TWI521040B - Method of cutting off hot peeling adhesive tape and electronic parts - Google Patents

Method of cutting off hot peeling adhesive tape and electronic parts Download PDF

Info

Publication number
TWI521040B
TWI521040B TW103116746A TW103116746A TWI521040B TW I521040 B TWI521040 B TW I521040B TW 103116746 A TW103116746 A TW 103116746A TW 103116746 A TW103116746 A TW 103116746A TW I521040 B TWI521040 B TW I521040B
Authority
TW
Taiwan
Prior art keywords
heat
adhesive
adhesive layer
sensitive adhesive
expandable
Prior art date
Application number
TW103116746A
Other languages
English (en)
Chinese (zh)
Other versions
TW201514271A (zh
Inventor
Kazuhiro Kitayama
Daisuke Shimokawa
Takamasa Hirayama
Kazuki Soejima
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW201514271A publication Critical patent/TW201514271A/zh
Application granted granted Critical
Publication of TWI521040B publication Critical patent/TWI521040B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2421/00—Presence of unspecified rubber
    • C09J2421/006—Presence of unspecified rubber in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
TW103116746A 2013-07-19 2014-05-12 Method of cutting off hot peeling adhesive tape and electronic parts TWI521040B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013151139A JP5778721B2 (ja) 2013-07-19 2013-07-19 熱剥離型粘着テープ及び電子部品の切断方法

Publications (2)

Publication Number Publication Date
TW201514271A TW201514271A (zh) 2015-04-16
TWI521040B true TWI521040B (zh) 2016-02-11

Family

ID=51803586

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103116746A TWI521040B (zh) 2013-07-19 2014-05-12 Method of cutting off hot peeling adhesive tape and electronic parts

Country Status (4)

Country Link
JP (1) JP5778721B2 (ko)
KR (1) KR101492371B1 (ko)
CN (1) CN104130723A (ko)
TW (1) TWI521040B (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6448333B2 (ja) * 2014-12-02 2019-01-09 日東電工株式会社 粘着シート
CN107683315A (zh) * 2015-12-21 2018-02-09 积水化学工业株式会社 粘合剂组合物和粘合带
KR102313586B1 (ko) * 2016-03-30 2021-10-15 린텍 가부시키가이샤 반도체 가공용 시트
CN106433506A (zh) * 2016-11-07 2017-02-22 苏州旭泽新材料科技有限公司 一种加热减粘保护膜及其制备方法
JP7169247B2 (ja) * 2019-04-26 2022-11-10 シャープ株式会社 Ｌｅｄ光源基板及び照明装置
WO2020250848A1 (ja) * 2019-06-12 2020-12-17 ニッタ株式会社 感温性粘着剤
CN110205043B (zh) * 2019-06-21 2021-07-16 广东硕成科技有限公司 一种半导体材料加工用切割胶带及其制备方法
JP6807492B1 (ja) * 2020-03-27 2021-01-06 株式会社寺岡製作所 熱剥離型粘着テープ
CN112358822A (zh) * 2020-10-27 2021-02-12 江苏皇冠新材料科技有限公司 一种用于动力电池bms的泡棉胶带及电池模组
JP2023039829A (ja) * 2021-09-09 2023-03-22 日東電工株式会社 電子部品仮固定用粘着シート

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60259945A (ja) * 1984-06-05 1985-12-23 Shimadzu Corp 細管式等速電気泳動分析用リ−デイング液
KR19980016612A (ko) * 1996-08-29 1998-06-05 한형수 고정용 발포박리성 점착필름
JP2002069410A (ja) * 2000-08-28 2002-03-08 Fujimori Kogyo Co Ltd 熱剥離性粘着剤及びそれを用いた粘着部材
JP3897236B2 (ja) * 2001-11-26 2007-03-22 ソマール株式会社 再剥離性粘着シート
JP2004018604A (ja) * 2002-06-13 2004-01-22 Somar Corp 粘着体、それを用いた加熱剥離型粘着シート
JP3932268B2 (ja) * 2002-06-17 2007-06-20 日東電工株式会社 マスキング用粘着テープを使用する樹脂封止方法
JP2005330406A (ja) * 2004-05-21 2005-12-02 Somar Corp 再剥離性粘着剤組成物及びそれを用いた再剥離性粘着シート
JP2005314708A (ja) * 2005-06-02 2005-11-10 Nitto Denko Corp 加熱剥離型粘着シート
JP4849993B2 (ja) * 2006-08-14 2012-01-11 日東電工株式会社 粘着シート、その製造方法および積層セラミックシートの切断方法
JP2008266456A (ja) * 2007-04-20 2008-11-06 Nitto Denko Corp 熱剥離型両面粘着シート
JP2008266455A (ja) * 2007-04-20 2008-11-06 Nitto Denko Corp 層状珪酸塩を含む熱剥離型粘着シート及び該シートを使用する電子部品の製造方法
JP2009246302A (ja) * 2008-03-31 2009-10-22 Lintec Corp ダイソートテープ
KR20100096031A (ko) * 2009-02-23 2010-09-01 닛토덴코 가부시키가이샤 적층 세라믹 시트 절단용 열박리형 점착 시트 및 적층 세라믹 시트의 절단 가공 방법
JP5536800B2 (ja) * 2010-07-27 2014-07-02 パナソニック株式会社 アレルゲン低減剤とそれを用いた加工製品および塗料
JP5744434B2 (ja) * 2010-07-29 2015-07-08 日東電工株式会社 加熱剥離シート一体型半導体裏面用フィルム、半導体素子の回収方法、及び半導体装置の製造方法
JP5689336B2 (ja) * 2011-03-03 2015-03-25 日東電工株式会社 加熱剥離型粘着シート
JP5255717B1 (ja) * 2012-05-23 2013-08-07 古河電気工業株式会社 半導体加工用表面保護粘着テープ
JP6054208B2 (ja) * 2013-03-04 2016-12-27 日東電工株式会社 熱剥離型粘着シート

Also Published As

Publication number Publication date
KR20150010564A (ko) 2015-01-28
TW201514271A (zh) 2015-04-16
KR101492371B1 (ko) 2015-02-10
JP2015021081A (ja) 2015-02-02
CN104130723A (zh) 2014-11-05
JP5778721B2 (ja) 2015-09-16

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