TWI785287B - Resin molding device and method of manufacturing resin molded product - Google Patents

Resin molding device and method of manufacturing resin molded product Download PDF

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Publication number
TWI785287B
TWI785287B TW108142205A TW108142205A TWI785287B TW I785287 B TWI785287 B TW I785287B TW 108142205 A TW108142205 A TW 108142205A TW 108142205 A TW108142205 A TW 108142205A TW I785287 B TWI785287 B TW I785287B
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resin
molded product
resin molding
image data
molding
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TW108142205A
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Chinese (zh)
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TW202019656A (en
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中村守
岡本良太
林口慎也
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日商Ｔｏｗａ股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/006—Pressing and sintering powders, granules or fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5816—Measuring, controlling or regulating temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5825—Measuring, controlling or regulating dimensions or shape, e.g. size, thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/585—Measuring, controlling or regulating detecting defects, e.g. foreign matter between the moulds, inaccurate position, breakage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5891—Measuring, controlling or regulating using imaging devices, e.g. cameras

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

This invention provides a resin molding device (100) which improves the quality of resin molded product and applies granular resin (J) to perform resin molding. The resin molding device (100) includes a resin capturing part (23) for shooting the scatter condition of the granular resin (J) and a controlling part (26) for performing feedback control on resin molding conditions based on the resin image data obtained by the resin capturing part (23).

Description

樹脂成形裝置及樹脂成形品的製造方法Resin molding device and method for manufacturing resin molded product

本發明是有關於一種樹脂成形裝置及樹脂成形品的製造方法。The present invention relates to a resin molding device and a method for manufacturing a resin molded product.

作為使用樹脂材料進行樹脂成形的樹脂成形裝置，可想到專利文獻1所示的裝置。An apparatus disclosed in Patent Document 1 is conceivable as a resin molding apparatus that performs resin molding using a resin material.

專利文獻1的樹脂成形裝置將液狀樹脂從分配器（dispenser）的噴嘴供給至被成形品，而對被成形品的半導體晶片進行樹脂密封。而且，樹脂成形裝置為了降低成形品的不均，而測量搭載於被成形品的半導體晶片的有無、半導體晶片的厚度、以及樹脂成形品的厚度，並調整供給至被成形品的樹脂量。 [現有技術文獻] [專利文獻]The resin molding apparatus of Patent Document 1 supplies a liquid resin from a nozzle of a dispenser to a molded product, and resin-seals a semiconductor wafer of the molded product. Furthermore, the resin molding apparatus measures the presence or absence of a semiconductor wafer mounted on a molded product, the thickness of the semiconductor wafer, and the thickness of the resin molded product, and adjusts the amount of resin supplied to the molded product in order to reduce unevenness of the molded product. [Prior art literature] [Patent Document]

[專利文獻1]日本專利特開2006-315184號公報[Patent Document 1] Japanese Patent Laid-Open No. 2006-315184

[發明所要解決的問題] 然而，由於用於半導體晶片的樹脂密封的液狀樹脂為高黏度，因此即使從分配器的噴嘴供給至平面狀的成形範圍，也難以在所述範圍內均勻地供給。由此，有可能在一個成形品中產生厚度不均。[Problem to be Solved by the Invention] However, since the liquid resin used for resin sealing of semiconductor wafers has a high viscosity, even if it is supplied from a nozzle of a dispenser to a flat molding range, it is difficult to supply it uniformly within the range. This may cause thickness unevenness in one molded product.

因此，本發明是為了解決所述問題點而成，且其主要課題在於降低樹脂成形品的厚度不均。 [解決問題的技術手段]Therefore, this invention is made|formed in order to solve the said problem, and the main subject is reducing the thickness unevenness of a resin molded article. [Technical means to solve the problem]

即，本發明的樹脂成形裝置是使用顆粒狀樹脂進行樹脂成形的樹脂成形裝置，包括：樹脂攝像部，對所述顆粒狀樹脂所散布的狀態進行拍攝；以及控制部，基於由所述樹脂攝像部所獲得的樹脂圖像數據來對樹脂成形條件進行反饋控制。 [發明的效果]That is, the resin molding apparatus of the present invention is a resin molding apparatus that performs resin molding using granular resin, and includes: a resin imaging unit that captures images of the state in which the granular resin is scattered; Feedback control of resin molding conditions is performed using the resin image data obtained at the part. [Effect of the invention]

根據如上所述而構成的本發明，可以提高樹脂成形品的品質。According to the present invention constituted as described above, the quality of a resin molded product can be improved.

接下來，舉例對本發明作進一步詳細說明。但是，本發明並不由以下的說明所限定。Next, the present invention will be further described in detail with examples. However, the present invention is not limited by the following description.

如上所述，本發明的樹脂成形裝置是使用顆粒狀樹脂進行樹脂成形的樹脂成形裝置，其包括：樹脂攝像部，對所述顆粒狀樹脂所散布的狀態進行拍攝；以及控制部，基於由所述樹脂攝像部所獲得的樹脂圖像數據來對樹脂成形條件進行反饋控制。As described above, the resin molding apparatus of the present invention is a resin molding apparatus that uses granular resin to mold resin, and includes: a resin imaging unit that captures images of the state in which the granular resin is dispersed; The resin image data obtained by the resin imaging unit is used to perform feedback control on resin molding conditions.

在使用顆粒狀樹脂進行樹脂成形的情況下，經散布的狀態下的顆粒狀樹脂的不均會對成形品的例如厚度等的品質產生不良影響。若為本發明的樹脂成形裝置，則基於對顆粒狀樹脂所散布的狀態進行拍攝而獲得的樹脂圖像數據對樹脂成形條件進行反饋控制，因此可以提高成形品的例如厚度等的品質。此外，由於不如以前那樣使用液狀樹脂，因此不需要考慮其黏度，通過使用顆粒狀樹脂，容易在成形範圍內均勻地配置。In the case of resin molding using granular resin, the unevenness of the dispersed granular resin adversely affects the quality of the molded product, such as thickness. According to the resin molding apparatus of the present invention, the resin molding conditions are feedback-controlled based on resin image data obtained by photographing the state in which the granular resin is dispersed, so that the quality of molded products such as thickness can be improved. In addition, since liquid resin is not used as in the past, there is no need to consider its viscosity, and by using granular resin, it is easy to arrange it uniformly within the molding range.

在這裡，在樹脂成形條件中例如包含以下的項目（1）～項目（7）中的至少一個。此外，在樹脂成形條件中，若對樹脂成形品的品質產生影響，則也可以包含其他條件。 （1）樹脂量：樹脂成形品所需的顆粒狀樹脂的量 （2）樹脂散布動作：具體來說，是從樹脂材料投入機構供給的每單位時間的量和/或移動台的移動速度 （3）合模位置：成形模具的合模位置 （4）成形模具的溫度：將顆粒狀樹脂軟化或熔化並成形時所需的溫度 （5）成形時間：在成形模具內顆粒狀樹脂硬化成形時所需的時間 （6）真空度：在樹脂成形時對密閉空間排氣後的真空狀態的程度 （7）合模壓力值：在將成形模具合模時，利用應變計測量應變量的值Here, at least one of the following items (1) to (7) is included in the resin molding conditions, for example. In addition, other conditions may be included in the resin molding conditions as long as they affect the quality of the resin molded product. (1) Resin amount: the amount of granular resin required for resin molded products (2) Resin spreading operation: Specifically, the amount per unit time supplied from the resin material input mechanism and/or the moving speed of the mobile table (3) Clamping position: the clamping position of the forming mold (4) The temperature of the forming mold: the temperature required to soften or melt the granular resin and form it (5) Forming time: the time required for the granular resin to harden and form in the forming mold (6) Vacuum degree: The degree of vacuum state after exhausting the closed space during resin molding (7) Clamping pressure value: when the forming mold is clamped, use the strain gauge to measure the value of the strain

為了通過測量樹脂成形品的狀態來判斷樹脂成形品的品質是否良好，並提高樹脂成形品的品質，理想的是樹脂成形裝置具有測量樹脂成形品的狀態的成形品測量部，所述控制部基於所述樹脂圖像數據以及由所述成形品測量部所獲得的成形品測量數據來對樹脂成形條件進行反饋控制。In order to determine whether the quality of the resin molded product is good by measuring the state of the resin molded product, and to improve the quality of the resin molded product, it is desirable that the resin molding device has a molded product measuring section for measuring the state of the resin molded product, and the control section is based on The resin image data and the molded product measurement data obtained by the molded product measurement unit are used for feedback control of resin molding conditions.

作為成形品測量部的具體例，理想的是所述成形品測量部測量所述樹脂成形品的多個部位的厚度。通過測量樹脂成形品的多個部位的厚度，可以更進一步提高樹脂成形品的例如厚度等的品質。另外，為了提高樹脂成形品的外觀等的品質，理想的是成形品測量部對所述樹脂成形品進行拍攝。As a specific example of the molded product measuring unit, it is desirable that the molded product measuring unit measures the thickness of a plurality of locations of the resin molded product. By measuring the thickness of multiple parts of the resin molded product, it is possible to further improve the quality of the resin molded product such as the thickness. In addition, in order to improve the quality of the resin molded product, such as the appearance, it is desirable that the molded product measurement unit takes an image of the resin molded product.

作為使用成形品測量數據以及樹脂圖像數據的控制序列（sequence），理想的是所述控制部基於所述成形品測量數據而進行所述樹脂成形品的不良檢查，在將所述樹脂成形品判斷為不良的情況下，基於所述樹脂圖像數據而進行與所述顆粒狀樹脂的均勻性相關的判定，在判定為所述顆粒狀樹脂不均勻的情況下，對所述顆粒狀樹脂的散布條件進行反饋控制。As a control sequence (sequence) using molded product measurement data and resin image data, it is desirable that the control unit performs defect inspection of the resin molded product based on the molded product measurement data, and when the resin molded product is When it is judged to be defective, a judgment related to the uniformity of the granular resin is performed based on the resin image data, and when it is judged that the granular resin is not uniform, the Scatter conditions for feedback control.

不僅是顆粒狀樹脂的散布狀態，若可以利用其他資訊對樹脂成形條件進行反饋控制，則樹脂成形品的品質將更進一步提高。因此，理想的是樹脂成形裝置具有測量成形對象物的狀態的對象物測量部，所述控制部基於所述樹脂圖像數據以及由所述對象物測量部所獲得的對象物測量數據來對樹脂成形條件進行反饋控制。如此，通過測量成形對象物的狀態，可以對例如顆粒狀樹脂的樹脂量或散布方法等散布條件進行反饋控制。If feedback control of resin molding conditions can be performed using not only the dispersion state of granular resin but also other information, the quality of resin molded products will be further improved. Therefore, it is desirable that the resin molding apparatus has an object measurement unit that measures the state of the object to be molded, and that the control unit measure the resin based on the resin image data and the object measurement data obtained by the object measurement unit. Forming conditions are feedback controlled. In this way, by measuring the state of the object to be molded, it is possible to perform feedback control on the spraying conditions such as the resin amount of the granular resin and the spraying method.

另外，理想的是樹脂成形裝置具有測量成形模具的溫度的溫度測量部，所述控制部基於所述樹脂圖像數據以及由所述溫度測量部所獲得的溫度測量數據來對樹脂成形條件進行反饋控制。如此，通過測量成形模具的溫度，可以對例如成形模具的設定溫度的修正等樹脂成形條件進行反饋控制。In addition, it is desirable that the resin molding device has a temperature measurement unit that measures the temperature of the molding die, and that the control unit feeds back the resin molding conditions based on the resin image data and the temperature measurement data obtained by the temperature measurement unit. control. In this manner, by measuring the temperature of the molding die, it is possible to perform feedback control of resin molding conditions such as correction of the set temperature of the molding die, for example.

進而，理想的是樹脂成形裝置具有位置測量部，所述位置測量部測量將成形模具合模的合模機構的合模位置，所述控制部基於所述樹脂圖像數據以及由所述位置測量部所獲得的位置測量數據來對樹脂成形條件進行反饋控制。如此，通過測量合模位置，可以對例如合模位置的修正等樹脂成形條件進行反饋控制。Furthermore, it is desirable that the resin molding apparatus has a position measurement unit that measures a mold clamping position of a mold clamping mechanism that clamps a molding mold, and that the control unit is based on the resin image data and the position measurement. Feedback control of resin molding conditions is performed using the position measurement data obtained by the department. Thus, by measuring the mold clamping position, feedback control can be performed on resin molding conditions such as correction of the mold clamping position, for example.

尤其，為了更進一步提高樹脂成形品的厚度的品質，理想的是所述控制部對所述樹脂成形條件進行反饋控制以至少變更所述顆粒狀樹脂的散布狀態。In particular, in order to further improve the quality of the thickness of the resin molded product, it is desirable that the control unit performs feedback control on the resin molding conditions so as to change at least the dispersion state of the granular resin.

另外，使用所述樹脂成形裝置的樹脂成形品的製造方法也是本發明的一個形態。Moreover, the manufacturing method of the resin molded article using the said resin molding apparatus is also one aspect of this invention.

＜本發明的一個實施方式＞ 以下，參照附圖，對本發明的樹脂成形裝置的一個實施方式進行說明。再者，關於以下所示的任一圖，為了易於理解，適當省略或誇張地示意性地進行描繪。關於相同的構成元件，標注相同的符號並適當省略說明。<An embodiment of the present invention> Hereinafter, one embodiment of the resin molding apparatus of the present invention will be described with reference to the drawings. In addition, regarding any of the figures shown below, for the sake of easy understanding, they are appropriately omitted or exaggerated and schematically drawn. For the same constituent elements, the same symbols are assigned and explanations thereof are appropriately omitted.

＜樹脂成形裝置100的整體構成＞ 本實施方式的樹脂成形裝置100是利用樹脂材料J對搭載於作為成形對象物的基板W的電子零件Wx進行樹脂密封而製造樹脂成形品P的裝置。此外，作為基板，例如可舉出金屬基板、樹脂基板、玻璃基板、陶瓷基板、電路基板、半導體基板、引線框架（lead frame）等。另外，樹脂材料J例如為顆粒狀樹脂。<Overall Configuration of Resin Molding Device 100> The resin molding apparatus 100 of the present embodiment is an apparatus for manufacturing a resin molded product P by resin-sealing an electronic component Wx mounted on a substrate W serving as a molding object with a resin material J. In addition, examples of the substrate include metal substrates, resin substrates, glass substrates, ceramic substrates, circuit substrates, semiconductor substrates, lead frames, and the like. In addition, the resin material J is, for example, granular resin.

如圖1所示，所述樹脂成形裝置100包含基板供給與收納模塊A、兩個樹脂成形模塊B及樹脂材料供給模塊C分別作為構成元件。各構成元件（各模塊A～模塊C）相對於各個構成元件能夠拆裝並且能夠更換。As shown in FIG. 1 , the resin molding apparatus 100 includes a substrate supply and storage module A, two resin molding modules B, and a resin material supply module C as constituent elements, respectively. Each constituent element (each module A to module C) is detachable and replaceable with respect to each constituent element.

基板供給與收納模塊A包括：供給密封前基板W的基板供給部11；收納密封完基板W（樹脂成形品P）的基板收納部12；交接密封前基板W及樹脂成形品P的基板載置部13；以及搬運密封前基板W及樹脂成形品P的基板搬運機構14。基板載置部13在基板供給與收納模塊A內，在與基板供給部11相對應的位置和與基板收納部12相對應的位置之間在Y方向上移動。基板搬運機構14在基板供給與收納模塊A及各個樹脂成形模塊B內，在X方向及Y方向上移動。The substrate supply and storage module A includes: a substrate supply unit 11 that supplies the unsealed substrate W; a substrate storage unit 12 that stores the sealed substrate W (resin molded product P); part 13; The substrate placement unit 13 moves in the Y direction between a position corresponding to the substrate supply unit 11 and a position corresponding to the substrate storage unit 12 in the substrate supply and storage module A. As shown in FIG. The substrate conveyance mechanism 14 moves in the X direction and the Y direction in the substrate supply and storage module A and each resin molding module B. As shown in FIG.

在基板供給與收納模塊A設置有測量密封前基板W的狀態的對象物測量部20。所述對象物測量部20光學地測量密封前基板W，例如可以使用雷射位移計。利用所述對象物測量部20，可以測量搭載在密封前基板W的電子零件數（晶片數）、電子零件Wx的堆疊數（級數）以及電子零件Wx的映射資訊（晶片有無的配置資訊）。The substrate supply and storage module A is provided with an object measuring unit 20 that measures the state of the substrate W before sealing. The object measuring unit 20 optically measures the substrate W before sealing, for example, a laser displacement meter can be used. The object measuring unit 20 can measure the number of electronic components (number of wafers) mounted on the substrate W before sealing, the number of stacked electronic components Wx (number of stages), and the mapping information of the electronic components Wx (disposition information of the presence or absence of wafers). .

另外，在基板供給與收納模塊A設置有測量樹脂成形品P的狀態的成形品測量部21。所述成形品測量部21光學地測量樹脂成形品P，且具有：厚度測量部21a，測量樹脂成形品P的樹脂密封面的多個部位的厚度；以及成形品攝像部21b，對樹脂成形品P的樹脂密封面進行拍攝。作為厚度測量部21a，可以使用雷射位移計。由厚度測量部21a所獲得的厚度數據及由成形品攝像部21b所獲得的成形品圖像數據被發送至後述的控制部26。Moreover, the molded product measurement part 21 which measures the state of the resin molded product P is provided in board|substrate supply and storage module A. As shown in FIG. The molded product measurement unit 21 optically measures the resin molded product P, and includes: a thickness measurement unit 21a for measuring the thickness of a plurality of locations on the resin sealing surface of the resin molded product P; and a molded product imaging unit 21b for measuring the resin molded product P. The resin-sealed surface of the P is photographed. As the thickness measurement unit 21a, a laser displacement meter can be used. The thickness data obtained by the thickness measurement unit 21 a and the molded product image data obtained by the molded product imaging unit 21 b are sent to the control unit 26 described later.

各樹脂成形模塊B包括：形成有模腔2C的第一成形模具即下模2；保持基板W的第二成形模具即上模3；以及將下模2及上模3合模的合模機構4。關於具體構成，將在後文描述。Each resin molding module B includes: a lower mold 2 that is a first molding die having a cavity 2C; an upper mold 3 that is a second molding die that holds a substrate W; and a mold clamping mechanism that clamps the lower mold 2 and the upper mold 3 together. 4. The specific configuration will be described later.

樹脂材料供給模塊C包括：移動台15；載置於移動台15的樹脂材料收容部16；計量樹脂材料J並將其投入至樹脂材料收容部16的樹脂材料投入機構17；以及搬運樹脂材料收容部16而對下模的模腔2C供給樹脂材料J的樹脂材料供給機構18。移動台15在樹脂材料供給模塊C內在X方向及Y方向上移動。樹脂材料供給機構18在樹脂材料供給模塊C及各個樹脂成形模塊B內，在X方向及Y方向上移動。The resin material supply module C includes: a mobile platform 15; a resin material storage unit 16 mounted on the mobile platform 15; a resin material input mechanism 17 that measures the resin material J and puts it into the resin material storage unit 16; A resin material supply mechanism 18 for supplying the resin material J to the cavity 2C of the lower mold through the part 16 . The moving table 15 moves in the X direction and the Y direction in the resin material supply module C. The resin material supply mechanism 18 moves in the X direction and the Y direction in the resin material supply module C and each resin molding module B. As shown in FIG.

在樹脂材料投入機構17設置有計量樹脂材料J的計量部22，由所述計量部22所獲得的樹脂計量數據被發送至後述的控制部26。The resin material input mechanism 17 is provided with a measuring unit 22 for measuring the resin material J, and the resin measuring data obtained by the measuring unit 22 is sent to the control unit 26 described later.

另外，在樹脂材料供應模塊C設置有樹脂攝像部23，所述樹脂攝像部23對樹脂材料容納部16的樹脂材料J所散布的狀態進行拍攝。由所述樹脂攝像部23所獲得的樹脂圖像數據被發送至後述的控制部26。In addition, the resin material supply module C is provided with a resin imaging unit 23 for imaging the state where the resin material J in the resin material storage unit 16 is scattered. The resin image data obtained by the resin imaging unit 23 is sent to the control unit 26 described later.

＜樹脂成形模塊B的具體的構成＞ 接著，以下，對本實施方式的樹脂成形模塊B的具體構成進行說明。<Concrete configuration of resin molding module B> Next, a specific configuration of the resin molding module B of the present embodiment will be described below.

如上所述，如圖2所示，樹脂成形模塊B包括：形成有模腔2C的下模2；保持基板W的上模3；以及安裝下模2及上模3並且將下模2及上模3合模的合模機構4。As described above, as shown in FIG. 2, the resin molding module B includes: the lower mold 2 formed with the cavity 2C; the upper mold 3 holding the substrate W; A mold clamping mechanism 4 for mold 3 clamping.

合模機構4包括安裝下模2的活動盤41、安裝上模3的上部固定盤42、以及用於使活動盤41升降移動的驅動機構43。The mold clamping mechanism 4 includes a movable plate 41 on which the lower mold 2 is installed, an upper fixed plate 42 on which the upper mold 3 is installed, and a driving mechanism 43 for moving the movable plate 41 up and down.

活動盤41是在其上表面安裝下模2的構件，由立設於下部固定盤44的多個支柱部45可升降移動地支撐著。The movable platen 41 is a member on which the lower die 2 is attached, and is supported by a plurality of pillars 45 erected on the lower fixed platen 44 so as to be movable up and down.

上部固定盤42是在其下表面安裝上模3的構件，以與活動盤41相向的方式，固定於左右一對支柱部45的上端部。The upper fixed platen 42 is a member to which the upper die 3 is attached on the lower surface thereof, and is fixed to the upper end portions of the pair of left and right pillar portions 45 so as to face the movable platen 41 .

驅動機構43設置於活動盤41與下部固定盤44之間，通過使活動盤41升降移動而使下模2及上模3合模，並且施加規定的成形壓力。本實施方式的驅動機構43是利用將伺服馬達（servo motor）等的旋轉轉換成線性移動的滾珠螺杆機構431將所述旋轉傳遞至活動盤41的直動方式的機構，但也可以是利用例如肘節連杆等連杆機構將伺服馬達等動力源傳遞至活動盤41的連杆（link）方式的機構。The driving mechanism 43 is provided between the movable platen 41 and the lower fixed platen 44 , and moves the movable platen 41 up and down to close the lower mold 2 and the upper mold 3 and apply a predetermined molding pressure. The drive mechanism 43 of the present embodiment is a linear motion mechanism that transmits the rotation to the movable plate 41 using a ball screw mechanism 431 that converts the rotation of a servo motor (servo motor) etc. into a linear movement. A link mechanism such as a toggle link is a link-type mechanism that transmits a power source such as a servo motor to the movable plate 41 .

再者，本實施方式是利用下部固定盤44、支柱部45及上部固定盤42，構成收容活動盤41及驅動機構43的固定框架。Furthermore, in this embodiment, the lower fixed plate 44 , the pillar portion 45 and the upper fixed plate 42 are used to form a fixed frame for accommodating the movable plate 41 and the driving mechanism 43 .

並且，在下模2與活動盤41之間，設置有下模保持部46。所述下模保持部46包括對下模2進行加熱的加熱板461、設置於所述加熱板461的下表面的隔熱構件462、設置於加熱板461的上表面而包圍下模2的周圍的側壁構件463、以及設置於所述側壁構件463的上端的密封構件464。Furthermore, a lower mold holding portion 46 is provided between the lower mold 2 and the movable platen 41 . The lower mold holder 46 includes a heating plate 461 for heating the lower mold 2 , a heat insulating member 462 provided on the lower surface of the heating plate 461 , and a heat insulating member 462 provided on the upper surface of the heating plate 461 to surround the lower mold 2 . The side wall member 463 and the sealing member 464 provided on the upper end of the side wall member 463 .

在上模3與上部固定盤42之間，設置有上模保持部47。所述上模保持部47包括對上模3進行加熱的加熱板471、設置於所述加熱板471的上表面的隔熱構件472、設置於加熱板471的下表面而包圍上模3的周圍的側壁構件473、以及設置於所述側壁構件473的下端的密封構件474。並且，在利用驅動機構43的合模時，側壁構件463的密封構件464及側壁構件473的密封構件474密接，收容下模2及上模3的空間與外部空氣隔離。再者，也可以設為不設置密封構件464或密封構件474中的一者的構成。Between the upper die 3 and the upper fixed platen 42, an upper die holder 47 is provided. The upper mold holder 47 includes a heating plate 471 for heating the upper mold 3 , a heat insulating member 472 provided on the upper surface of the heating plate 471 , and a heat insulating member 472 provided on the lower surface of the heating plate 471 to surround the upper mold 3 . The side wall member 473 and the sealing member 474 provided at the lower end of the side wall member 473 . Furthermore, during mold clamping by the driving mechanism 43, the sealing member 464 of the side wall member 463 and the sealing member 474 of the side wall member 473 are in close contact, and the space for accommodating the lower mold 2 and the upper mold 3 is isolated from the outside air. In addition, it is good also as the structure which does not provide either the sealing member 464 or the sealing member 474.

上模3是吸附基板W的背面而保持的構件。在上模3的下表面形成有吸附孔（未圖示），在上模3的內部形成有抽吸流路（未圖示）。所述內部流路與外部的抽吸裝置（未圖示）連接。The upper mold 3 is a member that holds the back surface of the substrate W by suction. Suction holes (not shown) are formed on the lower surface of the upper die 3 , and suction channels (not shown) are formed inside the upper die 3 . The internal flow path is connected to an external suction device (not shown).

如圖2及圖3所示，在下模2形成有模腔2C，所述模腔2C收容搭載在基板W的電子零件Wx及樹脂材料J。具體來說，下模2具有形成模腔2C的底面的單一構件即底面構件201及圍繞所述底面構件201的側面構件202。模腔2C由所述底面構件201的上表面及側面構件202的內周面形成。本實施方式的底面構件201是俯視下呈矩形形狀的平板，側面構件202俯視下呈矩形框狀。側面構件202設置成相對於底面構件201能夠相對上下移動。具體來說，相對於下模2的基底板203由螺旋彈簧等多個彈性構件204支撐著（參照圖2）。此外，為了提高樹脂成形品P的脫模性，本實施方式的下模2被脫模薄膜28覆蓋。As shown in FIGS. 2 and 3 , a cavity 2C for accommodating the electronic component Wx and the resin material J mounted on the substrate W is formed in the lower mold 2 . Specifically, the lower mold 2 has a bottom member 201 which is a single member forming the bottom of the cavity 2C, and side members 202 surrounding the bottom member 201 . The cavity 2C is formed by the upper surface of the bottom member 201 and the inner peripheral surface of the side member 202 . The bottom surface member 201 of this embodiment is a rectangular flat plate in plan view, and the side member 202 has a rectangular frame shape in plan view. The side member 202 is provided so as to be relatively movable up and down with respect to the bottom member 201 . Specifically, the base plate 203 of the lower die 2 is supported by a plurality of elastic members 204 such as coil springs (see FIG. 2 ). In addition, in order to improve the releasability of the resin molded product P, the lower mold 2 of the present embodiment is covered with a mold release film 28 .

另外，在樹脂成形模塊B設置有測量成形模具（下模2或上模3）的溫度的溫度測量部24。溫度測量部24可以直接測量成形模具的溫度，也可以測量保持成形模具的模具保持部（例如加熱板等）的溫度。由所述溫度測量部24所獲得的成形模具的溫度數據被發送至後述的控制部26。In addition, the resin molding block B is provided with a temperature measurement unit 24 for measuring the temperature of the molding die (the lower die 2 or the upper die 3 ). The temperature measuring unit 24 may directly measure the temperature of the forming mold, or may measure the temperature of a mold holding unit (for example, a heating plate, etc.) that holds the forming mold. The temperature data of the molding die obtained by the temperature measurement unit 24 is sent to the control unit 26 described later.

進而，在樹脂成形模塊B設置有位置測量部25，所述位置測量部25測量將下模2或上模3合模的合模機構4的合模位置。本實施方式的位置測量部25計算作為使活動盤41升降的驅動源的伺服馬達的編碼器值而間接地檢測合模位置。由所述位置測量部25所獲得的合模位置數據被發送至後述的控制部26。此外，位置測量部25能夠根據驅動機構43的方式進行各種變更。Furthermore, the resin molding module B is provided with a position measuring unit 25 that measures the mold clamping position of the mold clamping mechanism 4 that clamps the lower mold 2 or the upper mold 3 . The position measurement part 25 of this embodiment calculates the encoder value of the servomotor which is a drive source which raises and lowers the movable platen 41, and detects the clamping position indirectly. The mold clamping position data obtained by the position measurement unit 25 is sent to the control unit 26 described later. In addition, the position measuring unit 25 can be changed variously according to the form of the driving mechanism 43 .

＜樹脂成形裝置100的動作＞ 參照圖1～圖4對所述樹脂成形裝置100的樹脂成形（樹脂密封）的動作進行說明。以下所示的動作是通過控制部26控制樹脂成形裝置100的各部來進行。此外，控制部26是具有中央處理單元（Central Processing Unit，CPU）、內部記憶體、輸入輸出接口、模數（analog digital，AD）轉換器等的專用或通用的電腦。<Operation of Resin Molding Device 100> The resin molding (resin sealing) operation of the resin molding apparatus 100 will be described with reference to FIGS. 1 to 4 . The operations described below are performed by the control unit 26 controlling each unit of the resin molding apparatus 100 . In addition, the control unit 26 is a dedicated or general-purpose computer having a central processing unit (Central Processing Unit, CPU), an internal memory, an input/output interface, an analog digital (AD) converter, and the like.

在基板供給與收納模塊A中，從基板供給部11向基板載置部13送出密封前基板W。接下來，使位於規定的待機位置的基板搬運機構14移動，從基板載置部13接收密封前基板W（參照圖1）。然後，使基板搬運機構14移動至樹脂成形模塊B，將密封前基板W保持於已開模的上模3（參照圖2）。然後，使基板搬運機構14返回至規定的待機位置。In the substrate supply and storage module A, the substrate W before sealing is delivered from the substrate supply unit 11 to the substrate mounting unit 13 . Next, the substrate transfer mechanism 14 positioned at a predetermined standby position is moved to receive the pre-sealed substrate W from the substrate placement unit 13 (see FIG. 1 ). Then, the substrate transfer mechanism 14 is moved to the resin molding module B, and the substrate W before sealing is held in the opened upper mold 3 (see FIG. 2 ). Then, the substrate transfer mechanism 14 is returned to a predetermined standby position.

在所述密封前基板W的搬入步驟中，利用對象物測量部20測量密封前基板W的電子零件數、電子零件Wx的堆疊數、以及映射資訊。In the loading-in step of the substrate W before sealing, the number of electronic components on the substrate W before sealing, the number of stacked electronic components Wx, and map information are measured by the object measuring unit 20 .

另一方面，在樹脂材料供給模塊C中，將脫模薄膜28設為規定的形狀，使位於規定的待機位置的移動台15移動，並在所述移動台15依次載置脫模薄膜28及框構件（未圖示）而形成為樹脂材料收容部16。然後，使樹脂材料收容部16移動至樹脂材料投入機構17（參照圖1）。接下來，從樹脂材料投入機構17將規定量的樹脂材料J投入至樹脂材料收容部16的框構件的內側。然後，使移動台15返回至規定的待機位置。On the other hand, in the resin material supply module C, the mold release film 28 is made into a predetermined shape, the mobile table 15 located at a predetermined standby position is moved, and the mold release film 28 and the A frame member (not shown) is formed as the resin material housing portion 16 . Then, the resin material storage part 16 is moved to the resin material input mechanism 17 (refer FIG. 1). Next, a predetermined amount of resin material J is injected from the resin material input mechanism 17 into the inside of the frame member of the resin material storage portion 16 . Then, the mobile station 15 is returned to a predetermined standby position.

在所述樹脂投入步驟中，利用計量部22計量樹脂材料J，並且利用樹脂攝像部23對投入至樹脂材料容納部16且為散布的狀態的樹脂材料J進行拍攝。In the resin feeding step, the resin material J is weighed by the measuring unit 22 , and the resin material J thrown into the resin material storage unit 16 in a scattered state is photographed by the resin imaging unit 23 .

接下來，使位於規定的待機位置的樹脂材料供給機構18移動，而從移動台15接收收容有樹脂材料J的樹脂材料收容部16。然後，使樹脂材料供給機構18移動至樹脂成形模塊B，將樹脂材料收容部16的脫模薄膜28及收容於樹脂材料收容部16內的樹脂材料J供給至已開模的下模2的模腔2C（參照圖2）。然後，使樹脂材料供給機構18返回至規定的待機位置。再者，脫模薄膜28也可以在將樹脂材料J供給至模腔2C之前而密接。Next, the resin material supply mechanism 18 located in the predetermined standby position is moved, and the resin material storage part 16 in which the resin material J is accommodated is received from the moving table 15 . Then, the resin material supply mechanism 18 is moved to the resin molding module B, and the release film 28 of the resin material storage part 16 and the resin material J contained in the resin material storage part 16 are supplied to the mold of the lower mold 2 that has been opened. Cavity 2C (see Figure 2). Then, the resin material supply mechanism 18 is returned to a predetermined standby position. In addition, the mold release film 28 may be closely bonded before supplying the resin material J to 2 C of cavities.

在這裡，下模2通過加熱板461而預先加熱至規定溫度，樹脂材料J是經軟化或熔融的狀態。Here, the lower mold 2 is preheated to a predetermined temperature by the heating plate 461, and the resin material J is in a softened or melted state.

在所述步驟之後，在樹脂成形模塊B中，通過驅動機構43而使活動盤41上升，使上模保持部47的密封構件474與下模保持部46的密封構件464密接，而形成密閉空間（參照圖3）。在所述狀態下，通過未圖示的排氣機構而將密閉空間設為真空狀態。After the above steps, in the resin molding module B, the movable platen 41 is raised by the driving mechanism 43, and the sealing member 474 of the upper mold holding part 47 is brought into close contact with the sealing member 464 of the lower mold holding part 46 to form a closed space. (Refer to Figure 3). In this state, the sealed space is made into a vacuum state by an exhaust mechanism not shown.

然後，利用驅動機構43使活動盤41進一步上升，側面構件202被上模3按壓，彈性構件204壓縮變形，並且基板W的電子零件Wx浸漬在樹脂材料J，並且基板W的零件搭載面被樹脂材料J包覆。在所述狀態下，下模2與上模3通過規定的合模壓力進行合模（參照圖3）。在經過預定時間之後，通過合模機構4使下模2下降，而將下模2與上模3開模（參照圖4）。此外，在合模的過程中，可以使密閉空間回到大氣壓。Then, the movable plate 41 is further raised by the driving mechanism 43, the side member 202 is pressed by the upper mold 3, the elastic member 204 is compressed and deformed, and the electronic parts Wx of the substrate W are impregnated in the resin material J, and the component mounting surface of the substrate W is covered by the resin. Material J cladding. In this state, the lower mold 2 and the upper mold 3 are mold-clamped with a predetermined mold clamping pressure (see FIG. 3 ). After a predetermined time elapses, the lower mold 2 is lowered by the mold clamping mechanism 4 to open the lower mold 2 and the upper mold 3 (see FIG. 4 ). In addition, the closed space can be returned to atmospheric pressure during mold closing.

在所述合模步驟中，利用溫度測量部24測量成形模具的溫度，並且利用位置測量部25測量合模位置。In the mold clamping step, the temperature of the forming mold is measured by the temperature measuring section 24 , and the mold clamping position is measured by the position measuring section 25 .

接下來，移動基板供給與收納模塊A的基板搬運機構14，而從開模的上模3接收樹脂成形品P。使基板搬運機構14移動至基板載置部13，將樹脂成形品P交接至基板載置部13（參照圖1）。從基板載置部13將密封完基板W收納至基板收納部12。如此，樹脂密封完成。Next, the substrate transfer mechanism 14 of the substrate supply and storage module A is moved, and the resin molded product P is received from the opened upper mold 3 . The board|substrate conveyance mechanism 14 is moved to the board|substrate mounting part 13, and the resin molded product P is delivered to the board|substrate mounting part 13 (refer FIG. 1). The sealed substrate W is stored in the substrate storage unit 12 from the substrate loading unit 13 . In this way, resin sealing is completed.

在所述樹脂成形品P的搬出步驟中，利用厚度測量部21a測量樹脂成形品P的樹脂密封面的多個部位的厚度，並且利用成形品攝像部21b對樹脂成形品P的樹脂密封面進行拍攝。In the unloading step of the resin molded product P, the thicknesses of multiple locations on the resin sealing surface of the resin molded product P are measured by the thickness measuring unit 21a, and the resin sealing surface of the resin molded product P is measured by the molded product imaging unit 21b. shoot.

然後，控制部26在所述各步驟中從樹脂成形裝置100的各部收集資訊，並基於所述資訊來對樹脂成形條件進行反饋控制。And the control part 26 collects information from each part of the resin molding apparatus 100 in each said step, and performs feedback control of resin molding conditions based on the said information.

具體來說，如圖5所示，控制部26針對各樹脂成形，收集以下（1）～（8）的資訊： （1）由對象物測量部20所獲得的電子零件數數據以及堆疊數數據。 （2）由對象物測量部20所獲得的電子零件Wx的映射數據。 （3）由計量部22所獲得的樹脂計量數據。 （4）由樹脂攝像部23所獲得的樹脂圖像數據。 （5）由溫度測量部24所獲得的成形模具的溫度數據。 （6）由位置測量部25所獲得的合模位置數據。 （7）由厚度測量部21a所獲得的厚度數據。 （8）由成形品攝像部21b所獲得的成形品圖像數據。Specifically, as shown in FIG. 5 , the control unit 26 collects the following information (1) to (8) for each resin molding: (1) Electronic component count data and stack count data obtained by the object measuring unit 20 . (2) The map data of the electronic component Wx obtained by the object measuring unit 20 . (3) The resin metering data obtained by the metering unit 22 . (4) Resin image data obtained by the resin imaging unit 23 . (5) The temperature data of the molding die obtained by the temperature measurement unit 24 . (6) Mold clamping position data obtained by the position measurement unit 25 . (7) Thickness data obtained by the thickness measurement unit 21a. (8) Molded product image data obtained by the molded product imaging unit 21b.

＜樹脂成形品P的不良檢測＞ 然後，控制部26基於樹脂成形品P的厚度數據來檢測樹脂成形品P的厚度不良。此時，控制部26例如將預先設定的厚度基準值與厚度數據進行比較，來檢測樹脂成形品P的厚度不良。<Defect detection of resin molded product P> And the control part 26 detects the thickness defect of the resin molded product P based on the thickness data of the resin molded product P. At this time, the control part 26 detects the thickness defect of the resin molded product P by comparing, for example, a preset thickness reference value with thickness data.

另外，控制部26基於樹脂成形品P的成形品圖像數據來檢測樹脂成形品P的外觀不良（例如，電子零件Wx的未填充或樹脂泄漏等）。此時，控制部26例如將預先設定的基準圖像數據與成形品圖像數據進行比較，來檢測樹脂成形品P的外觀不良。Moreover, the control part 26 detects the appearance defect of the resin molded product P based on the molded product image data of the resin molded product P (for example, the lack of filling of the electronic component Wx, resin leakage, etc.). At this time, the control unit 26 detects a defect in the appearance of the resin molded product P by comparing, for example, preset reference image data with the molded product image data.

＜不良因素的判定＞ 控制部26在（a）檢測出厚度不良的情況及（b）檢測出外觀不良的情況下，以如下方式判定這些不良因素。＜Determination of adverse factors＞ The control part 26 determines these defect factors as follows when (a) detection of thickness defect and (b) appearance defect are detected.

（a）檢測出厚度不良的情況 控制部26使用電子零件數數據以及堆疊數數據來判定有無電子零件Wx的誤識別、以及樹脂量計算值是否正確。另外，控制部26使用樹脂計量數據來判定樹脂計量值是否正確。(a) When the thickness defect is detected The control part 26 judges whether there is an erroneous recognition of the electronic component Wx, and whether the resin amount calculation value is correct using the electronic component number data and stacking number data. Moreover, the control part 26 judges whether the resin measurement value is correct using resin measurement data.

另外，控制部26使用樹脂圖像數據來進行與樹脂材料J的散布狀態的均勻性相關的判定。此處，作為判定方法，例如，考慮與散布狀態均勻時的基準圖像數據進行比較、或對樹脂圖像數據進行圖像處理，將散布狀態數值化來判定等。In addition, the control unit 26 performs a determination related to the uniformity of the spreading state of the resin material J using the resin image data. Here, as a judging method, for example, comparison with reference image data when the spreading state is uniform, or performing image processing on resin image data to digitize the spreading state for determination, etc. are conceivable.

進而，控制部26使用合模位置數據來判定成形時的合模位置是否正確。此時，控制部26例如將預先設定的基準位置與所測量的合模位置進行比較來判定。另外，控制部26使用成形模具的溫度數據來判定成形時的成形模具的溫度是否正確。此時，控制部26例如將預先設定的基準溫度與所測量的成形模具的溫度進行比較來判定。Furthermore, the control unit 26 uses the mold clamping position data to determine whether or not the mold clamping position during molding is correct. At this time, the control unit 26 determines by comparing, for example, a preset reference position with the measured mold clamping position. Moreover, the control part 26 judges whether the temperature of the molding die at the time of molding is correct using the temperature data of a molding die. At this time, the control unit 26 determines by comparing, for example, a preset reference temperature with the measured temperature of the molding die.

（b）檢測出外觀不良的情況 控制部26使用映射數據來判定電子零件Wx的安裝排列是否正確。此時，控制部26將預先輸入的基準排列與所測量的安裝排列進行比較來判定。(b) Detection of poor appearance The control unit 26 uses the map data to determine whether the mounting arrangement of the electronic components Wx is correct. At this time, the control unit 26 compares the reference arrangement input in advance with the measured installation arrangement, and makes a determination.

另外，控制部26使用樹脂圖像數據來進行與樹脂材料J的散布狀態的均勻性相關的判定。此處，作為判定方法，例如，考慮與散布狀態均勻時的基準圖像數據進行比較、或將樹脂圖像數據進行圖像處理，對散布狀態進行數值化來判斷等。In addition, the control unit 26 performs a determination related to the uniformity of the spreading state of the resin material J using the resin image data. Here, as a judging method, for example, comparison with reference image data when the spreading state is uniform, image processing of resin image data to digitize the spreading state, and the like are conceivable.

進而，控制部26使用合模位置數據來判定成形時的合模位置是否正確。此時，控制部26例如將預先設定的基準位置與所測量的合模位置進行比較來判定。另外，控制部26使用成形模具的溫度數據來判定成形時的成形模具的溫度是否正確。此時，控制部26例如將預先設定的基準溫度與所測量的成形模具的溫度進行比較來判定。Furthermore, the control unit 26 uses the mold clamping position data to determine whether or not the mold clamping position during molding is correct. At this time, the control unit 26 determines by comparing, for example, a preset reference position with the measured mold clamping position. Moreover, the control part 26 judges whether the temperature of the molding die at the time of molding is correct using the temperature data of a molding die. At this time, the control unit 26 determines by comparing, for example, a preset reference temperature with the measured temperature of the molding die.

＜樹脂成形條件的反饋控制＞ （a）檢測出厚度不良的情況 控制部26基於使用所述電子零件數數據以及堆疊數數據的判定結果來變更投入的樹脂量的設定值。另外，控制部26基於使用所述計量數據的判定結果來修正由計量部22所獲得的樹脂計量值。＜Feedback control of resin molding conditions＞ (a) When the thickness defect is detected The control part 26 changes the setting value of the resin quantity to inject based on the determination result using the said electronic component number data and stacking number data. Also, the control unit 26 corrects the resin measurement value obtained by the measurement unit 22 based on the determination result using the measurement data.

另外，在基於使用所述樹脂圖像數據的判定結果而判定為樹脂材料J不均勻的情況下，控制部26為了變更樹脂材料J的散布條件，而變更散布樹脂時的移動台15的同步動作。例如，考慮在樹脂圖像數據中散布的樹脂材料J多的部分加快移動台15的移動速度，在散布的樹脂材料J少的部分減慢移動台15的移動速度。In addition, when it is determined that the resin material J is not uniform based on the determination result using the resin image data, the control unit 26 changes the synchronous operation of the mobile station 15 when spraying the resin in order to change the spraying conditions of the resin material J. . For example, it is considered that the moving speed of the mobile table 15 is increased in a part where there is a lot of resin material J scattered in the resin image data, and the moving speed of the mobile table 15 is slowed down in a part where there is little resin material J scattered.

進而，控制部26基於使用所述合模位置數據的判定結果來變更合模位置的設定位置。另外，控制部26基於使用所述成形模具的溫度數據的判定結果來變更成形模具的設定溫度。Furthermore, the control unit 26 changes the set position of the mold clamping position based on the determination result using the mold clamping position data. Moreover, the control part 26 changes the set temperature of a molding die based on the determination result using the temperature data of the said molding die.

（b）檢測出外觀不良的情況 控制部26基於使用所述映射數據的判定結果，根據電子零件Wx的位置來增減樹脂散布量。此處，作為增減樹脂散布量的方法，考慮可以增減來自樹脂材料投入機構17的投入量、也可考慮控制移動台15的移動速度或移動時機來增減。(b) Detection of poor appearance The control unit 26 increases or decreases the amount of sprayed resin according to the position of the electronic component Wx based on the determination result using the map data. Here, as a method of increasing or decreasing the amount of resin spraying, it is conceivable to increase or decrease the input amount from the resin material input mechanism 17, or to control the moving speed or movement timing of the moving table 15 to increase or decrease.

另外，在基於使用所述樹脂圖像數據的判定結果而判定為樹脂材料J不均勻的情況下，控制部26為了變更樹脂材料J的散布條件，而變更散布樹脂時的移動台15的同步動作。例如，考慮在樹脂圖像數據中散布的樹脂材料J多的部分加快移動台15的移動速度，在散布的樹脂材料J少的部分減慢移動台15的移動速度。In addition, when it is determined that the resin material J is not uniform based on the determination result using the resin image data, the control unit 26 changes the synchronous operation of the mobile station 15 when spraying the resin in order to change the spraying conditions of the resin material J. . For example, it is considered that the moving speed of the mobile table 15 is increased in a part where there is a lot of resin material J scattered in the resin image data, and the moving speed of the mobile table 15 is slowed down in a part where there is little resin material J scattered.

進而，控制部26基於使用所述合模位置數據的判定結果來變更合模位置的設定位置。另外，控制部26基於使用所述成形模具的溫度數據的判定結果來變更成形模具的設定溫度。Furthermore, the control unit 26 changes the set position of the mold clamping position based on the determination result using the mold clamping position data. Moreover, the control part 26 changes the set temperature of a molding die based on the determination result using the temperature data of the said molding die.

如上所述，通過控制部26基於判定結果而變更各部的控制量，在下一次的樹脂成形時，進行對這些進行了反饋的樹脂成形。As mentioned above, the control amount of each part is changed by the control part 26 based on the determination result, and the resin molding which feeds back these is performed in the next resin molding.

＜本實施方式的效果＞ 根據本實施方式的樹脂成形裝置100，基於對粒狀的樹脂材料J所散布的狀態進行拍攝而獲得的樹脂圖像數據來對樹脂成形條件進行反饋控制，因此可以提高樹脂成形品P的例如厚度等的品質。此外，由於不像以前那樣使用液狀樹脂，因此不需要考慮其黏度，通過使用顆粒狀樹脂，容易均勻地配置在成形範圍內。<Effects of this embodiment> According to the resin molding apparatus 100 of this embodiment, the resin molding conditions are feedback-controlled based on the resin image data obtained by photographing the state where the granular resin material J is scattered, so that the thickness of the resin molded product P can be increased, for example. Waiting for quality. In addition, since liquid resin is not used like before, there is no need to consider its viscosity, and by using granular resin, it is easy to arrange it uniformly within the molding range.

另外，根據本實施方式，在每次檢測到不良時確定其因素並進行反饋，因此可以避免不良品在下一步驟出現。In addition, according to the present embodiment, each time a defect is detected, the cause thereof is identified and fed back, so that a defective product can be prevented from appearing in the next step.

＜其他變形實施方式＞ 此外，本發明並不限於所述實施方式。＜Other Modified Embodiments＞ In addition, the present invention is not limited to the embodiments.

例如，所述實施方式的控制部分為厚度不良及外觀不良來判定各自的因素，但也可以不將這些進行區別而判定因素。For example, the control part of the above-mentioned embodiment determines the respective factors for the thickness defect and the appearance defect, but it is also possible to determine the factors without distinguishing them.

另外，控制部通過變更一個樹脂成形條件來消除一個不良因素，但也可以通過變更多個樹脂成形條件來消除一個不良因素。In addition, the control unit eliminates one defect factor by changing one resin molding condition, but it is also possible to eliminate one defect factor by changing a plurality of resin molding conditions.

在所述實施方式中，是在基板供給與收納模塊A和樹脂材料供給模塊C之間，連接著兩個樹脂成形模塊B的構成，但是也可以設為將基板供給與收納模塊A及樹脂材料供給模塊C形成為一個模塊，在所述模塊連接著樹脂成形模塊B的構成。並且，樹脂成形裝置也可以不像所述實施方式那樣模塊化成各模塊。In the above-described embodiment, two resin molding modules B are connected between the substrate supply and storage module A and the resin material supply module C, but it is also possible to make the substrate supply and storage module A and the resin material supply module C The supply module C is formed as one module, and the configuration of the resin molding module B is connected to the module. In addition, the resin molding device does not need to be modularized into individual modules like the above-described embodiment.

另外，當然，本發明並不限於所述實施方式，可以在不脫離其主旨的範圍內進行各種變形。In addition, of course, this invention is not limited to the said embodiment, Various deformation|transformation is possible in the range which does not deviate from the summary.

2:下模（成形模具） 2C:模腔 3:上模（成形模具） 4:合模機構 11:基板供給部 12:基板收納部 13:基板載置部 14:基板搬運機構 15:移動台 16:樹脂材料收容部 17:樹脂材料投入機構 18:樹脂材料供給機構 20:對象物測量部 21:成形品測量部 21a:厚度測量部 21b:成形品攝像部 22:計量部 23:樹脂攝像部 24:溫度測量部 25:位置測量部 26:控制部 28:脫模薄膜 41:活動盤 42:上部固定盤 43:驅動機構 44:下部固定盤 45:支柱部 46:下模保持部 47:上模保持部 100:樹脂成形裝置 201:底面構件 202:側面構件 203:基底板 204:彈性構件 431:滾珠螺杆機構 461、471:加熱板 462、472:隔熱構件 463、473:側壁構件 464、474:密封構件 A:基板供給與收納模塊（模塊） B:樹脂成形模塊（模塊） C:樹脂材料供給模塊（模塊） J:樹脂材料（顆粒狀樹脂） P:樹脂成形品 W:成形對象物（基板） Wx:電子零件2: Lower mold (forming mold) 2C: Cavity 3: Upper mold (forming mold) 4: Clamping mechanism 11: Substrate supply part 12: Substrate storage part 13: Substrate loading part 14: Substrate handling mechanism 15: mobile station 16: Resin Material Storage Department 17: Resin material input mechanism 18: Resin material supply mechanism 20: Object Measurement Department 21: Formed product measurement department 21a: Thickness measurement department 21b: Molded product camera department 22: Metrology department 23:Resin camera department 24: Temperature measurement department 25: Position measurement department 26: Control Department 28: Release film 41: Movable disk 42: Upper fixed plate 43: Driving mechanism 44: Lower fixed plate 45: Pillar Department 46: Lower mold holding part 47: Upper mold holding part 100: Resin molding device 201: Bottom surface component 202: side member 203: base plate 204: Elastic member 431: Ball screw mechanism 461, 471: heating plate 462, 472: heat insulation components 463, 473: side wall components 464, 474: sealing member A: Substrate supply and storage module (module) B: Resin molding module (module) C: Resin material supply module (module) J: resin material (granular resin) P: Resin molded product W: Forming object (substrate) Wx: electronic parts

圖1是示意性地表示本實施方式的樹脂成形裝置的構成的平面圖。 圖2是表示所述實施方式的樹脂成形品的製造方法的圖。 圖3是表示所述實施方式的樹脂成形品的製造方法的圖。 圖4是表示所述實施方式的樹脂成形品的製造方法的圖。 圖5是表示所述實施方式的各部的構成的框圖。FIG. 1 is a plan view schematically showing the configuration of a resin molding apparatus according to this embodiment. FIG. 2 is a diagram showing a method of manufacturing a resin molded article according to the embodiment. FIG. 3 is a diagram showing a method of manufacturing a resin molded article according to the embodiment. FIG. 4 is a diagram showing a method of manufacturing a resin molded article according to the embodiment. FIG. 5 is a block diagram showing the configuration of each part of the embodiment.

20:對象物測量部 20: Object Measurement Department

21:成形品測量部 21: Formed product measurement department

21a:厚度測量部 21a: Thickness measurement department

21b:成形品攝像部 21b: Molded product camera department

22:計量部 22: Metrology Department

23:樹脂攝像部 23:Resin camera department

24:溫度測量部 24: Temperature measurement department

25:位置測量部 25: Position measurement department

26:控制部 26: Control Department

A:基板供給與收納模塊 A: Substrate supply and storage module

B:樹脂成形模塊 B: Resin molding module

C:樹脂材料供給模塊 C: Resin material supply module

Claims (8)

一種樹脂成形裝置，是使用顆粒狀樹脂進行樹脂成形的樹脂成形裝置，包括：樹脂攝像部，對所述顆粒狀樹脂所散布的狀態進行拍攝；成形品測量部，測量樹脂成形品的狀態；以及控制部，基於由所述樹脂攝像部所獲得的樹脂圖像數據以及由所述成形品測量部所獲得的成形品測量數據來對下一次的樹脂成形的樹脂成形條件進行反饋控制，所述成形品測量部測量所述樹脂成形品的多個部位的厚度，所述控制部將所述成形品測量數據與預先設定的基準數據進行比較而進行所述樹脂成形品的不良檢查，在所述樹脂成形品檢測出厚度不良的情況，將所述樹脂圖像數據與散布狀態均勻時的基準圖像數據進行比較、或將所述樹脂圖像數據進行圖像處理，對散布狀態進行數值化而進行與所述樹脂材料的散布狀態的均勻性相關的判定。 A resin molding device that performs resin molding using granular resin, including: a resin imaging unit that captures images of a state in which the granular resin is dispersed; a molded product measurement unit that measures the state of a resin molded product; and The control unit performs feedback control of resin molding conditions for next resin molding based on the resin image data obtained by the resin imaging unit and the molded product measurement data obtained by the molded product measurement unit. The product measurement unit measures the thicknesses of a plurality of parts of the resin molded product, and the control unit compares the measured data of the molded product with preset reference data to perform a defect inspection of the resin molded product. When a molded product has a thickness defect, compare the resin image data with the reference image data when the spreading state is uniform, or perform image processing on the resin image data to digitize the spreading state. Judgment related to the uniformity of the dispersion state of the resin material. 如申請專利範圍第1項所述的樹脂成形裝置，其中所述成形品測量部進而對所述樹脂成形品進行拍攝。 The resin molding apparatus according to claim 1, wherein the molded product measurement unit further takes a photograph of the resin molded product. 如申請專利範圍第1項所述的樹脂成形裝置，其中所述控制部在將所述樹脂成形品判斷為不良的情況下，基於所述樹脂圖像數據而進行與所述顆粒狀樹脂的均勻性相關的判定，在判定為所述顆粒狀樹脂不均勻的情況下，對所述顆粒狀樹脂的散布條件進行反饋控制。 The resin molding apparatus according to claim 1, wherein when the control unit determines that the resin molded product is defective, it uniformly mixes with the granular resin based on the resin image data. In the judgment of property correlation, when it is judged that the granular resin is not uniform, feedback control is performed on the dispersion condition of the granular resin. 如申請專利範圍第1項所述的樹脂成形裝置，具有測量成形對象物的狀態的對象物測量部，所述控制部基於所述樹脂圖像數據以及由所述對象物測量部所獲得的對象物測量數據來對樹脂成形條件進行反饋控制。 The resin molding apparatus according to claim 1, comprising an object measurement unit for measuring the state of a molding object, and the control unit is based on the resin image data and the object obtained by the object measurement unit. Feedback control of resin molding conditions based on physical measurement data. 如申請專利範圍第1項所述的樹脂成形裝置，具有測量成形模具的溫度的溫度測量部，所述控制部基於所述樹脂圖像數據以及由所述溫度測量部所獲得的溫度測量數據來對樹脂成形條件進行反饋控制。 The resin molding apparatus according to claim 1, which includes a temperature measurement unit for measuring the temperature of the molding die, and the control unit performs the following steps based on the resin image data and the temperature measurement data obtained by the temperature measurement unit. Feedback control of resin molding conditions. 如申請專利範圍第1項所述的樹脂成形裝置，具有位置測量部，所述位置測量部測量將成形模具合模的合模機構的合模位置，所述控制部基於所述樹脂圖像數據以及由所述位置測量部所獲得的位置測量數據來對樹脂成形條件進行反饋控制。 The resin molding apparatus according to claim 1, comprising a position measurement unit for measuring a mold clamping position of a mold clamping mechanism for clamping a molding mold, and the control unit based on the resin image data And the resin molding condition is feedback-controlled based on the position measurement data obtained by the position measurement unit. 如申請專利範圍第1項所述的樹脂成形裝置，其中所述控制部對所述樹脂成形條件進行反饋控制以至少變更所述顆粒狀樹脂的散布狀態。 The resin molding apparatus according to claim 1, wherein the control unit performs feedback control on the resin molding conditions to change at least a dispersion state of the granular resin. 一種樹脂成形品的製造方法，使用如申請專利範圍第1至7中任一項所述的樹脂成形裝置。 A method of manufacturing a resin molded product, using the resin molding device described in any one of claims 1 to 7.
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