ITMI20061960A1 - AUTOMATIC OPTICAL ALIGNMENT MACHINE AND INDUCTIVE FIXING OF LAYERS OF A MULTILAYER WITH CIRCUIT PRINTED IN THE FORM OF SEMI-FINISHED - Google Patents

AUTOMATIC OPTICAL ALIGNMENT MACHINE AND INDUCTIVE FIXING OF LAYERS OF A MULTILAYER WITH CIRCUIT PRINTED IN THE FORM OF SEMI-FINISHED

Info

Publication number
ITMI20061960A1
ITMI20061960A1 ITMI20061960A ITMI20061960A1 IT MI20061960 A1 ITMI20061960 A1 IT MI20061960A1 IT MI20061960 A ITMI20061960 A IT MI20061960A IT MI20061960 A1 ITMI20061960 A1 IT MI20061960A1
Authority
IT
Italy
Prior art keywords
multilayer
semi
finished
layers
optical alignment
Prior art date
Application number
Other languages
Italian (it)
Inventor
Bruno Ceraso
Original Assignee
Cedal Equipment Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cedal Equipment Srl filed Critical Cedal Equipment Srl
Priority to ITMI20061960 priority Critical patent/ITMI20061960A1/en
Priority to PCT/IT2006/000834 priority patent/WO2008044254A1/en
Priority to TW96100476A priority patent/TW200817128A/en
Publication of ITMI20061960A1 publication Critical patent/ITMI20061960A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/101—Using electrical induction, e.g. for heating during soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
ITMI20061960 2006-10-13 2006-10-13 AUTOMATIC OPTICAL ALIGNMENT MACHINE AND INDUCTIVE FIXING OF LAYERS OF A MULTILAYER WITH CIRCUIT PRINTED IN THE FORM OF SEMI-FINISHED ITMI20061960A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
ITMI20061960 ITMI20061960A1 (en) 2006-10-13 2006-10-13 AUTOMATIC OPTICAL ALIGNMENT MACHINE AND INDUCTIVE FIXING OF LAYERS OF A MULTILAYER WITH CIRCUIT PRINTED IN THE FORM OF SEMI-FINISHED
PCT/IT2006/000834 WO2008044254A1 (en) 2006-10-13 2006-12-04 Automatic machine for optical alignment and inductive bonding of the layers of a semi-finished multilayer printed circuit
TW96100476A TW200817128A (en) 2006-10-13 2007-01-05 Automatic machine for optical alignment and inductive bonding of the layers of a semi-finished multilayer printed circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITMI20061960 ITMI20061960A1 (en) 2006-10-13 2006-10-13 AUTOMATIC OPTICAL ALIGNMENT MACHINE AND INDUCTIVE FIXING OF LAYERS OF A MULTILAYER WITH CIRCUIT PRINTED IN THE FORM OF SEMI-FINISHED

Publications (1)

Publication Number Publication Date
ITMI20061960A1 true ITMI20061960A1 (en) 2008-04-14

Family

ID=38136076

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI20061960 ITMI20061960A1 (en) 2006-10-13 2006-10-13 AUTOMATIC OPTICAL ALIGNMENT MACHINE AND INDUCTIVE FIXING OF LAYERS OF A MULTILAYER WITH CIRCUIT PRINTED IN THE FORM OF SEMI-FINISHED

Country Status (3)

Country Link
IT (1) ITMI20061960A1 (en)
TW (1) TW200817128A (en)
WO (1) WO2008044254A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013015157A1 (en) * 2011-07-27 2013-01-31 住友重機械工業株式会社 Device and method for producing substrate
CN107870252B (en) * 2017-12-21 2024-01-23 深圳市新啟电子科技有限公司 Test fixture for electronic components
CN108724047B (en) * 2018-06-21 2020-08-14 邵东智能制造技术研究院有限公司 Vice overturning method and vice clamping device
CN110682271B (en) * 2019-09-03 2023-04-04 贵州航天电器股份有限公司 Equipment and method for replacing pins of carriers in circular connector production line
CN111712055B (en) * 2020-08-22 2020-11-24 东莞栢能电子科技有限公司 Control device for double-sided jointed boards of PCB
CN112935749B (en) * 2021-03-04 2024-05-31 广西玉柴机器股份有限公司 Automatic overturning device for diesel engine tray
CN113490350A (en) * 2021-07-28 2021-10-08 湖南维胜科技电路板有限公司 PCB and laminating process thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2190757B1 (en) * 2001-12-28 2005-07-16 Chemplate Materials, S.L. PROCEDURE FOR THE WELDING OF THE CONSTITUTIVE LAYERS OF A MULTI-PAPER AND MACHINE PRINTED CIRCUIT FOR THE SAME.
US20040055131A1 (en) * 2002-09-24 2004-03-25 Abid Ghuman Method of assembling vehicles in a flexible manufacturing system

Also Published As

Publication number Publication date
TW200817128A (en) 2008-04-16
WO2008044254A1 (en) 2008-04-17

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