TWI781662B - Resin molding device and method for manufacturing a resin molded product - Google Patents

Resin molding device and method for manufacturing a resin molded product Download PDF

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Publication number
TWI781662B
TWI781662B TW110123005A TW110123005A TWI781662B TW I781662 B TWI781662 B TW I781662B TW 110123005 A TW110123005 A TW 110123005A TW 110123005 A TW110123005 A TW 110123005A TW I781662 B TWI781662 B TW I781662B
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resin
supply
resin material
supplied
molding
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TW110123005A
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Chinese (zh)
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TW202202310A (en
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石川侑扶
和多田晃樹
岡本良太
水間敬太
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日商Ｔｏｗａ股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/04—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/361—Moulds for making articles of definite length, i.e. discrete articles with pressing members independently movable of the parts for opening or closing the mould, e.g. movable pistons
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5875—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)

Abstract

The present invention provides a resin molding device and a method for manufacturing a resin molded product that can easily change the supply mode of the resin material. The resin molded product (D) has: a resin supply structure (21) providing the resin material to the supplied object (F); a forming mold (M) including an upper mold (UM) and a lower mold (LM) corresponding to each other; a mold closing mechanism closing the forming mold (M) when the supplied object (F) is placed between the upper mold (UM) and the lower mold (LM); a display (6) graphically showing the supply status of the resin material based on the input of the supply of resin material to the supplied object (F); and a controller (5) controlling the operation of the resin supply structure (21) and the display (6).

Description

樹脂成型裝置和樹脂成型品之製造方法Resin molding device and manufacturing method of resin molded product

本發明係關於一種樹脂成型裝置和樹脂成型品之製造方法。The present invention relates to a resin molding device and a method for manufacturing resin moldings.

安裝有半導體晶片之基板等通常藉由進行樹脂密封而用作電子零件。以往，作為對基板進行樹脂密封之樹脂成型裝置，已知具備如下機構之裝置：樹脂供給機構，向作為供給對象物之基板供給樹脂材料；以及合模機構，在將供給有樹脂材料之基板配置於上模與下模之間之狀態下，對成型模進行合模（例如，參照專利文獻1）。A substrate or the like on which a semiconductor chip is mounted is generally used as an electronic component by being resin-sealed. Conventionally, as a resin molding device for resin-sealing a substrate, a device having the following mechanisms is known: a resin supply mechanism that supplies a resin material to a substrate to be supplied; In the state between the upper mold and the lower mold, the forming mold is clamped (for example, refer to Patent Document 1).

專利文獻1之樹脂成型裝置基於藉由計量部計測出之基板之重量，計算出樹脂供給機構所排出之樹脂量。藉此，根據半導體晶片之缺損數來調整向基板供給之樹脂量。The resin molding device of Patent Document 1 calculates the amount of resin discharged from the resin supply mechanism based on the weight of the substrate measured by the weighing unit. Thereby, the amount of resin supplied to the substrate is adjusted according to the number of defects of the semiconductor wafer.

先前技術文獻 專利文獻 專利文獻1：日本特開2003－165133號公報 Prior Art Documents Patent Documents Patent Document 1: Japanese Patent Laid-Open No. 2003-165133

發明欲解決之問題The problem to be solved by the invention

然而，專利文獻1所記載之樹脂成型裝置雖然能增加向基板供給缺損之半導體晶片之容積量之樹脂量，但不優化至樹脂材料之供給位置。亦即，無法根據基板之種類、形狀而容易變更各種設定之樹脂材料之供給模式。However, although the resin molding apparatus described in Patent Document 1 can increase the amount of resin supplied to the substrate by the volume of the defective semiconductor wafer, it does not optimize the supply position of the resin material. That is, it is not possible to easily change the supply mode of the resin material in various settings according to the type and shape of the substrate.

因此，期望能容易變更樹脂材料之供給模式之樹脂成型裝置和樹脂成型品之製造方法。Therefore, a resin molding device and a method of manufacturing a resin molded product that can easily change the supply mode of the resin material are desired.

用於解決問題之方案solutions to problems

本發明之樹脂成型裝置之特徵構成為如下方面，前述樹脂成型裝置具備：樹脂供給機構，向供給對象物供給樹脂材料；成型模，包括上模和與該上模對置之下模；合模機構，在將前述供給對象物配置於前述上模與前述下模之間之狀態下，對前述成型模進行合模；顯示部，基於對前述供給對象物供給前述樹脂材料之輸入，將前述樹脂材料之供給狀態圖形化而顯示；以及控制部，至少控制前述樹脂供給機構和前述顯示部之工作。The resin molding device of the present invention is characterized by the following aspects. The resin molding device includes: a resin supply mechanism for supplying a resin material to an object to be supplied; a molding die including an upper die and a lower die facing the upper die; A mechanism for clamping the molding die with the object to be supplied placed between the upper mold and the lower mold; and a display unit for displaying the resin to the object to be supplied based on an input of supplying the resin material to the object to be supplied. The supply state of the material is graphically displayed; and the control unit controls at least the operations of the resin supply mechanism and the display unit.

本發明之樹脂成型品之製造方法之特徵在於如下方面，樹脂成型品之製造方法包括：顯示步驟，基於對供給對象物供給樹脂材料之輸入，將前述樹脂材料之供給狀態圖形化而顯示；樹脂供給步驟，基於前述供給狀態，向前述供給對象物供給前述樹脂材料；以及樹脂成型步驟，使用前述樹脂供給步驟中供給之前述樹脂材料進行樹脂成型。The method for manufacturing a resin molded article of the present invention is characterized in that the method for manufacturing a resin molded article includes: a display step of graphically displaying the supply state of the resin material based on the input of the resin material supplied to the object to be supplied; A supplying step of supplying the resin material to the supply object based on the supply state; and a resin molding step of performing resin molding using the resin material supplied in the resin supplying step.

發明效果Invention effect

根據本發明，能提供一種能容易變更樹脂材料之供給模式之樹脂成型裝置和樹脂成型品之製造方法。According to the present invention, it is possible to provide a resin molding device and a method of manufacturing a resin molded product in which the supply mode of the resin material can be easily changed.

以下，基於圖式對本發明之樹脂成型裝置和樹脂成型品之製造方法之實施方式進行說明。在本實施方式中，作為樹脂成型裝置之一個例子，對如圖1所示那樣具備樹脂供給模組2之樹脂成型裝置D進行說明。不過，不限定於以下之實施方式，可以在不脫離其主旨之範圍內進行各種變形。Hereinafter, an embodiment of the resin molding apparatus and the method of manufacturing a resin molded product according to the present invention will be described based on the drawings. In this embodiment, as an example of a resin molding device, a resin molding device D including a resin supply module 2 as shown in FIG. 1 will be described. However, it is not limited to the following embodiment, Various deformation|transformation is possible in the range which does not deviate from the summary.

[[ 裝置構成Device composition ]]

安裝有半導體晶片之基板等藉由進行樹脂密封而用作電子零件。作為將成型物件物進行樹脂密封之技術，可列舉出壓縮方式（壓縮成型）、傳遞（Transfer）方式等。作為該壓縮方式之一，可列舉出：向脫模膜供給了液態或粉粒體狀之樹脂後，在成型模之下模上載置脫模膜，使成型對象物浸入脫模膜上之樹脂中而進行樹脂成型之樹脂密封方法。本實施方式中之樹脂成型裝置D採用壓縮方式，樹脂供給模組2為向成型模、基板（供給對象物之一個例子）或脫模膜F（供給對象物之一個例子）供給液態之樹脂（樹脂材料之一個例子）之裝置。以下，A substrate or the like on which a semiconductor chip is mounted is used as an electronic component by being resin-sealed. Examples of techniques for resin-sealing molded objects include a compression method (compression molding), a transfer method, and the like. As one of the compression methods, after supplying liquid or powder resin to the release film, the release film is placed on the lower mold of the molding die, and the molded object is immersed in the resin on the release film. Resin sealing method for resin molding. The resin molding device D in this embodiment adopts a compression method, and the resin supply module 2 supplies liquid resin to a molding die, a substrate (an example of a supply object), or a release film F (an example of a supply object) ( An example of resin material) device. the following,

將待供給由液態樹脂構成之樹脂材料之供給對象物設為脫模膜F，將搭載有半導體晶片（以下，有時稱為“晶片”）之基板S設為成型物件物之一個例子，將重力方向設為下，將與重力方向相反之方向設為上，藉此進行說明。又，圖1所示之Z方向為上下方向。Let the object to be supplied of the resin material made of liquid resin be the release film F, and the substrate S on which the semiconductor wafer (hereinafter, sometimes referred to as "wafer") is mounted is an example of the molded object. The direction of the gravitational force will be described as downwards, and the direction opposite to the direction of the gravitational force will be defined as upwards. In addition, the Z direction shown in FIG. 1 is an up-down direction.

在圖1中，示出了樹脂成型裝置D之示意圖。本實施方式中之樹脂成型裝置D具備：樹脂供給模組2、多個（在本實施方式中為三個）壓縮成型模組3、輸送模組4、控制部5以及顯示部6。樹脂供給模組2、多個壓縮成型模組3以及輸送模組4可以各自獨立地裝接或拆卸。又，本實施方式中之壓縮成型模組3由三個構成，但也可以由一個或兩個以上之多個構成。In FIG. 1 , a schematic diagram of a resin molding device D is shown. The resin molding device D in this embodiment includes a resin supply module 2 , a plurality (three in this embodiment) of compression molding modules 3 , a transport module 4 , a control unit 5 , and a display unit 6 . The resin supply module 2 , the plurality of compression molding modules 3 and the delivery module 4 can be attached or detached independently. Moreover, the compression molding die set 3 in this embodiment consists of three, but it may consist of one or more than two.

樹脂供給模組2在脫模膜F上之樹脂供給區域包含供給樹脂成型用之液態樹脂之樹脂供給機構21。在此，液態樹脂係指，不僅包括常溫（室溫）下液態之樹脂，也包括固體樹脂因加熱而熔融成為液態之熔融樹脂。常溫下成為液態之液態樹脂可以係熱塑性樹脂，也可以係熱固化性樹脂。熱固化性樹脂在常溫下為液態樹脂，若加熱則粘度降低，若進一步加熱則會聚合而固化，成為固化樹脂。本實施方式中之液態樹脂優選為常溫下不迅速流動之程度之較高粘度之熱固化性之樹脂。The resin supply area of the resin supply module 2 on the release film F includes a resin supply mechanism 21 for supplying liquid resin for resin molding. Here, the liquid resin refers not only to a liquid resin at normal temperature (room temperature), but also to a molten resin in which a solid resin is melted into a liquid state by heating. The liquid resin that becomes liquid at normal temperature may be a thermoplastic resin or a thermosetting resin. Thermosetting resins are liquid resins at room temperature, and when heated, the viscosity decreases, and when further heated, they polymerize and solidify to become cured resins. The liquid resin in this embodiment is preferably a relatively high-viscosity thermosetting resin that does not flow rapidly at normal temperature.

樹脂供給機構21包括：載置脫模膜F之工作臺21A、排出液態樹脂之排出機構21B以及重量感測器25。在工作臺21A中，設有：脫模膜供給機構22，將捲繞於未圖示之捲筒之脫模膜F送出，並且切割脫模膜F而分離。該分離出之脫模膜F被未圖示之吸引機構而吸附保持於工作臺21A之上表面。在脫模膜F之上表面載置有框狀構件（未圖示）。該框狀構件中形成有與後述之下模腔MC對應之空間。The resin supply mechanism 21 includes a table 21A on which the release film F is placed, a discharge mechanism 21B for discharging liquid resin, and a weight sensor 25 . In table 21A, release film supply mechanism 22 is provided, and release film F wound on a roll not shown is sent out, and release film F is cut and separated. The separated release film F is adsorbed and held on the upper surface of the table 21A by a suction mechanism not shown. A frame-shaped member (not shown) is placed on the upper surface of the release film F. As shown in FIG. A space corresponding to the lower cavity MC described later is formed in the frame-shaped member.

排出機構21B包括裝配有噴嘴單元23之點膠機單元24。該點膠機單元24包括用於將容納有後述之液態樹脂之盒23a內之液態樹脂擠出之按壓構件（未圖示），藉由使按壓構件向下方向移動，經由噴嘴單元23向脫模膜F上定量供給。裝配有噴嘴單元23之點膠機單元24構成為能在成為脫模膜F之載置面之XY平面上（水準方向）任意移動。又，也可以構成為除了點膠機單元24以外，或代替點膠機單元24，工作臺21A能在XY平面上任意移動。此外，點膠機單元24構成為能在Z方向（上下方向）移動。The discharge mechanism 21B includes a dispenser unit 24 equipped with a nozzle unit 23 . The dispenser unit 24 includes a pressing member (not shown) for extruding the liquid resin in the box 23a containing the liquid resin described later. Quantitative supply on the mold film F. The dispenser unit 24 equipped with the nozzle unit 23 is comprised so that it can arbitrarily move on the XY plane (horizontal direction) used as the mounting surface of the release film F. In addition, the table 21A may be configured to be arbitrarily movable on the XY plane in addition to the dispenser unit 24 or instead of the dispenser unit 24 . In addition, the dispenser unit 24 is configured to be movable in the Z direction (vertical direction).

噴嘴單元23包括容納液態樹脂之盒23a和排出液態樹脂之噴嘴23b。該噴嘴單元23預先在樹脂容納部11中容納有多個（在本實施方式中為六個）。點膠機單元24構成為在填充於噴嘴單元23之液態樹脂用盡時，能自動更換成不同之噴嘴單元23。The nozzle unit 23 includes a cartridge 23a containing liquid resin and a nozzle 23b that discharges the liquid resin. A plurality of nozzle units 23 (six in the present embodiment) are housed in resin container 11 in advance. The dispenser unit 24 is configured to be automatically replaced with a different nozzle unit 23 when the liquid resin filled in the nozzle unit 23 is used up.

重量感測器25計測供給至脫模膜F上之液態樹脂之重量。該重量感測器25係根據樹脂供給後之工作臺21A或脫模膜F之重量與樹脂供給前之工作臺21A或脫模膜F之重量之差來計測所供給之液態樹脂之公知之載荷感測器。The weight sensor 25 measures the weight of the liquid resin supplied on the release film F. As shown in FIG. The weight sensor 25 measures the known load of the supplied liquid resin based on the difference between the weight of the table 21A or the release film F after the resin supply and the weight of the table 21A or the release film F before the resin supply. sensor.

樹脂裝載機12構成為能在軌道上在樹脂供給模組2與壓縮成型模組3之間移動。樹脂裝載機12能保持由樹脂供給機構21供給了液態樹脂之脫模膜F，將其移送至壓縮成型模組3。The resin loader 12 is configured to be movable on rails between the resin supply module 2 and the compression molding module 3 . The resin loader 12 can hold the release film F supplied with the liquid resin by the resin supply mechanism 21 and can transfer it to the compression molding module 3 .

壓縮成型模組3至少具有成型模M和將成型模M合模之合模機構35。關於壓縮成型模組3之詳情在後文加以敘述。The compression molding die set 3 has at least a molding die M and a mold clamping mechanism 35 for closing the molding die M. Details about the compression molding module 3 will be described later.

輸送模組4輸送安裝有樹脂密封前之晶片之樹脂密封前基板Sa（成型前基板），並且輸送樹脂密封後之樹脂密封完畢之基板Sb（樹脂成型品）。輸送模組4包括：基板裝載機41；第一容納部43，收納樹脂密封前基板Sa；第二容納部44，收納樹脂密封完畢之基板Sb；以及基板交接部45。基板交接部45能在輸送模組4內在Y方向上移動，與基板裝載機41交接樹脂密封前基板Sa。此外，基板交接部45能接受從基板裝載機41輸送之樹脂密封完畢之基板Sb。基板裝載機41在輸送模組4和各壓縮成型模組3內在X方向和Y方向上移動。The transport module 4 transports the pre-resin sealing substrate Sa (substrate before molding) on which the wafer before resin sealing is mounted, and transports the resin-sealed substrate Sb (resin molded product) after resin sealing. The conveying module 4 includes: a substrate loader 41 ; a first storage unit 43 for storing the substrate Sa before resin sealing; a second storage unit 44 for storing the resin-sealed substrate Sb; and a substrate delivery unit 45 . The substrate transfer unit 45 is movable in the Y direction within the transfer module 4 , and transfers the pre-resin-sealed substrate Sa to the substrate loader 41 . In addition, the substrate transfer unit 45 can receive the resin-sealed substrate Sb conveyed from the substrate loader 41 . The substrate loader 41 moves in the X direction and the Y direction within the transfer module 4 and each compression molding module 3 .

輸送模組4還包括檢查機構（未圖示）。檢查機構對作為壓縮成型模組3中之成型物件物之基板S中之晶片之存在區域進行檢查。檢查機構藉由鐳射位移計之掃描，在預定了檢查之晶片之存在區域中檢查晶片是否實際存在，對晶片存在之場所和晶片不存在之場所進行存儲。又，檢查機構也可以利用可見光相機等來拍攝基板S，基於該拍攝圖像來檢查基板S中之晶片之存在區域。The delivery module 4 also includes an inspection mechanism (not shown). The inspection mechanism inspects the existence area of the wafer in the substrate S as the molding object in the compression molding module 3 . The inspection mechanism checks whether the wafer actually exists in the area where the wafer is scheduled to be inspected by scanning the laser displacement meter, and stores the location where the wafer exists and the location where the wafer does not exist. Furthermore, the inspection mechanism may image the substrate S with a visible light camera or the like, and inspect the wafer presence area on the substrate S based on the imaged image.

就控制部5而言，作為控制樹脂成型裝置D之工作之軟體，由HDD（Hard Disk Drive：硬碟驅動器）、記憶體等硬體中存儲之程式構成，由電腦之CPU執行。在本實施方式中，作為控制部5之控制方式之一個例子，將控制樹脂供給機構21和顯示部6之工作之情況在後文加以敘述。The software for controlling the operation of the resin molding device D in the control unit 5 is composed of programs stored in hardware such as HDD (Hard Disk Drive) and memory, and executed by the CPU of the computer. In this embodiment, as an example of the control method of the control part 5, the case where the operation|movement of the resin supply mechanism 21 and the display part 6 is controlled is demonstrated later.

顯示部6由能從外部視覺確認之狀態下固定於輸送模組4之殼體之公知之液晶顯示器構成，被控制部5顯示控制。顯示部6由能藉由用手指按壓畫面上之顯示而操作之觸摸面板構成。本實施方式中之顯示部6設於輸送模組4之前表面，但也可以設於樹脂供給模組2或壓縮成型模組3之前表面。關於顯示部6之顯示方式，在後文加以敘述。The display unit 6 is composed of a known liquid crystal display fixed to the casing of the conveying module 4 in a state that can be visually recognized from the outside, and is controlled by the control unit 5 for display. The display unit 6 is constituted by a touch panel that can be operated by pressing a display on the screen with a finger. In this embodiment, the display unit 6 is provided on the front surface of the conveying module 4 , but it may also be provided on the front surface of the resin supply module 2 or the compression molding module 3 . The display method of the display unit 6 will be described later.

又，也可以由臺式型個人電腦、筆記本型個人電腦或平板終端等之顯示器構成顯示部6，也可以藉由經過網路線路以HTML（Hyper Text Markup Language：超文字標記語言）、CSS（Cascading Style Sheets：層疊樣式表）等啟動之網頁流覽器來顯示操作畫面。在該情況下，顯示部6構成為能與控制部5經由規定之無線接入點進行無線通訊，或能藉由有線電連接來進行有線通信。此外，也可以構成為能藉由操作滑鼠、鍵盤等來操作顯示部6。In addition, the display unit 6 may also be constituted by a display of a desktop personal computer, a notebook personal computer, or a tablet terminal, and may also be displayed by using HTML (Hyper Text Markup Language), CSS ( Cascading Style Sheets: Cascading Style Sheet) and other activated web browsers to display the operation screen. In this case, the display unit 6 is configured to be able to perform wireless communication with the control unit 5 via a predetermined wireless access point, or to be able to perform wired communication through a wired electrical connection. In addition, the display unit 6 may be configured to be operable by operating a mouse, a keyboard, or the like.

如圖2所示，本實施方式中之壓縮成型模組3由藉由板狀構件32將下部固定盤31和上部固定盤33一體化而成之壓制框架（Press frame）構成。在下部固定盤31與上部固定盤33之間設有可動台板34。可動台板34能沿板狀構件32上下移動。在下部固定盤31上，設有：合模機構35，由作為使可動台板34上下移動之裝置之一對滾珠絲杠等構成。合模機構35可以藉由使可動台板34向上方移動來進行成型模M之合模，使可動台板34向下方移動來進行成型模M之開模。合模機構35之驅動源沒有特別限定，例如可以使用伺服馬達等電動馬達。As shown in FIG. 2 , the compression molding module 3 in this embodiment is composed of a press frame formed by integrating the lower fixed plate 31 and the upper fixed plate 33 with a plate member 32 . A movable platen 34 is provided between the lower fixed disk 31 and the upper fixed disk 33 . The movable platen 34 can move up and down along the plate member 32 . On the lower fixed plate 31, there is provided a mold clamping mechanism 35 consisting of a pair of ball screws as one of the means for moving the movable platen 34 up and down. The mold clamping mechanism 35 can close the mold M by moving the movable platen 34 upward, and can open the mold M by moving the movable platen 34 downward. The drive source of the mold clamping mechanism 35 is not particularly limited, and for example, an electric motor such as a servo motor can be used.

作為成型模M之上模UM和下模LM相互對置地配置，均由模具等構成。在上部固定盤33之下表面配置有上部加熱器37，在上部加熱器37之下方裝配有上模UM。在上模UM中設有用於配置基板S之上模基板設置部（未圖示），在上模UM之下表面裝配有安裝有晶片等之基板S。在可動台板34之上表面配置有下部加熱器36，在下部加熱器36之上方設有下模LM。藉由在下模腔MC中保持由吸引機構（未圖示）吸引之脫模膜F，樹脂供給機構21將塗布於脫模膜F上之液態樹脂供給至下模腔MC。藉由利用合模機構35對成型模M進行合模，並且利用下部加熱器36對下模LM進行加熱，下模腔MC內之液態樹脂固化。亦即，在將作為供給對象物之樹脂密封前基板Sa和脫模膜F配置於上模UM與下模LM之間之狀態下，利用合模機構35對成型模M進行合模。藉此，在樹脂密封前基板Sa（成型前基板）上安裝之晶片等在下模腔MC內進行樹脂密封而成為樹脂密封完畢之基板Sb（樹脂成型品）。As the molding die M, an upper die UM and a lower die LM are arranged to face each other, and both are composed of dies and the like. An upper heater 37 is arranged on the lower surface of the upper fixed platen 33 , and an upper mold UM is installed under the upper heater 37 . The upper mold UM is provided with an upper mold substrate setting part (not shown) for arranging the substrate S, and the substrate S on which a chip or the like is mounted is mounted on the lower surface of the upper mold UM. A lower heater 36 is arranged on the upper surface of the movable platen 34 , and a lower mold LM is provided above the lower heater 36 . The resin supply mechanism 21 supplies the liquid resin coated on the release film F to the lower cavity MC by holding the release film F sucked by a suction mechanism (not shown) in the lower cavity MC. By clamping the molding die M with the mold clamping mechanism 35 and heating the lower mold LM with the lower heater 36, the liquid resin in the lower cavity MC is solidified. That is, the molding die M is clamped by the mold clamping mechanism 35 in a state where the pre-resin-sealed substrate Sa and the release film F which are objects to be supplied are disposed between the upper mold UM and the lower mold LM. Thereby, the chip mounted on the pre-resin-sealed substrate Sa (pre-molding substrate) is resin-sealed in the lower cavity MC to become a resin-sealed substrate Sb (resin molded product).

在圖3中，示出顯示部6之顯示畫面之一個例子。顯示部6具有：塗佈線調整部60、供給狀態顯示部61、運算結果顯示部62、參數顯示部63以及輸入切換部64。輸入切換部64具有：樹脂供給輸入模式64a、調整點輸入模式64b以及斷液點輸入模式64c。在供給狀態顯示部61之矩形區域中，顯示有樹脂密封前基板Sa之Z方向觀察之外形。當選擇樹脂供給輸入模式64a時，供給狀態顯示部61成為能輸入液態樹脂對脫模膜F（樹脂密封前基板Sa）之供給位置之狀態。液態樹脂對脫模膜F之供給位置為對成型模M進行了合模時之液態樹脂向樹脂密封前基板Sa之供給位置。亦即，樹脂供給機構21向作為供給對象物之脫模膜F供給液態樹脂，向樹脂密封前基板Sa供給脫模膜F上之液態樹脂，因此樹脂供給機構21間接地向樹脂密封前基板Sa供給液態樹脂，在供給狀態顯示部61之矩形區域中，顯示出樹脂密封前基板Sa之Z方向觀察之外形。In FIG. 3, an example of the display screen of the display part 6 is shown. The display unit 6 has a coating line adjustment unit 60 , a supply state display unit 61 , a calculation result display unit 62 , a parameter display unit 63 , and an input switching unit 64 . The input switching unit 64 has a resin supply input mode 64a, an adjustment point input mode 64b, and a liquid cut-off point input mode 64c. In the rectangular region of the supply state display portion 61, the Z-direction-viewed outline of the substrate Sa before resin sealing is displayed. When the resin supply input mode 64a is selected, the supply state display part 61 will be in the state which can input the supply position of the liquid resin to the release film F (substrate Sa before resin sealing). The position where the liquid resin is supplied to the release film F is the position where the liquid resin is supplied to the substrate Sa before resin sealing when the mold M is closed. That is, since the resin supply mechanism 21 supplies the liquid resin to the release film F which is the object to be supplied, and supplies the liquid resin on the release film F to the resin-sealed pre-resin substrate Sa, the resin supply mechanism 21 indirectly supplies the resin-sealed pre-substrate Sa. The liquid resin is supplied, and in the rectangular region of the supply state display portion 61, the Z-direction-viewed shape of the substrate Sa before resin sealing is displayed.

在塗佈線調整部60中顯示出多個方向（在本實施方式中為八個方向）之箭頭，能藉由游標操作（對箭頭進行按壓操作）對利用手指觸摸供給狀態顯示部61輸入起始點和終點而描繪出之線段之長度（液態樹脂之脫模膜F上之長度）、方向進行修正。該線段係對作為供給對象物之脫模膜F供給液態樹脂之輸入，係液態樹脂之塗佈線。Arrows in multiple directions (eight directions in this embodiment) are displayed on the coating line adjustment unit 60, and input can be started by touching the supply status display unit 61 with a finger by operating the cursor (pressing the arrow). Correct the length and direction of the line segment drawn from the starting point and the end point (the length on the release film F of the liquid resin). This line segment is an input for supplying the liquid resin to the release film F which is the object to be supplied, and is a coating line of the liquid resin.

供給狀態顯示部61基於對脫模膜F供給液態樹脂之位置之輸入（供給樹脂材料之輸入之一個例子），將液態樹脂對脫模膜F（樹脂密封前基板Sa）之供給狀態圖形化而顯示。在圖3之例子中，作為液態樹脂對脫模膜F之供給位置之輸入，在供給狀態顯示部61中觸摸輸入成為起始點和終點之多個點後，藉由向參數顯示部63輸入線序號（圖3之參數顯示部63所示之“線”欄）來描繪線段。然後，藉由重複該輸入，多條（在圖3中為5條）線段（塗佈線）被描繪為液態樹脂對脫模膜F（樹脂密封前基板Sa）之供給狀態。這些多條線段之各自或它們之組合係成為液態樹脂對脫模膜F（樹脂密封前基板Sa）之塗布區域之圖形。又，作為供給樹脂材料之輸入，也可以將下載之CAD資料等圖形資料登錄至控制部5，控制部5使顯示部6顯示液態樹脂之供給狀態。此外，也可以為藉由向參數顯示部63輸入XY座標（圖3之參數顯示部63所示之“X軸”、“Y軸”欄），控制部5自動地描繪線段之構成。此外，也可以為藉由在供給狀態顯示部61中觸摸輸入成為起始點和終點之多個點，能自由連結各點之構成。The supply state display unit 61 graphically displays the supply state of the liquid resin to the release film F (substrate Sa before resin sealing) based on the input of the position where the liquid resin is supplied to the release film F (an example of the input of the resin material supply). show. In the example of FIG. 3 , as the input of the supply position of the liquid resin to the release film F, after touching and inputting a plurality of points as the start point and the end point on the supply status display unit 61 , by inputting the position to the parameter display unit 63 Line numbers (column "line" shown in the parameter display portion 63 of FIG. 3) are used to draw line segments. Then, by repeating this input, a plurality of (five in FIG. 3 ) line segments (coating lines) are drawn as a supply state of the liquid resin to the release film F (substrate Sa before resin sealing). Each of these multiple line segments or a combination thereof becomes a pattern of the application area of the liquid resin to the release film F (substrate Sa before resin sealing). Moreover, as the input of supplying the resin material, graphic data such as downloaded CAD data may be registered in the control unit 5, and the control unit 5 may display the supply state of the liquid resin on the display unit 6. In addition, by inputting XY coordinates ("X-axis" and "Y-axis" columns shown in the parameter display section 63 of FIG. 3 ) to the parameter display section 63 , the control section 5 may automatically draw a line segment. In addition, by touching and inputting a plurality of points to be the start point and the end point on the supply state display portion 61, the respective points can be freely connected.

控制部5基於供給狀態顯示部61所顯示之圖形，選定相對於多條線段而成為各自之起始點和終點之XY座標，對脫模膜F之塗布區域中之液態樹脂之重量和脫模膜F上之長度進行運算。控制部5考慮到從樹脂供給機構21之噴嘴單元23排出之每單位時間之液態樹脂之排出量（g/s）和裝配有噴嘴單元23之點膠機單元24之移動速度（mm/s），對液態樹脂之重量（g）和長度（mm）進行運算。從該噴嘴單元23排出之每單位時間之液態樹脂之排出量基於噴嘴23b之直徑、液態樹脂之比重等設定。此外，點膠機單元24之移動速度設定為與從噴嘴單元23排出之液態樹脂之排出速度一致。點膠機單元24之移動速度係將每單位時間之噴嘴23b之排出重量除以液態樹脂之比重而得到之值，再除以噴嘴23b之排出截面積來計算出之。如此，控制部5根據液態樹脂之物性和樹脂供給機構21之規格，計算出液態樹脂對脫模膜F（樹脂密封前基板Sa）之供給狀態。The control unit 5 selects the XY coordinates which are the respective start points and end points with respect to a plurality of line segments based on the graph displayed on the supply status display unit 61, and controls the weight and release ratio of the liquid resin in the coating area of the release film F. The length on the film F is calculated. The control section 5 considers the discharge amount (g/s) of the liquid resin per unit time discharged from the nozzle unit 23 of the resin supply mechanism 21 and the moving speed (mm/s) of the dispenser unit 24 equipped with the nozzle unit 23 , calculate the weight (g) and length (mm) of the liquid resin. The discharge amount of the liquid resin per unit time discharged from the nozzle unit 23 is set based on the diameter of the nozzle 23b, the specific gravity of the liquid resin, and the like. In addition, the movement speed of the dispenser unit 24 is set to coincide with the discharge speed of the liquid resin discharged from the nozzle unit 23 . The moving speed of the dispenser unit 24 is calculated by dividing the discharge weight of the nozzle 23b per unit time by the specific gravity of the liquid resin, and then dividing it by the discharge cross-sectional area of the nozzle 23b. In this manner, the control unit 5 calculates the supply state of the liquid resin to the release film F (substrate Sa before resin sealing) based on the properties of the liquid resin and the specifications of the resin supply mechanism 21 .

此外，控制部5至少基於作為成型物件物之基板S之尺寸、基板S中之晶片之存在區域，對脫模膜F之塗布區域中之液態樹脂之最大重量和脫模膜F上之最大長度進行運算。在該運算時，也可以考慮液態樹脂之物性和樹脂供給機構21之規格。具體而言，基於基板S之尺寸和晶片之存在區域，計算出基板S被樹脂密封之體積，藉由將該體積乘以液態樹脂之比重來對脫模膜F之塗布區域中之液態樹脂之最大重量進行運算，並且將該體積除以噴嘴23b之排出截面積來對脫模膜F之塗布區域中之液態樹脂之最大長度進行運算。又，可以預先藉由手動對基板S之尺寸、基板S中之晶片等之存在區域以及噴嘴單元23之直徑等進行輸入設定，也可以即時讀出存儲於上述之檢查機構之基板S之尺寸和基板S中之晶片等之存在區域。In addition, the control unit 5 determines the maximum weight of the liquid resin in the coating area of the release film F and the maximum length on the release film F based on at least the size of the substrate S as a molded object and the area where the wafer in the substrate S exists. Perform calculations. In this calculation, the properties of the liquid resin and the specifications of the resin supply mechanism 21 may also be considered. Specifically, based on the size of the substrate S and the area where the wafer exists, the volume of the substrate S sealed with resin is calculated, and the volume of the liquid resin in the coating area of the release film F is calculated by multiplying the volume by the specific gravity of the liquid resin. The maximum weight is calculated, and the maximum length of the liquid resin in the application region of the release film F is calculated by dividing the volume by the discharge cross-sectional area of the nozzle 23b. In addition, the size of the substrate S, the area where the wafers in the substrate S, etc., and the diameter of the nozzle unit 23 can be input and set manually in advance, and the size and the size of the substrate S stored in the above-mentioned inspection mechanism can also be read out in real time. The area where chips and the like exist in the substrate S.

如圖4之下圖所示，運算結果顯示部62顯示與供給狀態顯示部61所顯示之供給狀態相關之液態樹脂之重量和長度（圖4之下圖所示之“量”、“距離”欄）。在圖4之例子中，將脫模膜F之塗布區域中之液態樹脂之最大重量和最大長度顯示于上行，將與供給狀態顯示部61所顯示之供給狀態相關之液態樹脂之重量和長度顯示於下行。As shown in the lower figure of Figure 4, the calculation result display part 62 displays the weight and length of the liquid resin related to the supply state displayed by the supply state display part 61 (the "quantity" and "distance" shown in the lower figure of Figure 4 column). In the example of FIG. 4 , the maximum weight and maximum length of the liquid resin in the coating area of the release film F are displayed on the upper line, and the weight and length of the liquid resin related to the supply state displayed on the supply state display part 61 are displayed. in the downlink.

如此，基於液態樹脂之供給位置之輸入，將液態樹脂對脫模膜F（樹脂密封前基板Sa）之供給狀態圖形化而顯示，因此能在視覺上掌握液態樹脂之供給狀態。亦即，僅輸入對脫模膜F供給之液態樹脂之平面位置，就能直觀掌握液態樹脂之供給狀態，以成為合理之供給量和合理之供給位置之方式設定液態樹脂之理想之供給模式。其結果係，在合模機構35之成型時，能消除液態樹脂從下模腔MC溢出這樣之不良狀況，根據基板S之種類而向液態樹脂容易不足之部位重點供給液態樹脂。而且，若在運算結果顯示部62中顯示液態樹脂之重量和長度，則能以成為合理之供給量和合理之供給位置之方式容易變更液態樹脂之供給模式。In this way, since the supply state of the liquid resin to the release film F (substrate Sa before resin sealing) is graphically displayed based on the input of the supply position of the liquid resin, the supply state of the liquid resin can be grasped visually. That is, only by inputting the plane position of the liquid resin supplied to the release film F, the supply state of the liquid resin can be grasped intuitively, and an ideal supply pattern of the liquid resin can be set so as to achieve a reasonable supply amount and a reasonable supply position. As a result, during molding of the mold clamping mechanism 35, the problem of liquid resin overflowing from the lower cavity MC can be eliminated, and the liquid resin can be preferentially supplied to the portion where the liquid resin is likely to be insufficient depending on the type of the substrate S. Furthermore, if the weight and length of the liquid resin are displayed on the calculation result display unit 62, the supply pattern of the liquid resin can be easily changed so as to obtain a reasonable supply amount and a reasonable supply position.

當選擇輸入切換部64之調整點輸入模式64b時，供給狀態顯示部61成為能將再次供給完成了樹脂供給後之不足部分之液態樹脂之位置（調整點）輸入至供給狀態顯示部61之狀態。該調整點例如藉由設定於脫模膜F（樹脂密封前基板Sa）之中央部分（圖4之上圖所示之“ADJ”），在合模機構35之成型時，不存在不足部分之液態樹脂從下模腔MC溢出這樣之不良狀況。如此，樹脂供給機構21完成了對脫模膜F供給液態樹脂後，在供給狀態顯示部61中顯示再次供給不足部分之液態樹脂之位置，因此藉由調整該位置，能以成為合理之供給量和合理之供給位置之方式供給樹脂材料。When the adjustment point input mode 64b of the input switching unit 64 is selected, the supply status display unit 61 is in a state where the position (adjustment point) of the liquid resin that is insufficient after the completion of the resin supply is resupplied can be input to the supply status display unit 61 . For example, by setting this adjustment point at the central part ("ADJ" shown in the upper diagram of FIG. 4 ) of the release film F (resin-sealed front substrate Sa), there is no shortage of part during the molding of the mold clamping mechanism 35. There is a problem that the liquid resin overflows from the lower cavity MC. In this way, after the resin supply mechanism 21 finishes supplying the liquid resin to the release film F, the supply state display unit 61 displays the position where the insufficient liquid resin is supplied again. Therefore, by adjusting this position, a reasonable supply amount can be achieved. Supply resin materials in a reasonable supply position.

如圖5所示，參數顯示部63也可以顯示對樹脂供給機構21之工作速度進行校正之校正值（圖5所示之“偏移（Offset）”欄）。若裝配有噴嘴單元23之點膠機單元24之移動速度（以下，稱為噴嘴單元23之移動速度）與從噴嘴單元23排出之液態樹脂之排出速度不一致，則塗佈線產生起伏，無法描繪如設定那樣之塗佈線。因此，作為對樹脂供給機構21之工作速度進行校正之校正值，向參數顯示部63輸入噴嘴單元23之移動速度之校正比例（比率，1為標準值），控制部5優選根據該校正比例來變更噴嘴單元23之移動速度。藉此，能消除液態樹脂對脫模膜F之塗佈線之起伏，以成為合理之供給量和合理之供給位置之方式設定液態樹脂之供給模式。又，噴嘴單元23之移動速度可以按每條塗佈線變更，也可以整體統一地變更。As shown in FIG. 5 , the parameter display unit 63 may display a correction value for correcting the operating speed of the resin supply mechanism 21 (column “Offset” shown in FIG. 5 ). If the moving speed of the dispenser unit 24 equipped with the nozzle unit 23 (hereinafter referred to as the moving speed of the nozzle unit 23) does not match the discharge speed of the liquid resin discharged from the nozzle unit 23, the coating line will fluctuate and cannot be drawn. Coating line as set. Therefore, as a correction value for correcting the operating speed of the resin supply mechanism 21, a correction ratio (ratio, 1 is a standard value) of the moving speed of the nozzle unit 23 is input to the parameter display unit 63, and the control unit 5 preferably adjusts the movement speed according to the correction ratio. The moving speed of the nozzle unit 23 is changed. Thereby, the undulation of the coating line of the liquid resin to the release film F can be eliminated, and the supply pattern of the liquid resin can be set so that it may become a reasonable supply amount and a reasonable supply position. In addition, the moving speed of the nozzle unit 23 may be changed for each coating line, or may be changed collectively as a whole.

此外，作為樹脂供給機構21中之一輪供給結束時之工作內容，參數顯示部63也可以顯示樹脂供給機構21暫時停止了對脫模膜F供給液態樹脂後，使噴嘴23b上下移動之次數（圖5所示之“排空（Drain）”欄）。在結束向一條塗佈線供給液態樹脂，暫時停止了點膠機單元24之驅動後，即使將噴嘴23b堵塞，液態樹脂之粘性越高，液態樹脂之拉絲狀態在噴嘴23b中也越長時間維持，因此直至該拉絲狀態消除為止才使點膠機單元24之驅動停止，生產性會降低。因此，優選係，向參數顯示部63輸入使噴嘴單元23上下移動之次數，控制部5利用規定之斷液點使噴嘴單元23上下移動。藉由調整使噴嘴單元23上下移動之次數，能更早消除拉絲狀態。In addition, as the operation content when one round of supply in the resin supply mechanism 21 ends, the parameter display part 63 may also display the number of times the nozzle 23b moves up and down after the resin supply mechanism 21 temporarily stops supplying the liquid resin to the release film F (Fig. "Drain" column shown in 5). After the supply of liquid resin to one coating line is completed and the drive of the dispenser unit 24 is temporarily stopped, even if the nozzle 23b is blocked, the higher the viscosity of the liquid resin, the longer the drawing state of the liquid resin will be maintained in the nozzle 23b. Therefore, the drive of the dispenser unit 24 is stopped until the stringing state is eliminated, and the productivity will be reduced. Therefore, it is preferable that the number of times the nozzle unit 23 is moved up and down is input to the parameter display unit 63, and the control unit 5 moves the nozzle unit 23 up and down using a predetermined liquid cut-off point. By adjusting the number of times the nozzle unit 23 moves up and down, the stringing state can be eliminated earlier.

當選擇輸入切換部64之斷液點輸入模式64c時，成為能將在樹脂供給機構21暫時停止了對脫模膜F供給液態樹脂後使噴嘴23b上下移動之位置（斷液點）輸入至供給狀態顯示部61之狀態。該斷液點例如藉由設定于各塗佈線之中央部分，能向脫模膜F上均勻地供給液態樹脂。如此，若顯示在樹脂供給機構21暫時停止了對脫模膜F供給液態樹脂後使噴嘴23b上下移動之位置，則能藉由調整該位置來均勻地供給樹脂材料。When the liquid cut-off point input mode 64c of the input switching unit 64 is selected, the position (liquid cut-off point) at which the nozzle 23b moves up and down after the resin supply mechanism 21 temporarily stops supplying the liquid resin to the release film F can be input to the supply system. The status of the status display unit 61. The liquid resin can be uniformly supplied on the release film F by setting this liquid cut point, for example, at the center part of each coating line. In this way, if the position where the nozzle 23b moves up and down after the resin supply mechanism 21 temporarily stops supplying the liquid resin to the release film F is displayed, the resin material can be supplied uniformly by adjusting this position.

又，作為樹脂供給機構21中之一輪之供給結束時之工作內容，參數顯示部63也可以顯示使噴嘴單元23沿塗佈線往復移動之時間（後述之規定時間）。在該情況下，優選係，向參數顯示部63輸入使噴嘴單元23往復移動之時間，控制部5根據該時間而使噴嘴單元23沿塗佈線往復移動。藉此，在暫時停止了點膠機單元24之驅動後，直至盒23a內之壓力被釋放為止，從噴嘴23b排出之殘留液體均等地塗布于塗佈線，因此能防止樹脂積存。In addition, the parameter display unit 63 may display the time for reciprocating the nozzle unit 23 along the coating line (predetermined time described later) as the operation content when the supply of one round of the resin supply mechanism 21 is completed. In this case, preferably, the time for reciprocating the nozzle unit 23 is input to the parameter display unit 63, and the control unit 5 reciprocates the nozzle unit 23 along the coating line based on the time. Thereby, after the drive of the dispenser unit 24 is temporarily stopped, until the pressure in the cartridge 23a is released, the residual liquid discharged from the nozzle 23b is uniformly applied to the coating line, thereby preventing resin accumulation.

此外，參數顯示部63也可以顯示與供給狀態顯示部61所顯示之供給狀態相關之每條塗佈線之液態樹脂之長度和重量（圖5所示之“距離”、“量”欄）。如此，若基於供給狀態顯示部61中之液態樹脂之供給位置之輸入，掌握每條塗佈線之液態樹脂之供給狀態，則能以在塗佈線之間成為均等之供給長度和供給量之方式變更液態樹脂之供給模式。In addition, the parameter display unit 63 can also display the length and weight of the liquid resin of each coating line (columns “distance” and “quantity” shown in FIG. 5 ) related to the supply status displayed on the supply status display unit 61 . In this way, if the supply state of the liquid resin for each coating line is grasped based on the input of the supply position of the liquid resin in the supply state display unit 61, the supply length and the supply amount can be equalized between the coating lines. Method Change the supply mode of liquid resin.

[樹脂材料供給方法][Resin material supply method]

主要使用圖6對樹脂材料供給方法進行說明。The resin material supply method will be described mainly using FIG. 6 .

控制部5至少基於作為成型物件物之基板S之尺寸、基板S中之晶片等之存在區域，預先對脫模膜F之塗布區域中之液態樹脂之最大重量和最大長度進行運算。接著，利用手指觸摸供給狀態顯示部61而輸入了起始點和終點後，藉由向參數顯示部63輸入線序號，來描繪多條（例如，N＝5）塗佈線，輸入樹脂供給位置（#61）。具體而言，與起始點和終點之觸摸輸入相對應，在圖3所示之供給狀態顯示部61中顯示點序號，在參數顯示部63中藉由輸入線序號（圖3之參數顯示部63所示之“線”欄）來描繪多條線段。此時，根據需要，也可以藉由對圖3所示之塗佈線調整部60進行游標操作來調整各塗佈線之長度。The control unit 5 preliminarily calculates the maximum weight and maximum length of the liquid resin in the coating area of the release film F based on at least the size of the substrate S as a molded object and the existing area of the wafer on the substrate S. Next, after inputting the start point and end point by touching the supply state display part 61 with a finger, a plurality of (for example, N=5) coating lines are drawn by inputting the line number to the parameter display part 63, and the resin supply position is input. (#61). Specifically, corresponding to the touch input of the start point and the end point, the point serial number is displayed in the supply state display part 61 shown in FIG. 63 shown in the "line" column) to describe multiple line segments. At this time, if necessary, the length of each coating line can also be adjusted by performing a cursor operation on the coating line adjustment unit 60 shown in FIG. 3 .

其結果係，如圖4之上圖所示，在供給狀態顯示部61中，將液態樹脂對脫模膜F（樹脂密封前基板Sa）之供給狀態圖形化而顯示（#62，顯示步驟）。然後，控制部5基於供給狀態顯示部61所顯示出之圖形，選定相對於多條線段而成為各自之起始點和終點之XY座標，對脫模膜F之塗布區域中之液態樹脂之重量和長度進行運算（計算步驟）。其結果係，如圖4之下圖所示，在運算結果顯示部62中，將脫模膜F之塗布區域中之液態樹脂之最大重量和最大長度以及與供給狀態顯示部61所顯示之供給狀態相關之液態樹脂之重量和長度依次顯示於上下行。As a result, as shown in the upper diagram of FIG. 4 , the supply state of the liquid resin to the release film F (substrate Sa before resin sealing) is graphically displayed on the supply state display unit 61 (#62, display step) . Then, the control unit 5 selects the XY coordinates of the respective start points and end points with respect to the plurality of line segments based on the graph displayed on the supply state display unit 61, and calculates the weight of the liquid resin in the coating area of the release film F and length (computation step). As a result, as shown in the lower figure of FIG. 4 , in the calculation result display unit 62, the maximum weight and maximum length of the liquid resin in the coating area of the release film F and the supply status displayed on the supply state display unit 61 are compared. The weight and length of the liquid resin relative to the state are displayed in the upper and lower rows in sequence.

接著，控制部5判定與供給狀態顯示部61所顯示之供給狀態相關之液態樹脂之重量和長度是否小於脫模膜F之塗布區域中之液態樹脂之最大重量和最大長度，亦即判定供給狀態（供給量和供給位置）是否合理（#63）。控制部5在與供給狀態顯示部61所顯示之供給狀態相關之液態樹脂之重量或長度未小於最大重量或最大長度之情況下，例如，將運算結果顯示部62之數位著色為紅色來進行警告顯示。藉此，能在視覺上判定供給狀態是否合理。在#63之判定之結果為供給狀態不合理之情況（#63中判定為否）下，再次對#61之樹脂供給位置之輸入進行修正。在該修正輸入時，如圖5之參數顯示部63所示，顯示出每條塗佈線之液態樹脂之重量和長度，因此能對每條塗佈線進行微修正。Next, the control part 5 determines whether the weight and length of the liquid resin related to the supply state displayed by the supply state display part 61 are smaller than the maximum weight and maximum length of the liquid resin in the coating area of the release film F, that is, to determine the supply state Whether (supply quantity and supply location) is reasonable (#63). When the weight or length of the liquid resin related to the supply status displayed on the supply status display unit 61 is not smaller than the maximum weight or maximum length, the control unit 5, for example, colors the digits of the calculation result display unit 62 in red to give a warning. show. Thereby, it is possible to visually judge whether or not the supply state is appropriate. If the result of the judgment in #63 is that the supply state is unreasonable (the judgment in #63 is NO), the input of the resin supply position in #61 is corrected again. When this correction is input, as shown in the parameter display part 63 of FIG. 5, the weight and length of the liquid resin for each coating line are displayed, so fine correction can be performed for each coating line.

在#63之判定之結果為供給狀態合理之情況（#63中判定為是）下，控制部5以噴嘴單元23之噴嘴23b位於第N＝1條（#64）塗佈線之起始點上部（圖4之上圖所示之點序號“00”之上部）之方式，使樹脂供給機構21之裝配有噴嘴單元23之點膠機單元24移動，沿該塗佈線朝向點序號“01”供給液態樹脂（#65，供給步驟）。此時，若向參數顯示部63輸入噴嘴單元23之移動速度之校正比例，則控制部5對排出液態樹脂之噴嘴單元23之移動速度進行校正（校正步驟）。其結果係，能使噴嘴單元23之移動速度與從噴嘴單元23排出之液態樹脂之排出速度一致而消除塗佈線之起伏。接著，控制部5判定噴嘴單元23是否到達第N＝1條塗佈線之終點上部（圖4之上圖所示之點序號“01”之上部）（#66）。若#66之判定之結果為噴嘴單元23未到達第N＝1條塗佈線之終點上部（#66中判定為否），則接著向第N＝1條塗佈線供給液態樹脂。When the result of determination in #63 is that the supply state is reasonable (the determination in #63 is Yes), the control section 5 locates the nozzle 23b of the nozzle unit 23 at the starting point of the N=1th (#64) coating line The upper part (the upper part of the dot serial number "00" shown in the upper figure of Figure 4) moves the dispenser unit 24 equipped with the nozzle unit 23 of the resin supply mechanism 21 toward the dot serial number "01" along the coating line. "Supply liquid resin (#65, supply step). At this time, when the correction ratio of the moving speed of the nozzle unit 23 is input to the parameter display unit 63, the control unit 5 corrects the moving speed of the nozzle unit 23 for discharging the liquid resin (calibration step). As a result, the movement speed of the nozzle unit 23 can be matched with the discharge speed of the liquid resin discharged from the nozzle unit 23, and the undulation of the coating line can be eliminated. Next, the control unit 5 judges whether the nozzle unit 23 has reached the upper part of the end point of the N=1th coating line (the upper part of the dot number "01" shown in the upper diagram of FIG. 4) (#66). If the result of determination in #66 is that the nozzle unit 23 has not reached the upper portion of the end point of the N=1 coating line (No in #66), then the liquid resin is supplied to the N=1 coating line.

若#66之判定之結果為噴嘴單元23到達第N＝1條塗佈線之終點上部（#66中判定為是），則控制部5判定為一輪之樹脂供給結束，暫時停止點膠機單元24之驅動。然後，使噴嘴單元23沿第N＝1條塗佈線（與脫模膜F平行之水準方向）往復移動（#67，往復移動步驟）。接著，作為向參數顯示部63輸入之使噴嘴單元23往復移動之時間，判定是否經過了釋放噴嘴單元23之殘留壓力之規定時間（#68）。若#68之判定之結果為未經過規定時間（#68中判定為否），則控制部5繼續使噴嘴單元23往復移動，若經過了規定時間（#68中判定為是），則N加1（#69）。在該加法運算之前，為了可靠地實現噴嘴單元23之斷液，控制部5利用規定之斷液點使噴嘴單元23進行輸入至參數顯示部63之次數之上下移動。接著，控制部5判定N是否超過匯流排數量（N＝5），若N為匯流排數量以內（#70中判定為否），則重複#65～#68之控制。If the result of the determination of #66 is that the nozzle unit 23 has reached the top of the end point of the N=1th coating line (determined as yes in #66), the control part 5 determines that one round of resin supply is completed, and temporarily stops the dispenser unit 24 drive. Then, the nozzle unit 23 is reciprocated along the N=1-th coating line (horizontal direction parallel to the release film F) (#67, reciprocating movement step). Next, it is determined whether or not a predetermined time for releasing the residual pressure of the nozzle unit 23 has elapsed as the time for reciprocating the nozzle unit 23 input to the parameter display unit 63 (#68). If the result of the judgment of #68 is that the prescribed time has not passed (judged as No in #68), the control section 5 continues to move the nozzle unit 23 back and forth, and if the prescribed time has passed (judged as Yes in #68), then N increases 1 (#69). Before this addition, the control unit 5 moves the nozzle unit 23 up and down by the number of times input to the parameter display unit 63 using a predetermined liquid cut-off point in order to reliably realize the liquid cut-off of the nozzle unit 23 . Next, the control unit 5 judges whether N exceeds the number of bus bars (N=5), and if N is within the number of bus bars (No in #70), the control of #65 to #68 is repeated.

另一方面，若N超過匯流排數量（N＝5）（#70中判定為是），則控制部5判定利用重量感測器25測定出之基於樹脂供給機構21之液態樹脂之供給量相對於目標量是否在公差範圍內（#71）。假設基於樹脂供給機構21之液態樹脂之供給量相對於目標量超出公差範圍而不足（#71中判定為否），則控制部5使噴嘴單元23移動至調整點（圖4之上圖所示之“ADJ”），向調整點供給不足部分之液態樹脂並結束（#72）。該調整點可以為脫模膜F（樹脂密封前基板Sa）之中央部分，也可以為多條塗佈線之間樹脂量相對少之塗佈線，也可以為利用檢查機構檢查出之不存在晶片等之區域。另一方面，若#71之判定之結果為基於樹脂供給機構21之液態樹脂之供給量相對於目標量在公差範圍內（#71中判定為是），則結束。On the other hand, if N exceeds the number of bus bars (N=5) (YES in #70), the control unit 5 determines that the supply amount of the liquid resin based on the resin supply mechanism 21 measured by the weight sensor 25 is relatively large. Whether the target quantity is within the tolerance range (#71). Assuming that the amount of liquid resin supplied by the resin supply mechanism 21 exceeds the tolerance range and is insufficient relative to the target amount (No in #71), the control unit 5 moves the nozzle unit 23 to the adjustment point (shown in the upper diagram of FIG. 4 "ADJ"), supply insufficient liquid resin to the adjustment point and end (#72). The adjustment point may be the central part of the release film F (substrate Sa before resin sealing), or it may be a coating line with a relatively small amount of resin among multiple coating lines, or it may be the non-existence detected by the inspection mechanism. area of wafers, etc. On the other hand, if the result of the determination in #71 is that the supply amount of the liquid resin by the resin supply mechanism 21 is within the tolerance range with respect to the target amount (YES in #71), the process ends.

[樹脂成型品之製造方法][Manufacturing method of resin molded products]

接著，對包括上述樹脂材料供給方法之樹脂成型品之製造方法進行說明。Next, a method of manufacturing a resin molded product including the above-mentioned resin material supply method will be described.

首先，如圖1所示，將從第一容納部43藉由基板交接部45交接到之樹脂密封前基板Sa載置於基板裝載機41。此時，檢查機構預先對作為成型對象物之基板S（樹脂密封前基板Sa）中之晶片等之存在區域進行檢查。此外，執行上述之樹脂材料供給方法，向脫模膜F供給液態樹脂。First, as shown in FIG. 1 , the pre-resin-sealed substrate Sa delivered from the first storage unit 43 through the substrate delivery unit 45 is placed on the substrate loader 41 . At this time, the inspection mechanism inspects in advance the region where a wafer or the like exists in the substrate S (substrate Sa before resin sealing) which is the object to be molded. Moreover, the above-mentioned resin material supply method is performed, and liquid resin is supplied to the release film F. FIG.

接著，樹脂裝載機12將脫模膜F移送至下模LM，藉由吸引機構將脫模膜F吸引於下模腔MC並保持。此外，基板裝載機41將樹脂密封前基板Sa移送至上模UM並與上模UM交接。接著，一邊利用合模機構35執行成型模M之合模，一邊利用下部加熱器36對下模LM進行加熱，藉此使脫模膜F上之液態樹脂在樹脂密封前基板Sa之晶片安裝面流動。然後，利用下部加熱器36對下模LM進一步加熱，下模腔MC內之液態樹脂固化，對樹脂密封前基板Sa進行樹脂密封而形成樹脂密封完畢之基板Sb（樹脂成型步驟）。接著，藉由使可動台板34向下方移動而進行成型模M之開模，利用基板裝載機41將剝離了脫模膜F之樹脂密封完畢之基板Sb輸送至輸送模組4，基板交接部45從基板裝載機41接受樹脂密封完畢之基板Sb，將其容納於第二容納部44（參照圖1）。Next, the resin loader 12 transfers the mold release film F to the lower mold LM, and the mold release film F is sucked and held in the lower mold cavity MC by a suction mechanism. In addition, the substrate loader 41 transfers the pre-resin-sealed substrate Sa to the upper mold UM and delivers it to the upper mold UM. Next, while the mold clamping mechanism 35 is used to clamp the mold M, the lower heater 36 is used to heat the lower mold LM, whereby the liquid resin on the release film F is placed on the wafer mounting surface of the substrate Sa before resin sealing. flow. Then, the lower mold LM is further heated by the lower heater 36, the liquid resin in the lower mold cavity MC is solidified, and the resin-sealed substrate Sa is resin-sealed to form the resin-sealed substrate Sb (resin molding step). Next, the molding mold M is opened by moving the movable platen 34 downward, and the resin-sealed substrate Sb with the release film F peeled off is transported to the conveying module 4 by the substrate loader 41, and the substrate transfer section 45 receives the resin-sealed substrate Sb from the substrate loader 41 and accommodates it in the second storage portion 44 (see FIG. 1 ).

[另一實施方式][another embodiment]

以下，為了容易理解，對與上述之實施方式相同之構件使用相同術語、圖式標記來進行說明。Hereinafter, for the sake of easy understanding, the same terms and reference signs will be used for the same components as those in the above-mentioned embodiment.

＜1＞<1>

液態樹脂向作為供給對象物之脫模膜F（樹脂密封前基板Sa）之供給狀態不限定於圖4之上圖所示之圖形化之多條塗佈線，例如，也可以由多個平行之直線形成，也可以由點群構成。在該情況下，各點成為“圖形”。此外，塗佈線不限定於直線，也可以由曲線或直線與曲線之組合形成。The supply state of the liquid resin to the release film F (resin-sealed substrate Sa) as the object to be supplied is not limited to the patterned multiple coating lines shown in the upper diagram of FIG. Formed by straight lines, it can also be formed by point groups. In this case, each point becomes a "graph". In addition, the coating line is not limited to a straight line, and may be formed by a curved line or a combination of a straight line and a curved line.

＜2＞<2>

樹脂供給機構21也可以由向脫模膜F供給粉粒體狀樹脂（樹脂材料之一個例子）之裝置構成。在該情況下，填充有粉粒體狀樹脂之容器被上述之樹脂裝載機12移送至樹脂供給機構21。然後，粉粒體狀樹脂經由連接於容器之底部開口之振動槽向脫模膜F供給。The resin supply mechanism 21 may be comprised by the apparatus which supplies powdery granular resin (an example of a resin material) to the release film F. As shown in FIG. In this case, the container filled with the powdery or granular resin is transferred to the resin supply mechanism 21 by the above-mentioned resin loader 12 . Then, the granular resin is supplied to the release film F through a vibrating tank connected to the bottom opening of the container.

＜3＞<3>

在上述之實施方式中，預先向噴嘴單元23中填充了液態樹脂，但也可以另行設置樹脂填充單元。在該情況下，在樹脂填充單元中，向容器之內部填充規定量之液態樹脂。然後，樹脂裝載機12將填充有液態樹脂之容器移送至樹脂供給機構21，點膠機單元24從容器吸引液態樹脂，從噴嘴23b供給脫模膜F上之液態樹脂。In the above-mentioned embodiment, the liquid resin is filled in the nozzle unit 23 in advance, but a resin filling unit may be provided separately. In this case, in the resin filling unit, a predetermined amount of liquid resin is filled into the container. Then, the resin loader 12 transfers the container filled with the liquid resin to the resin supply mechanism 21, the dispenser unit 24 sucks the liquid resin from the container, and supplies the liquid resin on the release film F from the nozzle 23b.

＜4＞<4>

通常，在基板S之幾乎整個區域等間隔地存在多個半導體晶片，但有時在基板S之一部分不存在半導體晶片。因此，可以將不存在半導體晶片之部分設為斷液點、調整點。Usually, a plurality of semiconductor wafers exist at equal intervals over almost the entire area of the substrate S, but sometimes no semiconductor wafer exists on a part of the substrate S. Therefore, the portion where no semiconductor wafer exists can be set as a liquid break point or an adjustment point.

＜5＞<5>

在上述之實施方式中，在樹脂供給模組2之內部向脫模膜F上供給樹脂材料，但樹脂供給模組2也可以將脫模膜供給機構22作為脫模膜供給模組而從樹脂供給模組2分離，設為兩個模組構成。In the above-mentioned embodiment, the resin material is supplied to the release film F inside the resin supply module 2, but the resin supply module 2 may also use the release film supply mechanism 22 as a release film supply module to supply the resin from the resin supply module 2. The supply module 2 is separated and configured as two modules.

＜6＞<6>

上述之實施方式中之基板S可以為圓形狀、矩形狀等任何形狀。The substrate S in the above-mentioned embodiment may be in any shape such as a circle, a rectangle, or the like.

＜7＞<7>

上述之實施方式中之對樹脂供給機構21之工作速度進行校正之校正值也可以構成為將一條塗佈線分割為多條，能對各分割線進行設定。The correction value for correcting the operating speed of the resin supply mechanism 21 in the above-mentioned embodiment may also be configured so that one coating line is divided into multiple lines, and each division line can be set.

＜8＞<8>

在上述之實施方式中，以晶片下置（Die down）之壓縮方式進行了說明，但也可以作為晶片上置（Die up）之壓縮方式，將基板等成型物件物設為在樹脂供給機構21中供給樹脂之供給對象物。此外，也可以省略脫模膜F而將成型模M設為在樹脂供給機構21中供給樹脂之供給對象物。In the above-mentioned embodiment, the compression method of die down was described, but it can also be used as a compression method of die up, and molded objects such as substrates are placed in the resin supply mechanism 21 The object to be supplied to supply the resin. In addition, the mold release film F may be omitted, and the molding die M may be used as a supply object for supplying the resin in the resin supply mechanism 21 .

[上述實施方式之概要][Summary of the above-mentioned embodiment]

以下，對在上述之實施方式中說明之樹脂成型裝置D、樹脂成型品之製造方法以及樹脂材料供給方法之概要進行說明。Hereinafter, the outline of the resin molding apparatus D demonstrated in the said embodiment, the manufacturing method of a resin molded article, and the resin material supply method is demonstrated.

（1）樹脂成型裝置D之特徵構成為如下方面，前述樹脂成型裝置D具備：樹脂供給機構21，向供給對象物（脫模膜F）供給樹脂材料；成型模M，包括上模UM和與上模UM對置之下模LM；合模機構35，在將供給對象物配置於上模UM與下模LM之間之狀態下，對成型模M進行合模；顯示部6，基於對供給對象物供給樹脂材料之輸入，將樹脂材料之供給狀態圖形化而顯示；以及控制部5，至少控制樹脂供給機構21和顯示部6之工作。(1) The characteristic configuration of the resin molding device D is as follows. The above-mentioned resin molding device D includes: a resin supply mechanism 21 for supplying a resin material to the object to be supplied (release film F); The upper mold UM faces the lower mold LM; the mold clamping mechanism 35 clamps the forming mold M in a state where the object to be supplied is arranged between the upper mold UM and the lower mold LM; the display unit 6 The input of the object supply resin material displays the supply state of the resin material graphically; and the control unit 5 controls at least the operations of the resin supply mechanism 21 and the display unit 6 .

在本構成中，基於對供給對象物供給樹脂材料之輸入，將樹脂材料之供給狀態圖形化而顯示，因此能在視覺上掌握樹脂材料之供給狀態。亦即，僅輸入對供給對象物供給之樹脂材料之平面位置等，就能直觀掌握樹脂材料之供給狀態，以成為合理之供給量和合理之供給位置之方式設定樹脂材料之理想之供給模式。其結果係，在用合模機構35對成型模M進行合模之狀態下之成型時，消除了樹脂材料從下模腔MC溢出這樣之不良狀況，能根據成型物件物之種類而向樹脂材料容易不足之部位重點供給樹脂材料。如此，能提供能容易變更樹脂材料之供給模式之樹脂成型裝置D。In this configuration, since the supply state of the resin material is graphically displayed based on the input of supply of the resin material to the object to be supplied, the supply state of the resin material can be grasped visually. That is, only by inputting the planar position of the resin material to be supplied to the object to be supplied, etc., the supply state of the resin material can be grasped intuitively, and an ideal supply pattern of the resin material can be set so as to achieve a reasonable supply amount and a reasonable supply position. As a result, when the mold M is clamped by the mold clamping mechanism 35, the problem of overflow of the resin material from the lower cavity MC is eliminated, and the resin material can be poured according to the type of the molded object. Focus on supplying resin materials to parts that are prone to shortage. In this manner, it is possible to provide the resin molding apparatus D capable of easily changing the supply mode of the resin material.

（2）也可以係，顯示部6顯示與樹脂材料之供給狀態相關之樹脂材料之重量和長度。(2) The display unit 6 may display the weight and length of the resin material related to the supply state of the resin material.

若如本構成那樣顯示樹脂材料之重量和長度，則能以成為合理之供給量和合理之供給位置之方式容易變更樹脂材料之供給模式。If the weight and length of the resin material are displayed as in this configuration, the supply pattern of the resin material can be easily changed so as to obtain a reasonable supply amount and a reasonable supply position.

（3）也可以係，顯示部6顯示對樹脂供給機構21之工作速度進行校正之校正值。(3) The display unit 6 may display a correction value for correcting the operating speed of the resin supply mechanism 21 .

若噴嘴單元23之移動速度與樹脂材料之排出速度不一致，則無法描繪如設定那樣之塗佈線。若如本構成那樣顯示對樹脂供給機構21之工作速度進行校正之校正值，則能描繪如設定那樣之塗佈線。If the moving speed of the nozzle unit 23 does not match the discharge speed of the resin material, the coating line cannot be drawn as set. If the correction value for correcting the operating speed of the resin supply mechanism 21 is displayed as in this configuration, the coating line as set can be drawn.

（4）也可以係，樹脂供給機構21包括排出樹脂材料之噴嘴23b，顯示部6顯示：在樹脂供給機構21暫時停止了對供給對象物供給樹脂材料後，使噴嘴23b上下移動之次數。(4) The resin supply mechanism 21 may include a nozzle 23b for discharging the resin material, and the display unit 6 may display the number of times the nozzle 23b moves up and down after the resin supply mechanism 21 temporarily stops supplying the resin material to the object to be supplied.

樹脂材料之粘性越高，樹脂供給機構21中之樹脂供給暫時停止後，噴嘴23b之拉絲狀態越長時間維持，因此直至該拉絲狀態消除為止才使點膠機單元24之驅動停止，生產性會降低。若如本構成那樣顯示：在樹脂供給機構21暫時停止了對供給對象物供給樹脂材料後，使噴嘴23b上下移動之次數，則能藉由調整該次數來更早地消除拉絲狀態。The higher the viscosity of the resin material, the longer the drawing state of the nozzle 23b will be maintained after the resin supply in the resin supply mechanism 21 is temporarily stopped. Therefore, the drive of the dispenser unit 24 will not be stopped until the drawing state is eliminated, and the productivity will decrease. reduce. If the number of times the nozzle 23b is moved up and down after the resin supply mechanism 21 temporarily stops supplying the resin material to the object to be supplied is displayed as in this configuration, the stringing state can be eliminated earlier by adjusting the number of times.

（5）也可以係，顯示部6顯示使噴嘴23b上下移動之位置。(5) The display unit 6 may display the position where the nozzle 23b is moved up and down.

若如本構成那樣顯示：在樹脂供給機構21暫時停止了對供給對象物供給樹脂材料後使噴嘴23b上下移動之位置，能藉由調整該位置而均勻地供給樹脂材料。As shown in this configuration, the resin material can be uniformly supplied by adjusting the position where the nozzle 23b is moved up and down after the resin supply mechanism 21 temporarily stops supplying the resin material to the object to be supplied.

（6）也可以係，顯示部6顯示：在樹脂供給機構21完成了對供給對象物供給樹脂材料後，再次供給不足部分之樹脂材料之位置。(6) The display unit 6 may display the position where the insufficient resin material is supplied again after the resin supply mechanism 21 finishes supplying the resin material to the object to be supplied.

若如本構成那樣顯示：在樹脂供給機構21完成了對供給對象物供給樹脂材料後，再次供給不足部分之樹脂材料之位置，則能藉由調整該位置而以成為合理之供給量和合理之供給位置之方式供給樹脂材料。If it is shown as in this structure: after the resin supply mechanism 21 finishes supplying the resin material to the object to be supplied, the position of supplying the insufficient part of the resin material again can be adjusted to become a reasonable supply amount and a reasonable amount. Supply the resin material by means of the supply position.

（7）也可以係，控制部5根據樹脂材料之物性和樹脂供給機構21之規格，計算出與樹脂材料之供給狀態相關之樹脂材料之重量和長度。(7) The control unit 5 may calculate the weight and length of the resin material related to the supply state of the resin material based on the properties of the resin material and the specifications of the resin supply mechanism 21 .

樹脂材料之供給狀態會根據樹脂材料之比重、噴嘴直徑等而變化。因此，若如本構成那樣，根據樹脂材料之物性和樹脂供給機構21之規格，計算出與供給狀態相關之樹脂材料之重量和長度，則能以成為合理之供給量和合理之供給位置之方式供給樹脂材料。The supply state of the resin material varies depending on the specific gravity of the resin material, the diameter of the nozzle, and the like. Therefore, if the weight and length of the resin material related to the supply state are calculated based on the physical properties of the resin material and the specifications of the resin supply mechanism 21 as in this configuration, then it is possible to achieve a reasonable supply amount and a reasonable supply position. Supply resin material.

（8）樹脂成型品之製造方法之特徵在於如下方面，前述樹脂成型品之製造方法包括：顯示步驟，基於對供給對象物（脫模膜F）供給樹脂材料之輸入，將樹脂材料之供給狀態圖形化而顯示；樹脂供給步驟，基於供給狀態，向供給對象物供給樹脂材料；以及樹脂成型步驟，使用樹脂供給步驟中供給之樹脂材料進行樹脂成型。(8) The method of manufacturing a resin molded product is characterized in that the method of manufacturing a resin molded product includes: a display step of displaying the supply state of the resin material based on the input of the resin material supplied to the object to be supplied (release film F). Graphically displaying; a resin supply step of supplying a resin material to a supply object based on a supply state; and a resin molding step of performing resin molding using the resin material supplied in the resin supply step.

在本方法中，基於對供給對象物供給樹脂材料之輸入，將樹脂材料之供給狀態圖形化而顯示，因此能在視覺上掌握樹脂材料之供給狀態。亦即，僅輸入對供給對象物供給之樹脂材料之平面位置等，就能掌握樹脂材料之供給狀態，以成為合理之供給量和合理之供給位置之方式設定樹脂材料之理想之供給模式。其結果係，能根據成型物件物之種類而向樹脂材料容易不足之部位重點供給樹脂材料。如此，能提供能容易變更樹脂材料之供給模式之樹脂成型品之製造方法。In this method, since the supply state of the resin material is graphically displayed based on the input of supply of the resin material to the object to be supplied, the supply state of the resin material can be grasped visually. That is, only by inputting the planar position of the resin material to be supplied to the supply object, etc., the supply state of the resin material can be grasped, and an ideal supply pattern of the resin material can be set so as to achieve a reasonable supply amount and a reasonable supply position. As a result, the resin material can be preferentially supplied to the portion where the resin material is likely to be insufficient according to the type of the molded article. In this way, it is possible to provide a method of manufacturing a resin molded product in which the supply mode of the resin material can be easily changed.

（9）樹脂材料供給方法之特徵在於如下方面，前述樹脂材料供給方法包括：顯示步驟，基於對供給對象物（脫模膜F）供給樹脂材料之輸入，將樹脂材料之供給狀態圖形化而顯示；以及樹脂供給步驟，基於供給狀態，向供給對象物供給樹脂材料。(9) The method for supplying the resin material is characterized in that the method for supplying the resin material includes: a display step of graphically displaying the supply state of the resin material based on the input of supplying the resin material to the object to be supplied (release film F). and a resin supply step of supplying the resin material to the supply object based on the supply state.

在本方法中，基於對供給對象物供給樹脂材料之輸入，將樹脂材料之供給狀態圖形化而顯示，因此能在視覺上掌握樹脂材料之供給狀態。亦即，僅輸入對供給對象物供給之樹脂材料之平面位置等，就能掌握樹脂材料之供給狀態，以成為合理之供給量和合理之供給位置之方式設定樹脂材料之理想之供給模式。其結果係，能根據成型物件物之種類而向樹脂材料容易不足之部位重點供給樹脂材料。如此，能提供能容易變更樹脂材料之供給模式之樹脂材料供給方法。In this method, since the supply state of the resin material is graphically displayed based on the input of supply of the resin material to the object to be supplied, the supply state of the resin material can be grasped visually. That is, only by inputting the planar position of the resin material to be supplied to the supply object, etc., the supply state of the resin material can be grasped, and an ideal supply pattern of the resin material can be set so as to achieve a reasonable supply amount and a reasonable supply position. As a result, the resin material can be preferentially supplied to the portion where the resin material is likely to be insufficient according to the type of the molded article. In this manner, it is possible to provide a resin material supply method capable of easily changing the supply mode of the resin material.

（10）也可以係，上述樹脂材料供給方法還包含：計算步驟，計算出與樹脂材料之供給狀態相關之樹脂材料之重量和長度。(10) The method for supplying the resin material may further include: a calculation step of calculating the weight and length of the resin material related to the supply state of the resin material.

若如本方法那樣，計算出樹脂材料之重量和長度，則能以成為合理之供給量和合理之供給位置之方式容易變更樹脂材料之供給模式。If the weight and length of the resin material are calculated as in this method, the supply pattern of the resin material can be easily changed so as to obtain a reasonable supply amount and a reasonable supply position.

（11）也可以係，上述樹脂材料供給方法還包含：校正步驟，對在樹脂供給步驟中排出樹脂材料之噴嘴單元23之移動速度進行校正。(11) The above resin material supply method may further include a correction step of correcting the moving speed of the nozzle unit 23 that discharges the resin material in the resin supply step.

若噴嘴單元23之移動速度與樹脂材料之排出速度不一致，則無法描繪如設定那樣之塗佈線。若如本方法那樣，對排出樹脂材料之噴嘴單元23之移動速度進行校正，則能描繪如設定那樣之塗佈線。If the moving speed of the nozzle unit 23 does not match the discharge speed of the resin material, the coating line cannot be drawn as set. If the moving speed of the nozzle unit 23 which discharges a resin material is corrected like this method, the coating line as set can be drawn.

（12）也可以係，上述樹脂材料供給方法還包含：往復移動步驟，在樹脂供給步驟中暫時停止了對供給對象物供給樹脂材料後，使排出樹脂材料之噴嘴單元23在與供給對象物平行之水準方向上往復移動。(12) It is also possible that the above-mentioned resin material supply method further includes: a reciprocating movement step, in which the supply of the resin material to the supply object is temporarily stopped in the resin supply step, and then the nozzle unit 23 that discharges the resin material is positioned parallel to the supply object. Move back and forth in the horizontal direction.

樹脂供給步驟中之樹脂供給暫時停止後，直至噴嘴單元23之殘留壓力被釋放為止，恐怕會因從噴嘴23b排出之殘留液體而形成樹脂積存。若如本方法那樣，在暫時停止了對供給對象物供給樹脂材料後，使排出樹脂材料之噴嘴單元23在與供給對象物平行之水準方向上往復移動，則能防止樹脂積存。After the resin supply in the resin supply step is temporarily stopped until the residual pressure of the nozzle unit 23 is released, there is a possibility that a resin pool may be formed due to the residual liquid discharged from the nozzle 23b. Resin accumulation can be prevented by reciprocating the nozzle unit 23 that discharges the resin material in the horizontal direction parallel to the object to be supplied after the supply of the resin material to the object to be supplied is temporarily stopped as in this method.

又，上述之實施方式（包括另一實施方式，以下相同）中公開之構成只要不產生矛盾，就能與其他實施方式中公開之構成組合來應用。此外，在本說明書中公開之實施方式為例示，本發明之實施方式並不限定於此，可以在不脫離本發明之主旨之範圍內適當改變。In addition, the configuration disclosed in the above-mentioned embodiment (including another embodiment, the same applies hereinafter) can be applied in combination with the configuration disclosed in the other embodiment as long as there is no conflict. In addition, embodiment disclosed in this specification is an illustration, Embodiment of this invention is not limited to this, It can change suitably in the range which does not deviate from the summary of this invention.

產業上之可利用性Industrial availability

本發明能用於樹脂成型裝置和樹脂成型品之製造方法。The present invention can be applied to a resin molding device and a method of manufacturing a resin molded article.

11:樹脂容納部                                        12:樹脂裝載機 2:樹脂供給模組                                      21:樹脂供給機構 21A:工作臺                                             22:脫模膜供給機構 23:噴嘴單元                                            23a:盒 23b:噴嘴                                                  24:點膠機單元 25:重量感測器                                        3:壓縮成型模組 31:下部固定盤                                        32:板狀構件 33:上部固定盤                                        34:可動台板 35:合模機構                                            36:下部加熱器 37:上部加熱器                                        4:輸送模組 41:基板裝載機                                        43:第一容納部 44:第二容納部                                        45:基板交接部 5:控制部                                                  6:顯示部 60:塗佈線調整部                                    61:供給狀態顯示部 62:運算結果顯示部                                 63:參數顯示部 64:輸入切換部                                        64a:樹脂供給輸入模式 64b:調整點輸入模式                               64c:斷液點輸入模式 D:樹脂成型裝置                                      F:脫模膜（供給對象物） M:成型模                                                LM:下模 UM:上模                                                 MC:下模腔 S:基板                                                     Sa:樹脂密封前基板 Sb:樹脂密封完畢之基板11:Resin housing part 12: Resin loader 2: Resin supply module 21: Resin supply mechanism 21A:Workbench 22: Release film supply mechanism 23:Nozzle unit 23a: box 23b: Nozzles 24: Dispenser unit 25: Weight sensor 3: Compression molding module 31: Lower fixed plate 32: Plate member 33: Upper fixed plate 34: movable platen 35: Clamping mechanism 36: Lower heater 37: Upper heater 4: Conveyor module 41: Substrate loader 43: The first containment department 44:Second storage part 45: Substrate transfer part 5: Control Department 6: Display part 60: Coating line adjustment department 61: Supply status display unit 62: Calculation result display unit 63: Parameter display part 64: Input switching part 64a: Resin supply input mode 64b: Adjustment point input mode 64c: Liquid break point input mode D: Resin molding device F: Release film (supplied object) M: forming mold LM: lower mold UM: upper mold MC: lower cavity S: Substrate Sa: Resin-sealed front substrate Sb: substrate sealed with resin

圖1為表示樹脂成型裝置之示意圖。 圖2為表示合模機構之示意圖。 圖3為表示顯示部之整體之圖。 圖4為表示顯示部之一部分之圖。 圖5為表示顯示部之一部分之圖。 圖6為樹脂材料供給方法之流程圖。Fig. 1 is a schematic diagram showing a resin molding apparatus. Fig. 2 is a schematic diagram showing a mold clamping mechanism. FIG. 3 is a diagram showing the whole of a display unit. Fig. 4 is a diagram showing part of a display unit. Fig. 5 is a diagram showing part of a display unit. Fig. 6 is a flowchart of a resin material supply method.

12:樹脂裝載機12: Resin loader

2:樹脂供給模組2: Resin supply module

21:樹脂供給機構21: Resin supply mechanism

21A:工作臺21A:Workbench

22:脫模膜供給機構22: Release film supply mechanism

23:噴嘴單元23:Nozzle unit

23a:盒23a: box

23b:噴嘴23b: Nozzle

24:點膠機單元24: Dispenser unit

25:重量感測器25: Weight sensor

3:壓縮成型模組3: Compression molding module

4:輸送模組4: Conveyor module

5:控制部5: Control Department

6:顯示部6: Display part

D:樹脂成型裝置D: Resin molding device

F:脫模膜(供給對象物)F: Release film (supplied object)

M:成型模M: forming mold

LM:下模LM: lower mold

MC:下模腔MC: lower cavity

S:基板S: Substrate

Sa:樹脂密封前基板Sa: Resin-sealed front substrate

Sb:樹脂密封完畢之基板Sb: substrate sealed with resin

Claims (8)

一種樹脂成型裝置，其中，具備：樹脂供給機構，向供給對象物供給樹脂材料；成型模，包括上模和與該上模對置之下模；合模機構，在將供給有前述樹脂材料之前述供給對象物配置於前述上模與前述下模之間之狀態下，對前述成型模進行合模而壓縮成型；顯示部，基於對前述供給對象物供給前述樹脂材料之輸入，在前述成型模之合模之前將前述樹脂材料之供給狀態所含之塗佈線圖形化而顯示；以及控制部，至少控制前述樹脂供給機構和前述顯示部之工作；其中，前述控制部在前述成型模之合模之前，以基於顯示於前述顯示部之前述塗佈線之設定將前述樹脂材料供給至前述供給對象物之方式，控制前述樹脂供給機構之工作。 A resin molding device, comprising: a resin supply mechanism for supplying a resin material to an object to be supplied; a molding mold including an upper mold and a lower mold opposed to the upper mold; and a mold clamping mechanism for supplying the aforementioned resin material. The object to be supplied is placed between the upper mold and the lower mold, and the molding die is clamped to perform compression molding. The display unit is displayed on the molding mold based on the input of the resin material supplied to the object to be supplied. Before the mold is closed, the coating line included in the supply state of the aforementioned resin material is graphically displayed; and the control part controls at least the operation of the aforementioned resin supply mechanism and the aforementioned display part; Before the molding, the operation of the resin supply mechanism is controlled so that the resin material is supplied to the supply object based on the setting of the coating line displayed on the display unit. 如請求項1之樹脂成型裝置，其中，前述顯示部顯示與前述供給狀態相關之前述樹脂材料之重量和長度。 The resin molding apparatus according to claim 1, wherein the display unit displays the weight and length of the resin material related to the supply state. 如請求項1或2之樹脂成型裝置，其中，前述顯示部顯示對前述樹脂供給機構之工作速度進行校正之校正值。 The resin molding apparatus according to claim 1 or 2, wherein the display unit displays a correction value for correcting the operating speed of the resin supply mechanism. 如請求項1或2之樹脂成型裝置，其中：前述樹脂供給機構包括排出前述樹脂材料之噴嘴，前述顯示部顯示：在前述樹脂供給機構暫時停止了對前述供給對象物供給前述樹脂材料後，使前述噴嘴上下移動之次數。 The resin molding apparatus according to claim 1 or 2, wherein: the resin supply mechanism includes a nozzle for discharging the resin material, and the display unit displays: after the resin supply mechanism temporarily stops supplying the resin material to the object to be supplied, The number of times the aforementioned nozzle moves up and down. 如請求項4之樹脂成型裝置，其中，前述顯示部顯示使前述噴嘴上下移動之位置。 The resin molding apparatus according to claim 4, wherein the display unit displays the position where the nozzle is moved up and down. 如請求項1或2之樹脂成型裝置，其中，前述顯示部顯示：在前述樹脂供給機構完成了對前述供給對象物供給前述樹脂材料後，再次供給不足部分之前述樹脂材料之位置。 The resin molding apparatus according to claim 1 or 2, wherein the display unit displays a position where the insufficient portion of the resin material is resupplied after the resin supply mechanism finishes supplying the resin material to the object to be supplied. 如請求項1或2之樹脂成型裝置，其中，前述控制部根據前述樹脂材料之物性和前述樹脂供給機構之規格，計算出與前述供給狀態相關之前述樹脂材料之重量和長度。 The resin molding apparatus according to claim 1 or 2, wherein the control unit calculates the weight and length of the resin material related to the supply state based on the physical properties of the resin material and the specifications of the resin supply mechanism. 一種樹脂成型品之製造方法，其中，包括：顯示步驟，基於對供給對象物供給樹脂材料之輸入，將前述樹脂材料之供給狀態所含之塗佈線圖形化而顯示；樹脂供給步驟，基於以前述顯示步驟所顯示之前述塗佈線之設定，向前述供給對象物供給前述樹脂材料；以及樹脂成型步驟，在將前述樹脂供給步驟中供給有前述樹脂材料之前述供給對象物配置於上模與下模之間之狀態下，對成型模進行合模而進行壓縮成型。 A method of manufacturing a resin molded product, comprising: a display step of displaying a coating line included in the supply state of the resin material in a pattern based on an input of a resin material supply to a supply object; and a resin supply step based on the In the setting of the coating line displayed in the display step, the resin material is supplied to the object to be supplied; and in the resin molding step, the object to be supplied to which the resin material is supplied in the resin supply step is arranged on the upper mold and the object to be supplied. In the state between the lower dies, the molding dies are clamped to perform compression molding.
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