TW200737372A - Chip supply unit loading device - Google Patents
Chip supply unit loading deviceInfo
- Publication number
- TW200737372A TW200737372A TW095141946A TW95141946A TW200737372A TW 200737372 A TW200737372 A TW 200737372A TW 095141946 A TW095141946 A TW 095141946A TW 95141946 A TW95141946 A TW 95141946A TW 200737372 A TW200737372 A TW 200737372A
- Authority
- TW
- Taiwan
- Prior art keywords
- supply unit
- chip supply
- unit
- loading device
- loaded
- Prior art date
Links
Classifications
-
- E—FIXED CONSTRUCTIONS
- E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
- E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
- E06B9/00—Screening or protective devices for wall or similar openings, with or without operating or securing mechanisms; Closures of similar construction
- E06B9/24—Screens or other constructions affording protection against light, especially against sunshine; Similar screens for privacy or appearance; Slat blinds
- E06B9/26—Lamellar or like blinds, e.g. venetian blinds
- E06B9/36—Lamellar or like blinds, e.g. venetian blinds with vertical lamellae ; Supporting rails therefor
-
- E—FIXED CONSTRUCTIONS
- E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
- E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
- E06B9/00—Screening or protective devices for wall or similar openings, with or without operating or securing mechanisms; Closures of similar construction
- E06B9/56—Operating, guiding or securing devices or arrangements for roll-type closures; Spring drums; Tape drums; Counterweighting arrangements therefor
- E06B9/78—Operating, guiding or securing devices or arrangements for roll-type closures; Spring drums; Tape drums; Counterweighting arrangements therefor for direct manual operation, e.g. by tassels, by handles
Landscapes
- Engineering & Computer Science (AREA)
- Structural Engineering (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Abstract
A chip supply unit loading device includes a transfer unit mounted at a frame, a transfer arm reciprocable by the transfer unit, and a clamping unit mounted at the transfer arm and reciprocated with the transfer arm, for loading/unloading a chip supply unit onto/from a table while linear contacting therewith. Accordingly, a chip supply unit loaded in a cassette unit can be rapidly and stably loaded onto the table, and the chip supply unit loaded onto the table can be rapidly and stably re-loaded into the cassette unit. Accordingly, the chip supply unit is prevented from being damaged while being transferred, thereby minimizing defects during a bonding process and shortening a bonding process time.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020060025469A KR20070095148A (en) | 2006-03-20 | 2006-03-20 | Chip supplying unit loading device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200737372A true TW200737372A (en) | 2007-10-01 |
| TWI320211B TWI320211B (en) | 2010-02-01 |
Family
ID=38632568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095141946A TWI320211B (en) | 2006-03-20 | 2006-11-13 | Chip supply unit loading device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2007258674A (en) |
| KR (1) | KR20070095148A (en) |
| CN (1) | CN100547756C (en) |
| TW (1) | TWI320211B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI562272B (en) * | 2012-08-01 | 2016-12-11 | Mitsuboshi Diamond Ind Co Ltd |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8215473B2 (en) * | 2008-05-21 | 2012-07-10 | Applied Materials, Inc. | Next generation screen printing system |
| KR101017522B1 (en) * | 2009-03-10 | 2011-02-28 | 에이시디(주) | Structure for arranging bonding head of chip on glass bonding apparatus |
| JP2011035281A (en) * | 2009-08-05 | 2011-02-17 | Disco Abrasive Syst Ltd | Workpiece storage mechanism and grinding device |
| JP5473691B2 (en) * | 2010-03-16 | 2014-04-16 | 株式会社ディスコ | Containment cassette |
| JP5681009B2 (en) * | 2011-03-23 | 2015-03-04 | 東レエンジニアリング株式会社 | Gripping hand |
| CN102723302B (en) * | 2012-04-23 | 2014-08-20 | 吴周令 | Fully-automatic loading and unloading device used in processing semiconductor chips by laser and application method thereof |
| CN102983095B (en) * | 2012-11-30 | 2015-12-02 | 芜湖致通汽车电子有限公司 | A kind of wafer gets frock and the using method thereof of chip |
| KR102615166B1 (en) * | 2016-01-07 | 2023-12-18 | (주)제이티 | Trasfer Tool |
| KR102575958B1 (en) * | 2018-10-30 | 2023-09-07 | 세메스 주식회사 | Apparatus for transferring wafer ring |
| KR102575962B1 (en) * | 2018-11-01 | 2023-09-07 | 세메스 주식회사 | Apparatus for transferring wafer ring |
| CN109719706B (en) * | 2019-01-11 | 2020-10-02 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Substrate unloading manipulator and substrate processing system |
| JP7274350B2 (en) * | 2019-05-28 | 2023-05-16 | 東京エレクトロン株式会社 | Conveyance system, inspection system and inspection method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3516066B2 (en) * | 1993-11-26 | 2004-04-05 | 芝浦メカトロニクス株式会社 | Article transfer device |
-
2006
- 2006-03-20 KR KR1020060025469A patent/KR20070095148A/en not_active Application Discontinuation
- 2006-11-13 TW TW095141946A patent/TWI320211B/en not_active IP Right Cessation
- 2006-12-01 CN CNB200610160907XA patent/CN100547756C/en not_active Expired - Fee Related
- 2006-12-07 JP JP2006330768A patent/JP2007258674A/en not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI562272B (en) * | 2012-08-01 | 2016-12-11 | Mitsuboshi Diamond Ind Co Ltd |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007258674A (en) | 2007-10-04 |
| CN101034678A (en) | 2007-09-12 |
| KR20070095148A (en) | 2007-09-28 |
| TWI320211B (en) | 2010-02-01 |
| CN100547756C (en) | 2009-10-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |