TWI668174B - Electronic component transfer device and electronic component inspection device - Google Patents

Electronic component transfer device and electronic component inspection device Download PDF

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Publication number
TWI668174B
TWI668174B TW105116157A TW105116157A TWI668174B TW I668174 B TWI668174 B TW I668174B TW 105116157 A TW105116157 A TW 105116157A TW 105116157 A TW105116157 A TW 105116157A TW I668174 B TWI668174 B TW I668174B
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button
operating
tray
electronic component
unit
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TW105116157A
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Chinese (zh)
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TW201643093A (en
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清水博之
下島聡興
清水惣太
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日商精工愛普生股份有限公司
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Priority claimed from JP2015107156A external-priority patent/JP2016222354A/en
Priority claimed from JP2015109535A external-priority patent/JP2016223875A/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

本發明提供一種能夠操作各作動部之電子零件搬送裝置及電子零件檢查裝置。 The present invention provides an electronic component transfer device and an electronic component inspection device capable of operating each of the moving parts.

電子零件搬送裝置10具有：複數個作動部；及操作部，其能夠操作各作動部中之至少1個作動部。該操作部係由顯示於顯示裝置40之按鈕構成。又，操作滑鼠51於顯示裝置40中將游標對準按鈕並點選，藉此能夠使作動部作動。 The electronic component transfer device 10 includes a plurality of operating units and an operation unit capable of operating at least one of the operating units. This operation unit is constituted by buttons displayed on the display device 40. In addition, by operating the mouse 51 and aligning the cursor with the button on the display device 40 and clicking, the operating unit can be operated.

Description

電子零件搬送裝置及電子零件檢查裝置 Electronic component transfer device and electronic component inspection device

本發明係關於一種電子零件搬送裝置及電子零件檢查裝置。 The invention relates to an electronic component conveying device and an electronic component inspection device.

先前，已知有例如對IC(Integrated Circuit，積體電路)器件等電子零件之電氣特性進行檢查之電子零件檢查裝置。該電子零件檢查裝置一般具有：檢查部，其檢查IC器件；及電子零件搬送裝置，其具有用以將IC器件搬送至檢查部之搬送部。又，於電子零件檢查裝置中，存在一面將IC器件冷卻或加熱至特定溫度，一面檢查IC器件之情況。 Conventionally, there has been known an electronic component inspection device that inspects the electrical characteristics of electronic components such as IC (Integrated Circuit) devices. The electronic component inspection apparatus generally includes an inspection section that inspects IC devices, and an electronic component transport device that includes a transport section for transporting the IC devices to the inspection section. In addition, in the electronic component inspection device, the IC device may be inspected while cooling or heating the IC device to a specific temperature.

作為此種電子零件檢查裝置之一例，例如專利文獻1中揭示有具備檢查IC器件之電氣特性之檢查部之IC處置器。於該專利文獻1中，將IC處置器內之溫度或氣體等各種設定條件、或IC器件之良品率等顯示於操作畫面。 As an example of such an electronic component inspection device, for example, Patent Document 1 discloses an IC handler including an inspection unit that inspects the electrical characteristics of an IC device. In Patent Document 1, various setting conditions such as temperature and gas in the IC processor, or yield of the IC device, etc. are displayed on the operation screen.

又，於先前之電子零件檢查裝置中，存在組入有用以將IC器件搬送至檢查部之保持部之電子零件搬送裝置者。例如，於專利文獻2所示之電子零件搬送裝置中，載置IC器件並使其自第1位置(特定位置)移動至第2位置(特定位置)之移動部對應於IC器件之搬送路徑而配置於複數個部位，作為移動部，存在使IC器件沿X方向移動者。 In addition, in the conventional electronic component inspection apparatus, there is an electronic component transport apparatus incorporated to carry the IC device to the holding section of the inspection section. For example, in the electronic component transfer device shown in Patent Document 2, a moving part that mounts and moves the IC device from the first position (specific position) to the second position (specific position) corresponds to the IC device transfer path. Arranged at a plurality of locations, there are those who move the IC device in the X direction as a moving portion.

[先前技術文獻] [Prior technical literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開2009-97899號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2009-97899

[專利文獻2]日本專利特開2014-085230號公報 [Patent Document 2] Japanese Patent Laid-Open No. 2014-085230

然而，於專利文獻1所示之IC處置器中，無法於操作畫面上操作IC處置器之各部之作動。因此，例如於進行IC處置器之各部之動作確認等之情形時，需要移動IC處置器整體。 However, in the IC treatment device shown in Patent Document 1, the operation of each part of the IC treatment device cannot be operated on the operation screen. Therefore, for example, in the case of confirming the operation of each part of the IC handler, it is necessary to move the entire IC handler.

又，於專利文獻2所示之電子零件搬送裝置中，存在定期進行用以變更移動部自第1位置移動至第2位置所需之動作時間之維護之情況。然而，動作時間之變更例如係進行維護之作業人員使用秒錶而進行，藉由該作業人員按下開始按鈕之時點或按下停止按鈕之時點會產生偏差。該情形時，存在用以獲得所需之處理量之移動部之動作時間未準確地變更之問題。 Further, in the electronic component transfer device shown in Patent Document 2, maintenance may be performed periodically to change the operation time required for the moving unit to move from the first position to the second position. However, the operation time is changed, for example, by a maintenance worker using a stopwatch, and a deviation occurs when the worker presses the start button or the stop button. In this case, there is a problem that the operation time of the moving unit for obtaining a required processing amount is not accurately changed.

本發明係為了解決上述課題之至少一部分而完成者，能夠作為以下之形態或應用例而實現。 The present invention has been made to solve at least a part of the problems described above, and can be implemented as the following forms or application examples.

[應用例1]本應用例之電子零件搬送裝置之特徵在於具有：複數個作動部；及操作部，其能夠操作上述複數個作動部中之至少1個作動部。 [Application Example 1] The electronic component transfer device of this application example includes a plurality of operating sections and an operation section capable of operating at least one of the plurality of operating sections.

藉此，能夠操作各作動部。因此，例如能夠進行作動部之動作確認。 Thereby, each operating part can be operated. Therefore, for example, the operation of the operating unit can be confirmed.

[應用例2]於上述應用例之電子零件搬送裝置中，較佳為，上述操作部能夠各自獨立地操作上述複數個作動部。 [Application Example 2] In the electronic component transfer device of the application example described above, it is preferable that the operation unit can independently operate the plurality of operation units.

藉此，例如能夠進行複數個作動部中之僅欲進行動作確認之作動部之動作確認。 Thereby, for example, it is possible to perform the operation confirmation of only the operation portion whose operation confirmation is to be performed among the plurality of operation portions.

[應用例3]於上述應用例之電子零件搬送裝置中，較佳為，上述作動部係能夠開閉之擋板。 [Application Example 3] In the electronic component transfer device according to the application example described above, it is preferable that the operating portion is a shutter capable of being opened and closed.

藉此，能夠進行擋板之動作確認。 This makes it possible to confirm the operation of the shutter.

[應用例4]於上述應用例之電子零件搬送裝置中，較佳為，具有顯示上述操作部之顯示部。 [Application Example 4] In the electronic component transporting device of the application example described above, it is preferable to include a display section that displays the operation section.

藉此，能夠一面視認顯示部一面進行操作部之操作。 This makes it possible to operate the operation unit while viewing the display unit.

[應用例5]於上述應用例之電子零件搬送裝置中，較佳為，上述顯示部顯示作動部之作動狀態。 [Application Example 5] In the electronic component transfer device of the application example described above, it is preferable that the display section displays an operation state of the operation section.

藉此，能夠將作動部之作動狀態顯示於顯示部。因此，能夠一面進行作動部之操作一面確認作動狀態。 Thereby, the operating state of the operating unit can be displayed on the display unit. Therefore, it is possible to confirm the operating state while operating the operating unit.

[應用例6]於上述應用例之電子零件搬送裝置中，較佳為，上述操作部係於上述作動部之動作確認時顯示。 [Application Example 6] In the electronic component conveying device of the application example described above, preferably, the operation unit is displayed when the operation of the operation unit is confirmed.

藉此，能夠進行動作確認。 Thereby, operation confirmation can be performed.

[應用例7]於上述應用例之電子零件搬送裝置中，較佳為，上述顯示部具有進行使上述作動部作動之指示之操作按鈕。 [Application Example 7] In the electronic component conveying device according to the application example described above, it is preferable that the display section includes an operation button for instructing the operating section to operate.

藉此，能夠藉由對操作按鈕進行操作之簡單方法，而操作作動部。 Thereby, it is possible to operate the operating portion by a simple method of operating the operation button.

[應用例8]於上述應用例之電子零件搬送裝置中，較佳為，上述操作按鈕係以矩形顯示。 [Application Example 8] In the electronic component conveying device of the above application example, it is preferable that the operation buttons are displayed in a rectangular shape.

藉由將操作按鈕設為矩形，使其他部分之形狀與矩形不同，能夠易於視認到操作按鈕。 By making the operation buttons rectangular, the shape of the other parts is different from the rectangle, and the operation buttons can be easily seen.

[應用例9]於上述應用例之電子零件搬送裝置中，較佳為，上述操作按鈕係發光者，當操作上述操作按鈕而將上述作動部設為作動狀態時，亮度增加。 [Application Example 9] In the electronic component conveying device of the application example described above, preferably, the operation button is a light-emitting person, and when the operation button is operated to set the operating portion to an operating state, the brightness is increased.

藉此，能夠獲知操作按鈕是否***作。 This makes it possible to know whether the operation button is operated.

[應用例10]於上述應用例之電子零件搬送裝置中，較佳為，上述顯示部具有顯示上述作動部是否為作動狀態之作動狀態顯示部。 [Application Example 10] In the electronic component conveying device according to the application example, it is preferable that the display section includes an operation state display section that displays whether the operation section is in an operation state.

藉此，能夠藉由視認而獲知作動部是否處於作動狀態。 This makes it possible to know whether the operating portion is in an operating state by visual inspection.

[應用例11]於上述應用例之電子零件搬送裝置中，較佳為，上述 作動狀態顯示部係以圓形顯示。 [Application Example 11] In the electronic component transfer device of the application example described above, it is preferable that The operating state display section is displayed in a circle.

藉由將作動狀態顯示部設為圓形，使其他部分之形狀與圓形不同，能夠易於視認到作動狀態顯示部。 By setting the operating state display section to be circular, the shape of the other portions is different from the circle, so that the operating state display section can be easily seen.

[應用例12]於上述應用例之電子零件搬送裝置中，較佳為，上述作動狀態顯示部係發光者，於上述作動狀態時，亮度增加。 [Application Example 12] In the electronic component transfer device of the application example described above, it is preferable that the operating state display section is a light-emitting person, and in the operating state, the brightness is increased.

藉此，能夠藉由視認而獲知作動部是否處於作動狀態。 This makes it possible to know whether the operating portion is in an operating state by visual inspection.

[應用例13]於上述應用例之電子零件搬送裝置中，較佳為，於上述顯示部中，上述操作按鈕及上述作動狀態顯示部之至少中心部之明暗會變化。 [Application Example 13] In the electronic component transporting device of the above application example, it is preferable that in the display section, the brightness of at least the central portion of the operation button and the operating state display section is changed.

藉此，能夠易於觀察到操作按鈕及作動狀態顯示部。 This makes it easy to observe the operation buttons and the operation state display section.

[應用例14]本應用例之電子零件檢查裝置之特徵在於具有：複數個作動部；操作部，其能夠操作上述複數個作動部中之至少l個作動部；及檢查部，其檢查電子零件。 [Application Example 14] The electronic component inspection device of this application example is characterized by having: a plurality of operating sections; an operation section capable of operating at least one of the plurality of operating sections; and an inspection section for inspecting electronic parts .

藉此，能夠操作各作動部。因此，例如能夠進行作動部之動作確認。 Thereby, each operating part can be operated. Therefore, for example, the operation of the operating unit can be confirmed.

[應用例15]本應用例之電子零件搬送裝置之特徵在於具有：移動部，其使能夠載置電子零件之載置構件移動；及移動時間顯示部，其顯示上述移動部之移動時間。 [Application Example 15] The electronic component transfer device of this application example is characterized by including a moving section that moves a mounting member capable of placing electronic components, and a moving time display section that displays the moving time of the moving section.

藉此，電子零件搬送裝置之操作員等作業人員能夠視認到移動時間顯示部所顯示之移動時間，因此，能夠確認是否為了獲得利用該裝置之所需之處理量而是否恰好地設定了移動時間，即，移動部是否準確地動作。 Thereby, an operator such as an operator of the electronic component transporting device can visually recognize the moving time displayed on the moving time display section. Therefore, it is possible to confirm whether or not the moving time has been set properly in order to obtain a processing amount required to use the device , That is, whether the moving part is operating accurately.

[應用例16]於上述應用例之電子零件搬送裝置中，上述移動時間較佳為上述移動部自動作開始時至動作結束時之時間。 [Application Example 16] In the electronic component conveying device of the above application example, the moving time is preferably a time from when the moving section starts automatically to when the operation ends.

藉此，移動部之移動時間成為足以判斷是否為了獲得利用電子零件搬送裝置之所需之處理量而恰好地進行了設定之時間。 Thereby, the moving time of the moving part becomes a time sufficient to determine whether or not the setting has been made precisely in order to obtain the required processing amount using the electronic component transfer device.

[應用例17]於上述應用例之電子零件搬送裝置中，較佳為，具有能夠變更上述移動時間之移動時間變更部。 [Application Example 17] In the electronic component transporting device of the application example described above, it is preferable to include a moving time changing unit capable of changing the moving time.

藉此，於需要變更移動部之移動時間之情形時，能夠迅速地進行其變更。 Thereby, when it is necessary to change the moving time of the moving part, the change can be made quickly.

[應用例18]於上述應用例之電子零件搬送裝置中，較佳為，上述移動時間變更部能夠藉由旋動操作而進行上述移動時間之變更。 [Application Example 18] In the electronic component transfer device according to the application example described above, it is preferable that the movement time changing unit can change the movement time by a turning operation.

藉此，對移動時間變更部之操作變得簡單，因此，移動時間變更部之操作性即維護性提高，並且能夠準確地操作移動時間變更部。 Thereby, the operation of the moving time changing unit is simplified, and therefore, the operability, that is, the maintainability, of the moving time changing unit is improved, and the moving time changing unit can be accurately operated.

[應用例19]於上述應用例之電子零件搬送裝置中，較佳為，上述移動時間變更部包含將上述移動部之移動速度於特定之範圍內變更而進行上述移動時間之變更之複數個模式，於變更上述移動時間之情形時，選擇上述複數個模式中之任一者。 [Application Example 19] In the electronic component transfer device according to the above application example, it is preferable that the moving time changing section includes a plurality of modes for changing the moving speed of the moving section within a specific range and changing the moving time. When changing the movement time, select any one of the multiple modes.

藉此，能夠儘可能細微地進行移動時間之變更，即，能夠進行微變更，因此，能夠準確地進行該移動時間之變更。 Thereby, the movement time can be changed as finely as possible, that is, the change can be performed minutely, and therefore, the movement time can be changed accurately.

[應用例20]於上述應用例之電子零件搬送裝置中，較佳為，上述移動時間變更部包含將上述移動部之移動速度於至少2種特定之範圍內變更，而進行上述移動時間之變更之低速模式用移動時間變更部及高速模式用移動時間變更部，於變更上述移動時間之情形時，選擇上述低速模式用移動時間變更部與上述高速模式用移動時間變更部中之至少一者。 [Application Example 20] In the electronic component conveying device of the above application example, it is preferable that the moving time changing section includes changing the moving speed of the moving section within at least two specific ranges and changing the moving time. When changing the moving time, the low-speed mode moving time changing section and the high-speed mode moving time changing section select at least one of the low-speed mode moving time changing section and the high-speed mode moving time changing section.

藉此，能夠儘可能細微地進行移動時間之變更，因此，能夠準確地進行該移動時間之變更。 Thereby, since the movement time can be changed as finely as possible, the movement time can be changed accurately.

[應用例21]於上述應用例之電子零件搬送裝置中，較佳為，上述移動部於動作開始至動作結束之期間，以利用上述高速模式用移動時間變更部變更後之移動時間移動，繼而，以利用上述低速模式用移動時間變更部變更後之移動時間移動。 [Application Example 21] In the electronic component transfer device of the above application example, it is preferable that the moving section moves between the start of the operation and the end of the operation using the moving time changed by the moving time changing section in the high-speed mode, and To move using the moving time changed by the moving time changing section in the low speed mode.

藉此，移動部能夠於動作結束時儘可能低速地停止，因此，能夠防止於動作結束時因例如碰撞或慣性而使電子零件飛出。 Thereby, the moving part can be stopped as low as possible at the end of the operation. Therefore, it is possible to prevent the electronic parts from flying out due to, for example, collision or inertia at the end of the operation.

[應用例22]於上述應用例之電子零件搬送裝置中，較佳為，具有抵接於上述動作結束時之上述移動部之抵接部。 [Application Example 22] In the electronic component transporting device of the application example described above, it is preferable to include a contact portion that abuts the moving portion at the end of the operation.

藉此，完成電子零件之定位，其後，例如能夠利用與移動部分開設置之固持部固持該電子零件。 Thereby, positioning of the electronic component is completed, and thereafter, the electronic component can be held by, for example, a holding portion provided separately from the moving portion.

[應用例23]本應用例之電子零件檢查裝置之特徵在於具有：移動部，其載置電子零件而移動；移動時間顯示部，其顯示上述移動部之移動時間；及檢查部，其檢查上述電子零件。 [Application Example 23] The electronic component inspection device of this application example is characterized by having: a moving section that moves while placing electronic parts; a moving time display section that displays the moving time of the moving section; and an inspection section that checks the above Electronic parts.

藉此，電子零件檢查裝置之操作員等作業人員能夠視認到移動時間顯示部所顯示之移動時間，因此，能夠確認是否為了獲得利用該裝置之所需之處理量而恰好地設定了移動時間，即，移動部是否準確地動作。 Thereby, an operator such as an operator of the electronic component inspection device can visually recognize the moving time displayed on the moving time display section, and thus can confirm whether the moving time is properly set in order to obtain a processing amount required to use the device. That is, whether the moving part is operating accurately.

1‧‧‧檢查裝置 1‧‧‧Inspection device

10‧‧‧電子零件搬送裝置 10‧‧‧Electronic parts transfer device

11A‧‧‧托盤搬送機構 11A‧‧‧Tray transfer mechanism

11B‧‧‧托盤搬送機構 11B‧‧‧Tray transfer mechanism

12‧‧‧溫度調整部 12‧‧‧Temperature Adjustment Department

12a‧‧‧擋板 12a‧‧‧ bezel

13‧‧‧供給機械手 13‧‧‧ supply robot

14‧‧‧器件供給部 14‧‧‧Device Supply Department

14a‧‧‧擋板 14a‧‧‧ Bezel

15‧‧‧供給空托盤搬送機構 15‧‧‧Supply empty pallet transfer mechanism

16‧‧‧檢查部 16‧‧‧ Inspection Department

17‧‧‧測定機械手 17‧‧‧Measurement robot

17a‧‧‧臂 17a‧‧‧arm

17b‧‧‧臂 17b‧‧‧arm

18‧‧‧器件回收部 18‧‧‧Device Recycling Department

19‧‧‧回收用托盤 19‧‧‧Recycling tray

20‧‧‧回收機械手 20‧‧‧Recycling robot

21‧‧‧回收空托盤搬送機構 21‧‧‧Recycling empty pallet transfer mechanism

22A‧‧‧托盤搬送機構 22A‧‧‧Tray transfer mechanism

22B‧‧‧托盤搬送機構 22B‧‧‧Tray transfer mechanism

30‧‧‧控制裝置 30‧‧‧Control device

31‧‧‧控制部 31‧‧‧Control Department

32‧‧‧記憶部 32‧‧‧Memory Department

40‧‧‧顯示裝置 40‧‧‧ display device

41‧‧‧監視器 41‧‧‧Monitor

50‧‧‧操作裝置 50‧‧‧ Operating device

51‧‧‧滑鼠 51‧‧‧Mouse

60‧‧‧設定顯示部 60‧‧‧ Setting display section

90‧‧‧IC器件 90‧‧‧IC device

101‧‧‧主畫面 101‧‧‧ main screen

102‧‧‧圖標群 102‧‧‧icon group

103‧‧‧圖標 103‧‧‧ icon

104‧‧‧子視窗 104‧‧‧Sub-window

105‧‧‧按鈕 105‧‧‧ button

106‧‧‧視窗 106‧‧‧window

107‧‧‧按鈕群 107‧‧‧ Button Group

108‧‧‧按鈕 108‧‧‧ button

109‧‧‧指示燈 109‧‧‧ indicator

109a‧‧‧指示燈群 109a‧‧‧light group

109b‧‧‧指示燈群 109b‧‧‧ Indicator Group

110‧‧‧按鈕 110‧‧‧ button

110a‧‧‧按鈕群 110a‧‧‧ button group

110b‧‧‧按鈕群 110b‧‧‧ button group

111‧‧‧按鈕 111‧‧‧ button

111a‧‧‧按鈕群 111a‧‧‧ Button Group

111b‧‧‧按鈕群 111b‧‧‧ Button Group

112‧‧‧視窗 112‧‧‧window

113‧‧‧指示燈群 113‧‧‧light group

114‧‧‧指示燈群 114‧‧‧light group

115‧‧‧指示燈群 115‧‧‧ indicator group

115a‧‧‧指示燈 115a‧‧‧ Indicator

115b‧‧‧指示燈 115b‧‧‧ Indicator

115c‧‧‧指示燈 115c‧‧‧ Indicator

115d‧‧‧指示燈 115d‧‧‧ Indicator

116‧‧‧按鈕 116‧‧‧ button

117‧‧‧按鈕 117‧‧‧ button

118‧‧‧視窗 118‧‧‧window

119‧‧‧示意圖 119‧‧‧Schematic

120‧‧‧指示燈群 120‧‧‧ indicator group

120a‧‧‧指示燈 120a‧‧‧ Indicator

120b‧‧‧指示燈 120b‧‧‧ Indicator

120c‧‧‧指示燈 120c‧‧‧ Indicator

120d‧‧‧指示燈 120d‧‧‧Indicator

120e‧‧‧指示燈 120e‧‧‧ indicator

121‧‧‧按鈕群 121‧‧‧ Button Group

121a‧‧‧按鈕 121a‧‧‧ button

121b‧‧‧按鈕 121b‧‧‧ button

121c‧‧‧按鈕 121c‧‧‧ button

121d‧‧‧按鈕 121d‧‧‧ button

122‧‧‧示意圖 122‧‧‧ Schematic

123‧‧‧指示燈群 123‧‧‧light group

123a‧‧‧指示燈 123a‧‧‧ Indicator

123b‧‧‧指示燈 123b‧‧‧ Indicator

123c‧‧‧指示燈 123c‧‧‧ Indicator

123d‧‧‧指示燈 123d‧‧‧ Indicator

123e‧‧‧指示燈 123e‧‧‧ Indicator

124‧‧‧按鈕群 124‧‧‧ Button Group

124a‧‧‧按鈕 124a‧‧‧ button

124b‧‧‧按鈕 124b‧‧‧ button

124c‧‧‧按鈕 124c‧‧‧ button

125‧‧‧視窗 125‧‧‧ windows

126‧‧‧示意圖 126‧‧‧Schematic

127‧‧‧指示燈群 127‧‧‧ Indicator Group

127a‧‧‧指示燈 127a‧‧‧ indicator

127b‧‧‧指示燈 127b‧‧‧ Indicator

127c‧‧‧指示燈 127c‧‧‧ Indicator

127d‧‧‧指示燈 127d‧‧‧ Indicator

127e‧‧‧指示燈 127e‧‧‧ indicator

127f‧‧‧指示燈 127f‧‧‧ indicator

128‧‧‧按鈕群 128‧‧‧ Button Group

128a‧‧‧按鈕 128a‧‧‧ button

128b‧‧‧按鈕 128b‧‧‧ button

128c‧‧‧按鈕 128c‧‧‧ button

128d‧‧‧按鈕 128d‧‧‧ button

129‧‧‧示意圖 129‧‧‧Schematic

130‧‧‧指示燈群 130‧‧‧ Indicator Group

130a‧‧‧指示燈 130a‧‧‧ Indicator

130b‧‧‧指示燈 130b‧‧‧ indicator

130c‧‧‧指示燈 130c‧‧‧ Indicator

131‧‧‧按鈕 131‧‧‧ button

132‧‧‧視窗 132‧‧‧window

133‧‧‧示意圖 133‧‧‧Schematic

134‧‧‧指示燈群 134‧‧‧light group

134a‧‧‧指示燈 134a‧‧‧ Indicator

134b‧‧‧指示燈 134b‧‧‧ Indicator

134c‧‧‧指示燈 134c‧‧‧ Indicator

134d‧‧‧指示燈 134d‧‧‧ Indicator

134e‧‧‧指示燈 134e‧‧‧ Indicator

134f‧‧‧指示燈 134f‧‧‧ Indicator

135‧‧‧按鈕群 135‧‧‧ Button Group

135a‧‧‧按鈕 135a‧‧‧ button

135b‧‧‧按鈕 135b‧‧‧ button

135c‧‧‧按鈕 135c‧‧‧ button

135d‧‧‧按鈕 135d‧‧‧ button

135e‧‧‧按鈕 135e‧‧‧ button

136‧‧‧示意圖 136‧‧‧Schematic

137‧‧‧指示燈群 137‧‧‧ Indicator Group

137a‧‧‧指示燈 137a‧‧‧ Indicator

137b‧‧‧指示燈 137b‧‧‧ Indicator

137c‧‧‧指示燈 137c‧‧‧Indicator

137d‧‧‧指示燈 137d‧‧‧ Indicator

137e‧‧‧指示燈 137e‧‧‧ Indicator

137f‧‧‧指示燈 137f‧‧‧ Indicator

138‧‧‧按鈕群 138‧‧‧ Button Group

138a‧‧‧按鈕 138a‧‧‧ button

138b‧‧‧按鈕 138b‧‧‧ button

138c‧‧‧按鈕 138c‧‧‧ button

139‧‧‧視窗 139‧‧‧window

140‧‧‧指示燈群 140‧‧‧ Indicator Group

140a‧‧‧指示燈 140a‧‧‧ Indicator

140b‧‧‧指示燈 140b‧‧‧ Indicator

140c‧‧‧指示燈 140c‧‧‧ Indicator

140d‧‧‧指示燈 140d‧‧‧ Indicator

140e‧‧‧指示燈 140e‧‧‧ Indicator

141‧‧‧視窗 141‧‧‧window

142‧‧‧指示燈群 142‧‧‧light group

142a‧‧‧指示燈 142a‧‧‧ Indicator

142b‧‧‧指示燈 142b‧‧‧ Indicator

142c‧‧‧指示燈 142c‧‧‧Indicator

142d‧‧‧指示燈 142d‧‧‧ Indicator

142e‧‧‧指示燈 142e‧‧‧ Indicator

142f‧‧‧指示燈 142f‧‧‧ Indicator

142g‧‧‧指示燈 142g‧‧‧ Indicator

142h‧‧‧指示燈 142h‧‧‧ Indicator

142i‧‧‧指示燈 142i‧‧‧ Indicator

142j‧‧‧指示燈 142j‧‧‧ indicator

142k‧‧‧指示燈 142k‧‧‧ Indicator

142L‧‧‧指示燈 142L‧‧‧ Indicator

143‧‧‧按鈕群 143‧‧‧ Button Group

143a‧‧‧按鈕 143a‧‧‧ button

143b‧‧‧按鈕 143b‧‧‧ button

143c‧‧‧按鈕 143c‧‧‧ button

143d‧‧‧按鈕 143d‧‧‧ button

143e‧‧‧按鈕 143e‧‧‧ button

143f‧‧‧按鈕 143f‧‧‧ button

143g‧‧‧按鈕 143g‧‧‧ button

143h‧‧‧按鈕 143h‧‧‧ button

143i‧‧‧按鈕 143i‧‧‧ button

143j‧‧‧按鈕 143j‧‧‧ button

170‧‧‧吸附噴嘴 170‧‧‧ adsorption nozzle

171‧‧‧吸附感測器 171‧‧‧ Adsorption sensor

200‧‧‧托盤 200‧‧‧tray

201‧‧‧光感測器 201‧‧‧light sensor

202‧‧‧光感測器 202‧‧‧light sensor

203‧‧‧固定構件 203‧‧‧Fixed components

204‧‧‧擋板 204‧‧‧ bezel

205‧‧‧光感測器 205‧‧‧light sensor

206‧‧‧升降機構 206‧‧‧Lifting mechanism

207‧‧‧光感測器 207‧‧‧light sensor

208‧‧‧固定構件 208‧‧‧Fixed components

209‧‧‧擋板 209‧‧‧ bezel

210‧‧‧光感測器 210‧‧‧light sensor

211‧‧‧光感測器 211‧‧‧light sensor

212‧‧‧光感測器 212‧‧‧light sensor

213‧‧‧升降機構 213‧‧‧Lifting mechanism

214‧‧‧光感測器 214‧‧‧light sensor

215‧‧‧光感測器 215‧‧‧light sensor

216‧‧‧固定構件 216‧‧‧Fixed components

217‧‧‧擋板 217‧‧‧ Bezel

218‧‧‧光感測器 218‧‧‧light sensor

219‧‧‧光感測器 219‧‧‧light sensor

220‧‧‧光感測器 220‧‧‧light sensor

221‧‧‧光感測器 221‧‧‧light sensor

222‧‧‧升降機構 222‧‧‧Lifting mechanism

223‧‧‧分離爪 223‧‧‧Separation claw

224‧‧‧分離爪 224‧‧‧Separation claw

311‧‧‧驅動控制部 311‧‧‧Drive Control Department

312‧‧‧檢查控制部 312‧‧‧ Inspection Control Department

1000‧‧‧檢查裝置 1000‧‧‧ Inspection device

1003‧‧‧維護表單 1003‧‧‧Maintenance Form

1004‧‧‧選單表單 1004‧‧‧Menu Form

1005‧‧‧面板 1005‧‧‧ panel

1011A‧‧‧托盤搬送機構 1011A‧‧‧Tray transfer mechanism

1011B‧‧‧托盤搬送機構 1011B‧‧‧Tray transfer mechanism

1012‧‧‧溫度調整部 1012‧‧‧Temperature Adjustment Department

1013‧‧‧器件搬送頭 1013‧‧‧device transfer head

1014‧‧‧器件供給部 1014‧‧‧Device Supply Department

1015‧‧‧托盤搬送機構 1015‧‧‧Tray transfer mechanism

1016‧‧‧檢查部 1016‧‧‧ Inspection Department

1017‧‧‧器件搬送頭 1017‧‧‧device transfer head

1018‧‧‧器件回收部 1018‧‧‧Device Recycling Department

1019‧‧‧回收用托盤 1019‧‧‧Recycling tray

1020‧‧‧器件搬送頭 1020‧‧‧device transfer head

1021‧‧‧托盤搬送機構 1021‧‧‧Tray transfer mechanism

1022A‧‧‧托盤搬送機構 1022A‧‧‧Tray transfer mechanism

1022B‧‧‧托盤搬送機構 1022B‧‧‧Tray transfer mechanism

1031‧‧‧器件供給部．回收部用選單群 1031‧‧‧Device Supply Department. Menu group for recycling department

1032‧‧‧托盤供給．去除用選單群 1032‧‧‧Tray supply. Remove menu group

1033‧‧‧空托盤搬送用選單群 1033‧‧‧ empty pallet transfer menu group

1034‧‧‧托盤搬送用選單群 1034‧‧‧Tray Transfer Menu Group

1035‧‧‧移動時間顯示欄 1035‧‧‧ Move time display bar

1041‧‧‧第1選單群 1041‧‧‧The first menu group

1042‧‧‧第2選單群 1042‧‧‧The second menu group

1043‧‧‧第3選單群 1043‧‧‧3rd menu group

1044‧‧‧軟體名顯示欄 1044‧‧‧ Software name display

1045‧‧‧檔案名顯示欄 1045‧‧‧File name display

1046‧‧‧檢查部狀態顯示表 1046‧‧‧Inspection Department Status Display Form

1051‧‧‧變更用柄 1051‧‧‧ Change handle

1052‧‧‧變更用柄 1052‧‧‧ Change handle

1053‧‧‧變更用柄 1053‧‧‧ Change handle

1054‧‧‧變更用柄 1054‧‧‧ Change handle

1055‧‧‧變更用柄 1055‧‧‧ Change handle

1056‧‧‧變更用柄 1056‧‧‧ Change handle

1061‧‧‧第1間隔壁 1061‧‧‧The first partition

1062‧‧‧第2間隔壁 1062‧‧‧Second partition

1063‧‧‧第3間隔壁 1063‧‧‧ 3rd partition

1064‧‧‧第4間隔壁 1064‧‧‧ 4th partition

1065‧‧‧第5間隔壁 1065‧‧‧The fifth partition

1066‧‧‧內側間隔壁 1066‧‧‧ inside partition

1070‧‧‧前外殼 1070‧‧‧Front housing

1071‧‧‧側外殼 1071‧‧‧side shell

1072‧‧‧側外殼 1072‧‧‧side shell

1073‧‧‧後外殼 1073‧‧‧Rear shell

1074‧‧‧頂部外殼 1074‧‧‧Top case

1080‧‧‧控制部 1080‧‧‧ Control Department

1111‧‧‧主動輪 1111‧‧‧Driver

1112‧‧‧從動輪 1112‧‧‧ Follower

1113‧‧‧傳送帶 1113‧‧‧Conveyor

1114‧‧‧擋塊 1114‧‧‧ Stop

1115‧‧‧馬達 1115‧‧‧ Motor

1116‧‧‧第1感測器 1116‧‧‧1st sensor

1116a‧‧‧發光部 1116a‧‧‧Lighting Department

1116b‧‧‧受光部 1116b‧‧‧Light receiving section

1117‧‧‧第2感測器 1117‧‧‧Second sensor

1117a‧‧‧發光部 1117a‧‧‧Lighting Department

1117b‧‧‧受光部 1117b‧‧‧Light receiving section

1300‧‧‧監視器 1300‧‧‧Monitor

1301‧‧‧顯示畫面 1301‧‧‧display

1311‧‧‧按鈕 1311‧‧‧ button

1312‧‧‧按鈕 1312‧‧‧ button

1313‧‧‧按鈕 1313‧‧‧ button

1314‧‧‧按鈕 1314‧‧‧ button

1315‧‧‧按鈕 1315‧‧‧ button

1316‧‧‧按鈕 1316‧‧‧ button

1321‧‧‧按鈕 1321‧‧‧ button

1322‧‧‧按鈕 1322‧‧‧ button

1323‧‧‧按鈕 1323‧‧‧ button

1331‧‧‧按鈕 1331‧‧‧ button

1332‧‧‧按鈕 1332‧‧‧ button

1341a‧‧‧按鈕 1341a‧‧‧ button

1341b‧‧‧按鈕 1341b‧‧‧ button

1342a‧‧‧按鈕 1342a‧‧‧ button

1342b‧‧‧按鈕 1342b‧‧‧ button

1343a‧‧‧按鈕 1343a‧‧‧ button

1343b‧‧‧按鈕 1343b‧‧‧ button

1344a‧‧‧按鈕 1344a‧‧‧ button

1344b‧‧‧按鈕 1344b‧‧‧ button

1345a‧‧‧按鈕 1345a‧‧‧ button

1345b‧‧‧按鈕 1345b‧‧‧ button

1346a‧‧‧按鈕 1346a‧‧‧ button

1346b‧‧‧按鈕 1346b‧‧‧ button

1400‧‧‧信號燈 1400‧‧‧Signal Light

1411‧‧‧按鈕 1411‧‧‧ button

1412‧‧‧按鈕 1412‧‧‧ button

1413‧‧‧按鈕 1413‧‧‧ button

1414‧‧‧按鈕 1414‧‧‧ button

1415‧‧‧按鈕 1415‧‧‧ button

1416‧‧‧按鈕 1416‧‧‧ button

1431‧‧‧設定部 1431‧‧‧Setting Department

1432‧‧‧設定部 1432‧‧‧Setting Department

1433‧‧‧設定部 1433‧‧‧Setting Department

1434‧‧‧設定部 1434‧‧‧Setting Department

1435‧‧‧設定部 1435‧‧‧Setting Department

1436‧‧‧設定部 1436‧‧‧Setting Department

1500‧‧‧揚聲器 1500‧‧‧Speaker

1511‧‧‧低速用柄 1511‧‧‧Low Speed Handle

1512‧‧‧高速用柄 1512‧‧‧High-speed handle

1513‧‧‧標記 1513‧‧‧Mark

1521‧‧‧低速用柄 1521‧‧‧Low Speed Handle

1522‧‧‧高速用柄 1522‧‧‧High Speed Handle

1531‧‧‧低速用柄 1531‧‧‧Low-speed handle

1532‧‧‧高速用柄 1532‧‧‧High-speed handle

1541‧‧‧低速用柄 1541‧‧‧Low Speed Handle

1542‧‧‧高速用柄 1542‧‧‧High-speed handle

1551‧‧‧低速用柄 1551‧‧‧Low Speed Handle

1552‧‧‧高速用柄 1552‧‧‧High-speed handle

1561‧‧‧低速用柄 1561‧‧‧Low-speed handle

1562‧‧‧高速用柄 1562‧‧‧High-speed handle

1600‧‧‧滑鼠台 1600‧‧‧Mouse Station

1701‧‧‧門 1701‧‧‧ Gate

4201‧‧‧按鈕 4201‧‧‧ button

4202‧‧‧按鈕 4202‧‧‧ button

4203‧‧‧按鈕 4203‧‧‧ button

4204‧‧‧按鈕 4204‧‧‧ button

4205‧‧‧按鈕 4205‧‧‧ button

4206‧‧‧按鈕 4206‧‧‧ button

4207‧‧‧按鈕 4207‧‧‧ button

4208‧‧‧按鈕 4208‧‧‧ button

4209‧‧‧按鈕 4209‧‧‧ button

4210‧‧‧按鈕 4210‧‧‧ button

4211‧‧‧按鈕 4211‧‧‧ button

4212‧‧‧按鈕 4212‧‧‧ button

A1‧‧‧托盤供給區域 A1‧‧‧Tray supply area

A2‧‧‧器件供給區域 A2‧‧‧Device supply area

A3‧‧‧檢查區域 A3‧‧‧ Inspection area

A4‧‧‧器件回收區域 A4‧‧‧device recycling area

A5‧‧‧托盤去除區域 A5‧‧‧Tray removal area

AC‧‧‧交流電源 AC‧‧‧AC Power

B1‧‧‧托盤供給區域 B1‧‧‧Tray supply area

B2‧‧‧器件供給區域 B2‧‧‧Device supply area

B3‧‧‧檢查區域 B3‧‧‧ Inspection area

B4‧‧‧器件回收區域 B4‧‧‧device recycling area

B5‧‧‧托盤去除區域 B5‧‧‧Tray removal area

L116‧‧‧光 L116‧‧‧Light

L117‧‧‧光 L117‧‧‧Light

R11A‧‧‧判定結果 R 11A ‧‧‧ Judgment result

SW511‧‧‧開關 SW 511 ‧‧‧ Switch

SW512‧‧‧開關 SW 512 ‧‧‧ Switch

t0‧‧‧閾值 t 0 ‧‧‧ threshold

t11A‧‧‧移動時間 t 11A ‧‧‧moving time

VR511‧‧‧可變電阻 VR 511 ‧‧‧Variable resistor

VR512‧‧‧可變電阻 VR 512 ‧‧‧Variable resistor

圖1係表示本發明之第1實施形態之電子零件檢查裝置之概略立體圖。 FIG. 1 is a schematic perspective view showing an electronic component inspection apparatus according to a first embodiment of the present invention.

圖2係圖1所示之檢查裝置(電子零件檢查裝置)之概略俯視圖。 FIG. 2 is a schematic plan view of the inspection device (electronic component inspection device) shown in FIG. 1. FIG.

圖3係表示圖1所示之檢查裝置之一部分之方塊圖。 FIG. 3 is a block diagram showing a part of the inspection apparatus shown in FIG. 1. FIG.

圖4係表示顯示於圖1所示之監視器之視窗之圖。 FIG. 4 is a diagram showing a window displayed on the monitor shown in FIG. 1. FIG.

圖5係表示顯示於圖1所示之監視器之視窗之圖。 FIG. 5 is a diagram showing a window displayed on the monitor shown in FIG. 1. FIG.

圖6係表示顯示於圖1所示之監視器之視窗之圖。 FIG. 6 is a diagram showing a window displayed on the monitor shown in FIG. 1. FIG.

圖7係表示顯示於圖1所示之監視器之視窗之圖。 FIG. 7 is a diagram showing a window displayed on the monitor shown in FIG. 1. FIG.

圖8係表示顯示於圖1所示之監視器之視窗之圖。 FIG. 8 is a diagram showing a window displayed on the monitor shown in FIG. 1. FIG.

圖9係表示顯示於圖1所示之監視器之視窗之圖。 FIG. 9 is a diagram showing a window displayed on the monitor shown in FIG. 1. FIG.

圖10係表示顯示於圖1所示之監視器之視窗之圖。 FIG. 10 is a diagram showing a window displayed on the monitor shown in FIG. 1. FIG.

圖11係表示顯示於圖1所示之監視器之視窗之圖。 FIG. 11 is a diagram showing a window displayed on the monitor shown in FIG. 1. FIG.

圖12係自正面側觀察本發明之第2實施形態之電子零件檢查裝置之概略立體圖。 Fig. 12 is a schematic perspective view of an electronic component inspection apparatus according to a second embodiment of the present invention, as viewed from the front side.

圖13係圖12所示之電子零件檢查裝置之概略俯視圖。 FIG. 13 is a schematic plan view of the electronic component inspection device shown in FIG. 12.

圖14A係表示藉由圖13所示之電子零件檢查裝置所具備之托盤搬送機構而搬送之托盤之狀態之俯視圖。 FIG. 14A is a plan view showing a state of a pallet transported by a pallet transport mechanism provided in the electronic component inspection apparatus illustrated in FIG. 13.

圖14B係表示藉由圖13所示之電子零件檢查裝置所具備之托盤搬送機構而搬送之托盤之狀態之側視圖。 FIG. 14B is a side view showing a state of a tray conveyed by a tray conveyance mechanism provided in the electronic component inspection apparatus shown in FIG. 13.

圖15係顯示於圖12所示之電子零件檢查裝置所具備之監視器之表單。 FIG. 15 is a table showing a monitor included in the electronic component inspection apparatus shown in FIG. 12.

圖16係顯示於圖12所示之電子零件檢查裝置所具備之監視器之表單。 FIG. 16 shows a form of a monitor included in the electronic component inspection apparatus shown in FIG. 12.

圖17係顯示於圖12所示之電子零件檢查裝置所具備之監視器之表單。 FIG. 17 is a table showing a monitor included in the electronic component inspection apparatus shown in FIG. 12.

圖18係顯示於圖12所示之電子零件檢查裝置所具備之監視器之表單。 FIG. 18 shows a form of a monitor included in the electronic component inspection apparatus shown in FIG. 12.

圖19係表示圖12所示之電子零件檢查裝置所具備之移動時間變更部之構成之一例之前視圖。 FIG. 19 is a front view showing an example of a configuration of a moving time changing section provided in the electronic component inspection device shown in FIG. 12.

圖20係圖19所示之移動時間變更部之放大圖。 FIG. 20 is an enlarged view of a moving time changing section shown in FIG. 19.

圖21係包含圖19所示之移動時間變更部之電路圖。 FIG. 21 is a circuit diagram including a moving time changing section shown in FIG. 19.

圖22係表示藉由圖14A及圖14B所示之托盤搬送機構而搬送之托盤之搬送速度之經時性變化之曲線圖。 FIG. 22 is a graph showing a change with time of a transfer speed of a tray transferred by the tray transfer mechanism shown in FIGS. 14A and 14B.

以下，參照隨附圖式，對本發明之實施形態之電子零件搬送裝置及電子零件檢查裝置進行詳細說明。 Hereinafter, the electronic component transfer device and the electronic component inspection device according to the embodiments of the present invention will be described in detail with reference to the accompanying drawings.

再者，於以下之實施形態中，為便於說明，於在圖中表示有相互正交之3軸之情形時，將相互正交之3軸設為X軸、Y軸及Z軸。又， 包含X軸及Y軸之XY平面成為水平，Z軸成為鉛垂。又，將平行於X軸之方向亦稱為「X方向」，將平行於Y軸之方向亦稱為「Y方向」，將平行於Z軸之方向亦稱為「Z方向」。又，將X軸、Y軸及Z軸之各軸之箭頭之方向稱為正(+)側，將與箭頭相反之方向稱為負(-)側。又，將電子零件之搬送方向之上游側亦簡稱為「上游側」，將下游側亦簡稱為「下游側」。又，本案說明書中所謂之「水平」並不限於完全水平，只要不妨礙電子零件之搬送，亦包含相對於水平略微(例如未達5°之程度)傾斜之狀態。 In addition, in the following embodiments, for convenience of explanation, when three axes orthogonal to each other are shown in the figure, the three axes orthogonal to each other are set to the X axis, the Y axis, and the Z axis. also, The XY plane including the X axis and the Y axis becomes horizontal, and the Z axis becomes vertical. Further, a direction parallel to the X axis is also referred to as "X direction", a direction parallel to the Y axis is also referred to as "Y direction", and a direction parallel to the Z axis is also referred to as "Z direction". The directions of the arrows of the X-axis, Y-axis, and Z-axis are referred to as positive (+) side, and the directions opposite to the arrows are referred to as negative (-) side. The upstream side in the direction of transport of electronic components is also simply referred to as the "upstream side", and the downstream side is also simply referred to as the "downstream side". In addition, the so-called "horizontal" in the description of this case is not limited to a complete level, as long as it does not hinder the transportation of electronic parts, it also includes a state that is slightly inclined (for example, less than 5 °) from the level.

又，以下之實施形態所示之檢查裝置(電子零件檢查裝置)例如係用以對BGA(Ball grid array，球狀柵格陣列)封裝體或LGA(Land grid array，焊盤柵格陣列)封裝體等IC器件、LCD(Liquid Crystal Display，液晶顯示裝置)、CIS(CMOS(Complementary Metal Oxide Semiconductor，互補金屬氧化物半導體)Image Sensor，CMOS影像感測器)等電子零件之電氣特性進行檢查、試驗(以下簡稱為「檢查」)之裝置。再者，以下，為便於說明，以使用IC器件作為進行檢查之上述電子零件之情形為代表進行說明，且將其作為「IC器件90」。 In addition, the inspection device (electronic component inspection device) shown in the following embodiments is used for, for example, packaging a BGA (Ball grid array) package or a LGA (Land grid array) package. Check and test the electrical characteristics of electronic components such as IC devices, LCD (Liquid Crystal Display, liquid crystal display), CIS (Complementary Metal Oxide Semiconductor), and Image Sensor (CMOS image sensor) (Hereinafter referred to as "inspection"). In the following, for convenience of explanation, a case where an IC device is used as the above-mentioned electronic component for inspection will be described as a representative, and this will be referred to as "IC device 90".

(第1實施形態) (First Embodiment)

圖1係表示本發明之第1實施形態之電子零件檢查裝置之概略立體圖。圖2係圖1所示之檢查裝置(電子零件檢查裝置)之概略俯視圖。圖3係表示圖1所示之檢查裝置之一部分之方塊圖。圖4~圖11係表示顯示於圖1所示之監視器之視窗之圖。 FIG. 1 is a schematic perspective view showing an electronic component inspection apparatus according to a first embodiment of the present invention. FIG. 2 is a schematic plan view of the inspection device (electronic component inspection device) shown in FIG. 1. FIG. FIG. 3 is a block diagram showing a part of the inspection apparatus shown in FIG. 1. FIG. 4 to 11 are views showing windows of the monitor shown in FIG. 1.

如圖1及圖2所示，檢查裝置1具備：電子零件搬送裝置10，其搬送IC器件90；檢查部16；及設定顯示部(顯示部)60，其具有顯示裝置40及操作裝置50。再者，於本實施形態中，電子零件搬送裝置10由除檢查部16及下述控制裝置30所具有之檢查控制部312以外之構成而構成。 As shown in FIGS. 1 and 2, the inspection device 1 includes an electronic component transfer device 10 that transfers an IC device 90, an inspection portion 16, and a setting display portion (display portion) 60 that includes a display device 40 and an operation device 50. In addition, in this embodiment, the electronic component transfer apparatus 10 is comprised by the structure other than the inspection part 16 and the inspection control part 312 which the control device 30 mentioned later has.

又，如圖1及圖2所示，檢查裝置1分為托盤供給區域A1、器件供給區域(電子零件供給區域)A2、設置有檢查部16之檢查區域(檢查部配置區域)A3、器件回收區域(電子零件回收區域)A4、及托盤去除區域A5。於該檢查裝置1中，IC器件90依序經由托盤供給區域A1至托盤去除區域A5之各區域，於中途之檢查區域A3進行檢查。再者，檢查裝置1係以能夠於常溫環境下、低溫環境下、及高溫環境下進行檢查之方式而構成。 As shown in FIG. 1 and FIG. 2, the inspection device 1 is divided into a tray supply area A1, a device supply area (electronic parts supply area) A2, an inspection area (inspection unit arrangement area) A3 in which the inspection section 16 is provided, and a device recovery Area (electronic parts collection area) A4, and tray removal area A5. In this inspection device 1, the IC device 90 performs inspections in the inspection area A3 in the middle through the areas from the tray supply area A1 to the tray removal area A5 in order. The inspection device 1 is configured to be capable of performing inspections in a normal temperature environment, a low temperature environment, and a high temperature environment.

托盤供給區域A1係供給排列著未檢查狀態之複數個IC器件90之托盤200之區域。於托盤供給區域A1中，可堆積多個托盤200。 The tray supply area A1 is an area for supplying the trays 200 in which a plurality of IC devices 90 are arranged in an unchecked state. A plurality of trays 200 can be stacked in the tray supply area A1.

器件供給區域A2係將來自托盤供給區域A1之托盤200上之複數個IC器件90分別供給至檢查區域A3之區域。再者，以跨及托盤供給區域A1與器件供給區域A2之方式，設置有搬送托盤200之托盤搬送機構(搬送部)11A、11B。 The device supply area A2 is an area where a plurality of IC devices 90 on the tray 200 from the tray supply area A1 are supplied to the inspection area A3, respectively. In addition, tray transfer mechanisms (transfer units) 11A and 11B for transferring the tray 200 are provided so as to span the tray supply area A1 and the device supply area A2.

於器件供給區域A2設置有溫度調整部(浸泡板(soak plate))12、供給機械手(器件搬送頭)13、及供給空托盤搬送機構15。 A temperature adjustment unit (soak plate) 12, a supply robot (device transfer head) 13, and a supply empty tray transfer mechanism 15 are provided in the device supply area A2.

溫度調整部12係配置IC器件90，加熱或冷卻所配置之IC器件90，而將該IC器件90調整(控制)至適合檢查之溫度的裝置。於圖2所示之構成中，沿Y方向配置、固定有2個溫度調整部12。而且，藉由托盤搬送機構11A自托盤供給區域A1搬入之托盤200上之IC器件90被搬送、載置於任一溫度調整部12。 The temperature adjustment section 12 is a device that arranges the IC device 90 and heats or cools the placed IC device 90 to adjust (control) the IC device 90 to a temperature suitable for inspection. In the configuration shown in FIG. 2, two temperature adjustment sections 12 are arranged and fixed along the Y direction. Further, the IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray transfer mechanism 11A is transferred and placed on any one of the temperature adjustment sections 12.

再者，雖然未圖示，但於溫度調整部12設置有檢測溫度調整部12中之IC器件90之溫度之溫度檢測部。該溫度檢測部與控制裝置30電性連接，將所檢測出之溫度之資訊發送至控制裝置30。 In addition, although not shown, a temperature detection unit that detects the temperature of the IC device 90 in the temperature adjustment unit 12 is provided in the temperature adjustment unit 12. The temperature detection unit is electrically connected to the control device 30 and sends information on the detected temperature to the control device 30.

又，於溫度調整部12，並排形成有8列2行之供配置IC器件90之凹部。再者，此處，將X方向設為列，將Y方向設為行。即，8個凹部沿Y方向直線狀地配置，進而，8個凹部沿Y方向直線狀地配置於在X 方向上錯開之位置。又，於各凹部之開口部設置有能夠開閉之擋板12a。 Further, in the temperature adjustment section 12, recessed portions for arranging the IC devices 90 in eight rows and two rows are formed side by side. Here, the X direction is set as a column, and the Y direction is set as a row. That is, eight recessed portions are arranged linearly in the Y direction, and further, eight recessed portions are arranged linearly in the Y direction at X Staggered position. In addition, a shutter 12a that can be opened and closed is provided in an opening portion of each recessed portion.

圖2所示之供給機械手13係進行IC器件90之搬送之搬送部，能夠於器件供給區域A2內沿X方向、Y方向、及Z方向移動地受支持。該供給機械手13負責自托盤供給區域A1搬入之托盤200與溫度調整部12之間之IC器件90之搬送、及溫度調整部12與下述器件供給部14之間之IC器件90之搬送。 The supply robot 13 shown in FIG. 2 is a transfer unit that transfers the IC device 90, and is supported to be movable in the X direction, the Y direction, and the Z direction within the device supply area A2. The supply robot 13 is responsible for transferring the IC devices 90 between the tray 200 and the temperature adjustment section 12 carried in from the tray supply area A1, and the IC devices 90 between the temperature adjustment section 12 and the device supply section 14 described below.

供給空托盤搬送機構15係將去除所有IC器件90之狀態下之空的托盤200於X方向上進行搬送之搬送部(搬送機構)。而且，於該搬送後，藉由托盤搬送機構11B使空的托盤200自器件供給區域A2返回至托盤供給區域A1。 The supply empty tray transfer mechanism 15 is a transfer unit (transfer mechanism) that transfers the empty tray 200 in a state where all IC devices 90 are removed in the X direction. After the transfer, the empty tray 200 is returned from the device supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B.

檢查區域A3係檢查IC器件90之區域。於該檢查區域A3設置有器件供給部14、檢查部16、測定機械手(器件搬送頭)17、及器件回收部18。 The inspection area A3 is an area where the IC device 90 is inspected. A device supply unit 14, an inspection unit 16, a measurement robot (device transfer head) 17, and a device recovery unit 18 are provided in the inspection area A3.

器件供給部14係將經溫度調整(溫度控制)之IC器件90搬送至檢查部16附近之搬送部。該器件供給部14能夠沿X方向於器件供給區域A2與檢查區域A3之間移動地受支持。又，於圖2所示之構成中，沿Y方向配置有2個器件供給部14，溫度調整部12上之IC器件90被搬送、載置於任一器件供給部14。再者，該搬送係藉由供給機械手13而進行。又，器件供給部14係以能夠加熱或冷卻IC器件90之方式而構成。又，雖然未圖示，但於器件供給部14設置有檢測器件供給部14中之IC器件90之溫度之溫度檢測部。 The device supply unit 14 is a transfer unit that transfers the temperature-adjusted (temperature-controlled) IC devices 90 to the inspection unit 16. The device supply unit 14 is supported so as to be movable between the device supply region A2 and the inspection region A3 in the X direction. In the configuration shown in FIG. 2, two device supply units 14 are arranged along the Y direction, and the IC devices 90 on the temperature adjustment unit 12 are transported and placed on either of the device supply units 14. The conveyance is performed by the supply robot 13. The device supply unit 14 is configured so that the IC device 90 can be heated or cooled. Although not shown, a temperature detection unit that detects the temperature of the IC device 90 in the device supply unit 14 is provided in the device supply unit 14.

又，於各器件供給部14，並排形成有2列8行之供配置IC器件90之凹部。而且，於各凹部之開口部設置有能夠開閉之擋板14a。 Further, in each of the device supply sections 14, recesses for arranging the IC devices 90 in two rows and eight rows are formed side by side. In addition, a shutter 14a that can be opened and closed is provided in an opening portion of each recessed portion.

檢查部16係對IC器件90之電氣特性進行檢查、試驗之單元，且係於檢查IC器件90之情形時保持該IC器件90之保持部。於檢查部16， 設置有於保持有IC器件90之狀態下與該IC器件90之端子電性連接之複數個探針接腳。而且，IC器件90之端子與探針接腳電性連接(接觸)，經由探針接腳進行IC器件90之檢查。又，檢查部16係以能夠加熱或冷卻IC器件90之方式而構成。又，雖然未圖示，但於檢查部16設置有檢測檢查部16中之IC器件90之溫度之溫度檢測部。 The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90, and is a holding unit that holds the IC device 90 when the IC device 90 is inspected. In the inspection department 16, A plurality of probe pins are provided which are electrically connected to the terminals of the IC device 90 while the IC device 90 is held. In addition, the terminal of the IC device 90 is electrically connected (contacted) with the probe pin, and the inspection of the IC device 90 is performed through the probe pin. The inspection unit 16 is configured to be capable of heating or cooling the IC device 90. Although not shown, a temperature detection unit that detects the temperature of the IC device 90 in the inspection unit 16 is provided in the inspection unit 16.

測定機械手17係進行IC器件90之搬送之搬送部，能夠於檢查區域A3內移動地受支持。該測定機械手17能夠將自器件供給區域A2搬入之器件供給部14上之IC器件90搬送、載置於檢查部16上。 The measurement robot 17 is a transfer unit that transfers the IC device 90, and is supported while being movable within the inspection area A3. The measurement robot 17 can transfer and place the IC device 90 on the device supply unit 14 carried in from the device supply area A2 and place it on the inspection unit 16.

再者，測定機械手17具有一對臂17a、17b。該臂17a、17b分別具有固持IC器件90之複數個固持部(未圖示)。各固持部具備吸附噴嘴170，能夠藉由吸附IC器件90將其固持。又，如圖2所示，各吸附噴嘴170以2列8行之矩陣狀配置於臂17a、17b之各者。進而，於臂17a、17b之各者，以2列8行之矩陣狀配置有複數個吸附感測器171而設置。 The measurement robot 17 includes a pair of arms 17a and 17b. The arms 17a and 17b each include a plurality of holding portions (not shown) for holding the IC device 90. Each holding portion is provided with a suction nozzle 170 that can be held by the suction IC device 90. As shown in FIG. 2, each suction nozzle 170 is arranged in a matrix of two columns and eight rows on each of the arms 17 a and 17 b. Further, each of the arms 17a, 17b is provided with a plurality of adsorption sensors 171 arranged in a matrix of two columns and eight rows.

測定機械手17於檢查IC器件90之情形時，將IC器件90朝檢查部16推壓，使IC器件90抵接於檢查部16。藉此，如上所述，IC器件90之端子與檢查部16之探針接腳電性連接。再者，測定機械手17係以能夠加熱或冷卻IC器件90之方式而構成。又，雖然未圖示，但於測定機械手17設置有檢測測定機械手17中之IC器件90之溫度之溫度檢測部。 When the measurement robot 17 inspects the IC device 90, the measurement robot 17 pushes the IC device 90 toward the inspection unit 16, and causes the IC device 90 to abut the inspection unit 16. Thereby, as described above, the terminal of the IC device 90 and the probe pin of the inspection section 16 are electrically connected. The measurement robot 17 is configured to be capable of heating or cooling the IC device 90. Although not shown in the figure, a temperature detection unit that detects the temperature of the IC device 90 in the measurement robot 17 is provided in the measurement robot 17.

器件回收部18係將已結束檢查部16之檢查之IC器件90搬送至器件回收區域A4之搬送部。該器件回收部18能夠沿X方向於檢查區域A3與器件回收區域A4之間移動地受支持。又，於圖2所示之構成中，器件回收部18係與器件供給部14同樣地沿Y方向配置有2個，檢查部16上之IC器件90被搬送、載置於任一器件回收部18。再者，該搬送係藉由測定機械手17而進行。又，雖然未圖示，但亦可於器件回收部18設置有檢測器件回收部18中之IC器件90之溫度之溫度檢測部。 The device recovery section 18 is a transport section that transports the IC devices 90 that have completed the inspection by the inspection section 16 to the device recovery area A4. The device recovery unit 18 is supported so as to be movable between the inspection region A3 and the device recovery region A4 in the X direction. In the configuration shown in FIG. 2, two device recovery sections 18 are arranged in the Y direction in the same manner as the device supply section 14, and the IC devices 90 on the inspection section 16 are transported and placed in any of the device recovery sections 18. The conveyance is performed by the measurement robot 17. Although not shown, a temperature detection unit that detects the temperature of the IC device 90 in the device recovery unit 18 may be provided in the device recovery unit 18.

器件回收區域A4係供回收檢查結束之IC器件90之區域。於該器 件回收區域A4設置有回收用托盤19、回收機械手(器件搬送頭)20、及回收空托盤搬送機構(托盤搬送機構)21。又，於器件回收區域A4亦準備有3個空的托盤200。 The device recovery area A4 is an area for the IC device 90 where the recovery inspection is completed. In the device The piece collection area A4 is provided with a collection tray 19, a collection robot (device transfer head) 20, and a collection empty tray transfer mechanism (tray transfer mechanism) 21. In addition, three empty trays 200 are also prepared in the device recovery area A4.

回收用托盤19係供載置IC器件90之載置部，固定於器件回收區域A4內，且於圖2所示之構成中，沿X方向並排配置有3個。又，空的托盤200亦係供載置IC器件90之載置部，沿X方向並排配置有3個。而且，移動至器件回收區域A4之器件回收部18上之IC器件90被搬送、載置於該等回收用托盤19及空的托盤200中之任一個。藉此，針對每一檢查結果，將IC器件90回收、分類。 The recovery tray 19 is a mounting portion on which the IC device 90 is mounted, and is fixed in the device recovery area A4. In the configuration shown in FIG. 2, three recovery trays are arranged side by side in the X direction. Also, three empty trays 200 are mounting portions on which the IC devices 90 are mounted, and three are arranged side by side in the X direction. Then, the IC device 90 on the device recovery section 18 moved to the device recovery area A4 is transported and placed on any one of the recovery tray 19 and the empty tray 200. With this, the IC device 90 is collected and classified for each inspection result.

回收機械手20係進行IC器件90之搬送之搬送部，能夠於器件回收區域A4內沿X方向、Y方向、及Z方向移動地受支持。該回收機械手20能夠將IC器件90自器件回收部18搬送至回收用托盤19或空的托盤200。再者，回收機械手20具有固持IC器件90之複數個固持部(未圖示)。各固持部構成為能夠吸附IC器件90，能夠藉由吸附IC器件90而將其固持。 The collection robot 20 is a transfer unit that transfers the IC device 90, and is supported to be movable in the X direction, the Y direction, and the Z direction within the device collection area A4. The collection robot 20 can transfer the IC device 90 from the component collection unit 18 to the collection tray 19 or the empty tray 200. The recovery robot 20 includes a plurality of holding portions (not shown) that hold the IC device 90. Each of the holding portions is configured to be capable of attracting the IC device 90, and the IC device 90 can be held by being adsorbed.

回收空托盤搬送機構21係將自托盤去除區域A5搬入之空的托盤200沿X方向進行搬送之搬送部(搬送機構)。繼而，於該搬送後，空的托盤200配置於供回收IC器件90之位置，即，可成為上述3個空的托盤200中之任一個。 The collected empty tray transfer mechanism 21 is a transfer unit (transfer mechanism) that transfers the empty tray 200 carried in from the tray removal area A5 in the X direction. Then, after the transfer, the empty tray 200 is disposed at a position where the IC device 90 is collected, that is, it can be any one of the three empty trays 200 described above.

托盤去除區域A5係回收、去除排列有檢查完畢狀態之複數個IC器件90之托盤200之區域。於托盤去除區域A5中，可堆積多個托盤200。再者，以跨及器件回收區域A4與托盤去除區域A5之方式設置有將托盤200逐個搬送之托盤搬送機構(搬送部)22A、22B。托盤搬送機構22A將載置有檢查完畢之IC器件90之托盤200自器件回收區域A4搬送至托盤去除區域A5。托盤搬送機構22B將用以回收IC器件90之空的托盤200自托盤去除區域A5搬送至器件回收區域A4。 The tray removal area A5 is an area for collecting and removing the trays 200 in which the plurality of IC devices 90 in the inspected state are arranged. In the tray removal area A5, a plurality of trays 200 can be stacked. In addition, tray transfer mechanisms (transfer units) 22A and 22B for transferring the trays 200 one by one are provided across the device recovery area A4 and the tray removal area A5. The tray transfer mechanism 22A transfers the tray 200 on which the IC devices 90 having been inspected are loaded from the device recovery area A4 to the tray removal area A5. The tray transfer mechanism 22B transfers the empty tray 200 for recycling the IC devices 90 from the tray removal area A5 to the device collection area A4.

如上說明之各區域A1~A5相互藉由未圖示之壁部或擋板等而分隔。該等擋板分別構成為能夠開閉，與控制裝置30電性連接，而控制其作動。 Each of the regions A1 to A5 described above is separated from each other by a wall portion, a baffle, or the like not shown. The baffles are configured to be able to be opened and closed, and are electrically connected to the control device 30 to control the operation thereof.

如圖3所示，控制裝置30具有控制檢查裝置1之各部之功能，具有包含驅動控制部311及檢查控制部312之控制部31、及記憶部32。 As shown in FIG. 3, the control device 30 has a function of controlling each section of the inspection device 1, and includes a control section 31 including a drive control section 311 and an inspection control section 312, and a memory section 32.

驅動控制部311控制各部(托盤搬送機構11A、11B、溫度調整部12、供給機械手13、供給空托盤搬送機構15、器件供給部14、檢查部16、測定機械手17、器件回收部18、回收機械手20、回收空托盤搬送機構21、及托盤搬送機構22A、22B)之驅動等。 The drive control section 311 controls each section (the tray conveyance mechanisms 11A and 11B, the temperature adjustment section 12, the supply robot 13, the supply empty tray conveyance mechanism 15, the device supply section 14, the inspection section 16, the measurement robot 17, the device recovery section 18, The driving of the recovery robot 20, the recovery empty tray transfer mechanism 21, and the tray transfer mechanisms 22A, 22B).

檢查控制部312能夠控制檢查等。例如亦能夠基於記憶於記憶部32內之程式(軟體)，進行配置於檢查部16之IC器件90之檢查等。 The inspection control unit 312 can control inspections and the like. For example, based on a program (software) stored in the memory unit 32, the inspection of the IC device 90 arranged in the inspection unit 16 can be performed.

又，控制部31亦具有將各部之驅動或檢查結果等顯示於顯示裝置40之功能、或根據來自操作裝置50之輸入進行處理之功能等。 The control unit 31 also has a function of displaying the driving or inspection results of each unit on the display device 40, a function of processing based on an input from the operation device 50, and the like.

記憶部32記憶用以使控制部31進行各種處理之程式或資料等。 The storage unit 32 stores programs, data, and the like for causing the control unit 31 to perform various processes.

設定顯示部60具有顯示裝置40及操作裝置50。 The setting display unit 60 includes a display device 40 and an operation device 50.

顯示裝置40具有顯示各部之驅動或檢查結果等之監視器41。監視器41例如可包含發光之液晶顯示面板或有機EL(electro luminescence，電致發光)等顯示面板等。作業人員能夠經由該監視器41，設定或確認檢查裝置1之各種處理或條件等。如圖1所示，顯示裝置40配置於檢查裝置1之+Z方向上。 The display device 40 includes a monitor 41 that displays driving, inspection results, and the like of each unit. The monitor 41 may include, for example, a light-emitting liquid crystal display panel or a display panel such as an organic EL (electro luminescence). The worker can set or confirm various processes, conditions, and the like of the inspection device 1 through the monitor 41. As shown in FIG. 1, the display device 40 is arranged in the + Z direction of the inspection device 1.

操作裝置50係滑鼠51等輸入器件，將對應於作業人員之操作之操作信號輸出至控制部31。因此，作業人員能夠使用滑鼠51，對控制部31進行各種處理等之指示。如圖1所示，滑鼠51(操作裝置50)配置於檢查裝置1之+X方向上且靠近顯示裝置40之位置。又，於本實施形態中，雖然將滑鼠51用作操作裝置50，但操作裝置50並不限定於此，例如亦可為鍵盤、軌跡球、觸控面板等輸入器件等。 The operation device 50 is an input device such as a mouse 51 and outputs an operation signal corresponding to the operation of the operator to the control section 31. Therefore, the operator can use the mouse 51 to instruct the control unit 31 for various processes and the like. As shown in FIG. 1, the mouse 51 (operation device 50) is disposed in the + X direction of the inspection device 1 and near the display device 40. In this embodiment, although the mouse 51 is used as the operation device 50, the operation device 50 is not limited to this, and may be, for example, input devices such as a keyboard, a trackball, and a touch panel.

於此種檢查裝置1中，藉由操作滑鼠51，於顯示於顯示裝置40之視窗上操作游標，能夠使檢查裝置1之各部(作動部)作動。以下，對該情況進行說明。 In such an inspection device 1, by operating the mouse 51 and operating a cursor on a window displayed on the display device 40, it is possible to operate each part (actuating part) of the inspection device 1. This case will be described below.

圖4係表示顯示於顯示裝置40之主畫面101之圖。於圖4中，表示點選於主畫面101內之上側橫向排列之圖標群102中之標有「Controller」之字符之圖標103之狀態。 FIG. 4 is a diagram showing a main screen 101 displayed on the display device 40. FIG. 4 shows a state where the icon 103 marked with the character “Controller” in the icon group 102 arranged horizontally on the upper side in the main screen 101 is clicked.

若點選「Controller」之圖標103，則於圖標103之下側，子視窗104與主畫面101重疊顯示。於該子視窗104配置有複數個(於圖示之構成中為8個)按鈕。若點選該等中之「I/O Monitor」之按鈕105，則如圖5所示，切換至視窗106。 If the icon 103 of "Controller" is clicked, the sub-window 104 and the main screen 101 are displayed overlappingly below the icon 103. A plurality of buttons (eight in the configuration shown in the figure) are arranged in the sub-window 104. If the button 105 of the "I / O Monitor" is clicked, as shown in Fig. 5, the window 106 is switched.

於該視窗106內，於下方中央部顯示有按鈕群107。該按鈕群107係複數個(於本實施形態中為15個)按鈕矩陣狀地配置而成者。又，圖5表示點選按鈕群107中之「Index Arm」之按鈕108之狀態。於該狀態下，於按鈕群107之上方，自左側起依序排列顯示有指示燈群(作動狀態顯示部)109a、109b、按鈕群(操作按鈕)110a、110b、按鈕群111a、111b。又，於該畫面內顯示之「Arm1」對應於臂17a，「Arm2」對應於臂17b。 In this window 106, a button group 107 is displayed in the lower center. The button group 107 is a plurality of (15 in the present embodiment) buttons arranged in a matrix. FIG. 5 shows a state of the button 108 of the “Index Arm” in the click button group 107. In this state, above the button group 107, an indicator group (operation state display sections) 109a, 109b, a button group (operation button) 110a, 110b, and a button group 111a, 111b are sequentially displayed from the left. In addition, "Arm1" displayed on this screen corresponds to the arm 17a, and "Arm2" corresponds to the arm 17b.

指示燈群109a、109b係顯示分別設置於測定機械手17之臂17a、17b之吸附感測器171是否作動者。指示燈群109a係顯示臂17a之吸附感測器171之作動狀態者，指示燈群109b係顯示臂17b之吸附感測器171之作動狀態者。 The indicator lamps 109 a and 109 b indicate whether or not the adsorption sensors 171 provided on the arms 17 a and 17 b of the measurement robot 17 are activated, respectively. The indicator lamp group 109a indicates the operation state of the adsorption sensor 171 of the arm 17a, and the indicator lamp group 109b indicates the operation state of the adsorption sensor 171 of the arm 17b.

於各指示燈群109a、109b中，圓形之指示燈(作動狀態顯示部)109排列成2列8行，各個指示燈109與吸附感測器171逐個對應。若臂17a、17b之吸附感測器171作動，則與其對應之位置之指示燈109發光。即，亮度增大。藉此，作業人員可知對應於發光之指示燈109之吸附感測器171處於作動狀態。又，各指示燈109係以中心部發光之方 式而構成，故而易於獲知其發光。 In each of the indicator groups 109a and 109b, circular indicator lamps (operation status display sections) 109 are arranged in two rows and eight rows, and each indicator lamp 109 corresponds to the adsorption sensor 171 one by one. When the adsorption sensors 171 of the arms 17a and 17b are activated, the indicator lights 109 corresponding to the positions are illuminated. That is, the brightness is increased. Thereby, the operator can know that the adsorption sensor 171 corresponding to the light-emitting indicator 109 is in an operating state. Each of the indicator lights 109 emits light at the center. Structure, it is easy to know its light emission.

於按鈕群110a、110b中，正方形(矩形)之按鈕110排列成2列8行，各個按鈕110對應於臂17a、17b之吸附感測器171。 In the button groups 110a and 110b, square (rectangular) buttons 110 are arranged in two columns and eight rows, and each button 110 corresponds to the adsorption sensor 171 of the arms 17a and 17b.

於檢查裝置1中，藉由操作滑鼠51，於顯示裝置40之畫面上將游標對準按鈕110並點選，能夠使對應於所點選之按鈕110之吸附感測器171作動。藉此，能夠使吸附感測器171之各者獨立地作動。 In the inspection device 1, by operating the mouse 51, aligning the cursor with the button 110 on the screen of the display device 40 and clicking, the adsorption sensor 171 corresponding to the selected button 110 can be operated. Thereby, each of the adsorption sensors 171 can be operated independently.

又，若各按鈕110(針對按鈕111亦相同)被點選操作，則按鈕110之整體變亮。即，亮度增大。藉此，作業人員可知已點選哪一個按鈕。 In addition, when each button 110 (the same is applied to the button 111) is clicked and operated, the entire button 110 becomes bright. That is, the brightness is increased. With this, the operator can know which button has been clicked.

進而，按鈕110(針對按鈕111亦相同)呈正方形，指示燈109呈圓形。即，按鈕110與指示燈109之形狀不同，能夠防止作業人員將其等混同。 Further, the button 110 (the same applies to the button 111) is square, and the indicator light 109 is circular. That is, the shapes of the button 110 and the indicator lamp 109 are different, and it is possible to prevent the operator from mixing them up.

於按鈕群111a、111b中，正方形(矩形)之按鈕111排列成2列8行，各按鈕111對應於對臂17a、17b之與IC器件90抵接之抵接部供給冷卻氣體之空氣閥。 In the button groups 111a and 111b, square (rectangular) buttons 111 are arranged in two rows and eight rows, and each button 111 corresponds to an air valve that supplies cooling gas to the contact portions of the arms 17a and 17b that abut the IC device 90.

於檢查裝置1中，藉由操作滑鼠51，於顯示裝置40之畫面上將游標對準按鈕111並點選，能夠使對應於所點選之按鈕111之空氣閥作動，而對抵接部供給冷卻氣體。藉此，能夠獨立地對抵接部之各者供給冷卻氣體。 In the inspection device 1, by operating the mouse 51, aligning the cursor with the button 111 on the screen of the display device 40 and clicking, the air valve corresponding to the selected button 111 can be actuated, and the abutting portion can be operated. Supply cooling gas. This makes it possible to independently supply the cooling gas to each of the contact portions.

又，測定機械手17中之吸附感測器171之配置與顯示裝置40中之指示燈109及按鈕110之配置相同。藉此，作業人員易於一面利用顯示裝置40進行操作，一面掌握實際上作動之吸附感測器171。 The arrangement of the adsorption sensor 171 in the measurement robot 17 is the same as that of the indicator 109 and the button 110 in the display device 40. This makes it easy for the worker to grasp the suction sensor 171 that actually operates while operating the display device 40.

其次，對圖6所示之視窗112進行說明。 Next, the window 112 shown in FIG. 6 will be described.

於視窗112(針對視窗118、125、132、139、141亦相同)中，於各指示燈群及各按鈕群中，因與上述視窗106之指示燈群及按鈕群之構成相同，故而省略詳細說明。又，以下所說明之圓形之指示燈作為作 動狀態顯示部而發揮功能，矩形之按鈕作為操作部(操作按鈕)而發揮功能。 In the window 112 (the same applies to the windows 118, 125, 132, 139, and 141), in each indicator group and each button group, the configuration is the same as that of the indicator group and the button group of the above-mentioned window 106, and details are omitted Instructions. In addition, the circular indicator lights described below are used as The dynamic state display section functions and the rectangular button functions as an operation section (operation button).

如圖6所示，若點選按鈕群107之「Shuttle」按鈕，則切換至視窗112。於該視窗112中，於按鈕群107之上側，自左側起依序排列顯示有指示燈群113、114、115及按鈕116、117。 As shown in FIG. 6, if the “Shuttle” button of the button group 107 is clicked, the window 112 is switched. In the window 112, on the upper side of the button group 107, the indicator groups 113, 114, 115 and the buttons 116, 117 are sequentially displayed from the left side.

指示燈群113係顯示配置於2個器件供給部14之IC器件90是否正常地座落於設置於器件供給部14之凹穴內者。於指示燈群113中，縱向排列有2個表示列之指示燈，橫向排列有8個表示行之指示燈。又，於該等指示燈之橫向右側，顯示有表示有無IC器件90之感測器之指示燈。 The indicator group 113 indicates whether or not the IC device 90 disposed in the two device supply sections 14 is normally located in a cavity provided in the device supply section 14. In the indicator light group 113, two indicator lights indicating rows are arranged vertically, and eight indicator lights indicating rows are arranged horizontally. In addition, on the right side of these indicators, an indicator indicating the presence or absence of a sensor of the IC device 90 is displayed.

指示燈群114係顯示配置於2個器件回收部18之IC器件90是否正常地座落於設置於器件供給部18之凹穴內者。於指示燈群114中，縱向排列有2個表示列之指示燈，橫向排列有8個表示行之指示燈。又，於該等指示燈之橫向右側，顯示有表示有無IC器件90之感測器之指示燈。 The indicator lamp group 114 indicates whether or not the IC device 90 disposed in the two device recovery sections 18 is normally located in a cavity provided in the device supply section 18. In the indicator light group 114, two indicator lights indicating rows are arranged vertically, and eight indicator lights indicating rows are arranged horizontally. In addition, on the right side of these indicators, an indicator indicating the presence or absence of a sensor of the IC device 90 is displayed.

於指示燈群(作動狀態顯示部)115中，縱向排列有以點亮之狀態表示設置於器件供給部14之各凹穴之開口之擋板14a成為開狀態之指示燈115a、及以點亮之狀態表示擋板14a成為閉狀態之指示燈115b。 In the indicator light group (operation status display section) 115, there are vertically arranged indicator lights 115a indicating that the shutters 14a provided in the openings of the recesses of the device supply section 14 are turned on in a lighted state, and lighted up. The state indicates the indicator 115b in which the shutter 14a is closed.

又，於指示燈群(作動狀態顯示部)115中，於指示燈115a、115b之下側，縱向排列有指示燈115c、115d。指示燈115c以點亮狀態表示設置於器件回收部18之各凹穴之開口之擋板(未圖示)成為開狀態，指示燈115d以點亮狀態表示器件回收部18之擋板(未圖示)成為閉狀態。 In the indicator lamp group (operation state display unit) 115, indicators 115c and 115d are arranged vertically below the indicators 115a and 115b. The indicator light 115c indicates that the shutters (not shown) of the openings of the recesses provided in the device recovery unit 18 are turned on, and the indicator 115d indicates that the shutters (not shown) of the device recovery unit 18 are on. (Shown) becomes closed.

按鈕116能夠操作器件供給部14之擋板14a之作動。藉由操作滑鼠51並點選按鈕116，能夠使器件供給部14之擋板14a作動。當點選按鈕116將擋板14a設為閉狀態時，按鈕116變亮。又，此時，指示燈115b變亮。若自該狀態再次點選按鈕116，則擋板14a成為開狀態，按鈕 116變暗。 The button 116 can operate the shutter 14 a of the device supply unit 14. By operating the mouse 51 and clicking the button 116, the shutter 14a of the device supply unit 14 can be operated. When the click button 116 sets the shutter 14a to the closed state, the button 116 becomes bright. At this time, the indicator 115b is turned on. When the button 116 is clicked again from this state, the shutter 14a is turned on, and the button 116 dimmed.

此點對於按鈕117亦同，能夠操作器件回收部18之擋板(未圖示)之作動。 This point is the same for the button 117, and can operate the shutter (not shown) of the device recovery part 18.

其次，對圖7所示之視窗118進行說明。 Next, the window 118 shown in FIG. 7 will be described.

如圖7所示，若點選按鈕群107之「Loader」之按鈕，則切換至視窗118。視窗118係用以顯示圖2中之托盤搬送機構11A及其附近之部分之作動之畫面。 As shown in FIG. 7, if the “Loader” button of the button group 107 is clicked, the window 118 is switched. The window 118 is used to display the operation of the tray conveyance mechanism 11A and its vicinity in FIG. 2.

於視窗118顯示有示意圖119、指示燈群120、按鈕群121、示意圖122、指示燈群123、及按鈕群124。 In the window 118, a schematic diagram 119, an indicator group 120, a button group 121, a schematic diagram 122, an indicator group 123, and a button group 124 are displayed.

示意圖119係於檢查裝置1中，自+Z方向(正)側觀察托盤搬送機構11A之圖。於示意圖119中顯示有光感測器201、光感測器202、固定構件203、及擋板204。 The schematic diagram 119 is a diagram of the tray conveyance mechanism 11A viewed from the + Z direction (positive) side in the inspection device 1. In the schematic diagram 119, a light sensor 201, a light sensor 202, a fixing member 203, and a baffle 204 are shown.

於示意圖119之橫向右側顯示有指示燈群120。於指示燈群120中，縱向排列有5個圓形之指示燈120a、120b、120c、120d、120e。 An indicator light group 120 is shown on the right side in the horizontal direction of the diagram 119. In the indicator light group 120, five circular indicator lights 120a, 120b, 120c, 120d, and 120e are arranged vertically.

於指示燈120a之橫向右側顯示有「Forward」之字符，表示指示燈120a對應於檢測有無托盤200之光感測器201(參照示意圖119)。 The character "Forward" is displayed on the right side of the indicator light 120a, indicating that the indicator light 120a corresponds to the light sensor 201 that detects the presence or absence of the tray 200 (refer to the schematic diagram 119).

同樣地，於指示燈120b之橫向右側顯示有「Middle」之字符，表示指示燈120b對應於光感測器202。 Similarly, the character "Middle" is displayed on the right side of the indicator 120b, indicating that the indicator 120b corresponds to the light sensor 202.

同樣地，於指示燈120c之橫向右側顯示有「Lock」之字符，表示指示燈120c對應於固定托盤200之固定構件203。 Similarly, the character "Lock" is displayed on the right side of the indicator 120c, indicating that the indicator 120c corresponds to the fixing member 203 of the fixed tray 200.

於指示燈120d之橫向右側顯示有「Shutter Open」之字符，表示擋板204成為開狀態。 The character "Shutter Open" is displayed on the right side of the indicator light 120d, indicating that the shutter 204 is in an open state.

於指示燈120e之橫向右側顯示有「Shutter Close」之字符，表示擋板204成為閉狀態。 A character "Shutter Close" is displayed on the right side of the indicator light 120e, indicating that the shutter 204 is closed.

於指示燈群120之橫向右側顯示有按鈕群121。於按鈕群121中，縱向排列地顯示有按鈕121a、121b、121c、121d。 A button group 121 is displayed on the right side of the indicator group 120 in the horizontal direction. In the button group 121, buttons 121a, 121b, 121c, and 121d are displayed in a row.

於按鈕121a之橫向右側顯示有「Tray Lock」之字符，表示按鈕121a對應於固定構件203。 A character "Tray Lock" is displayed on the right side of the button 121a, indicating that the button 121a corresponds to the fixed member 203.

於按鈕121b之橫向右側顯示有「Shutter Valve」之字符，表示按鈕121b對應於擋板204之閥。 The character "Shutter Valve" is displayed on the right side of the button 121b, indicating that the button 121b corresponds to the valve of the baffle 204.

於按鈕121c之橫向右側顯示有「Turn」之字符，表示按鈕121c進行擋板204之閥之馬達之ON/OFF之切換。 The character "Turn" is displayed on the right side of the button 121c, indicating that the button 121c switches the ON / OFF of the motor of the valve of the baffle 204.

於按鈕121d之橫向右側顯示有「Low Speed」之字符，表示進行馬達之高速模式/低速模式之切換。 The character "Low Speed" is displayed on the right side of the button 121d, indicating that the motor is switched between the high speed mode and the low speed mode.

於按鈕群121之橫向右側顯示有示意圖122。示意圖122係自-Y方向(負)側觀察托盤搬送機構11A之圖。於示意圖122中，顯示有光感測器205、升降機構206、及分離爪224。 A schematic diagram 122 is displayed on the right side of the button group 121 in the horizontal direction. The schematic diagram 122 is a diagram in which the tray conveyance mechanism 11A is viewed from the -Y direction (negative) side. In the schematic diagram 122, a light sensor 205, a lifting mechanism 206, and a separation claw 224 are shown.

於示意圖122之橫向右側顯示有指示燈群123。於指示燈群123中，縱向排列地顯示有指示燈123a、123b、123c、123d、123e。 An indicator group 123 is displayed on the right side in the horizontal direction of the diagram 122. In the indicator group 123, indicators 123a, 123b, 123c, 123d, and 123e are displayed in a row.

於指示燈123a之橫向右側顯示有「Remaining Tray」之字符，表示對應於光感測器205。 The character "Remaining Tray" is displayed on the right side in the horizontal direction of the indicator 123a, indicating that it corresponds to the light sensor 205.

於指示燈123b之橫向右側顯示有「Exist」之字符，表示檢測即將搬送至托盤搬送機構11A之前之托盤200之光感測器205之作動狀態。 The character "Exist" is displayed on the right side of the indicator 123b in the horizontal direction, which indicates the detection of the operating state of the light sensor 205 of the tray 200 immediately before being transferred to the tray conveying mechanism 11A.

指示燈123c、123d係表示升降機構206之作動狀態。 The indicator lights 123c and 123d indicate the operating state of the lifting mechanism 206.

於指示燈群123之橫向右側顯示有按鈕群124。於按鈕群124中，縱向排列有按鈕124a、124b、124c。 A button group 124 is displayed on the right side of the indicator group 123 in the horizontal direction. In the button group 124, buttons 124a, 124b, and 124c are arranged vertically.

於按鈕124a之橫向右側顯示有「Separator」之字符，能夠操作分離爪224之作動。 The character "Separator" is displayed on the right side of the button 124a in the horizontal direction, and the operation of the separating claw 224 can be performed.

於按鈕124b之橫向右側顯示有「Upper」之字符，能夠使升降機構206上升。 The character "Upper" is displayed on the right side of the button 124b in the horizontal direction, and the lifting mechanism 206 can be raised.

於按鈕124c之橫向右側顯示有「Middle」之字符，能夠使升降機構206下降。 The character "Middle" is displayed on the right side of the button 124c in the horizontal direction, and the lifting mechanism 206 can be lowered.

如此，將2個示意圖119、122顯示於1個視窗118。藉此，可省略為使托盤搬送機構11A及其周邊作動而操作按鈕群107來切換視窗之操作。即，利用1個視窗118足以使托盤搬送機構11A及其周邊作動，故操作容易。 In this way, two diagrams 119 and 122 are displayed in one window 118. Accordingly, the operation of switching the window by operating the button group 107 to operate the tray conveyance mechanism 11A and its surroundings can be omitted. That is, it is sufficient to operate the tray conveyance mechanism 11A and its surroundings with one window 118, so that the operation is easy.

其次，對圖8所示之視窗125進行說明。 Next, the window 125 shown in FIG. 8 will be described.

如圖8所示，若點選按鈕群107之「Auto1」之按鈕，則切換至視窗125。視窗125係用以顯示圖2中之托盤搬送機構22A及其附近之部分之作動之畫面(關於「Aut02」、「Aut03」亦相同)。 As shown in FIG. 8, if the “Auto1” button of the button group 107 is clicked, the window 125 is switched. The window 125 is a screen for displaying the operation of the tray conveyance mechanism 22A and its vicinity in FIG. 2 (the same applies to "Aut02" and "Aut03").

於視窗125顯示有示意圖126、指示燈群127、按鈕群128、示意圖129、指示燈群130、及按鈕131。 In the window 125, a schematic diagram 126, an indicator group 127, a button group 128, a schematic diagram 129, an indicator group 130, and a button 131 are displayed.

示意圖126係於檢查裝置1中自+Z方向(正)側觀察托盤搬送機構22A之圖。於示意圖126顯示有光感測器207、固定構件208、擋板209、光感測器210、及光感測器211。 The schematic diagram 126 is a diagram of the tray conveyance mechanism 22A viewed from the + Z direction (positive) side in the inspection device 1. The schematic diagram 126 shows a light sensor 207, a fixing member 208, a baffle 209, a light sensor 210, and a light sensor 211.

於示意圖126之橫向右側顯示有指示燈群127。於指示燈群127中，縱向排列有6個圓形之指示燈127a、127b、127c、127d、127e、127f。 An indicator group 127 is displayed on the right side in the horizontal direction of the diagram 126. In the indicator light group 127, six circular indicator lights 127a, 127b, 127c, 127d, 127e, and 127f are arranged vertically.

於指示燈127a之橫向右側顯示有「Forward」之字符，表示指示燈127a對應於檢測有無托盤200之光感測器207(參照示意圖126)。 The character "Forward" is displayed on the right side of the indicator light 127a, indicating that the indicator light 127a corresponds to the light sensor 207 (see the schematic diagram 126) for detecting the presence or absence of the tray 200.

同樣地，於指示燈127b之橫向右側顯示有「Lock」之字符，表示指示燈127b對應於固定托盤200之固定構件208。 Similarly, the character "Lock" is displayed on the right side of the indicator light 127b, indicating that the indicator light 127b corresponds to the fixing member 208 of the fixed tray 200.

於指示燈127c之橫向右側顯示有「Shutter Open」之字符，表示擋板209成為開狀態。 The character "Shutter Open" is displayed on the right side of the indicator light 127c, indicating that the shutter 209 is in an open state.

於指示燈127d之橫向右側顯示有「Shutter Close」之字符，表示擋板209成為閉狀態。 The character "Shutter Close" is displayed on the right side of the indicator light 127d, indicating that the shutter 209 is closed.

於指示燈127e之橫向右側顯示有「Middle」之字符，表示指示燈127e對應於光感測器210。 The character "Middle" is displayed on the right side of the indicator 127e, indicating that the indicator 127e corresponds to the light sensor 210.

於指示燈127f之橫向右側顯示有「Exist」之字符，表示指示燈127f對應於光感測器211。 The character "Exist" is displayed on the right side of the indicator 127f, indicating that the indicator 127f corresponds to the light sensor 211.

於指示燈群127之橫向右側顯示有按鈕群128。於按鈕群128中，縱向排列地顯示有按鈕128a、128b、128c、128d。 A button group 128 is displayed on the right side of the indicator group 127 in the horizontal direction. In the button group 128, buttons 128a, 128b, 128c, and 128d are displayed in a row.

於按鈕128a之橫向右側顯示有「Tray Lock」之字符，表示按鈕128a對應於固定構件208。 A character "Tray Lock" is displayed on the right side of the button 128a, indicating that the button 128a corresponds to the fixed member 208.

於按鈕128b之橫向右側顯示有「Shutter Valve」之字符，表示按鈕128b對應於擋板209之閥。 A "Shutter Valve" character is displayed on the right side of the button 128b, indicating that the button 128b corresponds to the valve of the baffle 209.

於按鈕128c之橫向右側顯示有「Turn」之字符，表示按鈕128c進行擋板209之閥之馬達之ON/OFF之切換。 The character "Turn" is displayed on the right side of the button 128c, indicating that the button 128c switches the ON / OFF of the motor of the valve of the baffle 209.

於按鈕128d之橫向右側顯示有「Low Speed」之字符，表示進行馬達之高速模式/低速模式之切換。 The character "Low Speed" is displayed on the right side of the button 128d, indicating that the motor is switched between high-speed mode and low-speed mode.

於按鈕群128之橫向右側顯示有示意圖129。示意圖129係自-Y方向(負)側觀察托盤搬送機構22A之圖。於示意圖129顯示有光感測器212及升降機構213。 A schematic diagram 129 is displayed on the right side of the button group 128 in the horizontal direction. The schematic diagram 129 is a diagram in which the tray conveyance mechanism 22A is viewed from the -Y direction (negative) side. The photo sensor 212 and the lifting mechanism 213 are shown in the schematic diagram 129.

於示意圖129之橫向右側顯示有指示燈群130。於指示燈群130中，縱向排列地顯示有指示燈130a、130b、130c。 A light group 130 is shown on the right side in the horizontal direction of the diagram 129. In the indicator light group 130, the indicator lights 130a, 130b, and 130c are displayed in a row.

於指示燈130a之橫向右側顯示有「Full」之字符，對應於光感測器212。 A character "Full" is displayed on the right side of the indicator 130a in the horizontal direction, which corresponds to the light sensor 212.

指示燈130b及指示燈130c表示示意圖129中之使托盤200升降之升降機構213之位置。 The indicator lights 130b and 130c show the positions of the lifting mechanism 213 for raising and lowering the tray 200 in the schematic diagram 129.

於指示燈130b之橫向右側顯示有按鈕131。於按鈕131之橫向右側顯示有「Upper/Middle」之字符，表示按鈕131對應於升降機構213之作動。 A button 131 is displayed on the right side of the indicator light 130b in the lateral direction. The character "Upper / Middle" is displayed on the right side of the button 131, indicating that the button 131 corresponds to the action of the lifting mechanism 213.

其次，對圖9所示之視窗132進行說明。 Next, the window 132 shown in FIG. 9 will be described.

如圖9所示，若點選按鈕群107之「Empty1」之按鈕，則切換至視 窗132。視窗132係用以顯示圖2中之托盤搬送機構22B及其附近之部分之作動之畫面。 As shown in Figure 9, if you click on the "Empty1" button in the button group 107, Window 132. The window 132 is a screen for displaying the operation of the tray conveyance mechanism 22B and its vicinity in FIG. 2.

於視窗132顯示有示意圖133、指示燈群134、按鈕群135、示意圖136、指示燈群137、及按鈕群138。 In the window 132, a schematic diagram 133, an indicator group 134, a button group 135, a schematic diagram 136, an indicator group 137, and a button group 138 are displayed.

示意圖133係於檢查裝置1中自+Z方向(正)側觀察托盤搬送機構22B之圖。於示意圖133顯示有光感測器214、光感測器215、固定構件216、擋板217、及光感測器218。 The schematic diagram 133 is a diagram of the tray conveyance mechanism 22B viewed from the + Z direction (positive) side in the inspection device 1. The schematic diagram 133 shows a light sensor 214, a light sensor 215, a fixing member 216, a baffle 217, and a light sensor 218.

於示意圖133之橫向右側顯示有指示燈群134。於指示燈群134中，縱向排列有6個圓形之指示燈134a、134b、134c、134d、134e、134f。 An indicator group 134 is displayed on the right side in the horizontal direction of the diagram 133. In the indicator light group 134, six circular indicator lights 134a, 134b, 134c, 134d, 134e, and 134f are arranged vertically.

於指示燈134a之橫向右側顯示有「Forward」之字符，表示指示燈134a對應於檢測有無托盤200之光感測器214。 The character "Forward" is displayed on the right side of the indicator light 134a, indicating that the indicator light 134a corresponds to the light sensor 214 that detects the presence or absence of the tray 200.

於指示燈134b之橫向右側顯示有「Middle」之字符，表示指示燈134b對應於檢測有無托盤200之光感測器215。 The character "Middle" is displayed on the right side of the indicator light 134b, indicating that the indicator light 134b corresponds to the light sensor 215 that detects the presence or absence of the tray 200.

於指示燈134c之橫向右側顯示有「Lock」之字符，表示指示燈134c對應於固定托盤200之固定構件216。 The character "Lock" is displayed on the right side of the indicator light 134c, indicating that the indicator light 134c corresponds to the fixing member 216 of the fixed tray 200.

於指示燈134d之橫向右側顯示有「Shutter Open」之字符，表示擋板217成為開狀態。 The character "Shutter Open" is displayed on the right side of the indicator light 134d, indicating that the shutter 217 is open.

於指示燈134e之橫向右側顯示有「Shutter Close」之字符，表示擋板217成為閉狀態。 The character "Shutter Close" is displayed on the right side of the indicator light 134e, indicating that the shutter 217 is closed.

於指示燈134f之橫向右側顯示有「Middle LD」之字符，表示指示燈134f對應於光感測器218。 The character "Middle LD" is displayed on the right side of the indicator 134f, indicating that the indicator 134f corresponds to the light sensor 218.

於指示燈群134之橫向右側顯示有按鈕群135。於按鈕群135中，縱向排列地顯示有按鈕135a、135b、135c、135d、135e。 A button group 135 is displayed on the right side of the indicator group 134 in the horizontal direction. In the button group 135, buttons 135a, 135b, 135c, 135d, and 135e are displayed in a row.

於按鈕135a之橫向右側顯示有「Tray Lock」之字符，表示按鈕135a對應於固定構件216。 A character "Tray Lock" is displayed on the right side of the button 135a, indicating that the button 135a corresponds to the fixed member 216.

於按鈕135b之橫向右側顯示有「Shutter Valve」之字符，表示按鈕135b對應於擋板217之閥。 The character "Shutter Valve" is displayed on the right side of the button 135b, indicating that the button 135b corresponds to the valve of the baffle plate 217.

於按鈕135c之橫向右側顯示有「Turn」之字符，表示按鈕135c進行擋板217之閥之馬達之ON/OFF之切換。 The character "Turn" is displayed on the right side of the button 135c, indicating that the button 135c switches the ON / OFF of the motor of the valve of the baffle 217.

於按鈕135d之橫向右側顯示有「Low Speed」之字符，表示進行馬達之高速模式/低速模式之切換。 The character "Low Speed" is displayed on the right side of the button 135d in the horizontal direction, which indicates that the high speed mode / low speed mode of the motor is switched.

於按鈕135e之橫向右側顯示有「Reverse」之字符，表示進行馬達之旋轉之朝向之切換。 The character "Reverse" is displayed on the right side of the button 135e in the horizontal direction, which indicates that the rotation direction of the motor is switched.

於按鈕群135之橫向右側顯示有示意圖136。示意圖136係自-Y方向(負)側觀察托盤搬送機構22B之圖。於示意圖136顯示有光感測器219、光感測器220、光感測器221、升降機構222、及分離爪223。 A schematic diagram 136 is displayed on the right side of the button group 135 in the horizontal direction. The schematic diagram 136 is a diagram in which the tray conveyance mechanism 22B is viewed from the -Y direction (negative) side. The schematic diagram 136 shows a light sensor 219, a light sensor 220, a light sensor 221, a lifting mechanism 222, and a separation claw 223.

於示意圖136之橫向右側顯示有指示燈群137。於指示燈群137中，縱向排列地顯示有指示燈137a、137b、137c、137d、137e、137f。 An indicator light group 137 is displayed on the right side in the horizontal direction of the diagram 136. In the indicator group 137, indicators 137a, 137b, 137c, 137d, 137e, and 137f are displayed in a row.

於指示燈137a之橫向右側顯示有「Full」之字符，表示對應於光感測器219。 A character "Full" is displayed on the right side of the indicator 137a in the horizontal direction, which corresponds to the light sensor 219.

於指示燈137b之橫向右側顯示有「Remaining」之字符，表示對應於光感測器220。 The character "Remaining" is displayed on the right side of the indicator 137b in the horizontal direction, which corresponds to the light sensor 220.

於指示燈137c之橫向右側顯示有「Exist」之字符，表示對應於光感測器221。 The character "Exist" is displayed on the right side of the indicator light 137c in the horizontal direction, which corresponds to the light sensor 221.

指示燈137d~137f分別係表示示意圖136中所示之升降機構222之位置者。 The indicator lights 137d to 137f respectively indicate positions of the lifting mechanism 222 shown in the schematic diagram 136.

於指示燈群137之橫向右側顯示有按鈕群138。於按鈕群138中，縱向排列地配置有138a、138b、138c。 A button group 138 is displayed on the right side in the horizontal direction of the indicator group 137. In the button group 138, 138a, 138b, and 138c are arranged vertically.

於按鈕138a之橫向右側顯示有「Separator」之字符，能夠操作分離爪223之作動。 The character "Separator" is displayed on the right side of the button 138a in the horizontal direction, and the operation of the separating claw 223 can be performed.

於按鈕138b之橫向右側顯示有「Upper」之字符，能夠使升降機構222上升。 The character "Upper" is displayed on the right side of the button 138b in the horizontal direction, and the lifting mechanism 222 can be raised.

於按鈕138c之橫向右側顯示有「Middle」之字符，能夠使升降機構222下降。 The character "Middle" is displayed on the right side of the button 138c in the horizontal direction, and the lifting mechanism 222 can be lowered.

其次，對圖10所示之視窗139進行說明。 Next, the window 139 shown in FIG. 10 will be described.

如圖10所示，若點選按鈕群107之「Plate Cover」之按鈕，則切換至視窗139。於視窗139顯示有指示燈群140。 As shown in FIG. 10, if the "Plate Cover" button of the button group 107 is clicked, the window is switched to window 139. A light group 140 is displayed on the window 139.

指示燈群140具有指示燈140a、140b、140c、140d、140e。指示燈140a~140c係縱向排列顯示。指示燈140d、140e縱向排列地顯示於指示燈140a~140c之右側。 The indicator group 140 includes indicators 140a, 140b, 140c, 140d, and 140e. The indicators 140a ~ 140c are arranged vertically. The indicator lights 140d and 140e are vertically arranged to the right of the indicators 140a to 140c.

於指示燈140a之橫向左側顯示有「X Slide Cover origin」之字符，指示燈140a表示設置於溫度調整部12之沿X方向開閉之擋板關閉。 The character "X Slide Cover origin" is displayed on the left side of the indicator light 140a in the horizontal direction. The indicator light 140a indicates that the shutter provided in the temperature adjustment section 12 that is opened and closed in the X direction is closed.

於指示燈140b之橫向左側顯示有「X Slide Cover middle」之字符，指示燈140b表示設置於溫度調整部12之沿X方向開閉之擋板打開。 The character "X Slide Cover middle" is displayed on the left side of the indicator light 140b in the horizontal direction. The indicator light 140b indicates that a shutter provided in the temperature adjustment section 12 that opens and closes in the X direction is opened.

於指示燈140c之橫向左側顯示有「X Slide Cover left limit」之字符，指示燈140c表示設置於溫度調整部12之沿X方向開閉之擋板打開至極限。 The character "X Slide Cover left limit" is displayed on the left side of the indicator light 140c in the horizontal direction. The indicator light 140c indicates that the shutter opened and closed in the X direction provided in the temperature adjustment section 12 is opened to the limit.

於指示燈140d之橫向左側顯示有「Y Slide Cover origin」之字符，指示燈140d表示設置於溫度調整部12之沿Y方向開閉之擋板關閉。 A character "Y Slide Cover origin" is displayed on the left side of the indicator light 140d in the horizontal direction. The indicator light 140d indicates that a shutter provided in the temperature adjustment section 12 that is opened and closed in the Y direction is closed.

於指示燈140e之橫向左側顯示有「Y Slide Cover 30mm」之字符，指示燈140e表示設置於溫度調整部12之沿Y方向開閉之擋板打開30mm。 The character "Y Slide Cover 30mm" is displayed on the left side of the indicator light 140e, and the indicator light 140e indicates that the shutter provided in the temperature adjustment section 12 that opens and closes in the Y direction opens 30mm.

其次，對圖11所示之視窗141進行說明。 Next, the window 141 shown in FIG. 11 will be described.

如圖11所示，若點選按鈕群107之「Fix Tray & Other」之按鈕，則切換至視窗141。於視窗141顯示有指示燈群142、按鈕群143。 As shown in FIG. 11, if the “Fix Tray & Other” button of the button group 107 is clicked, the window 141 is switched. An indicator group 142 and a button group 143 are displayed on the window 141.

指示燈群142包含指示燈142a、142b、142c、142d、142e、 142f、142g、142h、142i、142j、142k、142L。指示燈142a~142g係縱向排列顯示。指示燈142h~142L縱向排列地顯示於指示燈142a~142g之右側。 The indicator group 142 includes indicators 142a, 142b, 142c, 142d, 142e, 142f, 142g, 142h, 142i, 142j, 142k, 142L. The indicator lights 142a ~ 142g are arranged vertically. The indicator lights 142h to 142L are vertically arranged to the right of the indicator lights 142a to 142g.

於指示燈142a之橫向左側顯示有「Fix Tray 1」之字符，指示燈142a表示是否於Fix Tray 1載置有IC器件90。 The character "Fix Tray 1" is displayed on the left side of the indicator light 142a, and the indicator light 142a indicates whether the IC device 90 is mounted on the Fix Tray 1.

於指示燈142b之橫向左側顯示有「Fix Tray 2」之字符，指示燈142b表示是否於Fix Tray 2載置有IC器件90。 The character "Fix Tray 2" is displayed on the left side of the indicator light 142b, and the indicator light 142b indicates whether the IC device 90 is mounted on the Fix Tray 2.

於指示燈142c之橫向左側顯示有「Fix Tray 3」之字符，指示燈142c表示是否於Fix Tray 3載置有IC器件90。 The character "Fix Tray 3" is displayed on the left side of the indicator light 142c. The indicator light 142c indicates whether the IC device 90 is mounted on the Fix Tray 3.

於指示燈142d之橫向左側顯示有「Double IC reset」之字符。 The character "Double IC reset" is displayed on the left side of the indicator light 142d in the horizontal direction.

於指示燈142e之橫向左側顯示有「Chamber Door」之字符，指示燈142e表示檢查部16之擋板之開閉狀態。 The character "Chamber Door" is displayed on the left side of the indicator light 142e, and the indicator light 142e indicates the opening / closing state of the shutter of the inspection section 16.

於指示燈142f之橫向左側顯示有「Air」之字符，指示燈142f表示空氣流入至檢查部16。 The character "Air" is displayed on the left side of the indicator light 142f, and the indicator light 142f indicates that air has flowed into the inspection section 16.

於指示燈142g之橫向左側顯示有「Temporary Stage Floating Sensor 1」之字符，指示燈142g表示於臨時放置台載置有IC器件90。 The character "Temporary Stage Floating Sensor 1" is displayed on the left side of the indicator light 142g, and the indicator light 142g indicates that the IC device 90 is placed on the temporary placement table.

於指示燈142h之橫向左側顯示有「DockPlate Free L」之字符。 The character "DockPlate Free L" is displayed on the left side of the indicator light 142h in the horizontal direction.

於指示燈142i之橫向左側顯示有「DockPlate Free R」之字符。 The character "DockPlate Free R" is displayed on the left side of the indicator light 142i in the horizontal direction.

於指示燈142j之橫向左側顯示有「Front Cover Sensor」之字符。 The character "Front Cover Sensor" is displayed on the left side of the indicator light 142j in the horizontal direction.

於指示燈142k之橫向左側顯示有「Front Cover Switch」之字符。 The character "Front Cover Switch" is displayed on the left side of the indicator light 142k in the horizontal direction.

於指示燈142L之橫向左側顯示有「Temporary Stage Floating Sensor 2」之字符，指示燈142L表示於臨時放置台載置有IC器件90。 The character "Temporary Stage Floating Sensor 2" is displayed on the left side of the indicator light 142L. The indicator light 142L indicates that the IC device 90 is placed on the temporary placement table.

於按鈕群143中，顯示有按鈕143a、143b、143c、143d、143e、143f、143g、143h、143i、143j。按鈕143a~143e係縱向排列顯示。按鈕143f~按鈕143j縱向排列地顯示於按鈕143a~143e之右側。 In the button group 143, buttons 143a, 143b, 143c, 143d, 143e, 143f, 143g, 143h, 143i, and 143j are displayed. The buttons 143a to 143e are displayed vertically. The buttons 143f to 143j are displayed vertically to the right of the buttons 143a to 143e.

於按鈕143a之橫向左側顯示有「FAN Start」之字符，於按鈕143b 之橫向左側顯示有「FAN Run」之字符，於按鈕143c之橫向左側顯示有「FAN Reset」之字符。該等按鈕143a~143c能夠進行使檢查部16內之風扇作動/停止之操作。 The character "FAN Start" is displayed on the left side of the button 143a, and on the button 143b The character "FAN Run" is displayed on the left side in the horizontal direction, and the character "FAN Reset" is displayed on the left side in the horizontal direction of the button 143c. These buttons 143a to 143c can be used to operate / stop the fan in the inspection unit 16.

於按鈕143d之橫向左側顯示有「Heater ON」之字符，於按鈕143e之橫向左側顯示有「Heater OFF」之字符。按鈕143d、143e能夠切換檢查部16內之加熱器之作動/停止。 The character "Heater ON" is displayed on the left side of the button 143d in the horizontal direction, and the character "Heater OFF" is displayed on the left side of the button 143e in the horizontal direction. The buttons 143d and 143e can switch the operation / stop of the heater in the inspection unit 16.

於按鈕143f之橫向左側顯示有「Cover Lock」之字符。於按鈕143g之橫向左側顯示有「Double IC LED」之字符。於按鈕143h之橫向左側顯示有「START」之字符。於按鈕143i之橫向左側顯示有「Front Cover Lock」之字符。於按鈕143j之橫向左側顯示有「Front Cover LED」之字符。 The character "Cover Lock" is displayed on the left side of the button 143f in the horizontal direction. The character "Double IC LED" is displayed on the left side of the button 143g in the horizontal direction. The character "START" is displayed on the left side of the button 143h in the horizontal direction. The character "Front Cover Lock" is displayed on the left side of the button 143i in the horizontal direction. The character "Front Cover LED" is displayed on the left side of the button 143j in the horizontal direction.

如以上所說明般，於檢查裝置1中，於顯示裝置40中顯示有使檢查裝置1之各部作動之按鈕(操作部)，藉由點選按鈕，能夠使各部獨立地作動。又，於檢查裝置1中，於顯示裝置40中顯示有顯示各部之作動狀態之指示燈。 As described above, in the inspection device 1, the display device 40 displays a button (operation portion) for operating each part of the inspection device 1. By clicking the button, each part can be operated independently. In addition, in the inspection device 1, a display device 40 displays an indicator light indicating the operating state of each unit.

先前，例如於在IC器件90之檢查之前進行動作確認之情形時，係總括地使檢查裝置之各部作動，而進行各部之檢查。相對於此，於檢查裝置1中，如上所述，能夠使檢查裝置1之各部獨立地作動，又，能夠分別獲知各部是否作動。因此，於檢查裝置1中，尤其是於進行動作確認(維護)時非常有利。 Previously, for example, when the operation was confirmed before the inspection of the IC device 90, each part of the inspection apparatus was operated collectively to perform the inspection of each part. In contrast, in the inspection device 1, as described above, each part of the inspection device 1 can be operated independently, and whether each part is operated can be known separately. Therefore, the inspection apparatus 1 is very advantageous especially when performing operation confirmation (maintenance).

(第2實施形態) (Second Embodiment)

圖12係自正面側觀察本發明之第2實施形態之電子零件檢查裝置之概略立體圖。圖13係圖12所示之電子零件檢查裝置之概略俯視圖。圖14A係表示藉由圖13所示之電子零件檢查裝置所具備之托盤搬送機構而搬送之托盤之狀態之俯視圖，圖14B係表示圖13所示之電子零件檢查裝置所具備之托盤之狀態之側視圖。圖15~圖18分別係圖12所示 之電子零件檢查裝置所具備之監視器所顯示之表單。圖19係表示圖12所示之電子零件檢查裝置所具備之移動時間變更部之構成之一例之前視圖。圖20係圖19所示之移動時間變更部之放大圖。圖21係包含圖19所示之移動時間變更部之電路圖。圖22係表示藉由圖14A及圖14B所示之托盤搬送機構而搬送之托盤之搬送速度之經時性變化之曲線圖。 Fig. 12 is a schematic perspective view of an electronic component inspection apparatus according to a second embodiment of the present invention, as viewed from the front side. FIG. 13 is a schematic plan view of the electronic component inspection device shown in FIG. 12. FIG. 14A is a plan view showing a state of a tray transferred by a tray transfer mechanism provided in the electronic part inspection device shown in FIG. 13, and FIG. 14B is a view showing a state of a tray provided in the electronic part inspection device shown in FIG. 13. Side view. Figures 15 to 18 are shown in Figure 12 The form displayed on the monitor of the electronic component inspection device. FIG. 19 is a front view showing an example of a configuration of a moving time changing section provided in the electronic component inspection device shown in FIG. 12. FIG. 20 is an enlarged view of a moving time changing section shown in FIG. 19. FIG. 21 is a circuit diagram including a moving time changing section shown in FIG. 19. FIG. 22 is a graph showing a change with time of a transfer speed of a tray transferred by the tray transfer mechanism shown in FIGS. 14A and 14B.

如圖13所示，檢查裝置1000被分為托盤供給區域B1、器件供給區域(以下簡稱為「供給區域」)B2、檢查區域B3、器件回收區域(以下簡稱為「回收區域」)B4、及托盤去除區域B5。而且，IC器件90依序經由托盤供給區域B1至托盤去除區域B5之各區域，於中途之檢查區域B3進行檢查。如此，檢查裝置1000成為具備於各區域搬送IC器件90之電子零件搬送裝置、於檢查區域B3內進行檢查之檢查部1016、及控制部1080者。又，如圖12所示，檢查裝置1000具備監視器1300及信號燈1400。 As shown in FIG. 13, the inspection apparatus 1000 is divided into a tray supply area B1, a device supply area (hereinafter referred to as "supply area") B2, an inspection area B3, a device recovery area (hereinafter referred to as "recycling area") B4, and Tray removal area B5. In addition, the IC device 90 performs inspection in the inspection area B3 in the middle through the areas from the tray supply area B1 to the tray removal area B5 in order. As described above, the inspection apparatus 1000 includes an electronic component transport apparatus that transports the IC device 90 in each area, an inspection unit 1016 that performs inspection in the inspection area B3, and a control unit 1080. As shown in FIG. 12, the inspection device 1000 includes a monitor 1300 and a signal light 1400.

再者，檢查裝置1000係配置有托盤供給區域B1、托盤去除區域B5之一方(圖13中之-Y方向側)成為正面側，其相反側、即配置有檢查區域B3之一方(圖13中之+Y方向側)作為背面側而使用。 In addition, the inspection device 1000 is configured such that one of the tray supply area B1 and the tray removal area B5 (the -Y direction side in FIG. 13) becomes the front side, and the opposite side, that is, one of the inspection areas B3 (FIG. 13) (+ Y direction side) is used as the back side.

托盤供給區域B1係供給排列著未檢查狀態之複數個IC器件90之托盤(配置構件)200之供材部。於托盤供給區域B1中，可堆積多個托盤200。 The tray supply area B1 is a material supply section for supplying trays (arrangement members) 200 in which a plurality of IC devices 90 are arranged in an unchecked state. A plurality of trays 200 can be stacked in the tray supply area B1.

供給區域B2係將配置於來自托盤供給區域B1之托盤200上之複數個IC器件90分別供給至檢查區域B3之區域。再者，以跨及托盤供給區域B1與供給區域B2之方式，設置有將托盤200逐個沿水平方向搬送之托盤搬送機構1011A、1011B。托盤搬送機構1011A係能夠使托盤200與載置於該托盤200之IC器件90一併沿Y方向移動之移動部。藉此，能夠將IC器件90穩定地送入至供給區域B2。又，托盤搬送機構1011B係能夠使空托盤200移動之移動部。 The supply area B2 is an area where a plurality of IC devices 90 arranged on the tray 200 from the tray supply area B1 are supplied to the inspection area B3, respectively. In addition, tray transfer mechanisms 1011A and 1011B are provided so as to span the tray supply area B1 and the supply area B2 one by one in the horizontal direction. The tray conveyance mechanism 1011A is a moving part capable of moving the tray 200 in the Y direction together with the IC device 90 placed on the tray 200. Thereby, the IC device 90 can be stably fed into the supply region B2. The tray conveyance mechanism 1011B is a moving unit capable of moving the empty tray 200.

於供給區域B2設置有溫度調整部(浸泡板)1012、器件搬送頭1013、及托盤搬送機構(第1搬送裝置)1015。 A temperature adjustment section (soaking plate) 1012, a device transfer head 1013, and a tray transfer mechanism (first transfer device) 1015 are provided in the supply area B2.

溫度調整部1012係供載置複數個IC器件90之載置部，能夠加熱或冷卻該複數個IC器件90。藉此，能夠將IC器件90調整至適合檢查之溫度。於圖13所示之構成中，沿Y方向配置、固定有2個溫度調整部1012。而且，藉由托盤搬送機構1011A自托盤供給區域B1搬入(搬送來)之托盤200上之IC器件90被搬送、載置於任一溫度調整部1012。 The temperature adjustment section 1012 is a mounting section for mounting a plurality of IC devices 90, and can heat or cool the plurality of IC devices 90. Thereby, the IC device 90 can be adjusted to a temperature suitable for inspection. In the configuration shown in FIG. 13, two temperature adjustment sections 1012 are arranged and fixed along the Y direction. Then, the IC device 90 on the tray 200 that is carried in (carried in) from the tray supply area B1 by the tray transfer mechanism 1011A is transferred and placed on any of the temperature adjustment units 1012.

器件搬送頭1013能夠於供給區域B2內移動地受支持。藉此，器件搬送頭1013負責自托盤供給區域B1搬入之托盤200與溫度調整部1012之間之IC器件90之搬送、及溫度調整部1012與下述器件供給部1014之間之IC器件90之搬送。 The device transfer head 1013 is supported to be movable within the supply area B2. With this, the device transfer head 1013 is responsible for transferring the IC device 90 between the tray 200 and the temperature adjustment section 1012 carried in from the tray supply area B1, and the IC device 90 between the temperature adjustment section 1012 and the device supply section 1014 described below. Transport.

托盤搬送機構1015係將去除所有IC器件90之狀態之空的托盤200於供給區域B2內在X方向上搬送之機構。繼而，於該搬送後，藉由托盤搬送機構1011B使空的托盤200自供給區域B2返回至托盤供給區域B1。 The tray transfer mechanism 1015 is a mechanism that transfers the empty tray 200 in a state where all the IC devices 90 are removed in the X direction in the supply area B2. Then, after the transfer, the empty tray 200 is returned from the supply area B2 to the tray supply area B1 by the tray transfer mechanism 1011B.

檢查區域B3係檢查IC器件90之區域。於該檢查區域B3設置有器件供給部(供給梭)1014、檢查部1016、器件搬送頭1017、及器件回收部(回收梭)1018。 The inspection area B3 is an area where the IC device 90 is inspected. A device supply unit (supply shuttle) 1014, an inspection unit 1016, a device transfer head 1017, and a device recovery unit (recovery shuttle) 1018 are provided in the inspection area B3.

器件供給部1014係能夠載置經溫度調整之IC器件90，並將該IC器件90搬送(使其移動)至檢查部1016附近之移動部。該器件供給部1014能夠於供給區域B2與檢查區域B3之間沿X方向在水平方向上移動地受支持。又，於圖13所示之構成中，沿Y方向配置有2個器件供給部1014，溫度調整部1012上之IC器件90被搬送、載置於任一器件供給部1014。 The device supply section 1014 is a moving section capable of placing the temperature-adjusted IC device 90 and transporting (moving) the IC device 90 to the inspection section 1016. This device supply unit 1014 is supported so as to be movable in the horizontal direction in the X direction between the supply region B2 and the inspection region B3. In the configuration shown in FIG. 13, two device supply units 1014 are arranged along the Y direction, and the IC device 90 on the temperature adjustment unit 1012 is transported and placed on any of the device supply units 1014.

檢查部1016係檢查、試驗IC器件90之電氣特性之單元。於檢查部1016，設置有於保持有IC器件90之狀態下與該IC器件90之端子電性 連接之複數個探針接腳。而且，IC器件90之端子與探針接腳電性連接(接觸)，經由探針接腳進行IC器件90之檢查。IC器件90之檢查係基於連接於檢查部1016之測試機所具備之檢查控制部中記憶之程式而進行。再者，於檢查部1016中，與溫度調整部1012同樣地，能夠加熱或冷卻IC器件90，而將該IC器件90調整至適合檢查之溫度。 The inspection unit 1016 is a unit for inspecting and testing the electrical characteristics of the IC device 90. The inspection unit 1016 is provided with the electrical properties of the terminals of the IC device 90 while the IC device 90 is held. A plurality of probe pins connected. In addition, the terminal of the IC device 90 is electrically connected (contacted) with the probe pin, and the inspection of the IC device 90 is performed through the probe pin. The inspection of the IC device 90 is performed based on a program stored in an inspection control section provided in a tester connected to the inspection section 1016. In addition, in the inspection unit 1016, similarly to the temperature adjustment unit 1012, the IC device 90 can be heated or cooled, and the IC device 90 can be adjusted to a temperature suitable for inspection.

器件搬送頭1017能夠於檢查區域B3內移動地受支持。藉此，器件搬送頭1017能夠將自供給區域B2搬入之器件供給部1014上之IC器件90搬送、載置於檢查部1016上。 The device transfer head 1017 is supported to be movable within the inspection area B3. Thereby, the device transfer head 1017 can transfer and place the IC device 90 on the device supply part 1014 carried in from the supply area B2 to the inspection part 1016.

器件回收部1018係載置已結束於檢查部1016之檢查之IC器件90，並可將該IC器件90搬送(使其移動)至回收區域B4之移動部。該器件回收部1018能夠在檢查區域B3與回收區域B4之間沿X方向於水平方向上移動地受支持。又，於圖13所示之構成中，器件回收部1018與器件供給部1014同樣地沿Y方向配置有2個，檢查部1016上之IC器件90被搬送、載置於任一器件回收部1018。該搬送係藉由器件搬送頭1017而進行。 The device recovery section 1018 is an IC device 90 on which the inspection completed in the inspection section 1016 is placed, and the IC device 90 can be transported (moved) to the moving section of the recovery area B4. This device recovery part 1018 is supported so that it can move horizontally in the X direction between the inspection area B3 and the recovery area B4. In the configuration shown in FIG. 13, two device recovery units 1018 are arranged in the Y direction in the same manner as the device supply unit 1014. The IC devices 90 on the inspection unit 1016 are transported and placed in any of the device recovery units 1018. . This transfer is performed by the device transfer head 1017.

回收區域B4係供回收檢查結束之複數個IC器件90之區域。於該回收區域B4設置有回收用托盤1019、器件搬送頭1020、及托盤搬送機構(第2搬送裝置)1021。又，於回收區域B4亦準備有空的托盤200。 The recovery area B4 is an area of the plurality of IC devices 90 where the recovery inspection is completed. A collection tray 1019, a device transfer head 1020, and a tray transfer mechanism (second transfer device) 1021 are provided in the collection area B4. An empty tray 200 is also prepared in the collection area B4.

回收用托盤1019係供載置IC器件90之載置部，固定於回收區域B4內，於圖13所示之構成中，沿X方向配置有3個。又，空的托盤200亦為供載置IC器件90之載置部，沿X方向配置有3個。而且，移動至回收區域B4之器件回收部1018上之IC器件90被搬送、載置於該等回收用托盤1019及空的托盤200中之任一個。藉此，依各個檢查結果，將IC器件90回收、分類。 The collection tray 1019 is a mounting portion on which the IC device 90 is mounted, and is fixed in the collection area B4. In the configuration shown in FIG. 13, three collection trays are arranged in the X direction. In addition, three empty trays 200 are mounting portions on which the IC devices 90 are mounted, and three are arranged in the X direction. Then, the IC device 90 on the device recovery section 1018 moved to the recovery area B4 is transported and placed on one of the recovery trays 1019 and the empty tray 200. Thereby, the IC device 90 is collected and sorted according to each inspection result.

器件搬送頭1020能夠於回收區域B4內移動地受支持。藉此，器件搬送頭1020能夠將IC器件90自器件回收部1018搬送至回收用托盤 1019或空的托盤200。 The device transfer head 1020 is supported so as to be movable within the recovery area B4. Thereby, the device transfer head 1020 can transfer the IC device 90 from the device collection part 1018 to the collection tray. 1019 or empty tray 200.

托盤搬送機構1021係將自托盤去除區域B5搬入之空的托盤200於回收區域B4內沿X方向進行搬送之機構。繼而，於該搬送後，空的托盤200配置於供回收IC器件90之位置，即，可能會成為上述3個空的托盤200中之任一個。如此，於檢查裝置1000中，於回收區域B4設置有托盤搬送機構1021，此外，於供給區域B2設置有托盤搬送機構1015。藉此，例如與利用1個搬送機構進行將空的托盤200向X方向搬送相比，能夠謀求處理量(每單位時間之IC器件90之搬送個數)之提高。 The tray transfer mechanism 1021 is a mechanism that transfers the empty tray 200 carried in from the tray removal area B5 in the X direction in the collection area B4. Then, after the transfer, the empty tray 200 is disposed at a position where the IC device 90 is collected, that is, it may become any of the three empty trays 200 described above. In this way, in the inspection apparatus 1000, the tray transfer mechanism 1021 is provided in the collection area B4, and the tray transfer mechanism 1015 is provided in the supply area B2. Thereby, for example, compared with the case where the empty tray 200 is conveyed in the X direction by one conveyance mechanism, the throughput (the number of conveyances of the IC device 90 per unit time) can be improved.

再者，作為托盤搬送機構1015、1021之構成，並無特別限定，例如可列舉具有吸附托盤200之吸附構件、及將該吸附構件能夠沿X方向移動地支持之滾珠螺桿等支持機構之構成。 In addition, the configurations of the tray transfer mechanisms 1015 and 1021 are not particularly limited, and examples thereof include a support mechanism such as a suction member having a suction tray 200 and a ball screw that supports the suction member to move in the X direction.

托盤去除區域B5係回收、去除排列有檢查完畢狀態之複數個IC器件90之托盤200之除材部。於托盤去除區域B5中，可堆積多個托盤200。 The tray removal area B5 is a material removal section for collecting and removing the trays 200 of the plurality of IC devices 90 arranged in a checked state. In the tray removal area B5, a plurality of trays 200 can be stacked.

又，以跨及回收區域B4與托盤去除區域B5之方式設置有將托盤200沿水平方向逐個搬送之托盤搬送機構1022A、1022B。托盤搬送機構1022A係能夠使托盤200與載置於該托盤200之檢查完畢之IC器件90一併沿Y方向移動之移動部。藉此，能夠將檢查完畢之IC器件90自回收區域B4搬送至托盤去除區域B5。又，托盤搬送機構1022B係能夠使用以回收IC器件90之空的托盤200自托盤去除區域B5移動至回收區域B4之移動部。 In addition, tray transfer mechanisms 1022A and 1022B are provided so as to span the recovery area B4 and the tray removal area B5 one by one in the horizontal direction. The tray transfer mechanism 1022A is a moving part that can move the tray 200 in the Y direction together with the inspected IC device 90 placed on the tray 200. Thereby, the inspected IC device 90 can be transferred from the collection area B4 to the tray removal area B5. In addition, the tray transfer mechanism 1022B is a moving unit capable of moving the empty tray 200 for collecting the IC devices 90 from the tray removal area B5 to the collection area B4.

控制部1080例如具有驅動控制部。驅動控制部例如控制托盤搬送機構1011A、1011B、溫度調整部1012、器件搬送頭1013、器件供給部1014、托盤搬送機構1015、檢查部1016、器件搬送頭1017、器件回收部1018、器件搬送頭1020、托盤搬送機構1021、及托盤搬送機構 1022A、1022B之各部之驅動。 The control unit 1080 includes, for example, a drive control unit. The drive control unit controls, for example, the tray transfer mechanism 1011A, 1011B, the temperature adjustment unit 1012, the device transfer head 1013, the device supply unit 1014, the tray transfer mechanism 1015, the inspection unit 1016, the device transfer head 1017, the device recovery unit 1018, and the device transfer head 1020. , Tray transfer mechanism 1021, and tray transfer mechanism 1022A, 1022B each drive.

再者，上述測試機之檢查控制部例如基於記憶於未圖示之記憶體內之程式，進行配置於檢查部1016之IC器件90之電氣特性之檢查等。 In addition, the inspection control section of the tester performs, for example, inspection of the electrical characteristics of the IC device 90 arranged in the inspection section 1016 based on a program stored in a memory not shown.

操作員能夠經由監視器1300，設定或確認檢查裝置1000之作動時之溫度條件等。如圖12所示，該監視器1300具有例如由液晶畫面構成之顯示畫面1301，配置於檢查裝置1000之正面側上部(+Z方向側)。於托盤去除區域B5之+X方向側，設置有載置操作監視器1300所顯示之畫面時所使用之滑鼠之滑鼠台1600。 The operator can set or confirm temperature conditions and the like during operation of the inspection device 1000 through the monitor 1300. As shown in FIG. 12, the monitor 1300 has, for example, a display screen 1301 composed of a liquid crystal screen, and is arranged on the front side (+ Z direction side) of the inspection device 1000. On the + X direction side of the tray removal area B5, a mouse stage 1600 for mounting a screen displayed by the operation monitor 1300 is provided.

又，信號燈1400能夠藉由所發光之顏色之組合，報告檢查裝置1000之作動狀態等。如圖12所示，信號燈1400配置於檢查裝置1000之上部(+Z方向側)。再者，於檢查裝置1000內置有揚聲器1500，藉由該揚聲器1500亦能夠報告檢查裝置1000之作動狀態等。 In addition, the signal lamp 1400 can report the operation state of the inspection device 1000 and the like by a combination of the emitted colors. As shown in FIG. 12, the signal light 1400 is arranged on the upper part (+ Z direction side) of the inspection device 1000. Furthermore, a speaker 1500 is built in the inspection device 1000, and the operation state of the inspection device 1000 can also be reported by the speaker 1500.

如圖13所示，於檢查裝置1000中，托盤供給區域B1與供給區域B2之間由第1間隔壁1061隔開(分隔)，供給區域B2與檢查區域B3之間由第2間隔壁1062隔開，檢查區域B3與回收區域B4之間由第3間隔壁1063隔開，回收區域B4與托盤去除區域B5之間由第4間隔壁1064隔開。又，供給區域B2與回收區域B4之間亦由第5間隔壁1065隔開。該等間隔壁具有保持各區域之氣密性之功能。 As shown in FIG. 13, in the inspection device 1000, the tray supply area B1 and the supply area B2 are separated (separated) by a first partition wall 1061, and the supply area B2 and the inspection area B3 are separated by a second partition wall 1062. On, the inspection area B3 and the collection area B4 are separated by a third partition wall 1063, and the collection area B4 and the tray removal area B5 are separated by a fourth partition wall 1064. The supply area B2 and the recovery area B4 are also separated by a fifth partition wall 1065. These partitions have the function of maintaining the airtightness of each area.

進而，檢查裝置1000之最外包裝由外殼覆蓋，該外殼例如存在前外殼1070、側外殼1071、側外殼1072、後外殼1073、頂部外殼1074。再者，於較後外殼1073更靠內側，配置有內側間隔壁1066。 Furthermore, the outermost package of the inspection device 1000 is covered by a casing, which includes, for example, a front casing 1070, a side casing 1071, a side casing 1072, a rear casing 1073, and a top casing 1074. Further, an inner partition wall 1066 is disposed further inside than the rear case 1073.

如上所述，檢查裝置1000具備托盤搬送機構1011A、器件供給部1014、器件回收部1018、托盤搬送機構1022A，作為載置IC器件90而移動之移動部。而且，於檢查裝置1000中，為了獲得所需之處理量(每單位時間之IC器件90之處理個數)，需要確認是否恰好地設定了該 等移動部之移動時間。該確認係於各種維護時進行，例如於檢查裝置1000之出貨時進行，或於該出貨後於IC器件90之製造工廠內之使用時定期地進行，或於構成移動部之零件隨著連續之使用而劣化之情形時更換該零件時進行。 As described above, the inspection apparatus 1000 includes the tray transfer mechanism 1011A, the device supply section 1014, the device recovery section 1018, and the tray transfer mechanism 1022A as the moving section for moving the IC device 90. In addition, in the inspection device 1000, in order to obtain a required processing amount (the number of processing of the IC device 90 per unit time), it is necessary to confirm whether or not the setting is properly set. Wait for the moving time of the moving part. This confirmation is performed during various kinds of maintenance, for example, when the inspection device 1000 is shipped, or periodically after use in the manufacturing facility of the IC device 90, or when the parts constituting the moving part follow It is performed when the part is replaced in the case of continuous use and deterioration.

以下，說明對移動部之維護，但作為該移動部，代表性地說明托盤搬送機構1011A。 Hereinafter, the maintenance of the moving part will be described, but as the moving part, the tray conveyance mechanism 1011A will be representatively described.

如圖14A及圖14B所示，托盤搬送機構1011A具有主動輪1111、從動輪1112、及傳送帶1113。 As shown in FIGS. 14A and 14B, the tray conveyance mechanism 1011A includes a driving wheel 1111, a driven wheel 1112, and a conveyor belt 1113.

主動輪1111配置於托盤供給區域B1內，連結於馬達1115。 The driving wheel 1111 is arranged in the tray supply area B1 and is connected to the motor 1115.

從動輪1112相對於主動輪1111於+Y方向上相隔，且配置於供給區域B2內。 The driven wheel 1112 is spaced apart from the driving wheel 1111 in the + Y direction, and is arranged in the supply area B2.

傳送帶1113係環繞架設於主動輪1111與從動輪1112之環形傳送帶。再者，傳送帶1113有2條，相互於X方向上相隔而配置。 The conveyor belt 1113 is an endless conveyor belt that is erected around the driving wheel 1111 and the driven wheel 1112. In addition, there are two conveyor belts 1113, which are arranged apart from each other in the X direction.

於此種構成之托盤搬送機構1011A中，藉由馬達1115之作動而旋轉之主動輪1111之旋轉力經由傳送帶1113傳遞至從動輪1112。藉此，能夠將載置於傳送帶1113上之托盤200自托盤供給區域B1搬送至供給區域B2。 In the tray conveyance mechanism 1011A having such a configuration, the rotational force of the driving wheel 1111 that is rotated by the operation of the motor 1115 is transmitted to the driven wheel 1112 via the conveyor 1113. Accordingly, the tray 200 placed on the conveyor 1113 can be transferred from the tray supply area B1 to the supply area B2.

再者，較佳為，於主動輪1111與從動輪1112之間配置有防止傳送帶1113之撓曲之構件。藉此，能夠穩定地搬送托盤200。 Further, it is preferable that a member for preventing the deflection of the conveyor belt 1113 is disposed between the driving wheel 1111 and the driven wheel 1112. Thereby, the tray 200 can be stably conveyed.

又，托盤搬送機構1011A於供給區域B2內具有作為供托盤200抵接之抵接部之擋塊1114。當托盤200自托盤供給區域B1移動至供給區域B2時，於其移動(動作)結束之時刻碰觸於擋塊1114。藉由該碰觸狀態，完成與托盤200一起之各IC器件90之定位，因此，能夠利用器件搬送頭1013固持該各IC器件90。 In addition, the tray conveyance mechanism 1011A includes a stopper 1114 as a contact portion for the tray 200 to abut in the supply area B2. When the tray 200 moves from the tray supply area B1 to the supply area B2, it touches the stopper 1114 at the time when the movement (operation) is completed. With this touched state, positioning of each IC device 90 together with the tray 200 is completed, and therefore, each IC device 90 can be held by the device transfer head 1013.

再者，擋塊1114係由配置、固定於供給區域B2內且能夠抵接至托盤200之前進方向前方之端面之塊狀、或板狀之構件構成。又，作 為擋塊1114之構成材料，並無特別限定，例如可使用不鏽鋼或鋁等金屬材料、聚乙烯或尼龍等樹脂材料。 In addition, the stopper 1114 is composed of a block-shaped or plate-shaped member that is arranged and fixed in the supply area B2 and can abut on the end face in the forward direction of the tray 200. Again The material constituting the stopper 1114 is not particularly limited. For example, a metal material such as stainless steel or aluminum, and a resin material such as polyethylene or nylon can be used.

其次，對監視器1300之顯示畫面1301進行說明。 Next, a display screen 1301 of the monitor 1300 will be described.

如圖16~圖18所示，於監視器1300之顯示畫面1301放映出維護表單1003。如圖15所示，該維護表單1003係自顯示畫面1301所顯示之選單表單1004選擇者。 As shown in FIGS. 16 to 18, a maintenance sheet 1003 is displayed on a display screen 1301 of the monitor 1300. As shown in FIG. 15, the maintenance form 1003 is selected from the menu form 1004 displayed on the display screen 1301.

於對維護表單1003進行說明之前，對選單表單1004進行說明。 Before describing the maintenance form 1003, the menu form 1004 is described.

如圖15所示，選單表單1004包含第1選單群1041、第2選單群1042、第3選單群1043、軟體名顯示欄1044、檔案名顯示欄1045、及檢查部(插座)狀態顯示表1046。 As shown in FIG. 15, the menu form 1004 includes a first menu group 1041, a second menu group 1042, a third menu group 1043, a software name display field 1044, a file name display field 1045, and an inspection unit (socket) status display table 1046. .

第1選單群1041包含按鈕1411~按鈕1416，且以如下方式分配，即，按鈕1411對應於「Exit」，按鈕1412對應於「Shut down」，按鈕1413對應於「Device Set」，按鈕1414對應於「Unit Set」，按鈕1415對應於「Maintenance」，按鈕1416對應於「My Pad」。而且，藉由操作按鈕1415，顯示圖16~圖18之維護表單1003。 The first menu group 1041 includes buttons 1411 to 1416, and is assigned in the following manner, that is, button 1411 corresponds to "Exit", button 1412 corresponds to "Shut down", button 1413 corresponds to "Device Set", and button 1414 corresponds to In the "Unit Set", the button 1415 corresponds to "Maintenance", and the button 1416 corresponds to "My Pad". Furthermore, by operating the button 1415, the maintenance form 1003 shown in FIGS. 16 to 18 is displayed.

第2選單群1042包含按鈕4201~按鈕4212，且以如下方式分配，即，按鈕4201對應於「Build」，按鈕4202對應於「Start Mode」，按鈕4203對應於「C.Select」，按鈕4204對應於「C.Clear」，按鈕4205對應於「Temp Monitor」，按鈕4206對應於「Tower Light」，按鈕4207對應於「Password」，按鈕4208對應於「Security」，按鈕4209對應於「Observer」，按鈕4210對應於「Configuration」，按鈕4211對應於「Controller」，按鈕4212對應於「DIO Setting」。 The second menu group 1042 includes buttons 4201 to 4212, and is assigned in the following manner, that is, button 4201 corresponds to "Build", button 4202 corresponds to "Start Mode", button 4203 corresponds to "C.Select", and button 4204 corresponds to In "C.Clear", button 4205 corresponds to "Temp Monitor", button 4206 corresponds to "Tower Light", button 4207 corresponds to "Password", button 4208 corresponds to "Security", button 4209 corresponds to "Observer", button 4210 corresponds to "Configuration", button 4211 corresponds to "Controller", and button 4212 corresponds to "DIO Setting".

第3選單群1043包含設定檢查裝置1000之作動條件之設定部1431~設定部1436，且以如下方式分配，即，設定部1431對應於「Temperature」，設定部1432對應於「Tester」，設定部1433對應於「Run Mode」，設定部1434對應於「Start Mode」，設定部1435對應於「Bin Setting」，設定部1436對應於「Rotation」。 The third menu group 1043 includes a setting section 1431 to a setting section 1436 for setting operating conditions of the inspection device 1000, and is assigned in such a manner that the setting section 1431 corresponds to "Temperature", the setting section 1432 corresponds to "Tester", and the setting section 1433 corresponds to "Run Mode", setting unit 1434 corresponds to "Start Mode", and setting unit 1435 corresponds to "Bin Setting ", and the setting unit 1436 corresponds to" Rotation ".

於軟體名顯示欄1044顯示有用以使檢查裝置1000作動之軟體之名稱。 In the software name display field 1044, the name of the software used to operate the inspection device 1000 is displayed.

於檔案名顯示欄1045顯示有用以使檢查裝置1000作動之檔案之名稱。 The file name display field 1045 displays the name of a file that is used to operate the inspection device 1000.

於檢查部狀態顯示表1046顯示有於檢查部1016之檢查狀態。 The inspection status display table 1046 shows the inspection status in the inspection section 1016.

其次，對維護表單1003進行說明。 Next, the maintenance form 1003 will be described.

如圖16~圖18所示，維護表單1003包含器件供給部．回收部用選單群1031、托盤供給．去除用選單群1032、空托盤搬送用選單群1033、托盤搬送用選單群1034、及移動時間顯示欄(移動時間顯示部)1035。 As shown in Fig. 16 to Fig. 18, the maintenance form 1003 includes a device supply unit. The collection unit is supplied with a menu group 1031 and a tray. The removal menu group 1032, the empty tray transfer menu group 1033, the tray transfer menu group 1034, and the moving time display field (moving time display section) 1035.

器件供給部．回收部用選單群1031包含設定器件供給部(供給梭)1014及器件回收部(回收梭)1018之作動條件之按鈕1311~按鈕1316。以如下方式分配，即，按鈕1311對應於「In Shuttle 1」，按鈕1312對應於「Out Shuttle 1」，按鈕1313對應於「Out Fiber」，按鈕1314對應於「In Shuttle 2」，按鈕1315對應於「Out Shuttle 2」，按鈕1316對應於「Out Fiber」。 Device Supply Department. The recovery group menu group 1031 includes buttons 1311 to 1316 that set operating conditions of the device supply section (supply shuttle) 1014 and the device recovery section (recovery shuttle) 1018. Assigned in such a way that button 1311 corresponds to "In Shuttle 1", button 1312 corresponds to "Out Shuttle 1", button 1313 corresponds to "Out Fiber", button 1314 corresponds to "In Shuttle 2", and button 1315 corresponds to "Out Shuttle 2", button 1316 corresponds to "Out Fiber".

托盤供給．去除用選單群1032包含設定於托盤供給區域B1及托盤去除區域B5之對托盤200之作動條件之按鈕1321~按鈕1323。以如下方式分配，即，按鈕1321對應於「Loader」，按鈕1322對應於「Unloader 」，按鈕1323對應於「Tray Lock」。 Tray supply. The removal menu group 1032 includes buttons 1321 to 1323 of operating conditions for the tray 200 set in the tray supply area B1 and the tray removal area B5. Assigned in such a way that the button 1321 corresponds to "Loader", the button 1322 corresponds to "Unloader", and the button 1323 corresponds to "Tray Lock".

空托盤搬送用選單群1033包含設定托盤搬送機構1021之作動條件之按鈕1331及按鈕1332。以如下方式分配，即，按鈕1331對應於「Position Check」，按鈕1332對應於「Cylinder」。 The empty tray transfer menu group 1033 includes a button 1331 and a button 1332 that set operating conditions of the tray transfer mechanism 1021. The assignment is such that the button 1331 corresponds to "Position Check" and the button 1332 corresponds to "Cylinder".

托盤搬送用選單群1034包含使托盤搬送機構1011A、托盤搬送機構1011B、3個托盤搬送機構1022A、托盤搬送機構1022B作動之按鈕 1341a~1346b。 The tray transfer menu group 1034 includes buttons for operating the tray transfer mechanism 1011A, the tray transfer mechanism 1011B, the three tray transfer mechanisms 1022A, and the tray transfer mechanism 1022B. 1341a ~ 1346b.

托盤搬送用選單群1034內之標題「Loader」係指「托盤搬送機構1011A」。而且，以如下方式分配，即，按鈕1341a對應於使托盤搬送機構1011A以高速模式作動之「High SPD」按鈕，按鈕1341b對應於使托盤搬送機構1011A以低速模式作動之「Low SPD」按鈕。 The title "Loader" in the tray transfer menu group 1034 means "tray transfer mechanism 1011A". The buttons 1341a correspond to a "High SPD" button for operating the tray transport mechanism 1011A in a high-speed mode, and the buttons 1341b correspond to a "Low SPD" button for operating the tray transport mechanism 1011A in a low-speed mode.

標題「ReLoader 1」係指「托盤搬送機構1011B」。而且，以如下方式分配，即，按鈕1342a對應於使托盤搬送機構1011B以高速模式作動之「High SPD」按鈕，按鈕1342b對應於使托盤搬送機構1011B以低速模式作動之「Low SPD」按鈕。 The title "ReLoader 1" means "pallet transfer mechanism 1011B." The buttons 1342a correspond to a "High SPD" button for operating the tray transport mechanism 1011B in a high-speed mode, and the button 1342b corresponds to a "Low SPD" button for operating the tray transport mechanism 1011B in a low-speed mode.

標題「ReLoader 2」係指「托盤搬送機構1022B」。而且，以如下方式分配，即，按鈕1343a對應於使托盤搬送機構1022B以高速模式作動之「High SPD」按鈕，按鈕1343b對應於使托盤搬送機構1022B以低速模式按鈕「Low SPD」按鈕。 The title "ReLoader 2" means "tray transfer mechanism 1022B." The button 1343a corresponds to a "High SPD" button for operating the tray transport mechanism 1022B in a high-speed mode, and the button 1343b corresponds to a "Low SPD" button for operating the tray transport mechanism 1022B in a low-speed mode.

又，根據檢查裝置1000之種類，例如亦可使托盤搬送用選單群1034進而包含使托盤搬送機構1015以高速模式作動之按鈕、及以低速模式作動之按鈕。 In addition, depending on the type of the inspection apparatus 1000, for example, the tray transfer menu group 1034 may further include a button for operating the tray transfer mechanism 1015 in a high-speed mode and a button for operating in a low-speed mode.

標題「UnLoader 1」係指處於最靠近供給區域B2之位置之「托盤搬送機構1022A」。而且，以如下方式分配，即，按鈕1344a對應於使該托盤搬送機構1022A以高速模式作動之速度「High SPD」按鈕，按鈕1344b對應於使該托盤搬送機構1022A以低速模式作動之「Low SPD」按鈕。 The title "UnLoader 1" refers to "pallet transfer mechanism 1022A" which is closest to the supply area B2. Further, the button 1344a corresponds to a "High SPD" button for operating the tray transport mechanism 1022A in a high-speed mode, and the button 1344b corresponds to "Low SPD" for operating the tray transport mechanism 1022A in a low-speed mode. Button.

標題「UnLoader 2」係指鄰接於UnLoader 1之「托盤搬送機構1022A」。而且，以如下方式分配，即，按鈕1345a對應於使該托盤搬送機構1022A以高速模式作動之「High SPD」按鈕，按鈕1345b對應於使該托盤搬送機構1022A以低速模式作動之「Low SPD」按鈕。 The title "UnLoader 2" refers to "pallet transfer mechanism 1022A" adjacent to UnLoader 1. The button 1345a corresponds to a "High SPD" button for operating the tray transport mechanism 1022A in a high-speed mode, and the button 1345b corresponds to a "Low SPD" button for operating the tray transport mechanism 1022A in a low-speed mode. .

標題「UnLoader 3」係指鄰接於UnLoader 2之「托盤搬送機構1022A 」。而且，以如下方式分配，即，按鈕1346a對應於使該托盤搬送機構1022A以高速模式作動之「High SPD」按鈕，按鈕1346b對應於使該托盤搬送機構1022A以低速模式作動之「Low SPD」按鈕。 The title "UnLoader 3" refers to "Tray Transfer Mechanism 1022A" adjacent to UnLoader 2. ". Further, the button 1346a corresponds to a "High SPD" button for operating the tray transport mechanism 1022A in a high-speed mode, and the button 1346b corresponds to a "Low SPD" button for operating the tray transport mechanism 1022A in a low-speed mode. .

例如於選擇了按鈕1341a之情形時，於移動時間顯示欄1035，於括弧內顯示有以高速模式作動之托盤搬送機構1011A之1次之自動作開始至動作結束之實際時間即移動時間t11A。而且，檢查裝置1000之操作員等作業人員於維護時，能夠視認到該移動時間顯示欄1035所顯示之移動時間t11A。藉此，作業人員能夠於維護時確認是否為了獲得利用檢查裝置1000之所需之處理量而恰好地設定了移動時間t11A，即，托盤搬送機構1011A是否準確地動作。如此，檢查裝置1000成為維護性優異之裝置。 For example, in the case of selecting the button 1341a, the mobile time display field 1035, within the parentheses showed the actuation of the high-speed mode tray conveyance mechanism 1011A of 1, followed by automatic operation start to the end of the operation of the actual time, i.e. the travel time t 11A. In addition, during maintenance, an operator such as an operator of the inspection device 1000 can visually recognize the moving time t 11A displayed in the moving time display field 1035. Thereby, the operator can confirm whether the moving time t 11A is set exactly in order to obtain the required processing amount using the inspection device 1000 during maintenance, that is, whether the tray transfer mechanism 1011A operates accurately. Thus, the inspection apparatus 1000 becomes an apparatus excellent in maintainability.

再者，亦能夠以如下方式構成，即，於選擇了按鈕1341a之情形時，能夠視覺地辨識選擇了該按鈕1341a之意旨。作為此種構成，例如可列舉使按鈕1341a之顏色變化，或顯示於「LDR High」與監視器1300(維護表單1003)等構成。 Moreover, it can be comprised so that the intention of selecting this button 1341a can be visually recognized when the button 1341a is selected. Examples of such a configuration include a configuration in which the color of the button 1341a is changed or displayed on "LDR High" and the monitor 1300 (maintenance sheet 1003).

又，如圖16~圖18所示，於移動時間顯示欄1035顯示有移動時間t11A是否處於預先設定且記憶之數值即閾值t0之範圍內之判定結果R11A及該閾值t0。 As shown in FIGS. 16 to 18, the moving time display column 1035 displays a determination result R 11A of whether or not the moving time t 11A is within a range set in advance and memorized as a threshold value t 0 and the threshold value t 0 .

判定結果R11A以「OK」或「NG」而顯示。 The determination result R 11A is displayed as "OK" or "NG".

閾值t0於本實施形態中為「1.3±0.1[s]」，根據移動時間t11A是否處於該範圍內，選擇顯示「OK」與「NG」中之任一者。藉此，作業人員能夠判斷是否應變更移動時間t11A。 The threshold value t 0 is "1.3 ± 0.1 [s]" in this embodiment, and one of "OK" and "NG" is selected to be displayed depending on whether the moving time t 11A is within the range. Thereby, the worker can determine whether the moving time t 11A should be changed.

例如，於圖16所示之狀態下，移動時間t11A為1.3[s]。該情形時，移動時間t11A處於閾值t0之範圍內，故而判定結果R11A成為「OK」。因此，作業人員能夠判斷為了獲得利用檢查裝置1000之所需之處理量而恰好地設定了移動時間t11A。 For example, in the state shown in FIG. 16, the moving time t 11A is 1.3 [s]. In this case, since the moving time t 11A is within the range of the threshold value t 0 , the determination result R 11A becomes “OK”. Therefore, the worker can determine that the movement time t 11A is set exactly in order to obtain the processing amount required to use the inspection device 1000.

又，於圖17所示之狀態下，移動時間t11A為1.5[s]。該情形時，移動時間t11A偏離閾值t0之範圍，故而判定結果R11A成為「NG」。因此，作業人員能夠判斷未恰好地設定移動時間t11A，需要進行移動時間t11A之變更。再者，於移動時間顯示欄1035，顯示有移動時間t11A過晚之意旨之「LDR HIGH is Too Slow」。 In the state shown in FIG. 17, the moving time t 11A is 1.5 [s]. In this case, since the movement time t 11A deviates from the range of the threshold value t 0 , the determination result R 11A becomes "NG". Therefore, the operator can determine that the moving time t 11A has not been set properly, and it is necessary to change the moving time t 11A . Further, in the moving time display column 1035, "LDR HIGH is Too Slow" indicating that the moving time t 11A is too late is displayed.

於圖18所示之狀態下，移動時間t11A為1.1[s]。該情形時，移動時間t11A亦偏離閾值t0之範圍，故而判定結果R11A成為「NG」。因此，作業人員能夠判斷未恰好地設定移動時間t11A，需要進行移動時間t11A之變更。再者，於移動時間顯示欄1035顯示有移動時間t11A過早之意旨之「LDR HIGH is Too Fast」。 In the state shown in FIG. 18, the moving time t 11A is 1.1 [s]. In this case, the movement time t 11A also deviates from the range of the threshold value t 0 , so the determination result R 11A becomes "NG". Therefore, the operator can determine that the moving time t 11A has not been set properly, and it is necessary to change the moving time t 11A . Furthermore, "LDR HIGH is Too Fast", which means that the moving time t 11A is too early, is displayed in the moving time display column 1035.

如上所述，存在需要進行移動時間t11A之變更之情況。對用以變更該移動時間t11A之構成進行說明。 As described above, there is a case where it is necessary to change the moving time t 11A . A configuration for changing the moving time t 11A will be described.

如圖19所示，於檢查裝置1000之正面側，設置有具有作為能夠變更移動時間t11A之移動時間變更部之變更用柄(第1變更用柄)1051之面板1005。再者，如圖12所示，於覆蓋檢查裝置1000之正面側之前外殼1070，設置有能夠開閉地設置之門1701。藉由敞開該門1701，能夠使面板1005露出，從而對該面板1005進行操作。 As shown in FIG. 19, on the front side of the inspection device 1000, a panel 1005 having a change handle (first change handle) 1051 as a moving time changing section capable of changing the moving time t 11A is provided. Further, as shown in FIG. 12, a door 1701 that can be opened and closed is provided on the housing 1070 before covering the front side of the inspection device 1000. By opening the door 1701, the panel 1005 can be exposed, and the panel 1005 can be operated.

於該變更用柄1051存在沿X方向排列配置之低速用柄1511及高速用柄1512。低速用柄1511與高速用柄1512係用以使托盤搬送機構1011A之移動速度於低速模式與高速模式之2個不同移動速度範圍內變更，而進行移動時間t11A之變更者。再者，操作低速用柄1511或高速用柄1512後之值例如亦能夠反映於圖16~圖18所示之維護表單1003。 The changing handle 1051 includes a low-speed handle 1511 and a high-speed handle 1512 arranged in the X direction. The low-speed handle 1511 and the high-speed handle 1512 are used to change the moving speed of the tray conveying mechanism 1011A within two different moving speed ranges of the low speed mode and the high speed mode, and change the moving time t 11A . In addition, the value after the low-speed handle 1511 or the high-speed handle 1512 is operated can be reflected in, for example, the maintenance sheet 1003 shown in FIGS. 16 to 18.

作為托盤搬送機構1011A之於低速模式下之移動速度範圍，並無特別限定，例如較佳為5mm/s以上且20mm/s以下，更佳為10mm/s以上且15mm/s以下。低速用柄1511係於該範圍內變更移動時間t11A之低 速模式用移動時間變更部。 The movement speed range of the tray conveyance mechanism 1011A in the low speed mode is not particularly limited, but it is preferably 5 mm / s or more and 20 mm / s or less, more preferably 10 mm / s or more and 15 mm / s or less. The low-speed lever 1511 is a low-speed mode moving time changing unit that changes the moving time t 11A within this range.

又，作為托盤搬送機構1011A之於高速模式下之移動速度範圍，並無特別限定，例如較佳為100mm/s以上且300mm/s以下，更佳為150mm/s以上且250mm/s以下。高速用柄1512係於該範圍內變更移動時間t11A之高速模式用移動時間變更部。 The moving speed range of the tray conveyance mechanism 1011A in the high-speed mode is not particularly limited. For example, it is preferably 100 mm / s or more and 300 mm / s or less, more preferably 150 mm / s or more and 250 mm / s or less. The high-speed handle 1512 is a high-speed mode moving time changing unit that changes the moving time t 11A within this range.

而且，當變更移動時間t11A時，能夠選擇低速用柄1511與高速用柄1512中之至少一個柄進行操作。再者，亦能夠以如下方式構成：與低速用柄1511或高速用柄1512之選擇操作連動(關連)地操作對應於該柄之按鈕1341a或按鈕1341b。 Further, when the moving time t 11A is changed, at least one of the low-speed handle 1511 and the high-speed handle 1512 can be selected and operated. Moreover, it can be comprised so that the button 1341a or button 1341b corresponding to the handle may be operated (linked) in conjunction with the selection operation of the low speed handle 1511 or the high speed handle 1512.

又，面板1005並不限定於如圖12所示般之配置部位，例如亦可配置於監視器1300之下側。該情形時，能夠一面視認監視器1300一面容易且準確地操作面板1005。 In addition, the panel 1005 is not limited to the arrangement position as shown in FIG. In this case, the panel 1005 can be easily and accurately operated while viewing the monitor 1300.

再者，如圖19所示，於面板1005，除變更用柄1051外，自+Z方向側朝-Z方向側沿Z軸依序配置有變更用柄(第2變更用柄)1052、變更用柄(第3變更用柄)1053、變更用柄(第4變更用柄)1054、變更用柄(第5變更用柄)1055、及變更用柄(第6變更用柄)1056。 In addition, as shown in FIG. 19, in the panel 1005, in addition to the change handle 1051, change handles (second change handles) 1052 are sequentially arranged along the Z axis from the + Z direction side to the -Z direction side. The handle (the third change handle) 1053, the change handle (the fourth change handle) 1054, the change handle (the fifth change handle) 1055, and the change handle (the sixth change handle) 1056.

變更用柄1052係能夠變更作為「ReLoader 1」之托盤搬送機構1011B之移動時間之移動時間變更部。該變更用柄1052亦存在用以使托盤搬送機構1011B之移動速度於低速模式與高速模式之2個不同移動速度範圍內變更，而進行移動時間之變更之低速用柄1521及高速用柄1522。 The changing handle 1052 is a moving time changing unit capable of changing the moving time of the tray conveyance mechanism 1011B as "ReLoader 1". The changing handle 1052 also includes a low-speed handle 1521 and a high-speed handle 1522 for changing the moving speed of the tray conveyance mechanism 1011B within two different moving speed ranges of the low-speed mode and the high-speed mode, and changing the moving time.

變更用柄1053係能夠變更作為「ReLoader 2」之托盤搬送機構1022B之移動時間之移動時間變更部。該變更用柄1053亦存在用以使托盤搬送機構1022B之移動速度於低速模式與高速模式之2個不同移動速度範圍內變更，而進行移動時間之變更之低速用柄1531及高速用柄1532。 The changing handle 1053 is a moving time changing unit capable of changing the moving time of the tray conveyance mechanism 1022B as "ReLoader 2". The changing handle 1053 also includes a low-speed handle 1531 and a high-speed handle 1532 for changing the moving speed of the tray conveyance mechanism 1022B within two different moving speed ranges of the low-speed mode and the high-speed mode, and changing the moving time.

變更用柄1054係能夠變更作為「UnLoader 1」之托盤搬送機構1022A之移動時間之移動時間變更部。該變更用柄1054亦存在用以使該托盤搬送機構1022A之移動速度於低速模式與高速模式之2個不同移動速度範圍內變更，而進行移動時間之變更之低速用柄1541及高速用柄1542。 The changing handle 1054 is a moving time changing unit capable of changing the moving time of the tray conveyance mechanism 1022A as "UnLoader 1." The changing handle 1054 also has a low-speed handle 1541 and a high-speed handle 1542 for changing the moving speed of the tray conveying mechanism 1022A within two different moving speed ranges of the low-speed mode and the high-speed mode, and changing the moving time. .

變更用柄1055係能夠變更作為「UnLoader 2」之托盤搬送機構1022A之移動時間之移動時間變更部。該變更用柄1055亦存在用以使該托盤搬送機構1022A之移動速度於低速模式與高速模式之2個不同移動速度範圍內變更，而進行移動時間之變更之低速用柄1551及高速用柄1552。 The changing handle 1055 is a moving time changing unit capable of changing the moving time of the tray conveyance mechanism 1022A as "UnLoader 2". The changing handle 1055 also has a low-speed handle 1551 and a high-speed handle 1552 for changing the moving speed of the tray conveying mechanism 1022A within two different moving speed ranges of the low-speed mode and the high-speed mode, and changing the moving time. .

變更用柄1056係能夠變更作為「UnLoader 3」之托盤搬送機構1022A之移動時間之移動時間變更部。該變更用柄1056亦存在用以使該托盤搬送機構1022A之移動速度於低速模式與高速模式之2個不同移動速度範圍內變更，而進行移動時間之變更之低速用柄1561及高速用柄1562。 The changing handle 1056 is a moving time changing unit capable of changing the moving time of the tray conveyance mechanism 1022A as "UnLoader 3." The changing handle 1056 also has a low-speed handle 1561 and a high-speed handle 1562 for changing the moving speed of the tray conveying mechanism 1022A within two different moving speed ranges of the low-speed mode and the high-speed mode, and changing the moving time. .

又，於面板1005標註有用以識別哪一「變更用柄」係變更哪一「托盤搬送機構」者之名稱「Loader」、「ReLoader 1」、「ReLoader 2」、「UnLoader 1」、「UnLoader 2」、「UnLoader 3」。 In addition, the names "Loader", "ReLoader 1", "ReLoader 2", "UnLoader 1", "UnLoader 2" are used to identify which "change handle" is used to identify which "pallet transfer mechanism" is changed on the panel 1005 "," UnLoader 3 ".

又，亦標註有用以識別「低速用柄」及「高速用柄」中之哪一個係「低速用柄」或「高速用柄」之名稱「Low」、「High」。 Also, the names "Low" and "High" are used to identify which of the "low-speed handle" and "high-speed handle" is "low-speed handle" or "high-speed handle".

圖19中之變更用柄1051~變更用柄1056除於面板1005上之配置部位不同以外係相同構成，故而代表性地對變更用柄1051進行說明。 The change handle 1051 to the change handle 1056 in FIG. 19 have the same configuration except that the arrangement positions on the panel 1005 are different. Therefore, the change handle 1051 will be representatively described.

如圖20所示，低速用柄1511(或高速用柄1512)係由自+Y方向觀察時呈圓形之構件構成，且係能夠以其中心O為旋動中心旋動地受支持之所謂之「轉盤式」之操作構件。 As shown in FIG. 20, the low-speed handle 1511 (or the high-speed handle 1512) is a so-called circular member when viewed from the + Y direction, and is a so-called support that can be rotated with its center O as the rotation center "Turntable" operating member.

如圖21所示，於低速用柄1511內置有可變電阻VR511，於高速用 柄1512內置有可變電阻VR512。可變電阻VR511之最大電阻值與可變電阻VR512之最小電阻值相同。 As shown in FIG. 21, a variable resistance VR 511 is built into the low-speed handle 1511, and a variable resistance VR 512 is built into the high-speed handle 1512. The maximum resistance of the variable resistor VR 511 is the same as the minimum resistance of the variable resistor VR 512 .

可變電阻VR511與可變電阻VR512於交流電源AC與自交流電源AC供給電力之托盤搬送機構1011A之馬達1115之間並聯連接。於交流電源AC與可變電阻VR511之間設置有開關SW511，於交流電源AC與可變電阻VR512之間設置有開關SW512。 The variable resistor VR 511 and the variable resistor VR 512 are connected in parallel between the AC power source AC and the motor 1115 of the tray transfer mechanism 1011A supplied with power from the AC power source AC. It is provided between the AC power source AC variable resistor VR 511 and a switch SW 511, provided between the AC power source AC variable resistor VR 512 and a switch SW 512.

於維護時，例如將開關SW511設為「ON」狀態，將低速用柄1511沿圖20中之順時針方向旋動操作，藉此可變電阻VR511之電阻值減少。隨著該電阻值之減少，供給至馬達1115之電力增加。藉此，托盤搬送機構1011A之移動速度亦增加，因此，能夠縮短移動時間t11A。另一方面，將開關SW511設為「ON」狀態，將低速用柄1511沿圖20中之逆時針方向旋動操作，藉此可變電阻VR511之電阻值增加。隨著該電阻值之增加，供給至馬達1115之電力減少。藉此，托盤搬送機構1011A之移動速度亦減少，因此，能夠延長移動時間t11A。 During maintenance, for example, the switch SW 511 is set to the “ON” state, and the low-speed handle 1511 is rotated in the clockwise direction in FIG. 20 to reduce the resistance value of the variable resistor VR 511 . As the resistance value decreases, the power supplied to the motor 1115 increases. Thereby, the moving speed of the tray conveyance mechanism 1011A also increases, and therefore, the moving time t 11A can be shortened. On the other hand, the switch SW 511 is set to the "ON" state, and the low-speed handle 1511 is rotated in the counterclockwise direction in FIG. 20 to increase the resistance value of the variable resistor VR 511 . As the resistance value increases, the power supplied to the motor 1115 decreases. Thereby, the moving speed of the tray conveyance mechanism 1011A is also reduced, and therefore, the moving time t 11A can be extended.

如此，藉由低速用柄1511之旋動操作，能夠使可變電阻VR511之電阻值變化，而進行移動時間t11A之變更。該情況於操作高速用柄1512時亦相同。而且，該變更於實際之IC器件90之通常之檢查時亦維持原本狀態。藉此，能夠準確地進行對托盤搬送機構1011A之動作變更，維護性優異。 In this way, by rotating the low-speed handle 1511, the resistance value of the variable resistor VR 511 can be changed, and the movement time t 11A can be changed. This is the same when the high-speed handle 1512 is operated. This change is maintained in the original state during the normal inspection of the actual IC device 90. Thereby, the operation | movement of the tray conveyance mechanism 1011A can be changed accurately, and it is excellent in maintainability.

再者，如上所述，可變電阻VR511之最大電阻值與可變電阻VR512之最小電阻值相同。該情形時，於低速模式下之移動速度與於高速模式下之移動速度變得相同。 Furthermore, as described above, the maximum resistance value of the variable resistor VR 511 is the same as the minimum resistance value of the variable resistor VR 512 . In this case, the moving speed in the low speed mode becomes the same as the moving speed in the high speed mode.

如圖20所示，於低速用柄1511(或高速用柄1512)之周圍附有0~10之刻度。藉由將低速用柄1511(或高速用柄1512)之標記1513與各刻度重合，能夠階段性地變更移動時間t11A。藉此，能夠消除進行維護之作業人員之個人差異。 As shown in FIG. 20, a scale of 0 to 10 is attached around the low speed handle 1511 (or the high speed handle 1512). By overlapping the mark 1513 of the low-speed handle 1511 (or the high-speed handle 1512) with each scale, the moving time t 11A can be changed in stages. As a result, it is possible to eliminate individual differences among maintenance personnel.

又，開關SW511及開關SW512之ON/OFF之切換係藉由控制部1080而控制。該ON/OFF切換時點係基於圖14A所示之第1感測器1116之檢測結果而進行。再者，托盤搬送機構1011A於動作開始時設定為高速模式，於中途切換至低速模式，並在維持該低速模式之狀態下停止(參照圖22)。 The ON / OFF switching of the switches SW 511 and SW 512 is controlled by the control unit 1080. This ON / OFF switching timing is performed based on the detection result of the first sensor 1116 shown in FIG. 14A. In addition, the tray transport mechanism 1011A is set to the high-speed mode at the start of the operation, switches to the low-speed mode halfway, and stops while maintaining the low-speed mode (see FIG. 22).

如圖14A所示，第1感測器1116具有於俯視下介隔2條傳送帶1113於X方向上相隔而對向配置之發光部1116a及受光部1116b。自發光部1116a發出之光L116於受光部1116b被接收，但當自托盤供給區域B1進入至供給區域B2之托盤200介存於發光部1116a與受光部1116b之間時，該光L116被該托盤200遮斷。而且，於檢測到該遮光之情形時，托盤搬送機構1011A自高速模式切換至低速模式，即，開關SW512變成OFF，開關SW511變成ON。 As shown in FIG. 14A, the first sensor 1116 includes a light-emitting portion 1116a and a light-receiving portion 1116b which are arranged to face each other with two conveyor belts 1113 spaced apart in the X direction in a plan view. The light L 116 emitted from the light-emitting portion 1116a is received at the light-receiving portion 1116b. However, when the tray 200 entering from the tray supply area B1 to the supply area B2 is interposed between the light-emitting portion 1116a and the light-receiving portion 1116b, the light L 116 is The tray 200 is blocked. When detecting the light-shielding situation, the tray transport mechanism 1011A switches from the high-speed mode to the low-speed mode, that is, the switch SW 512 is turned OFF and the switch SW 511 is turned ON.

其後，托盤搬送機構1011A於低速模式下動作，其動作停止之時點係基於圖14A所示之第2感測器1117之檢測結果而進行。 Thereafter, the tray conveyance mechanism 1011A operates in the low speed mode, and the point at which the operation is stopped is performed based on the detection result of the second sensor 1117 shown in FIG. 14A.

如圖14A所示，第2感測器1117位於在俯視下較第1感測器1116更靠托盤200之搬送方向前方。該第2感測器1117具有於俯視下介隔2條傳送帶1113於X方向上相隔而對向配置之發光部1117a及受光部1117b。自發光部1117a發出之光L117於受光部1117b被接收，但當托盤200快要抵接至擋塊1114(例如2~5mm近前)時，光L117被該托盤200遮斷(遮光)。而且，於檢測到該遮光之情形時，開關SW511變成OFF，停止對馬達1115供給電力。藉此，托盤搬送機構1011A之動作停止，即，移動之托盤200停止。此時，托盤200能夠儘可能以低速抵接至擋塊1114。藉此，能夠防止因托盤200與擋塊1114之碰撞，而使托盤200上之IC器件90飛出。 As shown in FIG. 14A, the second sensor 1117 is located further forward than the first sensor 1116 in the conveyance direction of the tray 200 in a plan view. The second sensor 1117 includes a light-emitting portion 1117a and a light-receiving portion 1117b which are arranged to face each other with two conveyor belts 1113 spaced apart in the X direction in a plan view. The light L 117 emitted from the light-emitting portion 1117a is received by the light-receiving portion 1117b, but when the tray 200 is about to abut the stopper 1114 (for example, 2 to 5 mm near), the light L 117 is blocked (shielded) by the tray 200. When the light-shielding condition is detected, the switch SW 511 is turned off, and the power supply to the motor 1115 is stopped. Thereby, the operation of the tray conveyance mechanism 1011A stops, that is, the moving tray 200 stops. At this time, the tray 200 can abut against the stopper 1114 at a low speed as much as possible. This can prevent the IC device 90 on the tray 200 from flying out due to the collision between the tray 200 and the stopper 1114.

以上，作為對移動部之維護，代表性地說明了對托盤搬送機構1011A之維護，但針對托盤搬送機構1011B、器件供給部1014、托盤 搬送機構1015、器件回收部1018、托盤搬送機構1022A、托盤搬送機構1022B，亦能夠與托盤搬送機構1011A同樣地進行維護。 As mentioned above, the maintenance of the moving part has been described as representative of the maintenance of the tray conveyance mechanism 1011A. However, the tray conveyance mechanism 1011B, the device supply unit 1014, and the tray The transfer mechanism 1015, the device recovery unit 1018, the tray transfer mechanism 1022A, and the tray transfer mechanism 1022B can also be maintained in the same manner as the tray transfer mechanism 1011A.

以上，基於較佳之實施形態，對本發明之電子零件搬送裝置及電子零件檢查裝置進行了說明，但本發明並不限定於此，各部之構成能夠置換成具有相同功能之任意之構成者。又，亦可附加其他任意之構成物。 The electronic component transfer device and the electronic component inspection device of the present invention have been described based on the preferred embodiments, but the present invention is not limited to this, and the configuration of each part can be replaced with an arbitrary configuration having the same function. Moreover, you may add another arbitrary structure.

於上述第1實施形態中，設定顯示部60具備操作裝置50及顯示裝置40，但例如亦可為操作裝置與顯示裝置成為一體之構成。作為操作裝置與顯示裝置成為一體之構成，例如可列舉顯示裝置所具有之監視器成為觸控面板之構成。 In the first embodiment described above, the setting display unit 60 includes the operation device 50 and the display device 40. However, for example, the operation device and the display device may be integrated. As a configuration in which the operation device and the display device are integrated, for example, a configuration in which a monitor included in the display device is a touch panel can be cited.

再者，於按鈕群107中，關於除上述所說明之按鈕以外之按鈕，亦與上述同樣地，能夠切換至新視窗，能夠操作電子零件搬送裝置10之各部，或顯示作動狀態。 In addition, in the button group 107, buttons other than the buttons described above can be switched to a new window in the same manner as described above, and each part of the electronic component transporting device 10 can be operated, or an operating state can be displayed.

又，於上述第2實施形態中，能夠變更移動部之移動時間之移動時間變更部包含低速模式用移動時間變更部與高速模式用移動時間變更部之2種變更部，但並不限定於此，亦可包含1種或3種以上之變更部。 Furthermore, in the second embodiment described above, the moving time changing section capable of changing the moving time of the moving section includes two types of changing sections for the low-speed mode moving time changing section and the high-speed mode moving time changing section, but it is not limited to this. It may include one or three or more types of change sections.

Claims (16)

一種電子零件搬送裝置，其特徵在於具有：複數個作動部；操作部，其能夠操作上述複數個作動部中之至少1個作動部；及作動部資訊部，其顯示利用上述操作部所操作之上述作動部。An electronic parts conveying device, comprising: a plurality of actuating sections; an operation section capable of operating at least one of the plurality of actuating sections; and an actuating section information section that displays the operations performed by the operation section. The above moving part. 一種電子零件搬送裝置，其特徵在於具有：複數個作動部；第1操作部，其能夠操作上述複數個作動部中之至少1個作動部；顯示部，其顯示上述第1操作部；第2操作部，其將上述第1操作部顯示於上述顯示部。An electronic component conveying device, comprising: a plurality of operating units; a first operating unit capable of operating at least one of the plurality of operating units; a display unit displaying the first operating unit; a second operating unit; An operation unit that displays the first operation unit on the display unit. 如請求項1或2之電子零件搬送裝置，其中上述操作部能夠各自獨立地操作上述複數個作動部。For example, the electronic component transfer device of claim 1 or 2, wherein the operation unit can independently operate the plurality of operation units. 如請求項1或2之電子零件搬送裝置，其中上述作動部係能夠開閉之擋板。For example, the electronic component transfer device of claim 1 or 2, wherein the above-mentioned operating part is a shutter capable of being opened and closed. 如請求項1或2之電子零件搬送裝置，其具有顯示上述操作部之顯示部。If the electronic component transfer device of claim 1 or 2 is provided, it has a display part which displays the said operation part. 如請求項5之電子零件搬送裝置，其中上述顯示部顯示作動部之作動狀態。For example, the electronic component conveying device according to claim 5, wherein the display section displays an operating state of the operating section. 如請求項1或2之電子零件搬送裝置，其中上述操作部係於上述作動部之動作確認時顯示。For example, if the electronic component transfer device of item 1 or 2 is requested, the operation part is displayed when the operation of the operation part is confirmed. 如請求項5之電子零件搬送裝置，其中上述顯示部具有進行使上述作動部作動之指示之操作按鈕。In the electronic component transfer device according to claim 5, the display unit has an operation button for instructing the operating unit to operate. 如請求項8之電子零件搬送裝置，其中上述操作按鈕係以矩形顯示。For example, the electronic component transfer device of claim 8, wherein the operation buttons are displayed in a rectangle. 如請求項8之電子零件搬送裝置，其中上述操作按鈕係發光者，當操作上述操作按鈕而將上述作動部設為作動狀態時，亮度增加。For example, the electronic component conveying device according to claim 8, wherein the operation button is a light-emitting person, and when the operation button is operated to set the operating portion to an operating state, the brightness increases. 如請求項5之電子零件搬送裝置，其中上述顯示部具有顯示上述作動部是否為作動狀態之作動狀態顯示部。For example, the electronic component conveying device according to claim 5, wherein the display unit includes an operating state display unit that displays whether the operating unit is in an operating state. 如請求項11之電子零件搬送裝置，其中上述作動狀態顯示部係以圓形顯示。For example, the electronic component conveying device according to claim 11, wherein the operation state display unit is displayed in a circle. 如請求項11之電子零件搬送裝置，其中上述作動狀態顯示部係發光者，於上述作動狀態時，亮度增加。For example, the electronic component conveying device according to claim 11, wherein the above-mentioned operating state display unit is a light-emitting person, and the brightness is increased during the above-mentioned operating state. 如請求項8之電子零件搬送裝置，其中上述顯示部具有顯示上述作動部是否為作動狀態之作動狀態顯示部；且於上述顯示部中，上述操作按鈕及上述作動狀態顯示部之至少中心部之明暗會變化。For example, the electronic component transfer device of claim 8, wherein the display section has an operation state display section that displays whether the operation section is in an operation state; and in the display section, at least a central part of the operation button and the operation state display section Light and shade will change. 一種電子零件檢查裝置，其特徵在於具有：複數個作動部；操作部，其能夠操作上述複數個作動部中之至少1個作動部；作動部資訊部，其顯示利用上述操作部所操作之上述作動部；及檢查部，其檢查電子零件。An electronic component inspection device, comprising: a plurality of actuating sections; an operating section capable of operating at least one of the plurality of actuating sections; and an actuating section information section that displays the above operated by the operating section. An operating unit; and an inspection unit that inspects electronic parts. 一種電子零件檢查裝置，其特徵在於具有：複數個作動部；第1操作部，其能夠操作上述複數個作動部中之至少1個作動部；顯示部，其顯示上述第1操作部；第2操作部，其將上述第1操作部顯示於上述顯示部；及檢查部，其檢查電子零件。An electronic component inspection device, comprising: a plurality of operating units; a first operating unit capable of operating at least one of the plurality of operating units; a display unit displaying the first operating unit; a second operating unit; An operation unit that displays the first operation unit on the display unit; and an inspection unit that inspects electronic components.
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