TW202410182A - 基板處理裝置 - Google Patents

基板處理裝置 Download PDF

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Publication number
TW202410182A
TW202410182A TW112128128A TW112128128A TW202410182A TW 202410182 A TW202410182 A TW 202410182A TW 112128128 A TW112128128 A TW 112128128A TW 112128128 A TW112128128 A TW 112128128A TW 202410182 A TW202410182 A TW 202410182A
Authority
TW
Taiwan
Prior art keywords
pipe
liquid
switching valve
drain
substrate
Prior art date
Application number
TW112128128A
Other languages
English (en)
Chinese (zh)
Inventor
石丸慧
東克栄
植村知浩
吉原直彦
藤原直樹
竹松佑介
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW202410182A publication Critical patent/TW202410182A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW112128128A 2022-08-24 2023-07-27 基板處理裝置 TW202410182A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022133197A JP2024030355A (ja) 2022-08-24 2022-08-24 基板処理装置
JP2022-133197 2022-08-24

Publications (1)

Publication Number Publication Date
TW202410182A true TW202410182A (zh) 2024-03-01

Family

ID=90034524

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112128128A TW202410182A (zh) 2022-08-24 2023-07-27 基板處理裝置

Country Status (4)

Country Link
JP (1) JP2024030355A (ja)
KR (1) KR20240028293A (ja)
CN (1) CN117637533A (ja)
TW (1) TW202410182A (ja)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6494536B2 (ja) 2016-01-12 2019-04-03 東京エレクトロン株式会社 基板処理装置および基板処理装置の洗浄方法

Also Published As

Publication number Publication date
JP2024030355A (ja) 2024-03-07
CN117637533A (zh) 2024-03-01
KR20240028293A (ko) 2024-03-05

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