TWI373814B - Semiconductor device inspecting apparatus and semiconductor device inspecting method using the same - Google Patents
Semiconductor device inspecting apparatus and semiconductor device inspecting method using the same Download PDFInfo
- Publication number
- TWI373814B TWI373814B TW97108287A TW97108287A TWI373814B TW I373814 B TWI373814 B TW I373814B TW 97108287 A TW97108287 A TW 97108287A TW 97108287 A TW97108287 A TW 97108287A TW I373814 B TWI373814 B TW I373814B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor device
- image
- semiconductor
- tray
- detecting
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Biochemistry (AREA)
- Pathology (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Immunology (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Quality & Reliability (AREA)
- Theoretical Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Signal Processing (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Cleaning In General (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20070024652A KR100862638B1 (ko) | 2007-03-13 | 2007-03-13 | 클리닝 수단이 일체로 구비된 반도체 소자의 검사 장치 및그를 이용한 반도체 소자의 검사 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200847310A TW200847310A (en) | 2008-12-01 |
TWI373814B true TWI373814B (en) | 2012-10-01 |
Family
ID=39759670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW97108287A TWI373814B (en) | 2007-03-13 | 2008-03-10 | Semiconductor device inspecting apparatus and semiconductor device inspecting method using the same |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100862638B1 (ko) |
TW (1) | TWI373814B (ko) |
WO (1) | WO2008111758A1 (ko) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101040921B1 (ko) * | 2009-04-28 | 2011-06-17 | 에버테크노 주식회사 | 테스트 핸들러의 보트 시스템 |
CN103293458B (zh) * | 2012-02-29 | 2017-03-01 | 宰体有限公司 | 元件检测装置 |
KR102000948B1 (ko) * | 2012-02-29 | 2019-07-17 | (주)제이티 | 소자검사장치 |
KR101442483B1 (ko) * | 2013-01-10 | 2014-09-24 | 주식회사 미르기술 | Led 패키지 비전 검사 및 분류 시스템 |
KR102043633B1 (ko) * | 2014-01-21 | 2019-11-13 | (주)테크윙 | 반도체소자 테스트용 핸들러 |
KR102099641B1 (ko) * | 2014-06-03 | 2020-04-10 | 세메스 주식회사 | 반도체 칩 검사 장치 및 방법 |
KR102114678B1 (ko) * | 2019-02-26 | 2020-06-08 | 주식회사 메리테크 | 로더를 구비한 전자부품 내열성능테스트 시스템 |
KR102141814B1 (ko) * | 2019-04-23 | 2020-08-06 | 주식회사 윈텍오토메이션 | 초경인서트 클리닝 장치 |
CN111239159A (zh) * | 2020-03-16 | 2020-06-05 | 科为升视觉技术(苏州)有限公司 | 封装基板视觉检测***及方法 |
CN112739045B (zh) * | 2021-04-01 | 2021-07-13 | 电信科学技术仪表研究所有限公司 | 一种球栅阵列(bga)器件焊点清洗工艺的调节方法及清洗工艺 |
CN116153817B (zh) * | 2023-02-07 | 2023-11-03 | 江苏振宁半导体研究院有限公司 | 一种基于芯片良率监测用调节装置及方法 |
KR102671863B1 (ko) * | 2023-05-26 | 2024-06-03 | 제너셈(주) | 스트립 백워드 기능을 제공하는 패키지 절단 및 소팅 시스템 |
KR102641625B1 (ko) * | 2023-05-26 | 2024-02-28 | 제너셈(주) | 리젝트 빈을 구비하는 패키지 절단 및 소팅 시스템 |
KR102642099B1 (ko) * | 2023-05-26 | 2024-02-29 | 제너셈(주) | 에어 건조부를 구비한 패키지 절단 및 소팅 시스템 |
KR102672634B1 (ko) * | 2023-06-07 | 2024-06-05 | 제너셈(주) | 패키지 절단 및 소팅 시스템 |
KR102682563B1 (ko) | 2023-06-07 | 2024-07-08 | 제너셈(주) | 트레이 운반 모듈을 구비하는 패키지 처리 시스템 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001050728A (ja) * | 1999-08-04 | 2001-02-23 | Toshiba Ceramics Co Ltd | 半導体ウエハの外観検査装置 |
KR100385876B1 (ko) * | 2000-12-20 | 2003-06-02 | 한미반도체 주식회사 | 반도체 패키지장치 절단용 핸들러 시스템 |
JP3808320B2 (ja) * | 2001-04-11 | 2006-08-09 | 大日本スクリーン製造株式会社 | パターン検査装置およびパターン検査方法 |
KR100574584B1 (ko) * | 2003-05-31 | 2006-04-27 | 한미반도체 주식회사 | 반도체 패키지 제조공정용 절단 및 핸들러시스템 |
JP4339631B2 (ja) * | 2003-06-20 | 2009-10-07 | 東京エレクトロン株式会社 | 検査方法及び検査装置 |
KR100596505B1 (ko) * | 2004-09-08 | 2006-07-05 | 삼성전자주식회사 | 소잉/소팅 시스템 |
-
2007
- 2007-03-13 KR KR20070024652A patent/KR100862638B1/ko active IP Right Grant
-
2008
- 2008-03-05 WO PCT/KR2008/001260 patent/WO2008111758A1/en active Application Filing
- 2008-03-10 TW TW97108287A patent/TWI373814B/zh active
Also Published As
Publication number | Publication date |
---|---|
WO2008111758A1 (en) | 2008-09-18 |
KR100862638B1 (ko) | 2008-10-09 |
KR20080083872A (ko) | 2008-09-19 |
TW200847310A (en) | 2008-12-01 |
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