TWI270924B - Coating and developing apparatus, resist pattern forming method, exposure apparatus and washing apparatus - Google Patents

Coating and developing apparatus, resist pattern forming method, exposure apparatus and washing apparatus Download PDF

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Publication number
TWI270924B
TWI270924B TW94130666A TW94130666A TWI270924B TW I270924 B TWI270924 B TW I270924B TW 94130666 A TW94130666 A TW 94130666A TW 94130666 A TW94130666 A TW 94130666A TW I270924 B TWI270924 B TW I270924B
Authority
TW
Taiwan
Prior art keywords
wafer
liquid
cleaning
semiconductor wafer
coating
Prior art date
Application number
TW94130666A
Other languages
English (en)
Chinese (zh)
Other versions
TW200632988A (en
Inventor
Taro Yamamoto
Masahiro Fukuda
Seiki Ishida
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200632988A publication Critical patent/TW200632988A/zh
Application granted granted Critical
Publication of TWI270924B publication Critical patent/TWI270924B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Environmental & Geological Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW94130666A 2004-09-10 2005-09-07 Coating and developing apparatus, resist pattern forming method, exposure apparatus and washing apparatus TWI270924B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004264753A JP4271109B2 (ja) 2004-09-10 2004-09-10 塗布、現像装置、レジストパターン形成方法、露光装置及び洗浄装置

Publications (2)

Publication Number Publication Date
TW200632988A TW200632988A (en) 2006-09-16
TWI270924B true TWI270924B (en) 2007-01-11

Family

ID=36036193

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94130666A TWI270924B (en) 2004-09-10 2005-09-07 Coating and developing apparatus, resist pattern forming method, exposure apparatus and washing apparatus

Country Status (3)

Country Link
JP (1) JP4271109B2 (ja)
TW (1) TWI270924B (ja)
WO (1) WO2006027900A1 (ja)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5008280B2 (ja) 2004-11-10 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP5154008B2 (ja) * 2004-11-10 2013-02-27 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP4926433B2 (ja) 2004-12-06 2012-05-09 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP5154006B2 (ja) * 2004-12-06 2013-02-27 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5154007B2 (ja) 2004-12-06 2013-02-27 株式会社Ｓｏｋｕｄｏ 基板処理装置
US7196770B2 (en) 2004-12-07 2007-03-27 Asml Netherlands B.V. Prewetting of substrate before immersion exposure
JP4634822B2 (ja) * 2005-02-24 2011-02-16 株式会社東芝 レジストパターン形成方法および半導体装置の製造方法
KR101255048B1 (ko) 2005-04-01 2013-04-16 에프에스아이 인터내쇼날 인크. 하나 이상의 처리 유체를 이용하여 마이크로일렉트로닉 워크피이스를 처리하는데 이용되는 장치용 배리어 구조 및 노즐 장치
US7691559B2 (en) * 2005-06-30 2010-04-06 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion lithography edge bead removal
JP4761907B2 (ja) 2005-09-28 2011-08-31 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5132108B2 (ja) * 2006-02-02 2013-01-30 株式会社Ｓｏｋｕｄｏ 基板処理装置
CN104319249B (zh) * 2006-07-07 2017-11-07 Tel Fsi股份有限公司 用于处理微电子工件的设备
CN100541713C (zh) 2006-07-18 2009-09-16 东京毅力科创株式会社 高折射率液体循环***、图案形成装置以及图案形成方法
JP2008042004A (ja) * 2006-08-08 2008-02-21 Tokyo Electron Ltd パターン形成方法およびパターン形成装置
JP5004611B2 (ja) 2007-02-15 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5149513B2 (ja) * 2007-02-15 2013-02-20 株式会社Ｓｏｋｕｄｏ 基板処理装置
US7641406B2 (en) * 2007-07-26 2010-01-05 Sokudo Co., Ltd. Bevel inspection apparatus for substrate processing
JP2009071235A (ja) * 2007-09-18 2009-04-02 Sokudo:Kk 基板処理装置
US8051863B2 (en) * 2007-10-18 2011-11-08 Lam Research Corporation Methods of and apparatus for correlating gap value to meniscus stability in processing of a wafer surface by a recipe-controlled meniscus
JP5017232B2 (ja) * 2007-10-31 2012-09-05 エーエスエムエル ネザーランズ ビー．ブイ． クリーニング装置および液浸リソグラフィ装置
JP5136103B2 (ja) 2008-02-12 2013-02-06 東京エレクトロン株式会社 洗浄装置及びその方法、塗布、現像装置及びその方法、並びに記憶媒体
KR20110005699A (ko) 2008-05-09 2011-01-18 에프에스아이 인터내쇼날 인크. 개방 동작 모드와 폐쇄 동작 모드사이를 용이하게 변경하는 처리실 설계를 이용하여 마이크로일렉트로닉 워크피이스를 처리하는 공구 및 방법
JP2010287686A (ja) * 2009-06-10 2010-12-24 Tokyo Electron Ltd 塗布、現像装置及び基板の裏面洗浄方法。
JP5590602B2 (ja) * 2010-02-12 2014-09-17 サムスン電機ジャパンアドバンスドテクノロジー株式会社 ディスク駆動装置の生産方法及びその生産方法により生産されたディスク駆動装置
TWI708348B (zh) 2015-12-15 2020-10-21 日商千住金屬工業股份有限公司 焊料凸塊形成裝置及流體吐出方法
CN111045299B (zh) * 2020-01-02 2023-07-21 长江存储科技有限责任公司 一种显影洗边设备和显影洗边方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2929196B2 (ja) * 1988-09-13 1999-08-03 東京エレクトロン株式会社 加熱装置
JP2001319849A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd 液処理装置及び液処理方法
JP4015823B2 (ja) * 2001-05-14 2007-11-28 株式会社東芝 アルカリ現像液の製造方法，アルカリ現像液，パターン形成方法，レジスト膜の剥離方法，及び薬液塗布装置
EP1571694A4 (en) * 2002-12-10 2008-10-15 Nikon Corp EXPOSURE APPARATUS AND METHOD FOR MANUFACTURING THE DEVICE
JP4525062B2 (ja) * 2002-12-10 2010-08-18 株式会社ニコン 露光装置及びデバイス製造方法、露光システム
JP2005277363A (ja) * 2003-05-23 2005-10-06 Nikon Corp 露光装置及びデバイス製造方法
JP4101740B2 (ja) * 2003-12-09 2008-06-18 東京エレクトロン株式会社 塗布・現像装置及びレジストパターンの形成方法
JP4220423B2 (ja) * 2004-03-24 2009-02-04 株式会社東芝 レジストパターン形成方法
JP4535489B2 (ja) * 2004-03-31 2010-09-01 東京エレクトロン株式会社 塗布・現像装置
JP2006024715A (ja) * 2004-07-07 2006-01-26 Toshiba Corp リソグラフィー装置およびパターン形成方法

Also Published As

Publication number Publication date
JP4271109B2 (ja) 2009-06-03
TW200632988A (en) 2006-09-16
JP2006080403A (ja) 2006-03-23
WO2006027900A1 (ja) 2006-03-16

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