TW201815546A - Device and method for supplying resin material, resin molding device, and resin molded product manufacturing method capable of supplying a resin material to an object in a manner of becoming almost uniform compared to the prior art - Google Patents

Device and method for supplying resin material, resin molding device, and resin molded product manufacturing method capable of supplying a resin material to an object in a manner of becoming almost uniform compared to the prior art Download PDF

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TW201815546A
TW201815546A TW106120168A TW106120168A TW201815546A TW 201815546 A TW201815546 A TW 201815546A TW 106120168 A TW106120168 A TW 106120168A TW 106120168 A TW106120168 A TW 106120168A TW 201815546 A TW201815546 A TW 201815546A
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resin material
supply
resin
supplied
supplying
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TW106120168A
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TWI656958B (en
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荒木芳文
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東和股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
    • B29C31/042—Feeding of the material to be moulded, e.g. into a mould cavity using dispensing heads, e.g. extruders, placed over or apart from the moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
    • B29C31/06—Feeding of the material to be moulded, e.g. into a mould cavity in measured doses, e.g. by weighting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3405—Feeding the material to the mould or the compression means using carrying means
    • B29C2043/3427—Feeding the material to the mould or the compression means using carrying means hopper, vessel, chute, tube, conveying screw, for material in discrete form, e.g. particles or powder or fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3433—Feeding the material to the mould or the compression means using dispensing heads, e.g. extruders, placed over or apart from the moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3488—Feeding the material to the mould or the compression means uniformly distributed into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5875—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

A resin material supply device comprises a supply object holding part for holding a supply object as a target to which a resin material is supplied; and a resin material supply port disposed above the supply object holding part; a moving part for moving the resin material supply port relative to a relative position in horizontal direction of the supply object held by the supply object holding part; and a control part controlling the moving part in a manner of making the relative position pass the entire supply object area of the object to be supplied started from the starting position without passing the same position twice or more to return to the starting position. By returning the relative position to the starting position, the resin material is resupplied near the starting position where the supply amount of the resin material is less at the time of starting the supply, so that the amount of the resin material near the starting position becomes almost uniform.

Description

樹脂材料供給裝置及方法、樹脂成形裝置及樹脂成形品製造方法    Resin material supply device and method, resin molding device, and resin molded product manufacturing method   

本發明係關於一種供給樹脂材料之樹脂材料供給裝置及方法、具有該樹脂材料供給裝置之樹脂成形裝置、以及使用該樹脂材料供給方法之樹脂成形品製造方法。 The present invention relates to a resin material supply device and method for supplying a resin material, a resin molding device having the resin material supply device, and a resin molded product manufacturing method using the resin material supply method.

為了自光、熱、濕氣等環境保護電子零件，電子零件一般由樹脂密封。樹脂密封之方法中有壓縮成形法或移送成形法等。壓縮成形法係藉由使用由下模與上模構成之成形模具，對下模之模槽供給樹脂材料，將裝設有電子零件之基板安裝至上模後，一面對下模與上模進行加熱，一面將兩者合模進行成形。移送成形法係藉由對上模與下模中之一者之模槽安裝基板後，一面對下模與上模進行加熱，一面將兩者合模，並利用柱塞(plunger)將樹脂壓入至模槽進行成形。於移送成形法中，在自柱塞對模槽送給樹脂之路徑中會殘留樹脂之一部分而產生浪費，並且會產生因樹脂流動而導致半導體基板或配線損傷之問題，故而近年來壓縮成形法成為主流。 In order to protect electronic parts from light, heat, humidity and other environmental protection, electronic parts are generally sealed by resin. Resin sealing methods include compression molding and transfer molding. The compression molding method uses a forming mold composed of a lower mold and an upper mold to supply a resin material to a mold groove of the lower mold, and after mounting a substrate on which electronic components are mounted to the upper mold, it faces the lower mold and the upper mold. Heat and mold the two while closing. In the transfer molding method, after the substrate is installed in the mold slot of one of the upper mold and the lower mold, the lower mold and the upper mold are heated while the two are closed, and the resin is plungered to the resin. It is pressed into a die cavity to be formed. In the transfer molding method, a part of the resin remains in the path of feeding the resin from the plunger to the mold groove to cause waste, and the semiconductor substrate or the wiring is damaged due to the resin flow. Therefore, the compression molding method has been used in recent years. Go mainstream.

於壓縮成形中，一般而言，供給至模槽之樹脂材料係使用粉末狀或顆粒狀(以下，將其等統稱為「粉體狀」)者、或者液體狀者。粉體狀之樹脂材料於供給後不會於模槽內自由流動，關於液體狀之樹脂材料，於壓縮成形中所使用者一般而言黏性較高，故而不太於模槽內流動。因此，於成形時，藉由因對樹脂材料進行加熱而導致黏性下降，樹脂於模槽內流動，而有對電子零件施加負荷之虞，故而樹脂材料較佳為於成形前預先儘可能均勻地供給至模槽內。專利文獻1所記載之壓縮成形裝置係一面自滑件之樹脂材料供給口使樹脂材料落下至載置於XY平台上之模槽，一面將樹脂材料供給口之位置固定，使XY平台呈U形曲線狀移動，藉此對模槽內供給樹脂材料。於圖11中表示該習知之壓縮成形裝置中樹脂材料供給口相對於模槽91之相對移動之軌道92。該U形曲線狀之相對移動期間，一面將移動速度維持為固定之值，一面將樹脂材料以固定之供給速度(每單位時間之樹脂材料之供給量)供給，藉此模槽91內之樹脂材料不管處於哪一位置均變得均勻。 In compression molding, generally, the resin material to be supplied to the mold cavity is powdered or granular (hereinafter, these are collectively referred to as "powdered") or liquid. The powdered resin material does not flow freely in the mold groove after being supplied. As for the liquid resin material, the user in compression molding generally has a high viscosity, so it does not flow much in the mold groove. Therefore, during molding, the viscosity of the resin material is reduced due to the heating of the resin material, and the resin flows in the mold cavity, which may cause a load on the electronic parts. Therefore, it is preferable that the resin material be as uniform as possible before molding. Ground is supplied into the mold slot. The compression molding device described in Patent Document 1 is a resin material supply port that slides from the resin material to a die groove placed on the XY platform while fixing the position of the resin material supply port to make the XY platform U-shaped. The resin material is supplied into the cavity by moving in a curved shape. FIG. 11 shows a track 92 of the relative movement of the resin material supply port with respect to the die groove 91 in the conventional compression molding apparatus. During the U-curve relative movement, the resin material is supplied at a fixed supply speed (supply amount of resin material per unit time) while maintaining the moving speed at a fixed value, whereby the resin in the mold groove 91 is supplied. The material becomes uniform no matter where it is.

[先前技術文獻] [Prior technical literature]

[專利文獻] [Patent Literature]

[專利文獻1]日本特開2013-042017號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2013-042017

一般而言，於對模槽投入樹脂材料之裝置中，自開始樹脂材 料之供給動作後至達到上述固定之供給速度為止需要時間(雖然僅需些許)，剛開始供給後之供給速度較該固定之供給速度低。因此，即便將模槽之移動速度設為固定，於模槽內，剛開始供給後之位置(開始位置)之樹脂材料之量亦較其他位置上之樹脂材料之量減少。由此，模槽內之樹脂材料變得不均勻。 Generally speaking, in a device for feeding a resin material into a mold cavity, it takes time (although only a little) until the above-mentioned fixed supply speed is reached after the resin material supply operation is started. The supply speed is low. Therefore, even if the moving speed of the die groove is fixed, the amount of the resin material at the position (starting position) immediately after the supply is started in the die groove is reduced compared to the amount of the resin material at other positions. As a result, the resin material in the mold groove becomes uneven.

本發明所欲解決之課題在於提供一種能夠以與習知相比變得近乎均勻之方式對樹脂成形裝置之模槽等供給對象物供給樹脂材料的樹脂材料供給裝置及方法。 The problem to be solved by the present invention is to provide a resin material supply device and method capable of supplying a resin material to a supply target such as a die groove of a resin molding device in a manner that is more uniform than conventional.

為了解決上述課題而完成之本發明之樹脂材料供給裝置之特徵在於具備：a)供給對象物保持部，其保持供給樹脂材料之對象之供給對象物；b)樹脂材料供給口，其設置於該供給對象物保持部之上方；c)移動部，其使上述樹脂材料供給口相對於保持於上述供給對象物保持部之供給對象物的水平方向之相對位置移動；及d)控制部，其以上述相對位置自開始位置起不會於移動路徑中通過同一位置2次以上地返回至該開始位置的方式控制上述供給對象物之供給對象區域中之上述移動部之移動。 The resin material supply device of the present invention completed in order to solve the above-mentioned problems is characterized by including: a) a supply target holding portion that holds a supply target of a target to which the resin material is supplied; b) a resin material supply port provided in the Above the supply target holding portion; c) a moving portion that moves the relative position of the resin material supply port with respect to a horizontal direction of the supply target held by the supply target holding portion; and d) a control portion that The relative position does not control the movement of the moving part in the supply target area of the supply target object from the start position to return to the start position by the same position more than twice in the movement path.

本發明之樹脂材料供給方法之特徵在於：一面使為供給樹脂材料之對象之供給對象物與設置於該供給對象物之上方之樹脂材料供給口之水平方向的相對位置以自開始位置起不會於移動路徑中通過同一位置2次以上地返回至該開始位置的方式於上述供給對象物之供給對象區域移 動，一面自該樹脂材料供給口對該供給對象物供給樹脂材料。 The method for supplying a resin material according to the present invention is characterized in that the relative position in the horizontal direction between a supply target object to be supplied with the resin material and a resin material supply port provided above the supply target is prevented from the start position A resin material is supplied to the supply target object from the resin material supply port while moving in the supply target area of the supply target object by returning to the starting position twice or more at the same position in the movement path.

本發明之樹脂成形裝置之特徵在於具備：上述樹脂材料供給裝置；壓縮成形部，其具有第1成形模具、具有模槽之第2成形模具、及將該第1成形模具與該第2成形模具合模之合模機構；及移送部，其將藉由上述樹脂材料供給裝置而被供給有樹脂材料之供給對象物移送至上述模槽之上，自該供給對象物對該模槽供給該樹脂材料。 A resin molding apparatus according to the present invention includes: the above-mentioned resin material supply device; a compression molding section including a first molding die, a second molding die having a die groove, and the first molding die and the second molding die A mold clamping mechanism for clamping the mold; and a transfer unit that transfers a supply object to which the resin material is supplied by the resin material supply device to the mold groove, and supplies the resin from the supply object to the mold groove. material.

本發明之樹脂成形品製造方法之特徵在於具有如下步驟：藉由上述樹脂材料供給方法對上述供給對象物供給樹脂材料之步驟；將被供給有樹脂材料之供給對象物移送至第2成形模具之模槽，且自該供給對象物對該模槽供給該樹脂材料之步驟；及將第1成形模具與模槽中被供給有樹脂材料之第2成形模具合模之步驟。 The method for manufacturing a resin molded article of the present invention is characterized by having the steps of: supplying a resin material to the supply target by the resin material supply method; and transferring the supply target to which the resin material is supplied to a second molding die. A step of feeding the resin material to the mold slot from the supply target; and a step of clamping the first molding mold and the second molding mold to which the resin material is supplied from the mold slot.

根據本發明，能夠以與習知相比變得近乎均勻之方式對樹脂成形裝置之模槽等供給對象物供給樹脂材料。 According to the present invention, it is possible to supply a resin material to a supply target such as a die groove of a resin molding apparatus in a manner that is more uniform than conventional.

10、10A‧‧‧樹脂材料供給裝置 10, 10A‧‧‧ resin material supply device

11‧‧‧樹脂材料保持部 11‧‧‧Resin material holding section

12‧‧‧槽 12‧‧‧slot

121‧‧‧樹脂材料供給口 121‧‧‧Resin material supply port

13‧‧‧激勵部 13‧‧‧Incentive Department

14‧‧‧計量部 14‧‧‧ Metrology Department

15‧‧‧原供給部 15‧‧‧ Former Supply Department

151‧‧‧原供給口 151‧‧‧ Original supply port

152‧‧‧原供給部激勵部 152‧‧‧Former Supply Department Incentive Department

16‧‧‧保持台 16‧‧‧ holding table

17‧‧‧移動部 17‧‧‧Mobile

18‧‧‧移送部 18‧‧‧ Transfer Department

19‧‧‧控制部 19‧‧‧ Control Department

191‧‧‧供給速度檢測部 191‧‧‧Supply speed detection section

192‧‧‧警報發送部 192‧‧‧Alarm sending department

20、20A‧‧‧樹脂材料移送托盤 20, 20A‧‧‧Resin material transfer tray

21、21A‧‧‧樹脂材料收容部 21, 21A‧‧‧Resin material storage department

211‧‧‧樹脂材料收容框 211‧‧‧Resin material storage frame

2111‧‧‧停止部 2111‧‧‧Stop Department

212‧‧‧膜張力框材 212‧‧‧ film tension frame

2121‧‧‧突出部 2121‧‧‧ protrusion

213‧‧‧膜固定部 213‧‧‧Film fixing part

22、22A‧‧‧開始位置 22, 22A‧‧‧ starting position

23、23A1、23A2、92‧‧‧相對位置之移動之軌道 23, 23A1, 23A2, 92‧‧‧ orbits in relative position

24、241、242、243、244‧‧‧樹脂材料收容部之邊緣 24, 241, 242, 243, 244‧‧‧Edge of resin material storage

245‧‧‧樹脂材料收容部之長邊之邊緣之中央 245‧‧‧ The center of the long edge of the resin container

25‧‧‧曲線之外側之區域 25‧‧‧ Area outside the curve

30‧‧‧壓縮成形部 30‧‧‧Compression molding department

311‧‧‧下部固定盤 311‧‧‧ Lower fixed plate

312‧‧‧上部固定盤 312‧‧‧upper fixed plate

32‧‧‧連桿 32‧‧‧ connecting rod

33‧‧‧可動平台 33‧‧‧ Mobile platform

34‧‧‧合模裝置 34‧‧‧Clamping device

351‧‧‧下部加熱器 351‧‧‧lower heater

352‧‧‧上部加熱器 352‧‧‧upper heater

40‧‧‧樹脂成形裝置 40‧‧‧resin molding device

41‧‧‧材料接收模組 41‧‧‧Material receiving module

411‧‧‧基板接收部 411‧‧‧Substrate receiving section

42‧‧‧成形模組 42‧‧‧forming module

43‧‧‧排出模組 43‧‧‧Discharge module

431‧‧‧樹脂成形品保持部 431‧‧‧Resin molded product holding section

46‧‧‧主搬送裝置 46‧‧‧Main conveying device

47‧‧‧副搬送裝置 47‧‧‧Deputy transfer device

91‧‧‧模槽 91‧‧‧mould groove

F‧‧‧離形薄膜 F‧‧‧ Release film

LM‧‧‧下模(第2成形模具) LM‧‧‧Lower mold (second forming mold)

MC‧‧‧模槽 MC‧‧‧mould slot

P‧‧‧樹脂材料 P‧‧‧Resin material

PA‧‧‧樹脂材料收容空間 PA‧‧‧Resin material storage space

S‧‧‧基板 S‧‧‧ substrate

UM‧‧‧上模(第1成形模具) UM‧‧‧ Upper mold (No. 1 forming mold)

圖1係表示本發明之樹脂材料供給裝置之一實施形態之概略構成圖。 FIG. 1 is a schematic configuration diagram showing an embodiment of a resin material supply device of the present invention.

圖2係表示於樹脂材料移送托盤供給有樹脂材料之狀態(a)、及將樹脂材料移送托盤提昇而形成樹脂材料收容空間之狀態(b)的圖。 2 is a view showing a state (a) where a resin material is supplied to the resin material transfer tray, and a state (b) where the resin material transfer tray is raised to form a resin material storage space.

圖3係表示樹脂材料移送托盤、及於本實施形態之樹脂材料供給裝置中對該樹脂材料移送托盤供給樹脂材料之軌道之例的俯視圖。 FIG. 3 is a plan view showing an example of a resin material transfer tray and a track for supplying a resin material to the resin material transfer tray in the resin material supply device of the present embodiment.

圖4係表示自樹脂材料供給口朝樹脂材料移送托盤之樹脂材料收容部的樹脂材料之供給速度之目標值與實測值之時間變化的曲線圖。 FIG. 4 is a graph showing a time change of a target value and a measured value of a resin material supply speed from a resin material supply port to a resin material storage section of a resin material transfer tray.

圖5係供給至樹脂材料移送托盤之樹脂材料收容部之樹脂材料的與相對位置之移動方向平行之縱剖面圖，圖5(a)係表示剛開始供給後之狀態，圖5(b)係表示供給結束時之狀態。 Fig. 5 is a longitudinal sectional view of a resin material supplied to a resin material storage portion of a resin material transfer tray in parallel with a relative position moving direction. Fig. 5 (a) shows a state immediately after the supply is started, and Fig. 5 (b) shows Shows the status at the end of supply.

圖6係供給至樹脂材料移送托盤之樹脂材料收容部之樹脂材料的與相對位置之移動方向垂直之縱剖面圖。 6 is a longitudinal cross-sectional view of a resin material supplied to a resin material storage section of a resin material transfer tray, which is perpendicular to a moving direction of a relative position.

圖7係表示樹脂材料移送托盤及於本實施形態之樹脂材料供給裝置中對樹脂材料移送托盤供給樹脂材料之軌道之另一例的俯視圖。 FIG. 7 is a plan view showing another example of a resin material transfer tray and a track for supplying the resin material to the resin material transfer tray in the resin material supply device of the present embodiment.

圖8係表示本實施形態之樹脂材料供給裝置之變形例之概略構成圖。 FIG. 8 is a schematic configuration diagram showing a modified example of the resin material supply device of this embodiment.

圖9係表示為本發明之樹脂成形裝置之一部分之壓縮成形部之一例的縱剖面圖。 Fig. 9 is a longitudinal cross-sectional view showing an example of a compression-molded portion which is a part of a resin molding apparatus of the present invention.

圖10係表示具備材料接收模組、成形模組、及排出模組之樹脂成形裝置之例的概略圖。 FIG. 10 is a schematic diagram showing an example of a resin molding apparatus including a material receiving module, a molding module, and a discharge module.

圖11係表示於習知之壓縮成形裝置中對模槽供給樹脂材料之軌道的俯視圖。 FIG. 11 is a plan view showing a track for supplying a resin material to a die groove in a conventional compression molding apparatus.

於本發明之樹脂材料供給裝置及方法中，一面使樹脂材料供給口相對於保持於供給對象物保持部之供給對象物的水平方向之相對位置 以自開始位置起不會於移動路徑中通過同一位置2次以上地返回至開始位置之方式於上述供給對象物之供給對象區域移動，一面自樹脂材料供給口將樹脂材料供給至供給對象物。由於如此般以使相對位置返回至開始位置之方式使該相對位置移動，故而將於移動結束時供給之樹脂材料之一部分或全部供給至開始位置。藉此，即便因剛開始樹脂材料之供給後之樹脂材料之供給速度較慢而使供給至該開始位置之樹脂材料之量變少，亦會藉由在移動結束時所供給之樹脂材料之一部分或全部被供給至開始位置而得以彌補，故而供給至供給對象物之樹脂材料變得近乎均勻。又，於移動路徑中，相對位置不會通過同一位置2次以上，故而不存在對同一位置供給樹脂材料2次以上而使樹脂材料之供給量變多之情況。 In the resin material supply device and method of the present invention, the relative position of the resin material supply port with respect to the horizontal direction of the supply target object held by the supply target object holding portion will not pass through the same path in the movement path from the starting position. The position is returned to the starting position more than twice, and the resin material is supplied to the supply target from the resin material supply port while moving in the supply target area of the supply target. Since the relative position is moved in such a manner that the relative position is returned to the starting position, a part or all of the resin material supplied at the end of the movement is supplied to the starting position. Therefore, even if the amount of the resin material supplied to the starting position is reduced due to the slow supply speed of the resin material immediately after the supply of the resin material is started, a part of the resin material supplied at the end of the movement or The entire supply is made up to the starting position, and the resin material supplied to the supply target becomes almost uniform. Further, in the moving path, the relative position does not pass through the same position more than twice, so there is no case where the resin material is supplied to the same position twice or more, and the supply amount of the resin material increases.

於本發明之樹脂材料供給裝置及方法中，上述相對位置「返回至開始位置」除了包含上述相對位置返回至與開始位置為同一位置之情況以外，亦包含樹脂材料擴展而到達至如下位置之情況，該位置距開始位置僅隔開樹脂材料到達至開始位置之程度的距離。 In the resin material supply device and method of the present invention, the above-mentioned relative position "return to the starting position" includes the case where the above-mentioned relative position returns to the same position as the starting position, and also includes the case where the resin material expands to reach the following position , The position is separated from the starting position by a distance from the resin material to the starting position.

上述相對位置之移動可為藉由供給對象物保持部之移動，亦可為藉由樹脂材料供給口之移動，或者亦可為藉由供給對象物保持部與樹脂材料供給口之兩者之移動。 The above-mentioned relative position movement may be the movement by the supply object holding portion, the movement by the resin material supply port, or the movement by both the supply object holding portion and the resin material supply port. .

供給對象物例如可為樹脂成形裝置之模槽，亦可為自樹脂材料供給裝置對設置於樹脂成形裝置之模槽搬送樹脂材料之樹脂材料搬送托盤。或者，亦可為進行樹脂成形之對象物亦即封裝有電子零件之基板。 The object to be supplied may be, for example, a die groove of a resin molding device, or a resin material transfer tray that transfers a resin material from the resin material supply device to a die groove provided in the resin molding device. Alternatively, it may be an object to be resin-molded, that is, a substrate in which electronic components are packaged.

樹脂材料可為粉體狀者，亦可為液體狀者。 The resin material may be powdered or liquid.

於本發明之樹脂材料供給裝置及方法中，為了對供給對象物 均勻地供給樹脂材料，通常將相對位置之移動速度及自樹脂材料供給口對供給對象物供給樹脂材料之供給速度設為固定。但是，例如於以下所示之情形時，上述移動速度及上述供給速度中之任一個或兩個可變。於該情形時，由於移動速度較供給速度更容易控制，故而較理想為將移動速度設為可變而將供給速度設為等速。 In the resin material supply device and method of the present invention, in order to uniformly supply the resin material to the supply target, the relative position moving speed and the supply speed of the resin material to the supply target from the resin material supply port are usually fixed. However, for example, in the case shown below, one or both of the moving speed and the supplying speed may be changed. In this case, since the movement speed is easier to control than the supply speed, it is desirable to set the movement speed to be variable and set the supply speed to a constant speed.

作為將移動速度及/或供給速度設為可變之情形，可列舉以下之例。 Examples of the case where the moving speed and / or the supply speed are variable include the following.

當對矩形等具有角部之形狀之模槽供給樹脂材料時，若為了使相對位置順利地移動而使該相對位置以曲線之軌道移動，則存在樹脂材料未充分地擴散至角部附近之情況。因此，當於角部附近使相對位置呈曲線狀移動時，藉由使移動速度較呈直線狀移動時變慢(及/或加快供給速度)，能夠使樹脂材料向角部附近之供給量變多，從而於模槽整體使樹脂材料更近乎均勻。 When a resin material is supplied to a mold groove having a corner shape such as a rectangle, if the relative position is moved on a curved track in order to smoothly move the relative position, the resin material may not sufficiently diffuse to the vicinity of the corner. . Therefore, when the relative position is moved in a curved shape near the corner, the moving speed is slower (and / or the supply speed is increased) than when the linear movement is performed, so that the supply amount of the resin material to the corner is increased , So that the resin material as a whole more nearly uniform.

又，若使相對位置沿模槽之邊緣移動，則樹脂材料不會擴展至較該邊緣更靠外側，故而邊緣附近之樹脂材料之量較其他位置變多。因此，當使相對位置沿模槽之邊緣移動時，藉由使移動速度較於模槽之更內側移動之情形時加快(及/或使供給速度變慢)，能夠使樹脂材料向邊緣附近之供給量變少，從而於模槽整體使樹脂材料更近乎均勻。 In addition, if the relative position is moved along the edge of the die groove, the resin material will not spread to the outside than the edge, so the amount of resin material near the edge becomes larger than other positions. Therefore, when the relative position is moved along the edge of the die groove, the resin material can be moved toward the vicinity of the edge by making the movement speed faster than when the die groove is moved more inward (and / or slowing the feeding speed). The supply amount is reduced, thereby making the resin material more uniform throughout the die cavity.

樹脂材料之供給速度除了於上述剛開始供給後變慢以外，亦存在因對樹脂材料供給口送出樹脂材料之裝置之故障等而變得不穩定之情況。因此，可於本發明之樹脂材料供給裝置設置檢測樹脂材料之供給速度之供給速度檢測部。於該情形時，亦可進一步地於樹脂材料供給裝置設置 藉由供給速度檢測部檢測到供給速度之異常(超過或未達既定之設定範圍)時，對裝置之管理者發出聲音、光、或者顯示於顯示裝置(顯示器)之圖像等之警告的警告部。或者，亦可於藉由供給速度檢測部檢測到供給速度之異常時，停止移動部之動作及樹脂材料自樹脂材料供給口之供給。於本發明之樹脂材料供給方法中，亦同樣地，可於對上述供給對象物供給樹脂材料期間檢測樹脂材料之供給速度，進一步地，亦可於檢測到供給速度之異常時發出警告或停止樹脂材料之供給。 The supply speed of the resin material is not only reduced immediately after the supply is started, but also may be unstable due to a failure of a device for feeding the resin material to the resin material supply port. Therefore, the resin material supply device of the present invention may be provided with a supply speed detection unit that detects the supply speed of the resin material. In this case, when the supply speed of the resin material supply device is detected by the supply speed detection unit (over or under the set range), a sound, light, or A warning section for warnings such as images displayed on a display device (display). Alternatively, when an abnormality in the supply speed is detected by the supply speed detection section, the operation of the moving section and the supply of the resin material from the resin material supply port may be stopped. In the resin material supply method of the present invention, similarly, the supply speed of the resin material can be detected during the supply of the resin material to the supply object, and further, a warning can be issued or the resin can be stopped when an abnormality in the supply speed is detected. Supply of materials.

以下，使用圖1~圖10，對本發明之樹脂材料供給裝置、樹脂材料供給方法、樹脂成形裝置、及樹脂成形品製造方法之更具體之實施形態進行說明。 Hereinafter, more specific embodiments of the resin material supply device, the resin material supply method, the resin molding device, and the resin molded product manufacturing method of the present invention will be described using FIGS. 1 to 10.

(1)本實施形態之樹脂材料供給裝置之構成 (1) Configuration of the resin material supply device of this embodiment

於圖1中表示本實施形態之樹脂材料供給裝置10之概略構成。樹脂材料供給裝置10係對為供給對象物之樹脂材料移送托盤20供給粉體狀之樹脂材料P的裝置。 FIG. 1 shows a schematic configuration of a resin material supply device 10 according to this embodiment. The resin material supply device 10 is a device that supplies a powdery resin material P to a resin material transfer tray 20 that is a supply target.

樹脂材料供給裝置10具有保持樹脂材料P之樹脂材料保持部11、及槽12。槽12之一端連接於樹脂材料保持部11，另一端設置有為對樹脂材料移送托盤20供給樹脂材料P之開口之樹脂材料供給口121。又，樹脂材料供給裝置10具有：激勵部13，其使樹脂材料保持部11及槽12振動；及計量部14，其測定包含樹脂材料P之樹脂材料保持部11及槽12之重量。於樹脂材料保持部11之上方，具有對該樹脂材料保持部11供給樹脂材料P之原供給部15。原供給部15係於其下部設置有為對樹脂材料保持部11供給樹脂材料P之開口之原供給口151及使該原供給部15振動之原供給 部激勵部152。樹脂材料保持部11係配置於原供給口151之正下方。 The resin material supply device 10 includes a resin material holding portion 11 that holds a resin material P, and a groove 12. One end of the groove 12 is connected to the resin material holding portion 11, and the other end is provided with a resin material supply port 121 that is opened to supply the resin material P to the resin material transfer tray 20. The resin material supply device 10 includes an excitation unit 13 that vibrates the resin material holding unit 11 and the groove 12, and a measuring unit 14 that measures the weight of the resin material holding unit 11 and the groove 12 including the resin material P. Above the resin material holding portion 11, there is an original supply portion 15 that supplies the resin material P to the resin material holding portion 11. The original supply unit 15 is provided at its lower portion with an original supply port 151 for opening the resin material P to the resin material holding portion 11 and an original supply unit excitation unit 152 that vibrates the original supply unit 15. The resin material holding portion 11 is disposed directly below the original supply port 151.

於樹脂材料供給口121之正下方配置有保持樹脂材料移送托盤20之保持台(供給對象物保持部)16。於保持台16之下設置有使該保持台16沿水平方向移動之移動部17。移動部17能夠使保持台16沿X方向(圖1之橫向)及Y方向(圖1之與紙面垂直之方向)中之任一個以低於既定之最高速度之範圍內之任意速度移動，且能夠使保持台16沿X方向與Y方向之兩者同時移動。因此，亦能夠使樹脂材料供給口121與保持台16之水平方向之相對位置沿任意方向以任意速度移動。另外，一般將保持台16與移動部17合併而成者稱為「XY平台」。 A holding table (supplying object holding section) 16 that holds the resin material transfer tray 20 is disposed directly below the resin material supply port 121. A moving part 17 is provided below the holding table 16 to move the holding table 16 in the horizontal direction. The moving part 17 can move the holding table 16 in any one of the X direction (the horizontal direction in FIG. 1) and the Y direction (the direction perpendicular to the paper surface in FIG. 1) at an arbitrary speed within a range lower than a predetermined maximum speed, and The holding table 16 can be moved simultaneously in both the X direction and the Y direction. Therefore, the relative position of the resin material supply port 121 and the holding table 16 in the horizontal direction can also be moved at an arbitrary speed in an arbitrary direction. In addition, the combination of the holding stage 16 and the moving unit 17 is generally referred to as an "XY stage".

樹脂材料供給裝置10又具有將被供給樹脂材料P之前之樹脂材料移送托盤20搬入並載置於保持台16之上，並且將被供給樹脂材料P之後之樹脂材料移送托盤20自保持台16之上搬出之移送部18。 The resin material supply device 10 further includes a resin material transfer tray 20 before being supplied with the resin material P and is placed on the holding table 16, and a resin material transfer tray 20 after being supplied with the resin material P is removed from the holding table 16.上 haul out of the transfer section 18.

樹脂材料供給裝置10進一步地具有控制部19。控制部19藉由電腦之硬體及軟體而實現，控制自樹脂材料供給口121將樹脂材料P供給至樹脂材料移送托盤20時之ON/OFF或供給速度，並且控制移動部17之動作。關於利用控制部19進行之控制之詳細情況，以下與樹脂材料供給裝置10整體之動作一併進行說明。 The resin material supply device 10 further includes a control unit 19. The control unit 19 is realized by the hardware and software of a computer, controls the ON / OFF or supply speed when the resin material P is supplied to the resin material transfer tray 20 from the resin material supply port 121, and controls the operation of the movement unit 17. The details of the control performed by the control unit 19 will be described below along with the overall operation of the resin material supply device 10.

如圖2(a)所示，樹脂材料移送托盤20具備具有對應於壓縮成形裝置之成形模具之模槽的形狀、大小，且相當於上述供給對象區域之樹脂材料收容部21。樹脂材料收容部21由為具有長方形之開口部之框材之樹脂材料收容框211、及覆蓋樹脂材料收容框211之開口部之下面的離形薄膜F所構成。於樹脂材料收容框211之下面設置有藉由抽吸空氣而使離 形薄膜F吸附至該下面之吸附機構(未圖示)。於樹脂材料收容框211之開口部之內側形成有內周側之下端部分朝內側突出而成之停止部2111。於樹脂材料收容框211之內側設置有對應於樹脂材料收容框211之開口部之形狀的長方形之框材，且係於外周側具有突出部2121，剖面為倒L字形之環之膜張力框材212。樹脂材料收容框211之側面由移送部18固持。於移送部18之下設置有固持張設於樹脂材料收容框211之下面之離形薄膜F之端部的膜固定部213。 As shown in FIG. 2 (a), the resin material transfer tray 20 includes a resin material storage portion 21 having a shape and size corresponding to a mold groove of a molding die of a compression molding device and corresponding to the supply target area. The resin material accommodating portion 21 is composed of a resin material accommodating frame 211 which is a frame material having a rectangular opening portion, and a release film F covering a lower surface of the opening portion of the resin material accommodating frame 211. An adsorption mechanism (not shown) is provided below the resin material housing frame 211 to suck the release film F to the lower surface by sucking air. A stopper 2111 is formed on the inner side of the opening portion of the resin material storage frame 211 and the lower end portion of the inner peripheral side projects inward. A rectangular frame material corresponding to the shape of the opening of the resin material storage frame 211 is provided inside the resin material storage frame 211, and is a film tension frame material having a protruding portion 2121 on the outer peripheral side and an inverted L-shaped cross section. 212. The side surface of the resin material storage frame 211 is held by the transfer portion 18. A film fixing portion 213 is provided below the transfer portion 18 and holds an end portion of the release film F stretched and set under the resin material storage frame 211.

樹脂材料移送托盤20係若如下述般藉由樹脂材料供給裝置10使樹脂材料收容部21接收樹脂材料P之供給(圖2(a))之後，由移送部18提昇，則膜張力框材212相對於樹脂材料收容框211藉由自重相對地下降直至突出部2121抵接於停止部2111為止。藉此，形成對應於成形模具之模槽之形狀的樹脂材料收容空間PA(圖2(b))。 The resin material transfer tray 20 is a film tension frame material 212 that is raised by the transfer unit 18 after the resin material storage unit 21 receives the supply of the resin material P by the resin material supply device 10 as shown below (FIG. 2 (a)). The resin frame 211 is relatively lowered by its own weight until the protruding portion 2121 abuts on the stop portion 2111. Thereby, the resin material storage space PA corresponding to the shape of the groove of the molding die is formed (FIG. 2 (b)).

(2)本實施形態之樹脂材料供給裝置之動作及本實施形態之樹脂材料供給方法 (2) The operation of the resin material supply device of this embodiment and the resin material supply method of this embodiment

以下，對樹脂材料供給裝置10之動作(本實施形態之樹脂材料供給方法)進行說明。 The operation of the resin material supply device 10 (the resin material supply method of this embodiment) will be described below.

操作者預先對原供給部15供給樹脂材料P。然後，操作者使用設置於樹脂材料供給裝置10之觸控面板等輸入裝置(未圖示)進行既定之操作，藉此開始樹脂材料供給裝置10之動作。 The operator supplies the resin material P to the original supply unit 15 in advance. Then, the operator performs a predetermined operation using an input device (not shown) such as a touch panel provided in the resin material supply device 10, thereby starting the operation of the resin material supply device 10.

首先，移送部18將被供給樹脂材料P之前之樹脂材料移送托盤20搬入並載置於保持台16之上。繼而，移動部17藉由控制部19之控制，以將樹脂材料供給口121配置於樹脂材料移送托盤20之樹脂材料收容 部21中之既定之開始位置22(參照圖3)之正上方之方式，使保持台16沿水平方向移動。於圖3之例中，將具有大致長方形之上表面之樹脂材料收容部21之長邊之邊緣之附近且該長邊之中央245附近之位置設為開始位置22，但開始位置亦可為樹脂材料收容部21內之任一位置。 First, the transfer unit 18 loads the resin material transfer tray 20 before the resin material P is supplied, and places the resin material transfer tray 20 on the holding table 16. Then, the moving unit 17 is controlled by the control unit 19 to arrange the resin material supply port 121 directly above a predetermined start position 22 (see FIG. 3) in the resin material storage unit 21 of the resin material transfer tray 20. To move the holding table 16 in the horizontal direction. In the example of FIG. 3, the position near the edge of the long side and the center of the long side 245 of the resin material containing portion 21 having a substantially rectangular upper surface is set to the start position 22, but the start position may be resin. Any position in the material storage portion 21.

接著，計量部14測定將樹脂材料保持部11及槽12、以及收容於其等中之樹脂材料P加在一起後之重量。由於樹脂材料保持部11及槽12之重量已知，故而藉由自此處所測定之重量減去該等樹脂材料保持部11及槽12之重量，可求出樹脂材料保持部11及槽12內之樹脂材料P之重量。於該樹脂材料P之重量較應供給至樹脂材料移送托盤20之樹脂材料收容部21之樹脂材料之重量足夠多之情形時，開始下一段落中所述之對樹脂材料收容部21之樹脂材料P之供給動作。另一方面，於該樹脂材料P之重量不充分或者為零之情形時，控制部19以自原供給部激勵部152對原供給部15賦予既定時間之振動之方式，控制該原供給部激勵部152。藉此，將原供給部15內之樹脂材料P透過原供給口151僅供給既定之量至樹脂材料保持部11。 Next, the weighing unit 14 measures the weight of the resin material holding portion 11 and the groove 12 and the resin material P accommodated in the resin material holding portion 11 and the groove 12. Since the weights of the resin material holding portion 11 and the groove 12 are known, by subtracting the weights of the resin material holding portion 11 and the groove 12 from the weight measured here, the resin material holding portion 11 and the groove 12 can be obtained. Weight of the resin material P. When the weight of the resin material P is more than the weight of the resin material supplied to the resin material storage section 21 of the resin material transfer tray 20, the resin material P for the resin material storage section 21 described in the next paragraph is started. Its supply action. On the other hand, when the weight of the resin material P is insufficient or is zero, the control unit 19 controls the original supply unit to excite the original supply unit 15 by applying vibration to the original supply unit 15 for a predetermined period of time.部 152. Thereby, the resin material P in the original supply portion 15 is supplied through the original supply port 151 only to a predetermined amount to the resin material holding portion 11.

接著，控制部19以自激勵部13對樹脂材料保持部11及槽12以固定之強度賦予振動之方式控制該激勵部13。藉此，自樹脂材料供給口121對樹脂材料移送托盤20之樹脂材料收容部21以固定之供給速度供給樹脂材料P。與該振動之賦予之開始同時地，控制部19以使樹脂材料供給口121相對於樹脂材料收容部21之水平方向之相對位置移動之方式，控制移動部17。 Next, the control unit 19 controls the excitation unit 13 such that the self-excitation unit 13 applies vibration to the resin material holding unit 11 and the groove 12 with a fixed intensity. Thereby, the resin material P is supplied to the resin material storage part 21 of the resin material transfer tray 20 from the resin material supply port 121 at a fixed supply rate. Simultaneously with the start of the application of the vibration, the control unit 19 controls the moving unit 17 so as to move the relative position of the resin material supply port 121 with respect to the horizontal direction of the resin material storage unit 21.

圖3中，作為一例，表示該相對位置移動之軌道23。相對 位置首先自開始位置22起沿樹脂材料收容部21之一長邊之邊緣241移動至一短邊之邊緣242附近，於此處以描畫U字之方式，即，以轉U形彎之方式，一面朝向另一長邊之邊緣243側沿短邊方向(短邊延伸方向)移動與樹脂材料供給口121之寬度相同程度之距離，一面使長邊方向(長邊延伸之方向)之移動之朝向反轉。另外，此處之短邊方向之移動距離若為自樹脂材料供給口121供給之樹脂材料P擴展之範圍內，則亦可較樹脂材料供給口121之寬度長。其後，當相對位置返回至長邊方向之中央245附近時，同樣地轉U形彎而移動至上述一短邊之邊緣242附近。藉由以此方式反覆於一短邊之邊緣附近與長邊方向之中央附近轉U形彎，當到達至另一長邊之邊緣243附近時，相對位置沿該另一長邊之邊緣243移動至另一短邊之邊緣244附近。因此，相對位置一面朝向上述一長邊之邊緣241側沿短邊方向移動與樹脂材料供給口121之寬度相同程度之距離，一面使長邊方向之移動之朝向反轉(轉U形彎)。以後，相對位置一面於長邊方向之中央245附近與另一短邊之邊緣244附近反覆轉U形彎，一面移動至一長邊之邊緣241附近。如此，相對位置通過為供給對象區域之樹脂材料收容部21之整體，最後沿一長邊之邊緣241返回至開始位置22。於以上所述之相對位置之移動期間，繼續自樹脂材料供給口121朝樹脂材料收容部21供給樹脂材料P。 FIG. 3 shows, as an example, the orbit 23 of the relative position movement. The relative position first moves from the starting position 22 along the long side edge 241 of one of the resin material accommodating portions 21 to the short side edge 242. Here, the U-shape is drawn, that is, the U-turn is turned. One side faces the edge 243 side of the other long side, and moves in the short side direction (short side extension direction) by the same distance as the width of the resin material supply port 121, while making the long side direction (long side extension direction) move the direction Reverse. In addition, if the moving distance in the short-side direction is within the extended range of the resin material P supplied from the resin material supply port 121, it may be longer than the width of the resin material supply port 121. Thereafter, when the relative position returns to the vicinity of the center 245 in the long side direction, the U-turn is similarly moved to move to the vicinity of the edge 242 of the short side. By repeating the U-turn near the edge of one short side and the center of the long side in this way, when it reaches the edge 243 of the other long side, the relative position moves along the edge 243 of the other long side To near the other short edge 244. Therefore, the relative position moves in the direction of the short side toward the edge 241 side of the long side in the short direction by the same distance as the width of the resin material supply port 121, and reverses the direction of movement in the long side direction (turns U-shaped). After that, the relative position is repeatedly U-turned near the center 245 in the long direction and near the edge 244 of the other short side, while moving to the vicinity of the edge 241 on the long side. In this way, the relative position passes through the entirety of the resin material accommodating portion 21 which is the supply target area, and finally returns to the starting position 22 along the long edge 241. During the relative position movement described above, the resin material P is continuously supplied from the resin material supply port 121 toward the resin material receiving portion 21.

此處，相對位置「通過供給對象物之供給對象區域之整體」除了包含以使樹脂材料供給口通過供給對象區域之整體之方式使相對移動之軌道之間隔緊密地(以樹脂材料供給口之寬度程度)填滿之情形以外，亦包含軌道之間以自樹脂材料供給口供給之樹脂材料擴展而遍及至供給對象區域整體之程度隔開之情況。進一步地，亦包含軌道與供給對象區域之 端部之間以自樹脂材料供給口供給之樹脂材料擴展而遍及至供給對象區域整體之程度隔開之情況。 Here, the relative position "through the entire supply target region of the supply target object" includes not only that the distance of the relative movement track is made to be close (by the width of the resin material supply port) so that the resin material supply port passes through the entire supply target region. In addition to the case of filling, the case also includes a case where the rails are separated to the extent that the resin material supplied from the resin material supply port is extended to the entire supply target area. Furthermore, the case where the rail and the end of the supply target area are separated by the extent that the resin material supplied from the resin material supply port is extended to the entire supply target area is also included.

如圖4所示，樹脂材料P之供給速度自剛開始供給後起一定期間(圖中之「上升期間」)內未達到目標值。因此，如圖5(a)所示，於開始供給時供給至開始位置22附近之樹脂材料P之供給量較其後供給之位置變少。另外，於圖5(a)中，自開始位置22觀察，於相對位置之移動方向之相反側亦存在樹脂材料P，其原因在於：樹脂材料供給口121具有一定之寬度，以及樹脂材料P自樹脂材料供給口121落下至樹脂材料收容部21時沿水平方向擴展。而且，當相對位置通過樹脂材料收容部21之整體後返回至開始位置22時，對剛開始供給後樹脂材料P之供給量較少之開始位置22附近再次供給樹脂材料P，故而開始位置22附近之樹脂材料P之量與無該再次之供給之情形時相比，變得接近於其他位置上之樹脂材料P之量(亦即，近乎均勻)(圖5(b))。 As shown in FIG. 4, the supply rate of the resin material P has not reached a target value within a certain period of time (“rising period” in the figure) immediately after the supply of the resin material P is started. Therefore, as shown in FIG. 5 (a), the supply amount of the resin material P supplied to the vicinity of the start position 22 at the start of supply is smaller than the position to be supplied thereafter. In addition, in FIG. 5 (a), when viewed from the starting position 22, the resin material P also exists on the opposite side to the direction of movement of the relative position because the resin material supply port 121 has a certain width and the resin material P When the resin material supply port 121 drops to the resin material storage portion 21, it expands in the horizontal direction. In addition, when the relative position passes through the entire resin material storage portion 21 and returns to the start position 22, the resin material P is supplied again near the start position 22 where the supply amount of the resin material P is small immediately after the start of supply, so the start position 22 is near the start position 22. The amount of the resin material P becomes closer to the amount (that is, almost uniform) of the resin material P at other positions than when no re-supply is provided (FIG. 5 (b)).

使相對位置移動之速度(移動速度)既可固定，亦可如以下所例示般設為根據位置可變。另外，關於相對位置之移動速度，與剛開始移動後即上升期間相比，略微移動後之控制更容易。因此，於本實施形態中，將較上升期間後之時間之移動速度設為可變。例如，於在軌道23中轉U形彎之部位，供給至曲線之外側之區域(圖3中標註符號25而表示之區域)之樹脂材料P之量與直線之部位相比變少，故而藉由在轉U形彎之部位使相對位置之移動速度變慢，而略多地對該曲線部分供給樹脂材料P。如此，略多地供給至曲線之樹脂材料P擴展至樹脂材料P之量較少之曲線之外側，藉此能夠使樹脂材料P之供給量近乎均勻。 The speed (moving speed) for moving the relative position may be fixed, or may be made variable according to the position as exemplified below. In addition, the movement speed of the relative position is easier to control after a slight movement than when the movement is started immediately after the movement. Therefore, in this embodiment, the moving speed is made variable from the time after the rising period. For example, the amount of the resin material P supplied to the area outside the curve (the area indicated by the reference numeral 25 in FIG. 3) at the portion where the U-turn is turned in the track 23 is smaller than the portion of the straight line. The resin material P is supplied to the curved portion slightly by slowing down the moving speed of the relative position at the U-turned portion. In this way, the resin material P supplied slightly to the curve is expanded beyond the curve where the amount of the resin material P is small, whereby the supply amount of the resin material P can be made almost uniform.

又，如圖6所示，因相對位置沿樹脂材料收容部21之邊緣24移動時所供給之樹脂材料P1不會擴展至邊緣24側，故而若使相對位置以等速移動，則變得較於樹脂材料收容部21之更內側移動時所供給之樹脂材料P2多。因此，藉由使相對位置沿樹脂材料收容部21之邊緣24移動時之移動速度較於其他位置之移動速度快，能夠使樹脂材料P之供給量近乎均勻。 As shown in FIG. 6, the resin material P1 supplied when the relative position is moved along the edge 24 of the resin material accommodating portion 21 does not extend to the edge 24 side. Therefore, if the relative position is moved at a constant speed, the relative position becomes relatively small. When the resin material storage portion 21 is moved further inside, a large amount of resin material P2 is supplied. Therefore, by moving the relative position along the edge 24 of the resin material accommodating portion 21 at a faster speed than at other positions, the supply amount of the resin material P can be made almost uniform.

利用本實施形態之樹脂材料供給裝置10供給樹脂材料之樹脂材料移送托盤之樹脂材料收容部(及對應於其之壓縮成形裝置之成形模具之模槽)之平面形狀並不限於圖3所示之長方形，可設為長方形以外之四邊形、四邊形以外之多邊形、圓形等任意之形狀。例如於使用樹脂材料收容部21A為圓形之樹脂材料移送托盤20A之情形時，可使相對位置沿圖7(a)所示之軌道23A1移動。於該移動中，相對位置係將樹脂材料收容部21A之邊緣附近作為開始位置22A，首先，沿該邊緣呈圓弧狀移動將近90°之後，一面朝向圓之中心移動相當於樹脂材料供給口121之寬度之量，一面轉U形彎，呈同心圓(圓弧)狀朝反方向移動將近90°之後，進一步地轉U形彎，反覆進行該動作直至到達至該圓之中心附近。此處設為「將近90°」而非90°之原因在於：為了確保轉U形彎所需之區域。繼而，相對位置於該圓之中心附近移動將近180°，一面朝向樹脂材料收容部21A之邊緣移動相當於樹脂材料供給口121之寬度之量，一面轉U形彎，呈同心圓(圓弧)狀向反方向移動將近90°之後，進一步地轉U形彎，反覆進行該動作直至到達至邊緣附近。進一步地，相對位置於邊緣附近移動將近180°後，進行與此前相同之自邊緣附近朝向圓之中心之操作，其後進行自圓之中心朝向邊 緣附近之操作。然後，於相對位置於該邊緣附近呈圓弧狀移動時到達至開始位置22A，結束一連串之移動。 The planar shape of the resin material storage portion of the resin material transfer tray (and the mold groove corresponding to the molding die of the compression molding device) supplied by the resin material supply device 10 of the present embodiment is not limited to that shown in FIG. 3 The rectangle can be any shape such as a quadrilateral other than a rectangle, a polygon other than a quadrilateral, and a circle. For example, when the resin material transfer tray 20A in which the resin material accommodating portion 21A is circular is used, the relative position can be moved along the track 23A1 shown in FIG. 7 (a). In this movement, the relative position is the starting position 22A near the edge of the resin material accommodating portion 21A. First, after moving approximately 90 ° along the edge in an arc shape, one side moves toward the center of the circle corresponding to the resin material supply port 121. The width of the U-turn is one side, and the concentric circle (arc) moves in the opposite direction for nearly 90 °. Then, the U-turn is further turned, and the operation is repeated until it reaches the center of the circle. The reason why it is set to "near 90 °" instead of 90 ° is to ensure the area required for U-turns. Then, the relative position moves approximately 180 ° near the center of the circle, while moving toward the edge of the resin material containing portion 21A is equivalent to the width of the resin material supply port 121, while turning U-shaped to form a concentric circle (arc) After the shape moves in the opposite direction for nearly 90 °, it further turns the U-bend and repeats this action until it reaches the edge. Further, after the relative position is moved approximately 180 ° near the edge, the same operation is performed from the vicinity of the edge toward the center of the circle as before, and then the operation from the center of the circle toward the edge is performed. Then, when the relative position moves in an arc shape near the edge, it reaches the starting position 22A, and ends a series of movements.

於圖7(a)之例中，相對位置每當移動將近90°時轉U形彎，於到達至圓之中心或邊緣時移動將近180°，但亦可如於圖7(b)中以軌道23A2所示般，每當移動將近180°時轉U形彎，於到達至圓之中心或邊緣時移動將近360°。 In the example of Fig. 7 (a), the U-turn is turned when the relative position moves nearly 90 °, and it moves nearly 180 ° when it reaches the center or edge of the circle, but it can also be used as shown in Fig. 7 (b). As shown in the track 23A2, the U-turn is turned whenever the movement is nearly 180 °, and the movement is nearly 360 ° when it reaches the center or edge of the circle.

於圖8中表示變形例之樹脂材料供給裝置10A之概略構成。變形例之樹脂材料供給裝置10A除了具有上述樹脂材料供給裝置10所具有之構成要素以外，還具有供給速度檢測部191及警報發送部192。供給速度檢測部191於對供給對象物供給樹脂材料期間，獲取計量部14所計量之重量，由該重量之時間變化檢測樹脂材料向供給對象物之供給速度。警報發送部192於利用供給速度檢測部191所檢測出之樹脂材料之供給速度偏離既定範圍之情形時發出警報音。警報發送部192亦可代替發出警報音，而發出光或於畫面上顯示圖像。若供給速度偏離既定範圍，則供給至供給對象物之樹脂材料之量會偏離目標值，故而藉由以此方式發出警報，能夠防止以錯誤之樹脂材料之量進行樹脂成形。另外，亦可代替設置警報發送部192，而設置於利用供給速度檢測部191檢測出之樹脂材料之供給速度偏離既定範圍之情形時使裝置停止之停止控制部。 FIG. 8 shows a schematic configuration of a resin material supply device 10A according to a modification. The resin material supply device 10A according to the modification includes a supply speed detection unit 191 and an alarm transmission unit 192 in addition to the components included in the resin material supply device 10 described above. During the supply of the resin material to the supply target, the supply speed detection unit 191 obtains the weight measured by the weighing unit 14 and detects the supply speed of the resin material to the supply target from the change in the weight over time. The alarm transmitting section 192 issues an alarm sound when the supply speed of the resin material detected by the supply speed detecting section 191 deviates from a predetermined range. The alarm transmitting unit 192 may emit light or display an image on a screen instead of generating an alarm sound. If the supply speed deviates from the predetermined range, the amount of the resin material supplied to the supply target will deviate from the target value. Therefore, by issuing an alarm in this manner, it is possible to prevent resin molding from being performed with the wrong amount of the resin material. In addition, instead of providing the alarm transmitting unit 192, a stop control unit may be provided to stop the device when the supply speed of the resin material detected by the supply speed detecting unit 191 deviates from a predetermined range.

於以上之例中，以對樹脂材料移送托盤20供給樹脂材料之情形為例進行了說明，但亦可自樹脂材料供給裝置10對具有上述以外之構成之樹脂材料移送托盤供給樹脂材料。又，亦可將成形模具設為可搬送，自樹脂材料供給裝置10對該成形模具之模槽供給樹脂材料，亦可自樹脂材 料供給裝置10對封裝有電子零件之基板之表面供給樹脂材料。樹脂材料並不限於粉體狀者，亦可使用液體狀者。 In the above example, the case where the resin material is supplied to the resin material transfer tray 20 has been described as an example, but the resin material may be supplied from the resin material supply device 10 to a resin material transfer tray having a structure other than the above. Alternatively, the molding die may be transportable, and the resin material may be supplied from the resin material supply device 10 to the mold groove of the molding die, or the resin material may be supplied from the resin material supply device 10 to the surface of the substrate on which the electronic components are enclosed. The resin material is not limited to a powder form, and a liquid form may be used.

(3)本實施形態之樹脂成形裝置(壓縮成形裝置)及樹脂成形品製造方法之實施形態 (3) An embodiment of the resin molding apparatus (compression molding apparatus) and the method for manufacturing a resin molded product of this embodiment

本實施形態之樹脂成形裝置具有上述樹脂材料供給裝置10及壓縮成形部30。以下，使用圖9對壓縮成形部30之構成進行說明。 The resin molding apparatus of this embodiment includes the above-mentioned resin material supply apparatus 10 and a compression molding section 30. Hereinafter, the configuration of the compression molding section 30 will be described using FIG. 9.

於壓縮成形部30中，在下部固定盤311之四角分別立設有連桿32(一共4根)，於連桿32之上端附近設置有長方形之上部固定盤312。在下部固定盤311與上部固定盤312之間設置有長方形之可動平台33。可動平台33於四角設置有供連桿32通過之孔，可沿連桿32上下移動。於下部固定盤311之上，設置有為使可動平台33上下移動之裝置之合模裝置34。 In the compression molding section 30, connecting rods 32 (a total of four) are respectively erected at the four corners of the lower fixing plate 311, and a rectangular upper fixing plate 312 is provided near the upper end of the connecting rod 32. A rectangular movable platform 33 is provided between the lower fixed plate 311 and the upper fixed plate 312. The movable platform 33 is provided with holes at the four corners through which the connecting rod 32 passes, and can move up and down along the connecting rod 32. Above the lower fixed plate 311, a mold clamping device 34 is provided for a device for moving the movable platform 33 up and down.

於可動平台33之上面配置有下部加熱器351，於下部加熱器351之上，設置有作為上述第2成形模具之下模LM。 A lower heater 351 is disposed on the upper surface of the movable platform 33. Above the lower heater 351, a lower mold LM serving as the second molding die is provided.

於上部固定盤312之下表面配置有上部加熱器352，於上部加熱器352之下，安裝有為上述第1成形模具之上模UM。於上模UM之下面，能夠安裝封裝有半導體晶片之基板S。上模UM與下模LM係相互對向地配置。 An upper heater 352 is arranged on the lower surface of the upper fixed plate 312. Below the upper heater 352, the above-mentioned first mold UM is mounted. Below the upper mold UM, a substrate S on which a semiconductor wafer is packaged can be mounted. The upper mold UM and the lower mold LM are arranged to face each other.

壓縮成形部30之動作如下。首先，藉由基板移動機構(未圖示)，於上模UM之下面安裝封裝有半導體晶片之基板S。接著，如上所述般將於樹脂材料供給裝置10中被供給有樹脂材料P之樹脂材料移送托盤20藉由移送部18移送至下模LM之正上方，將樹脂材料收容空間PA內之樹脂材料P與離形薄膜F一併收容至模槽MC內。另外，向上模UM之基 板S之安裝與向下模LM之樹脂材料P之收容亦可以與上述相反之順序進行。 The operation of the compression molding section 30 is as follows. First, a substrate S on which a semiconductor wafer is packaged is mounted under the upper mold UM by a substrate moving mechanism (not shown). Next, as described above, the resin material transfer tray 20 to which the resin material P is supplied in the resin material supply device 10 is transferred by the transfer portion 18 directly above the lower mold LM to transfer the resin material in the resin material storage space PA. P and the release film F are received in the mold groove MC together. In addition, the mounting of the base plate S of the upper die UM and the storage of the resin material P of the lower die LM may be performed in the reverse order as described above.

於該狀態下，藉由利用下部加熱器351對模槽MC內之樹脂材料P進行加熱而使其軟化，並且藉由上部加熱器352對基板S進行加熱。於樹脂材料P及基板S已被加熱之狀態下，藉由合模裝置34使可動平台33上升，將成形模具(上模UM與下模LM)合模，使樹脂材料P硬化。於樹脂材料P硬化後，藉由利用合模裝置34使可動平台33下降而開模。 In this state, the resin material P in the cavity MC is heated and softened by the lower heater 351, and the substrate S is heated by the upper heater 352. In a state where the resin material P and the substrate S have been heated, the movable platform 33 is raised by the mold clamping device 34, and the molding mold (upper mold UM and lower mold LM) is closed to harden the resin material P. After the resin material P is hardened, the mold is opened by lowering the movable platform 33 by the mold clamping device 34.

藉由以上所述之樹脂材料供給裝置10及壓縮成形部30之動作(樹脂成形品製造方法)，而製造樹脂密封有半導體晶片之樹脂密封品(樹脂成形品)。所獲得之樹脂密封品係藉由下模LM之內面由離形薄膜F被覆，而自下模LM順利地脫模。 The resin-sealed product (resin-molded product) in which a semiconductor wafer is resin-sealed is manufactured by the operations of the resin material supply device 10 and the compression-molded part 30 described above (resin-molded product manufacturing method). The obtained resin-sealed product was covered with the release film F by the inner surface of the lower mold LM, and the mold was smoothly released from the lower mold LM.

接著，使用圖10，對本發明之樹脂成形裝置之其他實施形態進行說明。本實施形態之樹脂成形裝置40具有材料接收模組41、成形模組42、及排出模組43。材料接收模組41係用以自外部接收樹脂材料P及基板S並送出至成形模組42之裝置，具備上述樹脂材料供給裝置10，並且具有基板接收部411。1台成形模組42具備1組上述壓縮成形部30。於圖10中表示有3台成形模組42，但於樹脂成形裝置40中可設置任意台數之成形模組42。又，即便於將樹脂成形裝置40組裝完成而開始使用之後，亦能夠增減成形模組42。排出模組43的作用為將利用成形模組42製造之樹脂成形品自成形模組42搬入並保持，且具有樹脂成形品保持部431。 Next, another embodiment of the resin molding apparatus of the present invention will be described using FIG. 10. The resin molding apparatus 40 of this embodiment includes a material receiving module 41, a molding module 42, and a discharge module 43. The material receiving module 41 is a device for receiving the resin material P and the substrate S from the outside and sending the resin material P and the substrate S to the forming module 42. The material receiving module 41 includes the resin material supplying device 10 described above, and includes a substrate receiving section 411. One forming module 42 includes 1 The above-mentioned compression-molded portion 30 is assembled. Although three forming modules 42 are shown in FIG. 10, an arbitrary number of forming modules 42 may be provided in the resin forming apparatus 40. In addition, even after the resin molding apparatus 40 is assembled and used, the molding module 42 can be increased or decreased. The discharge module 43 functions to carry and hold a resin molded product manufactured by the molding module 42 from the molding module 42 and includes a resin molded product holding portion 431.

以貫穿材料接收模組41、1或多台成形模組42、及排出模組43之方式，設置有搬送基板S、樹脂材料移送托盤20、及樹脂成形品之 主搬送裝置46。上述移送部18構成主搬送裝置46之一部分。又，於各模組內，於主搬送裝置46與該模組內之裝置之間設置有搬送基板S、樹脂材料移送托盤20、及樹脂成形品之副搬送裝置47。 A main transfer device 46 for transferring a substrate S, a resin material transfer tray 20, and a resin molded product is provided so as to penetrate the material receiving module 41, one or more molding modules 42, and a discharging module 43. The transfer unit 18 described above constitutes a part of the main transfer device 46. In each module, a transfer substrate S, a resin material transfer tray 20, and a resin transfer device 47 are provided between the main transfer device 46 and the devices in the module.

此外，樹脂成形裝置40具有用以使上述各模組動作之電源及控制部(均未圖示)。 In addition, the resin molding apparatus 40 includes a power source and a control unit (neither of which is shown) for operating the modules.

對樹脂成形裝置40之動作進行說明。基板S係由操作者保持於材料接收模組41之基板接收部411。主搬送裝置46及副搬送裝置47將基板S自基板接收部411搬送至處於成形模組42中之1台中的壓縮成形部30，並將基板S安裝至該壓縮成形部30之上模UM。繼而，主搬送裝置46及副搬送裝置47將樹脂材料移送托盤20搬入至樹脂材料供給裝置10。於樹脂材料供給裝置10中，如上所述般對樹脂材料移送托盤20供給樹脂材料P。主搬送裝置46及副搬送裝置47將被供給有樹脂材料P之樹脂材料移送托盤20搬送至在上模UM安裝有基板S之成形模組42之壓縮成形部30，將樹脂材料移送托盤20配置於該壓縮成形部30之下模LM之上後，將樹脂材料P自樹脂材料移送托盤20供給至下模LM之模槽MC。其後，藉由主搬送裝置46及副搬送裝置47將樹脂材料移送托盤20自壓縮成形部30搬出，其後於該壓縮成形部30中進行壓縮成形。於利用該壓縮成形部30進行壓縮成形期間，對其他壓縮成形部30進行與此前相同之操作，藉此可於多個壓縮成形部30間一面錯開時間一面並行地進行壓縮成形。藉由壓縮成形而獲得之樹脂成形品係藉由主搬送裝置46及副搬送裝置47自壓縮成形部30搬出，搬入至排出模組43之樹脂成形品保持部431並保持。使用者適當將樹脂成形品自樹脂成形品保持部431取出。 The operation of the resin molding apparatus 40 will be described. The substrate S is held by the operator in the substrate receiving portion 411 of the material receiving module 41. The main transfer device 46 and the sub transfer device 47 transfer the substrate S from the substrate receiving section 411 to the compression molding section 30 in one of the molding modules 42, and mount the substrate S to the compression molding section 30 on the die UM. Then, the main conveying device 46 and the sub conveying device 47 carry the resin material transfer tray 20 into the resin material supply device 10. In the resin material supply device 10, the resin material P is supplied to the resin material transfer tray 20 as described above. The main transfer device 46 and the sub transfer device 47 transfer the resin material transfer tray 20 to which the resin material P is supplied to the compression molding section 30 of the molding module 42 on which the substrate S is mounted on the upper mold UM, and arrange the resin material transfer tray 20 After the compression molding portion 30 is positioned above the lower mold LM, the resin material P is supplied from the resin material transfer tray 20 to the mold groove MC of the lower mold LM. Thereafter, the resin material transfer tray 20 is carried out from the compression molding section 30 by the main transfer device 46 and the sub-transport device 47, and compression molding is performed in the compression molding section 30. During the compression molding using the compression molding section 30, the other compression molding sections 30 are operated in the same manner as before, so that the compression molding can be performed in parallel while the plurality of compression molding sections 30 are shifted in time. The resin molded product obtained by compression molding is carried out from the compression molding section 30 by the main conveying device 46 and the sub conveying device 47, and is carried into the resin molded product holding section 431 of the discharge module 43 and held. The user appropriately takes out the resin molded product from the resin molded product holding portion 431.

本發明當然並不限定於上述各實施形態，除上述說明中所述之方面以外，亦能夠進行各種變形。 The invention is of course not limited to the embodiments described above, and various modifications can be made in addition to the aspects described in the above description.

Claims (10)

一種樹脂材料供給裝置，其特徵在於具備：a)供給對象物保持部，其保持作為供給樹脂材料之對象之供給對象物；b)樹脂材料供給口，其設置於該供給對象物保持部之上方；c)移動部，其使上述樹脂材料供給口相對於保持於上述供給對象物保持部之供給對象物的水平方向之相對位置移動；及d)控制部，其以上述相對位置自開始位置起不會於移動路徑中通過同一位置2次以上地返回至該開始位置的方式控制上述供給對象物之供給對象區域中之上述移動部之移動。     A resin material supply device, comprising: a) a supply target holding portion that holds a supply target that is a target for supplying a resin material; b) a resin material supply port provided above the supply target holding portion C) a moving part that moves the relative position of the resin material supply port with respect to the horizontal direction of the supply target object held by the supply object holding part; and d) a control part that starts from the start position with the relative position The movement of the moving part in the supply target area of the supply target is not controlled by returning to the starting position more than two times in the same position in the movement path.     如申請專利範圍第1項之樹脂材料供給裝置，其中上述相對位置之移動速度及自上述樹脂材料供給口供給之樹脂材料之供給速度中之任一個或兩個可變。     For example, in the resin material supply device of the scope of application for patent, one or both of the above-mentioned relative position moving speed and the supply speed of the resin material supplied from the above-mentioned resin material supply port are variable.     如申請專利範圍第2項之樹脂材料供給裝置，其中上述移動速度可變，且上述供給速度為等速。     For example, the resin material supply device of the second patent application range, wherein the above-mentioned moving speed is variable, and the above-mentioned supply speed is a constant speed.     如申請專利範圍第1至3項中任一項之樹脂材料供給裝置，其具備供給速度檢測部，該供給速度檢測部檢測自上述樹脂材料供給口供給之樹脂材料之供給速度。     The resin material supply device according to any one of claims 1 to 3, includes a supply speed detection unit that detects a supply speed of the resin material supplied from the resin material supply port.     一種樹脂材料供給方法，其特徵在於：一面使為供給樹脂材料之對象之供給對象物與設置於該供給對象物之上方之樹脂材料供給口之水平方向的相對位置以自開始位置起不會於移動路徑中通過同一位置2次以上地返回至該開始位置的方式於上述供給對象物之供給對象區域移 動，一面自該樹脂材料供給口對該供給對象物供給樹脂材料。     A method for supplying a resin material, characterized in that: a relative position in a horizontal direction between a supply target object to be supplied with the resin material and a resin material supply port provided above the supply target object is prevented from starting at a position In the moving path, the resin material is supplied to the supply target object from the resin material supply port by moving in the supply target region of the supply target object by returning to the starting position twice or more at the same position.     如申請專利範圍第5項之樹脂材料供給方法，其中上述相對位置之移動速度及自上述樹脂材料供給口供給之樹脂材料之供給速度中之任一個或兩個可變。     For example, in the method for supplying a resin material according to item 5 of the scope of the application, any one or both of the above-mentioned relative position moving speed and the supply speed of the resin material supplied from the above-mentioned resin material supply port are variable.     如申請專利範圍第6項之樹脂材料供給方法，其中上述移動速度可變，且上述供給速度為等速。     For example, the method for supplying a resin material according to item 6 of the application, wherein the above-mentioned moving speed is variable, and the above-mentioned supplying speed is a constant speed.     如申請專利範圍第5至7項中任一項之樹脂材料供給方法，其檢測自上述樹脂材料供給口供給之樹脂材料之供給速度。     For example, the method for supplying a resin material according to any one of items 5 to 7 of the scope of patent application, which detects the supply speed of the resin material supplied from the resin material supply port.     一種樹脂成形裝置，其特徵在於具備：如申請專利範圍第1至4項中任一項之樹脂材料供給裝置；壓縮成形部，其具有第1成形模具、具有模槽之第2成形模具、及將該第1成形模具與該第2成形模具合模之合模機構；及移送部，其將藉由上述樹脂材料供給裝置而被供給有樹脂材料之供給對象物移送至上述模槽之上，自該供給對象物對該模槽供給該樹脂材料。     A resin molding device, comprising: a resin material supply device according to any one of claims 1 to 4; a compression molding section having a first molding die, a second molding die having a die groove, and A clamping mechanism for clamping the first forming mold and the second forming mold; and a transfer unit that transfers a supply target to which the resin material is supplied by the resin material supply device to the mold groove, The resin material is supplied to the mold cavity from the supply target.     一種樹脂成形品製造方法，其特徵在於具有如下步驟：藉由如申請專利範圍第5至8項中任一項之樹脂材料供給方法對上述供給對象物供給樹脂材料之步驟；將被供給有樹脂材料之供給對象物移送至第2成形模具之模槽，且自該供給對象物對該模槽供給該樹脂材料之步驟；及將第1成形模具與模槽中供給有樹脂材料之第2成形模具合模之步驟。     A method for manufacturing a resin molded product, comprising the steps of: supplying a resin material to the above-mentioned object to be supplied by the resin material supplying method according to any one of claims 5 to 8; A step of transferring a material supply object to a mold groove of a second molding die, and supplying the resin material to the mold groove from the supply target; and a second molding in which a resin material is supplied to the first molding die and the mold groove Steps of mold clamping.    
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