋轉，並且受壓臂驅動部66維持臂缸35s、36s之伸長。繼而，按壓馬達驅動部65b持續以按壓力Fcon按壓電子零件T。 Then, the conveyance motor drive section 65a suppresses the rotation of the conveyance motor MY, and the pressured arm drive section 66 maintains the extension of the arm cylinders 35s and 36s. Then, the pressing motor driving portion 65b continues to press the electronic component T with the pressing force Fcon.

[位置控制期間：T7-T8] [During position control: T7-T8]

當將按壓缸53之按壓解除時，控制裝置60如圖4所示，於時序T7，對按壓馬達驅動部65b輸出位置指令。繼而，按壓馬達驅動部65b根據按壓馬達51M之旋轉位置與上述位置指令生成驅動電流，並將該驅動電流輸出至按壓馬達51M。藉此，按壓馬達51M藉由開始朝向特定方向之旋轉，而開始以按壓力Fbase按壓電子零件T(參照圖11(a)(b))。 When the pressing of the pressing cylinder 53 is released, as shown in FIG. 4, the control device 60 outputs a position command to the pressing motor driving unit 65 b at timing T7. Then, the pressing motor driving unit 65b generates a driving current based on the rotation position of the pressing motor 51M and the position command, and outputs the driving current to the pressing motor 51M. Accordingly, the pressing motor 51M starts to press the electronic component T with the pressing force Fbase by starting to rotate in a specific direction (see FIG. 11 (a) (b)).

再者，於上述位置控制期間，為了維持第1搬送單元34中之Y方向之位置，而控制裝置60對搬送馬達驅動部65a輸出位置指令。又，為了維持臂缸35s、36s之伸長，而控制裝置60對受壓臂驅動部66輸出接觸指令。 In addition, during the position control period, in order to maintain the position in the Y direction in the first conveyance unit 34, the control device 60 outputs a position command to the conveyance motor drive unit 65a. In order to maintain the extension of the arm cylinders 35s and 36s, the control device 60 outputs a contact instruction to the pressure receiving arm driving portion 66.

繼而，搬送馬達驅動部65a抑制搬送馬達MY之旋轉，並且受壓臂驅動部66維持臂缸35s、36s之伸長。 Then, the conveyance motor drive section 65a suppresses the rotation of the conveyance motor MY, and the pressured arm drive section 66 maintains the extension of the arm cylinders 35s and 36s.

[受壓臂解除期間：T8-T9] [During release of pressure arm: T8-T9]

當藉由位置控制驅動按壓馬達51M時，為了使受壓臂35b、36b返回至離開位置為止，而控制裝置60如圖4所示，於時序T8，對受壓臂驅動部66輸出接觸解除指令。繼而，受壓臂驅動部66根據接觸解除指令生成驅動信號並輸出，臂缸35s、36s進行收縮，而受壓臂35b、36b返回至離開位置(參照圖12(a)(b))。 When the pressing motor 51M is driven by the position control, the control device 60 outputs a contact release command to the pressure arm driving portion 66 at timing T8 as shown in FIG. 4 in order to return the pressure arms 35b and 36b to the separated position. . Then, the pressure-receiving arm driving unit 66 generates and outputs a driving signal in accordance with the contact release command, the arm cylinders 35s and 36s contract, and the pressure-receiving arms 35b and 36b return to the separation position (see FIG. 12 (a) (b)).

再者，於上述受壓臂機構解除期間，為了維持第1搬送單元34中之Y方向之位置，而控制裝置60對搬送馬達驅動部65a輸出位置指令。又，為了以按壓力Fbase按壓電子零件T，而控制裝置60對按壓馬達驅動部65b輸出位置指令。 In addition, during the period when the pressure-receiving arm mechanism is released, the control device 60 outputs a position command to the transport motor driving unit 65a in order to maintain the position in the Y direction in the first transport unit 34. In order to press the electronic component T with the pressing force Fbase, the control device 60 outputs a position command to the pressing motor driving unit 65b.

繼而，搬送馬達驅動部65a抑制搬送馬達MY之旋轉，並且按壓馬達驅動部65b抑制按壓馬達51M之旋轉。 Then, the conveyance motor driving section 65a suppresses the rotation of the conveyance motor MY, and the pressing motor driving section 65b suppresses the rotation of the pressing motor 51M.

[上升期間：T9-T10] [Rising period: T9-T10]

當受壓臂35b、36b返回至離開位置為止時，為了使垂直移動臂52之下端部返回至最高位置為止，而控制裝置60如圖4所示，於時序T9，對按壓馬達驅動部65b輸出位置指令。繼而，按壓馬達驅動部65b根據按壓馬達51M之旋轉位置與上述位置指令生成驅動電流，並將該驅動電流輸出至按壓馬達51M。藉此，按壓馬達51M向與時序T9以前相反之方向旋轉而使垂直移動臂52返回至最高位置為止。 When the pressure-receiving arms 35b and 36b return to the disengaged position, in order to return the lower end of the vertical moving arm 52 to the highest position, the control device 60, as shown in FIG. Position command. Then, the pressing motor driving unit 65b generates a driving current based on the rotation position of the pressing motor 51M and the position command, and outputs the driving current to the pressing motor 51M. Thereby, the pressing motor 51M is rotated in a direction opposite to that before the timing T9, and the vertical moving arm 52 is returned to the highest position.

繼而，當垂直移動臂52之下端部到達最高位置時，為了使第1搬送單元34之吸附部54配置於回收用梭盤32b之正上方，而控制裝置60如圖4所示，於時序T10，對搬送馬達驅動部65a輸出位置指令。繼而，搬送馬達驅動部65a根據搬送馬達MY之旋轉位置與上述位置指令生成驅動電流，並將該驅動電流輸出至搬送馬達MY。藉此，搬送馬達MY自時序T10起開始朝向特定方向之旋轉，第1搬送單元34朝向第1梭子進行回向移動直至吸附於吸附部54之電子零件T到達回收用梭盤32b之正上方為止。 Then, when the lower end portion of the vertical moving arm 52 reaches the highest position, in order to arrange the suction portion 54 of the first conveying unit 34 directly above the recovery shuttle 32b, the control device 60 is shown in FIG. 4 at time T10 A position command is output to the transport motor driving unit 65a. Then, the conveyance motor drive unit 65a generates a drive current based on the rotation position of the conveyance motor MY and the position command, and outputs the drive current to the conveyance motor MY. As a result, the transfer motor MY starts to rotate in a specific direction from the timing T10, and the first transfer unit 34 moves back toward the first shuttle until the electronic component T adsorbed on the adsorption unit 54 reaches directly above the recovery shuttle 32b .

如以上說明所述，根據上述實施形態，可獲得以下列舉之效果。 As described above, according to the above embodiment, the following effects can be obtained.

(1)按壓缸53之按壓力之反作用力之一部分作用於搬送單元34、38或搬送導件31，然而其剩餘部分經由受壓臂機構35、36而作用於基台11。即，並非按壓力之反作用力之全部作用於搬送單元34、38，而該反作用力之一部分將向基台11分散。藉此，雖然以所期望之按壓力按壓電子零件T，但搬送單元34、38所要求之剛性為可耐受按壓力之反作用力之一部分者即可。因此，可抑制搬送單元34、38之大型化或重量化。 (1) Part of the reaction force of the pressing force of the pressing cylinder 53 acts on the conveying units 34, 38 or the conveying guide 31, but the remaining part acts on the base 11 via the pressure arm mechanisms 35, 36. That is, not all of the reaction force of the pressing force acts on the conveying units 34 and 38, and a part of the reaction force is dispersed to the base 11. Thereby, although the electronic component T is pressed with a desired pressing force, the rigidity required by the transport units 34 and 38 may be a part that can withstand the reaction force of the pressing force. Therefore, it is possible to suppress an increase in size and weight of the transport units 34 and 38.

(2)按壓電子零件T之垂直移動臂52與按壓缸53中，受壓臂機構 35、36僅與設置於垂直移動臂52之被受壓片52a接觸。因此，可抑制垂直移動臂52因按壓缸53之按壓力而退回。而且，亦可抑制施加至電子零件T之按壓力發生變動。 (2) In the vertical moving arm 52 and the pressing cylinder 53 for pressing the electronic component T, the pressure arm mechanism 35 and 36 are in contact with only the pressed piece 52a provided in the vertical moving arm 52. Therefore, it is possible to suppress the vertical movement arm 52 from retracting due to the pressing force of the pressing cylinder 53. Furthermore, it is possible to suppress variation in the pressing force applied to the electronic component T.

(3)由於搬送單元34、38包含以相對較大之按壓力按壓電子零件T之按壓缸53，故而與藉由馬達之驅動施加相對較大之按壓力之構成相比，可使搬送單元34、38之構成簡單，進而可使處置器10之構成簡單。又，與代替按壓缸53而包含馬達之構成相比，增大施加至電子零件T之按壓力亦變得容易。 (3) Since the conveying units 34 and 38 include a pressing cylinder 53 that presses the electronic component T with a relatively large pressing force, the conveying unit 34 can be compared with a configuration in which a relatively large pressing force is applied by driving of a motor. The structure of the and 38 is simple, and the structure of the treatment device 10 can be further simplified. Furthermore, it is easier to increase the pressing force applied to the electronic component T than the configuration including a motor instead of the pressing cylinder 53.

(4)於按壓缸53之按壓力施加至電子零件T之狀態下，藉由轉矩控制驅動按壓馬達51M。因此，即便垂直移動臂52因按壓缸53之伸長而退回，按壓馬達51M亦輸出特定之轉矩，既然如此便不會對該馬達施加過量之負載。 (4) In a state where the pressing force of the pressing cylinder 53 is applied to the electronic component T, the pressing motor 51M is driven by torque control. Therefore, even if the vertical moving arm 52 is retracted due to the extension of the pressing cylinder 53, the pressing motor 51M also outputs a specific torque. In this case, an excessive load is not applied to the motor.

(5)於按壓缸53對電子零件T施加按壓力時，藉由轉矩控制驅動按壓馬達51M。因此，不會對按壓馬達51M施加過量之負載，此外施加至電子零件T之按壓力亦變得穩定。 (5) When the pressing cylinder 53 applies a pressing force to the electronic component T, the pressing motor 51M is driven by torque control. Therefore, an excessive load is not applied to the pressing motor 51M, and in addition, the pressing force applied to the electronic component T becomes stable.

(6)來自按壓缸53之按壓力之反作用力作用於相互對向之一對受壓臂35b、36b之各者。因此，與抵抗來自按壓缸53之按壓力之反作用力作用於搭載面11a之一個部位之態樣相比，可擴大該反作用力分散之範圍，進而可抑制受壓臂機構35、36或基台11所要求之剛性。 (6) The reaction force of the pressing force from the pressing cylinder 53 acts on each of the pair of pressure receiving arms 35b, 36b facing each other. Therefore, compared with a state in which a reaction force from the pressing cylinder 53 acting on a portion of the mounting surface 11a is resisted, the range in which the reaction force is dispersed can be enlarged, and the pressure arm mechanism 35, 36, or abutment can be suppressed. 11 required rigidity.

(7)若為同時按壓複數個電子零件T之上述態樣，則施加至檢查用插座33之整體之按壓力自動變大，因此與此相應，該按壓力之反作用力亦自動變大。因此，可抑制搬送單元34、38之大型化或重量化之效果變得更顯著。 (7) If the plurality of electronic parts T are pressed simultaneously, the pressing force applied to the entirety of the inspection socket 33 is automatically increased, and accordingly, the reaction force of the pressing force is automatically increased accordingly. Therefore, the effect of suppressing the increase in size or weight of the transport units 34 and 38 becomes more significant.

再者，上述實施形態可以如下之方式進行適當變更而實施。 In addition, the said embodiment can be implemented as suitably changed as follows.

●搬送對象除上述電子零件T以外，亦可為光學零件或精密機器零件等各種零件，總之，為被搬送及按壓者即可。即便為上述之搬送 對象，亦可獲得依據上述(1)~(7)所得之效果。 ● In addition to the electronic components T described above, the objects to be transported can also be various parts such as optical parts and precision machine parts. In short, they can be transported and pressed. Even for the above The object can also obtain the effects obtained according to the above (1) to (7).

●保持部保持搬送對象之態樣並不限定於如上述般吸附搬送對象之態樣，亦可為例如握持搬送對象之態樣，總之，為可保持載置於上述各種托盤之搬送對象，並且可利用檢查用插座33按壓所保持之搬送對象之態樣即可。即便為如上所述之保持之態樣，亦可獲得依據上述(1)~(7)所得之效果。 ● The holding part is not limited to the state in which the conveyed object is adsorbed as described above, and may be, for example, a state in which the conveyed object is held. In short, it is capable of holding the conveyed object placed on the above-mentioned various trays. The inspection socket 33 may be used to press the held transport target. Even in the state of being maintained as described above, the effects obtained according to the above (1) to (7) can be obtained.

●處置器10亦可不為必定同時搬送且同時按壓複數個電子零件T之構成。總之，至少具有同時搬送複數個電子零件T之狀態及同時按壓複數個電子零件T之狀態即可。根據上述構成，由於具有施加至檢查用插座33之整體之按壓力變大之狀態，故而與此相應，具有該按壓力之反作用力亦變大之狀態。因此，可抑制搬送單元34、38之大型化或重量化之效果變得更顯著。 ● The disposer 10 may not necessarily be configured to be transported simultaneously and a plurality of electronic parts T are pressed simultaneously. In short, it is sufficient to have at least a state in which a plurality of electronic parts T are simultaneously conveyed and a state in which a plurality of electronic parts T are simultaneously pressed. According to the above-mentioned configuration, since the pressing force applied to the entirety of the inspection socket 33 is increased, the reaction force corresponding to the pressing force is also increased accordingly. Therefore, the effect of suppressing the increase in size or weight of the transport units 34 and 38 becomes more significant.

●一個搬送單元搬送之搬送對象之個數亦可為一個。即便為如上所述之構成，亦可獲得依據上述(1)~(6)所得之效果。 ● The number of objects to be transported by one transport unit may also be one. Even with the structure described above, the effects obtained according to the above (1) to (6) can be obtained.

●亦可為被受壓片52a與一個受壓臂機構接觸之構成，即便為如上所述之構成，亦可獲得依據上述(1)~(5)、(7)所得之效果，又，受壓臂機構之數量較少，相應地可將處置器10之構成設為簡單者。 ● It can also be a structure in which the pressed piece 52a is in contact with a pressured arm mechanism. Even if it is the structure described above, the effects obtained according to the above (1) to (5) and (7) can also be obtained. The number of the pressing arm mechanisms is small, and accordingly, the configuration of the treatment device 10 can be simplified.

●亦可為如下之構成：於作為第1按壓部之按壓缸53對電子零件T施加按壓力時，與該按壓力之施加同時地，以轉矩控制模式驅動構成第2按壓部之按壓馬達51M。即便為如上所述之構成，亦可獲得依據上述(1)~(4)、(6)、(7)所得之效果，而且亦可利用共通之控制信號使驅動按壓缸53之時序與以轉矩控制模式驅動按壓馬達51M之時序同步。因此，驅動按壓缸53之時序與以轉矩控制模式驅動按壓馬達51M之時序之匹配亦變得容易。 ● It is also possible to have a configuration in which when the pressing cylinder 53 serving as the first pressing section applies a pressing force to the electronic component T, the pressing motor constituting the second pressing section is driven in a torque control mode simultaneously with the application of the pressing force. 51M. Even with the structure as described above, the effects obtained according to the above (1) to (4), (6), and (7) can be obtained, and the common control signal can be used to make the timing and rotation of the driving pressure cylinder 53 The timing control of the moment control mode driving the pressing motor 51M is synchronized. Therefore, it is also easy to match the timing of driving the pressing cylinder 53 with the timing of driving the pressing motor 51M in the torque control mode.

●亦可為於按壓缸53對電子零件T施加按壓力時，藉由位置控制驅動按壓馬達51M之態樣。即便為如上所述之構成，亦可獲得依據上 述(1)~(3)、(5)~(7)所得之效果，並且亦可省略用以計測按壓馬達51M之驅動電流之電流計測部I51M。 ● When the pressing cylinder 53 applies a pressing force to the electronic component T, the pressing motor 51M is driven by the position control. Even if the structure is as described above, The effects obtained in (1) to (3) and (5) to (7) are described, and the current measurement unit I51M for measuring the driving current of the pressing motor 51M may be omitted.

●按壓缸並不限定於經由閥而供給特定壓力之壓縮空氣之構成，亦可為供給藉由電氣調節器而壓縮為特定壓力之空氣之構成。又，按壓缸並不限定於藉由壓縮空氣而給予作動壓之缸，亦可為藉由油壓而給予作動壓之缸。 ● The pressing cylinder is not limited to a configuration in which compressed air of a specific pressure is supplied through a valve, and may also be a configuration in which air compressed to a specific pressure by an electric regulator is supplied. In addition, the pressing cylinder is not limited to a cylinder that is actuated by compressed air, but may be a cylinder that is actuated by oil pressure.

●亦可為搬送單元34、38代替按壓缸53而包含與按壓馬達51M不同之按壓用之馬達之構成，即便為如上所述之構成，亦可獲得依據上述(1)、(2)、(6)、(7)所得之效果。 ● The conveying units 34 and 38 may be configured to include a pressing motor different from the pressing motor 51M instead of the pressing cylinder 53. Even if the configuration is as described above, the above-mentioned (1), (2), ( 6), (7) The effect obtained.

●亦可為搬送單元34、38僅藉由按壓缸53按壓搬送對象之構成。 即便為如上所述之構成，亦可獲得依據上述(1)、(2)、(6)、(7)所得之效果。 ● The conveying units 34 and 38 may be configured to press the conveying target only by the pressing cylinder 53. Even if it is a structure as mentioned above, the effect obtained by said (1), (2), (6), (7) can also be acquired.

●亦可為搬送單元34、38不包含按壓缸53之構成，且僅藉由按壓馬達51M進行搬送對象之按壓之構成。即便為如上所述之構成，亦可獲得依據上述(1)、(2)、(6)、(7)所得之效果，而且亦可使搬送單元之構成簡單。 ● It is also possible to adopt a configuration in which the conveying units 34 and 38 do not include the pressing cylinder 53 and the pressing of the conveying object is performed only by the pressing motor 51M. Even with the configuration described above, the effects obtained in the above (1), (2), (6), and (7) can be obtained, and the configuration of the transfer unit can be simplified.

●與受壓臂35b、36b接觸之被受壓片52a並不限定於垂直移動臂52之下端，亦可相較垂直移動臂52之下端而設置於水平移動臂51側。 ● The pressed piece 52a which is in contact with the pressed arms 35b, 36b is not limited to the lower end of the vertical moving arm 52, and may be provided on the horizontal moving arm 51 side compared to the lower end of the vertical moving arm 52.

●亦可為對垂直移動臂與按壓缸設置被受壓片，並且受壓臂機構35、36與該等被受壓片之兩者接觸之構成。即便為如上所述之構成，亦可獲得依據上述(1)、(3)~(7)所得之效果，與被受壓片之數量多相應地，按壓馬達51M與按壓缸53之按壓力之反作用力更確實地由受壓臂機構35、36所受壓。 ● It is also possible to provide a compressed plate for the vertical moving arm and the pressing cylinder, and the compressed arm mechanisms 35, 36 are in contact with both of the pressed plates. Even with the structure described above, the effects obtained according to the above (1), (3) to (7) can be obtained. According to the number of the pressed pieces, the pressing force of the pressing motor 51M and the pressing cylinder 53 can be obtained. The reaction force is more surely pressed by the pressure arm mechanisms 35 and 36.

●亦可為按壓缸包含缸本體與連結於吸附部之柱塞，且於缸本體設置被受壓片之構成。即便為上述之構成，亦可獲得依據上述(1)、(3)~(7)所得之效果。 ● It can also be a structure in which the pressing cylinder includes a cylinder body and a plunger connected to the suction part, and a pressed sheet is provided in the cylinder body. Even if it is the said structure, the effect obtained by said (1), (3)-(7) can be acquired.

●受壓臂35b、36b亦可為藉由臂缸35s、36s以外之機構例如由馬達驅動之機構等其他機構而驅動者。 ● The pressure-receiving arms 35b and 36b may be driven by a mechanism other than the arm cylinders 35s and 36s, for example, a mechanism driven by a motor.

●亦可為如下之構成：受壓臂35b、36b於其接觸位置固定於支撐體35a、36a，於受壓臂35b、36b與檢查用插座33之間，設置有被受壓片52a可沿Y方向移動之間隙。若為如上所述之構成，則於所固定之受壓臂35b、36b之下方，進行電子零件T相對於檢查用插座33之搬入及搬出，並且因按壓力之反作用力而退回之被受壓片52a與受壓臂35b、36b接觸。又，由於可省略受壓臂35b、36b之可動所需之機構，故而亦可簡化受壓臂35b、36b之構成。 ● It can also have a structure in which the pressure-receiving arms 35b and 36b are fixed to the support bodies 35a and 36a at their contact positions, and between the pressure-receiving arms 35b and 36b and the inspection socket 33, a pressure-receiving sheet 52a is provided along Gap in Y direction. With the structure as described above, the electronic components T are moved in and out of the inspection socket 33 under the fixed pressure arms 35b and 36b, and are returned under pressure due to the reaction force of the pressing force. The piece 52a is in contact with the pressure receiving arms 35b, 36b. In addition, since the mechanism required for the movement of the pressure-receiving arms 35b and 36b can be omitted, the structure of the pressure-receiving arms 35b and 36b can be simplified.

●受壓臂35b、36b與被受壓片52a亦可為以如下之方式進行動作之構成。即，於位於接觸位置之受壓臂35b、36b與檢查用插座33之間隙中，被受壓片52a自Y方向移動。繼而，於被受壓片52a與受壓臂35b、36b接觸之後，受壓臂35b、36b變位至離開位置。而且，被受壓片52a沿z方向移動。 The pressure-receiving arms 35b, 36b and the pressure-receiving piece 52a may be configured to operate in the following manner. That is, in the gap between the pressure-receiving arms 35b and 36b located at the contact position and the inspection socket 33, the pressure-receiving piece 52a moves from the Y direction. Then, after the pressure-receiving sheet 52a contacts the pressure-receiving arms 35b, 36b, the pressure-receiving arms 35b, 36b are displaced to the separation position. Then, the pressed piece 52a moves in the z direction.

根據上述動作，於利用第1搬送單元34進行電子零件T之按壓時，可省略使位於離開位置之受壓臂35b、36b向接觸位置移動之期間、即自上述時序T3直至時序T4為止之期間。再者，已變位至離開位置之受壓臂35b、36b於任意時序變位至接觸位置即可。 According to the above operation, when the electronic component T is pressed by the first transfer unit 34, the period during which the pressure arms 35b and 36b located at the separated position are moved to the contact position can be omitted, that is, the period from the timing T3 to the timing T4. . Moreover, the pressure arms 35b, 36b that have been displaced to the disengaged position may be displaced to the contact position at any timing.

●受壓臂35b、36b與被受壓片52a亦可為以如下之方式進行動作之構成。即，於位於離開位置之受壓臂35b、36b間，被受壓片52a自Z方向移動，繼而，受壓臂35b、36b移動至接觸位置。繼而，於被受壓片52a與受壓臂35b、36b接觸之後，被受壓片52a自受壓臂35b、36b與檢查用插座33之間隙沿Y方向移動，藉此解除與受壓臂35b、36b之接觸。 The pressure-receiving arms 35b, 36b and the pressure-receiving piece 52a may be configured to operate in the following manner. That is, between the pressure-receiving arms 35b and 36b located at the separation position, the pressure-receiving piece 52a moves from the Z direction, and then the pressure-receiving arms 35b and 36b move to the contact position. Then, after the pressed piece 52a comes into contact with the pressed arms 35b and 36b, the pressed piece 52a moves in the Y direction from the gap between the pressed arms 35b and 36b and the inspection socket 33, thereby releasing the pressed piece 35b. , 36b contact.

根據上述動作，於利用第1搬送單元34進行電子零件T之按壓時，可省略使已變位至接觸位置之受壓臂35b、36b向離開位置移動之期 間、即自上述時序T8直至時序T9為止之期間。再者，已變位至接觸位置之受壓臂35b、36b於被受壓片52a之解除後之任意時序變位至離開位置即可。 According to the above operation, when the electronic component T is pressed by the first transfer unit 34, the period of moving the pressure arms 35b and 36b that have been displaced to the contact position to the separation position can be omitted. Time, that is, a period from the above-mentioned timing T8 to timing T9. Further, the pressure-receiving arms 35b, 36b that have been displaced to the contact position may be displaced to the away position at any timing after the pressure-receiving sheet 52a is released.

●亦可為按壓部之一部分以與所固定之受壓部之接觸部接觸之方式可動之構成，又，亦可為按壓部之一部分以解除與接觸部之接觸之方式可動之構成。 ● It is also possible that a part of the pressing part is movable so as to be in contact with the contact part of the fixed pressure receiving part, and it may be a part that is movable so as to release the contact with the contact part.

●受壓部亦可作為藉由因與按壓部之接觸而產生之摩擦，而抑制按壓部向按壓方向之相反側移動之構成而實現。而且，受壓部與按壓部之接觸部位亦可為按壓部之下端。於此情形時，亦可為於按壓部設置有凹部，並且於受壓部設置有凸部之構成或於按壓部設置有凸部，並且於受壓部設置有凹部之構成。藉由於該等凹部與凸部之間產生之摩擦，可很大地抑制按壓部之移動。總之，受壓部為可阻止按壓部因按壓搬送對象時產生之反作用力而退回之構成即可。 ● The pressure-receiving portion can also be realized as a structure that suppresses movement of the pressing portion to the opposite side of the pressing direction by friction caused by contact with the pressing portion. In addition, a contact portion between the pressure receiving portion and the pressing portion may be a lower end of the pressing portion. In this case, a configuration in which a depression is provided in the pressing portion and a projection is provided in the pressure receiving portion or a projection is provided in the pressing portion and a depression is provided in the pressure receiving portion. Due to the friction generated between the concave portions and the convex portions, the movement of the pressing portion can be greatly suppressed. In short, the pressure receiving portion may be configured to prevent the pressing portion from returning due to a reaction force generated when the conveyed object is pressed.

●設為按壓缸53之按壓力大於按壓馬達51M之按壓力之構成，但亦可為按壓馬達51M之按壓力大於按壓缸53之按壓力之構成，或按壓馬達51M之按壓力與按壓缸53之按壓力相等之構成。 ● The pressing force of the pressing cylinder 53 is greater than the pressing force of the pressing motor 51M, but it can also be the pressing force of the pressing motor 51M greater than the pressing pressure of the pressing cylinder 53 or the pressing force of the pressing motor 51M and the pressing cylinder 53 Composed of equal pressure.

●使得處置器10包含受到第1搬送單元34將電子零件T嵌入檢查用插座33時之反作用力之受壓臂機構35、36。並不限定於此，亦可使得處置器10包含受到第1搬送單元34利用供給用梭盤32a、回收用梭盤37b或輸送機托盤C1a、C2a、C3a、C4a等按壓電子零件T時之反作用力之受壓臂機構。 The treatment device 10 includes the pressure arm mechanisms 35 and 36 that receive the reaction force when the first transfer unit 34 inserts the electronic component T into the inspection socket 33. The present invention is not limited to this, and the disposer 10 may include a reaction when the first transfer unit 34 receives the electronic component T by pressing the supply shuttle 32a, the recovery shuttle 37b, or the conveyor trays C1a, C2a, C3a, and C4a. Forced arm mechanism.

●亦可為按壓馬達51M之按壓力大於按壓缸53之按壓力之構成或按壓馬達51M之按壓力與按壓缸53之按壓力相等之構成。 ● It is also possible that the pressing force of the pressing motor 51M is greater than the pressing force of the pressing cylinder 53 or the pressing force of the pressing motor 51M and the pressing force of the pressing cylinder 53 are equal.

●使得供給側可動導件22相對於所固定之供給側固定導件21相對移動，並且回收側可動導件42相對於所固定之回收側固定導件41相對移動，但亦可為設置有2個可相對於所固定之單一之固定導件相對移 動之可動導件之構成。於此情形時，固定導件較佳為於上述蓋構件12內，與基台11之上表面中之沿X方向延伸之一邊平行，且遍及基台11之X方向之大致整個範圍而形成。又，2個可動導件較佳為於蓋構件12內且隔著上述搬送導件31而設置於相反側。 ● Move the supply-side movable guide 22 relative to the fixed supply-side fixed guide 21 and move the recovery-side movable guide 42 relative to the fixed-recovery-side fixed guide 41, but it may be provided with 2 Can be moved relative to a single fixed guide The structure of the movable guide. In this case, the fixing guide is preferably formed in the cover member 12 in parallel with one side extending in the X direction in the upper surface of the base table 11 and is formed over substantially the entire range in the X direction of the base table 11. Moreover, it is preferable that two movable guides are provided in the cover member 12 on the opposite side via the conveyance guide 31 mentioned above.

●處置器10包含之搬送單元之台數並不限定於2台，亦可為1台或3台。 ● The number of transport units included in the handler 10 is not limited to two, and may be one or three.

●亦可為如下之態樣：收容於供給用梭盤32a之電子零件T由第1搬送單元34搬送至檢查用插座33為止，且收容於檢查用插座33之電子零件T由第2搬送單元38按壓。總之，為對搬送對象進行搬送，且按壓該搬送對象之態樣即可。 ● It is also possible that the electronic component T stored in the supply shuttle 32a is transferred from the first transfer unit 34 to the inspection socket 33, and the electronic component T stored in the inspection socket 33 is transferred by the second transfer unit. 38 Press. In short, it is sufficient to carry out the conveyance and press the conveyance object.

●處置器並不限定於檢查搬送對象之零件檢查裝置，為用於進行搬送對象之搬送與按壓之裝置者即可。 ● The disposer is not limited to a part inspection device for inspecting a conveyed object, and may be a device for conveying and pressing the conveyed object.

Claims (9)

一種處置器，其特徵在於包含：基台；可配置檢查用插座之區域，其中該檢查用插座係設置於上述基台並檢查搬送對象者；梭子，其可載置上述搬送對象；供給機械手，其將檢查前之上述搬送對象供給至上述梭子；回收機械手，其不同於上述供給機械手，將檢查後之上述搬送對象自上述梭子回收；搬送部，其可將上述搬送對象自上述梭子搬送至上述檢查用插座，而且可將上述搬送對象自上述檢查用插座搬送至上述梭子；及受壓部，其由上述基台所具備；且於上述搬送部設有將上述搬送對象按壓於上述檢查用插座之按壓部；於上述受壓部設有與上述按壓部進行接觸的受壓元件；當將上述搬送對象按壓於上述檢查用插座時，上述按壓部係沿與上述按壓之方向相反之方向，對上述受壓元件進行接觸。A handler is characterized by comprising: an abutment; an area where an inspection socket can be arranged, wherein the inspection socket is provided on the above-mentioned abutment and inspects a person to be transported; a shuttle capable of placing the object to be transported; and a robot hand It supplies the transfer object before the inspection to the shuttle; a recovery robot, which is different from the supply robot, recovers the transfer object after the inspection from the shuttle; and a transport unit that can transfer the transfer object from the shuttle It can be transported to the inspection socket, and the transport object can be transported from the inspection socket to the shuttle; and a pressure receiving section provided by the abutment; and the transport section is provided with the transport object pressed against the inspection. A pressing part of a socket; a pressure receiving element in contact with the pressing part is provided on the pressure receiving part; when the conveying object is pressed against the inspection socket, the pressing part is in a direction opposite to the pressing direction , Making contact with the pressure-receiving element. 如請求項1之處置器，其中上述按壓部包含：第1按壓部，其將上述搬送對象朝向上述基台按壓；及第2按壓部，其將上述第1按壓部朝向上述基台按壓；且上述受壓部之上述受壓元件係可朝與設置於上述第2按壓部之突出部進行接觸之方向移動。The disposer of claim 1, wherein the pressing portion includes: a first pressing portion that presses the conveyed object toward the abutment; and a second pressing portion that presses the first pressing portion toward the abutment; and The pressure-receiving element of the pressure-receiving portion is movable in a direction in contact with a protruding portion provided in the second pressing portion. 如請求項2之處置器，其中：上述受壓部之上述受壓元件係可朝離開設置於上述第2按壓部之突出部之方向移動。In the treatment device of claim 2, wherein the pressure receiving element of the pressure receiving portion is movable in a direction away from a protruding portion provided on the second pressing portion. 如請求項3之處置器，其中上述第1按壓部為按壓缸；上述第2按壓部包含使上述按壓缸上升及下降之馬達；上述第1按壓部之按壓力大於上述第2按壓部之按壓力。The treatment device of claim 3, wherein the first pressing portion is a pressing cylinder; the second pressing portion includes a motor for raising and lowering the pressing cylinder; the pressing force of the first pressing portion is greater than that of the second pressing portion; pressure. 如請求項4之處置器，其中包含控制上述馬達之驅動之馬達控制部；上述馬達控制部於上述按壓缸按壓上述搬送對象之狀態下，藉由轉矩控制而驅動上述馬達。The disposer of claim 4 includes a motor control unit that controls the drive of the motor; the motor control unit drives the motor by torque control in a state where the pressing cylinder presses the conveying object. 如請求項4或5之處置器，其中包含控制上述馬達之驅動之馬達控制部；上述馬達控制部於上述按壓缸按壓上述搬送對象之前，藉由轉矩控制而驅動上述馬達。For example, the processor of claim 4 or 5 includes a motor control unit that controls the drive of the motor; the motor control unit drives the motor by torque control before the pressing cylinder presses the transport object. 如請求項2至5中任一項之處置器，其中上述受壓元件為相互對向之一對可動臂；上述一對可動臂係變位至與上述突出部進行接觸之位置、及離開上述突出部之位置。The handler according to any one of claims 2 to 5, wherein the pressure-receiving element is a pair of movable arms facing each other; the pair of movable arms are displaced to a position where they come into contact with the protruding portion, and leave the above Position of the protrusion. 如請求項1至5中任一項之處置器，其中上述搬送部具有吸附複數個上述搬送對象之狀態；上述按壓部具有按壓複數個上述搬送對象之狀態。The processor according to any one of claims 1 to 5, wherein the transfer unit has a state in which a plurality of the transfer objects are adsorbed; and the pressing unit has a state in which a plurality of the transfer objects are pressed. 一種零件檢查裝置，其特徵在於包含：基台；檢查用插座，其設置於上述基台並檢查搬送對象；梭子，其可載置上述搬送對象；供給機械手，其將檢查前之上述搬送對象供給至上述梭子；回收機械手，其不同於上述供給機械手，將檢查後之上述搬送對象自上述梭子回收；搬送部，其可將上述搬送對象自上述梭子搬送至上述檢查用插座，而且可將上述搬送對象自上述檢查用插座搬送至上述梭子；及受壓部，其由上述基台所具備；且於上述搬送部設置將上述搬送對象按壓於上述檢查用插座之按壓部；於上述受壓部設有與上述按壓部進行接觸的受壓元件；當將上述搬送對象按壓於上述檢查用插座時，上述按壓部係沿與上述按壓之方向相反之方向，對上述受壓元件進行接觸。A part inspection device, comprising: a base; an inspection socket provided on the base and inspecting a transport object; a shuttle capable of mounting the transport object; and a robot arm that supplies the transport object before inspection Supply to the shuttle; a recovery robot, which is different from the supply robot, collects the transported object after the inspection from the shuttle; and a transport unit that can transport the transported object from the shuttle to the inspection socket, and can Transporting the transported object from the inspection socket to the shuttle; and a pressure receiving section provided by the base; and the transporting section is provided with a pressing section that presses the transported object against the inspection socket; A pressure receiving element is provided in contact with the pressing portion. When the transporting object is pressed against the inspection socket, the pressing portion contacts the pressure receiving element in a direction opposite to the pressing direction.