TW202144121A - 雙面研磨裝置用載具的製造方法及晶圓的雙面研磨方法 - Google Patents

雙面研磨裝置用載具的製造方法及晶圓的雙面研磨方法 Download PDF

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Publication number
TW202144121A
TW202144121A TW110110290A TW110110290A TW202144121A TW 202144121 A TW202144121 A TW 202144121A TW 110110290 A TW110110290 A TW 110110290A TW 110110290 A TW110110290 A TW 110110290A TW 202144121 A TW202144121 A TW 202144121A
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TW
Taiwan
Prior art keywords
double
carrier
wafer
stage
load
Prior art date
Application number
TW110110290A
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English (en)
Chinese (zh)
Inventor
吉田容輝
田中佑宜
Original Assignee
日商信越半導體股份有限公司
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Publication date
Application filed by 日商信越半導體股份有限公司 filed Critical 日商信越半導體股份有限公司
Publication of TW202144121A publication Critical patent/TW202144121A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW110110290A 2020-05-19 2021-03-23 雙面研磨裝置用載具的製造方法及晶圓的雙面研磨方法 TW202144121A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020087470A JP7276246B2 (ja) 2020-05-19 2020-05-19 両面研磨装置用キャリアの製造方法及びウェーハの両面研磨方法
JP2020-087470 2020-05-19

Publications (1)

Publication Number Publication Date
TW202144121A true TW202144121A (zh) 2021-12-01

Family

ID=78606760

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110110290A TW202144121A (zh) 2020-05-19 2021-03-23 雙面研磨裝置用載具的製造方法及晶圓的雙面研磨方法

Country Status (5)

Country Link
JP (1) JP7276246B2 (ja)
KR (1) KR20230011291A (ja)
CN (1) CN115485813A (ja)
TW (1) TW202144121A (ja)
WO (1) WO2021235066A1 (ja)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5114113B2 (ja) * 2007-07-02 2013-01-09 スピードファム株式会社 ワークキャリア
JP2009222183A (ja) 2008-03-18 2009-10-01 Nok Corp シール構造
JP5494224B2 (ja) * 2010-05-20 2014-05-14 信越半導体株式会社 両面研磨装置用キャリア及びこれを用いた両面研磨装置並びに両面研磨方法
JP5847789B2 (ja) * 2013-02-13 2016-01-27 信越半導体株式会社 両面研磨装置用キャリアの製造方法およびウエーハの両面研磨方法
KR20160056089A (ko) 2014-11-11 2016-05-19 엘지이노텍 주식회사 발광 장치
JP6447332B2 (ja) * 2015-04-13 2019-01-09 信越半導体株式会社 両面研磨装置用のキャリアの製造方法およびウェーハの両面研磨方法
JP6443370B2 (ja) * 2016-03-18 2018-12-26 信越半導体株式会社 両面研磨装置用のキャリアの製造方法およびウェーハの両面研磨方法
JP6863309B2 (ja) * 2018-02-06 2021-04-21 信越半導体株式会社 両面研磨装置用のキャリアの製造方法及びウェーハの両面研磨方法
JP6977657B2 (ja) * 2018-05-08 2021-12-08 信越半導体株式会社 両面研磨装置用キャリアの保管方法及びウェーハの両面研磨方法

Also Published As

Publication number Publication date
JP7276246B2 (ja) 2023-05-18
KR20230011291A (ko) 2023-01-20
CN115485813A (zh) 2022-12-16
JP2021182586A (ja) 2021-11-25
WO2021235066A1 (ja) 2021-11-25

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