TWI562272B - - Google Patents

Info

Publication number: TWI562272B
Authority: TW; Taiwan

Application number

TW102111947A

Other languages

Chinese (zh)

Other versions

TW201407713A (en

Inventor

Naohiro Kuroda

Kinya Ota

Original Assignee

Mitsuboshi Diamond Ind Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2012-08-01

Filing date

2013-04-02

Publication date

2016-12-11

2013-04-02 Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd

2014-02-16 Publication of TW201407713A publication Critical patent/TW201407713A/en

2016-12-11 Application granted granted Critical

2016-12-11 Publication of TWI562272B publication Critical patent/TWI562272B/zh

Links

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/009—Gripping heads and other end effectors with pins for accurately positioning the object on the gripping head
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/08—Gripping heads and other end effectors having finger members
- B25J15/083—Gripping heads and other end effectors having finger members with means for locking the fingers in an open or closed position
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

Engineering & Computer Science (AREA)
Robotics (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Mechanical Engineering (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Packaging Frangible Articles (AREA)
Dicing (AREA)

TW102111947A 2012-08-01 2013-04-02 Holding mechanism of substrate retaining ring TW201407713A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2012170964A JP6024267B2 (en)	2012-08-01	2012-08-01	Substrate holding ring gripping mechanism

Publications (2)

Publication Number	Publication Date
TW201407713A TW201407713A (en)	2014-02-16
TWI562272B true TWI562272B (en)	2016-12-11

Family

ID=50050560

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW102111947A TW201407713A (en)	2012-08-01	2013-04-02	Holding mechanism of substrate retaining ring

Country Status (4)

Country	Link
JP (1)	JP6024267B2 (en)
KR (1)	KR101829081B1 (en)
CN (1)	CN103579070B (en)
TW (1)	TW201407713A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP6630591B2 (en) *	2016-02-26	2020-01-15	川崎重工業株式会社	Substrate gripping hand and substrate transfer device
JP6804146B2 (en) *	2016-11-10	2020-12-23	株式会社ディスコ	Transport equipment, processing equipment and transport method
CN108796466B (en) *	2017-04-26	2020-06-19	北京北方华创微电子装备有限公司	Mechanical chuck and semiconductor processing equipment
CN108748245A (en) *	2018-06-01	2018-11-06	陕西科技大学	A kind of robotic paw with self-locking function
CN110172667B (en) *	2019-06-20	2021-06-01	深圳市华星光电半导体显示技术有限公司	Clamping device applied to sputtering equipment and sputtering equipment
CN114274387B (en) *	2022-01-06	2022-07-05	沈阳和研科技有限公司	Wafer ring removing machine

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH07144751A (en) *	1993-11-26	1995-06-06	Toshiba Seiki Kk	Article carrying device
TW200527987A (en) *	2003-10-24	2005-08-16	Matsushita Electric Ind Co Ltd	Electronic component mounting apparatus and electronic component mounting method
TW200737372A (en) *	2006-03-20	2007-10-01	Top Eng Co Ltd	Chip supply unit loading device
CN102194732A (en) *	2010-02-02	2011-09-21	株式会社迪思科	Holding method and holding mechanism for work piece unit

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH01315157A (en) *	1988-02-29	1989-12-20	Tel Sagami Ltd	Holding apparatus for sheet-like body
US4955649A (en) *	1988-02-29	1990-09-11	Tel Sagami Limited	Apparatus for holding plates
JPH01257347A (en) *	1988-04-07	1989-10-13	Toshiba Corp	Gripping apparatus
JPH0241439U (en) *	1988-09-13	1990-03-22
JP2825101B2 (en) *	1990-05-25	1998-11-18	富士通株式会社	Wafer frame moving device
JP5010095B2 (en)	2004-04-20	2012-08-29	株式会社東芝	Laser diode transfer device and transfer method
JP4806282B2 (en) *	2006-03-29	2011-11-02	株式会社ディスコ	Wafer processing equipment
JP2007281095A (en)	2006-04-04	2007-10-25	Tokyo Seimitsu Co Ltd	Workpiece carrying device
JP4511605B2 (en) *	2008-02-27	2010-07-28	タツモ株式会社	Transfer robot
JP5174570B2 (en)	2008-07-24	2013-04-03	Ｊｕｋｉ株式会社	Parts supply device
JP2011086650A (en) *	2009-10-13	2011-04-28	Fujitsu Semiconductor Ltd	Carrier, method of carrying object to be carried, and method of manufacturing semiconductor device
JP2011135026A (en) *	2009-11-27	2011-07-07	Disco Abrasive Syst Ltd	Holding method and holding mechanism for work unit
JP2012119489A (en) *	2010-11-30	2012-06-21	Takata Corp	Mounting table apparatus for processing object

2012
- 2012-08-01 JP JP2012170964A patent/JP6024267B2/en active Active
2013
- 2013-04-02 TW TW102111947A patent/TW201407713A/en unknown
- 2013-06-11 KR KR1020130066561A patent/KR101829081B1/en active IP Right Grant
- 2013-06-26 CN CN201310259471.XA patent/CN103579070B/en not_active Expired - Fee Related

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH07144751A (en) *	1993-11-26	1995-06-06	Toshiba Seiki Kk	Article carrying device
TW200527987A (en) *	2003-10-24	2005-08-16	Matsushita Electric Ind Co Ltd	Electronic component mounting apparatus and electronic component mounting method
TW200737372A (en) *	2006-03-20	2007-10-01	Top Eng Co Ltd	Chip supply unit loading device
CN102194732A (en) *	2010-02-02	2011-09-21	株式会社迪思科	Holding method and holding mechanism for work piece unit

Also Published As

Publication number	Publication date
TW201407713A (en)	2014-02-16
KR101829081B1 (en)	2018-03-29
JP6024267B2 (en)	2016-11-16
JP2014032992A (en)	2014-02-20
KR20140018783A (en)	2014-02-13
CN103579070A (en)	2014-02-12
CN103579070B (en)	2017-07-25

Publication	Publication Date	Title
BR112014017635A2 (en)	2017-06-20
BR112014017614A2 (en)	2017-06-20
BR112015011478A2 (en)	2017-08-15
BR112014017592A2 (en)	2017-06-20
BR112014017625A2 (en)	2017-06-20
BR112014024032A2 (en)	2017-06-20
BR112014017744A2 (en)	2017-06-20
BR112014017646A2 (en)	2017-06-20
AR092201A1 (en)	2015-04-08
BR112014017638A2 (en)	2017-06-20
BR112014017607A2 (en)	2017-06-20
BR112013027865A2 (en)	2017-01-03
BR112014017609A2 (en)	2017-06-20
BR112014017644A2 (en)	2017-06-20
BR112014017647A2 (en)	2017-06-20
BR112014017588A2 (en)	2017-06-20
BR112014017618A2 (en)	2017-06-20
BR112014013184A8 (en)	2017-06-27
BR112014017621A2 (en)	2017-06-20
BR112014017622A2 (en)	2017-06-20
BR112014017627A2 (en)	2017-06-20
BR112014017623A2 (en)	2017-06-20
BR112014017641A2 (en)	2017-06-20
BR112014017636A2 (en)	2017-06-20
TWI562272B (en)	2016-12-11