TW201533157A - 樹脂組成物、硬化膜及其製造方法、圖案硬化膜及其製造方法、以及電子零件 - Google Patents
樹脂組成物、硬化膜及其製造方法、圖案硬化膜及其製造方法、以及電子零件 Download PDFInfo
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- TW201533157A TW201533157A TW104103820A TW104103820A TW201533157A TW 201533157 A TW201533157 A TW 201533157A TW 104103820 A TW104103820 A TW 104103820A TW 104103820 A TW104103820 A TW 104103820A TW 201533157 A TW201533157 A TW 201533157A
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C—CHEMISTRY; METALLURGY
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- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
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- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
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CN112799281A (zh) * | 2015-08-21 | 2021-05-14 | 旭化成株式会社 | 感光性树脂组合物、聚酰亚胺的制造方法及半导体装置 |
JP6917187B2 (ja) * | 2016-05-10 | 2021-08-11 | 住友化学株式会社 | 光学フィルム、及びこれを用いたフレキシブルデバイス |
TW202212423A (zh) * | 2020-06-05 | 2022-04-01 | 日商富士軟片股份有限公司 | 樹脂組成物及其製造方法以及圖案形成用組成物的製造方法 |
WO2024070713A1 (ja) * | 2022-09-30 | 2024-04-04 | 富士フイルム株式会社 | 樹脂組成物、絶縁膜、及び再配線層用層間絶縁膜の製造方法 |
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JPH05216224A (ja) * | 1992-02-04 | 1993-08-27 | Chisso Corp | 感光性樹脂組成物 |
JP3785012B2 (ja) * | 1999-03-24 | 2006-06-14 | 富士通株式会社 | 感光性高誘電体組成物、その組成物からなる感光性高誘電体膜のパターン形成方法、及びその組成物を用いて製造したコンデンサ内蔵型多層回路基板 |
CN1980984B (zh) | 2004-07-16 | 2010-06-09 | 旭化成电子材料株式会社 | 聚酰胺 |
JP4789657B2 (ja) * | 2006-03-13 | 2011-10-12 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物 |
JP5212103B2 (ja) * | 2007-03-30 | 2013-06-19 | 東レ株式会社 | ポジ型感光性樹脂組成物 |
JP2009251451A (ja) * | 2008-04-09 | 2009-10-29 | Hitachi Chem Co Ltd | 感光性樹脂組成物及び感光性エレメント |
US9267004B2 (en) * | 2008-07-22 | 2016-02-23 | Kaneka Corporation | Polyimide precursor composition and use thereof |
JP5577659B2 (ja) * | 2008-09-18 | 2014-08-27 | 東レ株式会社 | 感光性黒色樹脂組成物、樹脂ブラックマトリクス基板、カラーフィルター基板および液晶表示装置 |
KR101443293B1 (ko) * | 2009-10-15 | 2014-09-19 | 주식회사 엘지화학 | 알칼리 수용액으로 현상 가능한 감광성 수지 조성물 및 이에 의해 제조된 드라이 필름 |
JP2011116848A (ja) * | 2009-12-02 | 2011-06-16 | Kaneka Corp | 新規なポリイミド前駆体組成物及びその利用 |
JP2011126922A (ja) * | 2009-12-15 | 2011-06-30 | Kaneka Corp | 新規な樹脂組成物及びその利用 |
JP5577728B2 (ja) * | 2010-02-12 | 2014-08-27 | 日立化成デュポンマイクロシステムズ株式会社 | 感光性樹脂組成物及びこれを用いた回路形成用基板 |
JP5994782B2 (ja) * | 2011-08-30 | 2016-09-21 | 旭硝子株式会社 | ネガ型感光性樹脂組成物、隔壁、ブラックマトリックスおよび光学素子 |
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