TW561808B - Method of copper plating small hole - Google Patents

Method of copper plating small hole Download PDF

Info

Publication number
TW561808B
TW561808B TW091123729A TW91123729A TW561808B TW 561808 B TW561808 B TW 561808B TW 091123729 A TW091123729 A TW 091123729A TW 91123729 A TW91123729 A TW 91123729A TW 561808 B TW561808 B TW 561808B
Authority
TW
Taiwan
Prior art keywords
small hole
plating
copper
mouth
copper plating
Prior art date
Application number
TW091123729A
Other languages
English (en)
Inventor
Kenji Nakamura
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Application granted granted Critical
Publication of TW561808B publication Critical patent/TW561808B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW091123729A 2001-10-16 2002-10-15 Method of copper plating small hole TW561808B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001317878 2001-10-16

Publications (1)

Publication Number Publication Date
TW561808B true TW561808B (en) 2003-11-11

Family

ID=19135677

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091123729A TW561808B (en) 2001-10-16 2002-10-15 Method of copper plating small hole

Country Status (6)

Country Link
US (1) US20040011654A1 (zh)
JP (1) JP4148895B2 (zh)
KR (1) KR20040045390A (zh)
CN (1) CN1283848C (zh)
TW (1) TW561808B (zh)
WO (1) WO2003033775A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040074775A1 (en) * 2002-10-21 2004-04-22 Herdman Roderick Dennis Pulse reverse electrolysis of acidic copper electroplating solutions
DE102004045451B4 (de) * 2004-09-20 2007-05-03 Atotech Deutschland Gmbh Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer
SE0403047D0 (sv) * 2004-12-14 2004-12-14 Polymer Kompositer I Goeteborg Pulse-plating method and apparatus
KR100632552B1 (ko) * 2004-12-30 2006-10-11 삼성전기주식회사 내부 비아홀의 필 도금 구조 및 그 제조 방법
US20060226014A1 (en) * 2005-04-11 2006-10-12 Taiwan Semiconductor Manufacturing Co., Ltd. Method and process for improved uniformity of electrochemical plating films produced in semiconductor device processing
JP4764718B2 (ja) 2005-12-28 2011-09-07 新光電気工業株式会社 スルーホールの充填方法
JP5246103B2 (ja) 2008-10-16 2013-07-24 大日本印刷株式会社 貫通電極基板の製造方法
JP5428280B2 (ja) * 2008-10-16 2014-02-26 大日本印刷株式会社 貫通電極基板及び貫通電極基板を用いた半導体装置
JP6161863B2 (ja) * 2010-12-28 2017-07-12 株式会社荏原製作所 電気めっき方法
EP2668317B1 (en) * 2011-01-26 2017-08-23 MacDermid Enthone Inc. Process for filling vias in the microelectronics
CN102443828B (zh) * 2011-09-23 2014-11-19 上海华力微电子有限公司 一种在半导体硅片的通孔中进行电镀铜的方法
TWI454422B (zh) * 2012-04-12 2014-10-01 Nat Univ Tsing Hua 具高密度雙晶的奈米銅導線製造方法
CN104109886A (zh) * 2013-04-22 2014-10-22 广东致卓精密金属科技有限公司 一种超填孔镀铜工艺
US10154598B2 (en) 2014-10-13 2018-12-11 Rohm And Haas Electronic Materials Llc Filling through-holes
JP2017199854A (ja) 2016-04-28 2017-11-02 Tdk株式会社 貫通配線基板
JP7087760B2 (ja) * 2018-07-18 2022-06-21 住友金属鉱山株式会社 銅張積層板

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4517059A (en) * 1981-07-31 1985-05-14 The Boeing Company Automated alternating polarity direct current pulse electrolytic processing of metals
JPH0356696A (ja) * 1989-07-24 1991-03-12 Canon Inc 湿式電解処理装置
JPH07336017A (ja) * 1994-06-08 1995-12-22 Hitachi Ltd 電流反転電解法による薄膜回路製造方法ならびにそれを用いた薄膜回路基板、薄膜多層回路基板および電子回路装置
US5486280A (en) * 1994-10-20 1996-01-23 Martin Marietta Energy Systems, Inc. Process for applying control variables having fractal structures
DE19545231A1 (de) * 1995-11-21 1997-05-22 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Metallschichten
JPH1143797A (ja) * 1997-07-25 1999-02-16 Hideo Honma ビアフィリング方法
US6071398A (en) * 1997-10-06 2000-06-06 Learonal, Inc. Programmed pulse electroplating process
KR100616198B1 (ko) * 1998-04-21 2006-08-25 어플라이드 머티어리얼스, 인코포레이티드 기판상에 전기도금하는 전기화학적 증착 시스템 및 방법
JP4132273B2 (ja) * 1998-08-25 2008-08-13 日本リーロナール有限会社 充填されたブラインドビアホールを有するビルドアッププリント配線板の製造方法
MY128333A (en) * 1998-09-14 2007-01-31 Ibiden Co Ltd Printed wiring board and its manufacturing method
JP3594894B2 (ja) * 2000-02-01 2004-12-02 新光電気工業株式会社 ビアフィリングめっき方法
JP4339980B2 (ja) * 2000-03-14 2009-10-07 沖プリンテッドサーキット株式会社 電解メッキ装置

Also Published As

Publication number Publication date
CN1283848C (zh) 2006-11-08
JP4148895B2 (ja) 2008-09-10
JPWO2003033775A1 (ja) 2005-02-03
CN1476492A (zh) 2004-02-18
WO2003033775A1 (fr) 2003-04-24
US20040011654A1 (en) 2004-01-22
KR20040045390A (ko) 2004-06-01

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees