TW202410182A - 基板處理裝置 - Google Patents
基板處理裝置 Download PDFInfo
- Publication number
- TW202410182A TW202410182A TW112128128A TW112128128A TW202410182A TW 202410182 A TW202410182 A TW 202410182A TW 112128128 A TW112128128 A TW 112128128A TW 112128128 A TW112128128 A TW 112128128A TW 202410182 A TW202410182 A TW 202410182A
- Authority
- TW
- Taiwan
- Prior art keywords
- pipe
- liquid
- switching valve
- drain
- substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 256
- 239000007788 liquid Substances 0.000 claims abstract description 333
- 239000000126 substance Substances 0.000 claims abstract description 164
- 238000004140 cleaning Methods 0.000 claims description 135
- 238000000034 method Methods 0.000 claims description 56
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 100
- 239000000243 solution Substances 0.000 description 90
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 59
- 239000008367 deionised water Substances 0.000 description 52
- 229910021641 deionized water Inorganic materials 0.000 description 52
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 46
- 238000010586 diagram Methods 0.000 description 31
- 230000001105 regulatory effect Effects 0.000 description 25
- QOSATHPSBFQAML-UHFFFAOYSA-N hydrogen peroxide;hydrate Chemical compound O.OO QOSATHPSBFQAML-UHFFFAOYSA-N 0.000 description 17
- 239000012530 fluid Substances 0.000 description 15
- 230000002093 peripheral effect Effects 0.000 description 12
- 235000012431 wafers Nutrition 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 8
- 230000001681 protective effect Effects 0.000 description 8
- 239000003814 drug Substances 0.000 description 7
- 230000000717 retained effect Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 230000000903 blocking effect Effects 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 3
- 235000011114 ammonium hydroxide Nutrition 0.000 description 3
- 230000003111 delayed effect Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000008235 industrial water Substances 0.000 description 3
- 239000008155 medical solution Substances 0.000 description 3
- 238000009987 spinning Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 2
- 239000000908 ammonium hydroxide Substances 0.000 description 2
- SWXQKHHHCFXQJF-UHFFFAOYSA-N azane;hydrogen peroxide Chemical compound [NH4+].[O-]O SWXQKHHHCFXQJF-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- XEMZLVDIUVCKGL-UHFFFAOYSA-N hydrogen peroxide;sulfuric acid Chemical compound OO.OS(O)(=O)=O XEMZLVDIUVCKGL-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 229910021642 ultra pure water Inorganic materials 0.000 description 2
- 239000012498 ultrapure water Substances 0.000 description 2
- 239000002351 wastewater Substances 0.000 description 2
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 1
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- DKAGJZJALZXOOV-UHFFFAOYSA-N hydrate;hydrochloride Chemical compound O.Cl DKAGJZJALZXOOV-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022133197A JP2024030355A (ja) | 2022-08-24 | 2022-08-24 | 基板処理装置 |
JP2022-133197 | 2022-08-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202410182A true TW202410182A (zh) | 2024-03-01 |
Family
ID=90034524
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW112128128A TW202410182A (zh) | 2022-08-24 | 2023-07-27 | 基板處理裝置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2024030355A (ja) |
KR (1) | KR20240028293A (ja) |
CN (1) | CN117637533A (ja) |
TW (1) | TW202410182A (ja) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6494536B2 (ja) | 2016-01-12 | 2019-04-03 | 東京エレクトロン株式会社 | 基板処理装置および基板処理装置の洗浄方法 |
-
2022
- 2022-08-24 JP JP2022133197A patent/JP2024030355A/ja active Pending
-
2023
- 2023-07-26 KR KR1020230097651A patent/KR20240028293A/ko unknown
- 2023-07-27 TW TW112128128A patent/TW202410182A/zh unknown
- 2023-08-23 CN CN202311076036.3A patent/CN117637533A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2024030355A (ja) | 2024-03-07 |
CN117637533A (zh) | 2024-03-01 |
KR20240028293A (ko) | 2024-03-05 |
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