TWI348077B - A method and apparatus for immersion lithography - Google Patents
A method and apparatus for immersion lithographyInfo
- Publication number
- TWI348077B TWI348077B TW095136760A TW95136760A TWI348077B TW I348077 B TWI348077 B TW I348077B TW 095136760 A TW095136760 A TW 095136760A TW 95136760 A TW95136760 A TW 95136760A TW I348077 B TWI348077 B TW I348077B
- Authority
- TW
- Taiwan
- Prior art keywords
- immersion lithography
- lithography
- immersion
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70941—Stray fields and charges, e.g. stray light, scattered light, flare, transmission loss
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/251,330 US7420188B2 (en) | 2005-10-14 | 2005-10-14 | Exposure method and apparatus for immersion lithography |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200715070A TW200715070A (en) | 2007-04-16 |
TWI348077B true TWI348077B (en) | 2011-09-01 |
Family
ID=37947309
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095136760A TWI348077B (en) | 2005-10-14 | 2006-10-03 | A method and apparatus for immersion lithography |
Country Status (6)
Country | Link |
---|---|
US (1) | US7420188B2 (zh) |
JP (1) | JP4642726B2 (zh) |
KR (1) | KR100823633B1 (zh) |
CN (1) | CN1949082B (zh) |
NL (1) | NL1032675C2 (zh) |
TW (1) | TWI348077B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10418316B1 (en) | 2018-04-04 | 2019-09-17 | Advanced Semiconductor Engineering, Inc. | Semiconductor substrate, semiconductor package structure and method of manufacturing a semiconductor device |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101466533B1 (ko) * | 2005-04-25 | 2014-11-27 | 가부시키가이샤 니콘 | 노광 방법, 노광 장치 및 액체 공급 방법 |
NL1036187A1 (nl) * | 2007-12-03 | 2009-06-04 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
JP5482784B2 (ja) | 2009-03-10 | 2014-05-07 | 株式会社ニコン | 露光装置、露光方法、及びデバイス製造方法 |
WO2011155529A1 (ja) * | 2010-06-10 | 2011-12-15 | 株式会社ニコン | 計測部材、ステージ装置、露光装置、露光方法、及びデバイス製造方法 |
US8937703B2 (en) * | 2010-07-14 | 2015-01-20 | Nikon Corporation | Liquid immersion member, immersion exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium |
JP5740287B2 (ja) * | 2011-11-09 | 2015-06-24 | 富士フイルム株式会社 | パターン形成方法、及び、電子デバイスの製造方法 |
CN104181776B (zh) * | 2014-07-28 | 2016-04-13 | 浙江大学 | 浸没式光刻机流体控制***的模块化工作流程控制方法 |
US9588446B2 (en) | 2015-05-29 | 2017-03-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Calibration apparatus and an adjustment method for a lithography apparatus |
JP2019529970A (ja) * | 2016-09-09 | 2019-10-17 | エーエスエムエル ホールディング エヌ.ブイ. | リソグラフィ装置及びサポート構造背景 |
CN110231725B (zh) * | 2019-05-20 | 2022-03-08 | 深圳市华星光电半导体显示技术有限公司 | 一种微影玻璃薄化的方法及其控制*** |
WO2021094057A1 (en) * | 2019-11-14 | 2021-05-20 | Asml Netherlands B.V. | Substrate support, lithographic apparatus, method for manipulating charge distribution and method for preparing a substrate |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4509852A (en) | 1980-10-06 | 1985-04-09 | Werner Tabarelli | Apparatus for the photolithographic manufacture of integrated circuit elements |
JPS57153433A (en) | 1981-03-18 | 1982-09-22 | Hitachi Ltd | Manufacturing device for semiconductor |
US5900354A (en) * | 1997-07-03 | 1999-05-04 | Batchelder; John Samuel | Method for optical inspection and lithography |
US6507474B1 (en) * | 2000-06-19 | 2003-01-14 | Advanced Micro Devices, Inc. | Using localized ionizer to reduce electrostatic charge from wafer and mask |
JP2005101498A (ja) * | 2003-03-04 | 2005-04-14 | Tokyo Ohka Kogyo Co Ltd | 液浸露光プロセス用浸漬液および該浸漬液を用いたレジストパターン形成方法 |
US7317504B2 (en) * | 2004-04-08 | 2008-01-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
TWI245163B (en) * | 2003-08-29 | 2005-12-11 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
KR101443001B1 (ko) * | 2003-09-29 | 2014-09-22 | 가부시키가이샤 니콘 | 투영 노광 장치, 투영 노광 방법 및 디바이스 제조 방법 |
JP4323946B2 (ja) * | 2003-12-19 | 2009-09-02 | キヤノン株式会社 | 露光装置 |
US7304715B2 (en) * | 2004-08-13 | 2007-12-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7327439B2 (en) * | 2004-11-16 | 2008-02-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
KR101220613B1 (ko) * | 2004-12-01 | 2013-01-18 | 가부시키가이샤 니콘 | 스테이지 장치 및 노광 장치 |
CN102385260B (zh) * | 2005-02-10 | 2014-11-05 | Asml荷兰有限公司 | 浸没液体、曝光装置及曝光方法 |
US7291569B2 (en) * | 2005-06-29 | 2007-11-06 | Infineon Technologies Ag | Fluids for immersion lithography systems |
-
2005
- 2005-10-14 US US11/251,330 patent/US7420188B2/en not_active Expired - Fee Related
-
2006
- 2006-09-29 CN CN2006101524156A patent/CN1949082B/zh active Active
- 2006-10-03 TW TW095136760A patent/TWI348077B/zh not_active IP Right Cessation
- 2006-10-12 KR KR1020060099304A patent/KR100823633B1/ko active IP Right Grant
- 2006-10-13 NL NL1032675A patent/NL1032675C2/nl active Search and Examination
- 2006-10-13 JP JP2006280557A patent/JP4642726B2/ja active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10418316B1 (en) | 2018-04-04 | 2019-09-17 | Advanced Semiconductor Engineering, Inc. | Semiconductor substrate, semiconductor package structure and method of manufacturing a semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
KR100823633B1 (ko) | 2008-04-21 |
JP4642726B2 (ja) | 2011-03-02 |
NL1032675A1 (nl) | 2007-04-17 |
TW200715070A (en) | 2007-04-16 |
US7420188B2 (en) | 2008-09-02 |
CN1949082A (zh) | 2007-04-18 |
KR20070041352A (ko) | 2007-04-18 |
US20070085034A1 (en) | 2007-04-19 |
CN1949082B (zh) | 2012-03-28 |
JP2007165852A (ja) | 2007-06-28 |
NL1032675C2 (nl) | 2008-05-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |