TW201322853A

TW201322853A - Device and method for producing substrate

Info

Publication number: TW201322853A
Application number: TW101126823A
Authority: TW
Inventors: Yasuhito Nakamori; Keiji Iso; Yuji Okamoto
Original assignee: Sumitomo Heavy Industries
Priority date: 2011-07-27
Filing date: 2012-07-25
Publication date: 2013-06-01
Also published as: TWI458408B; KR20140024953A; KR20180033598A; CN110099513A; JP5714110B2; CN103718661A; CN110099513B; KR102061315B1; KR20160044587A; JPWO2013015157A1; WO2013015157A1

Abstract

The present invention provides a device and method for producing substrate. In a first coating station, one surface of a substrate is coated with a liquid thin-film material, the thin-film material coated on the substrate is irradiated with light, and the surface-layer section of the thin-film material hardens. The substrate coated with the thin-film material in the first coating station is conveyed into a reversal station. In the reversal station, the thin-film material coated on the substrate is irradiated with light and hardens through to the interior of the thin-film material, and the front/rear orientation of the substrate is reversed. A conveying device conveys the substrate between the first coating station and the reversal station. A control device controls the first coating station, the reversal station and the conveying device. The control device controls the conveying device, and conveys the substrate treated in the first coating station to the reversal station.

Description

基板製造裝置及基板製造方法 Substrate manufacturing apparatus and substrate manufacturing method

本發明係有關一種吐出薄膜材料的液滴來在底層基板上形成薄膜之基板製造裝置。 The present invention relates to a substrate manufacturing apparatus for discharging droplets of a film material to form a thin film on a substrate.

已知有在印刷配線板等底層基板的表面，從噴嘴孔吐出薄膜圖案形成用材料(薄膜材料)的液滴來在底層基板上形成薄膜圖案之技術。薄膜圖案例如為阻焊抗蝕劑的圖案。 A technique of forming a thin film pattern on a base substrate by discharging droplets of a material for forming a thin film pattern (film material) from a nozzle hole on the surface of a base substrate such as a printed wiring board is known. The thin film pattern is, for example, a pattern of a solder resist.

公開有以電腦圖形的圖像資訊為基礎，在基板上直接噴吹液狀樹脂來進行圖案形成之液狀樹脂噴射裝置(例如參閱專利文獻1)。能夠藉由專利文獻1中記載之液狀樹脂噴射裝置輕鬆地形成薄膜圖案。並且，與以光刻蝕法進行圖案形成之情況相比，能夠實現程式的短時間化及生產成本的削減。 A liquid resin ejection device that directly injects a liquid resin onto a substrate and performs pattern formation based on image information of a computer graphic is disclosed (for example, see Patent Document 1). The thin film pattern can be easily formed by the liquid resin ejection device described in Patent Document 1. Further, compared with the case of pattern formation by photolithography, it is possible to shorten the time of the program and reduce the production cost.

(先前技術文獻) (previous technical literature) (專利文獻) (Patent Literature)

專利文獻1：日本專利第3544543號公報 Patent Document 1: Japanese Patent No. 3544543

期待能夠在底層基板的兩面更簡便地形成薄膜圖案之技術。本發明的目的為提供一種能夠以簡單的結構在底層基板的兩面形成薄膜圖案之基板製造裝置。 It is expected that a thin film pattern can be formed more easily on both sides of the underlying substrate. technology. An object of the present invention is to provide a substrate manufacturing apparatus capable of forming a thin film pattern on both surfaces of a base substrate with a simple structure.

依本發明的一觀點，提供一種基板製造裝置，其具有：第1塗佈站，在底層基板的單面塗佈液狀薄膜材料並對塗佈於前述底層基板之薄膜材料照射光來使薄膜材料的表層部固化；反轉站，被搬入在前述第1塗佈站被塗佈薄膜材料之底層基板，對塗佈於底層基板之薄膜材料照射光來使薄膜材料固化至其內部，並且使前述底層基板的背面和表面反轉；搬送裝置，在前述第1塗佈站與前述反轉站之間搬送底層基板；及控制裝置，控制前述第1塗佈站、前述反轉站及前述搬送裝置，前述控制裝置控制前述搬送裝置來將在前述第1塗佈站經處理之底層基板搬送到前述反轉站。 According to one aspect of the invention, there is provided a substrate manufacturing apparatus comprising: a first coating station, a liquid film material is applied to one surface of a base substrate, and a film material coated on the underlying substrate is irradiated with light to form a film The surface layer portion of the material is cured; the inversion station is carried into the underlying substrate on which the film material is applied in the first coating station, and the film material applied to the underlying substrate is irradiated with light to cure the film material to the inside thereof, and The back surface and the surface of the underlying substrate are reversed; the transfer device transports the underlying substrate between the first coating station and the reversing station; and the control device controls the first coating station, the reversing station, and the transfer In the device, the control device controls the transfer device to transport the underlying substrate processed at the first coating station to the inversion station.

依本發明的另一觀點，提供一種基板製造方法，其具有：將底層基板搬入第1塗佈站，在前述第1塗佈站中在前述底層基板的第1面塗佈液狀薄膜材料並使塗佈於前述底層基板之薄膜材料的表層部固化之製程；從前述第1塗佈站取出前述底層基板並搬入正式固化部，在前述正式固化部中使塗佈於前述底層基板的前述第1面之薄膜材料固化至其內部之製程，將前述底層基板從前述正式固化部搬送至反轉部，在前述反轉部中使前述底層基板的背面和表面反轉之製程；從前述反轉部取出前述底層基板，在前述底層基板的上下反轉之狀態下，將前述底層基板搬送至前述第1塗佈站，在前述第1塗佈站中在前述底層基板的第1面的相反側的第2面塗佈液狀薄膜材料，並使塗布於前述底層基板的前述第2面之薄膜材料的表層部固化之製程；及將前述底層基板從前述第1塗佈站搬送至前述正式固化部，在前述正式固化部中使塗佈於前述底層基板的前述第2面之薄膜材料固化至其內部之製程。 According to another aspect of the present invention, a substrate manufacturing method includes: carrying a substrate into a first coating station, and applying a liquid film material to a first surface of the underlying substrate in the first coating station; a process for curing a surface layer portion of a film material coated on the underlying substrate; Removing the underlying substrate from the first coating station and carrying it into the main curing portion, and curing the film material applied to the first surface of the underlying substrate to the inside of the main curing portion, and the underlying substrate is removed from the substrate The main solidified portion is transported to the inverting portion, and the back surface and the surface of the underlying substrate are reversed in the inverting portion; the underlying substrate is taken out from the inverting portion, and the underlying substrate is vertically inverted. The substrate is transferred to the first coating station, and a liquid film material is applied to the second surface on the opposite side of the first surface of the underlying substrate in the first coating station, and is applied to the underlayer. a process of curing the surface layer portion of the film material of the second surface of the substrate; and transporting the underlayer substrate from the first coating station to the main curing portion, and applying the coating layer to the underlying substrate in the main curing portion The film material of the second side is cured to its internal process.

使單面上形成有薄膜圖案之底層基板的背面和表面在反轉站反轉，藉此能夠在另一方的面輕鬆地形成薄膜圖案。 The back surface and the surface of the underlying substrate on which the thin film pattern is formed on one surface are reversed at the inversion station, whereby the thin film pattern can be easily formed on the other surface.

[實施例1] [Example 1]

第1圖中示出基於實施例1之基板製造裝置的概要圖。基於實施例1之基板製造裝置包括配置於筐體18內部之定位站2、塗佈站3、反轉站4、定位站5、塗佈站 6、紫外線照射裝置8、紫外線照射裝置9及提昇器11~14。基板製造裝置的筐體18上設置有基板的搬出入口1及搬出入口7。基於實施例1之基板製造裝置用於在例如作為矩形狀的印刷配線板之底層基板21~27的兩面(第1面和第2面)形成阻焊抗蝕劑的薄膜圖案。在本說明書中，有時將未形成有薄膜圖案之底層基板簡稱為“基板”。 Fig. 1 is a schematic view showing a substrate manufacturing apparatus according to the first embodiment. The substrate manufacturing apparatus according to the first embodiment includes a positioning station 2 disposed inside the casing 18, a coating station 3, a reversing station 4, a positioning station 5, and a coating station. 6. Ultraviolet irradiation device 8, ultraviolet irradiation device 9, and lifters 11 to 14. The housing 18 of the substrate manufacturing apparatus is provided with a loading/unloading port 1 and a loading/unloading port 7 of the substrate. The substrate manufacturing apparatus according to the first embodiment is used to form a thin film pattern of a solder resist on both surfaces (first surface and second surface) of the underlying substrates 21 to 27 which are rectangular printed wiring boards. In the present specification, an underlying substrate in which a thin film pattern is not formed may be simply referred to as a "substrate".

基板製造裝置包括傳送帶15、傳送帶16及控制裝置20。傳送帶15從筐體18的外部向內部搬入基板21~27。提昇器11~14在筐體18內的站之間搬送基板21~27。傳送帶16從筐體18的內部向外部搬出基板21~27。基於實施例1之基板製造裝置通常運轉時，從基板搬出入口1搬入基板，從基板搬出入口7搬出基板。筐體18內的各裝置的動作及傳送帶15、傳送帶16的動作藉由控制裝置20控制。控制裝置20包括記憶裝置20a。 The substrate manufacturing apparatus includes a conveyor belt 15, a conveyor belt 16, and a control device 20. The conveyor belt 15 is carried into the substrates 21 to 27 from the outside of the casing 18 to the inside. The lifters 11 to 14 transport the substrates 21 to 27 between the stations in the casing 18. The conveyor belt 16 carries out the substrates 21 to 27 from the inside of the casing 18 to the outside. In the normal operation of the substrate manufacturing apparatus according to the first embodiment, the substrate is carried out from the substrate carry-in/out port 1 and the substrate is carried out from the substrate carry-in/out port 7. The operation of each device in the casing 18 and the operation of the conveyor belt 15 and the conveyor belt 16 are controlled by the control device 20. The control device 20 includes a memory device 20a.

基板21~27搭載於傳送帶15上並通過搬出入口1搬入筐體18內。此時，基板21~27的第1面朝向圖的上方(Z軸的正方向)。 The substrates 21 to 27 are mounted on the conveyor belt 15 and carried into the casing 18 through the carry-out port 1 . At this time, the first surface of the substrates 21 to 27 faces upward (the positive direction of the Z axis) of the drawing.

對將垂直上方設為Z軸的正方向之XYZ正交座標系進行定義。在以下的說明中，定位站2到塗佈站6這5個站依次朝向X軸的正方向配置。從搬出入口1搬入筐體18內之基板21~27經由各站2~6整體朝向X軸的正方向搬送，從搬出入口7搬出至筐體18的外部。 The XYZ orthogonal coordinate system that sets the vertical direction above the Z axis is defined. In the following description, the five stations from the positioning station 2 to the coating station 6 are sequentially arranged in the positive direction of the X-axis. The substrates 21 to 27 that have been carried into the casing 18 from the loading/unloading port 1 are conveyed in the positive direction of the X-axis via the entire stations 2 to 6, and are carried out from the loading and unloading port 7 to the outside of the casing 18.

首先，對基於實施例1之基板製造裝置通常運轉時的動作進行說明。被導入筐體18的內部之基板21~27藉由提昇器11搬送到定位站2。定位站2中，檢測形成於基板21~27的表面之定位標記，並依據檢測結果進行基板21~27的定位(對位)。 First, when the substrate manufacturing apparatus according to the first embodiment is normally operated The action is explained. The substrates 21 to 27 introduced into the inside of the casing 18 are transported to the positioning station 2 by the lifter 11. In the positioning station 2, the positioning marks formed on the surfaces of the substrates 21 to 27 are detected, and the positioning (alignment) of the substrates 21 to 27 is performed in accordance with the detection result.

進行定位後之基板21~27藉由提昇器11搬送到塗佈站3。塗佈站3中，在基板21~27的第1面形成阻焊抗蝕劑的薄膜圖案。在塗佈站3中形成之薄膜圖案為只有其表層部固化之狀態，薄膜圖案的內部維持液狀。將只有表層部固化之現象稱為“臨時固化”，將固化至內部之現象稱為“正式固化”。 The substrates 21 to 27 that have been positioned are transported to the coating station 3 by the lifter 11. In the coating station 3, a film pattern of a solder resist is formed on the first surface of the substrates 21 to 27. The film pattern formed in the coating station 3 is in a state in which only the surface layer portion is cured, and the inside of the film pattern is maintained in a liquid state. The phenomenon in which only the surface layer portion is cured is referred to as "temporary curing", and the phenomenon of curing to the inside is referred to as "formal curing".

在第1面形成有薄膜圖案之基板21~27藉由提昇器12從塗佈站3搬送到反轉站4。反轉站4中，基板21~27的表面和背面被反轉。其結果，基板21~27的第2面朝向Z軸的正方向。並且，反轉站4中進行形成於基板21~27的第1面之薄膜圖案的正式固化。 The substrates 21 to 27 on which the thin film pattern is formed on the first surface are transferred from the coating station 3 to the inversion station 4 by the lifter 12. In the inversion station 4, the surfaces and the back surfaces of the substrates 21 to 27 are reversed. As a result, the second faces of the substrates 21 to 27 are oriented in the positive direction of the Z-axis. Further, the inversion station 4 performs the main curing of the thin film pattern formed on the first surface of the substrates 21 to 27.

表面和背面被反轉且第1面的薄膜圖案被正式固化之基板21~27由提昇器13從反轉站4搬送到第2個定位站5。第2個定位站5中，檢測形成於基板21~27的第2面之定位標記，並依據檢測結果進行基板21~27的定位。 The substrates 21 to 27 whose front and back surfaces are reversed and the film pattern of the first surface is completely solidified are transferred from the reversing station 4 to the second positioning station 5 by the lifter 13. In the second positioning station 5, the positioning marks formed on the second surface of the substrates 21 to 27 are detected, and the positioning of the substrates 21 to 27 is performed in accordance with the detection result.

基板21~27藉由提昇器13從定位站5搬送到第2個塗佈站6。第2個塗佈站6中，在基板21~27的第2面形成阻焊抗蝕劑的薄膜圖案。 The substrates 21 to 27 are transferred from the positioning station 5 to the second coating station 6 by the lifter 13. In the second coating station 6, a thin film pattern of a solder resist is formed on the second surface of the substrates 21 to 27.

在第2面形成有薄膜圖案之基板21~27藉由提昇器14從塗佈站6搬送到傳送帶16。傳送帶16將基板21~27 從搬出入口7搬出至筐體18的外部。在基板21~27搭載於傳送帶16上之狀態下，藉由紫外線照射裝置9對基板21~27的整個第2面照射紫外線。形成於基板21~27的第2面之薄膜圖案藉由紫外線照射進行正式固化。紫外線照射裝置9以通過搭載於傳送帶16上之基板21~27的上方之方式在筐體18內移動。當紫外線照射裝置9通過基板21~27的上方時，對基板21~27的第2面照射紫外線。另外，當亦可以是將紫外線照射裝置9固定於筐體18內，基板21~27搭載於傳送帶16通過紫外線照射裝置9的下方時，從紫外線照射裝置9對基板21~27照射紫外線之結構。藉由控制裝置20控制向基板21~27照射紫外線。 The substrates 21 to 27 on which the thin film pattern is formed on the second surface are transferred from the coating station 6 to the conveyor belt 16 by the lifter 14. Conveyor belt 16 will be substrates 21~27 It is carried out from the carry-out port 7 to the outside of the casing 18. In the state where the substrates 21 to 27 are mounted on the conveyor belt 16, the entire second surface of the substrates 21 to 27 is irradiated with ultraviolet rays by the ultraviolet irradiation device 9. The film pattern formed on the second surface of the substrates 21 to 27 is completely cured by ultraviolet irradiation. The ultraviolet irradiation device 9 moves in the casing 18 so as to be placed above the substrates 21 to 27 mounted on the conveyor belt 16. When the ultraviolet irradiation device 9 passes over the substrates 21 to 27, the second surface of the substrates 21 to 27 is irradiated with ultraviolet rays. In addition, when the ultraviolet irradiation device 9 is fixed in the casing 18, and the substrates 21 to 27 are mounted on the lower side of the ultraviolet irradiation device 9 when the conveyor belt 16 is mounted, the ultraviolet rays irradiation device 9 irradiates the substrates 21 to 27 with ultraviolet rays. The substrate 21 to 27 is irradiated with ultraviolet rays by the control device 20.

基於實施例1之基板製造裝置中，在定位站2、塗佈站3、反轉站4、定位站5及塗佈站6的各站並行進行處理。例如，在定位站2內進行形成於基板22的第1面之定位標記的檢測及基板22的定位之期間，塗佈站3中在其他基板23的第1面形成薄膜圖案。在此期間，反轉站4中進行形成於其他基板24的第1面之薄膜圖案的正式固化和基板24的表面和背面的反轉，定位站5中進行形成於其他基板25的第2面之定位標記的檢測及基板25的定位。塗佈站6中，在其他基板26的第2面形成薄膜圖案。另外，在此期間，傳送帶15將未形成薄膜圖案之其他基板21搬入筐體18內，傳送帶16從筐體18搬出在兩面形成有薄膜圖案之基板27。這樣，由於並行進行處理，因此能夠實現生產效率的提高。 In the substrate manufacturing apparatus of the first embodiment, the stations of the positioning station 2, the coating station 3, the reversing station 4, the positioning station 5, and the coating station 6 are processed in parallel. For example, during the detection of the positioning marks formed on the first surface of the substrate 22 and the positioning of the substrate 22 in the positioning station 2, a thin film pattern is formed on the first surface of the other substrate 23 in the coating station 3. During this period, the inversion station 4 performs the main curing of the thin film pattern formed on the first surface of the other substrate 24 and the reverse of the front and back surfaces of the substrate 24, and the positioning station 5 performs the second surface formed on the other substrate 25. The detection of the positioning mark and the positioning of the substrate 25. In the coating station 6, a thin film pattern is formed on the second surface of the other substrate 26. In addition, during this period, the conveyor belt 15 carries the other substrate 21 in which the film pattern is not formed into the casing 18, and the conveyor belt 16 carries out the substrate 27 on which the film pattern is formed on both sides from the casing 18. In this way, due to processing in parallel, Therefore, it is possible to achieve an increase in production efficiency.

參閱第2圖A~第2圖C對定位站2進行說明。第2圖A表示具備於定位站2之定位裝置的概要圖。定位裝置包括從底座31側依次配置於底座(基座)31上之Y載物台32、θ載物台33及卡盤板34。卡盤板34藉由提昇器11(第1圖)吸附保持搬送到定位站2之基板22。 The positioning station 2 will be described with reference to Figs. 2A to 2C. FIG. 2A is a schematic view showing a positioning device provided in the positioning station 2. The positioning device includes a Y stage 32, a θ stage 33, and a chuck plate 34 which are disposed on the base (base) 31 in this order from the base 31 side. The chuck plate 34 is sucked and held by the lifter 11 (Fig. 1) and transported to the substrate 22 of the positioning station 2.

Y載物台32使基板22與θ載物台33及卡盤板34一同向Y軸方向移動。θ載物台33以與Z軸平行之軸為旋轉中心，使基板22與卡盤板34一同旋轉。在本說明書中，將Y載物台32、θ載物台33及卡盤板34總稱為“移動載物台”。藉由控制裝置20控制基於卡盤板34之基板22的吸附、基板22基於Y載物台32及θ載物台33之移動。 The Y stage 32 moves the substrate 22 together with the θ stage 33 and the chuck plate 34 in the Y-axis direction. The θ stage 33 is rotated about the axis parallel to the Z axis, and the substrate 22 is rotated together with the chuck plate 34. In the present specification, the Y stage 32, the θ stage 33, and the chuck plate 34 are collectively referred to as a "moving stage." The movement of the substrate 22 by the chuck plate 34 is controlled by the control device 20, and the substrate 22 is moved based on the Y stage 32 and the θ stage 33.

定位裝置包括CCD攝像機35~38。CCD攝像機35~38對在保持於卡盤板34之基板22的表面上形成之定位標記進行拍攝。藉由控制裝置20控制基於CCD攝像機35~38之拍攝。另外，藉由CCD攝像機35~38獲得之圖像資料(檢測結果)發送到控制裝置20。 The positioning device includes CCD cameras 35~38. The CCD cameras 35 to 38 photograph the positioning marks formed on the surface of the substrate 22 held by the chuck plate 34. The shooting based on the CCD cameras 35 to 38 is controlled by the control device 20. Further, the image data (detection result) obtained by the CCD cameras 35 to 38 is transmitted to the control device 20.

第2圖B表示具備於定位站2之移動載物台及吸附保持於卡盤板34之基板22的俯視圖。基板22的第1面形成有定位標記22a~22d。定位標記22a~22d例如分別配置於四角附近。 FIG. 2B is a plan view showing the moving stage provided in the positioning station 2 and the substrate 22 adsorbed and held by the chuck plate 34. The first surface of the substrate 22 is formed with positioning marks 22a to 22d. The positioning marks 22a to 22d are disposed, for example, in the vicinity of the four corners.

藉由提昇器11搬送至卡盤板34上之基板22吸附保持於卡盤板34。保持於卡盤板34之基板22藉由Y載物台32在定位站2內向Y軸的負方向移動。第2圖B中，將移動後的卡盤板34及基板22示於括號內。 The substrate 22 conveyed to the chuck plate 34 by the lifter 11 is sucked and held by the chuck plate 34. The substrate 22 held on the chuck plate 34 is Y-loaded The stage 32 moves in the negative direction of the Y-axis within the positioning station 2. In Fig. 2B, the chuck plate 34 and the substrate 22 after the movement are shown in parentheses.

CCD攝像機35~38比從提昇器11接收基板22時的卡盤板34的位置更靠Y軸的負向側配置。另外，CCD攝像機35~38分別具有相對位置關係，以便能夠同時拍攝定位標記22a~22d。基板22藉由Y載物台32向CCD攝像機35~38的下方移動，CCD攝像機35~38分別拍攝形成於基板22的第1面之定位標記22a~22d。被拍攝之圖像資料發送到控制裝置20。 The CCD cameras 35 to 38 are arranged closer to the negative side of the Y-axis than the position of the chuck plate 34 when the substrate 22 is received from the lifter 11. In addition, the CCD cameras 35 to 38 have a relative positional relationship, respectively, so that the positioning marks 22a to 22d can be simultaneously photographed. The substrate 22 is moved below the CCD cameras 35 to 38 by the Y stage 32, and the CCD cameras 35 to 38 respectively capture the positioning marks 22a to 22d formed on the first surface of the substrate 22. The captured image data is sent to the control device 20.

控制裝置20分析藉由CCD攝像機35~38取得之圖像資料，並計算基板22的位置及以與Z軸平行之軸為旋轉中心之旋轉方向的位置(姿勢)。之後，補正基板22的旋轉方向的位置。將旋轉方向的位置補正稱為“θ補正”。 The control device 20 analyzes the image data acquired by the CCD cameras 35 to 38, and calculates the position (posture) of the position of the substrate 22 and the rotation direction of the axis parallel to the Z axis. Thereafter, the position of the substrate 22 in the rotational direction is corrected. The position correction in the direction of rotation is referred to as "θ correction".

第2圖B中，作為一例示出在基板22的XY平面的旋轉方向上產生從目標位置向逆時針方向僅位置偏離角度α之情況。此時，連結與定位標記22a對應之頂點和與定位標記22d對應之頂點之邊以後者的頂點為基準，從X軸的正方向向逆時針方向僅傾斜角度α。依據藉由CCD攝像機35~38取得之圖像資料由控制裝置20計算該位置偏離。控制裝置20藉由使θ載物台33向逆時針方向僅旋轉角度α來進行θ補正。 In FIG. 2B, as an example, a case where the position α is shifted from the target position to the counterclockwise direction by the angle α in the rotation direction of the XY plane of the substrate 22 is shown. At this time, the apex corresponding to the apex corresponding to the positioning mark 22a and the apex corresponding to the positioning mark 22d are connected, and the angle α is inclined from the positive direction of the X-axis to the counterclockwise direction. The positional deviation is calculated by the control device 20 based on the image data acquired by the CCD cameras 35 to 38. The control device 20 performs θ correction by rotating the θ stage 33 only by the angle α in the counterclockwise direction.

第2圖C中示出θ補正後的卡盤板34及基板22的俯視圖。θ補正的結果，矩形狀的基板22的各邊與X軸或 Y軸平行。進行基板22的θ補正之後，控制裝置20驅動Y載物台32，使基板22向Y軸的正方向移動。Y載物台32的移動距離與在第2圖B所示之製程中使Y載物台32向Y軸的負方向移動之距離相等。 FIG. 2C is a plan view showing the chuck plate 34 and the substrate 22 after θ correction. As a result of θ correction, each side of the rectangular substrate 22 is X-axis or The Y axis is parallel. After the θ correction of the substrate 22 is performed, the control device 20 drives the Y stage 32 to move the substrate 22 in the positive direction of the Y axis. The moving distance of the Y stage 32 is equal to the distance in which the Y stage 32 is moved in the negative direction of the Y axis in the process shown in FIG.

第2圖C的括號內示出向Y軸的正方向移動之後的卡盤板34及基板22。實施θ補正之基板22藉由提昇器11(第1圖)從定位站2搬送到塗佈站3(第1圖)。提昇器11藉由θ載物台33的旋轉維持θ補正後的基板22的旋轉方向的位置(姿勢)，並搬送至塗佈站3。 The chuck plate 34 and the substrate 22 after moving in the positive direction of the Y-axis are shown in parentheses in Fig. 2C. The substrate 22 subjected to the θ correction is transferred from the positioning station 2 to the coating station 3 by the lifter 11 (Fig. 1) (Fig. 1). The lifter 11 maintains the position (posture) of the rotation direction of the substrate 22 after the θ correction by the rotation of the θ stage 33, and conveys it to the coating station 3.

由於在第1圖所示之定位站2已完成θ補正，所以塗佈站3中無需進行基板22的θ補正，就能夠開始對基板22的第1面形成薄膜圖案。與在塗佈站3進行θ補正，之後形成薄膜圖案之情況相比，能夠縮短塗佈站3中的處理時間。其結果，能夠實現產距時間(takt time)的縮短及生產效率的提高。 Since the positioning station 2 shown in FIG. 1 has completed the θ correction, the coating station 3 can start forming the thin film pattern on the first surface of the substrate 22 without performing the θ correction of the substrate 22. The processing time in the coating station 3 can be shortened compared to the case where the coating station 3 performs θ correction and then forms a thin film pattern. As a result, it is possible to shorten the takt time and improve the production efficiency.

有時在基板22上發生拉伸應變。若發生拉伸應變，則薄膜圖案形成時刻的基板的尺寸與設計值不同。控制裝置20依據在定位站2取得之圖像資料計算基板22的尺寸。依據計算出之基板的尺寸生成在塗佈站3內形成薄膜圖案時使用之吐出控制用圖像資料。生成之吐出控制用圖像資料儲存於控制裝置20的記憶裝置20a。 Tensile strain sometimes occurs on the substrate 22. When the tensile strain occurs, the size of the substrate at the time of film formation is different from the design value. The control device 20 calculates the size of the substrate 22 based on the image data acquired at the positioning station 2. The image data for discharge control used when the film pattern is formed in the coating station 3 is generated based on the calculated size of the substrate. The generated image data for discharge control is stored in the memory device 20a of the control device 20.

第3圖A及第3圖B中示出具備於塗佈站3(第1圖)之液滴吐出裝置70的概要圖。如第3圖A所示，液滴吐出裝置70包括以與XY平面平行之姿勢設置之底座 (基座)41及從底座41側依次配置於底座41上之X載物台43、Y載物台44、卡盤板45。卡盤板45藉由提昇器11(第1圖)吸附保持被搬送到塗佈站3之基板23。 3A and 3B show a schematic view of the droplet discharge device 70 provided in the coating station 3 (first drawing). As shown in FIG. 3A, the droplet discharge device 70 includes a base disposed in a posture parallel to the XY plane. The (base) 41 and the X stage 43, the Y stage 44, and the chuck plate 45 which are disposed on the base 41 in this order from the base 41 side. The chuck plate 45 sucks and holds the substrate 23 conveyed to the coating station 3 by the lifter 11 (Fig. 1).

X載物台43使基板23與Y載物台44及卡盤板45一同向X軸方向移動。Y載物台44使基板23與卡盤板44一同向Y軸方向移動。將X載物台43、Y載物台44及卡盤板45總稱為“移動載物台”。藉由控制裝置20控制基於卡盤板45之基板23的吸附、基板23基於X載物台43及Y載物台44之移動。 The X stage 43 moves the substrate 23 together with the Y stage 44 and the chuck plate 45 in the X-axis direction. The Y stage 44 moves the substrate 23 together with the chuck plate 44 in the Y-axis direction. The X stage 43, the Y stage 44, and the chuck plate 45 are collectively referred to as a "moving stage." The movement of the substrate 23 by the chuck plate 45 is controlled by the control device 20, and the movement of the substrate 23 based on the X stage 43 and the Y stage 44 is performed.

另外，亦可將具有X載物台43、Y載物台44及卡盤板45的功能之高功能載物台用作移動載物台。 Further, a high-performance stage having the functions of the X stage 43, the Y stage 44, and the chuck plate 45 may be used as the moving stage.

底座41上固定有框架42。框架42包括2根支柱42a、支柱42b及橫樑42c。支柱42a、支柱42b安裝於底座41的Y軸方向的大致中央。橫樑42c以沿X軸方向之方式支撐於支柱42a、支柱42b。噴嘴單元47a~47f藉由框架42支撐於卡盤板44的上方。 A frame 42 is fixed to the base 41. The frame 42 includes two pillars 42a, a pillar 42b, and a beam 42c. The pillar 42a and the pillar 42b are attached to the substantially center of the base 41 in the Y-axis direction. The beam 42c is supported by the pillar 42a and the pillar 42b so as to be along the X-axis direction. The nozzle units 47a to 47f are supported by the frame 42 above the chuck plate 44.

噴嘴單元47a~47f經連結構件46支撐於框架42的橫樑42c。噴嘴單元47a~47f分別包括複數個噴頭及紫外光源。噴頭朝向保持於卡盤板44之基板23的第1面吐出例如紫外線固化型的薄膜材料的液滴。使基板23向Y軸方向移動之同時進行薄膜材料的吐出。由吐出之薄膜材料形成在基板23的第1面具有預定平面形狀之薄膜圖案。薄膜圖案藉由從紫外光源射出之紫外線臨時固化。 The nozzle units 47a to 47f are supported by the cross member 42c of the frame 42 via the joint member 46. The nozzle units 47a to 47f respectively include a plurality of nozzles and an ultraviolet light source. The head discharges, for example, droplets of the ultraviolet curable film material toward the first surface of the substrate 23 held by the chuck plate 44. The film material is discharged while moving the substrate 23 in the Y-axis direction. A film pattern having a predetermined planar shape on the first surface of the substrate 23 is formed from the discharged film material. The film pattern is temporarily cured by ultraviolet rays emitted from an ultraviolet light source.

控制裝置20的記憶裝置20a中記憶有對應形成於基板23的第1面之薄膜圖案的平面形狀進行定義之圖像資料(圖案定義資料)。圖案定義資料例如以格伯格式提供。另外，記憶裝置20a中記憶有表示基於移動載物台之基板23的移動量與來自噴頭的墨水的吐出時期的關係(吐出時機)之資料。該些資料為在基板23未產生應變之前提下提供之設計資料。當基板23上產生應變時，無法直接使用該設計資料。 The memory device 20a of the control device 20 has a corresponding memory formed in the base The image data (pattern definition data) of the film shape of the first surface of the sheet 23 is defined. The pattern definition material is provided, for example, in the Gerber format. In addition, the memory device 20a stores information indicating the relationship between the amount of movement of the substrate 23 of the moving stage and the discharge timing of the ink from the head (discharge timing). This information is provided for the design information provided before the substrate 23 is strained. When strain is generated on the substrate 23, the design information cannot be directly used.

控制裝置20依據在定位站2(第1圖)拍攝之基板23的圖像資料，由該些設計資料生成吐出控制用圖像資料。吐出控制用圖像資料例如以光柵格式提供。以下，對吐出控制用圖像資料的生成順序進行說明。控制裝置20由在定位站2中取得之圖像資料計算基板23的X方向、Y方向的伸縮量。在X方向及Y方向上，按照基板23的X方向及Y方向的伸縮量補正圖案定義資料。依據補正後的圖案定義資料生成光柵格式的吐出控制用圖像資料。 The control device 20 generates image data for discharge control from the design data based on the image data of the substrate 23 imaged by the positioning station 2 (Fig. 1). The image data for spitting control is provided, for example, in a raster format. Hereinafter, the procedure for generating the image data for discharge control will be described. The control device 20 calculates the amount of expansion and contraction of the substrate 23 in the X direction and the Y direction from the image data acquired at the positioning station 2. In the X direction and the Y direction, the pattern definition data is corrected in accordance with the amount of expansion and contraction of the substrate 23 in the X direction and the Y direction. The image data for the discharge control in the raster format is generated based on the corrected pattern definition data.

控制裝置20依據保存於記憶裝置20a之吐出控制用圖像資料控制來自噴嘴單元47a~47f的薄膜材料的吐出及基板23基於移動載物台之移動，以使在基板23的第1面的預定區域塗佈薄膜材料。基板23沿Y軸方向移動，在通過噴嘴單元47a~47f的垂直下方(Z軸的負方向)時，在基板23的第1面塗佈薄膜材料。 The control device 20 controls the discharge of the film material from the nozzle units 47a to 47f and the movement of the substrate 23 based on the movement of the substrate based on the image data for discharge control stored in the memory device 20a so as to be predetermined on the first surface of the substrate 23. Area coated film material. The substrate 23 is moved in the Y-axis direction, and the film material is applied to the first surface of the substrate 23 when passing through the vertical direction (the negative direction of the Z-axis) of the nozzle units 47a to 47f.

第3圖B中示出液滴吐出裝置70的噴嘴單元47a~47f附近的概要圖。噴嘴單元47a~47f具有相同的結構，沿X軸方向以等間隔固定於連結構件46。連結構件46能夠向Z軸方向移動地安裝於框架的橫樑42c上。藉由使連結構件46向Z軸方向移動，能夠改變噴嘴單元47a~47f與基板23之間的距離。藉由控制裝置20控制噴嘴單元47a~47f基於連結構件46向Z軸方向移動。另外，噴嘴單元47a~47f亦可直接固定於框架的橫樑42c上而不經連結構件46。 FIG. 3B is a schematic view showing the vicinity of the nozzle units 47a to 47f of the droplet discharge device 70. The nozzle units 47a to 47f have the same configuration and are fixed to the coupling member 46 at equal intervals in the X-axis direction. Connecting member 46 can It is attached to the beam 42c of the frame so as to be movable in the Z-axis direction. By moving the connecting member 46 in the Z-axis direction, the distance between the nozzle units 47a to 47f and the substrate 23 can be changed. The nozzle units 47a to 47f are controlled by the control device 20 to move in the Z-axis direction based on the joint member 46. Further, the nozzle units 47a to 47f may be directly fixed to the cross member 42c of the frame without passing through the joint member 46.

第4圖A中示出噴嘴單元47a的立體圖。噴嘴單元47a包括沿Y軸方向交替組裝於噴嘴夾具47a_c之噴頭47a₁~47a₄及紫外光源47a₅~47a₉。各噴頭47a₁~47a₄具備沿Y軸方向配置之2列噴嘴列。各噴嘴列由沿X軸方向排列之複數個、例如192個噴嘴孔構成。各噴嘴列的沿X軸方向之長度例如為約30mm。因此，噴嘴單元47a的沿X軸方向之長度亦為約30mm。從各噴嘴孔吐出紫外線固化型的薄膜材料。 A perspective view of the nozzle unit 47a is shown in Fig. 4A. The nozzle unit 47a includes nozzles 47a ₁ to 47a ₄ and ultraviolet light sources 47a ₅ to 47a ₉ which are alternately assembled in the Y-axis direction to the nozzle holder 47a _c . Each of the heads 47a ₁ to 47a ₄ includes two rows of nozzle rows arranged in the Y-axis direction. Each nozzle row is composed of a plurality of, for example, 192 nozzle holes arranged in the X-axis direction. The length of each nozzle row in the X-axis direction is, for example, about 30 mm. Therefore, the length of the nozzle unit 47a in the X-axis direction is also about 30 mm. An ultraviolet curable film material is discharged from each nozzle hole.

紫外光源47a₅~47a₉例如包括發光二極管(LED)而構成，發出紫外光區域的波長的光。從噴頭47a₁~47a₄的各噴嘴孔向基板23吐出之紫外線固化型的薄膜材料藉由從紫外光源47a₅~47a₉發出之光臨時固化。藉由控制裝置20控制來自紫外光源47a₅~47a₉的紫外光的射出。 The ultraviolet light sources 47a ₅ to 47a _{9 are,} for example, composed of light emitting diodes (LEDs), and emit light of a wavelength in the ultraviolet light region. The ultraviolet curable film material discharged from the nozzle holes of the heads 47a ₁ to 47a ₄ to the substrate 23 is temporarily solidified by light emitted from the ultraviolet light sources 47a ₅ to 47a ₉ . The emission of ultraviolet light from the ultraviolet light sources 47a ₅ to 47a ₉ is controlled by the control device 20.

第4圖B中示出噴嘴單元47a(噴頭47a₁~47a₄)的仰視圖。第4圖B中省略記載紫外光源47a₅~47a₉。 A bottom view of the nozzle unit 47a (heads 47a ₁ to 47a ₄ ) is shown in Fig. 4B. The ultraviolet light sources 47a ₅ to 47a ₉ are omitted in Fig. 4B.

若著眼於噴頭47a₁~47a₄的1個噴嘴列，則噴嘴孔沿X軸方向以160μm間隔配置。各噴頭47a₁~47a₄中，Y軸正向側的噴嘴列的噴嘴孔相對Y軸負向側的噴嘴列的噴嘴孔向X軸的正方向偏離80μm。因此，各噴頭47a₁~47a₄包括在X軸方向上以80μm間隔交錯狀(之字形)排列之384個噴嘴孔，並具有相當於約300dpi之解析度。各噴嘴孔配置有壓電元件，藉由對壓電元件施加電壓而從噴嘴孔吐出薄膜材料。藉由控制裝置20控制向壓電元件施加電壓。亦即，藉由控制裝置20控制薄膜材料的吐出。另外，實施例1中，在噴頭47a₁~47a₄分別配置2列噴嘴列，但是噴嘴列的列數可以是1列，亦可以是3列以上。 When focusing on one nozzle row of the heads 47a ₁ to 47a ₄ , the nozzle holes are arranged at intervals of 160 μm in the X-axis direction. In each of the heads 47a ₁ to 47a ₄ , the nozzle holes of the nozzle row on the positive side of the Y axis are offset from the nozzle holes of the nozzle row on the negative side of the Y axis by 80 μm in the positive direction of the X axis. Therefore, each of the heads 47a ₁ to 47a ₄ includes 384 nozzle holes arranged in a staggered (zigzag) shape at intervals of 80 μm in the X-axis direction, and has a resolution equivalent to about 300 dpi. A piezoelectric element is disposed in each nozzle hole, and a film material is discharged from the nozzle hole by applying a voltage to the piezoelectric element. The voltage applied to the piezoelectric element is controlled by the control device 20. That is, the discharge of the film material is controlled by the control device 20. Further, in the first embodiment, two nozzle rows are arranged in the heads 47a ₁ to 47a ₄ , but the number of rows of the nozzle rows may be one column or three or more columns.

噴頭47a₁~47a₄依次向X軸的正方向錯開相對位置之同時，整體沿Y軸方向配置。亦即，噴頭47a2相對噴頭47a₁向X軸的正方向僅偏離20μm而配置。同樣，噴頭47a3、噴頭47a₄分別相對噴頭47a2、噴頭47a3向X軸的正方向僅偏離20μm而配置。噴嘴單元47a具備在X軸方向上以20μm間隔(相當於約1200dpi之解析度)配置之複數個噴嘴孔。 The heads 47a ₁ to 47a _{4 are} sequentially shifted in the positive direction of the X-axis, and are disposed in the Y-axis direction as a whole. That is, the head 47a2 is disposed with respect to the head 47a ₁ in the positive direction of the X-axis by only 20 μm. Similarly, the head 47a3 and the head 47a ₄ are disposed only about 20 μm from the head 47a2 and the head 47a3 in the positive direction of the X-axis. The nozzle unit 47a includes a plurality of nozzle holes arranged at intervals of 20 μm (corresponding to a resolution of about 1200 dpi) in the X-axis direction.

第4圖C中示出噴嘴單元47a~47f的概要俯視圖。如上述，各噴嘴單元47a~47f在沿X軸方向之約30mm的範圍內具有液滴吐出能力。另外，複數個噴嘴單元47a~47f沿X軸方向以等間隔配置。相鄰之噴嘴單元47a~47f之間的距離例如為約60mm。 A schematic plan view of the nozzle units 47a to 47f is shown in Fig. 4C. As described above, each of the nozzle units 47a to 47f has a droplet discharge capability in a range of about 30 mm in the X-axis direction. Further, a plurality of nozzle units 47a to 47f are arranged at equal intervals in the X-axis direction. The distance between adjacent nozzle units 47a to 47f is, for example, about 60 mm.

對塗佈站3(第1圖)中的處理進行說明。提昇器11搬送基板23，使其搭載於卡盤板45(第3圖A)上。使保持於卡盤板45之基板23向Y軸的負方向移動之同時，朝向各噴嘴單元47a~47f下方的沿Y軸方向之奇數列區域(第4圖C中附加圓形記號之區域)的著落目標位置(應塗佈薄膜材料之位置)，從噴嘴單元47a~47f吐出薄膜材料。若向奇數列區域的著落目標位置之塗佈結束，則在X載物台43(第3圖A)上使基板23向X軸的正方向僅移動例如10μm。之後，使基板23向Y軸的正方向移動之同時，朝向各噴嘴單元47a~47f下方的沿Y軸方向之偶數列區域(第4圖C中附加叉形記號之區域)的著落目標位置，從噴嘴單元47a~47f吐出薄膜材料。在基板23移動的去路和回路上，能夠使薄膜材料分別著落於奇數列區域和偶數列區域的目標位置。藉此，能夠以相當於約2400dpi之高解析度形成薄膜圖案。 The processing in the coating station 3 (Fig. 1) will be described. The lifter 11 transports the substrate 23 and mounts it on the chuck plate 45 (Fig. 3A). While moving the substrate 23 held by the chuck plate 45 in the negative direction of the Y-axis, The target position of the odd-numbered column in the Y-axis direction (the area in which the circular mark is added in FIG. 4C) below the nozzle units 47a to 47f (the position at which the film material should be applied), from the nozzle units 47a to 47f Spit out the film material. When the application to the landing target position of the odd-numbered column region is completed, the substrate 23 is moved by only 10 μm in the positive direction of the X-axis on the X stage 43 (Fig. 3A). After that, the substrate 23 is moved in the positive direction of the Y-axis, and the landing target position of the even-numbered column region (the region where the fork-shaped mark is added in FIG. 4C) in the Y-axis direction below the nozzle cells 47a to 47f is directed. The film material is discharged from the nozzle units 47a to 47f. On the outward path and the loop in which the substrate 23 moves, the film material can be placed at the target positions of the odd column region and the even column region, respectively. Thereby, the thin film pattern can be formed with a high resolution equivalent to about 2400 dpi.

若薄膜材料向偶數列區域之塗佈結束，則驅動X載物台43，使基板23向X軸的正方向移動約30mm。藉由Y載物台44使基板23在Y軸方向上往返，從而在去路和回路上分別進行奇數列區域和偶數列區域的描繪。 When the application of the film material to the even-numbered region is completed, the X stage 43 is driven to move the substrate 23 in the positive direction of the X-axis by about 30 mm. The substrate 23 is reciprocated in the Y-axis direction by the Y stage 44, and the odd-line area and the even-numbered area are drawn on the outward path and the loop, respectively.

另外，再次進行同樣的處理，使基板23沿Y軸方向總計往返3次，藉此完成對基板23的第1面形成薄膜圖案。 Further, the same processing is performed again, and the substrate 23 is reciprocated three times in the Y-axis direction, thereby completing the formation of a thin film pattern on the first surface of the substrate 23.

第3圖A~第4圖C所示之液滴吐出裝置70具備6個噴嘴單元47a~47f。噴嘴單元的數量不限於6個。例如，亦可將噴嘴單元的個數設為1個。 The droplet discharge device 70 shown in FIGS. 3A to 4C has six nozzle units 47a to 47f. The number of nozzle units is not limited to six. For example, the number of nozzle units can also be set to one.

第5圖A~第5圖D中示出具備於反轉站4(第1圖)之基板反轉裝置50及紫外線照射裝置(薄膜材料固化裝置)60的概要圖。如第5圖A所示，基板反轉裝置50包括保持搬送到反轉站4之基板21~27之基板保持器51及支撐基板保持器51之棒狀支撐構件52。基板保持器51由沿長方形的4個邊中去除1個短邊之剩下的3個邊之棒狀構件構成。將沿相互平行之2條長邊之部份稱為“手臂”，將沿1條短邊之部份稱為“連結部份”。支撐構件52連接於連結部份的中點，向2個手臂的相反方向延伸。基板保持器51能夠以支撐構件52為旋轉軸進行旋轉。藉由控制裝置20控制基板保持器51基於支撐構件52之旋轉。 5A to 5D show the substrate inverting device 50 and the ultraviolet irradiation device (the film material solid) provided in the inversion station 4 (Fig. 1). Outline of the device 60. As shown in FIG. 5A, the substrate inverting device 50 includes a substrate holder 51 that holds the substrates 21 to 27 that are transported to the inversion station 4, and a rod-shaped support member 52 that supports the substrate holder 51. The substrate holder 51 is composed of a rod-shaped member that removes the remaining three sides of one short side among the four sides of the rectangle. The two long sides that are parallel to each other are referred to as "arms", and the portions along one short side are referred to as "joined portions". The support member 52 is connected to the midpoint of the joint portion and extends in the opposite direction of the two arms. The substrate holder 51 is rotatable with the support member 52 as a rotation axis. The rotation of the substrate holder 51 based on the support member 52 is controlled by the control device 20.

紫外線照射裝置60包括支撐構件61及紫外光源62。支撐構件61向與基板反轉裝置50的支撐構件52的延伸方向平行之方向延伸。紫外光源62包括燈或LED，發出紫外線區域的波長的光。紫外光源62的輸出高於噴嘴單元所含之紫外光源47a₅~47a₉(第4圖A)的輸出。從紫外光源2放射之紫外光的波長可以與從噴嘴單元的紫外光源射出之紫外光的波長相等，亦可不同。 The ultraviolet irradiation device 60 includes a support member 61 and an ultraviolet light source 62. The support member 61 extends in a direction parallel to the extending direction of the support member 52 of the substrate inverting device 50. The ultraviolet light source 62 includes a lamp or LED that emits light of a wavelength in the ultraviolet region. The output of the ultraviolet light source 62 is higher than the output of the ultraviolet light sources 47a ₅ to 47a ₉ (Fig. 4A) included in the nozzle unit. The wavelength of the ultraviolet light radiated from the ultraviolet light source 2 may be equal to or different from the wavelength of the ultraviolet light emitted from the ultraviolet light source of the nozzle unit.

支撐構件61上能夠向其延伸方向進行移動地支撐有紫外光源62。藉由控制裝置20控制來自紫外光源62的紫外光的射出及紫外光源62沿支撐構件61之移動。 The support member 61 is supported by the ultraviolet light source 62 so as to be movable in the extending direction thereof. The emission of ultraviolet light from the ultraviolet light source 62 and the movement of the ultraviolet light source 62 along the support member 61 are controlled by the control device 20.

如第5圖B所示，塗佈站3(第1圖)中在第1面形成有薄膜圖案之基板21~27，作為一例基板24藉由提昇器12(第1圖)搬送到反轉站4。基板24藉由提昇器12以基板24的第1面(形成有薄膜圖案之面)朝上之方式 (朝向Z軸的正方向之方式)搭載於基板保持器51。基板保持器51藉由吸附、按壓、夾緊等來對基板24進行固定性保持。亦即，基板24保持成不會相對基板保持器51相對移動。藉由控制裝置20控制基板24基於基板保持器51之固定性保持及其解除。 As shown in FIG. 5B, in the coating station 3 (Fig. 1), the substrates 21 to 27 on which the thin film pattern is formed on the first surface, as an example of the substrate 24, are conveyed to the reverse by the lifter 12 (Fig. 1). Station 4. The substrate 24 is raised by the lifter 12 with the first surface of the substrate 24 (the surface on which the thin film pattern is formed) facing upward. (A mode in which the positive direction of the Z axis is applied) is mounted on the substrate holder 51. The substrate holder 51 holds the substrate 24 in a fixed manner by suction, pressing, clamping, or the like. That is, the substrate 24 is held so as not to move relative to the substrate holder 51. The substrate 24 is controlled by the control device 20 to maintain and release the substrate based on the substrate holder 51.

如第5圖C所示，從紫外光源62射出紫外光之同時，使紫外光源62沿支撐構件61移動。當紫外光源62沿支撐構件61移動時，紫外光源62通過保持於基板保持器51之基板24的上方，從紫外光源62射出之紫外光照射於至少基板24形成有薄膜圖案之區域、例如基板24的第1面的整個區域。從紫外光源62射出之紫外光以例如1000mJ/cm²的能量密度照射於基板24的整個第1面。藉由紫外光的照射，進行形成於基板24的第1面之薄膜圖案的正式固化。當進行薄膜圖案的正式固化時，與進行臨時固化時相比，以更強的能量密度對基板24照射紫外光。 As shown in FIG. 5C, the ultraviolet light source 62 is moved along the support member 61 while the ultraviolet light source 62 emits ultraviolet light. When the ultraviolet light source 62 moves along the support member 61, the ultraviolet light source 62 is held above the substrate 24 of the substrate holder 51, and the ultraviolet light emitted from the ultraviolet light source 62 is irradiated onto at least the region of the substrate 24 where the thin film pattern is formed, such as the substrate 24. The entire area of the first side. The ultraviolet light emitted from the ultraviolet light source 62 is irradiated onto the entire first surface of the substrate 24 at an energy density of, for example, 1000 mJ/cm ² . The film pattern formed on the first surface of the substrate 24 is completely cured by irradiation of ultraviolet light. When the film pattern is formally cured, the substrate 24 is irradiated with ultraviolet light at a higher energy density than when the temporary curing is performed.

如第5圖D所示，使基板24的第1面的薄膜圖案正式固化之後，以支撐構件52為旋轉軸，使基板保持器51旋轉180°。藉此，保持於基板保持器51之基板24的表面和背面被反轉。表面和背面被反轉之基板24藉由提昇器13(第1圖)搬送到定位站5。若在定位站5中的處理結束，基板24則被搬送到塗佈站6。在進行基於提昇器13之搬送之前，解除基板24基於基板保持器51之保持。 As shown in FIG. 5D, after the film pattern of the first surface of the substrate 24 is completely cured, the substrate holder 51 is rotated by 180° with the support member 52 as a rotation axis. Thereby, the surface and the back surface of the substrate 24 held by the substrate holder 51 are reversed. The substrate 24 whose front and back surfaces are reversed is transported to the positioning station 5 by the lifter 13 (Fig. 1). When the processing in the positioning station 5 is completed, the substrate 24 is transported to the coating station 6. The substrate 24 is released based on the substrate holder 51 before the transfer by the lifter 13 is performed.

參閱第6圖A~第6圖F，對基板保持器51的基板保持結構進行說明。第6圖A、第6圖C及第6圖E表示基板保持器51的概要俯視圖，第6圖B、第6圖D及第6圖F表示基板保持器51的概要側視圖。 Referring to FIG. 6A to FIG. 6F, the substrate holder of the substrate holder 51 is protected. Hold the structure for explanation. 6A, 6C, and 6E show a schematic plan view of the substrate holder 51, and FIGS. 6B, 6D, and 6F show schematic side views of the substrate holder 51.

第6圖A及第6圖B所示之例子中，基板保持器51在手臂的表面具備真空吸附墊53。第6圖A及第6圖B中示出在2條臂的上面形成有複數個真空吸附墊53之例子。基板24藉由提昇器12(第1圖)搭載於真空吸附墊53上，藉由來自真空吸附墊53的吸引力吸附保持於基板保持器51。 In the example shown in FIGS. 6A and 6B, the substrate holder 51 is provided with a vacuum suction pad 53 on the surface of the arm. FIGS. 6A and 6B show an example in which a plurality of vacuum suction pads 53 are formed on the upper surfaces of the two arms. The substrate 24 is mounted on the vacuum suction pad 53 by the lifter 12 (first FIG. 1), and is held by the substrate holder 51 by the suction force from the vacuum suction pad 53.

第6圖C及第6圖D所示之例子中，基板保持器51在2條臂上具備有與臂平行地延伸之按壓輥54。按壓輥54藉由提昇器12(第1圖)在搭載於基板保持器51的上面之基板24的邊緣上移動。基板24藉由按壓於按壓輥54而被固定性保持於基板保持器51。 In the example shown in FIGS. 6C and 6D, the substrate holder 51 is provided with pressing rollers 54 extending in parallel with the arms on the two arms. The pressing roller 54 moves on the edge of the substrate 24 mounted on the upper surface of the substrate holder 51 by the lifter 12 (first FIG. 1). The substrate 24 is fixedly held by the substrate holder 51 by being pressed against the pressing roller 54.

第6圖E及第6圖F所示之例子中，基板保持器51具備夾緊機構55。夾緊機構55具有沿與2條臂平行之方向延伸之豎起部份，其一部份以(夾具頭)倒向內側之方式例如彎曲90。。藉由搭載於基板保持器51上之基板24的邊緣被挾持於夾緊機構55，從而基板24保持於基板保持器51。 In the example shown in FIGS. 6E and 6F, the substrate holder 51 is provided with a clamp mechanism 55. The clamping mechanism 55 has a erected portion extending in a direction parallel to the two arms, a portion of which is bent 90 by way of (inwardly) the (clamping head). . The substrate 24 is held by the substrate holder 51 by the edge of the substrate 24 mounted on the substrate holder 51 being held by the clamp mechanism 55.

第6圖A~第6圖F的任一結構例中，基板保持器51在未形成有薄膜圖案之部份與基板24接觸。 In any of the configuration examples of FIGS. 6A to 6F, the substrate holder 51 is in contact with the substrate 24 at a portion where the thin film pattern is not formed.

上述例子中，照射紫外光使基板24的第1面的薄膜圖案正式固化之後，使基板保持器51旋轉來使基板24的表面和背面反轉。亦可在使基板24的表面和背面反轉之後，從Z軸的負向側向基板24的第1面照射紫外光來進行正式固化。並且，亦可同時並行進行基於紫外光照射之正式固化和基板24基於基板保持器51的旋轉之反轉。此時，採用使紫外光源62與基板24的旋轉同步來進行旋轉移動等結構，以便例如預定強度的紫外光照射於旋轉中的基板24的第1面。藉由在使基板24反轉之期間進行正式固化，能夠縮短反轉站4中的處理時間。 In the above example, after the ultraviolet light is irradiated to form the thin film pattern of the first surface of the substrate 24, the substrate holder 51 is rotated to make the substrate 24 The surface and back are reversed. After the surface and the back surface of the substrate 24 are reversed, the first surface of the substrate 24 is irradiated with ultraviolet light from the negative side of the Z-axis to be formally cured. Further, the main curing by the ultraviolet light irradiation and the inversion of the rotation of the substrate 24 based on the substrate holder 51 can be performed in parallel at the same time. At this time, the ultraviolet light source 62 is rotated in synchronization with the rotation of the substrate 24 to perform a rotational movement or the like so that, for example, ultraviolet light of a predetermined intensity is irradiated onto the first surface of the rotating substrate 24. By performing the main curing while the substrate 24 is reversed, the processing time in the inversion station 4 can be shortened.

已進行第1面的薄膜圖案的正式固化及表面和背面的反轉之基板24藉由提昇器13(第1圖)搬送到定位站5(第1圖)。 The substrate 24 on which the thin film pattern of the first surface is completely cured and the front and back surfaces are reversed is transported to the positioning station 5 by the lifter 13 (Fig. 1) (Fig. 1).

定位站5具備與定位站2相同的結構和功能。用CCD攝像機檢測形成於基板24的第1面的相反側的第2面之定位標記，並進行θ補正。並且，由被拍攝之圖像資料計算已完成第1面的薄膜圖案形成之基板24的尺寸，重新生成在基板24的第2面形成薄膜圖案時使用之吐出控制用圖像資料。另外，在定位站5內進行基板24的θ補正。 The positioning station 5 has the same structure and function as the positioning station 2. The positioning mark of the second surface formed on the opposite side of the first surface of the substrate 24 is detected by a CCD camera, and θ is corrected. Then, the size of the substrate 24 on which the thin film pattern of the first surface has been formed is calculated from the image data to be imaged, and the image data for discharge control used when the thin film pattern is formed on the second surface of the substrate 24 is newly generated. Further, θ correction of the substrate 24 is performed in the positioning station 5.

提昇器13(第1圖)將θ補正後的基板24維持其旋轉方向的方向，並搬送至塗佈站6(第1圖)的載物台。 The lifter 13 (Fig. 1) maintains the θ-corrected substrate 24 in the direction of the rotation direction, and transports it to the stage of the coating station 6 (Fig. 1).

塗佈站6具備與塗佈站3相同的結構和功能。塗佈站6中，依據第2面的吐出控制用圖像資料在基板24的第2面形成薄膜圖案。 The coating station 6 has the same structure and function as the coating station 3. In the coating station 6, a film pattern is formed on the second surface of the substrate 24 in accordance with the image data for discharge control on the second surface.

另外，第2面的吐出控制用圖像資料亦能夠依據在第 1級定位站2中取得之圖像資料進行製作。此時，在定位站5中獲得之圖像資料僅使用於例如θ補正。 In addition, the image data for the discharge control of the second surface can also be based on The image data obtained in the level 1 positioning station 2 is produced. At this time, the image data obtained in the positioning station 5 is used only for, for example, θ correction.

由於在定位站5中進行基板24的θ補正，所以在塗佈站6中無需進行θ補正。因此，無需對搬送到塗佈站6之基板24進行旋轉方向的對位，就能夠開始對第2面形成薄膜圖案。藉此，能夠縮短塗佈站6中的處理時間，並能夠謀求節拍時間的縮短、生產效率的提高。 Since the θ correction of the substrate 24 is performed in the positioning station 5, it is not necessary to perform θ correction in the coating station 6. Therefore, it is possible to start forming a thin film pattern on the second surface without aligning the substrate 24 conveyed to the coating station 6 in the rotational direction. Thereby, the processing time in the coating station 6 can be shortened, and the tact time can be shortened and the production efficiency can be improved.

結束對第2面形成薄膜圖案之基板24藉由提昇器14(第1圖)搬送到傳送帶16。藉由對搭載於傳送帶16上之基板24的第2面照射從紫外線照射裝置9射出之紫外線來進行薄膜圖案的正式固化。之後，基板24藉由傳送帶16從搬出入口7搬出至筐體18的外部。 The substrate 24 that has formed the thin film pattern on the second surface is transported to the conveyor belt 16 by the lifter 14 (Fig. 1). The film pattern is completely cured by irradiating the second surface of the substrate 24 mounted on the conveyor belt 16 with the ultraviolet rays emitted from the ultraviolet irradiation device 9. Thereafter, the substrate 24 is carried out from the carry-out port 7 to the outside of the casing 18 by the conveyor belt 16.

在基於實施例1之基板製造裝置中，在塗佈站3(第1圖)中結束對基板24的第1面形成薄膜圖案到使基板24搭載於塗佈站6(第1圖)的載物台為止的期間，在反轉站4中使形成於基板24的第1面之薄膜圖案正式固化。在塗佈站3中形成於基板24的第1面之薄膜圖案不會與任何地方接觸，而在反轉站4中正式固化。 In the substrate manufacturing apparatus according to the first embodiment, in the coating station 3 (first drawing), the formation of the thin film pattern on the first surface of the substrate 24 until the substrate 24 is mounted on the coating station 6 (Fig. 1) is completed. The film pattern formed on the first surface of the substrate 24 is completely cured in the inversion station 4 until the stage is reached. The film pattern formed on the first surface of the substrate 24 in the coating station 3 is not in contact with any place, but is solidified in the reversing station 4.

在薄膜圖案未正式固化之狀態下，薄膜圖案中發生黏附性(黏著性)。若在尚未實現基板24的第1面的薄膜圖案的正式固化之狀態，進行基板24的第2面的薄膜圖案的形成，則例如在基板24基於提昇器13(第1圖)之裝卸時，或塗佈站6中在基板24的第2面形成薄膜圖案時，在第1面的薄膜圖案可能產生瑕疵等痕跡。並且，因黏附性，在各種處理中亦有可能產生不良情況。 Adhesion (adhesion) occurs in the film pattern in a state where the film pattern is not formally cured. When the thin film pattern of the second surface of the substrate 24 is formed in a state where the thin film pattern of the first surface of the substrate 24 is not yet completed, for example, when the substrate 24 is attached or detached by the lifter 13 (Fig. 1), When a film pattern is formed on the second surface of the substrate 24 in the coating station 6, a film or the like may be generated on the film pattern on the first surface. And because Adhesiveness may also cause adverse conditions in various treatments.

結束對基板24的第1面形成薄膜圖案時到使基板24搭載於塗佈站6的載物台為止的期間，使形成於基板24的第1面之薄膜圖案正式固化，藉此能夠防止在基板24的第1面的薄膜圖案上產生瑕疵或痕跡。因此能夠形成高品質的薄膜圖案。 When the film pattern is formed on the first surface of the substrate 24 and the substrate 24 is mounted on the stage of the coating station 6, the film pattern formed on the first surface of the substrate 24 is completely cured, thereby preventing the film pattern from being formed. A flaw or a mark is formed on the film pattern of the first surface of the substrate 24. Therefore, a high quality film pattern can be formed.

另外，藉由從紫外線照射裝置9射出之紫外線進行基板24的第2面的薄膜圖案的正式固化，所以能夠防止搬出筐體18的外部之後，在基板24的第2面的薄膜圖案產生瑕疵或痕跡。 In addition, since the thin film pattern of the second surface of the substrate 24 is completely cured by the ultraviolet light emitted from the ultraviolet irradiation device 9, it is possible to prevent the film pattern on the second surface of the substrate 24 from being generated after the outer casing 18 is carried out. trace.

參閱第1圖，對基於實施例1之基板製造裝置非通常運轉時的動作進行說明。非通常運轉時是指，例如配置於塗佈站3、塗佈站6之液滴吐出裝置的其中一方發生故障時，或進行維修時，只能使用另一方的塗佈站之狀態。 Referring to Fig. 1, an operation when the substrate manufacturing apparatus according to the first embodiment is not normally operated will be described. In the case of the non-normal operation, for example, when one of the droplet discharge devices disposed in the coating station 3 or the coating station 6 fails, or when maintenance is performed, only the other coating station can be used.

對基板製造裝置在第2級塗佈站6的液滴吐出裝置中產生不良情況之期間或進行液滴吐出裝置的維修之期間的動作進行說明。藉由從控制裝置20的控制來實現該動作。 The operation of the substrate manufacturing apparatus during the period in which the droplet discharge device of the second-stage coating station 6 is defective or the period during which the droplet discharge device is repaired will be described. This action is achieved by control from the control device 20.

針對導入筐體18的內部之基板之在定位站2、塗佈站3及反轉站4中的處理與通常運轉時相同。亦即，定位站2中，檢測形成於基板的第1面之定位標記，並依據檢測結果進行基板的θ補正。並且，依據在定位站2中取得之圖像資料計算基板的尺寸，按照掌握之尺寸生成吐出控制用圖像資料。提昇器11以維持基板的旋轉方向的位置 (姿勢)之狀態搬送到塗佈站3的載物台。塗佈站3中，依據吐出控制用圖像資料在基板的第1面形成薄膜圖案。提昇器12從塗佈站3向反轉站4搬送基板。在反轉站4中進行形成於基板的第1面之薄膜圖案的正式固化和表面和背面的反轉。 The processing in the positioning station 2, the coating station 3, and the reversing station 4 for the substrate introduced into the inside of the casing 18 is the same as in the normal operation. That is, the positioning station 2 detects the positioning mark formed on the first surface of the substrate, and performs θ correction of the substrate in accordance with the detection result. Then, the size of the substrate is calculated based on the image data acquired at the positioning station 2, and the image data for discharge control is generated in accordance with the size of the master. The lifter 11 maintains the position of the rotation direction of the substrate The state of (posture) is transported to the stage of the coating station 3. In the coating station 3, a film pattern is formed on the first surface of the substrate in accordance with the image data for discharge control. The lifter 12 transports the substrate from the coating station 3 to the reversing station 4. The final curing of the thin film pattern formed on the first surface of the substrate and the inversion of the front and back surfaces are performed in the inversion station 4.

已進行第1面的薄膜圖案的正式固化及表面和背面的反轉之基板藉由提昇器12或提昇器11搬送到第1級定位站2。定位站2中，藉由CCD攝像機35~38(第2圖A)檢測形成於基板的第2面之定位標記。依據檢測結果進行基板的θ補正。並且，依據藉由CCD攝像機35~38取得之圖像資料計算基板的尺寸，並按照計算出之尺寸生成形成於基板的第2面之薄膜圖案的吐出控制用圖像資料。 The substrate on which the thin film pattern of the first surface is completely cured and the surface and the back surface are reversed is transferred to the first stage positioning station 2 by the lifter 12 or the lifter 11. In the positioning station 2, the positioning marks formed on the second surface of the substrate are detected by the CCD cameras 35 to 38 (Fig. 2A). The θ correction of the substrate is performed based on the detection result. Then, the size of the substrate is calculated based on the image data acquired by the CCD cameras 35 to 38, and the image data for discharge control of the film pattern formed on the second surface of the substrate is generated in accordance with the calculated size.

另外，形成於第2面之薄膜圖案的吐出控制用圖像資料亦能夠依據拍攝到第1面的定位標記之圖像資料生成。此時，基板反轉之後在定位站2中獲得之圖像資料僅使用於θ補正。 Further, the image data for discharge control of the film pattern formed on the second surface can be generated based on the image data of the positioning mark on which the first surface is captured. At this time, the image data obtained in the positioning station 2 after the substrate is reversed is used only for θ correction.

已實施θ補正之基板藉由提昇器11搬送到塗佈站3。 The substrate on which the θ correction has been applied is transported to the coating station 3 by the lifter 11.

塗佈站3中，依據形成於第2面之薄膜圖案的吐出控制用圖像資料，藉由液滴吐出裝置在基板的第2面形成薄膜圖案。 In the coating station 3, a film pattern is formed on the second surface of the substrate by the droplet discharge device in accordance with the image data for discharge control of the film pattern formed on the second surface.

在第2面形成有薄膜圖案之基板藉由提昇器11搬送到傳送帶15。傳送帶15從搬出入口1向筐體18的外部搬出基板。當塗佈站6的液滴吐出裝置故障時或維修時，基板搬出入口1用於基板的搬入及搬出。在載置於傳送帶15 上之狀態下，藉由紫外線照射裝置8對基板的第2面的整個區域照射紫外線來進行形成於第2面之薄膜圖案的正式固化。紫外線照射裝置8能夠在筐體18內移動以通過搭載於傳送帶15之基板的上方，在通過基板的上方之同時對基板的第2面照射紫外線。另外，亦可將紫外線照射裝置8固定性配置於筐體18內，以便在用傳送帶15搬送基板之期間，使基板通過紫外線照射裝置8的下方。藉由控制裝置20控制對基板照射紫外線。 The substrate on which the thin film pattern is formed on the second surface is transported to the conveyor belt 15 by the lifter 11. The conveyor belt 15 carries out the substrate from the carry-out port 1 to the outside of the casing 18. When the droplet discharge device of the coating station 6 fails or is repaired, the substrate carry-out port 1 is used for loading and unloading the substrate. Placed on the conveyor belt 15 In the upper state, the entire region of the second surface of the substrate is irradiated with ultraviolet rays by the ultraviolet irradiation device 8, and the film pattern formed on the second surface is completely cured. The ultraviolet irradiation device 8 is movable in the casing 18 so as to be irradiated with ultraviolet rays on the second surface of the substrate while passing through the substrate above the substrate. Further, the ultraviolet irradiation device 8 may be fixedly disposed in the casing 18 so that the substrate passes through the lower portion of the ultraviolet irradiation device 8 while the substrate is being conveyed by the conveyor belt 15. The substrate is controlled to irradiate ultraviolet rays by the control device 20.

基於實施例1之基板製造裝置中，當塗佈站6的液滴吐出裝置故障時或維修時，利用第1級塗佈站3的液滴吐出裝置在基板的第1面及第2面雙方形成薄膜圖案。這樣，即使是無法使用第2級塗佈站6之狀態，亦能夠使用第1級塗佈站3繼續進行薄膜圖案的形成工作。 In the substrate manufacturing apparatus of the first embodiment, when the droplet discharge device of the coating station 6 fails or is repaired, the droplet discharge device of the first-stage coating station 3 is on both the first surface and the second surface of the substrate. A film pattern is formed. Thus, even in the state in which the second-stage coating station 6 cannot be used, the first-stage coating station 3 can be used to continue the film pattern forming operation.

通常運轉時，各站2~4中同時並行地處理基板，但是當第2級塗佈站6的液滴吐出裝置故障時或維修時，基板並不是同時並行處理，而是按每一片進行處理。例如對1片基板之處理結束，並從筐體18搬出基板之後，其他基板搬入到筐體18內。因此，與通常運轉時相比非通常運轉時，生產效率變低。 In normal operation, the substrates are processed in parallel at the same time in each of the stations 2 to 4, but when the droplet discharge device of the second-stage coating station 6 fails or is repaired, the substrates are not processed in parallel at the same time, but are processed in each piece. . For example, after the processing of one substrate is completed and the substrate is carried out from the casing 18, the other substrates are carried into the casing 18. Therefore, when the operation is not normal compared to the normal operation, the production efficiency is lowered.

根據情況，可以不對第2面形成薄膜圖案就在塗佈站3中結束薄膜圖案的形成之後，利用提昇器11將基板搬送到傳送帶15。結束向第1面的薄膜圖案的形成之後，在反轉站4中進行第1面的薄膜圖案的正式固化，之後，還能夠利用提昇器12或提昇器11將基板搬送到傳送帶15。另外，反轉站4中，不僅進行薄膜圖案的正式固化，還可進行基板的表面和背面的反轉。 In some cases, the substrate can be transported to the conveyor belt 15 by the lifter 11 after the film pattern is formed in the coating station 3 without forming a thin film pattern on the second surface. After the formation of the thin film pattern on the first surface is completed, the thin film pattern of the first surface is completely cured in the reversing station 4, and thereafter, the substrate can be transferred to the transport belt 15 by the lifter 12 or the lifter 11. another Further, in the inversion station 4, not only the actual curing of the thin film pattern but also the inversion of the surface and the back surface of the substrate can be performed.

如上述，當第2級塗佈站6的液滴吐出裝置故障時或維修時，利用第1級塗佈站3的液滴吐出裝置進行薄膜材料的塗佈。當第1級塗佈站3的液滴吐出裝置故障時或維修時，利用第2級塗佈站6的液滴吐出裝置進行薄膜材料的塗佈。 As described above, when the droplet discharge device of the second-stage coating station 6 fails or is repaired, the film material is applied by the droplet discharge device of the first-stage coating station 3. When the droplet discharge device of the first stage coating station 3 fails or is repaired, the film material is applied by the droplet discharge device of the second stage coating station 6.

接著，對基板製造裝置在第1級塗佈站3的液滴吐出裝置中產生不良情況之期間或進行液滴吐出裝置的維修之期間的動作進行說明。 Next, the operation of the substrate manufacturing apparatus during the period in which the droplet discharge device of the first-stage coating station 3 is defective or the period in which the droplet discharge device is repaired will be described.

傳送帶16從搬出入口7向筐體18內搬入基板。基板搬出入口7不僅可以用於搬出基板還用於搬入基板。另外，搬入時，基板的第1面朝向Z軸的正方向。 The conveyor belt 16 carries the substrate into the casing 18 from the carry-out port 7 . The substrate carry-in/out port 7 can be used not only for carrying out a substrate but also for carrying in a substrate. Further, at the time of loading, the first surface of the substrate faces the positive direction of the Z-axis.

導入筐體18的內部之基板藉由提昇器14或提昇器13搬送到定位站5。定位站5中，檢測形成於基板的第1面之定位標記。依據檢測結果進行基板的θ補正。另外，依據在定位站5中取得之圖像資料計算基板的尺寸，並按照計算出之尺寸生成吐出控制用圖像資料。 The substrate introduced into the inside of the casing 18 is transported to the positioning station 5 by the lifter 14 or the lifter 13. In the positioning station 5, the positioning mark formed on the first surface of the substrate is detected. The θ correction of the substrate is performed based on the detection result. Further, the size of the substrate is calculated based on the image data acquired at the positioning station 5, and the image data for discharge control is generated in accordance with the calculated size.

已進行θ補正之基板藉由提昇器13搬送至塗佈站6的載物台。依據生成之吐出控制用圖像資料，在基板的第1面形成薄膜圖案。之後，基板藉由提昇器13搬送到反轉站4，並進行形成於第1面之薄膜圖案的正式固化和表面和背面的反轉。 The substrate on which the θ correction has been performed is transported to the stage of the coating station 6 by the lifter 13. A thin film pattern is formed on the first surface of the substrate in accordance with the generated image data for discharge control. Thereafter, the substrate is transferred to the inversion station 4 by the lifter 13, and the film formation of the first surface is substantially cured and the front and back surfaces are reversed.

第2面朝向Z軸的正方向之狀態的基板藉由提昇器 13再次搬送到定位站5。定位站5中，檢測形成於基板的第2面之定位標記，並依據檢測結果進行基板的θ補正。並且，依據在定位站5中取得之圖像資料計算基板的尺寸，並按照計算出之尺寸生成形成於第2面之薄膜圖案的吐出控制用圖像資料。 The substrate in the state in which the second surface faces the positive direction of the Z axis is raised by the lifter 13 is again transported to the positioning station 5. The positioning station 5 detects the positioning mark formed on the second surface of the substrate, and performs θ correction of the substrate in accordance with the detection result. Then, the size of the substrate is calculated based on the image data acquired at the positioning station 5, and the image data for discharge control formed on the film pattern of the second surface is generated in accordance with the calculated size.

另外，形成於第2面之薄膜圖案的吐出控制用圖像資料亦能夠依據第1面的定位標記的檢測結果進行製作。 Further, the image data for discharge control of the film pattern formed on the second surface can be produced based on the detection result of the positioning mark on the first surface.

已實施θ補正之基板藉由提昇器13搬送至塗佈站6的載物台。 The substrate on which the θ correction has been performed is transported to the stage of the coating station 6 by the lifter 13.

塗佈站6中，依據形成於第2面之薄膜圖案的吐出控制用圖像資料，藉由液滴吐出裝置在第2面形成薄膜圖案。 In the coating station 6, a film pattern is formed on the second surface by the droplet discharge device in accordance with the image data for discharge control of the film pattern formed on the second surface.

在第2面形成有薄膜圖案之基板藉由提昇器14搬送到傳送帶16。傳送帶16從搬出入口7向筐體18的外部搬出基板。在搭載於傳送帶16上之狀態下，藉由紫外線照射裝置9對基板的第2面的整個區域照射紫外線，來進行薄膜圖案的正式固化。 The substrate on which the thin film pattern is formed on the second surface is transported to the conveyor belt 16 by the lifter 14. The conveyor belt 16 carries out the substrate from the carry-out port 7 to the outside of the casing 18. In the state of being mounted on the conveyor belt 16, the entire area of the second surface of the substrate is irradiated with ultraviolet rays by the ultraviolet irradiation device 9, and the film pattern is completely cured.

對1片基板之處理結束，從筐體18搬出基板之後，接著應處理之基板被搬入筐體18內。 After the processing of one substrate is completed, the substrate is carried out from the casing 18, and then the substrate to be processed is carried into the casing 18.

根據情況，可以不對第2面形成薄膜圖案就在塗佈站6中結束第1面的薄膜圖案的形成之後，利用提昇器14將基板搬送到傳送帶16。亦可在第1面的薄膜圖案的形成結束之後，在反轉站4中進行第1面的薄膜圖案的正式固化，之後，用提昇器13或提昇器14將基板搬送到傳送帶 16。另外，反轉站4中，不僅可以進行薄膜圖案的正式固化，還可進行基板的表面和背面的反轉。 In some cases, the formation of the film pattern on the first surface can be completed in the coating station 6 without forming a thin film pattern on the second surface, and then the substrate can be transferred to the conveyor belt 16 by the lifter 14. After the formation of the film pattern on the first surface is completed, the film pattern of the first surface is completely cured in the inversion station 4, and then the substrate is transferred to the conveyor by the lifter 13 or the lifter 14. 16. Further, in the inversion station 4, not only the actual curing of the thin film pattern but also the inversion of the front and back surfaces of the substrate can be performed.

另外，對當塗佈站3、塗佈站6的液滴吐出裝置的其中一方無法使用時，以第1面、第2面的順序形成薄膜圖案之例子進行了說明，但是亦能夠以第2面、第1面的順序形成薄膜圖案。另外，示出了僅在第1面形成薄膜圖案之例子，但亦可僅在第2面形成薄膜圖案。 In addition, when one of the droplet discharge devices of the coating station 3 and the coating station 6 is not usable, an example in which the film pattern is formed in the order of the first surface and the second surface has been described. However, the second pattern can also be used. The film pattern is formed in the order of the surface and the first surface. Further, although an example in which a thin film pattern is formed only on the first surface is shown, a thin film pattern may be formed only on the second surface.

基於實施例1之基板製造裝置中，當第2級塗佈站6的液滴吐出裝置故障時或維修時，利用第1級塗佈站3的液滴吐出裝置進行薄膜材料的塗佈，當第1級塗佈站3的液滴吐出裝置故障時或維修時，利用第2級塗佈站6的液滴吐出裝置進行薄膜材料的塗佈。因此，基於實施例1之基板製造裝置的工作連續性優異。 In the substrate manufacturing apparatus of the first embodiment, when the droplet discharge device of the second-stage coating station 6 fails or is repaired, the film material is applied by the droplet discharge device of the first-stage coating station 3, and when When the droplet discharge device of the first stage coating station 3 fails or is repaired, the film material is applied by the droplet discharge device of the second stage coating station 6. Therefore, the substrate manufacturing apparatus according to the first embodiment is excellent in work continuity.

[實施例2] [Embodiment 2]

第7圖中示出基於實施例2之基板製造裝置的概要圖。以下，對與實施例1的不同點進行說明，而對相同的結構省略說明。實施例2中，定位站2、定位站5不包括用於進行θ補正之定位裝置。代替此，塗佈站3、塗佈站6的液滴吐出裝置包括θ載物台49及CCD攝像機63~66。 Fig. 7 is a schematic view showing a substrate manufacturing apparatus according to the second embodiment. Hereinafter, differences from the first embodiment will be described, and the description of the same configurations will be omitted. In the second embodiment, the positioning station 2 and the positioning station 5 do not include a positioning device for performing θ correction. Instead of this, the droplet discharge device of the coating station 3 and the coating station 6 includes a θ stage 49 and CCD cameras 63 to 66.

對基於實施例2之基板製造裝置的通常運轉時的動作進行說明。 The operation at the time of normal operation of the substrate manufacturing apparatus according to the second embodiment will be described.

實施例2的定位站2、定位站5中配置進行未伴隨θ 補正之簡單定位之定位裝置亦即臨時設置載物台48。基板21~27藉由提昇器11、提昇器13搭載於定位站2、定位站5的臨時設置載物台48上。基板21~27被實施向固定銷緊壓等簡單定位之後，搬送到塗佈站3、塗佈站6。 The positioning station 2 of the second embodiment 2 is arranged in the positioning station 5 without θ The positioning device that corrects the simple positioning also temporarily sets the stage 48. The substrates 21 to 27 are mounted on the temporary setting stage 48 of the positioning station 2 and the positioning station 5 by the lifter 11 and the lifter 13. The substrates 21 to 27 are simply positioned to be pressed by a fixing pin or the like, and then transported to the coating station 3 and the coating station 6.

塗佈站3、塗佈站6的液滴吐出裝置在Y載物台44與卡盤板45之間包括θ載物台49。θ載物台49能夠使保持於卡盤板45之基板21~27以與Z軸平行之直線為旋轉中心進行旋轉。液滴吐出裝置包括檢測形成於朝向基板21~27的上方之面之定位標記之CCD攝像機63~66。 The droplet discharge device of the coating station 3 and the coating station 6 includes a θ stage 49 between the Y stage 44 and the chuck plate 45. The θ stage 49 can rotate the substrates 21 to 27 held by the chuck plate 45 with a straight line parallel to the Z axis as a center of rotation. The droplet discharge device includes CCD cameras 63 to 66 that detect positioning marks formed on the faces above the substrates 21 to 27.

搬送到塗佈站3、塗佈站6之基板21~27吸附保持於卡盤板45，藉由CCD攝像機63~66檢測朝向上方之面的定位標記。檢測結果、亦即被拍攝之圖像資料發送到控制裝置20。 The substrates 21 to 27 transported to the coating station 3 and the coating station 6 are sucked and held by the chuck plate 45, and the positioning marks of the upward facing surface are detected by the CCD cameras 63 to 66. The detection result, that is, the image data to be captured is transmitted to the control device 20.

控制裝置20分析檢測結果，並計算基板21~27的X及Y方向的位置及旋轉方向的位置(姿勢)。依據計算出之結果，藉由驅動θ載物台49進行基板21~27的θ補正。另外，控制裝置20依據CCD攝像機63~66的檢測結果計算基板21~27的尺寸，並按照計算出之尺寸生成吐出控制用圖像資料。 The control device 20 analyzes the detection result, and calculates the position in the X and Y directions of the substrates 21 to 27 and the position (posture) in the rotational direction. Based on the calculated result, θ correction of the substrates 21 to 27 is performed by driving the θ stage 49. Further, the control device 20 calculates the sizes of the substrates 21 to 27 based on the detection results of the CCD cameras 63 to 66, and generates image data for discharge control in accordance with the calculated size.

基於實施例2之基板製造裝置中，不在定位站2、定位站5中進行基板21~27的θ補正，而是在塗佈站3、塗佈站6中進行基板21~27的θ補正。另外，依據生成之吐出控制用圖像資料在基板21~27形成薄膜圖案。 In the substrate manufacturing apparatus of the second embodiment, the θ correction of the substrates 21 to 27 is not performed in the positioning station 2 and the positioning station 5, but the θ correction of the substrates 21 to 27 is performed in the coating station 3 and the coating station 6. Further, a thin film pattern is formed on the substrates 21 to 27 in accordance with the generated image data for discharge control.

關於基於實施例2之基板製造裝置非通常運轉時的動作，以與實施例1不同點為重點進行說明。 The movement of the substrate manufacturing apparatus according to the second embodiment when it is not normally operated The description will be focused on differences from the first embodiment.

當因第2級塗佈站6的液滴吐出裝置故障或維修而無法使用時，藉由控制裝置20如下控制基於實施例2之基板製造裝置的動作。 When the droplet discharge device of the second stage coating station 6 fails or is repaired, the operation of the substrate manufacturing apparatus according to the second embodiment is controlled by the control device 20 as follows.

從搬出入口1導入筐體18的內部之基板搭載於定位站2的臨時設置載物台48上，被實施簡單定位。之後，從定位站2搬送至塗佈站3的卡盤板45。 The substrate introduced into the inside of the casing 18 from the loading/unloading port 1 is mounted on the temporary setting stage 48 of the positioning station 2, and is simply positioned. Thereafter, it is transported from the positioning station 2 to the chuck plate 45 of the coating station 3.

基板吸附保持於卡盤板45，藉由CCD攝像機63~66檢測第1面的定位標記。檢測結果發送到控制裝置20。控制裝置20分析檢測結果，並檢測基板的位置及旋轉方向的姿勢。依據檢測結果進行基板的θ補正。並且，控制裝置20依據CCD攝像機63~66的檢測結果計算基板的尺寸，並按照計算出之尺寸生成吐出控制用圖像資料。之後，依據生成之吐出控制用圖像資料在基板的第1面形成薄膜圖案。 The substrate is adsorbed and held on the chuck plate 45, and the positioning marks of the first surface are detected by the CCD cameras 63 to 66. The detection result is sent to the control device 20. The control device 20 analyzes the detection result and detects the position of the substrate and the posture in the rotation direction. The θ correction of the substrate is performed based on the detection result. Further, the control device 20 calculates the size of the substrate based on the detection results of the CCD cameras 63 to 66, and generates image data for discharge control in accordance with the calculated size. Thereafter, a thin film pattern is formed on the first surface of the substrate in accordance with the generated image data for discharge control.

基板藉由提昇器12搬送到反轉站4，並進行形成於基板的第1面之薄膜圖案的正式固化及表面和背面的反轉。之後，藉由搭載於定位站2的臨時設置載物台48來進行簡單定位。進行簡單定位之後，再次返回到塗佈站3的液滴吐出裝置的卡盤板45上。 The substrate is transported to the inversion station 4 by the lifter 12, and the film pattern formed on the first surface of the substrate is completely cured and the front and back surfaces are reversed. Thereafter, the positioning is performed by the temporary setting stage 48 mounted on the positioning station 2. After the simple positioning is performed, it is returned to the chuck plate 45 of the droplet discharge device of the coating station 3 again.

塗佈站3中，藉由CCD攝像機63~66檢測形成於基板的第2面之定位標記，並依據檢測結果進行基板的θ補正。另外，依據藉由CCD攝像機63~66取得之圖像資料計算基板的尺寸，並按照計算出之尺寸生成形成於基板的第2面之薄膜圖案的吐出控制用圖像資料。依據形成於第2面之薄膜圖案的吐出控制用圖像資料在基板的第2面形成薄膜圖案。 In the coating station 3, the positioning marks formed on the second surface of the substrate are detected by the CCD cameras 63 to 66, and the θ correction of the substrate is performed based on the detection result. In addition, the size of the substrate is calculated based on the image data obtained by the CCD cameras 63-66, and the formed size is formed on the substrate according to the calculated size. Image data for discharge control of the film pattern of the second surface. A film pattern is formed on the second surface of the substrate in accordance with the image data for discharge control formed on the film pattern of the second surface.

在第2面形成有薄膜圖案之基板搬送到傳送帶15，並藉由紫外線照射裝置8進行第2面的薄膜圖案的正式固化。之後，傳送帶5從搬出入口1向筐體18的外部搬出基板。 The substrate on which the thin film pattern is formed on the second surface is transferred to the conveyor belt 15, and the film pattern of the second surface is completely cured by the ultraviolet irradiation device 8. Thereafter, the conveyor belt 5 carries out the substrate from the carry-out port 1 to the outside of the casing 18.

當無法使用第1級塗佈站3的液滴吐出裝置時，基板製造裝置藉由控制裝置20控制成如下。 When the droplet discharge device of the first stage coating station 3 cannot be used, the substrate manufacturing apparatus is controlled by the control device 20 as follows.

基板從搬出入口7導入筐體18的內部。導入筐體18內之基板藉由提昇器14、提昇器13搬送至定位站5的臨時設置載物台48，並進行簡單定位。之後，從定位站5搬送至塗佈站6的液滴吐出裝置的卡盤板45。 The substrate is introduced into the interior of the casing 18 from the carry-out port 7 . The substrate introduced into the casing 18 is transported to the temporary setting stage 48 of the positioning station 5 by the lifter 14 and the lifter 13, and is simply positioned. Thereafter, it is transported from the positioning station 5 to the chuck plate 45 of the droplet discharge device of the coating station 6.

藉由CCD攝像機63~66檢測吸附保持於卡盤板45之基板的第1面的定位標記，檢測結果發送到控制裝置20。控制裝置20分析檢測結果，檢測基板的位置及旋轉方向的姿勢，並進行θ補正。另外，控制裝置20依據CCD攝像機63~66的檢測結果計算基板的尺寸，並按照計算出之尺寸生成吐出控制用圖像資料。之後，依據生成之吐出控制用圖像資料在基板的第1面形成薄膜圖案。 The positioning marks of the first surface of the substrate held by the chuck plate 45 are detected by the CCD cameras 63 to 66, and the detection result is transmitted to the control device 20. The control device 20 analyzes the detection result, detects the position of the substrate, and the posture in the rotation direction, and performs θ correction. Further, the control device 20 calculates the size of the substrate based on the detection results of the CCD cameras 63 to 66, and generates image data for discharge control in accordance with the calculated size. Thereafter, a thin film pattern is formed on the first surface of the substrate in accordance with the generated image data for discharge control.

在第1面形成有薄膜圖案之基板藉由提昇器13搬送到反轉站4，並進行形成於第1面之薄膜圖案的正式固化及表面和背面的反轉。之後，在定位站5的臨時設置載物台48上進行簡單定位，再次返回到塗佈站6的液滴吐出裝置的卡盤板45上。 The substrate on which the thin film pattern is formed on the first surface is transported to the reversing station 4 by the lifter 13, and the main film formed on the first surface is solidified and the front and back surfaces are reversed. Thereafter, simple positioning is performed on the temporary setting stage 48 of the positioning station 5, and the droplet discharge to the coating station 6 is again returned. On the chuck plate 45 of the device.

塗佈站6中，藉由CCD攝像機63~66檢測形成於基板的第2面之定位標記，並依據檢測結果進行基板的θ補正。另外，依據藉由CCD攝像機63~66取得之圖像資料計算基板的尺寸，並按照計算出之尺寸生成形成於基板的第2面之薄膜圖案的吐出控制用圖像資料。依據形成於第2面之薄膜圖案的吐出控制用圖像資料在第2面形成薄膜圖案。 In the coating station 6, the positioning marks formed on the second surface of the substrate are detected by the CCD cameras 63 to 66, and the θ correction of the substrate is performed based on the detection result. Further, the size of the substrate is calculated based on the image data acquired by the CCD cameras 63 to 66, and the image data for discharge control of the film pattern formed on the second surface of the substrate is generated in accordance with the calculated size. A film pattern is formed on the second surface in accordance with the image data for discharge control formed on the film pattern of the second surface.

在第2面形成有薄膜圖案之基板搬送到傳送帶16，藉由紫外線照射裝置9進行第2面的薄膜圖案的正式固化。正式固化之後的基板從搬出入口7搬出至筐體18的外部。 The substrate on which the thin film pattern is formed on the second surface is transferred to the conveyor belt 16, and the film pattern of the second surface is completely cured by the ultraviolet irradiation device 9. The substrate after the main curing is carried out from the carry-out port 7 to the outside of the casing 18.

基於實施例2之基板製造裝置中，當無法使用塗佈站3、塗佈站6的液滴吐出裝置的其中一方時，亦能夠利用另一方的塗佈站形成薄膜圖案。藉此，能夠確保工作的連續性。 In the substrate manufacturing apparatus of the second embodiment, when one of the droplet discharge devices of the coating station 3 and the coating station 6 cannot be used, the film pattern can be formed by the other coating station. Thereby, the continuity of the work can be ensured.

[實施例3] [Example 3]

第8圖中示出基於實施例3之基板製造裝置的概要圖。以下，對與實施例1的不同點進行說明，而對相同的結構省略說明。實施例3不包括紫外線照射裝置8(第1圖)及反轉站4具備基板搬出口17，在這方面與實施例1不同。基於實施例3之基板製造裝置通常運轉時的動作與實施例1的基板製造裝置通常運轉時的動作相同。非通常運轉時，基於實施例3的基板製造裝置在基板的單面例如第1面形成薄膜圖案。 Fig. 8 is a schematic view showing a substrate manufacturing apparatus according to a third embodiment. Hereinafter, differences from the first embodiment will be described, and the description of the same configurations will be omitted. The third embodiment does not include the ultraviolet irradiation device 8 (first drawing) and the reversing station 4 includes the substrate carrying port 17, and is different from the first embodiment in this respect. The operation of the substrate manufacturing apparatus according to the third embodiment in the normal operation is the same as the operation in the normal operation of the substrate manufacturing apparatus of the first embodiment. Unusual During the operation, the substrate manufacturing apparatus according to the third embodiment forms a thin film pattern on one surface of the substrate, for example, the first surface.

第2級塗佈站6的液滴吐出裝置故障時或維修時，基於實施例3之基板製造裝置藉由控制裝置20控制成如下。 When the droplet discharge device of the second-stage coating station 6 fails or is repaired, the substrate manufacturing apparatus according to the third embodiment is controlled by the control device 20 as follows.

針對導入筐體18的內部之基板21~24之定位站2、塗佈站3及反轉站4中的處理與通常運轉時的處理相同。 The processing in the positioning station 2, the coating station 3, and the reversing station 4 of the substrates 21 to 24 introduced into the inside of the casing 18 is the same as the processing in the normal operation.

已進行形成於第1面之薄膜圖案的正式固化及表面和背面的反轉之基板21~24從基板搬出口17搬出至筐體18的外部。搬出可利用傳送帶進行，亦可人工進行。 The substrates 21 to 24 which have been subjected to the main curing of the thin film pattern formed on the first surface and the reverse of the front and back surfaces are carried out from the substrate carry-out port 17 to the outside of the casing 18. The removal can be carried out using a conveyor belt or manually.

另外，關於搬送到反轉站4之基板21~24，亦可不進行形成於表面之薄膜圖案的正式固化及基板反轉的其中一方或雙方，就從基板搬出口17搬出基板21~24。 Further, the substrates 21 to 24 transported to the inversion station 4 may be carried out from the substrate unloading port 17 without ejecting one or both of the main curing of the thin film pattern formed on the surface and the substrate reversal.

實施例1中，當無法使用塗佈站6的液滴吐出裝置時，結束對1片基板之處理並從筐體18搬出基板之後，將其他基板搬入筐體18內。實施例3中，能夠在各站2~4中同時並行進行基板的處理。因此，即使在無法使用塗佈站6的液滴吐出裝置之情況下，亦能夠維持較高的生產效率。 In the first embodiment, when the droplet discharge device of the coating station 6 cannot be used, the processing of one substrate is completed, and the substrate is carried out from the casing 18, and then the other substrate is carried into the casing 18. In the third embodiment, the processing of the substrate can be simultaneously performed in parallel in each of the stations 2 to 4. Therefore, even in the case where the droplet discharge device of the coating station 6 cannot be used, high production efficiency can be maintained.

當塗佈站3的液滴吐出裝置故障時或維修時，利用塗佈站6的液滴吐出裝置，藉由控制裝置20的控制同樣地在基板單面例如基板第1面形成薄膜圖案。 When the droplet discharge device of the coating station 3 fails or is repaired, the droplet discharge device of the coating station 6 performs a film pattern on the single surface of the substrate, for example, the first surface of the substrate by the control of the control device 20.

基板被傳送帶16搬送，從搬出入口7導入筐體18內。導入筐體18的內部之基板藉由提昇器14、提昇器13 搬送到定位站5。在定位站5中進行基板的θ補正。另外，依據在定位站5中取得之圖像資料計算基板的尺寸，並按照計算出之尺寸生成形成於第1面之薄膜圖案的吐出控制用圖像資料。 The substrate is transported by the conveyor belt 16 and introduced into the casing 18 from the carry-out port 7 . The substrate introduced into the interior of the housing 18 is supported by the lifter 14 and the lifter 13 Moved to the positioning station 5. The θ correction of the substrate is performed in the positioning station 5. Further, the size of the substrate is calculated based on the image data acquired at the positioning station 5, and the image data for discharge control formed on the film pattern of the first surface is generated in accordance with the calculated size.

提昇器13將θ補正後的基板從定位站5搬送至塗佈站6的載物臺上。依據生成之吐出控制用圖像資料在第1面形成薄膜圖案。基板藉由提昇器13搬送到反轉站4，並進行形成於第1面之薄膜圖案的正式固化和表面和背面的反轉。之後，基板從搬出口17例如藉由傳送帶或人工搬出至筐體18的外部。 The lifter 13 transports the θ-corrected substrate from the positioning station 5 to the stage of the coating station 6. A thin film pattern is formed on the first surface in accordance with the generated image data for discharge control. The substrate is transported to the inversion station 4 by the lifter 13, and the film formation on the first surface is completely cured and the front and back surfaces are reversed. Thereafter, the substrate is carried out from the delivery port 17 to the outside of the casing 18 by, for example, a conveyor belt or manually.

將基板搬送到反轉站4之後，亦可不進行薄膜圖案的正式固化及基板反轉的其中一方或雙方，就從搬出口17搬出。 After the substrate is transferred to the reversing station 4, one or both of the main curing of the film pattern and the substrate reversal may be carried out from the unloading port 17.

實施例3中，即使在無法使用塗佈站3的液滴吐出裝置的情況下，亦能夠在反轉站4中進行阻焊抗蝕劑的正式固化和基板的反轉期間，能夠進行定位站5中的定位或塗佈站6中的薄膜材料的塗佈。因此，實施例1中，比無法使用塗佈站3的液滴吐出裝置之情況，更能夠提高生產效率。 In the third embodiment, even when the droplet discharge device of the coating station 3 cannot be used, it is possible to perform the positioning of the solder resist resist and the substrate inversion in the inversion station 4, and the positioning station can be performed. The positioning in 5 or the coating of the film material in the coating station 6. Therefore, in the first embodiment, the production efficiency can be improved more than in the case where the droplet discharge device of the coating station 3 cannot be used.

基於實施例3之基板製造裝置當無法使用塗佈站3、塗佈站6的液滴吐出裝置的其中一方時，利用另一方的塗佈站對基板單面形成薄膜圖案，並將完成單面處理之基板從搬出口17搬出至筐體18的外部。因此，基於實施例3之基板製造裝置亦能夠在塗佈站故障時繼續進行工作。另外，搬出口17能夠使基板從連結塗佈站3和塗佈站6之基板搬送路徑取出至基板製造裝置的外部(筐體18的外部)。 In the substrate manufacturing apparatus of the third embodiment, when one of the droplet discharge devices of the coating station 3 and the coating station 6 cannot be used, a film pattern is formed on one surface of the substrate by the other coating station, and one side is completed. The processed substrate is carried out from the carry-out port 17 to the outside of the casing 18. Therefore, the substrate manufacturing apparatus based on Embodiment 3 can also continue to operate when the coating station fails. another In addition, the transfer port 17 can take out the substrate from the substrate transfer path connecting the coating station 3 and the coating station 6 to the outside of the substrate manufacturing apparatus (outside of the casing 18).

[實施例4] [Example 4]

第9圖中示出基於實施例4之基板製造裝置的概要圖。以下，對與實施例2的不同點進行說明，而對相同的結構省略說明。實施例4不包括紫外線照射裝置8(第7圖)及反轉站4具備基板搬出口17，在這方面與實施例2不同。基於實施例4之基板製造裝置通常運轉時的動作與實施例2的基板製造裝置通常運轉時的動作相同。非通常運轉時，基於實施例4之基板製造裝置與實施例3同樣地僅在基板的單面例如第1面形成薄膜圖案。 Fig. 9 is a schematic view showing a substrate manufacturing apparatus according to a fourth embodiment. Hereinafter, differences from the second embodiment will be described, and the description of the same configurations will be omitted. The fourth embodiment does not include the ultraviolet irradiation device 8 (Fig. 7) and the reversing station 4 includes the substrate carrying port 17, which is different from the second embodiment. The operation of the substrate manufacturing apparatus according to the fourth embodiment in the normal operation is the same as the operation in the normal operation of the substrate manufacturing apparatus of the second embodiment. In the non-normal operation, the substrate manufacturing apparatus according to the fourth embodiment forms a thin film pattern on only one surface of the substrate, for example, the first surface, in the same manner as in the third embodiment.

當塗佈站6的液滴吐出裝置故障時或維修時，基於實施例4之基板製造裝置藉由控制裝置20控制成如下。 When the droplet discharge device of the coating station 6 fails or is repaired, the substrate manufacturing apparatus according to Embodiment 4 is controlled by the control device 20 as follows.

針對導入筐體18的內部之基板21~24之在定位站2、塗佈站3及反轉站4中的處理與通常運轉時相同。 The processing in the positioning station 2, the coating station 3, and the reversing station 4 of the substrates 21 to 24 introduced into the inside of the casing 18 is the same as in the normal operation.

已進行形成於第1面之薄膜圖案的正式固化及表面和背面的反轉之基板21~24從搬出口17搬出至筐體18的外部。搬出可利用傳送帶進行，亦可人工進行。 The substrates 21 to 24 which have been subjected to the main curing of the film pattern formed on the first surface and the reverse of the front and back surfaces are carried out from the carry-out port 17 to the outside of the casing 18. The removal can be carried out using a conveyor belt or manually.

另外，亦可不進行形成於搬送到反轉站4之基板21~24的第1面之薄膜圖案的正式固化及基板反轉的其中一方或雙方，就從搬出口17搬出。 In addition, one or both of the main curing and the substrate reversal of the film pattern formed on the first surface of the substrates 21 to 24 transferred to the inversion station 4 may be carried out from the delivery port 17.

實施例2中，當無法使用塗佈站6的液滴吐出裝置時，結束對1片基板之處理，從筐體18搬出基板之後，將其他基板搬入筐體18。實施例4中，能夠在各站2~4中同時並行進行基板的處理。因此，即使在無法使用塗佈站6的液滴吐出裝置之情況下，亦能夠維持較高的生產效率。 In the second embodiment, when the droplet discharge device of the coating station 6 cannot be used When the processing of one substrate is completed, the substrate is carried out from the casing 18, and then the other substrate is carried into the casing 18. In the fourth embodiment, the processing of the substrate can be simultaneously performed in parallel in each of the stations 2 to 4. Therefore, even in the case where the droplet discharge device of the coating station 6 cannot be used, high production efficiency can be maintained.

當第1級塗佈站3的液滴吐出裝置故障時或維修時，利用塗佈站6的液滴吐出裝置，藉由控制裝置20的控制同樣地在基板單面例如第1面形成薄膜圖案。 When the droplet discharge device of the first-stage coating station 3 fails or is repaired, the droplet discharge device of the coating station 6 forms a thin film pattern on the single surface of the substrate, for example, on the first surface by the control of the control device 20. .

基板被傳送帶16搬送，從搬出入口7導入筐體18內。導入筐體18的內部之基板藉由提昇器14、提昇器13搬送到定位站5，並進行簡單定位。之後，基板搬送至塗佈站6的液滴吐出裝置的卡盤板45。塗佈站6中，藉由CCD攝像機63~66檢測基板的第1面的定位標記。控制裝置20依據檢測結果檢測基板21~24的位置及旋轉方向的姿勢，並進行基板的θ補正。另外，控制裝置20計算基板的尺寸，並按照計算出之尺寸生成吐出控制用圖像資料。之後，依據生成之吐出控制用圖像資料在基板的第1面形成薄膜圖案。形成有薄膜圖案之基板藉由提昇器13搬送到反轉站4，並進行形成於第1面之薄膜圖案的正式固化及表面和背面的反轉。之後，基板從搬出口17藉由例如傳送帶或人工搬出至筐體18的外部。 The substrate is transported by the conveyor belt 16 and introduced into the casing 18 from the carry-out port 7 . The substrate introduced into the inside of the casing 18 is transported to the positioning station 5 by the lifter 14 and the lifter 13, and is simply positioned. Thereafter, the substrate is transferred to the chuck plate 45 of the droplet discharge device of the coating station 6. In the coating station 6, the positioning marks of the first surface of the substrate are detected by the CCD cameras 63 to 66. The control device 20 detects the position of the substrates 21 to 24 and the posture in the rotation direction based on the detection result, and performs θ correction of the substrate. Moreover, the control device 20 calculates the size of the substrate, and generates image data for discharge control in accordance with the calculated size. Thereafter, a thin film pattern is formed on the first surface of the substrate in accordance with the generated image data for discharge control. The substrate on which the thin film pattern is formed is transported to the inversion station 4 by the lifter 13, and the film formation formed on the first surface is completely cured and the front and back surfaces are reversed. Thereafter, the substrate is carried out from the delivery port 17 to the outside of the casing 18 by, for example, a conveyor belt or manually.

與無法使用第2級塗佈站6的液滴吐出裝置時同樣地，在反轉站4中亦可以不進行薄膜圖案的正式固化及基板反轉的其中一方或雙方就從搬出口17搬出基板。 In the same manner as in the case of the droplet discharge device in which the second-stage coating station 6 cannot be used, the substrate 4 may be unloaded from the delivery port 17 without performing the main curing of the thin film pattern or the substrate reversal. .

實施例4中，即使在無法使用第1級塗佈站3的液滴吐出裝置之情況下，亦能夠在反轉站4進行薄膜圖案的正式固化及基板反轉之期間，進行定位站5中的定位或塗佈站6中的薄膜材料的塗佈。因此，實施例2中，比無法使用塗佈站3的液滴吐出裝置之情況，更能夠提高生產效率。 In the fourth embodiment, even when the liquid droplet discharging device of the first-stage coating station 3 cannot be used, the positioning station 5 can be performed while the reversing station 4 performs the main curing of the thin film pattern and the substrate inversion. The positioning or coating of the film material in the coating station 6. Therefore, in the second embodiment, the production efficiency can be improved more than in the case where the droplet discharge device of the coating station 3 cannot be used.

基於實施例4之基板製造裝置亦與實施例3同樣地，當無法使用塗佈站3、塗佈站6的液滴吐出裝置的其中一方時，利用另一方的塗佈站在基板單面形成薄膜圖案。將單面形成有薄膜圖案之基板從搬出口17搬出至基板製造裝置的外部(筐體18的外部)。基於實施例4之基板製造裝置亦能夠在塗佈站故障時繼續進行工作。 In the substrate manufacturing apparatus of the fourth embodiment, similarly to the third embodiment, when one of the droplet discharge devices of the coating station 3 and the coating station 6 cannot be used, the other coating station is formed on one side of the substrate. Film pattern. The substrate on which the thin film pattern is formed on one side is carried out from the carry-out port 17 to the outside of the substrate manufacturing apparatus (outside of the casing 18). The substrate manufacturing apparatus based on Embodiment 4 can also continue to operate when the coating station fails.

[實施例5] [Example 5]

第10圖中示出基於實施例5之基板製造裝置的概要圖。以下，對與實施例1的不同點進行說明，而對相同的結構省略說明。實施例5不包括第1圖所示之定位站5、塗佈站6、紫外線照射裝置9、提昇器13、提昇器14及傳送帶16，在這方面與實施例1不同。並且，基於實施例5之基板製造裝置中，筐體18不具備基板搬出入口7(第1圖)。另外，基於控制裝置20之控制的內容與實施例1不同。基於實施例5之基板製造裝置中，當無法使用基於實施例1之基板製造裝置的塗佈站6的液滴吐出裝置時，以與在基板的兩面形成薄膜圖案之順序相同的順序在基板的兩面形成薄膜圖案。 Fig. 10 is a schematic view showing a substrate manufacturing apparatus according to a fifth embodiment. Hereinafter, differences from the first embodiment will be described, and the description of the same configurations will be omitted. The fifth embodiment does not include the positioning station 5, the coating station 6, the ultraviolet irradiation device 9, the lifter 13, the lifter 14, and the conveyor belt 16 shown in Fig. 1, and is different from the first embodiment in this respect. Further, in the substrate manufacturing apparatus of the fifth embodiment, the casing 18 does not include the substrate carry-in/out port 7 (first drawing). Further, the content based on the control of the control device 20 is different from that of the first embodiment. In the substrate manufacturing apparatus of the fifth embodiment, when the droplet discharge device of the coating station 6 based on the substrate manufacturing apparatus of the first embodiment cannot be used, the substrate is in the same order as the order of forming the thin film pattern on both surfaces of the substrate. The two sides form a thin film pattern.

基板21被傳送帶15搬送，從搬出入口1導入筐體18內。基板21的第1面朝上方(Z軸的正方向)。基板21被提昇器11從傳送帶15搬送到定位站2。 The substrate 21 is transported by the conveyor belt 15 and introduced into the casing 18 from the carry-out port 1 . The first surface of the substrate 21 faces upward (the positive direction of the Z axis). The substrate 21 is transported from the conveyor belt 15 to the positioning station 2 by the lifter 11.

定位站2中，檢測形成於基板21的第1面之定位標記。依據檢測結果進行基板21的θ補正。並且，依據在定位站2中取得之圖像資料計算基板21的尺寸，並按照計算出之尺寸生成吐出控制用圖像資料。 In the positioning station 2, the positioning mark formed on the first surface of the substrate 21 is detected. The θ correction of the substrate 21 is performed based on the detection result. Then, the size of the substrate 21 is calculated based on the image data acquired at the positioning station 2, and the image data for discharge control is generated in accordance with the calculated size.

已進行θ補正之基板21藉由提昇器11搬送到塗佈站3。在塗佈站3中不進行θ補正就在基板21的第1面依據吐出控制用圖像資料形成薄膜圖案。 The substrate 21 on which the θ correction has been performed is transported to the coating station 3 by the lifter 11. In the coating station 3, the film pattern is formed on the first surface of the substrate 21 in accordance with the image data for discharge control without performing θ correction.

形成有薄膜圖案之基板21藉由提昇器12搬送至反轉站4。反轉站4中進行形成於基板21的第1面之薄膜圖案的正式固化及基板21的反轉。 The substrate 21 on which the thin film pattern is formed is transported to the reversing station 4 by the lifter 12. The inversion station 4 performs the main curing of the thin film pattern formed on the first surface of the substrate 21 and the inversion of the substrate 21.

被反轉之基板21藉由提昇器12、提昇器11搬送到定位站2。定位站2中檢測形成於基板21的第2面之定位標記，並依據檢測結果進行基板21的θ補正。另外，依據藉由CCD攝像機35~38取得之圖像資料計算基板21的尺寸，並按照計算出之尺寸生成形成於基板的第2面之薄膜圖案的吐出控制用圖像資料。 The inverted substrate 21 is transported to the positioning station 2 by the lifter 12 and the lifter 11. The positioning station 2 detects the positioning mark formed on the second surface of the substrate 21, and performs θ correction of the substrate 21 in accordance with the detection result. Further, the size of the substrate 21 is calculated based on the image data acquired by the CCD cameras 35 to 38, and the image data for discharge control of the film pattern formed on the second surface of the substrate is generated in accordance with the calculated size.

另外，亦可在形成於第2面之薄膜圖案的吐出控制用圖像資料的生成中利用基板21的第1面的定位標記的檢測結果。此時，基板21的第2面的定位標記的拍攝結果僅使用於θ補正。 In addition, the detection result of the positioning mark of the first surface of the substrate 21 can be used in the generation of the image data for discharge control formed on the film pattern of the second surface. At this time, the imaging result of the positioning mark of the second surface of the substrate 21 is used only for θ correction.

已實施θ補正之基板21藉由提昇器11搬送到塗佈站3。 The substrate 21 on which the θ correction has been applied is transported to the coating station 3 by the lifter 11.

塗佈站3中不進行θ補正就依據形成於基板21的第2面之薄膜圖案的吐出控制用圖像資料藉由液滴吐出裝置在基板21的第2面形成薄膜圖案。 In the coating station 3, the thin film pattern is formed on the second surface of the substrate 21 by the droplet discharge device in accordance with the image data for discharge control of the film pattern formed on the second surface of the substrate 21 without the θ correction.

在第2面形成有薄膜圖案之基板21藉由提昇器11搬送到傳送帶15，並藉由照射來自紫外線照射裝置8的紫外線來進行第2面的薄膜圖案的正式固化。傳送帶15將基板21從搬出入口1搬出至筐體18的外部。 The substrate 21 on which the thin film pattern is formed on the second surface is transported to the conveyor belt 15 by the lifter 11, and the ultraviolet ray from the ultraviolet ray irradiation device 8 is irradiated to form the main film of the second surface. The conveyor belt 15 carries the substrate 21 from the carry-out port 1 to the outside of the casing 18.

與基於實施例1之基板製造裝置相比，基於實施例5之基板製造裝置的結構較簡單，能夠謀求裝置的低成本化。 The substrate manufacturing apparatus according to the fifth embodiment has a simpler structure than the substrate manufacturing apparatus according to the first embodiment, and can reduce the cost of the apparatus.

[實施例6] [Embodiment 6]

第11圖中示出基於實施例6之基板製造裝置的概要圖。以下，對與實施例2的不同點進行說明，而對相同的結構省略說明。實施例6不包括第7圖所示之定位站5、塗佈站6、紫外線照射裝置9、提昇器13、提昇器14及傳送帶16，在這方面與實施例2不同。並且，基於實施例6之基板製造裝置中，筐體18不具備基板搬出入口7。另外，基於控制裝置20的控制內容與實施例2不同。基於實施例6之基板製造裝置中，當無法使用基於實施例2之基板製造裝置的塗佈站6的液滴吐出裝置時，以與在基板的兩面形成薄膜圖案之順序相同的順序在基板的兩面形成薄膜圖案。 Fig. 11 is a schematic view showing a substrate manufacturing apparatus according to a sixth embodiment. Hereinafter, differences from the second embodiment will be described, and the description of the same configurations will be omitted. The sixth embodiment does not include the positioning station 5, the coating station 6, the ultraviolet irradiation device 9, the lifter 13, the lifter 14, and the conveyor belt 16 shown in Fig. 7, and is different from the second embodiment in this respect. Further, in the substrate manufacturing apparatus of the sixth embodiment, the casing 18 does not include the substrate carry-in/out port 7. Further, the control content based on the control device 20 is different from that of the second embodiment. In the substrate manufacturing apparatus of the sixth embodiment, when the droplet discharge device of the coating station 6 based on the substrate manufacturing apparatus of the second embodiment cannot be used, the substrate is in the same order as the order of forming the thin film pattern on both surfaces of the substrate. Formed on both sides Film pattern.

基板21被傳送帶15搬送，從搬出入口1導入筐體18內。基板21的第1面朝上方(Z軸的正方向)。導入筐體18內之基板21被提昇器11搬送到定位站2。 The substrate 21 is transported by the conveyor belt 15 and introduced into the casing 18 from the carry-out port 1 . The first surface of the substrate 21 faces upward (the positive direction of the Z axis). The substrate 21 introduced into the casing 18 is transported to the positioning station 2 by the lifter 11.

定位站2中進行基板21的簡單定位。定位結束之後，基板21搬送到塗佈站3。 Simple positioning of the substrate 21 is performed in the positioning station 2. After the positioning is completed, the substrate 21 is transferred to the coating station 3.

塗佈站3中在基板21的第1面形成薄膜圖案。在第1面形成有薄膜圖案之基板21藉由提昇器12搬送到反轉站4。反轉站4中進行形成於基板的第1面之薄膜圖案的正式固化及基板的反轉。 A film pattern is formed on the first surface of the substrate 21 in the coating station 3. The substrate 21 on which the thin film pattern is formed on the first surface is transferred to the inversion station 4 by the lifter 12. The inversion station 4 performs the main curing of the thin film pattern formed on the first surface of the substrate and the inversion of the substrate.

之後，基板21搬送到定位站2。在定位站2中進行簡單定位之後，基板21再次搬送到塗佈站3。 Thereafter, the substrate 21 is transported to the positioning station 2. After simple positioning in the positioning station 2, the substrate 21 is again transported to the coating station 3.

塗佈站3中在基板21的第2面形成薄膜圖案。在第2面形成有薄膜圖案之基板21藉由提昇器11搬送到傳送帶15，並進行第2面的薄膜圖案的正式固化。之後，基板21從搬出入口1搬出至筐體18的外部。 A film pattern is formed on the second surface of the substrate 21 in the coating station 3. The substrate 21 on which the thin film pattern is formed on the second surface is transported to the conveyor belt 15 by the lifter 11, and the film pattern of the second surface is completely cured. Thereafter, the substrate 21 is carried out from the carry-out port 1 to the outside of the casing 18.

與基於實施例2之基板製造裝置的機構相比，基於實施例6之基板製造裝置的結構較簡單，能夠謀求裝置的低成本化。 The structure of the substrate manufacturing apparatus according to the sixth embodiment is simpler than the mechanism of the substrate manufacturing apparatus according to the second embodiment, and the cost of the apparatus can be reduced.

[實施例7] [Embodiment 7]

第12圖A~第12圖E中示出基於實施例7之基板製造裝置的反轉站的概要圖。該反轉站能夠應用於基於上述實施例1~實施例6之基板製造裝置的反轉站4(第1 圖、第7圖~第11圖)。 12A to 12E show schematic views of a reversing station based on the substrate manufacturing apparatus of the seventh embodiment. The inversion station can be applied to the inversion station 4 based on the substrate manufacturing apparatuses of the above-described Embodiments 1 to 6 (1st) Figure, Figure 7 ~ Figure 11).

如第12圖A所示，在Y軸方向上較長之紫外光源62的兩側設置有一對半圓周狀的導引件56。紫外光源62能夠被引導至兩側的導引件56而進行移動。藉由控制裝置20控制紫外光源62的移動。在基板24旋轉前的狀態下，形成有薄膜圖案之面朝向Z軸的正方向。從紫外光源62射出之紫外光照射於基板24的形成有薄膜圖案之面。另外，第12圖A~第12圖E所示之例子中，紫外光源62射出發散之紫外光。 As shown in Fig. 12A, a pair of semicircular guide members 56 are provided on both sides of the ultraviolet light source 62 which is long in the Y-axis direction. The ultraviolet light source 62 can be guided to the guide members 56 on both sides to move. The movement of the ultraviolet light source 62 is controlled by the control device 20. In a state before the substrate 24 is rotated, the surface on which the thin film pattern is formed faces the positive direction of the Z axis. The ultraviolet light emitted from the ultraviolet light source 62 is irradiated onto the surface of the substrate 24 on which the thin film pattern is formed. Further, in the example shown in Figs. 12A to 12E, the ultraviolet light source 62 emits ultraviolet light which is scattered.

如第12圖B~第12圖E所示，控制裝置20以支撐構件52為旋轉軸使基板24以恆定的角速度旋轉。以與基板24的旋轉同步地使紫外光源62沿導引件56以恆定速度移動，以便預定強度以上的紫外光照射到旋轉中的基板24的薄膜圖案形成面。如第7圖E所示，紫外光的照射在基板24的薄膜圖案形成面朝向Z軸的負方向時結束。 As shown in FIGS. 12B to 12D, the control device 20 rotates the substrate 24 at a constant angular velocity with the support member 52 as a rotation axis. The ultraviolet light source 62 is moved at a constant speed along the guide member 56 in synchronization with the rotation of the substrate 24 so that ultraviolet light of a predetermined intensity or higher is irradiated onto the film pattern forming face of the rotating substrate 24. As shown in FIG. 7E, the irradiation of the ultraviolet light ends when the thin film pattern formation surface of the substrate 24 faces the negative direction of the Z axis.

實施例7中，能夠並行進行基板的反轉及紫外線照射。因此，能夠縮短反轉站4中的處理時間。 In the seventh embodiment, the inversion of the substrate and the ultraviolet irradiation can be performed in parallel. Therefore, the processing time in the inversion station 4 can be shortened.

[實施例8] [Embodiment 8]

第13圖A~第13圖D中示出基於實施例8之基板製造裝置的反轉站的概要圖。該反轉站能夠應用於基於上述實施例1~實施例6之基板製造裝置的反轉站4(第1圖、第7圖~第11圖)。以下，對與實施例7的不同點進行說明，而對相同的結構省略說明。 A schematic diagram of a reversing station based on the substrate manufacturing apparatus of the eighth embodiment is shown in FIGS. 13A to 13D. This inversion station can be applied to the inversion station 4 (Fig. 1, Fig. 7 to Fig. 11) based on the substrate manufacturing apparatuses of the first to sixth embodiments. Hereinafter, differences from the seventh embodiment will be described, and the description of the same configurations will be omitted.

第13圖A~第13圖D所示之實施例8中，紫外光源62射出集束之紫外光。如第13圖A所示，在Y軸方向上較長之支撐構件61的兩端設置有一對導引件56。在X軸方向上較長之紫外光源62支撐於支撐構件61其一端。支撐構件61能夠被兩端的導引件56引導而進行移動。藉由控制裝置20控制支撐構件61的移動。 In Embodiment 8 shown in Figs. 13A to 13D, the ultraviolet light source 62 emits the bundled ultraviolet light. As shown in Fig. 13A, a pair of guide members 56 are provided at both ends of the support member 61 which is long in the Y-axis direction. An ultraviolet light source 62 that is long in the X-axis direction is supported at one end of the support member 61. The support member 61 can be guided by the guides 56 at both ends to move. The movement of the support member 61 is controlled by the control device 20.

如第13圖A~第13圖D所示，控制裝置20以支撐構件52為旋轉軸使基板24以恆定的角速度旋轉。與基板24的旋轉同步地使支撐構件61沿導引件56以恆定速度移動。另外，使紫外光源62沿支撐構件61向Y軸方向以恆定速度移動。將基板24的薄膜圖案形成面朝向Z軸的正方向之狀態示於第13圖A。將基板24慢慢旋轉而基板24的薄膜圖案形成面朝向Z軸的負方向之狀態示於第13圖D。在第13圖A所示之狀態下，紫外光源62對基板24的Y軸正向側的端部照射紫外光。直至達到第13圖D所示之狀態為止，紫外光源62移動至對基板24的Y軸負向側的端部照射紫外光之位置。紫外光的照射在基板24的薄膜圖案形成面朝向Z軸的正方向時開始，在基板24的薄膜圖案形成面朝向Z軸的負方向時結束。 As shown in FIGS. 13A to 13D, the control device 20 rotates the substrate 24 at a constant angular velocity with the support member 52 as a rotation axis. The support member 61 is moved at a constant speed along the guide 56 in synchronization with the rotation of the substrate 24. Further, the ultraviolet light source 62 is moved at a constant speed in the Y-axis direction along the support member 61. The state in which the thin film pattern forming surface of the substrate 24 faces the positive direction of the Z axis is shown in Fig. 13A. The state in which the substrate 24 is gradually rotated and the film pattern forming surface of the substrate 24 faces the negative direction of the Z axis is shown in Fig. 13D. In the state shown in Fig. 13A, the ultraviolet light source 62 irradiates the end portion of the substrate 24 on the positive side of the Y-axis with ultraviolet light. Until the state shown in FIG. 13D is reached, the ultraviolet light source 62 moves to a position where the end portion of the substrate 24 on the negative side of the Y-axis is irradiated with ultraviolet light. The irradiation of the ultraviolet light starts when the thin film pattern forming surface of the substrate 24 faces the positive direction of the Z axis, and ends when the thin film pattern forming surface of the substrate 24 faces the negative direction of the Z axis.

實施例8中，亦與實施例7同樣地能夠縮短反轉站4中的處理時間。 Also in the eighth embodiment, the processing time in the inversion station 4 can be shortened in the same manner as in the seventh embodiment.

上述實施例1~實施例8中，僅藉由載物台進行基板相對噴嘴單元之移動(XY平面內的移動)，但是亦能夠向Y軸方向移動框架42(第3圖A)，在框架42上向X 軸方向及Z軸方向移動噴嘴單元47a~47f(第3圖A)。噴嘴單元與基板只要相對移動即可。但是，在XY平面內僅移動基板之結構比還使噴嘴單元向XY平面方向移動之結構相比，更能夠提高薄膜圖案的位置精確度。 In the first to eighth embodiments described above, the movement of the substrate relative to the nozzle unit (movement in the XY plane) is performed only by the stage, but the frame 42 (Fig. 3A) can also be moved in the Y-axis direction. 42 up to X The nozzle units 47a to 47f are moved in the axial direction and the Z-axis direction (Fig. 3A). The nozzle unit and the substrate need only be relatively moved. However, the structure in which only the substrate is moved in the XY plane is more accurate than the structure in which the nozzle unit is moved in the XY plane direction.

另外，實施例1~實施例8中，藉由基板製造裝置在印刷配線板上形成阻焊抗蝕劑的薄膜圖案，但是基於實施例1~實施例8之基板製造裝置還能夠應用於其他薄膜圖案的形成。例如，基於實施例1~實施例8之基板製造裝置能夠用於製造在玻璃基板上形成絕緣膜之觸控面板。 Further, in the first to eighth embodiments, the thin film pattern of the solder resist is formed on the printed wiring board by the substrate manufacturing apparatus, but the substrate manufacturing apparatus according to the first to eighth embodiments can be applied to other thin films. The formation of the pattern. For example, the substrate manufacturing apparatus according to Embodiments 1 to 8 can be used to manufacture a touch panel in which an insulating film is formed on a glass substrate.

另外，具備臨時設置載物台48(第7圖等)之實施例中，在將基板搬送到液滴吐出裝置之前，並不一定要經由臨時設置載物台。例如，當實施例2的塗佈站6(第8圖)的液滴吐出裝置故障時或維修時，亦可無需從反轉站4經由定位站2就向塗佈站3搬送基板。藉由省略基於定位站2之處理，能夠抑制節拍時間的增加。這一點在基於實施例6之基板製造裝置通常動作等中亦相同。 Further, in the embodiment in which the stage 48 (Fig. 7 and the like) is temporarily provided, it is not always necessary to temporarily set the stage before the substrate is transported to the droplet discharge device. For example, when the droplet discharge device of the coating station 6 (Fig. 8) of the second embodiment fails or is repaired, it is not necessary to transport the substrate from the reversing station 4 to the coating station 3 via the positioning station 2. By omitting the processing based on the positioning station 2, it is possible to suppress an increase in the tact time. This point is also the same in the normal operation and the like of the substrate manufacturing apparatus according to the sixth embodiment.

並且，實施例1~實施例8中，可對提昇器或基板反轉裝置賦予定位功能。另外，實施例5或實施例6中，亦可在塗佈站3(第10圖、第11圖)與反轉站4(第10圖、第11圖)之間設置定位站。將在反轉站4中經處理之基板經由設置於塗佈站3與反轉站4之間之定位站搬送到塗佈站3而不是經由定位站2搬送到塗佈站3，藉此能夠實現節拍時間的縮短。 Further, in the first to eighth embodiments, the positioning function can be imparted to the lifter or the substrate inverting device. Further, in the fifth embodiment or the sixth embodiment, a positioning station may be provided between the coating station 3 (Fig. 10, Fig. 11) and the reversing station 4 (Fig. 10, Fig. 11). The substrate processed in the inversion station 4 is transported to the coating station 3 via a positioning station provided between the coating station 3 and the reversing station 4, instead of being transported to the coating station 3 via the positioning station 2, thereby enabling Achieve shortening of the beat time.

另外，實施例1~實施例8中，直線配置各站，但是例如亦可將各站設置於相當於多邊形的頂點之位置。藉由設為該種結構，能夠抑制例如伴隨定位產生之節拍時間的增大。 Further, in the first to eighth embodiments, the stations are arranged in a straight line, but For example, each station may be placed at a position corresponding to the vertex of the polygon. By adopting such a configuration, it is possible to suppress, for example, an increase in the tact time accompanying the positioning.

[實施例9] [Embodiment 9]

第14圖中示出基於實施例9之基板製造裝置的塗佈站3的概要俯視圖。該塗佈站3能夠應用於基於實施例1~實施例8之基板製造裝置的第1級塗佈站3(第1圖、第7圖~第11圖)及第2級塗佈站6(第1圖、第7圖~第9圖)。另外，基於實施例9之塗佈站3具備基板的定位功能，所以在實施例1~實施例8中應用基於實施例9之塗佈站3時，可省略定位站2、定位站5(第1圖、第7圖~第11圖)。 Fig. 14 is a schematic plan view showing a coating station 3 based on the substrate manufacturing apparatus of the ninth embodiment. The coating station 3 can be applied to the first-stage coating stations 3 (Fig. 1, Fig. 7 to Fig. 11) and the second-stage coating station 6 based on the substrate manufacturing apparatuses of the first to eighth embodiments (Fig. 1, Fig. 7 to Fig. 11). Figure 1, Figure 7 ~ Figure 9). Further, since the coating station 3 according to the ninth embodiment has the positioning function of the substrate, when the coating station 3 according to the ninth embodiment is applied to the first to eighth embodiments, the positioning station 2 and the positioning station 5 can be omitted. 1 picture, 7th picture ~ 11th picture).

如第14圖所示，塗佈站3中具備有第1塗佈站85A及第2塗佈站85B。第1塗佈站85A能夠在塗佈站3內的第1交接區域80A、第1定位區域81A及塗佈區域82之間移動。第2塗佈站85B能夠在塗佈站3內的第2交接區域80B、第2定位區域81B及塗佈區域82之間移動。塗佈區域82在第1塗佈載物台85A與第2塗佈載物台85B中是共用的。 As shown in Fig. 14, the coating station 3 is provided with a first coating station 85A and a second coating station 85B. The first coating station 85A is movable between the first transfer region 80A, the first positioning region 81A, and the application region 82 in the coating station 3. The second coating station 85B is movable between the second transfer region 80B, the second positioning region 81B, and the application region 82 in the coating station 3. The coating region 82 is common to the first coating stage 85A and the second coating stage 85B.

提昇器11能夠通過第1交接區域80A、第2交接區域80B的上方。在第1塗佈載物台85A配置於第1交接區域80A之狀態下，能夠從提昇器11向第1塗佈載物台85A，或與其相反地交接基板。同樣地，在第2塗佈載物台85B配置於第2交接區域80B之狀態下，能夠從提昇器11向第2塗佈載物台85B，或與其相反地交接基板。 The lifter 11 can pass above the first transfer area 80A and the second transfer area 80B. In a state in which the first coating stage 85A is disposed in the first delivery region 80A, the substrate can be transferred from the lifter 11 to the first coating stage 85A or vice versa. Similarly, in the second coating carrier When the stage 85B is placed in the second transfer area 80B, the substrate can be transferred from the lifter 11 to the second coating stage 85B or vice versa.

第1定位區域81A及第2定位區域81B中分別配置有複數台攝像裝置83。在第1塗佈載物台85A配置於第1定位區域81A之狀態下，藉由攝像裝置83拍攝保持於第1塗佈載物台85A之基板的定位標記。藉由分析拍攝結果能夠進行基板的θ補正，並且能夠計算X方向及Y方向的伸縮量。同樣地，在第2塗佈載物台85B配置於第2定位區域81B之狀態下，能夠進行保持於第2塗佈載物台85B之基板的θ補正，並且能夠計算X方向及Y方向的伸縮量。 A plurality of imaging devices 83 are disposed in each of the first positioning area 81A and the second positioning area 81B. When the first coating stage 85A is placed in the first positioning area 81A, the imaging device 83 captures the positioning mark held by the substrate of the first coating stage 85A. By analyzing the imaging result, the θ correction of the substrate can be performed, and the amount of expansion and contraction in the X direction and the Y direction can be calculated. In the same manner, in the state in which the second coating stage 85B is disposed in the second positioning region 81B, the θ correction of the substrate held by the second coating stage 85B can be performed, and the X direction and the Y direction can be calculated. The amount of expansion.

塗佈區域82中具備有噴嘴單元47a~47f。將第1塗佈載物台85A配置於塗佈區域82，相對噴嘴單元47a~47f掃描基板，藉此能夠在保持於第1塗佈載物台85A之基板的上面形成薄膜圖案。同樣地，藉由在塗佈區域82配置第2塗佈載物台85B，能夠在保持於第2塗佈載物台85B之基板的上面形成薄膜圖案。 The coating region 82 is provided with nozzle units 47a to 47f. By disposing the first coating stage 85A in the application region 82 and scanning the substrate with the nozzle units 47a to 47f, a thin film pattern can be formed on the upper surface of the substrate held by the first coating stage 85A. Similarly, by arranging the second coating stage 85B in the application region 82, a thin film pattern can be formed on the upper surface of the substrate held by the second coating stage 85B.

接著，對塗佈站3中在基板形成薄膜圖案之順序進行說明。如第15圖A所示，第1塗佈載物台85A及第2塗佈載物台85B分別配置於第1交接區域80A及第2交接區域80B。在該狀態下，提昇器11(第14圖)將未處理的基板21搭載於第1塗佈載物台85A。 Next, the procedure for forming a thin film pattern on the substrate in the coating station 3 will be described. As shown in FIG. 15A, the first coating stage 85A and the second coating stage 85B are disposed in the first delivery area 80A and the second delivery area 80B, respectively. In this state, the lifter 11 (Fig. 14) mounts the unprocessed substrate 21 on the first coating stage 85A.

如第15圖B所示，使第1塗佈載物台85A移動至第1定位區域81A。在該狀態下，用攝像裝置83(第14 圖)拍攝形成於基板21的上面之定位標記。依據拍攝結果進行基板21的θ補正，並且生成用於形成薄膜圖案之吐出控制用圖像資料。 As shown in Fig. 15B, the first coating stage 85A is moved to the first positioning area 81A. In this state, the imaging device 83 (14th) FIG. 4 is a view showing a positioning mark formed on the upper surface of the substrate 21. The θ correction of the substrate 21 is performed based on the result of the photographing, and image data for discharge control for forming a thin film pattern is generated.

如第15圖C所示，使第1塗佈載物台85A移動至塗佈區域82，並進行相對基板21之薄膜材料的塗佈處理。並行地，提昇器11將應接著處理之基板22搭載於第2塗佈載物台85B。 As shown in FIG. 15C, the first coating stage 85A is moved to the coating region 82, and the coating process of the film material with respect to the substrate 21 is performed. In parallel, the lifter 11 mounts the substrate 22 to be processed next to the second coating stage 85B.

如第15圖D所示，使第2塗佈載物台85B移動至第2定位區域81B。在該狀態下，用攝像裝置83(第14圖)拍攝保持於第2塗佈載物台85B之基板22上面所形成之定位標記。依據拍攝結果進行基板22的θ補正，並且生成吐出控制用圖像資料。針對於保持於第1塗佈載物台85A之基板21繼續進行薄膜材料的塗佈處理。 As shown in Fig. 15D, the second coating stage 85B is moved to the second positioning area 81B. In this state, the positioning mark formed on the substrate 22 held by the second coating stage 85B is imaged by the imaging device 83 (Fig. 14). The θ correction of the substrate 22 is performed based on the photographing result, and image data for discharge control is generated. The coating process of the film material is continued for the substrate 21 held on the first coating stage 85A.

如第15圖E所示，完成對基板21塗佈薄膜材料之後，使第1塗佈載物台85A從塗佈區域82移動至第1交接區域80A。並行地，使第2塗佈載物台85B從第2定位區域81B移動至塗佈區域82。 As shown in FIG. 15E, after the film material is applied to the substrate 21, the first coating stage 85A is moved from the application region 82 to the first delivery region 80A. In parallel, the second coating stage 85B is moved from the second positioning region 81B to the coating region 82.

如第15圖F所示，在保持於第2塗佈載物台85B之基板22的上面塗佈薄膜材料。並行地，提昇器12(第1圖)從塗佈站3搬出保持於第1塗佈載物台85A之基板21。 As shown in Fig. 15F, a film material is applied to the upper surface of the substrate 22 held on the second coating stage 85B. In parallel, the lifter 12 (first FIG. 1) carries out the substrate 21 held by the first coating stage 85A from the coating station 3.

如第15圖G所示，提昇器11(第14圖)將應接著處理之基板23搭載於第1塗佈載物台85A。此時，塗佈區域82中，繼續進行薄膜材料對保持於第2塗佈載物台 85B之基板22的上面之塗佈處理。 As shown in Fig. 15G, the lifter 11 (Fig. 14) mounts the substrate 23 to be processed next to the first coating stage 85A. At this time, in the coating region 82, the film material pair is continuously held on the second coating stage. The coating treatment of the upper surface of the substrate 22 of 85B.

如第15圖H所示，使第1塗佈載物台85A移動至第1定位區域81A。在該狀態下，拍攝形成於基板23的上面之定位標記。依據拍攝結果進行基板23的θ補正，並且生成吐出控制用圖像資料。此時，塗佈區域82中，繼續進行薄膜材料對保持於第2塗佈載物台85B之基板22的上面之塗佈處理。 As shown in FIG. 15H, the first coating stage 85A is moved to the first positioning area 81A. In this state, the positioning marks formed on the upper surface of the substrate 23 are taken. The θ correction of the substrate 23 is performed based on the photographing result, and image data for discharge control is generated. At this time, in the application region 82, the coating process of the film material on the upper surface of the substrate 22 held by the second coating stage 85B is continued.

若完成薄膜材料對保持於第2塗佈載物台85B之基板22之塗佈，則使第2塗佈載物台85B移動至第2交接區域80B，並從塗佈站3搬出基板22。並行地，與第15圖C所示之製程相同地使第1塗佈載物台85A移動至塗佈區域82，並且在第2塗佈載物台85B搭載應接著處理之基板。之後，反覆執行從第15圖D到第15圖H的處理。 When the application of the film material to the substrate 22 held by the second coating stage 85B is completed, the second coating stage 85B is moved to the second delivery area 80B, and the substrate 22 is carried out from the application station 3. In parallel, the first coating stage 85A is moved to the application region 82 in the same manner as the process shown in FIG. 15C, and the substrate to be processed is mounted on the second coating stage 85B. Thereafter, the processing from Fig. 15D to Fig. 15H is repeatedly executed.

如上述，實施例9中，在塗佈站3內進行對1片基板之薄膜材料的塗佈期間，並行進行應接著處理之基板的θ補正及吐出控制用圖像資料的生成。因此，能夠縮短處理時間。 As described above, in the ninth embodiment, during the application of the film material to one substrate in the coating station 3, the θ correction and the image data for discharge control of the substrate to be subsequently processed are simultaneously generated. Therefore, the processing time can be shortened.

[實施例10] [Embodiment 10]

第16圖A~第16圖F中示出基於實施例10之基板製造裝置的反轉站4的概要圖。以下，對與實施例1的不同點進行說明，而對相同的結構省略說明。實施例10的反轉站4應用於實施例1~實施例9的基板製造裝置的反轉站4(第1圖、第7圖~第11圖)。 A schematic diagram of the inversion station 4 based on the substrate manufacturing apparatus of the tenth embodiment is shown in FIGS. 16A to 16F. Hereinafter, differences from the first embodiment will be described, and the description of the same configurations will be omitted. The inversion station 4 of the tenth embodiment is applied to the inversion station 4 (Fig. 1, Fig. 7 to Fig. 11) of the substrate manufacturing apparatuses of the first to the ninth embodiments.

如第16圖A所示，反轉站4內具備有輥傳送帶90。從輥傳送帶90的上游端朝向下游端分隔出搬入部4A、正式固化部4B、反轉部4C及搬出部4D。在塗佈站3(第1圖、第7圖~第11圖)中被塗佈薄膜材料之基板21藉由提昇器12(第1圖、第7圖~第11圖)搭載於輥傳送帶90的搬入部4A上。塗佈有薄膜材料之第1面21A朝上方，相反側的第2面21B與輥傳送帶90接觸。 As shown in Fig. 16A, the reversing station 4 is provided with a roller conveyor 90. The carry-in portion 4A, the main solidified portion 4B, the reverse portion 4C, and the carry-out portion 4D are separated from the upstream end of the roller conveyor 90 toward the downstream end. The substrate 21 to which the film material is applied in the coating station 3 (Fig. 1 and Fig. 7 to Fig. 11) is mounted on the roller conveyor 90 by the lifter 12 (Fig. 1, Fig. 7 to Fig. 11). The loading part 4A. The first surface 21A to which the film material is applied is directed upward, and the second surface 21B on the opposite side is in contact with the roller conveyor 90.

正式固化部4B的輥傳送帶90的上方配置有正式固化用光源91。正式固化用光源91藉由輥傳送帶90對通過其下方之基板21的上面照射紫外線。 The main curing light source 91 is disposed above the roller conveyor 90 of the main solidifying portion 4B. The main curing light source 91 irradiates ultraviolet rays to the upper surface of the substrate 21 passing therethrough by the roller conveyor 90.

反轉部4C中，輥傳送帶90包括從下方支撐基板21之第1輥90A及與基板21的上面接觸之第2輥90B。能夠藉由使第1輥90A與第2輥90B的上下關係逆轉來使基板21的背面和表面反轉。若使基板21反轉，則塗佈有薄膜材料之第1面21A朝下方，未塗布薄膜材料之第2面朝上方。 In the inverting portion 4C, the roller conveyor 90 includes a first roller 90A that supports the substrate 21 from below and a second roller 90B that is in contact with the upper surface of the substrate 21. The back surface and the surface of the substrate 21 can be reversed by reversing the vertical relationship between the first roller 90A and the second roller 90B. When the substrate 21 is reversed, the first surface 21A to which the film material is applied faces downward, and the second surface of the uncoated film material faces upward.

搬送至輥傳送帶90的搬出部4D之基板21藉由提昇器13(第1圖、第7圖~第9圖)從反轉站4搬出，並搬入第2級塗佈站6(第1圖、第7圖~第9圖)等。 The substrate 21 conveyed to the carry-out portion 4D of the roller conveyor 90 is carried out from the reversing station 4 by the lifter 13 (Fig. 1, Fig. 7 to Fig. 9), and is carried into the second stage coating station 6 (Fig. 1 , Figure 7 ~ Figure 9).

如第16圖B所示，搭載於搬入部4A的輥傳送帶90之基板21通過正式固化部4B朝向反轉部4B而被搬送。當通過正式固化部4B時，被照射到來自正式固化用光源91之紫外線，塗佈於基板21的第1面21A之薄膜材料被正式固化。控制裝置20包括記憶基板21的進給速度之記憶裝置20b。記憶於記憶裝置20b之進給速度以投入基板21的第1面21A之光能密度成為足以使薄膜材料正式固化之大小之方式進行設定。另外，亦可在記憶裝置20b中記憶光照射時間。此時，控制裝置20從記憶於記憶裝置20b之照射時間計算基板21的進給速度。 As shown in FIG. 16B, the substrate 21 of the roller conveyor 90 mounted on the loading unit 4A is conveyed toward the reversing unit 4B by the main curing unit 4B. When passing through the main curing portion 4B, the ultraviolet ray from the main curing light source 91 is applied, and the film material applied to the first surface 21A of the substrate 21 is completely cured. The control device 20 includes a note of the feed speed of the memory substrate 21. Memories 20b. The feed rate stored in the memory device 20b is set such that the light energy density of the first surface 21A of the input substrate 21 is sufficient to formally cure the film material. In addition, the light irradiation time can also be memorized in the memory device 20b. At this time, the control device 20 calculates the feed speed of the substrate 21 from the irradiation time stored in the memory device 20b.

如第16圖C所示，基板21搬送至反轉部4C的輥傳送帶90。在第1輥90A與第2輥90B之間挾持基板21之狀態下，使第1輥90A、第2輥90B及基板21以與搬送方向平行之直線為旋轉中心旋轉180°。第16圖D中示出使第1輥90A、第2輥90B及基板21旋轉90°之狀態的側視圖。基板21的第1面21A朝向正前方。 As shown in Fig. 16C, the substrate 21 is conveyed to the roller conveyor 90 of the reversing portion 4C. In a state in which the substrate 21 is held between the first roller 90A and the second roller 90B, the first roller 90A, the second roller 90B, and the substrate 21 are rotated by 180° with respect to a line parallel to the conveyance direction. Fig. 16D is a side view showing a state in which the first roller 90A, the second roller 90B, and the substrate 21 are rotated by 90°. The first surface 21A of the substrate 21 faces forward.

第16圖E中示出使第1輥90A、第2輥90B及基板21旋轉90°之狀態的側視圖。第1輥90A與第2輥90B的上下關係逆轉，基板21的第2面21B朝上方。如第16圖F所示，將背面和表面被反轉之基板21搬送至輥傳送帶90的搬出部4D。 Fig. 16E is a side view showing a state in which the first roller 90A, the second roller 90B, and the substrate 21 are rotated by 90°. The vertical relationship between the first roller 90A and the second roller 90B is reversed, and the second surface 21B of the substrate 21 faces upward. As shown in FIG. 16F, the back surface and the substrate 21 whose surface is reversed are conveyed to the carry-out portion 4D of the roller conveyor 90.

如實施例10，還能夠利用輥傳送帶90進行正式固化和基板的反轉。 As in Embodiment 10, it is also possible to perform the main curing and the inversion of the substrate by the roll belt 90.

[實施例11] [Example 11]

第17圖中示出基於實施例11之基板製造裝置的概要圖。在基板堆料機93蓄積複數個基板。塗佈站3中，在基板上形成具有預定平面形狀之薄膜圖案。在塗佈站3中形成之薄膜圖案為臨時固化的狀態，並未進行正式固化。反轉站4包括正式固化部4B及反轉部4C。正式固化部4B中塗佈於基板之薄膜材料被正式固化。在反轉站4C中基板的背面和表面被反轉。基於實施例11之基板製造裝置中除正式固化部4B以外還配置有正式固化站94。亦可在正式固化站94中進行塗佈於基板之薄膜材料的正式固化。 Fig. 17 is a schematic view showing a substrate manufacturing apparatus according to the eleventh embodiment. A plurality of substrates are stacked in the substrate stocker 93. In the coating station 3, a film pattern having a predetermined planar shape is formed on the substrate. The film pattern formed in the coating station 3 is in a temporarily cured state, and no formal curing is performed. The reversing station 4 includes a main solidifying portion 4B and an inverting portion 4C. The film material applied to the substrate in the main curing portion 4B is formally cured. The back surface and surface of the substrate are reversed in the inversion station 4C. In the substrate manufacturing apparatus of the eleventh embodiment, a main curing station 94 is disposed in addition to the main curing portion 4B. Formal curing of the film material applied to the substrate can also be carried out in the final curing station 94.

搬送裝置100在基板堆料機93、正式固化站94、塗佈站3、反轉站4的正式固化部4B與反轉部4C之間搬送基板。搬送裝置100中利用輥傳送帶、吸附並保持基板的上面之提昇器、從下方支撐基板之機械手臂等。藉由控制裝置20控制搬送裝置100及各站內的裝置。第17圖中，用附加箭頭之曲線表示處理基板時的基板的移動路徑。 The conveyance device 100 conveys the substrate between the substrate stacker 93, the main curing station 94, the coating station 3, and the main solidified portion 4B of the reversing station 4 and the inverting portion 4C. In the conveying device 100, a roller conveyor, a lifter that adsorbs and holds the upper surface of the substrate, a robot arm that supports the substrate from below, and the like are used. The transport device 100 and the devices in each station are controlled by the control device 20. In Fig. 17, the movement path of the substrate when the substrate is processed is indicated by a curve of an additional arrow.

蓄積於基板堆料機93之未處理基板藉由搬送裝置100搬送到塗佈站3。塗佈站3中在作為基板的其中一方的表面之第1面形成薄膜圖案。形成有薄膜圖案之基板藉由搬送裝置100搬送到反轉站4的正式固化部4B。正式固化部4B中薄膜圖案被正式固化。之後，在反轉站4C中基板被反轉。被反轉之基板被搬送裝置100搬送到塗佈站3。塗佈站3中在基板的第1面的相反側的第2面形成薄膜圖案。在第2面形成有薄膜圖案之基板藉由搬送裝置100搬送到正式固化站94。正式固化站94使形成於基板的第2面之薄膜圖案正式固化。第2面的薄膜圖案被正式固化之後，基板藉由搬送裝置100搬送至基板堆料機93。接著，參閱第18圖A~第18圖G，對在基板上形成薄膜圖案之方法進行更詳細的說明。 The unprocessed substrate accumulated in the substrate stacker 93 is transported to the coating station 3 by the transfer device 100. In the coating station 3, a thin film pattern is formed on the first surface of one of the substrates. The substrate on which the thin film pattern is formed is transported to the main solidified portion 4B of the inversion station 4 by the transfer device 100. The film pattern in the main curing portion 4B is formally cured. Thereafter, the substrate is reversed in the inversion station 4C. The inverted substrate is transported to the coating station 3 by the transport device 100. In the coating station 3, a thin film pattern is formed on the second surface on the opposite side of the first surface of the substrate. The substrate on which the thin film pattern is formed on the second surface is transferred to the final curing station 94 by the transfer device 100. The main curing station 94 completely cures the film pattern formed on the second surface of the substrate. After the thin film pattern of the second surface is completely cured, the substrate is transferred to the substrate stocker 93 by the transfer device 100. Next, referring to FIG. 18A to FIG. 18G, a thin film pattern is formed on the substrate. The method is described in more detail.

第18圖A所示之反轉站4的搬入部4A、正式固化部4B及反轉部4C的結構具有與第16圖A所示之基於實施例10之基板製造裝置者相同的結構。基板21從基板堆料機93(第17圖)搬送到塗佈站3。塗佈站3中，在基板21的第1面21A形成薄膜圖案。形成有薄膜圖案之基板21藉由搬送裝置100(第17圖)搬入反轉站4的搬入部4A。形成有薄膜圖案之第1面21A朝上方。 The configuration of the loading unit 4A, the main solidifying portion 4B, and the inverting portion 4C of the inversion station 4 shown in FIG. 18A has the same configuration as that of the substrate manufacturing apparatus according to the tenth embodiment shown in FIG. The substrate 21 is transported from the substrate stocker 93 (Fig. 17) to the coating station 3. In the coating station 3, a thin film pattern is formed on the first surface 21A of the substrate 21. The substrate 21 on which the thin film pattern is formed is carried into the carry-in portion 4A of the reversing station 4 by the transfer device 100 (Fig. 17). The first surface 21A on which the thin film pattern is formed faces upward.

如第18圖B所示，藉由驅動輥傳送帶90，基板21經由正式固化部4B搬送至反轉部4C。輥傳送帶90作為將基板21從塗佈站3搬送至正式固化部4B，及從正式固化部4B搬送至反轉部4C之搬送裝置100(第17圖)發揮作用。形成於基板21的第1面21A之薄膜圖案在正式固化部4B中通過正式固化用光源91的下方時，藉由紫外光的照射而被固化。 As shown in FIG. 18B, the substrate 21 is conveyed to the inverting portion 4C via the main curing portion 4B by driving the roller conveyor 90. The roller conveyor 90 functions as a conveyance device 100 (FIG. 17) that conveys the substrate 21 from the coating station 3 to the main solidified portion 4B and from the main solidified portion 4B to the reverse portion 4C. When the thin film pattern formed on the first surface 21A of the substrate 21 passes under the main curing light source 91 in the main cured portion 4B, it is cured by irradiation of ultraviolet light.

如第18圖C所示，基板21挾持於反轉站4C的第1輥90A與第2輥90B之間。如第18圖D所示，使第1輥90A與第2輥90B的上下逆轉。藉此，基板21的第2面21B朝上方。 As shown in Fig. 18C, the substrate 21 is held between the first roller 90A and the second roller 90B of the reversing station 4C. As shown in Fig. 18D, the upper and lower sides of the first roller 90A and the second roller 90B are reversed. Thereby, the second surface 21B of the substrate 21 faces upward.

如第18圖E所示，驅動輥傳送帶90來將基板21搬送至搬入部4A。此時，基板21在正式固化部4B中不進行任何處理，而只是通過正式固化部4B。 As shown in FIG. 18E, the roller conveyor 90 is driven to convey the substrate 21 to the loading unit 4A. At this time, the substrate 21 is not subjected to any treatment in the main solidified portion 4B, but passes through the main solidified portion 4B.

如第18圖F所示，搬送裝置100(第17圖)將基板21從反轉站4搬送到塗佈站3。塗佈站3中，在基板21 的第2面21B形成薄膜圖案。 As shown in FIG. 18F, the transport apparatus 100 (Fig. 17) transports the substrate 21 from the reversing station 4 to the coating station 3. In the coating station 3, on the substrate 21 The second surface 21B forms a thin film pattern.

如第18圖G所示，搬送裝置100(第17圖)將基板21從塗佈站3搬送至正式固化站94。正式固化站94中，從正式固化用光源92向形成於基板21的第2面21B之薄膜圖案照射紫外線。藉此，形成於第2面21B之薄膜圖案被正式固化。第2面的薄膜圖案被正式固化之基板21藉由搬送裝置100(第17圖)搬送至基板堆料機93。 As shown in FIG. 18G, the transfer device 100 (Fig. 17) transports the substrate 21 from the coating station 3 to the final curing station 94. In the main curing station 94, the film pattern formed on the second surface 21B of the substrate 21 is irradiated with ultraviolet rays from the main curing light source 92. Thereby, the film pattern formed on the second surface 21B is formally cured. The substrate 21 on which the thin film pattern of the second surface is completely cured is transferred to the substrate stocker 93 by the transfer device 100 (Fig. 17).

實施例11中，在第18圖F所示之製程中於基板21的第2面21B形成薄膜圖案之後，無需將基板21返回到反轉站4就能夠在正式固化站94中進行薄膜圖案的正式固化。 In the eleventh embodiment, after the thin film pattern is formed on the second surface 21B of the substrate 21 in the process shown in FIG. 18F, the film pattern can be formed in the final curing station 94 without returning the substrate 21 to the inversion station 4. Formally cured.

如第17圖所示，在第17圖中向左方向搬送基板時，亦即在第1面形成薄膜圖案時，及向右方向搬送基板時，亦即在第2面形成薄膜圖案時，這兩種情況下使用塗佈站3。第17圖中，將向左方向搬送基板之路徑稱為“去路”，將向右方向搬送之路徑稱為“回路”。 As shown in Fig. 17, when the substrate is transported in the left direction in Fig. 17, that is, when the thin film pattern is formed on the first surface and when the substrate is transferred in the right direction, that is, when the thin film pattern is formed on the second surface, Coating station 3 was used in both cases. In Fig. 17, the path for transporting the substrate in the left direction is referred to as "outgoing", and the path for transporting in the right direction is referred to as "loop".

塗佈站3採用第14圖所示之基於實施例9之塗佈站3為較佳。基於實施例9之塗佈站3具備有第1塗佈載物台85A(第14圖)及第2塗佈載物台85B(第14圖)。例如，能夠在去路中使用第1塗佈載物台85A，在回路中使用第2塗佈載物台85B。因此，在去路中搬送之基板和在回路中搬送之基板能夠在塗佈站3內交錯。藉此，在從基板堆料機93搬出之基板經由去路和回路返回到基板堆料機93之前，能夠向去路送出應接著處理之基板。 The coating station 3 is preferably a coating station 3 based on the embodiment 9 shown in Fig. 14. The coating station 3 according to the ninth embodiment includes a first coating stage 85A (Fig. 14) and a second coating stage 85B (Fig. 14). For example, the first coating stage 85A can be used in the outward path, and the second coating stage 85B can be used in the circuit. Therefore, the substrate conveyed in the outward path and the substrate transferred in the circuit can be staggered in the coating station 3. Thereby, before the substrate carried out from the substrate stocker 93 is returned to the substrate stocker 93 via the outward path and the loop, the substrate to be processed can be sent out.

[實施例12] [Embodiment 12]

第19圖A中示出基於實施例12之基板製造裝置的概要圖。基於實施例12之基板製造裝置包括基板堆料機93、塗佈站3、反轉站4及臨時蓄積裝置95。反轉站4具有與實施例11的反轉站4(第18圖A)相同的結構，並包括正式固化部4B和反轉部4C。搬送裝置100在基板堆料機93、塗佈站3、反轉站4的正式固化部4B、反轉站4的反轉部4C及臨時蓄積裝置95之間搬送基板。藉由控制裝置20控制搬送裝置100及各站內的裝置。 Fig. 19 is a schematic view showing a substrate manufacturing apparatus according to a twelfth embodiment. The substrate manufacturing apparatus according to Embodiment 12 includes a substrate stocker 93, a coating station 3, a reversing station 4, and a temporary accumulating device 95. The reversing station 4 has the same configuration as the inversion station 4 (Fig. 18A) of the eleventh embodiment, and includes a main solidifying portion 4B and an inverting portion 4C. The transport apparatus 100 transports the substrate between the substrate stocker 93, the coating station 3, the main solidified portion 4B of the reversing station 4, the inverting portion 4C of the reversing station 4, and the temporary accumulating device 95. The transport device 100 and the devices in each station are controlled by the control device 20.

第19圖B中示出臨時蓄積裝置95的概要側視圖。臨時蓄積裝置95具有搭載基板之工作臺。在該工作臺上堆積複數個基板21。藉由搬送裝置100搬入臨時蓄積裝置95之基板搭載於已蓄積之基板的最上方。另外，搬送裝置100保持堆積於臨時蓄積裝置95之基板21中最上方的基板而從臨時蓄積裝置95搬出。 A schematic side view of the temporary accumulating device 95 is shown in Fig. 19B. The temporary storage device 95 has a table on which a substrate is mounted. A plurality of substrates 21 are stacked on the table. The substrate loaded into the temporary storage device 95 by the transfer device 100 is mounted on the uppermost side of the accumulated substrate. Further, the transport device 100 holds the substrate stacked on the uppermost portion of the substrate 21 of the temporary storage device 95 and is carried out from the temporary storage device 95.

參閱第20圖A~第20圖E，對由基於實施例12之基板製造裝置進行之基板的處理方法進行說明。 A method of processing a substrate by the substrate manufacturing apparatus according to the twelfth embodiment will be described with reference to FIGS. 20A to 20E.

如第20圖A所示，在基板製造裝置的動作開始時刻，應處理之所有基板21蓄積於基板堆料機93上，臨時蓄積裝置95中未蓄積有基板。蓄積於基板堆料機93之基板21以第1面朝上方之姿勢堆積。 As shown in FIG. 20A, at the start of the operation of the substrate manufacturing apparatus, all the substrates 21 to be processed are accumulated on the substrate stocker 93, and the substrate is not accumulated in the temporary storage device 95. The substrate 21 accumulated in the substrate stacker 93 is stacked with the first surface facing upward.

如第20圖B所示，搬送裝置100每次取出1片蓄積於基板堆料機93之基板，經由塗佈站3、反轉站4的正式固化部4B及反轉站4的反轉部4C搬送至臨時蓄積裝置95。將從基板堆料機93搬送至臨時蓄積裝置95之路徑稱為“去路”。塗佈站3中，在基板21的第1面形成薄膜圖案。正式固化部4B中，形成於基板21的第1面之薄膜圖案被正式固化。反轉部4C中，以基板21的第2面朝上方之方式反轉基板的背面和表面。臨時蓄積裝置95中，基板21以第2面朝上方之姿勢堆積。 As shown in FIG. 20B, the transport apparatus 100 takes out one sheet of the substrate stored in the substrate stacker 93, and passes through the application station 3 and the reversing station 4. The solidified portion 4B and the reverse portion 4C of the reversing station 4 are transported to the temporary accumulating device 95. The path from the substrate stocker 93 to the temporary accumulation device 95 is referred to as "outgoing". In the coating station 3, a thin film pattern is formed on the first surface of the substrate 21. In the main curing portion 4B, the film pattern formed on the first surface of the substrate 21 is completely cured. In the inversion portion 4C, the back surface and the surface of the substrate are reversed so that the second surface of the substrate 21 faces upward. In the temporary accumulation device 95, the substrate 21 is stacked with the second surface facing upward.

第20圖C中示出搬出蓄積於基板堆料機93之所有基板21，並臨時蓄積於臨時蓄積裝置95之狀態。 In FIG. 20C, the state in which all the substrates 21 accumulated in the substrate stocker 93 are carried out and temporarily stored in the temporary storage device 95 is shown.

如第20圖D所示。搬送裝置100每次搬出1片蓄積於臨時蓄積裝置95之基板21，並經由塗佈站3、反轉站4的正式固化部4B搬送至基板堆料機93。將從臨時蓄積裝置95搬送至基板堆料機93之路徑稱為“回路”。塗佈站3中，在基板21的第2面形成薄膜圖案。正式固化部4B中，形成於第2面之薄膜圖案被正式固化。 As shown in Figure 20D. Each of the transport apparatus 100 carries out one sheet 21 accumulated in the temporary storage device 95, and transports it to the substrate stocker 93 via the coating station 3 and the main solidified portion 4B of the reversing station 4. The path from the temporary storage device 95 to the substrate stocker 93 is referred to as a "loop." In the coating station 3, a thin film pattern is formed on the second surface of the substrate 21. In the main solidified portion 4B, the film pattern formed on the second surface is completely cured.

如第20圖E所示，臨時蓄積於臨時蓄積裝置95之基板21全部搬送到基板堆料機93。蓄積於基板堆料機93之基板21在兩面形成有薄膜圖案。 As shown in FIG. 20E, all of the substrates 21 temporarily accumulated in the temporary storage device 95 are transported to the substrate stocker 93. The substrate 21 accumulated in the substrate stocker 93 is formed with a thin film pattern on both surfaces.

實施例12中，不產生在第20圖B所示之去路中搬送之基板與在第20圖D所示之回路中搬送之基板的交錯。因此，在去路搬送1片基板期間，能夠從基板堆料機93向去路送出應接著處理之基板。 In the twelfth embodiment, the interleaving of the substrate conveyed in the outward path shown in Fig. 20B and the substrate conveyed in the circuit shown in Fig. 20D are not generated. Therefore, during the process of transporting one substrate by the way, the substrate to be processed can be sent out from the substrate stocker 93 to the outward path.

[實施例13] [Example 13]

第21圖中示出基於實施例13之基板製造裝置的概要圖。未處理的基板蓄積於搬入側的基板堆料機93。搬送裝置100在第1級塗佈站3、反轉站4的正式固化部4B、反轉站4的反轉部4C、中間堆料機98、第2級塗布站6、正式固化站96及搬出側的基板堆料機97之間搬送基板。塗佈站3、塗佈站6例如採用第14圖所示之基於實施例9之塗佈站。反轉站4採用第16圖A所示之基於實施例10之反轉站。正式固化站96例如包括基於實施例1之基板製造裝置的輥傳送帶16及紫外線照射裝置8。藉由控制裝置20控制搬送裝置100及各站內的裝置。 Fig. 21 is a schematic view showing a substrate manufacturing apparatus according to the thirteenth embodiment. The unprocessed substrate is accumulated on the substrate stacker 93 on the carry-in side. The conveying device 100 is in the first-stage coating station 3, the main solidifying portion 4B of the reversing station 4, the reversing portion 4C of the reversing station 4, the intermediate stocker 98, the second-stage coating station 6, the main curing station 96, and The substrate is transferred between the substrate stackers 97 on the carry-out side. The coating station 3 and the coating station 6 employ, for example, a coating station based on Example 9 shown in Fig. 14. The inversion station 4 employs the inversion station based on Embodiment 10 shown in Fig. 16A. The main curing station 96 includes, for example, a roll conveyor 16 and an ultraviolet irradiation device 8 based on the substrate manufacturing apparatus of the first embodiment. The transport device 100 and the devices in each station are controlled by the control device 20.

藉由控制裝置20控制搬送裝置100及各站內的裝置。控制裝置20包括記憶裝置20c。記憶裝置20c記憶有無第1級塗佈站3及第2級塗佈站6的故障。當塗佈站3、塗佈站6未發生故障時，蓄積於基板堆料機93之基板藉由搬送裝置100經由第1級塗佈站3、反轉站4的正式固化部4B、反轉站4的反轉部4C、第2級塗佈站6及正式固化站96搬送至搬出側的基板堆料機97。藉此，在基板的兩面形成薄膜圖案。不使用中間堆料機98。 The transport device 100 and the devices in each station are controlled by the control device 20. The control device 20 includes a memory device 20c. The memory device 20c memorizes the presence or absence of failure of the first-stage coating station 3 and the second-stage coating station 6. When the coating station 3 and the coating station 6 have not failed, the substrate stored in the substrate stacker 93 passes through the first stage coating station 3 and the main solidified portion 4B of the reversing station 4 by the transfer device 100, and reverses. The inverting portion 4C of the station 4, the second stage coating station 6, and the main curing station 96 are transported to the substrate stacker 97 on the carry-out side. Thereby, a thin film pattern is formed on both surfaces of the substrate. The intermediate stocker 98 is not used.

中間堆料機98配置於反轉站4與第2級塗佈站6之間。中間堆料機98能夠蓄積複數個基板。並且，蓄積於中間堆料機98之基板能夠搬出至基板製造裝置的外部。相反地，亦能夠將基板從基板製造裝置的外部搬入到中間堆料機98。 The intermediate stocker 98 is disposed between the inversion station 4 and the second stage coating station 6. The intermediate stocker 98 is capable of accumulating a plurality of substrates. Further, the substrate stored in the intermediate stocker 98 can be carried out to the outside of the substrate manufacturing apparatus. Conversely, the substrate can also be carried from the outside of the substrate manufacturing apparatus to the intermediate stocker 98.

第22圖A、第22圖B及第22圖C中分別示出第2 級塗佈站6發生故障時的基板的路徑的第1例、第2例及第3例。第22圖A所示之第1例中，向第2級塗佈站6及正式固化站96搬入基板，但是未進行任何處理就被搬出。第22圖B所示之第2例中，從反轉站4搬出之基板不經由第2級塗佈站6及正式固化站96就直接搬送至搬出用的基板堆料機97。第22圖C所示之第3例中，在反轉站4中經反轉處理之基板藉由搬送裝置100搬送至中間堆料機98。處理後的基板從中間堆料機98取出至外部。 The second drawing is shown in Fig. 22, A, 22, and 22, respectively. The first example, the second example, and the third example of the path of the substrate when the level coating station 6 fails. In the first example shown in Fig. 22A, the substrate was carried into the second-stage coating station 6 and the main curing station 96, but was carried out without any treatment. In the second example shown in FIG. 22B, the substrate carried out from the inversion station 4 is directly conveyed to the substrate stacker 97 for carry-out without passing through the second-stage coating station 6 and the main curing station 96. In the third example shown in FIG. 22C, the substrate subjected to the reverse processing in the inversion station 4 is transported to the intermediate stocker 98 by the transport device 100. The processed substrate is taken out from the intermediate stocker 98 to the outside.

第23圖A、第23圖B及第23圖C中分別示出第1級塗佈站3發生故障時的基板的路徑的第1例、第2例及第3例。第23圖A所示之第1例中，基板搬入第1級塗佈站3及反轉站4，但是未進行任何處理就被搬出。第23圖B所示之第2例中，從搬入側的基板堆料機93搬出之基板不經由第1級塗佈站3及反轉站4就直接搬送至第2級塗佈站6。第23圖C所示之第3例中，不使用搬入側的基板堆料機93，將未處理的基板準備於中間堆料機98。未處理的基板從中間堆料機98搬送至第2級塗佈站6。 The first example, the second example, and the third example of the path of the substrate when the first-stage coating station 3 fails are shown in FIG. 23A, FIG. 23B, and FIG. 23C. In the first example shown in Fig. 23A, the substrate is carried into the first-stage coating station 3 and the reversing station 4, but is carried out without any treatment. In the second example shown in FIG. 23B, the substrate carried out from the substrate stacker 93 on the loading side is directly conveyed to the second-stage coating station 6 without passing through the first-stage coating station 3 and the reversing station 4. In the third example shown in Fig. 23C, the unprocessed substrate is prepared in the intermediate stocker 98 without using the substrate stacker 93 on the carry-in side. The unprocessed substrate is transferred from the intermediate stocker 98 to the second-stage coating station 6.

如第22圖A~第23圖C所示，即使在塗佈站3、塗佈站6中的其中一方發生故障之情況下，亦能夠在基板的單面形成薄膜圖案。 As shown in FIGS. 22A to 23C, even when one of the coating station 3 and the coating station 6 fails, a thin film pattern can be formed on one surface of the substrate.

[實施例14] [Embodiment 14]

參閱第24圖A~第24圖D，對基於實施例14之基板製造裝置進行說明。以下，對與實施例13的不同點進行說明，而對相同的結構省略說明。實施例14中配置移動堆料機99A、移動堆料機99B來代替實施例13的搬入用的基板堆料機93及中間堆料機98(第21圖)。移動堆料機99A、移動堆料機99B能夠從搬送裝置100的搬送路徑拆卸來進行移動。第24圖A~第24圖D中示出第2級塗佈站6發生故障時的基板的處理流程。 Refer to Figure 24 to Figure 24D for the basis of Example 14. The board manufacturing apparatus will be described. Hereinafter, differences from the thirteenth embodiment will be described, and the description of the same configurations will be omitted. In the fourteenth embodiment, the moving stocker 99A and the moving stocker 99B are disposed instead of the substrate stocker 93 and the intermediate stocker 98 (FIG. 21) for carrying in the third embodiment. The moving stocker 99A and the moving stocker 99B can be detached from the transport path of the transport device 100 and moved. The processing flow of the substrate when the second-stage coating station 6 fails is shown in FIGS. 24A to 24D.

如第24圖A所示，在搬入用移動堆料機99A上堆積有複數個未處理的基板。在另一方的移動堆料機99B上蓄積基板。移動堆料機99A及移動堆料機99B分別配置於第21圖的搬入用的基板堆料機93及中間堆料機98的位置。搬送裝置100從移動堆料機99A經由第1級塗佈站3及反轉站4將基板搬送至另一方的移動堆料機99B。藉此，在基板的第1面形成薄膜圖案。蓄積於移動堆料機99A之所有基板搬送至另一方的移動堆料機99B之後，如第24圖B所示，從搬送裝置100的搬送路徑拆卸移動堆料機99A、移動堆料機99B。 As shown in Fig. 24A, a plurality of unprocessed substrates are stacked on the moving loader 99A. The substrate is accumulated on the other mobile stocker 99B. The moving stocker 99A and the moving stocker 99B are disposed at positions of the loading substrate stacker 93 and the intermediate stocker 98 of Fig. 21, respectively. The conveying device 100 transfers the substrate from the moving stocker 99A to the other moving stocker 99B via the first stage coating station 3 and the reversing station 4. Thereby, a thin film pattern is formed on the first surface of the substrate. After all the substrates stored in the mobile stocker 99A are transported to the other mobile stocker 99B, as shown in FIG. 24B, the moving stocker 99A and the moving stocker 99B are detached from the transport path of the transport apparatus 100.

如第24圖C所示，將空移動堆料機99A配置於中間堆料機98(第21圖)的位置，將蓄積有單面上形成有薄膜圖案之基板之移動堆料機99B配置於搬入用的基板堆料機93(第21圖)的位置。移動堆料機99A、移動堆料機99B的移動可人工進行，亦可以對移動堆料機99A、移動堆料機99B賦予自動運轉功能。 As shown in Fig. 24C, the empty moving stocker 99A is placed at the position of the intermediate stocker 98 (Fig. 21), and the moving stocker 99B in which the substrate on which the film pattern is formed on one side is placed is disposed. The position of the substrate stacker 93 (Fig. 21) for loading. The movement of the mobile stocker 99A and the mobile stocker 99B can be manually performed, and the automatic loader function can also be given to the mobile stocker 99A and the mobile stocker 99B.

如第24圖D所示，從移動堆料機99B經由塗佈站3 及反轉站4的正式固化部4B，將基板搬送至另一方的移動堆料機99A。藉此，在基板的第2面形成薄膜圖案。當反轉站4採用第16圖A所示之基於實施例10之反轉站4時，基板通過反轉站4C，但是不進行反轉動作。 As shown in Fig. 24, D, from the mobile stocker 99B via the coating station 3 The main solidified portion 4B of the reversing station 4 transports the substrate to the other mobile stocker 99A. Thereby, a thin film pattern is formed on the second surface of the substrate. When the inversion station 4 employs the inversion station 4 based on the tenth embodiment shown in Fig. 16, the substrate passes through the inversion station 4C, but does not perform the inversion operation.

實施例14中，能夠僅由藉由搬送裝置100向一方向搬送基板來在兩面形成薄膜圖案。當第1級塗佈站3發生故障時，將第21圖所示之中間堆料機98及搬出用的基板堆料機97分別置換成移動堆料機99A、移動堆料機99B即可。 In the fourteenth embodiment, the film pattern can be formed on both surfaces only by transporting the substrate in one direction by the transfer device 100. When the first stage coating station 3 fails, the intermediate stocker 98 shown in Fig. 21 and the substrate stocker 97 for carrying out are replaced with a moving stocker 99A and a moving stocker 99B.

[實施例15] [Example 15]

第25圖中示出基於實施例15之基板製造裝置的概要圖。以下，對與第21圖所示之實施例13的不同點進行說明，而對相同的結構省略說明。實施例15中未配置第21圖所示之中間堆料機98及正式固化站96。亦即，相對於2個塗佈站3、塗佈站6配置1個正式固化部4B。 Fig. 25 is a schematic view showing a substrate manufacturing apparatus according to a fifteenth embodiment. Hereinafter, differences from the thirteenth embodiment shown in FIG. 21 will be described, and the description of the same configurations will be omitted. In the fifteenth embodiment, the intermediate stocker 98 and the final curing station 96 shown in Fig. 21 are not disposed. That is, one main solidified portion 4B is disposed with respect to the two coating stations 3 and the coating station 6.

從搬入用的基板堆料機93到第2級塗佈站6的基板的流程與第21圖所示之實施例13相同。實施例15中，在第2級塗佈站6中在第2面形成有薄膜圖案之基板藉由搬送裝置100返回至反轉站4的正式固化部4B。正式固化部4B中基板的第2面的薄膜圖案被正式固化。之後，基板從正式固化部4B搬送至搬出用的基板堆料機97。 The flow from the substrate stacker 93 for loading to the substrate of the second-stage coating station 6 is the same as that of the thirteenth embodiment. In the fifteenth embodiment, the substrate on which the thin film pattern is formed on the second surface in the second-stage coating station 6 is returned to the main solidified portion 4B of the inversion station 4 by the transfer device 100. The thin film pattern of the second surface of the substrate in the main solidified portion 4B is formally cured. Thereafter, the substrate is transferred from the main solidified portion 4B to the substrate stocker 97 for carrying out.

與塗佈站3、塗佈站6中的薄膜材料的塗布處理時間相比，正式固化部4B中的正式固化處理較短時，如實施例15，在1個正式固化部4B中進行第1面及第2面的薄膜圖案的正式固化即可。 When the main curing process in the main curing portion 4B is shorter than the coating processing time of the film material in the coating station 3 and the coating station 6, as implemented In Example 15, the film form of the first surface and the second surface may be completely cured in one of the main cured portions 4B.

第26圖中示出基於實施例15的變形例之基板製造裝置的各站的平面佈局的一例。如第26圖所示，搬入用的基板堆料機93、第1級塗佈站3、正式固化部4B、反轉部4C、第2級塗佈站6及搬出用的基板堆料機97沿著圓周配置。該圓周的中心部配置有搬送裝置100。搬送裝置100能夠使用例如旋轉伸縮手臂。 Fig. 26 is a view showing an example of a plan layout of each station of the substrate manufacturing apparatus according to the modification of the fifteenth embodiment. As shown in Fig. 26, the substrate stacker 93 for loading, the first-stage coating station 3, the main solidified portion 4B, the reversing portion 4C, the second-stage coating station 6, and the substrate stacker 97 for loading and unloading Arrange along the circumference. The conveying device 100 is disposed at the center of the circumference. The transfer device 100 can use, for example, a rotary telescopic arm.

根據以上實施例對本發明進行了說明，但是本發明不限於此。例如，能夠進行各種變更、改良、組合等，這對本領域技術人員來講是顯而易見的。 The present invention has been described based on the above embodiments, but the present invention is not limited thereto. For example, it will be apparent to those skilled in the art that various changes, modifications, combinations and the like can be made.

1‧‧‧搬出入口 1‧‧‧ moving out of the entrance

2‧‧‧定位站 2‧‧‧Location Station

3‧‧‧塗佈站 3‧‧‧ coating station

4‧‧‧反轉站 4‧‧‧Reverse station

4A‧‧‧搬入部 4A‧‧‧Moving Department

4B‧‧‧正式固化部 4B‧‧‧Formal curing department

4C‧‧‧反轉部 4C‧‧‧Reversal Department

4D‧‧‧搬出部 4D‧‧‧ Moving out

5‧‧‧定位站 5‧‧‧Location Station

6‧‧‧塗佈站 6‧‧‧ coating station

7‧‧‧搬出入口 7‧‧‧ moving out of the entrance

8、9‧‧‧紫外線照射裝置 8, 9‧‧‧ ultraviolet irradiation device

11~14‧‧‧提昇器 11~14‧‧‧Elevator

15、16‧‧‧傳送帶 15, 16‧‧‧Conveyor belt

17‧‧‧搬出口 17‧‧‧Moving out

18‧‧‧筐體 18‧‧‧Shell

20‧‧‧控制裝置 20‧‧‧Control device

20a、20b、20c‧‧‧記憶裝置 20a, 20b, 20c‧‧‧ memory devices

21~27‧‧‧基板 21~27‧‧‧Substrate

22a~22d‧‧‧定位標記 22a~22d‧‧‧Positioning mark

31‧‧‧底座 31‧‧‧Base

32‧‧‧Y載物台 32‧‧‧Y stage

33‧‧‧θ載物台 33‧‧‧θ stage

34‧‧‧卡盤板 34‧‧‧ chuck plate

35~38‧‧‧CCD攝像機 35~38‧‧‧CCD camera

41‧‧‧底座 41‧‧‧Base

42‧‧‧框架 42‧‧‧Frame

42a、42b‧‧‧支柱 42a, 42b‧‧ ‧ pillar

42c‧‧‧橫樑 42c‧‧‧beam

43‧‧‧X載物台 43‧‧‧X stage

44‧‧‧Y載物台 44‧‧‧Y stage

45‧‧‧卡盤板 45‧‧‧ chuck plate

46‧‧‧連結構件 46‧‧‧Connected components

47a~47f‧‧‧噴嘴單元 47a~47f‧‧‧Nozzle unit

47a₁~47a₄‧‧‧噴頭 47a ₁ ~47a ₄ ‧‧‧sprinkler

47a₅~47a₉‧‧‧紫外光源 47a ₅ ~47a ₉ ‧‧‧UV source

47a_c‧‧‧噴嘴夾具 47a _c ‧‧‧Nozzle fixture

48‧‧‧臨時設置載物台 48‧‧‧ Temporary setting of the stage

49‧‧‧θ載物台 49‧‧‧θ stage

50‧‧‧基板反轉裝置 50‧‧‧Substrate reversal device

51‧‧‧基板保持器 51‧‧‧Substrate holder

52‧‧‧支撐構件 52‧‧‧Support members

53‧‧‧真空吸附墊 53‧‧‧Vacuum suction pad

54‧‧‧按壓輥 54‧‧‧Press roller

55‧‧‧夾緊機構 55‧‧‧Clamping mechanism

56‧‧‧導引件 56‧‧‧Guide

60‧‧‧紫外線照射裝置 60‧‧‧UV irradiation device

61‧‧‧支撐構件 61‧‧‧Support members

62‧‧‧紫外光源 62‧‧‧UV source

63~66‧‧‧CCD攝像機 63~66‧‧‧CCD camera

70‧‧‧液滴吐出裝置 70‧‧‧Drop ejection device

80A‧‧‧第1交接區域 80A‧‧‧1st handover area

80B‧‧‧第2交接區域 80B‧‧‧2nd handover area

81A‧‧‧第1定位區域 81A‧‧‧1st positioning area

81B‧‧‧第2定位區域 81B‧‧‧2nd positioning area

82‧‧‧塗佈區域 82‧‧‧Coating area

83‧‧‧攝像裝置 83‧‧‧ camera

85A‧‧‧第1塗佈站 85A‧‧‧1st coating station

85B‧‧‧第2塗佈站 85B‧‧‧2nd coating station

90‧‧‧輥傳送帶 90‧‧‧Roller belt

90A‧‧‧第1輥 90A‧‧‧1st roll

90B‧‧‧第2輥 90B‧‧‧2nd roller

91、92‧‧‧正式固化用光源 91, 92‧‧‧Formal curing light source

93‧‧‧基板堆料機 93‧‧‧Substrate stacker

94‧‧‧正式固化站 94‧‧‧Formal curing station

95‧‧‧臨時蓄積裝置 95‧‧‧ Temporary accumulation device

96‧‧‧正式固化站 96‧‧‧Formal curing station

97‧‧‧基板堆料機 97‧‧‧Substrate stacker

98‧‧‧中間堆料機 98‧‧‧Intermediate stacker

99A、99B‧‧‧移動堆料機 99A, 99B‧‧‧ mobile stacker

100‧‧‧搬送裝置 100‧‧‧Transporting device

第1圖係表示基於實施例1之基板製造裝置之概要圖。 Fig. 1 is a schematic view showing a substrate manufacturing apparatus according to the first embodiment.

第2圖A係具備於定位站之定位裝置的概要圖，第2圖B及第2圖C係表示定位站內的底層基板之俯視圖。 Fig. 2A is a schematic view of a positioning device provided in a positioning station, and Fig. 2B and Fig. 2C are plan views showing an underlying substrate in a positioning station.

第3圖A及第3圖B係具備於塗佈站之液滴吐出裝置的概要圖。 3A and 3B are schematic views of a droplet discharge device provided at a coating station.

第4圖A係表示噴嘴單元之概要圖，第4圖B係表示噴嘴單元的液滴吐出面之仰視圖，第4圖C係表示噴嘴單元的配置之概要俯視圖。 Fig. 4A is a schematic view showing a nozzle unit, Fig. 4B is a bottom view showing a droplet discharge surface of the nozzle unit, and Fig. 4C is a schematic plan view showing an arrangement of the nozzle unit.

第5圖A~第5圖D係具備於反轉站之基板反轉裝置及紫外線照射裝置的概要圖。 5A to 5D are schematic views of a substrate inverting device and an ultraviolet irradiation device provided in a reversing station.

第6圖A、第6圖C及第6圖E係基板保持器的概要俯視圖，第6圖B、第6圖D及第6圖F係基板保持器的概要側視圖。 6A, 6C, and 6E are schematic plan views of the substrate holder, and FIG. 6B, FIG. 6D, and FIG. 6F are schematic side views of the substrate holder.

第7圖係基於實施例2之基板製造裝置的概要圖。 Fig. 7 is a schematic view showing a substrate manufacturing apparatus based on the second embodiment.

第8圖係基於實施例3之基板製造裝置的概要圖。 Fig. 8 is a schematic view showing a substrate manufacturing apparatus based on the third embodiment.

第9圖係基於實施例4之基板製造裝置的概要圖。 Fig. 9 is a schematic view showing a substrate manufacturing apparatus based on the fourth embodiment.

第10圖係基於實施例5之基板製造裝置的概要圖。 Fig. 10 is a schematic view showing a substrate manufacturing apparatus based on the fifth embodiment.

第11圖係基於實施例6之基板製造裝置的概要圖。 Fig. 11 is a schematic view showing a substrate manufacturing apparatus based on the sixth embodiment.

第12圖A~第12圖E係基於實施例7之基板製造裝置的反轉站的概要圖。 12A to 12D are schematic views of a reversing station based on the substrate manufacturing apparatus of the seventh embodiment.

第13圖A~第13圖D係基於實施例8之基板製造裝置的反轉站的概要圖。 13A to 13D are schematic views of a reversing station based on the substrate manufacturing apparatus of the eighth embodiment.

第14圖係基於實施例9之基板製造裝置的塗佈站的概要俯視圖。 Fig. 14 is a schematic plan view of a coating station based on the substrate manufacturing apparatus of the ninth embodiment.

第15-1圖中，第15圖A~第15圖D係用於說明在基於實施例9之塗佈站形成薄膜圖案之順序之塗佈站內的概要俯視圖。 In Fig. 15-1, Fig. 15 to Fig. 15D are schematic plan views for explaining the steps in the coating station in which the film pattern is formed by the coating station according to the ninth embodiment.

第15-2圖中，第15圖E~第15圖H係用於說明在基於實施例9之塗佈站形成薄膜圖案之順序之塗佈站內的概要俯視圖。 In Fig. 15-2, Fig. 15E to Fig. 15H are schematic plan views for explaining the order of forming a film pattern in the coating station according to the ninth embodiment.

第16-1圖中，第16圖A~第16圖C係基於實施例10之基板製造裝置的反轉站的概要圖。 In Fig. 16-1, Fig. 16 to Fig. 16C are schematic views of a reversing station based on the substrate manufacturing apparatus of the tenth embodiment.

第16-2圖中，第16圖D~第16圖E係基於實施例10之基板製造裝置的反轉站的概要圖。 In Fig. 16-2, Fig. 16D to Fig. 16E are schematic views of a reversing station based on the substrate manufacturing apparatus of the tenth embodiment.

第17圖係基於實施例11之基板製造裝置的概要圖。 Fig. 17 is a schematic view showing a substrate manufacturing apparatus based on the eleventh embodiment.

第18-1圖中，第18圖A~第18圖C係用於說明以基於實施例11之基板製造裝置進行基板的處理時的處理順序之概要圖。 18 to 18, FIG. 18C is a schematic view for explaining a processing procedure when the substrate is processed by the substrate manufacturing apparatus of the eleventh embodiment.

第18-2圖中，第18圖D~第18圖E係用於說明以基於實施例11之基板製造裝置進行基板的處理時的處理順序之概要圖。 In the 18th to the 18th, FIG. 18D to FIG. 18E are schematic diagrams for explaining the processing procedure when the substrate is processed by the substrate manufacturing apparatus according to the eleventh embodiment.

第18-3圖中，第18圖F~第18圖G係用於說明以基於實施例11之基板製造裝置進行基板的處理時的處理順序之概要圖。 18 to 35, FIG. 18 is a schematic view showing a processing procedure when the substrate is processed by the substrate manufacturing apparatus of the eleventh embodiment.

第19圖A係基於實施例12之基板製造裝置的概要圖，第19圖B係臨時蓄積裝置的概要側視圖。 Fig. 19 is a schematic view showing a substrate manufacturing apparatus according to a twelfth embodiment, and Fig. 19B is a schematic side view of the temporary storage device.

第20-1圖中，第20圖A~第20圖C係用於說明以基於實施例12之基板製造裝置進行基板的處理時的處理順序之概要圖。 In the 20th to the 20th, FIG. 20 to FIG. 20C are schematic views for explaining the processing procedure when the substrate is processed by the substrate manufacturing apparatus according to the twelfth embodiment.

第20-2圖中，第20圖D~第20圖E係用於說明以基於實施例12之基板製造裝置進行基板的處理時的處理順序之概要圖。 In the 20th to the 20th, the 20th to the 20thth E is a schematic view for explaining the processing procedure when the substrate is processed by the substrate manufacturing apparatus according to the twelfth embodiment.

第21圖係基於實施例13之基板製造裝置的概要圖。 Fig. 21 is a schematic view showing a substrate manufacturing apparatus based on Example 13.

第22圖A、第22圖B及第22圖C係分別表示第2級塗佈站發生故障時的基板路徑的第1例、第2例及第3例之概要圖。 Fig. 22A, Fig. 22B, and Fig. 22C are schematic diagrams showing a first example, a second example, and a third example of the substrate path when the second-stage coating station fails.

第23圖A、第23圖B及第23圖C係分別表示第1級塗佈站發生故障時的基板路徑的第1例、第2例及第3 例之概要圖。 23A, 23B, and 23C show the first, second, and third substrate paths when the first-stage coating station fails. A summary of the example.

第24-1圖中，第24圖A~第24圖B係用於說明以基於實施例14之基板製造裝置進行基板的處理時的處理順序之概要圖。 In the case of Fig. 24-1, Fig. 24 to Fig. 24B are schematic diagrams for explaining a processing procedure when the substrate is processed by the substrate manufacturing apparatus of the fourteenth embodiment.

第24-2圖中，第24圖C~第24圖D係用於說明以基於實施例14之基板製造裝置進行基板的處理時的處理順序之概要圖。 In the 24-second drawing, FIG. 24 to FIG. 24D are schematic diagrams for explaining a processing procedure when the substrate is processed by the substrate manufacturing apparatus according to the fourteenth embodiment.

第25圖係基於實施例15之基板製造裝置的概要圖。 Fig. 25 is a schematic view showing a substrate manufacturing apparatus based on Example 15.

第26圖係基於實施例15的變形例之基板製造裝置的概要圖。 Fig. 26 is a schematic view showing a substrate manufacturing apparatus according to a modification of the fifteenth embodiment.

1‧‧‧搬出入口 1‧‧‧ moving out of the entrance

2‧‧‧定位站 2‧‧‧Location Station

3‧‧‧塗佈站 3‧‧‧ coating station

4‧‧‧反轉站 4‧‧‧Reverse station

5‧‧‧定位站 5‧‧‧Location Station

6‧‧‧塗佈站 6‧‧‧ coating station

7‧‧‧搬出入口 7‧‧‧ moving out of the entrance

11~14‧‧‧提昇器 11~14‧‧‧Elevator

15、16‧‧‧傳送帶 15, 16‧‧‧Conveyor belt

18‧‧‧筐體 18‧‧‧Shell

20‧‧‧控制裝置 20‧‧‧Control device

20a‧‧‧記憶裝置 20a‧‧‧ memory device

21~27‧‧‧基板 21~27‧‧‧Substrate

Claims

一種基板製造裝置，具有：第1塗佈站，在底層基板的單面塗佈液狀薄膜材料並對塗佈於前述底層基板之薄膜材料照射光來使薄膜材料的表層部固化；反轉站，被搬入在前述第1塗佈站被塗佈薄膜材料之底層基板，對塗佈於底層基板之薄膜材料照射光來使薄膜材料固化至其內部，並且使前述底層基板的背面和表面反轉；搬送裝置，在前述第1塗佈站與前述反轉站之間搬送底層基板；及控制裝置，控制前述第1塗佈站、前述反轉站及前述搬送裝置，前述控制裝置控制前述搬送裝置並將在前述第1塗佈站經處理之底層基板搬送到前述反轉站。 A substrate manufacturing apparatus comprising: a first coating station, which applies a liquid film material on one surface of a base substrate, and irradiates light to a film material applied to the underlying substrate to cure a surface layer portion of the film material; And moving onto the underlying substrate coated with the thin film material at the first coating station, irradiating light to the thin film material applied to the underlying substrate to cure the thin film material to the inside thereof, and inverting the back surface and surface of the underlying substrate a conveying device that conveys an underlying substrate between the first coating station and the reversing station; and a control device that controls the first coating station, the reversing station, and the conveying device, wherein the control device controls the conveying device The substrate processed at the first coating station is transferred to the inversion station.

如申請專利範圍第1項所述之基板製造裝置，其中，前述反轉站在使塗佈於前述底層基板之薄膜材料固化至內部之後，使前述底層基板的背面和表面反轉。 The substrate manufacturing apparatus according to claim 1, wherein the inversion station reverses a back surface and a surface of the underlying substrate after the film material applied to the underlying substrate is cured inside.

如申請專利範圍第1或2項所述之基板製造裝置，其中，在前述反轉站，照射到塗佈於前述底層基板之薄膜材料之光能密度高於在前述第1塗佈站照射到塗佈於前述底層基板之薄膜材料之光能密度。 The substrate manufacturing apparatus according to claim 1 or 2, wherein, in the inversion station, the light energy density of the film material applied to the underlying substrate is higher than that at the first coating station The light energy density of the film material applied to the underlying substrate.

如申請專利範圍第1項所述之基板製造裝置，其中，前述控制裝置控制前述搬送裝置來將在前述反轉站反轉之底層基板再搬入到前述第1塗佈站。 The substrate manufacturing apparatus according to claim 1, wherein the control device controls the transfer device to reload the underlying substrate inverted in the inversion station to the first coating station.

如申請專利範圍第4項所述之基板製造裝置，其中，更具有蓄積複數片底層基板之臨時蓄積裝置；前述搬送裝置在前述反轉站與前述臨時蓄積裝置之間搬送底層基板；前述控制裝置控制前述搬送裝置來將底層基板從前述反轉站搬送至前述臨時蓄積裝置，在前述臨時蓄積裝置依次蓄積複數片底層基板，並依次取出蓄積於前述臨時蓄積裝置之複數片底層基板，搬送至前述第1塗佈站。 The substrate manufacturing apparatus according to claim 4, further comprising a temporary storage device for storing a plurality of substrate substrates; wherein the transfer device transports the underlying substrate between the inversion station and the temporary storage device; and the control device The transfer device is controlled to transport the underlying substrate from the reversing station to the temporary accumulating device, and the plurality of underlying substrates are sequentially stored in the temporary accumulating device, and the plurality of underlying substrates accumulated in the temporary accumulating device are sequentially taken out and transported to the foregoing The first coating station.

如申請專利範圍第1至3項中任一項所述之基板製造裝置，其中，更具有第2塗佈站，在該第2塗佈站中在底層基板的單面塗佈液狀薄膜材料，並使塗佈於前述底層基板之薄膜材料的表層部固化，前述搬送裝置將在前述反轉站反轉之底層基板搬送至前述第2塗佈站。 The substrate manufacturing apparatus according to any one of claims 1 to 3, further comprising a second coating station, wherein the liquid coating material is applied to one surface of the underlying substrate in the second coating station And curing the surface layer portion of the film material applied to the underlying substrate, and the transfer device transports the underlying substrate reversed by the inversion station to the second coating station.

如申請專利範圍第6項所述之基板製造裝置，其中，前述控制裝置進一步具有記憶裝置，其記憶是否在前述第1塗佈站及前述第2塗佈站發生故障，當前述第1塗佈站及前述第2塗佈站的其中一方發生故障時，前述控制裝置控制前述搬送裝置來從發生故障之塗佈站搬出該底層基板，而不在搬入發生故障之塗佈站之底層基板塗佈薄膜材料。 The substrate manufacturing apparatus according to claim 6, wherein the control device further includes a memory device that memorizes whether the first coating station and the second coating station are malfunctioning, and the first coating When one of the cloth station and the second coating station fails, the control device controls the transfer device to carry out the underlying substrate from the failed coating station, and does not apply the underlying substrate to the failed coating station. Film material.

如申請專利範圍第7項所述之基板製造裝置，其中，更具有中間堆料機，其蓄積從前述反轉站搬出之底層基板，當前述第2塗佈站發生故障時，前述控制裝置控制前述搬送裝置來將從前述反轉站搬出之底層基板蓄積於前述中間堆料機中。 The substrate manufacturing apparatus according to claim 7, further comprising an intermediate stacker that accumulates the underlying substrate carried out from the reversing station, and when the second coating station fails, the control device controls The transfer device stores the underlying substrate carried out from the inversion station in the intermediate stacker.

如申請專利範圍第5項所述之基板製造裝置，其中，更具有中間堆料機，其蓄積搬送到前述第2塗佈站之底層基板，當前述第1塗佈站發生故障時，前述控制裝置控制前述搬送裝置來將蓄積於前述中間堆料機之底層基板搬送至第2塗佈站。 The substrate manufacturing apparatus according to claim 5, further comprising an intermediate stacker that accumulates and transports the substrate to the underlying substrate of the second coating station, and when the first coating station fails, the control The apparatus controls the transport apparatus to transport the underlying substrate accumulated in the intermediate stocker to the second coating station.

一種基板製造方法，具有：將底層基板搬入第1塗佈站，在前述第1塗佈站中在前述底層基板的第1面塗佈液狀薄膜材料，並使塗佈於前述底層基板之薄膜材料的表層部固化之製程；從前述第1塗佈站取出前述底層基板並搬入正式固化部，在前述正式固化部中使塗佈於前述底層基板的前述第 1面之薄膜材料固化至其內部之製程；將前述底層基板從前述正式固化部搬送至反轉部，並在前述反轉部中使前述底層基板的背面和表面反轉之製程；從前述反轉部取出前述底層基板，在前述底層基板的上下反轉之狀態下，將前述底層基板搬送至前述第1塗佈站，在前述第1塗佈站中在前述底層基板的第1面的相反側的第2面塗佈液狀薄膜材料，並使塗布於前述底層基板的前述第2面之薄膜材料的表層部固化之製程；及將前述底層基板從前述第1塗佈站搬送至前述正式固化部，在前述正式固化部中使塗佈於前述底層基板的前述第2面之薄膜材料固化至其內部之製程。 A method of manufacturing a substrate, comprising: transferring a substrate to a first coating station, applying a liquid film material to a first surface of the underlying substrate in the first coating station, and applying a film coated on the underlying substrate a process for curing the surface layer portion of the material; taking out the underlying substrate from the first coating station and carrying it into the main curing portion, and applying the first layer to the underlying substrate in the main curing portion a process of curing the film material of one side to the inside thereof; transferring the underlying substrate from the main solidified portion to the inverting portion, and inverting the back surface and the surface of the underlying substrate in the inverting portion; The rotating portion takes out the underlying substrate, and conveys the underlying substrate to the first coating station in a state where the underlying substrate is vertically inverted, and the first coating station is opposite to the first surface of the underlying substrate. Coating a liquid film material on the second surface, and curing a surface layer portion of the film material coated on the second surface of the underlying substrate; and transferring the underlying substrate from the first coating station to the official The curing unit is configured to cure the film material applied to the second surface of the underlying substrate to the inside thereof in the main curing portion.