CN107972220B

CN107972220B - Resin material supply device and method, resin molding device, and resin molded product manufacturing method

Info

Publication number: CN107972220B
Application number: CN201710977144.6A
Authority: CN
Inventors: 荒木芳文
Original assignee: Towa Corp
Current assignee: Towa Corp
Priority date: 2016-10-21
Filing date: 2017-10-19
Publication date: 2019-12-27
Anticipated expiration: 2037-10-19
Also published as: KR20180044190A; KR102074404B1; JP2018065335A; TW201815546A; TWI656958B; CN107972220A; JP6298871B1

Abstract

A resin material supply device and method, a resin molding device and a resin molded product manufacturing method are provided, the resin material supply device is provided with: a supply object holding unit that holds a supply object that is an object to which a resin material is supplied; a resin material supply port provided above the supply object holding portion; a moving unit that moves a relative position of the resin material supply port with respect to the supply target held by the supply target holding unit in a horizontal direction; and a control unit that controls the moving unit so that the relative position does not pass through the entire supply target region of the supply target 2 or more times from the start position in the same position in the moving path and return to the start position. By returning the relative position to the start position, the resin material is supplied again to the vicinity of the start position where the supply amount of the resin material is small immediately after the start of the supply, so that the amount of the resin material in the vicinity of the start position becomes almost uniform.

Description

Resin material supply device and method, resin molding device, and resin molded product manufacturing method

Technical Field

The present invention relates to a resin material supply device and method for supplying a resin material, a resin molding device having the resin material supply device, and a method for manufacturing a resin molded product using the resin material supply method.

Background

In order to protect electronic parts from light, heat, moisture, and the like, the electronic parts are generally sealed with resin. The resin sealing method may be compression molding or transfer molding. The compression molding method is a method of molding a substrate by using a molding die composed of a lower die and an upper die, supplying a resin material to a cavity of the lower die, mounting the substrate on which an electronic component is mounted on the upper die, and then closing the lower die and the upper die while heating them. The transfer molding method is a method in which a substrate is mounted in a cavity of one of an upper mold and a lower mold, the lower mold and the upper mold are closed while heating the two, and a resin is pressed into the cavity by a plunger (plunger) to perform molding. In the transfer molding method, a part of the resin remains in a path for supplying the resin to the cavity by the plunger, which causes waste, and a problem of damage to the semiconductor substrate or the wiring due to the flow of the resin occurs, so that the compression molding method has become the mainstream in recent years.

In compression molding, generally, the resin material supplied to the cavity is in a powder form, a pellet form (hereinafter, these are collectively referred to as a powder form), or a liquid form. A powdery resin material does not flow freely in the cavity after supply, and a liquid resin material generally used for compression molding has a high viscosity and therefore does not flow much in the cavity. Therefore, at the time of molding, since the viscosity of the resin material is lowered by heating, the resin flows in the cavity, and a load may be applied to the electronic component, the resin material is preferably supplied into the cavity as uniformly as possible before molding. In the compression molding apparatus described in patent document 1, the resin material is supplied into the cavity by dropping the resin material into the cavity mounted on the XY table through the resin material supply port of the slider, and moving the XY table in a U-shaped curve while fixing the position of the resin material supply port. Fig. 11 shows a rail 92 for moving the resin material supply port relative to the cavity 91 in the conventional compression molding apparatus. During the relative movement in the U-shaped curve, the resin material is supplied at a fixed supply rate (a supply amount of the resin material per unit time) while the movement rate is maintained at a fixed value, whereby the resin material in the cavity 91 becomes uniform at any position.

[ background Art document ]

[ patent document ]

[ patent document 1] Japanese patent application laid-open No. 2013-042017.

Disclosure of Invention

The invention aims to solve the problems that:

in general, in an apparatus for charging a cavity with a resin material, it takes time (although only a little) until the resin material reaches the fixed supply speed after the start of the supply operation of the resin material, and the supply speed immediately after the start of the supply is lower than the fixed supply speed. Therefore, even if the moving speed of the cavity is fixed, the amount of the resin material at the position (start position) immediately after the start of the supply is reduced in the cavity compared with the amount of the resin material at the other position. This causes the resin material in the cavity to be non-uniform.

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a resin material supply apparatus and method capable of supplying a resin material to a supply target such as a cavity of a resin molding apparatus so as to be more nearly uniform than a conventional one.

The technical means for solving the problems are as follows:

in order to solve the above problems, a resin material supply device according to the present invention includes:

a) a supply object holding unit for holding a supply object to be supplied with a resin material;

b) a resin material supply port provided above the supply object holding portion;

c) a moving unit that moves a relative position of the resin material supply port with respect to the supply target held by the supply target holding unit in a horizontal direction; and

d) and a control unit that controls the movement of the moving unit in the supply target area of the supply target so that the relative position does not return to the start position 2 or more times from the start position through the same position in the movement path.

The resin material supply method of the present invention is characterized in that: the resin material is supplied from a resin material supply port to a supply target object that is a target of supplying the resin material, while moving a relative position in a horizontal direction between the supply target object and the resin material supply port provided above the supply target object in a supply target area of the supply target object so as not to return to a start position 2 or more times through the same position in a movement path from the start position.

The resin molding apparatus of the present invention is characterized by comprising:

the resin material supply device;

a compression molding unit having a1 st molding die, a2 nd molding die having a cavity, and a mold clamping mechanism for clamping the 1 st molding die and the 2 nd molding die; and

and a transfer unit that transfers the supply object to which the resin material is supplied by the resin material supply device onto the cavity, and supplies the resin material from the supply object to the cavity.

The method for producing a resin molded article of the present invention is characterized by comprising the steps of:

supplying a resin material to the supply object by the resin material supply method;

transferring a supply object to which a resin material is supplied to a cavity of a2 nd forming die, and supplying the resin material from the supply object to the cavity; and

and a step of clamping the 1 st molding die and the 2 nd molding die with the resin material supplied to the cavity.

The invention has the following effects:

according to the present invention, a resin material can be supplied to a supply target such as a cavity of a resin molding apparatus so as to be more uniform than in the conventional art.

Drawings

Fig. 1 is a schematic configuration diagram showing one embodiment of a resin material supply apparatus of the present invention.

Fig. 2(a) is a view showing a state where the resin material is supplied to the resin material transfer tray, and fig. 2(b) is a view showing a state where the resin material transfer tray is lifted up to form the resin material storage space.

Fig. 3 is a plan view showing an example of a resin material transfer tray and a rail for supplying a resin material to the resin material transfer tray in the resin material supply device according to the present embodiment.

Fig. 4 is a graph showing a temporal change between a target value and an actually measured value of the supply speed of the resin material to the resin material storage portion of the resin material transfer tray from the resin material supply port.

Fig. 5(a) and 5(b) are vertical sectional views of the resin material supplied to the resin material accommodating portion of the resin material transfer tray, the vertical sectional views being parallel to the direction of movement of the relative position, fig. 5(a) showing a state immediately after the start of supply, and fig. 5(b) showing a state at the end of supply.

Fig. 6 is a vertical cross-sectional view of the resin material supplied to the resin material accommodating portion of the resin material transfer tray, the vertical cross-sectional view being perpendicular to the direction of movement of the relative position.

Fig. 7(a) and 7(b) are plan views showing another example of the resin material transfer tray and the rail for supplying the resin material to the resin material transfer tray in the resin material supply device according to the present embodiment.

Fig. 8 is a schematic configuration diagram showing a modification of the resin material supply device according to the present embodiment.

Fig. 9 is a vertical cross-sectional view showing an example of a compression molding section which is a part of the resin molding apparatus of the present invention.

Fig. 10 is a schematic diagram showing an example of a resin molding apparatus including a material receiving module, a molding module, and a discharge module.

Fig. 11 is a plan view showing a rail for supplying a resin material to a cavity in a conventional compression molding apparatus.

Description of the symbols:

10. 10A: resin material supply device

11: resin material holding part

12: trough

121: resin material supply port

13: excitation part

14: measuring part

15: raw material supply part

151: raw material supply port

152: original supply part excitation part

16: holding table

17: moving part

18: transfer part

19: control unit

191: supply speed detecting part

192: alarm transmitting unit

20. 20A: resin material transfer tray

21. 21A: resin material storage part

211: resin material housing frame

2111: stop part

212: film tension frame material

2121: projection part

213: membrane fixing part

22. 22A: starting position

23. 23a1, 23a2, 92: track for relative position movement

24. 241, 242, 243, 244: edge of resin material container

245: center of long edge of resin material container

25: region outside the curve

30: compression molding part

311: lower fixing disc

312: upper fixing disc

32: connecting rod

33: movable platform

34: mold clamping device

351: lower heater

352: upper heater

40: resin molding apparatus

41: material receiving module

411: substrate receiving part

42: forming module

43: discharge module

431: resin molded product holding part

46: main conveying device

47: auxiliary conveying device

91: die cavity

F: release film

LM: lower die (No. 2 forming die)

MC: die cavity

P: resin material

PA: resin material storage space

S: substrate

UM: and an upper die (1 st forming die).

Detailed Description

In the resin material supply device and method of the present invention, the resin material is supplied from the resin material supply port to the supply object while the resin material supply port is moved in the supply object region of the supply object so as not to return to the start position 2 or more times from the start position through the same position in the movement path with respect to the relative position of the supply object held by the supply object holding unit in the horizontal direction. Since the relative position is moved so as to return to the start position in this manner, a part or all of the resin material supplied at the end of the movement is supplied to the start position. Thus, even if the amount of the resin material supplied to the start position is reduced due to a low supply speed of the resin material immediately after the start of the supply of the resin material, the resin material supplied to the supply target becomes almost uniform because a part or all of the resin material supplied at the end of the movement is supplied to the start position and is compensated for. Further, since the relative position does not pass through the same position 2 times or more in the moving path, the supply amount of the resin material does not increase by supplying the resin material to the same position 2 times or more.

In the resin material supply device and method of the present invention, the "return to the start position" includes not only the case where the relative position returns to the same position as the start position but also the case where the resin material spreads and reaches the position separated from the start position by only the distance to the extent that the resin material reaches the start position.

The movement of the relative position may be a movement by the supply object holding portion, a movement by the resin material supply port, or a movement by both of the supply object holding portion and the resin material supply port.

The supply object may be, for example, a cavity of a resin molding apparatus, or may be a resin material transfer tray that transfers a resin material from a resin material supply apparatus to a cavity provided in the resin molding apparatus. Alternatively, the substrate may be a resin molded object, that is, a substrate in which electronic components are sealed.

The resin material may be in the form of powder or liquid.

In the resin material supply apparatus and method of the present invention, in order to uniformly supply the resin material to the supply object, the moving speed of the relative position and the supply speed of the resin material from the resin material supply port to the supply object are generally set to be constant. However, for example, in the case described below, either one or both of the moving speed and the feeding speed may be changed. In this case, since the moving speed is easier to control than the feeding speed, it is preferable that the moving speed is variable and the feeding speed is constant.

As a case where the moving speed and/or the feeding speed are made variable, the following example can be cited.

When a resin material is supplied to a cavity having a shape with corners such as a rectangle, if the relative position is moved along a curved path in order to smoothly move the relative position, the resin material may not sufficiently spread to the vicinity of the corners. Therefore, when the relative position is moved in a curved shape in the vicinity of the corner portion, the moving speed is made slower (and/or the feeding speed is made faster) than when the resin material is moved in a straight shape, so that the feeding amount of the resin material to the vicinity of the corner portion can be increased, and the resin material can be made more nearly uniform over the entire cavity.

Further, when the relative position is moved along the edge of the cavity, the resin material does not spread to the outer side of the edge, and the amount of the resin material in the vicinity of the edge is increased compared to other positions. Therefore, when the relative position is moved along the edge of the cavity, by making the moving speed faster (and/or making the feeding speed slower) than in the case where the moving speed is moved further inside the cavity, the feeding amount of the resin material to the vicinity of the edge can be made smaller, thereby making the resin material more nearly uniform over the entire cavity.

The supply speed of the resin material may become unstable due to a failure of a device for feeding the resin material to the resin material supply port, in addition to being slow immediately after the start of the supply. Therefore, the resin material supply device of the present invention may be provided with a supply speed detection unit that detects the supply speed of the resin material. In this case, the resin material supply device may be further provided with an alarm unit for giving an alarm such as a sound or light to the administrator of the device or an image displayed on a display device (monitor) when the supply speed detector detects an abnormality (exceeding or falling short of a predetermined set range) in the supply speed. Alternatively, when the supply speed detector detects an abnormality in the supply speed, the operation of the moving unit and the supply of the resin material from the resin material supply port may be stopped. In the resin material supply method of the present invention, similarly, the supply speed of the resin material may be detected while the resin material is supplied to the supply object, and further, a warning may be issued or the supply of the resin material may be stopped when an abnormality in the supply speed is detected.

Hereinafter, more specific embodiments of the resin material supply apparatus, the resin material supply method, the resin molding apparatus, and the resin molded product manufacturing method according to the present invention will be described with reference to fig. 1 to 10.

(1) The resin material supply device of the present embodiment has the following configuration:

fig. 1 shows a schematic configuration of a resin material supply device 10 according to the present embodiment. The resin material supply device 10 supplies a powdered resin material P to a resin material transfer tray 20 serving as a supply target.

The resin material supply device 10 includes a resin material holding portion 11 for holding the resin material P and a groove 12. One end of the groove 12 is connected to the resin material holding portion 11, and the other end is provided with a resin material supply port 121 that is open to supply the resin material P to the resin material transfer tray 20. Further, the resin material supply device 10 includes: an excitation portion 13 that vibrates the resin material holding portion 11 and the groove 12; and a measuring section 14 for measuring the weight of the resin material holding section 11 and the tank 12 containing the resin material P. Above the resin material holding portion 11, there is provided an original supply portion 15 for supplying the resin material P to the resin material holding portion 11. The original supply part 15 is provided at a lower portion thereof with an original supply port 151 opened to supply the resin material P to the resin material holding part 11 and an original supply part excitation part 152 vibrating the original supply part 15. The resin material holding portion 11 is disposed directly below the original supply port 151.

A holding base (supply object holding portion) 16 for holding the resin material transfer tray 20 is disposed immediately below the resin material supply port 121. A moving unit 17 for moving the holding table 16 in the horizontal direction is provided below the holding table 16. The moving unit 17 can move the holding base 16 at any speed within a range lower than a predetermined maximum speed in either the X direction (lateral direction in fig. 1) or the Y direction (direction perpendicular to the paper surface in fig. 1), and can move the holding base 16 in both the X direction and the Y direction. Therefore, the relative position of the resin material supply port 121 and the holding base 16 in the horizontal direction can be moved at an arbitrary speed in an arbitrary direction. The combination of the holding table 16 and the moving unit 17 is generally referred to as an "XY stage".

The resin material supply device 10 further includes a transfer unit 18 that carries in and places the resin material transfer tray 20 before the resin material P is supplied on the holding base 16, and carries out the resin material transfer tray 20 after the resin material P is supplied on the holding base 16.

The resin material supply device 10 further includes a control unit 19. The control unit 19 is realized by hardware and software of a computer, and controls ON/OFF or a supply speed when the resin material P is supplied from the resin material supply port 121 to the resin material transfer tray 20, and controls the operation of the moving unit 17. The control by the control unit 19 will be described in detail below together with the operation of the entire resin material supply apparatus 10.

As shown in fig. 2(a), the resin material transfer tray 20 includes a resin material accommodating portion 21 having a shape and a size corresponding to a cavity of a molding die of the compression molding apparatus and corresponding to the supply target region. The resin material housing portion 21 is composed of a resin material housing frame 211 which is a frame material having a rectangular opening, and a release film F which covers the lower surface of the opening of the resin material housing frame 211. An adsorption mechanism (not shown) for adsorbing the release film F to the lower surface by sucking air is provided on the lower surface of the resin material housing frame 211. A stopper 2111 is formed inside the opening of the resin material housing frame 211 so that the lower end portion on the inner peripheral side protrudes inward. A rectangular frame member corresponding to the shape of the opening of the resin material housing frame 211 is provided inside the resin material housing frame 211, and the film tension frame member 212 is a ring having a projection 2121 on the outer circumferential side and an inverted L-shaped cross section. The side surface of the resin material housing frame 211 is held by the transfer unit 18. A film fixing portion 213 for fixing an end portion of the release film F stretched under the resin material housing frame 211 is provided below the transfer portion 18.

As described below, when the resin material transfer tray 20 is raised by the transfer unit 18 after the resin material accommodating unit 21 receives supply of the resin material P by the resin material supply device 10 (fig. 2(a)), the film tension frame member 212 is lowered relative to the resin material accommodating frame 211 by its own weight until the protruding portion 2121 comes into contact with the stop portion 2111. Thereby, a resin material accommodating space PA corresponding to the shape of the cavity of the molding die is formed (fig. 2 (b)).

(2) Operation of the resin material supply apparatus of the present embodiment and the resin material supply method of the present embodiment

The operation of the resin material supply device 10 (the resin material supply method according to the present embodiment) will be described below.

The operator supplies the resin material P to the original supply unit 15 in advance. Then, the operator performs a predetermined operation using an input device (not shown) such as a touch panel provided in the resin material supply device 10, thereby starting the operation of the resin material supply device 10.

First, the transfer unit 18 carries the resin material transfer tray 20 before the resin material P is supplied thereto, and places the same on the holding base 16. Then, the moving unit 17 moves the holding base 16 in the horizontal direction so that the resin material supply port 121 is positioned directly above a predetermined start position 22 (see fig. 3) in the resin material accommodating portion 21 of the resin material transfer tray 20 under the control of the control unit 19. In the example of fig. 3, the starting position 22 is set to a position near the edge of the long side of the resin material housing portion 21 having a substantially rectangular upper surface and near the center 245 of the long side, but the starting position may be any position in the resin material housing portion 21.

Next, the weighing unit 14 measures the weight of the resin material holding unit 11 and the tank 12, together with the resin material P contained therein. Since the weights of the resin material holding portion 11 and the groove 12 are known, the weights of the resin material P in the resin material holding portion 11 and the groove 12 can be obtained by subtracting the weights of the resin material holding portion 11 and the groove 12 from the weight measured here. When the weight of the resin material P is sufficiently larger than the weight of the resin material to be supplied to the resin material accommodating portion 21 of the resin material transfer tray 20, the supply operation of the resin material P to the resin material accommodating portion 21 described in the next stage is started. On the other hand, when the weight of the resin material P is insufficient or zero, the control unit 19 controls the original supply unit exciting unit 152 so that the original supply unit exciting unit 152 gives vibration to the original supply unit 15 for a predetermined time. Thereby, the resin material P in the original supply portion 15 is supplied to the resin material holding portion 11 only by a predetermined amount through the original supply port 151.

Next, the control unit 19 controls the excitation unit 13 so that the excitation unit 13 applies vibration to the resin material holding unit 11 and the groove 12 with a constant strength. Thereby, the resin material P is supplied from the resin material supply port 121 to the resin material accommodating portion 21 of the resin material transfer tray 20 at a constant supply speed. Simultaneously with the start of the application of the vibration, the controller 19 controls the moving unit 17 to move the relative position of the resin material supply port 121 with respect to the resin material housing unit 21 in the horizontal direction.

Fig. 3 shows a rail 23 that moves the relative position, as an example. The relative position first moves from the start position 22 along the edge 241 of one long side of the resin material housing portion 21 to the vicinity of the edge 242 of one short side, and the direction of movement in the long side direction (the direction in which the long side extends) is reversed while moving in the short side direction (the direction in which the short side extends) toward the edge 243 of the other long side by a distance approximately equal to the width of the resin material supply port 121 so as to draw a U-shape, that is, so as to turn a U-turn. Here, the moving distance in the short direction may be longer than the width of the resin material supply port 121 if the moving distance is within a range in which the resin material P supplied from the resin material supply port 121 spreads. Thereafter, when the relative position returns to the vicinity of the center 245 in the longitudinal direction, the U-turn is similarly performed and the movement is made to the vicinity of the edge 242 of the one short side. By repeating the U-turn in the vicinity of the edge of one short side and the vicinity of the center in the long side direction in this manner, when reaching the vicinity of the edge 243 of the other long side, the relative position moves along the edge 243 of the other long side to the vicinity of the edge 244 of the other short side. Therefore, the relative position is reversed in the direction of movement in the longitudinal direction (U-turn) while being moved in the short-side direction toward the edge 241 side of the one long side by a distance approximately equal to the width of the resin material supply port 121. Thereafter, the facing position moves to the vicinity of the edge 241 on the one long side while repeating the U-turn near the center 245 in the long side direction and the vicinity of the edge 244 on the other short side. In this way, the relative position passes through the entire resin material accommodating portion 21 of the supply target region, and finally returns to the start position 22 along the edge 241 of one long side. During the movement of the relative position described above, the supply of the resin material P from the resin material supply port 121 to the resin material accommodating portion 21 is continued.

Here, the relative position "passing through the entire supply target region of the supply target object" includes not only a case where the space between the rails that are relatively moved is closely filled (by the width of the resin material supply port) so that the resin material supply port passes through the entire supply target region, but also a case where the rails are spaced apart from each other to such an extent that the resin material supplied from the resin material supply port spreads over the entire supply target region. Further, the present invention also includes a case where the rail is spaced apart from the end of the supply target region to such an extent that the resin material supplied from the resin material supply port spreads over the entire supply target region.

As shown in fig. 4, the feeding speed of the resin material P does not reach the target value within a certain period (in the figure, "rising period") from immediately after the start of feeding. Therefore, as shown in fig. 5(a), the amount of the resin material P supplied to the vicinity of the start position 22 at the start of supply is smaller than that at the position to be supplied thereafter. In fig. 5(a), the resin material P is also present on the opposite side of the relative position in the moving direction as viewed from the start position 22, because: the resin material supply port 121 has a certain width, and the resin material P spreads in the horizontal direction when falling from the resin material supply port 121 to the resin material accommodating portion 21. When the relative position passes through the entire resin material housing portion 21 and then returns to the start position 22, the resin material P is resupplied to the vicinity of the start position 22 where the supply amount of the resin material P immediately after the start of supply is small, and therefore the amount of the resin material P in the vicinity of the start position 22 becomes closer to the amount of the resin material P at another position (that is, almost uniform) than in the case where the resupply is not performed (fig. 5 (b)).

The speed at which the relative position is moved (moving speed) may be fixed or may be variable depending on the position as exemplified below. Further, the control after a slight movement is easier with respect to the movement speed of the relative position than during the rise period immediately after the start of the movement. Therefore, in the present embodiment, the moving speed is made variable in the time after the rise period. For example, at the U-turn portion of the rail 23, the amount of the resin material P supplied to the region outside the curve (the region indicated by reference numeral 25 in fig. 3) is smaller than that of the straight portion, and therefore, the resin material P is supplied to the curved portion slightly more by slowing down the moving speed of the relative position at the U-turn portion. In this way, the resin material P supplied to the curve slightly more spreads to the outside of the curve where the amount of the resin material P is small, whereby the supply amount of the resin material P can be made nearly uniform.

Further, as shown in fig. 6, since the resin material P1 supplied when the relative position moves along the edge 24 of the resin material containing portion 21 does not spread to the edge 24 side, if the relative position is moved at a constant speed, the amount of the resin material P2 supplied when the relative position moves further inside the resin material containing portion 21 becomes larger. Therefore, the supply amount of the resin material P can be made nearly uniform by making the moving speed when the relative position moves along the edge 24 of the resin material accommodating portion 21 faster than the moving speed at the other position.

The planar shape of the resin material accommodating portion of the resin material transfer tray (and the cavity of the molding die of the compression molding apparatus corresponding thereto) to which the resin material is supplied by the resin material supply apparatus 10 of the present embodiment is not limited to the rectangle shown in fig. 3, and may be any shape such as a quadrangle other than a rectangle, a polygon other than a quadrangle, and a circle. For example, when the resin material transfer tray 20A having the circular resin material accommodating portion 21A is used, the relative position can be moved along the rail 23a1 shown in fig. 7 (a). In this movement, the relative position is set to the vicinity of the edge of the resin material storage portion 21A as the start position 22A, and first, after moving in an arc shape along the edge by approximately 90 °, the U-turn is performed while moving toward the center of the circle by an amount corresponding to the width of the resin material supply port 121, and after moving in the opposite direction in a concentric circle (arc) shape by approximately 90 °, the U-turn is further performed, and this operation is repeated until the vicinity of the center of the circle is reached. The reason why "approximately 90 ° is set instead of 90 ° here is that: in order to ensure the area required for turning the U-bend. Then, the relative position is moved by nearly 180 ° near the center of the circle, and the relative position is moved by nearly 90 ° in the opposite direction in a concentric circle (circular arc) shape while being U-bent toward the edge of the resin material housing portion 21A by the width of the resin material supply port 121, and thereafter, the U-bending is further performed, and this operation is repeated until the relative position reaches the vicinity of the edge. Further, after the relative position is moved to near 180 ° in the vicinity of the edge, the same operation as before is performed from the vicinity of the edge toward the center of the circle, and thereafter, the operation is performed from the center of the circle toward the vicinity of the edge. Then, when the relative position moves in an arc near the edge, the relative position reaches the start position 22A, and the series of movements is ended.

In the example of fig. 7(a), the relative position turns the U-bend each time it moves approximately 90 °, the movement will be approximately 180 ° when it reaches the center or edge of the circle, but it may also turn the U-bend each time it moves approximately 180 ° and move approximately 360 ° when it reaches the center or edge of the circle, as shown with track 23a2 in fig. 7 (b).

Fig. 8 shows a schematic configuration of a resin material supply device 10A according to a modification. The resin material supply device 10A of the modification includes a supply speed detection unit 191 and an alarm transmission unit 192 in addition to the components of the resin material supply device 10. The supply speed detector 191 acquires the weight measured by the measuring unit 14 while the resin material is being supplied to the supply target, and detects the supply speed of the resin material to the supply target from the temporal change in the weight. The alarm transmitting unit 192 generates an alarm sound when the supply speed of the resin material detected by the supply speed detecting unit 191 deviates from a predetermined range. The alarm transmitting unit 192 may emit light or display an image on a screen instead of emitting an alarm sound. If the supply speed deviates from the predetermined range, the amount of the resin material supplied to the supply target object deviates from the target value, and thus, by issuing the alarm in this manner, it is possible to prevent resin molding from being performed with an incorrect amount of the resin material. Instead of providing the alarm transmitting unit 192, a stop control unit may be provided that stops the apparatus when the supply speed of the resin material detected by the supply speed detecting unit 191 deviates from a predetermined range.

In the above example, the case where the resin material is supplied to the resin material transfer tray 20 is described as an example, but the resin material may be supplied from the resin material supply device 10 to a resin material transfer tray having a configuration other than the above. The molding die may be made transportable, and the resin material may be supplied from the resin material supply device 10 to the cavity of the molding die, or the resin material may be supplied from the resin material supply device 10 to the surface of the substrate on which the electronic component is mounted. The resin material is not limited to a powder form, and a liquid form may be used.

(3) The resin molding apparatus (compression molding apparatus) and the method for producing a resin molded article according to the present embodiment:

the resin molding apparatus of the present embodiment includes the resin material supply device 10 and the compression molding unit 30. The structure of the compression-molded part 30 will be described below with reference to fig. 9.

In the compression molding section 30, the links 32 (4 in total) stand at four corners of the lower fixed plate 311, and a rectangular upper fixed plate 312 is provided near the upper ends of the links 32. A movable table 33 having a rectangular shape is provided between lower fixed disk 311 and upper fixed disk 312. The movable platform 33 has holes at four corners through which the links 32 pass, and is movable up and down along the links 32. A mold clamping device 34, which is a device for moving the movable platen 33 up and down, is provided on the lower fixed platen 311.

A lower heater 351 is disposed on the upper surface of the movable platen 33, and a lower mold LM as the 2 nd molding die is disposed above the lower heater 351.

An upper heater 352 is disposed on the lower surface of the upper fixed tray 312, and an upper mold UM, which is the 1 st molding die, is mounted below the upper heater 352. A substrate S in which a semiconductor chip is packaged can be mounted on the lower surface of the upper mold UM. The upper mold UM and the lower mold LM are disposed opposite to each other.

The compression molding section 30 operates as follows. First, a substrate S on which a semiconductor chip is mounted on a lower surface of the upper mold UM by a substrate moving mechanism (not shown). Next, as described above, the resin material transfer tray 20 to which the resin material P is supplied in the resin material supply device 10 is transferred to a position directly above the lower mold LM by the transfer portion 18, and the resin material P in the resin material accommodating space PA is accommodated in the cavity MC together with the release film F. The mounting of the substrate S to the upper mold UM and the storage of the resin material P in the lower mold LM may be performed in reverse order to the above.

In this state, the resin material P in the mold chase MC is softened by heating with the lower heater 351, and the substrate S is heated with the upper heater 352. In a state where the resin material P and the substrate S are heated, the movable platen 33 is raised by the mold clamping device 34 to clamp the molding dies (the upper die UM and the lower die LM) and cure the resin material P. After the resin material P is cured, the movable platen 33 is lowered by the mold clamping device 34 to open the mold.

By the operation of the resin material supply device 10 and the compression molding section 30 (resin molded product manufacturing method) described above, a resin-sealed product (resin molded product) in which the semiconductor chip is resin-sealed is manufactured. The obtained resin sealing line is smoothly released from the lower mold LM by coating the inner surface of the lower mold LM with the release film F.

Next, another embodiment of the resin molding apparatus of the present invention will be described with reference to fig. 10. The resin molding apparatus 40 of the present embodiment includes a material receiving module 41, a molding module 42, and a discharging module 43. The material receiving module 41 is a device for receiving the resin material P and the substrate S from the outside and sending them to the molding module 42, and includes the resin material supply device 10 and a substrate receiving portion 411. The 1 molding die set 42 includes 1 set of the compression molding unit 30. In fig. 10, there are 3 molding modules 42, but any number of molding modules 42 may be provided in the resin molding apparatus 40. Further, even after the resin molding apparatus 40 is assembled and started to be used, the molding modules 42 can be increased or decreased. The discharge module 43 is used to carry and hold the resin molded product manufactured by the molding module 42 from the molding module 42, and includes a resin molded product holding portion 431.

A main conveyance device 46 for conveying the substrate S, the resin material transfer tray 20, and the resin molded product is provided so as to penetrate the material receiving module 41, 1 or the plurality of molding modules 42 and the discharge module 43. The transfer unit 18 constitutes a part of the main conveyance device 46. In each module, a sub-conveying device 47 for conveying the substrate S, the resin material transfer tray 20, and the resin molded product is provided between the main conveying device 46 and the devices in the module.

The resin molding apparatus 40 includes a power supply and a control unit (not shown) for operating the modules.

The operation of the resin molding apparatus 40 will be described. The substrate S is held by the operator in the substrate receiving portion 411 of the material receiving module 41. The main conveyance device 46 and the sub conveyance device 47 convey the substrate S from the substrate receiving section 411 to the compression molding section 30 of 1 of the molding modules 42, and mount the substrate S to the upper mold UM of the compression molding section 30. Then, the main conveyance device 46 and the sub conveyance device 47 carry the resin material transfer tray 20 into the resin material supply device 10. In the resin material supply device 10, the resin material P is supplied to the resin material transfer tray 20 as described above. The main and sub-conveying devices 46 and 47 convey the resin material transfer tray 20 supplied with the resin material P to the compression molding section 30 of the molding module 42 having the substrate S mounted on the upper mold UM, place the resin material transfer tray 20 on the lower mold LM of the compression molding section 30, and then supply the resin material P from the resin material transfer tray 20 to the cavity MC of the lower mold LM. Thereafter, the resin material transfer tray 20 is carried out of the compression molding unit 30 by the main conveying device 46 and the sub conveying device 47, and then compression molding is performed in the compression molding unit 30. While the compression-molding is performed by the compression-molding section 30, the compression-molding can be performed in parallel with time shift among the plurality of compression-molding sections 30 by performing the same operation as before on the other compression-molding sections 30. The resin molded product obtained by compression molding is carried out of the compression molding section 30 by the main conveying device 46 and the sub conveying device 47, and carried into and held by the resin molded product holding section 431 of the discharge module 43. The user appropriately takes out the resin molded product from the resin molded product holding portion 431.

The present invention is not limited to the above embodiments, and various modifications can be made in addition to the aspects described in the above description.

Claims

1. A resin material supply device is characterized by comprising:

a) a supply object holding unit that holds a supply object to be supplied with a resin material;

2. The resin material supply device according to claim 1, wherein either one or both of a moving speed of the relative position and a supply speed of the resin material supplied from the resin material supply port is variable.

3. The resin material supply device according to claim 2, wherein the moving speed is variable, and the supply speed is constant.

4. The resin material supply device according to any one of claims 1 to 3, comprising a supply speed detection unit that detects a supply speed of the resin material supplied from the resin material supply port.

5. A resin material supply method characterized by comprising: the resin material is supplied from a resin material supply port to a supply target object that is a target of supplying the resin material, while moving a relative position in a horizontal direction between the supply target object and the resin material supply port provided above the supply target object in a supply target area of the supply target object so as not to return to a start position 2 or more times through the same position in a movement path from the start position.

6. The resin material supply method according to claim 5, wherein either one or both of a moving speed of the relative position and a supply speed of the resin material supplied from the resin material supply port is variable.

7. The resin material supply method according to claim 6, wherein the moving speed is variable, and the supply speed is constant.

8. The resin material supply method according to any one of claims 5 to 7, wherein a supply speed of the resin material supplied from the resin material supply port is detected.

9. A resin molding apparatus is characterized by comprising:

the resin material supply device according to any one of claims 1 to 4;

10. A method for producing a resin molded article, comprising the steps of:

a step of supplying a resin material to the supply object by the resin material supply method according to any one of claims 5 to 8;

and a step of clamping the 1 st forming mold and the 2 nd forming mold with the resin material supplied to the cavity.