TWI299555B - Semiconductor flip-chip package component and fabricating method - Google Patents

Semiconductor flip-chip package component and fabricating method Download PDF

Info

Publication number
TWI299555B
TWI299555B TW095115442A TW95115442A TWI299555B TW I299555 B TWI299555 B TW I299555B TW 095115442 A TW095115442 A TW 095115442A TW 95115442 A TW95115442 A TW 95115442A TW I299555 B TWI299555 B TW I299555B
Authority
TW
Taiwan
Prior art keywords
wafer
glue
film
conductive
elastic
Prior art date
Application number
TW095115442A
Other languages
English (en)
Chinese (zh)
Other versions
TW200742013A (en
Inventor
Wen Chih Chen
Original Assignee
Taiwan Tft Lcd Ass
Chunghwa Picture Tubes Ltd
Au Optronics Corp
Quanta Display Inc
Hannstar Display Corp
Chi Mei Optoelectronics Corp
Ind Tech Res Inst
Toppoly Optoelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Tft Lcd Ass, Chunghwa Picture Tubes Ltd, Au Optronics Corp, Quanta Display Inc, Hannstar Display Corp, Chi Mei Optoelectronics Corp, Ind Tech Res Inst, Toppoly Optoelectronics Corp filed Critical Taiwan Tft Lcd Ass
Priority to TW095115442A priority Critical patent/TWI299555B/zh
Priority to KR1020060074225A priority patent/KR100868616B1/ko
Priority to JP2006215739A priority patent/JP2007300052A/ja
Publication of TW200742013A publication Critical patent/TW200742013A/zh
Application granted granted Critical
Publication of TWI299555B publication Critical patent/TWI299555B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/731—Location prior to the connecting process
    • H01L2224/73101—Location prior to the connecting process on the same surface
    • H01L2224/73103—Bump and layer connectors
    • H01L2224/73104—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Dicing (AREA)
TW095115442A 2006-04-28 2006-04-28 Semiconductor flip-chip package component and fabricating method TWI299555B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW095115442A TWI299555B (en) 2006-04-28 2006-04-28 Semiconductor flip-chip package component and fabricating method
KR1020060074225A KR100868616B1 (ko) 2006-04-28 2006-08-07 반도체(플립 칩) 실장 부품과 그 제조 방법
JP2006215739A JP2007300052A (ja) 2006-04-28 2006-08-08 フリップチップ実装の部品とその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095115442A TWI299555B (en) 2006-04-28 2006-04-28 Semiconductor flip-chip package component and fabricating method

Publications (2)

Publication Number Publication Date
TW200742013A TW200742013A (en) 2007-11-01
TWI299555B true TWI299555B (en) 2008-08-01

Family

ID=38769275

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095115442A TWI299555B (en) 2006-04-28 2006-04-28 Semiconductor flip-chip package component and fabricating method

Country Status (3)

Country Link
JP (1) JP2007300052A (ko)
KR (1) KR100868616B1 (ko)
TW (1) TWI299555B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109996393A (zh) * 2017-12-29 2019-07-09 中国石油化工股份有限公司 用于提高钻井电子装置性能的方法和设备

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9236360B2 (en) 2011-10-12 2016-01-12 Novatek Microelectronics Corp. IC chip package and chip-on-glass structure using the same
TWI492342B (zh) * 2011-10-12 2015-07-11 Novatek Microelectronics Corp 積體電路晶片封裝件和應用之玻璃覆晶基板結構
TWI500126B (zh) * 2013-01-02 2015-09-11 Au Optronics Corp 顯示裝置之驅動元件的構裝方法以及顯示裝置之驅動元件的構裝結構
WO2020243147A1 (en) * 2019-05-30 2020-12-03 Glo Ab Light emitting diode device containing a positive photoresist insulating spacer and a conductive sidewall contact and method of making the same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03160738A (ja) * 1989-11-17 1991-07-10 Fujitsu Ltd フェースダウンチップとその製造方法およびその実装基板
JPH0897399A (ja) * 1994-09-28 1996-04-12 Fujitsu Ltd 半導体チップ及びその製造方法、半導体装置及びその製造方法並に半導体装置の実装構造
JPH08204166A (ja) * 1995-01-23 1996-08-09 Nippon Hoso Kyokai <Nhk> 積層型固体撮像装置
JP3197788B2 (ja) * 1995-05-18 2001-08-13 株式会社日立製作所 半導体装置の製造方法
JP3038703B2 (ja) * 1995-07-20 2000-05-08 カシオ計算機株式会社 半導体装置およびその製造方法並びにその実装方法
JP2000299409A (ja) * 1999-04-16 2000-10-24 Rohm Co Ltd フリップ・チップ実装式半導体チップの構造及びその製造方法
JP4334128B2 (ja) * 2000-10-27 2009-09-30 パナソニック株式会社 半導体実装方法および半導体実装装置
JP2003023034A (ja) * 2001-07-06 2003-01-24 Matsushita Electric Works Ltd フリップチップ実装方法
JP3718190B2 (ja) * 2002-07-31 2005-11-16 富士通株式会社 面実装構造体の形成方法および面実装構造体
JP2005340761A (ja) * 2004-04-27 2005-12-08 Seiko Epson Corp 半導体装置の実装方法、回路基板、電気光学装置並びに電子機器
JP2006086265A (ja) * 2004-09-15 2006-03-30 Seiko Epson Corp 配線基板、配線基板の製造方法および電子機器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109996393A (zh) * 2017-12-29 2019-07-09 中国石油化工股份有限公司 用于提高钻井电子装置性能的方法和设备

Also Published As

Publication number Publication date
KR100868616B1 (ko) 2008-11-13
TW200742013A (en) 2007-11-01
JP2007300052A (ja) 2007-11-15
KR20070106364A (ko) 2007-11-01

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MM4A Annulment or lapse of patent due to non-payment of fees