TW201535017A - 對準方法、電子零件之連接方法、連接體之製造方法、連接體、異向性導電膜 - Google Patents
對準方法、電子零件之連接方法、連接體之製造方法、連接體、異向性導電膜 Download PDFInfo
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- TW201535017A TW201535017A TW104103515A TW104103515A TW201535017A TW 201535017 A TW201535017 A TW 201535017A TW 104103515 A TW104103515 A TW 104103515A TW 104103515 A TW104103515 A TW 104103515A TW 201535017 A TW201535017 A TW 201535017A
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Abstract
將對準標記設置於與貼附異向性導電膜之區域重疊的位置,並且精度佳地進行使用藉由相機之拍攝圖像之對準。
一種對準方法,係於透明基板12之表面,經由導電性接著劑1搭載電子零件18,自透明基板12之背面側拍攝基板側對準標記21及零件側對準標記22,根據拍攝圖像調整兩對準標記21、22之位置,從而使相對於透明基板12之電子零件18的搭載位置對準;關於導電性接著劑1,於俯視下,導電性粒子4規則地排列,於拍攝圖像中,沿著兩對準標記21、22之外側緣的假想線段,自導電性粒子4間看到的兩對準標記21、22的外側緣以線段S之形式間斷地表示。
Description
本發明係關於一種電子零件與電路基板之對準方法,尤其關於一種經由含有導電性粒子之接著劑將電子零件連接至電路基板時之電子零件與電路基板之對準方法、電子零件之連接方法、連接體之製造方法、連接體及異向性導電膜。本申請案以於日本在2014年2月7日提出申請之日本申請案編號特願2014-022861為基礎而主張優先權,該申請案藉由參照引用於本申請案。
自先前以來,作為電視或PC顯示器、行動電話或智慧型手機、攜帶型遊戲機、平板終端或可佩戴終端、或者車載用顯示器等各種顯示手段,一直使用液晶顯示裝置或有機EL面板。近年來,關於此種顯示裝置,就微距化、輕量薄型化等觀點而言,採用將驅動用IC直接安裝於顯示面板的玻璃基板上之所謂COG(chip on glass,玻璃覆晶)。
例如於採用COG安裝方式之液晶顯示面板中,如圖8(A)(B)所示,於由玻璃基板等構成之透明基板101上,形成複數個由ITO(銦錫氧化物)等構成之透明電極102,於該等透明電極102上連接液晶驅動用IC103等電子零件。液晶驅動用IC103藉由於安裝面上對應透明電極102形成複數個連接端子104,並經由異向性導電膜105熱壓接於透明基板101上,
而使連接端子104與透明電極102連接。
異向性導電膜105係於黏合劑樹脂中混入導電性粒子而製成膜狀者,藉由被加熱壓接於2個導體間,而以導電性粒子取得導體間之電性導通,利用黏合劑樹脂保持導體間之機械連接。作為構成異向性導電膜105之接著劑,通常使用可靠性高之熱硬化性黏合劑樹脂,亦可為光硬化性黏合劑樹脂或光熱併用型黏合劑樹脂。
於經由此種異向性導電膜105將液晶驅動用IC103連接於透明電極102之情形時,首先,將異向性導電膜105藉由未圖示之預壓接手段暫時貼附於透明基板101之透明電極102上。繼而,經由異向性導電膜105將液晶驅動用IC103搭載於透明基板101上,形成預連接體,其後藉由熱壓頭106等熱壓接手段將液晶驅動用IC103與異向性導電膜105一併加熱推壓至透明電極102側。藉由利用此種熱壓頭106之加熱,異向性導電膜105發生熱硬化反應,藉此,液晶驅動用IC103被接著於透明電極102上。
此處,於在透明基板101搭載液晶驅動用IC103時,為了將形成於透明基板101之透明電極102與形成於液晶驅動用IC103之安裝面的連接端子104準確地連接,而事先進行對準。
藉由如下方式進行對準:利用設置於透明基板101之背面側的相機,拍攝分別設置於透明基板101及液晶驅動用IC103之安裝面的對準標記,基於所拍攝之圖像檢測出位置,基於檢測結果來移動基板或電子零件。對準標記事先被登記,藉由灰度查找(gray search)或二值法等圖像處理而使所拍攝之圖像與登記圖像匹配,藉此加以識別,可獲取位置資訊。
[專利文獻1]日本特開2005-26577號公報
伴隨近年來之液晶顯示裝置、此外電子機器之小型化、高功能化,電子零件亦小型化、高功能化,並且亦推進電路基板之配線間距或電子零件之連接端子的微距化。於使用異向性導電膜,將IC晶片等電子零件COG連接於電極端子經微距化之電路基板上之情形時,為了於經狹小化之電極端子間亦確實地夾持導電性粒子而確保導通,需要高密度地填充導電性粒子。
然而,若高密度地填充導電性粒子,則於進行電子零件對電路基板之對準時,有難以藉由設置於電路基板之背面側的相機讀取經由異向性導電膜設置於電路基板之表面或電子零件之安裝面的對準標記,對準的精度變低之虞。其原因在於經高密度填充之導電性粒子於膜之一部分發生凝聚等,而於對準標記之識別引起差錯,因此,通常對準標記以避開貼附異向性導電膜之部位的方式設置。如此,於將電路基板側之對準標記形成於異向性導電膜的貼附位置之外的情形時,會偏離電極端子之連接位置,對於提高經微距化之電極端子間的對準精度不充分,又,若將對準標記設置於電路基板的安裝位置之外,則伴有圖案設計之限制。
又,於對準精度低之情形時,關於相對向之電極端子間的異向性連接,由於在俯視方向上產生位置偏移,故亦會產生因夾持導電性粒子導致有助於導通之電極端子的面積及導電性粒子數減少等問題。進而,藉由微距化,與鄰接之電極端子的端子間間隔亦狹小化,因此於對準精度低之情形時,亦擔憂產生與和所意圖之電極端子鄰接的電極端子之連接(短路)等問題。
因此,本發明之目的在於提供一種於使用高密度地填充有導電性粒子之異向性導電膜進行COG連接之步驟中,將對準標記設置於與貼附異向性導電膜之區域重疊的位置,並且使用藉由相機之拍攝圖像高精度地進行對準之對準方法、電子零件之連接方法、連接體之製造方法、連接體、異向性導電膜。
為了解決上述課題,本發明之對準方法於設置有基板側對準標記之透明基板的表面,經由含有導電性粒子之接著劑搭載設置有零件側對準標記之電子零件,自上述透明基板之背面側拍攝上述基板側對準標記及上述零件側對準標記,並根據上述拍攝之圖像調整上述基板側對準標記及上述零件側對準標記的位置,從而使相對於上述透明基板之上述電子零件的搭載位置對準;關於上述接著劑,於俯視下,上述導電性粒子規則地排列,於上述所拍攝之圖像中,沿著上述基板側對準標記或上述零件側對準標記之外側緣的假想線段,自上述導電性粒子間看到的上述基板側對準標記或上述零件側對準標記之外側緣以線段的形式間斷地表示。
又,本發明之電子零件之連接方法於設置有基板側對準標記之透明基板的表面,經由含有導電性粒子之接著劑搭載設置有零件側對準標記之電子零件,自上述透明基板之背面側拍攝上述基板側對準標記及上述零件側對準標記,並根據上述所拍攝之圖像調整上述基板側對準標記及上述零件側對準標記之位置,從而使相對於上述透明基板之上述電子零件的搭載位置對準,其後連接上述電子零件;關於上述接著劑,於俯視下,上述導電性粒子規則地排列,於上述所拍攝之圖像中,沿著上述基板側對準標記或上述零件側對準標記之外側緣的假想線段,自上述導電性粒子間
看到的上述基板側對準標記或上述零件側對準標記之外側緣以線段的形式間斷地表示。
又,本發明之連接體之製造方法於設置有基板側對準標記之透明基板的表面,經由含有導電性粒子之接著劑搭載設置有零件側對準標記之電子零件,自上述透明基板之背面側拍攝上述基板側對準標記及上述零件側對準標記,並根據上述所拍攝之圖像調整上述基板側對準標記及上述零件側對準標記之位置,從而使相對於上述透明基板之上述電子零件的搭載位置對準,其後於連接上述電子零件之上述透明基板上連接有上述電子零件;關於上述接著劑,於俯視下,上述導電性粒子規則地排列,於上述所拍攝之圖像中,沿著上述基板側對準標記或上述零件側對準標記之外側緣的假想線段,自上述導電性粒子間看到的上述基板側對準標記或上述零件側對準標記之外側緣以線段的形式間斷地表示。
又,本發明之連接體係藉由上述方法製造者。
又,本發明之異向性導電膜係於俯視下規則排列有導電性粒子者,每單位面積之上述導電性粒子的面積密度未達50%。
根據本發明,導電性粒子於俯視下規則地排列,故於導電性粒子重疊於假想線段上之情形時,自導電性粒子間看到的對準標記之外側緣亦以線段的形式間斷地表示。因此,可以該間斷地表示之線段為邊界,精度佳地識別對比度差或色差等,而捕捉對準標記之外側緣,於特定之圖像處理中,可於座標上高精度地特定出電子零件相對於透明基板之位置。藉此,於介隔高密度地填充有導電性粒子的接著劑拍攝對準標記之情形時,亦可精度佳地進行位置檢測。
1‧‧‧異向性導電膜
2‧‧‧剝離膜
3‧‧‧黏合劑樹脂層
4‧‧‧導電性粒子
10‧‧‧液晶顯示面板
11、12‧‧‧透明基板
12a‧‧‧緣部
13‧‧‧密封件
14‧‧‧液晶
15‧‧‧面板顯示部
16、17‧‧‧透明電極
17a‧‧‧端子部
18‧‧‧液晶驅動用IC
18a‧‧‧安裝面
19‧‧‧電極端子
20‧‧‧COG安裝部
21‧‧‧基板側對準標記
22‧‧‧IC側對準標記
30‧‧‧拍攝相機
33‧‧‧熱壓頭
圖1係作為連接體之一例表示之液晶顯示面板之剖面圖。
圖2係表示液晶驅動用IC與透明基板之對準步驟之剖面圖。
圖3係表示對準狀態下之IC側對準標記與基板側對準標記之圖。
圖4係表示異向性導電膜之剖面圖。
圖5係表示呈晶格狀規則地排列有導電性粒子之異向性導電膜之俯視圖。
圖6係表示本發明之對準方法中拍攝相機的圖像之圖。
圖7係表示使用隨機配置有導電性粒子之異向性導電膜之對準方法中拍攝相機之圖像的圖。
圖8係表示將IC晶片連接至液晶顯示面板之透明基板的步驟之剖面圖。
以下,就應用本發明之對準方法、電子零件之連接方法、連接體之製造方法、連接體、異向性導電膜,一面參照圖式一面詳細地說明。再者,本發明不僅限定於以下實施形態,於不脫離本發明之主旨的範圍內,當然可進行各種變更。又,圖式為示意性者,有各尺寸之比率等與現實者不同之情況。具體之尺寸等應參酌以下說明加以判斷。又,於圖式相互間,當然亦含有互相之尺寸關係或比率不同的部分。
[連接體:液晶顯示面板]
以下,作為使用應用本發明之對準方法而於透明基板上COG連接有電子零件之連接體,將於液晶顯示面板之玻璃基板上安裝液晶驅動用之IC晶
片作為電子零件之情形為例進行說明。該液晶顯示面板10如圖1所示,由玻璃基板等構成之兩片透明基板11、12對向配置,該等透明基板11、12藉由框狀之密封件13互相貼合。並且,液晶顯示面板10藉由將液晶14封入於被透明基板11、12圍繞之空間內,而形成面板顯示部15。
透明基板11、12係於互相對向之兩內側表面,以相互交叉之方式形成有由ITO(銦錫氧化物)等構成之條紋狀的一對透明電極16、17。並且,兩透明電極16、17藉由該等兩透明電極16、17之該交叉部位構成作為液晶顯示之最小單位的像素。
兩透明基板11、12之中,一透明基板12以其平面尺寸大於另一透明基板11之方式形成,於該形成為較大之透明基板12的緣部12a設置有供作電子零件之液晶驅動用IC18安裝的COG安裝部20。於COG安裝部20,形成有與設置於液晶驅動用IC18之IC側對準標記22重疊的基板側對準標記21。
再者,液晶驅動用IC18藉由對像素選擇性地施加液晶驅動電壓,而可使液晶之配向部分地變化,進行特定之液晶顯示。又,如圖2所示,液晶驅動用IC18係於對透明基板12之安裝面18a,形成有與透明電極17之端子部17a導通連接的電極端子19。進而,液晶驅動用IC18藉由於安裝面18a與基板側對準標記21重疊,而形成進行對透明基板12之對準的IC側對準標記22。
[對準標記]
基板側對準標記21及IC側對準標記22例如由外側標記及位置對準於該外側標記內之內側標記構成。如圖3所示,關於透明基板12,作為基板
側對準標記21,例如形成具有四角形之開口部的四角形狀之外側標記21a,關於液晶驅動用IC18,作為IC側對準標記22,形成由大小為收斂於外側標記21a之開口部的四角形構成之內側標記22a。
並且,下述對準步驟中,藉由使液晶驅動用IC18以四角形之內側標記22a收斂於外側標記21a之開口部內的方式進行移動,而將形成於透明基板12之透明電極17的端子部17a與形成於液晶驅動用IC18之安裝面18a的電極端子19之位置對準。
再者,關於基板側對準標記21及IC側對準標記22,除外側標記及內側標記以外,亦可使用藉由組合而使透明基板12與液晶驅動用IC18對準之各種標記。又,基板側對準標記21及IC側對準標記22之大小並無特別限定,例如可以100~300μm見方之尺寸形成。
又,於使基板側對準標記21及IC側對準標記22之形狀亦重疊來加以識別之方面,並無特別限制,可使用各種公知者。進而,為了高精度地進行前後左右之位置對準,基板側對準標記21及IC側對準標記22亦可分別為複數個。該複數個對準標記亦可不為同一形狀。其原因在於:不同形狀容易清楚辨別。進而又,基板側對準標記21及IC側對準標記22亦可藉由附著色調而提高視認性。
於COG安裝部20,形成有透明電極17之端子部17a。於端子部17a上,使用異向性導電膜1作為電路連接用接著劑而連接液晶驅動用IC18。異向性導電膜1含有導電性粒子4,其係將液晶驅動用IC18之電極端子19與形成於透明基板12之緣部12a的透明電極17之端子部17a經由導電性粒子4電性連接者。關於該異向性導電膜1,藉由利用熱壓頭33進
行熱壓接,黏合劑樹脂流動化,導電性粒子4於端子部17a與液晶驅動用IC18之電極端子19之間被壓碎,黏合劑樹脂於該狀態下硬化。藉此,異向性導電膜1將透明基板12及液晶驅動用IC18電性、機械連接。
又,於兩透明電極16、17上形成特定之已實施摩擦處理之配向膜24,而液晶分子之初期配向受該配向膜24之限制。進而,於兩透明基板11、12之外側,配設一對偏光板25、26,而自背光裝置等光源(未圖示)之透射光的振動方向受該等兩偏光板25、26之限制。
[異向性導電膜]
其次,就異向性導電膜1進行說明。如圖4所示,異向性導電膜(ACF,Anisotropic Conductive Film)1通常於成為基材之剝離膜2上形成有含導電性粒子4之黏合劑樹脂層(接著劑層)3。異向性導電膜1為熱硬化型或紫外線等光硬化型之接著劑,貼附在形成於液晶顯示面板10之透明基板12的透明電極17上並且搭載液晶驅動用IC18,利用熱壓頭33進行熱加壓,藉此使其流動化,導電性粒子4於相對向之透明電極17之端子部17a與液晶驅動用IC18之電極端子19間被壓碎,藉由加熱或紫外線照射而以導電性粒子被壓碎之狀態下進行硬化。藉此,異向性導電膜1可將透明基板12與液晶驅動用IC18連接而導通。
又,關於異向性導電膜1,導電性粒子4以特定之圖案規則地排列於含有膜形成樹脂、熱硬化性樹脂、潛伏性硬化劑、矽烷偶合劑等通常之黏合劑樹脂層3。
支持黏合劑樹脂層3之剝離膜2例如於PET(Poly Ethylene Terephthalate,聚對苯二甲酸乙二酯)、OPP(Oriented Polypropylene,有向聚
丙烯)、PMP(Poly-4-methylpentene-1,聚-4-甲基戊烯-l)、PTFE(Polytetrafluoroethylene,聚四氟乙烯)等塗佈聚矽氧等剝離劑而成,防止異向性導電膜1之乾燥,並且維持異向性導電膜1之形狀。
作為黏合劑樹脂層3所含有之膜形成樹脂,較佳為平均分子量10000~80000左右之樹脂。作為膜形成樹脂,可列舉環氧樹脂、變性環氧樹脂、胺基甲酸酯樹脂、苯氧基樹脂等各種樹脂。其中,就膜形成狀態、連接可靠性等觀點而言,尤佳為苯氧基樹脂。
作為熱硬化性樹脂,並無特別限定,例如可列舉市售之環氧樹脂、丙烯酸樹脂等。
作為環氧樹脂,並無特別限定,例如可列舉:萘型環氧樹脂、聯苯型環氧樹脂、酚系酚醛清漆型環氧樹脂、雙酚型環氧樹脂、茋型環氧樹脂、三苯酚甲烷型環氧樹脂、苯酚芳烷基型環氧樹脂、萘酚型環氧樹脂、二環戊二烯型環氧樹脂、三苯甲烷型環氧樹脂等。該等可為單獨,亦可為2種以上之組合。
作為丙烯酸樹脂,並無特別限制,可根據目的適當選擇丙烯酸化合物、液狀丙烯酸酯等。例如可列舉:丙烯酸甲酯、丙烯酸乙酯、丙烯酸異丙酯、丙烯酸異丁酯、環氧丙烯酸酯、乙二醇二丙烯酸酯、二乙二醇二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、二羥甲基三環癸烷二丙烯酸酯、1,4-丁二醇四丙烯酸酯(tetramethylene glycol tetra acrylate)、2-羥基-1,3-二丙烯醯氧基丙烷、2,2-雙[4-(丙烯醯氧基甲氧基)苯基]丙烷、2,2-雙[4-(丙烯醯氧基乙氧基)苯基]丙烷、二環戊烯基丙烯酸酯、丙烯酸三環癸酯、異氰尿酸三(丙烯醯氧基乙基)酯、丙烯酸胺基甲酸酯、等。再者,亦可使用將丙烯酸酯設
為甲基丙烯酸酯者。該等可單獨使用1種,亦可併用2種以上。
作為潛伏性硬化劑,並無特別限定,例如可列舉加熱硬化型、UV硬化型等各種硬化劑。潛伏性硬化劑通常不發生反應,藉由熱、光、加壓等根據用途選擇之各種觸發而活性化,從而開始反應。熱活性型潛伏性硬化劑之活性化方法存在:藉由利用加熱之解離反應等產生活性種(陽離子或陰離子、自由基)之方法;於室溫附近穩定地分散於環氧樹脂中,於高溫下與環氧樹脂相溶、溶解而開始硬化反應之方法;使分子篩封入型之硬化劑於高溫下溶出而開始硬化反應之方法;利用微膠囊之溶出、硬化方法等。作為熱活性型潛伏性硬化劑,有咪唑系、醯肼系、三氟化硼-胺錯合物、鋶鹽、胺醯亞胺(aminimide)、聚胺鹽、雙氰胺等或該等之改質物,該等可為單獨,亦可為2種以上之混合體。其中,較佳為微膠囊型咪唑系潛伏性硬化劑。
作為矽烷偶合劑,並無特別限定,例如可列舉:環氧系、胺基系、巰基-硫化物系、脲基系等。藉由添加矽烷偶合劑,而提高於有機材料與無機材料之界面處的接著性。
[導電性粒子]
作為導電性粒子4,可列舉於異向性導電膜1中使用的公知之任意導電性粒子。作為導電性粒子4,例如可列舉:鎳、鐵、銅、鋁、錫、鉛、鉻、鈷、銀、金等各種金屬或金屬合金之粒子、金屬氧化物、於碳、石墨、玻璃、陶瓷、塑膠等粒子之表面塗佈金屬而成者,或者於該等粒子之表面進而塗佈絕緣薄膜而成者等。於為在樹脂粒子之表面塗佈金屬而成者之情形時,作為樹脂粒子,例如可列舉:環氧樹脂、酚樹脂、丙烯酸系樹脂、丙
烯腈-苯乙烯(AS)樹脂、苯胍樹脂、二乙烯苯系樹脂、苯乙烯系樹脂等粒子。
[導電性粒子之規則排列]
關於異向性導電膜1,導電性粒子4於俯視下以特定之排列圖案規則地排列,例如圖5所示,以晶格狀且均等地排列。異向性導電膜1藉由導電性粒子4於俯視下規則地排列,而即便高密度地填充導電性粒子4,亦可藉由拍攝相機30識別對準標記。導電性粒子4之均等排列圖案可任意地設定為俯視下四方晶格或六方晶格等。關於導電性粒子4,為了不阻礙視認性即透過性,可於同一層內單一地分散,就確保視認性之方面而言,較佳為導電性粒子4排列。關於對準步驟,下文中進行詳細說明。
又,異向性導電膜1藉由導電性粒子4規則地排列,而即便在高密度地填充於黏合劑樹脂層3之情形時,亦防止因導電性粒子4之凝聚而產生疏密。因此,根據異向性導電膜1,於經微距化之端子部17a或電極端子19亦可捕捉導電性粒子4,又,藉由進行鄰接之端子間距離的狹小化,亦可防止由導電性粒子4之凝聚體引起的端子間短路。
又,關於異向性導電膜1,較佳將每單位面積之導電性粒子4之面積密度設為未達50%、較佳為45%以下、更佳為40%以下、進而較佳為35%以下。其原因在於:若導電性粒子4之面積密度成為較其更高之密度,則透過率因導電性粒子4而惡化,無法確保經由異向性導電膜1之對準標記21、22的視認性。
關於此種異向性導電膜1,例如可藉由將導電性粒子4於基板上整齊排列為特定之排列圖案後,將導電性粒子4轉印至由剝離膜2支
持之黏合劑樹脂層3的方法,或者於由剝離膜2支持之黏合劑樹脂層3上經由設有根據排列圖案之開口部的排列板供給導電性粒子4等進行製造。
再者,異向性導電膜1之形狀並無特別限定,例如圖4所示,可設為可捲繞於捲取盤6之長條帶形狀,並僅切下特定之長度使用。
又,上述實施形態中,作為異向性導電膜1,以將含有導電性粒子4之熱硬化性樹脂組成物於黏合劑樹脂層3成形為膜狀所得之接著膜為例進行說明,但本發明之接著劑並不限定於此,例如可設為將僅由黏合劑樹脂3構成之絕緣性接著劑層與由含有導電性粒子4之黏合劑樹脂3構成之含導電性粒子層積層的構成。又,關於異向性導電膜1,只要導電性粒子4於俯視下規則排列,則除如圖2所示般單層排列以外,亦可為導電性粒子4跨及複數層黏合劑樹脂層3排列並且於俯視下為規則排列者。又,異向性導電膜1亦可為於多層構成之至少一層內以特定距離單一地分散者。
[連接體之製造方法]
其次,就經由異向性導電膜1而於透明基板12之透明電極17上連接有液晶驅動用IC18之連接體的製造步驟進行說明。首先,將異向性導電膜1預壓接於透明電極17上。將異向性導電膜1預壓接之方法為於透明基板12之透明電極17上,以使黏合劑樹脂層3成為透明電極17側之方式配置異向性導電膜1。
並且,將黏合劑樹脂層3配置於透明電極17上後,自剝離膜2側利用暫時貼附用之加熱推壓頭對黏合劑樹脂層3進行加熱及加壓,將加熱推壓頭自剝離膜2剝離,將剝離膜2自透明電極17上之黏合劑樹脂層3剝離,藉此僅黏合劑樹脂層3暫時貼合於透明電極17上。藉由加熱推
壓頭之預壓接係藉由一面以輕微之壓力(例如0.1MPa~2MPa左右)將剝離膜2之上表面推壓至透明電極17側一面實施加熱(例如70~100℃左右)而進行。
[對準方法]
其次,將暫時貼合有黏合劑樹脂層3之透明基板12載置於透明平台31上,以使透明基板12之透明電極17與液晶驅動用IC18之電極端子19介隔黏合劑樹脂層3而對向的方式,進行透明基板12與液晶驅動用IC18之對準。
對準藉由利用設置於透明基板12之背面側的拍攝相機30,拍攝分別設置於透明基板12及液晶驅動用IC18之安裝面18a的對準標記21、22,基於所拍攝之圖像檢測位置,並基於檢測結果移動液晶驅動用IC18而進行。各對準標記21、22事先被登記,藉由灰度查找或二值法等圖像處理,可使所拍攝之圖像與登記圖像匹配,藉此加以識別,從而獲取位置資訊。
基板側對準標記21介隔載置透明基板12之透明平台31及透明基板12而拍攝,IC側對準標記22介隔透明平台、透明基板12及高密度地排列有導電性粒子4之黏合劑樹脂層3而拍攝。為了高精度地進行對準,必須高精度地檢測出各對準標記21、22之位置,因此,必須可於拍攝圖像中識別出各對準標記21、22之邊界即外側緣。若拍攝對準標記21、22,則以外側緣為邊界,於對準標記側及未設置對準標記之側產生對比度差,故可以該對比度差為基礎檢測出對準標記之位置,即液晶驅動用IC18相對於透明基板12之位置。
本發明之對準步驟中,如圖6所示,藉由拍攝相機30拍攝
之基板側對準標記21及IC側對準標記22於拍攝圖像中,沿著構成其外側緣之假想線段,自導電性粒子4間看到的基板側對準標記21或IC側對準標記22之外側緣以線段S的形式間斷地表示。又,如上所述,關於異向性導電膜1,藉由將規則地排列之導電性粒子4的每單位面積之面積密度設為未達50%,而確保異向性導電膜1之透過率,從而確保對準標記21、22之視認性。
再者,於該情形時之每個導電粒子的單位面積較佳為0.7~1300μm2,更佳為1.8~750μm2,進而較佳為4.2~350μm2。
導電粒子之個數密度較佳為50~450000個/mm2,更佳為300~300000個/mm2,進而更佳為500~120000個/mm2。
關於該情形時之單位面積,就為可充分視認對準標記之範圍而言,較佳為0.7mm×0.7mm或大致相同之面積,更佳為1mm×1mm,進而更佳為2mm×2mm或者大致相同之面積。
所謂構成各對準標記21、22之外側緣的假想線段,為出現在形成有對準標記21、22之部位與未形成對準標記21、22之對準標記21、22間的由對比度差所產生之構成對準標記21、22的外側緣之線段。於拍攝圖像中,若高密度地排列之導電性粒子4重疊於假想線段上,則藉由該導電性粒子4之輪廓亦可形成對比度之差,故無法捕捉到連接對準標記21、22之外側緣的線,僅利用假想線段無法檢測出正確之位置。尤其如圖7所示,於使用導電性粒子4隨機地分散於黏合劑樹脂層3之異向性導電膜1之情形時,亦有導電性粒子4發生部分凝聚之情形,於該粒子凝聚體重疊於對準標記21、22之外側緣之情形時,亦難以識別假想線段。
關於該方面,本發明之對準步驟中,如上所述般導電性粒子4於俯視下規則地排列,故於導電性粒子4重疊於假想線段上之情形時,自導電性粒子4間看到的基板側對準標記21或IC側對準標記22之外側緣亦以線段S之形式間斷地表示。
其表示:於兩對準標記21、22之拍攝時的解析度下,由於導電性粒子4不發生凝聚,故可進行視認,換言之,可一面透過異向性導電膜1一面視認IC側對準標記22。即,於可視認兩對準標記21、22之倍率下,在較兩對準標記21、22更宏觀之狀態下,於整個面確保異向性導電膜1之導電性粒子4進行排列等而散佈之狀態。
藉此,於本發明之對準步驟中,可以間斷地表示之線段S為邊界,識別對比度差,捕捉基板側對準標記21或IC側對準標記22之外側緣,於灰度查找或二值法等特定之圖像處理中,可於座標上高精度地特定出液晶驅動用IC相對於透明基板12之位置。其後,參照透明基板12之透明電極17與液晶驅動用IC18之電極端子19相對向的座標資料,調整液晶驅動用IC18相對於透明基板12之位置。
藉此,於介隔異向性導電膜1拍攝IC側對準標記22之情形時,亦可精度佳地檢測出液晶驅動用IC之位置。又,可將基板側對準標記21設置於與IC側對準標記22大致重疊之位置,而以兩對準標記21、22成為特定之位置關係的方式進行對準。因此,可高精度地進行經狹小化、微距化之透明電極17的端子部17a與液晶驅動用IC之電極端子19的位置對準。
再者,自導電性粒子4之間看到的的對準標記21、22之外
側緣的線段S若被間斷地表示,則亦可分別不為相同長度。又,拍攝兩對準標記之拍攝相機30可使用CCD等固體拍攝元件。於拍攝相機30之解析度為與導電性粒子4之平均粒徑同等以下之情形時,即便在導電性粒子4重疊於對準標記21、22之外側緣之情形時,亦可捕捉自其間看到的外側緣的線段。再者,於拍攝相機30之解析度為與導電性粒子4的平均粒徑同等以上之情形時,由於導電性粒子4進行排列,故無法於面視野識別導電性粒子4,不會對獲得用以識別對準標記21、22所需之解像度造成影響。
藉由利用該解析度檢測出對準標記21、22,根據本發明之對準步驟,亦可使對準標記21、22極小化至數十μm級之尺寸,亦可減小透明基板12或液晶驅動用IC18之各電極圖案設計受對準標記的制約,從而提高電極圖案之設計自由度。
[自導電性粒子間看到的線段長度]
此處,於拍攝相機30之拍攝圖像中,自導電性粒子4之間看到的的對準標記21、22之外側緣的線段S成為數十~數百μm左右。又,自導電性粒子4間看到的兩對準標記21、22的外側緣之線段S具有可作為線段識別之長度,若具有合計為拍攝圖像中之假想線段的長度之25%以上、較佳為33%以上之長度,則可作為對準標記21、22之外側緣而捕捉。其原因在於:由於導電性粒子4被排列,故間斷之線段位於其延長線上,藉此可實質地識別為線。即便於同一層內,即同一平面內以特定距離單一地存在導電性粒子4,亦引起同樣效果,排列之導電性粒子4可預測到上述識別,故具有於軟體操作上之處理變得容易的有利效果。並且,藉由使用該拍攝圖像進行特定之圖像處理,可於座標上高精度地特定出液晶驅動用IC相對於透明
基板12之位置。
[導電性粒子間區域大於50%/導電性粒子之面積佔有率未達50%]
又,關於拍攝相機30之拍攝圖像,較佳導電性粒子4間之區域成為大於50%,較佳為55%以上,更佳為60%以上,進而較佳為65%以上,即,導電性粒子4之面積佔有率成為未達50%,較佳為45%以下,更佳為40%以下,進而較佳為35%以下。若導電性粒子4以較其以上之更高密度地排列,則於拍攝相機30之拍攝圖像中,難以將自導電性粒子4間看到的線段S為邊界識別對比度之差而作為對準標記21、22之外側緣捕捉,無法高精度地進行位置檢測。
[正式壓接步驟]
對準步驟之後,藉由加熱至使黏合劑樹脂層3硬化之特定的溫度之熱壓頭33,以特定之壓力、時間自液晶驅動用IC18上方進行熱加壓。藉此,異向性導電膜1之黏合劑樹脂顯示流動性,自液晶驅動用IC18之電極端子19與透明基板12之端子部17a間流出,並且黏合劑樹脂層3中之導電性粒子4夾持於電極端子19及端子部17a間而被壓碎。
其結果,所謂液晶驅動用IC18之電極端子19及透明基板12之端子部17a,經由導電性粒子4電性連接,於該狀態下藉由壓接工具使所加熱之黏合劑樹脂3硬化。不在電極端子19及端子部17a間之導電性粒子4分散於黏合劑樹脂,維持電性絕緣之狀態。藉此,僅於電極端子19與端子部17a之間實現電性導通。
再者,藉由使用自由基聚合反應體系之速硬化型者作為黏合
劑樹脂,藉由短加熱時間亦可使黏合劑樹脂速硬化。又,作為異向性導電膜1,不限定於熱硬化型,只要為進行加壓連接者,則亦可使用光硬化型或光熱併用型之接著劑。
[實施例]
其次,就本發明之實施例加以說明。本實施例中,使用規則排列有導電性粒子之異向性導電膜及隨機地分散有導電性粒子之異向性導電膜,而製作於評價用玻璃基板連接有評價用IC之連接體樣品,並對電極間之位置偏移及原本連接之端子與鄰接之端子的短路發生率進行測定。
[異向性導電膜]
關於用於評價用IC之連接的異向性導電膜之黏合劑樹脂層,製備將苯氧基樹脂(商品名YP50,新日鐵住金化學公司製造)60質量份、環氧樹脂(商品名jER828,三菱化學公司製造)40質量份、硬化劑(商品名SI-60L,三新化學工業公司製造)2質量份添加於溶劑而成之黏合劑樹脂組成物,將該黏合劑樹脂組成物塗佈於剝離膜上並進行焙燒。實施例1~3、比較例1、2中,將導電性粒子(商品名AUL704,積水化學工業公司製造)以成為特定之面積佔有率的方式呈晶格狀規則地排列後,將其轉印於由剝離膜支持之黏合劑樹脂層,藉此,獲得規則排列有導電性粒子之異向性導電膜(參照圖5)。又,比較例3中,使導電性粒子分散於黏合劑樹脂組成物,並塗佈於剝離膜上進行焙燒,藉此,獲得隨機地分散有導電性粒子之異向性導電膜。
[評價用IC]
作為評價元件,使用外形:1.5mm×13mm、厚度0.5mm、凸塊:25μm×140
μm、凸塊間間隔:7.5μm、凸塊高度:15μm(鍍Au)之評價用IC。
[評價用玻璃基板]
作為連接評價用IC之評價用玻璃基板,使用外形:30mm×50mm、厚度0.5mm、形成有與評價用IC之凸塊相同尺寸相同間距的梳齒狀之電極圖案的ITO圖案玻璃。
將異向性導電膜暫時貼附於該評價用玻璃基板後,一面使評價用IC之凸塊與評價用玻璃基板之配線電極對準,一面搭載評價用IC,藉由熱壓頭以180℃、80MPa、5sec之條件進行熱壓接,藉此製成連接體樣品。對各連接體樣品測定電極間之位置偏移及原本連接之端子與鄰接之端子的短路發生率。關於電極間之位置偏移,測定與形成為同尺寸之評價用IC的凸塊及評價用玻璃基板之電極間的偏移量。又,關於與鄰接端子之短路產生率,於評價用IC之全部凸塊與評價用玻璃基板之全部電極端子間,測定與鄰接端子之短路的發生率。
[實施例1]
實施例1中,使用以面積佔有率成為1%之方式規則排列有導電性粒子之異向性導電膜。又,實施例1中,設置於評價用IC之安裝面的IC側對準標記及設置於評價用玻璃基板之基板側對準標記形成於俯視下大致相同位置。
[實施例2]
實施例2中,使用以面積佔有率成為15%的方式規則排列有導電性粒子之異向性導電膜,除此以外,設為與實施例1相同條件。
[實施例3]
實施例3中,使用以面積佔有率成為35%的方式規則排列有導電性粒子之異向性導電膜,除此以外,設為與實施例1相同之條件。
[比較例1]
比較例1中,將基板側對準標記設置於遠離異向性導電膜之轉接著區域外的IC側對準標記之位置,除此以外,設為與實施例2相同之條件。
[比較例2]
比較例2中,使用以面積佔有率成為50%的方式規則排列有導電性粒子之異向性導電膜,除此以外,設為與實施例1相同之條件。
[比較例3]
比較例3中,使用以面積佔有率成為35%的方式隨機地分散有導電性粒子之異向性導電膜,除此以外,設為與實施例1相同之條件。
如表1所示,實施例1~3中,位置偏移均收斂於1~1.3μm,可精度佳地對準。其原因在於:實施例1~3中,使用以俯視下面積佔有率成為35%以下之方式規則排列有導電性粒子之異向性導電膜,故於介隔異向性導電膜拍攝對準標記,導電性粒子重疊於對準標記的外側緣之情形時,對準標記之外側緣的線段亦自導電性粒子之間露出,以該線段為邊界,捕捉對比度差,藉此可精度佳地檢測出對準標記之位置。
又,實施例1~3中,電極端子間之短路發生率亦低,為30ppm或70ppm。可認為其伴隨對準精度之提高,評價用IC之凸塊與評價用玻璃基板之配線電極之側緣部的偏移最小化,變得不易產生位於該區域之導電性粒子與位於凸塊間間隔之導電性粒子之不必要接觸,藉此抑制產生與鄰接端子之短路。即,若於對向之凸塊及配線電極間之對向位置產生偏移,則與原本連接之凸塊及端子鄰接之凸塊及端子的距離變短。於該情形時,擔憂產生因鄰接(傾斜)之凸塊及配線電極間的導電粒子所致之導通、即短路,但類推於實施例1~3中,伴隨對準精度之提高,原本連接之凸塊及配線電極間的偏移最小化,藉此,變得不易產生此種現象。
另一方面,比較例1中,由於將基板側對準標記設置於異向性導電膜之貼附區域外,故基板側對準標記與IC側對準標記分離,對準精度惡化。因此,評價用IC之凸塊與評價用玻璃基板之電極的位置偏移變大為4μm。又,伴隨對準偏移,與鄰接之電極端子之短路發生率增加為500ppm。
又,比較例2中,將導電性粒子之面積佔有率設為50%,故無法利用相機捕捉對準標記之外側緣,對準精度惡化。因此,評價用IC之凸塊與評價用玻璃基板之電極的位置偏移變大為4μm。又,伴隨對準偏移,與鄰接之電極端子的短路發生率增加為500ppm。
又,比較例3中,將導電性粒子隨機分散,故產生導電性粒子之凝聚體,導致對準標記之外側緣的視認性受損,對準精度惡化。因此,評價用IC之凸塊與評價用玻璃基板之電極的位置偏移變大為3μm。又,伴隨對準偏移,與鄰接之電極端子的短路發生率增加為400ppm。
Claims (11)
- 一種對準方法,於設置有基板側對準標記之透明基板的表面,經由含有導電性粒子之接著劑搭載設置有零件側對準標記之電子零件,自該透明基板之背面側拍攝該基板側對準標記及該零件側對準標記,根據該拍攝之圖像調整該基板側對準標記及該零件側對準標記之位置,從而使該相對於該透明基板之該電子零件的搭載位置對準;關於該接著劑,於俯視下,該導電性粒子規則地排列,於該所拍攝之圖像中,沿著該基板側對準標記或該零件側對準標記之外側緣的假想線段,自該導電性粒子間看到的該基板側對準標記或該零件側對準標記之外側緣以線段的形式間斷地表示。
- 如申請專利範圍第1項之對準方法,其中,沿著該假想線段,自該導電性粒子間看到的該線段以該假想線段之25%以上的長度表示。
- 如申請專利範圍第1或2項之對準方法,其中,於該所拍攝之圖像中,該接著劑之該導電性粒子間區域為65%以上。
- 如申請專利範圍第1或2項之對準方法,其中,於該所拍攝之圖像中,該導電性粒子之面積佔有率為35%以內。
- 如申請專利範圍第1或2項之對準方法,其中,拍攝該基板側對準標記及該零件側對準標記之拍攝相機的解析度為該導電性粒子之平均粒徑以下。
- 如申請專利範圍第3項之對準方法,其中,拍攝該基板側對準標記及該零件側對準標記之拍攝相機的解析度為該導電性粒子之平均粒徑以 下。
- 如申請專利範圍第1或2項之對準方法,其中,該基板側對準標記形成於設置該接著劑之位置。
- 一種電子零件之連接方法,於設置有基板側對準標記之透明基板的表面,經由含有導電性粒子之接著劑搭載設置有零件側對準標記之電子零件,自該透明基板之背面側拍攝該基板側對準標記及該零件側對準標記,根據該所拍攝之圖像調整該基板側對準標記及該零件側對準標記之位置,從而使該電子零件相對於該透明基板之該電子零件的搭載位置對準,其後連接該電子零件;關於該接著劑,於俯視下,該導電性粒子規則地排列,於該所拍攝之圖像中,沿著該基板側對準標記或該零件側對準標記之外側緣的假想線段,自該導電性粒子間看到的該基板側對準標記或該零件側對準標記之外側緣以線段的形式間斷地表示。
- 一種連接體之製造方法,於設置有基板側對準標記之透明基板的表面,經由含有導電性粒子之接著劑搭載設置有零件側對準標記之電子零件,自該透明基板之背面側拍攝該基板側對準標記及該零件側對準標記,根據該所拍攝之圖像調整該基板側對準標記及該零件側對準標記之位置,從而使該相對於該透明基板之該電子零件的搭載位置對準,其 後於連接該電子零件之該透明基板上連接有該電子零件;關於該接著劑,於俯視下,該導電性粒子規則地排列,於該所拍攝之圖像中,沿著該基板側對準標記或該零件側對準標記之外側緣的假想線段,自該導電性粒子間看到的該基板側對準標記或該零件側對準標記之外側緣以線段的形式間斷地表示。
- 一種連接體,藉由申請專利範圍第9項之方法製造。
- 一種異向性導電膜,於俯視下規則排列有導電性粒子,每單位面積之該導電性粒子的面積密度未達50%。
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JP6726070B2 (ja) * | 2016-09-28 | 2020-07-22 | エルジー ディスプレイ カンパニー リミテッド | 電子部品の実装方法、電子部品の接合構造、基板装置、ディスプレイ装置、ディスプレイシステム |
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JP2005026577A (ja) | 2003-07-04 | 2005-01-27 | Matsushita Electric Ind Co Ltd | 電子部品の実装方法 |
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JP2008101962A (ja) * | 2006-10-18 | 2008-05-01 | Toray Ind Inc | アライメントマークの認識方法 |
TWI328123B (en) * | 2007-06-12 | 2010-08-01 | Au Optronics Corp | Method and device for inspecting a misalignment of an electronic element |
JP4880533B2 (ja) * | 2007-07-03 | 2012-02-22 | ソニーケミカル&インフォメーションデバイス株式会社 | 異方性導電膜及びその製造方法、並びに接合体 |
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TWI764175B (zh) * | 2019-06-26 | 2022-05-11 | 日商日本顯示器股份有限公司 | 異向性導電膜及顯示裝置 |
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CN105940486A (zh) | 2016-09-14 |
US20160351532A1 (en) | 2016-12-01 |
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