TWI373814B - Semiconductor device inspecting apparatus and semiconductor device inspecting method using the same - Google Patents

Semiconductor device inspecting apparatus and semiconductor device inspecting method using the same Download PDF

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Publication number
TWI373814B
TWI373814B TW97108287A TW97108287A TWI373814B TW I373814 B TWI373814 B TW I373814B TW 97108287 A TW97108287 A TW 97108287A TW 97108287 A TW97108287 A TW 97108287A TW I373814 B TWI373814 B TW I373814B
Authority
TW
Taiwan
Prior art keywords
semiconductor device
image
semiconductor
tray
detecting
Prior art date
Application number
TW97108287A
Other languages
English (en)
Chinese (zh)
Other versions
TW200847310A (en
Inventor
Seung-Gyu Ko
Ssang-Gun Lim
Sang-Yoon Lee
Kyung-Soo Song
Original Assignee
Intekplus Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intekplus Co Ltd filed Critical Intekplus Co Ltd
Publication of TW200847310A publication Critical patent/TW200847310A/zh
Application granted granted Critical
Publication of TWI373814B publication Critical patent/TWI373814B/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Theoretical Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Cleaning In General (AREA)
TW97108287A 2007-03-13 2008-03-10 Semiconductor device inspecting apparatus and semiconductor device inspecting method using the same TWI373814B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20070024652A KR100862638B1 (ko) 2007-03-13 2007-03-13 클리닝 수단이 일체로 구비된 반도체 소자의 검사 장치 및그를 이용한 반도체 소자의 검사 방법

Publications (2)

Publication Number Publication Date
TW200847310A TW200847310A (en) 2008-12-01
TWI373814B true TWI373814B (en) 2012-10-01

Family

ID=39759670

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97108287A TWI373814B (en) 2007-03-13 2008-03-10 Semiconductor device inspecting apparatus and semiconductor device inspecting method using the same

Country Status (3)

Country Link
KR (1) KR100862638B1 (ko)
TW (1) TWI373814B (ko)
WO (1) WO2008111758A1 (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101040921B1 (ko) * 2009-04-28 2011-06-17 에버테크노 주식회사 테스트 핸들러의 보트 시스템
CN103293458B (zh) * 2012-02-29 2017-03-01 宰体有限公司 元件检测装置
KR102000948B1 (ko) * 2012-02-29 2019-07-17 (주)제이티 소자검사장치
KR101442483B1 (ko) * 2013-01-10 2014-09-24 주식회사 미르기술 Led 패키지 비전 검사 및 분류 시스템
KR102043633B1 (ko) * 2014-01-21 2019-11-13 (주)테크윙 반도체소자 테스트용 핸들러
KR102099641B1 (ko) * 2014-06-03 2020-04-10 세메스 주식회사 반도체 칩 검사 장치 및 방법
KR102114678B1 (ko) * 2019-02-26 2020-06-08 주식회사 메리테크 로더를 구비한 전자부품 내열성능테스트 시스템
KR102141814B1 (ko) * 2019-04-23 2020-08-06 주식회사 윈텍오토메이션 초경인서트 클리닝 장치
CN111239159A (zh) * 2020-03-16 2020-06-05 科为升视觉技术（苏州）有限公司 封装基板视觉检测***及方法
CN112739045B (zh) * 2021-04-01 2021-07-13 电信科学技术仪表研究所有限公司 一种球栅阵列（bga）器件焊点清洗工艺的调节方法及清洗工艺
CN116153817B (zh) * 2023-02-07 2023-11-03 江苏振宁半导体研究院有限公司 一种基于芯片良率监测用调节装置及方法
KR102671863B1 (ko) * 2023-05-26 2024-06-03 제너셈(주) 스트립 백워드 기능을 제공하는 패키지 절단 및 소팅 시스템
KR102641625B1 (ko) * 2023-05-26 2024-02-28 제너셈(주) 리젝트 빈을 구비하는 패키지 절단 및 소팅 시스템
KR102642099B1 (ko) * 2023-05-26 2024-02-29 제너셈(주) 에어 건조부를 구비한 패키지 절단 및 소팅 시스템
KR102672634B1 (ko) * 2023-06-07 2024-06-05 제너셈(주) 패키지 절단 및 소팅 시스템
KR102682563B1 (ko) 2023-06-07 2024-07-08 제너셈(주) 트레이 운반 모듈을 구비하는 패키지 처리 시스템

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001050728A (ja) * 1999-08-04 2001-02-23 Toshiba Ceramics Co Ltd 半導体ウエハの外観検査装置
KR100385876B1 (ko) * 2000-12-20 2003-06-02 한미반도체 주식회사 반도체 패키지장치 절단용 핸들러 시스템
JP3808320B2 (ja) * 2001-04-11 2006-08-09 大日本スクリーン製造株式会社 パターン検査装置およびパターン検査方法
KR100574584B1 (ko) * 2003-05-31 2006-04-27 한미반도체 주식회사 반도체 패키지 제조공정용 절단 및 핸들러시스템
JP4339631B2 (ja) * 2003-06-20 2009-10-07 東京エレクトロン株式会社 検査方法及び検査装置
KR100596505B1 (ko) * 2004-09-08 2006-07-05 삼성전자주식회사 소잉/소팅 시스템

Also Published As

Publication number Publication date
WO2008111758A1 (en) 2008-09-18
KR100862638B1 (ko) 2008-10-09
KR20080083872A (ko) 2008-09-19
TW200847310A (en) 2008-12-01

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