TW576791B - Laminate and process for producing the same - Google Patents

Laminate and process for producing the same Download PDF

Info

Publication number
TW576791B
TW576791B TW089122127A TW89122127A TW576791B TW 576791 B TW576791 B TW 576791B TW 089122127 A TW089122127 A TW 089122127A TW 89122127 A TW89122127 A TW 89122127A TW 576791 B TW576791 B TW 576791B
Authority
TW
Taiwan
Prior art keywords
polyimide
resin layer
layer
humidity
conductor
Prior art date
Application number
TW089122127A
Other languages
English (en)
Chinese (zh)
Inventor
Takuhei Ohta
Katsufumi Hiraishi
Makoto Shimose
Kazuto Okamura
Naoya Okabayashi
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Application granted granted Critical
Publication of TW576791B publication Critical patent/TW576791B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW089122127A 1999-10-21 2000-10-20 Laminate and process for producing the same TW576791B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29944399 1999-10-21

Publications (1)

Publication Number Publication Date
TW576791B true TW576791B (en) 2004-02-21

Family

ID=17872656

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089122127A TW576791B (en) 1999-10-21 2000-10-20 Laminate and process for producing the same

Country Status (8)

Country Link
US (1) US6998455B1 (ja)
EP (1) EP1245379B1 (ja)
JP (2) JP3759454B2 (ja)
KR (1) KR100657729B1 (ja)
CN (1) CN1241733C (ja)
DE (1) DE60040927D1 (ja)
TW (1) TW576791B (ja)
WO (1) WO2001028767A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI413460B (zh) * 2006-08-10 2013-10-21 Nippon Steel & Sumikin Chem Co 配線基板用層合體
TWI583721B (zh) * 2012-05-28 2017-05-21 宇部興產股份有限公司 聚醯亞胺前驅體及聚醯亞胺

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JP4571043B2 (ja) * 1999-10-21 2010-10-27 新日鐵化学株式会社 積層体及びその製造方法
JP4491574B2 (ja) * 2001-02-16 2010-06-30 大日本印刷株式会社 Ｈｄｄ用サスペンション及びその製造方法
TWI300744B (ja) * 2001-04-19 2008-09-11 Nippon Steel Chemical Co
WO2004073975A1 (ja) * 2003-02-18 2004-09-02 Mitsui Chemicals, Inc. ポリイミド金属積層体
CN1898298B (zh) * 2003-12-26 2010-12-15 新日铁化学株式会社 芳香族聚酰胺酸及聚酰亚胺
JP2005267724A (ja) * 2004-03-17 2005-09-29 Nippon Steel Chem Co Ltd Ｈｄｄサスペンション用積層体の製造方法
GB0425266D0 (en) * 2004-11-16 2004-12-15 Norton Healthcare Ltd Pharmaceutical manufacturing process
US20080268266A1 (en) * 2004-12-03 2008-10-30 Mitsui Chemicals, Inc. Polyimide Metal Laminate and Suspension for Hard Disk Using Same
JP4544588B2 (ja) * 2005-03-14 2010-09-15 株式会社エー・エム・ティー・研究所 積層体
KR100715294B1 (ko) * 2005-03-29 2007-05-08 가부시키가이샤 도모에가와 세이시쇼 플렉시블 금속 적층체 및 플렉시블 프린트기판
JP2008087254A (ja) * 2006-09-29 2008-04-17 Nippon Steel Chem Co Ltd フレキシブル銅張積層板及びキャリア付フレキシブル銅張積層板
JP5249203B2 (ja) * 2007-03-30 2013-07-31 新日鉄住金化学株式会社 ポリイミドフィルム
CN101652244B (zh) * 2007-04-18 2013-06-26 旭化成电子材料株式会社 金属-树脂层压体
CN101681628B (zh) * 2007-04-18 2012-01-11 大日本印刷株式会社 悬浮臂用基板、其制备方法、磁头悬浮臂和硬盘驱动器
US8394503B2 (en) * 2007-12-14 2013-03-12 Toadenka Corporation Resin-metal bonded article and method for producing the same
JP5235079B2 (ja) * 2008-02-04 2013-07-10 新日鉄住金化学株式会社 多層積層体及びフレキシブル銅張積層板の製造方法
US8087313B2 (en) * 2009-04-08 2012-01-03 Honda Motor Co., Ltd. Method for determining expected water uptake in hygroscopic material
JP5644068B2 (ja) * 2009-07-06 2014-12-24 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、レジストパターンの製造法、及びハードディスクサスペンション
US8507588B2 (en) 2011-02-07 2013-08-13 The Board Of Trustees Of The Leland Stanford Junior University PHBV/ground bone meal and pumice powder engineered biobased composite materials for construction
KR101134920B1 (ko) * 2011-06-03 2012-04-17 한국기초과학지원연구원 고분자 수지-구리 결합체 및 이의 제조방법
JP5869458B2 (ja) * 2012-09-27 2016-02-24 新日鉄住金化学株式会社 ポリアミド酸組成物、ポリイミド組成物、積層体、回路基板、その使用方法、積層体の製造方法及び回路基板の製造方法
KR102038137B1 (ko) * 2012-12-21 2019-10-30 주식회사 넥스플렉스 다층 연성금속박 적층체 및 이의 제조방법
JP7147313B2 (ja) * 2018-07-18 2022-10-05 三菱マテリアル株式会社 金属ベース基板

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JPS60197759A (ja) * 1984-03-21 1985-10-07 Ube Ind Ltd ポリイミド樹脂組成物
JPS60243120A (ja) 1984-05-18 1985-12-03 Hitachi Ltd フレキシブルプリント基板の製造方法
JPS61111181A (ja) 1984-11-07 1986-05-29 Nitto Electric Ind Co Ltd ポリイミド−金属箔複合フイルムの製法
JPS61143434A (ja) 1984-12-15 1986-07-01 Nitto Electric Ind Co Ltd 耐湿性ポリイミド
JPH01245586A (ja) * 1988-03-28 1989-09-29 Nippon Steel Chem Co Ltd フレキシブルプリント基板
JPH0693537B2 (ja) 1989-09-19 1994-11-16 新日鐵化学株式会社 両面導体ポリイミド積層体の製造方法
JP2738453B2 (ja) 1989-10-03 1998-04-08 新日鐵化学株式会社 銅張積層板の製造方法
JP2853218B2 (ja) 1989-11-24 1999-02-03 東洋紡績株式会社 積層体
US5166308A (en) * 1990-04-30 1992-11-24 E. I. Du Pont De Nemours And Company Copolyimide film with improved properties
JP3008471B2 (ja) 1990-10-05 2000-02-14 東洋紡績株式会社 耐熱性積層体及びその製造方法
US5196500A (en) * 1990-12-17 1993-03-23 E. I. Du Pont De Nemours And Company Tetrapolyimide film containing benzophenone tetracarboxylic dianhydride
JPH10126019A (ja) 1996-08-27 1998-05-15 Kanegafuchi Chem Ind Co Ltd フレキシブルプリント基板、ｆｃテープ及びそれからなるｔａｂテープ
JP3635384B2 (ja) * 1996-10-29 2005-04-06 株式会社カネカ 耐熱性ボンディングシート
JPH10298286A (ja) * 1997-02-25 1998-11-10 Du Pont Toray Co Ltd ブロック成分を有する共重合ポリイミドフィルム、その製造方法およびそれを基材とした金属配線回路板
JP3794446B2 (ja) 1997-08-05 2006-07-05 株式会社カネカ ハードディスクサスペンション配線基材用ポリイミドフィルム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI413460B (zh) * 2006-08-10 2013-10-21 Nippon Steel & Sumikin Chem Co 配線基板用層合體
TWI583721B (zh) * 2012-05-28 2017-05-21 宇部興產股份有限公司 聚醯亞胺前驅體及聚醯亞胺

Also Published As

Publication number Publication date
US6998455B1 (en) 2006-02-14
CN1241733C (zh) 2006-02-15
KR100657729B1 (ko) 2006-12-13
JP4755264B2 (ja) 2011-08-24
JP3759454B2 (ja) 2006-03-22
DE60040927D1 (de) 2009-01-08
EP1245379A1 (en) 2002-10-02
EP1245379B1 (en) 2008-11-26
EP1245379A4 (en) 2006-01-11
WO2001028767A1 (fr) 2001-04-26
KR20020038964A (ko) 2002-05-24
CN1382085A (zh) 2002-11-27
JP2009101706A (ja) 2009-05-14

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