TWI599462B - Hold the connector - Google Patents
Hold the connector Download PDFInfo
- Publication number
- TWI599462B TWI599462B TW105138549A TW105138549A TWI599462B TW I599462 B TWI599462 B TW I599462B TW 105138549 A TW105138549 A TW 105138549A TW 105138549 A TW105138549 A TW 105138549A TW I599462 B TWI599462 B TW I599462B
- Authority
- TW
- Taiwan
- Prior art keywords
- holder
- opening hole
- flat surfaces
- joint
- mounting portion
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
- B26D7/2614—Means for mounting the cutting member
- B26D7/2621—Means for mounting the cutting member for circular cutters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015255604A JP6668749B2 (ja) | 2015-12-28 | 2015-12-28 | ホルダジョイント |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201722667A TW201722667A (zh) | 2017-07-01 |
TWI599462B true TWI599462B (zh) | 2017-09-21 |
Family
ID=59271589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105138549A TWI599462B (zh) | 2015-12-28 | 2016-11-24 | Hold the connector |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6668749B2 (ja) |
KR (1) | KR101895778B1 (ja) |
CN (1) | CN106914994A (ja) |
TW (1) | TWI599462B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019188649A (ja) | 2018-04-20 | 2019-10-31 | 三星ダイヤモンド工業株式会社 | ホルダユニット |
CN110405954B (zh) * | 2018-04-27 | 2022-10-21 | 三星钻石工业股份有限公司 | 保持器单元及销 |
JP7209349B2 (ja) | 2018-04-27 | 2023-01-20 | 三星ダイヤモンド工業株式会社 | ホルダユニットおよびピン |
JP2019209506A (ja) | 2018-05-31 | 2019-12-12 | 三星ダイヤモンド工業株式会社 | ホルダユニットおよびスクライブ方法 |
JP7357892B2 (ja) * | 2018-12-27 | 2023-10-10 | 三星ダイヤモンド工業株式会社 | ホルダジョイント、ホルダユニット、およびスクライブ装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4948725B2 (ja) * | 2000-12-05 | 2012-06-06 | 三星ダイヤモンド工業株式会社 | チップホルダー |
JP2003071789A (ja) * | 2001-08-30 | 2003-03-12 | Honda Electronic Co Ltd | 超音波カッター |
CN102992606B (zh) * | 2005-12-01 | 2015-06-24 | 三星钻石工业股份有限公司 | 划线装置的刀片架安装结构体 |
KR101190649B1 (ko) * | 2007-06-06 | 2012-10-15 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 스크라이브 방법 및 팁 홀더 교환 방법 |
JP5353085B2 (ja) * | 2008-06-23 | 2013-11-27 | 三星ダイヤモンド工業株式会社 | ホルダジョイント、ホルダユニット、スクライブヘッド及びスクライブ装置 |
KR20120052007A (ko) * | 2010-11-15 | 2012-05-23 | 신한다이아몬드공업 주식회사 | 스크라이버 홀더 |
JP5447994B2 (ja) | 2011-07-25 | 2014-03-19 | 三星ダイヤモンド工業株式会社 | ホルダジョイント、スクライブヘッド及びスクライブ装置 |
JP5906148B2 (ja) * | 2012-06-29 | 2016-04-20 | 三星ダイヤモンド工業株式会社 | チップホルダ収納体 |
JP2014008711A (ja) * | 2012-06-29 | 2014-01-20 | Mitsuboshi Diamond Industrial Co Ltd | チップホルダ及びチップホルダ収納セット |
JP2014008714A (ja) * | 2012-06-29 | 2014-01-20 | Mitsuboshi Diamond Industrial Co Ltd | チップホルダ収納体 |
CN104129912A (zh) * | 2014-07-29 | 2014-11-05 | 北京沃尔德超硬工具有限公司 | 一种易于拆卸的防尘刀轮 |
-
2015
- 2015-12-28 JP JP2015255604A patent/JP6668749B2/ja active Active
-
2016
- 2016-11-24 TW TW105138549A patent/TWI599462B/zh active
- 2016-12-13 KR KR1020160169511A patent/KR101895778B1/ko active IP Right Grant
- 2016-12-16 CN CN201611170308.6A patent/CN106914994A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
JP6668749B2 (ja) | 2020-03-18 |
KR20170077789A (ko) | 2017-07-06 |
TW201722667A (zh) | 2017-07-01 |
CN106914994A (zh) | 2017-07-04 |
JP2017119348A (ja) | 2017-07-06 |
KR101895778B1 (ko) | 2018-09-07 |
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