TW201318501A - Method for manufacturing bending type printed circuit board - Google Patents
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Abstract
Description
本發明是有關於一種彎折式印刷電路板的製造方法。The present invention relates to a method of manufacturing a bent printed circuit board.
可撓性印刷電路板需根據使用的環境及狀態來選擇適當的印刷電路板。若在某些條件下不需要持續動態撓折，如組裝、重工或維修時只需要彎折數次，則可使用半撓折(semi-flex)印刷電路板。The flexible printed circuit board needs to select an appropriate printed circuit board depending on the environment and state of use. Semi-flex printed circuit boards can be used if continuous dynamic flexing is not required under certain conditions, such as assembly, rework, or repair, which requires only a few bends.
半撓折(semi-flex)印刷電路板通常是以一般電路板的製程先製造出印刷電路板，然後將需要彎曲的部分厚度減薄，使此部分具有可彎曲性。但此種印刷電路板的彎曲半徑(bending radius)最小只能達到3.5mm左右，且在90°彎曲的情況下，僅可彎曲十次以上。並且，上述印刷電路板無法彎曲到180°。由此可知，此半撓折印刷電路板的彎曲特性仍有改善的空間。A semi-flex printed circuit board is usually manufactured by a general circuit board process, and then the thickness of the portion to be bent is thinned to make the portion flexible. However, the bending radius of such a printed circuit board can only be as small as about 3.5 mm, and can be bent only ten times or more in the case of 90° bending. Also, the above printed circuit board cannot be bent to 180°. It can be seen that there is still room for improvement in the bending characteristics of the semi-flex printed circuit board.
因此，需要一種新穎的印刷電路板製造方法，以其能改善上述問題。Therefore, there is a need for a novel printed circuit board manufacturing method that can improve the above problems.
本發明係提供一種彎折式印刷電路板之製造方法。此製造方法的優點在於製造成本與材料成本均低，且製備出的彎折式印刷電路板具有良好的彎曲特性。The present invention provides a method of manufacturing a bent printed circuit board. The manufacturing method has the advantages of low manufacturing cost and material cost, and the prepared bent printed circuit board has good bending characteristics.
在一實施方式中，製造方法包含下列步驟。提供硬式核心板。形成不含玻璃纖維的黏著層於硬式核心板上。壓合預浸材及第一金屬層於黏著層上，以形成複合板。預浸材位於黏著層及第一金屬層間。複合板具有預定彎折之第一區以及第二區，第二區鄰接第一區。圖案化第一金屬層以形成第一電路層。於第一區中形成一開口貫穿硬式核心板，以露出黏著層之一部分。彎折開口下方之黏著層及預浸材形成彎曲部。In one embodiment, the method of manufacture comprises the following steps. Provide a hard core board. A glass fiber-free adhesive layer is formed on the hard core panel. The prepreg and the first metal layer are pressed onto the adhesive layer to form a composite panel. The prepreg is located between the adhesive layer and the first metal layer. The composite panel has a first zone and a second zone that are predetermined to be folded, the second zone being adjacent to the first zone. The first metal layer is patterned to form a first circuit layer. An opening is formed in the first region through the hard core plate to expose a portion of the adhesive layer. The adhesive layer and the prepreg under the bend opening form a curved portion.
在一實施方式中，壓合第一黏著層及第四金屬層於硬式核心板之第一表面上，以及壓合第二黏著層及第二金屬層於硬式核心板之第二表面上。第一黏著層及第二黏著層分別接觸硬式核心板之第一表面及第二表面。圖案化第四金屬層及第二金屬層，以於硬式核心板之第一表面及第二表面上分別形成第四電路層及第二電路層。壓合第一預浸材及第三金屬層於第四電路層上，以及壓合第二預浸材及第一金屬層於第二電路層上，以形成複合板。第一預浸材及第二預浸材分別接觸第四電路層及第二電路層。複合板具有第一區以及第二區鄰接第一區。圖案化第三金屬層及第一金屬層，以於第四電路層及第二電路層上分別形成第三電路層及第一電路層。於第一區形成開口貫穿第一預浸材、第一黏著層及硬式核心板，以露出第二黏著層之一部分，使開口下方之第二黏著層及第二預浸材形成彎曲部。In one embodiment, the first adhesive layer and the fourth metal layer are pressed onto the first surface of the hard core plate, and the second adhesive layer and the second metal layer are pressed onto the second surface of the hard core plate. The first adhesive layer and the second adhesive layer respectively contact the first surface and the second surface of the hard core board. The fourth metal layer and the second metal layer are patterned to form a fourth circuit layer and a second circuit layer on the first surface and the second surface of the hard core plate, respectively. Pressing the first prepreg and the third metal layer on the fourth circuit layer, and pressing the second prepreg and the first metal layer on the second circuit layer to form a composite board. The first prepreg and the second prepreg respectively contact the fourth circuit layer and the second circuit layer. The composite panel has a first zone and a second zone adjacent the first zone. The third metal layer and the first metal layer are patterned to form a third circuit layer and a first circuit layer on the fourth circuit layer and the second circuit layer, respectively. An opening is formed in the first region to penetrate the first prepreg, the first adhesive layer and the hard core plate to expose a portion of the second adhesive layer, so that the second adhesive layer and the second prepreg under the opening form a curved portion.
為了使本揭示內容的敘述更加詳盡與完備，下文針對了本發明的實施態樣與具體實施例提出了說明性的描述；但這並非實施或運用本發明具體實施例的唯一形式。以下所揭露的各實施例，在有益的情形下可相互組合或取代，也可在一實施例中附加其他的實施例，而無須進一步的記載或說明。The description of the embodiments of the present invention is intended to be illustrative and not restrictive. The embodiments disclosed herein may be combined or substituted with each other in an advantageous manner, and other embodiments may be added to an embodiment without further description or description.
在以下描述中，將詳細敘述許多特定細節以使讀者能夠充分理解以下的實施例。然而，可在無此等特定細節之情況下實踐本發明之實施例。在其他情況下，為簡化圖式，熟知的結構與裝置僅示意性地繪示於圖中。In the following description, numerous specific details are set forth However, embodiments of the invention may be practiced without these specific details. In other instances, well-known structures and devices are only schematically shown in the drawings in order to simplify the drawings.
本發明係提供一種彎折式印刷電路板之製造方法。第1A-1D圖係繪示依照本發明一實施方式的一種彎折式印刷電路板之製造方法的各製程階段的剖面示意圖。The present invention provides a method of manufacturing a bent printed circuit board. 1A-1D is a cross-sectional view showing each process stage of a method of manufacturing a bent printed circuit board according to an embodiment of the present invention.
首先，形成不含玻璃纖維的黏著層221於硬式核心板110之一表面上，如第1A圖所示。可使用塗佈製程或快壓製程來形成黏著層221於硬式核心板110的表面上。黏著層221可包含環氧樹脂，但不包含玻璃纖維。硬式核心板110可為由多片預浸材壓合熟化而形成的絕緣板，例如可為FR4板。此外，硬式核心板110可依照電路設計需求及避免整體堆疊結構發生翹曲而有不同種的設計。因此，硬式核心板110可為單層電路板或多層電路板。First, an adhesive layer 221 containing no glass fibers is formed on one surface of the hard core plate 110 as shown in Fig. 1A. The adhesion layer 221 may be formed on the surface of the hard core board 110 using a coating process or a quick press process. Adhesive layer 221 may comprise epoxy but does not comprise fiberglass. The hard core plate 110 may be an insulating plate formed by press-forming and curing a plurality of prepregs, and may be, for example, an FR4 plate. In addition, the hard core board 110 can have different designs depending on circuit design requirements and avoiding warpage of the overall stack structure. Therefore, the hard core board 110 can be a single layer circuit board or a multilayer circuit board.
在一實施例中，可先壓合黏著層221及一層第二金屬層224於硬式核心板110之表面上，如第1A圖所示。黏著層221位於硬式核心板110及第二金屬層224間。然後，移除第二金屬層224以完全露出黏著層221。可使用濕蝕刻製程來完全移除第二金屬層224。In one embodiment, the adhesive layer 221 and the second metal layer 224 may be first pressed onto the surface of the hard core plate 110, as shown in FIG. 1A. The adhesive layer 221 is located between the hard core board 110 and the second metal layer 224. Then, the second metal layer 224 is removed to completely expose the adhesive layer 221. The second metal layer 224 can be completely removed using a wet etch process.
在形成黏著層221後，壓合預浸材231及第一金屬層240於黏著層221上，以形成複合板105，如第1B圖所示，複合板105包含硬式核心板110、黏著層221、預浸材231及第一金屬層240。複合板105具有預定彎折之第一區105a以及第二區105b，第二區105b鄰接第一區105a。也就是說，第一區105a為預定要形成開口190a的區域。第二區105b為預定形成開口190a旁邊的區域。上述堆疊結構可使用傳統壓合機來進行壓合製程。After the adhesive layer 221 is formed, the prepreg 231 and the first metal layer 240 are pressed onto the adhesive layer 221 to form a composite board 105. As shown in FIG. 1B, the composite board 105 includes a hard core board 110 and an adhesive layer 221 The prepreg 231 and the first metal layer 240. The composite panel 105 has a first region 105a and a second region 105b that are predetermined to be folded, and the second region 105b is adjacent to the first region 105a. That is, the first region 105a is a region where the opening 190a is to be formed. The second zone 105b is an area that is intended to form the side of the opening 190a. The above stacked structure can be subjected to a press-bonding process using a conventional press.
然後，圖案化第一金屬層240以形成第一電路層242，如第1C圖所示。圖案化製程可包含有塗佈光阻、微影蝕刻以及去光阻等製程。Then, the first metal layer 240 is patterned to form the first circuit layer 242 as shown in FIG. 1C. The patterning process can include processes such as coating photoresist, photolithography etching, and photoresist removal.
在一實施例中，於圖案化第一金屬層240步驟後可形成軟板油墨180覆蓋第一區105a之預浸材231及第一電路層242，如第1D圖所示。在本實施方式中較佳可包含硬板油墨170與軟板油墨180。硬板油墨170可形成於第一電路層242上。例如可將硬板油墨材料先整個覆蓋在基板上，再利用預烤、曝光、顯影、後烤製程而可形成圖案化的硬板油墨170。圖案化的軟板油墨180則可使用網板印刷製程來製作。In one embodiment, after the step of patterning the first metal layer 240, the prepreg 231 and the first circuit layer 242 of the first region 105a may be formed by the soft ink 180, as shown in FIG. 1D. In the present embodiment, it is preferable to include the hard plate ink 170 and the soft plate ink 180. The hard plate ink 170 may be formed on the first circuit layer 242. For example, the hard-board ink material may be entirely covered on the substrate, and the patterned hard-plate ink 170 may be formed by using a pre-bake, exposure, development, and post-baking process. The patterned soft board ink 180 can be produced using a screen printing process.
接著，於第一區105a中形成一開口190a貫穿硬式核心板110，以露出黏著層221之一部分，如第1D圖所示。形成開口190a的方式為使用具有深度控制能力的盲撈製程。Next, an opening 190a is formed in the first region 105a through the hard core plate 110 to expose a portion of the adhesive layer 221, as shown in FIG. 1D. The manner in which the opening 190a is formed is to use a blind fishing process with depth control capability.
最後，彎折開口190a下方之黏著層221及預浸材231形成彎曲部200a。彎曲部200a之黏著層221的厚度可為20至70μm。在彎曲部200a中，靠近開口190a一側設置有不含玻璃纖維的黏著層221，其彎曲性及柔軟性較預浸材231為佳。黏著層221的下方設置有預浸材231。由於預浸材231含有玻璃纖維，因此玻璃纖維可分散在彎曲時所產生的應力，避免應力集中於某處而導致彎曲部200a斷裂。因此，本彎折式印刷電路板之彎曲性良好，可彎折0至180°。以上述製造方法製得之彎折式印刷電路板可具有至少一層電路層。Finally, the adhesive layer 221 and the prepreg 231 under the bent opening 190a form a curved portion 200a. The thickness of the adhesive layer 221 of the curved portion 200a may be 20 to 70 μm. In the curved portion 200a, an adhesive layer 221 containing no glass fibers is provided on the side close to the opening 190a, and the flexibility and flexibility are better than those of the prepreg 231. A prepreg 231 is provided below the adhesive layer 221. Since the prepreg 231 contains glass fibers, the glass fibers can be dispersed in stress generated during bending, and stress is prevented from being concentrated somewhere to cause the bent portion 200a to be broken. Therefore, the bent printed circuit board has good bendability and can be bent by 0 to 180°. The bent printed circuit board produced by the above manufacturing method may have at least one circuit layer.
本發明係提供另一種彎折式印刷電路板之製造方法。第2圖係繪示依照本發明一實施方式的一種彎折式印刷電路板之製造方法的流程圖。第3A-3G圖係繪示依照本發明一實施方式的一種彎折式印刷電路板之製造方法的各製程階段的剖面示意圖。The present invention provides another method of manufacturing a bent printed circuit board. 2 is a flow chart showing a method of manufacturing a bent printed circuit board according to an embodiment of the present invention. 3A-3G are cross-sectional views showing respective process stages of a method of manufacturing a bent printed circuit board according to an embodiment of the present invention.
在步驟10中，壓合第一黏著層122及第四金屬層124於硬式核心板110之第一表面110a上，以及壓合第二黏著層222及第二金屬層224於硬式核心板110之第二表面110b上，如第3A圖所示。在一實施方式中，也可於壓合製程後完全移除第四金屬層124或第二金屬層224。此外，也可使用塗佈或快壓的方式於硬式核心板110上形成第一黏著層122及第二黏著層222。In step 10, the first adhesive layer 122 and the fourth metal layer 124 are pressed onto the first surface 110a of the hard core board 110, and the second adhesive layer 222 and the second metal layer 224 are pressed into the hard core board 110. The second surface 110b is as shown in Fig. 3A. In an embodiment, the fourth metal layer 124 or the second metal layer 224 may also be completely removed after the pressing process. In addition, the first adhesive layer 122 and the second adhesive layer 222 may be formed on the hard core board 110 by coating or fast pressing.
第一黏著層122及第二黏著層222分別接觸硬式核心板110之第一表面110a及第二表面110b。上述堆疊結構可使用傳統壓合機來進行壓合製程。第一黏著層122和第二黏著層222可包含環氧樹脂，但不包含玻璃纖維。硬式核心板110可為由多片預浸材壓合熟化而形成的絕緣板，例如可為FR4板。在另一實施方式中，硬式核心板可為單層電路板或多層電路板。例如多層電路板可包含一基板，以及設置在基板兩側上之數層電路。若考慮到基板兩側之對稱性，較佳可在基板兩側上設置相同層數的電路，且同一側的數層電路間可另設置有絕緣層。The first adhesive layer 122 and the second adhesive layer 222 respectively contact the first surface 110a and the second surface 110b of the hard core board 110. The above stacked structure can be subjected to a press-bonding process using a conventional press. The first adhesive layer 122 and the second adhesive layer 222 may comprise epoxy but do not comprise glass fibers. The hard core plate 110 may be an insulating plate formed by press-forming and curing a plurality of prepregs, and may be, for example, an FR4 plate. In another embodiment, the hard core board can be a single layer circuit board or a multilayer circuit board. For example, a multilayer circuit board can include a substrate and a plurality of layers of circuitry disposed on both sides of the substrate. Considering the symmetry of the two sides of the substrate, it is preferable to provide the same number of circuits on both sides of the substrate, and an insulating layer may be additionally disposed between the plurality of circuits on the same side.
在一實施方式中，可先提供第一樹脂金屬箔120及第二樹脂金屬箔220。第一樹脂金屬箔120包含上述第四金屬層124以及上述第一黏著層122，第二樹脂金屬箔220包含上述第二金屬層224以及上述第二黏著層222。然後，將第一樹脂金屬箔120壓合在硬式核心板110之第一表面110a上，並將第二樹脂金屬箔220壓合在硬式核心板110之第二表面110b上。上述第一樹脂金屬箔120與第二樹脂金屬箔220可為樹脂銅箔(Resin Coated Copper,RCC)。可利用在銅箔之一側塗佈上一層樹脂，然後經烘箱乾燥而製得樹脂銅箔。In one embodiment, the first resin metal foil 120 and the second resin metal foil 220 may be provided first. The first resin metal foil 120 includes the fourth metal layer 124 and the first adhesive layer 122, and the second resin metal foil 220 includes the second metal layer 224 and the second adhesive layer 222. Then, the first resin metal foil 120 is pressed onto the first surface 110a of the hard core board 110, and the second resin metal foil 220 is pressed against the second surface 110b of the hard core board 110. The first resin metal foil 120 and the second resin metal foil 220 may be a resin copper foil (RCC). A resin copper foil can be obtained by coating a layer of resin on one side of the copper foil and then drying it in an oven.
在步驟20中，圖案化第四金屬層124及第二金屬層224，以於硬式核心板110之第一表面110a及第二表面110b上分別形成第四電路層126及第二電路層226，如第3B圖所示。圖案化製程可包含有塗佈光阻、微影蝕刻以及去光阻等製程。而可在硬式核心板110之兩側上分別形成第四電路層126及第二電路層226。In the step 20, the fourth metal layer 124 and the second metal layer 224 are patterned to form a fourth circuit layer 126 and a second circuit layer 226 on the first surface 110a and the second surface 110b of the hard core board 110, respectively. As shown in Figure 3B. The patterning process can include processes such as coating photoresist, photolithography etching, and photoresist removal. A fourth circuit layer 126 and a second circuit layer 226 may be formed on both sides of the hard core board 110, respectively.
在步驟30中，壓合第一預浸材130及第三金屬層140於第四電路層126上，以及壓合第二預浸材230及第一金屬層240於第二電路層226上，以形成複合板105，如第3C圖所示。第一預浸材130及第二預浸材230分別接觸第四電路層126及第二電路層226。複合板105具有第一區105a以及第二區105b，第二區105b鄰接第一區105a。第一區105a為預定於步驟50中要形成開口的區域。第二區105b為預定形成開口190a旁邊的區域。上述堆疊結構可使用傳統壓合機來進行壓合製程。第一預浸材130與第二預浸材230可包含玻璃纖維與環氧樹脂。具體來說，上述預浸材可包含有B階段(B-stage)的環氧樹脂與玻璃纖維之預浸材。在壓合製程中，軟化的環氧樹脂會稍微流動以填滿電路間的空隙及覆蓋電路。經壓合製程後，環氧樹脂交聯固化而形成C階段(C-stage)的環氧樹脂。In step 30, the first prepreg 130 and the third metal layer 140 are pressed onto the fourth circuit layer 126, and the second prepreg 230 and the first metal layer 240 are pressed onto the second circuit layer 226. To form the composite panel 105, as shown in Figure 3C. The first prepreg 130 and the second prepreg 230 contact the fourth circuit layer 126 and the second circuit layer 226, respectively. The composite panel 105 has a first zone 105a and a second zone 105b, the second zone 105b adjoining the first zone 105a. The first zone 105a is an area intended to form an opening in step 50. The second zone 105b is an area that is intended to form the side of the opening 190a. The above stacked structure can be subjected to a press-bonding process using a conventional press. The first prepreg 130 and the second prepreg 230 may comprise glass fibers and epoxy. Specifically, the prepreg may include a B-stage epoxy resin and a prepreg of glass fiber. During the compression process, the softened epoxy will flow slightly to fill the gaps between the circuits and cover the circuit. After the press-bonding process, the epoxy resin is cross-linked and cured to form a C-stage epoxy resin.
在一實施方式中，於進行步驟30之後，但於進行步驟40之前，更可包含形成至少一通孔150a貫穿第二區105b的堆疊結構。也就是貫穿第三金屬層140、第一預浸材130、第四電路層126、第一黏著層122、硬式核心板110、第二黏著層222、第二電路層226、第二預浸材230及第一金屬層240，如第3D圖所示。然後，形成導電層160於通孔150a中，以電性連接第三金屬層140及第一金屬層240。形成導電層160的方式可為電鍍金屬層於通孔150a中及覆蓋露出的第三金屬層140及第一金屬層240，如第3D圖所示。In an embodiment, after performing step 30, but before performing step 40, a stack structure in which at least one via hole 150a is formed through the second region 105b may be further included. That is, through the third metal layer 140, the first prepreg 130, the fourth circuit layer 126, the first adhesive layer 122, the hard core board 110, the second adhesive layer 222, the second circuit layer 226, and the second prepreg 230 and the first metal layer 240 are as shown in FIG. 3D. Then, the conductive layer 160 is formed in the via hole 150a to electrically connect the third metal layer 140 and the first metal layer 240. The conductive layer 160 may be formed by plating a metal layer in the via 150a and covering the exposed third metal layer 140 and the first metal layer 240, as shown in FIG. 3D.
在步驟40中，圖案化第三金屬層140及第一金屬層240，以於第四電路層126及第二電路層226上分別形成第三電路層142及第一電路層242，如第3E圖所示。圖案化製程可包含有塗佈光阻、微影蝕刻以及去光阻等製程。如第3E圖所示，由於導電層160覆蓋於第三金屬層140及第一金屬層240上，因此所形成的第三電路層142及第一電路層242上覆蓋有導電層160。In step 40, the third metal layer 140 and the first metal layer 240 are patterned to form a third circuit layer 142 and a first circuit layer 242 on the fourth circuit layer 126 and the second circuit layer 226, respectively, such as 3E. The figure shows. The patterning process can include processes such as coating photoresist, photolithography etching, and photoresist removal. As shown in FIG. 3E, since the conductive layer 160 covers the third metal layer 140 and the first metal layer 240, the formed third circuit layer 142 and the first circuit layer 242 are covered with the conductive layer 160.
在一實施方式中，於步驟40後，更可包含形成軟板油墨180覆蓋第一區105a之第一電路層242及第二預浸材230，如第3F圖所示。在上述步驟前，可先形成硬板油墨170於通孔150a中並覆蓋第二區105b之第三電路層142及第一電路層242。上述硬板油墨170與軟板油墨180是一種高分子絕緣材，用以覆蓋及保護電路層。可先將硬板油墨材料先整個覆蓋在基板上，再利用預烤、曝光、顯影、後烤製程而可形成圖案化的硬板油墨170。圖案化的軟板油墨180則可使用網板印刷製程來製作。軟板油墨180的延展性較硬板油墨170為佳，可耐多次彎曲而不會斷裂。由於第一區105a的堆疊結構欲作為彎曲部200a，因此設置軟板油墨180於第一區105a的外側表面上。第二區105b的堆疊結構由於不需彎曲，所以於第二區105b的外側表面設置硬板油墨170即可。此外，軟板油墨180可重疊第二區105b一部分的硬板油墨170。In an embodiment, after step 40, the first circuit layer 242 and the second prepreg 230 covering the first region 105a may be formed by the soft ink 180, as shown in FIG. 3F. Before the above steps, the hard ink 170 is formed in the through hole 150a and covers the third circuit layer 142 of the second region 105b and the first circuit layer 242. The hard plate ink 170 and the soft plate ink 180 are a polymer insulating material for covering and protecting the circuit layer. The hard-board ink material may be entirely covered on the substrate first, and then the patterned hard-plate ink 170 may be formed by using a pre-bake, exposure, development, and post-baking process. The patterned soft board ink 180 can be produced using a screen printing process. The flexibility of the soft board ink 180 is better than that of the hard board ink 170, and can withstand multiple bending without breaking. Since the stacked structure of the first region 105a is intended to be the curved portion 200a, the soft ink 180 is disposed on the outer side surface of the first region 105a. Since the stacked structure of the second region 105b does not need to be bent, the hard-plate ink 170 may be provided on the outer surface of the second region 105b. Additionally, the softboard ink 180 may overlap the hardboard ink 170 of a portion of the second zone 105b.
在步驟50中，於第一區105a形成開口190a貫穿第一預浸材130、第一黏著層122及硬式核心板110，以露出第二黏著層222之一部分，如第3G圖所示。在一實施方式中，形成開口190a的方式為使用具有深度控制能力的盲撈製程。也就是沿著垂直於板材表面的方向從第一預浸材130的表面向下除去一部分的堆疊結構，直至露出第二黏著層222為止。在形成開口190a的製程中可以深度控制方式來控制需除去的堆疊結構的厚度。In step 50, an opening 190a is formed in the first region 105a through the first prepreg 130, the first adhesive layer 122, and the hard core plate 110 to expose a portion of the second adhesive layer 222, as shown in FIG. 3G. In one embodiment, the manner in which the opening 190a is formed is to use a blind fishing process with depth control capabilities. That is, a portion of the stacked structure is removed downward from the surface of the first prepreg 130 in a direction perpendicular to the surface of the sheet until the second adhesive layer 222 is exposed. The thickness of the stacked structure to be removed can be controlled in a depth control manner in the process of forming the opening 190a.
在一實施方式中，露出部分之第二黏著層222的厚度為20至70 μm。開口190a下方之第二黏著層222及第二預浸材230形成彎曲部200a。在一實施方式中，第一區105a之露出部分之第二黏著層222、第二電路層226、第二預浸材230、第一電路層242及軟板油墨180的總厚度為0.2至0.25 mm。在彎曲部200a中，靠近開口190a一側設置有不含玻璃纖維的第二黏著層222，其彎曲性及柔軟性較預浸材為佳。第二黏著層222的下方設置有第二預浸材230。由於第二預浸材230中含有玻璃纖維，因此玻璃纖維可分散在彎曲時所產生的應力，避免應力集中於某處而導致彎曲部200a斷裂。此彎折式印刷電路板可作90°彎折，甚至可達到180°的彎折。也就是說，此彎折式印刷電路板可彎折0至180°。如第3G圖所示之彎折式印刷電路板，在彎曲半徑為3.3mm，180°彎曲的條件下，可彎曲至少50次以上。在彎曲半徑為3.3mm，90°彎曲的條件下可彎曲至少200次以上。In one embodiment, the exposed portion of the second adhesive layer 222 has a thickness of 20 to 70 μm. The second adhesive layer 222 and the second prepreg 230 under the opening 190a form a curved portion 200a. In one embodiment, the total thickness of the second adhesive layer 222, the second circuit layer 226, the second prepreg 230, the first circuit layer 242, and the soft ink 180 of the exposed portion of the first region 105a is 0.2 to 0.25. Mm. In the curved portion 200a, a second adhesive layer 222 containing no glass fibers is provided on the side close to the opening 190a, and the flexibility and flexibility are better than those of the prepreg. A second prepreg 230 is disposed under the second adhesive layer 222. Since the second prepreg 230 contains glass fibers, the glass fibers can be dispersed in stress generated during bending, and stress is prevented from being concentrated somewhere to cause the bent portion 200a to be broken. The bent printed circuit board can be bent at 90° and even bent at 180°. That is to say, the bent printed circuit board can be bent by 0 to 180°. The bent printed circuit board as shown in Fig. 3G can be bent at least 50 times under the conditions of a bending radius of 3.3 mm and a bending of 180°. It can be bent at least 200 times under the conditions of a bending radius of 3.3 mm and a bending of 90°.
第3G圖所示的彎折式印刷電路板總共有四層線路。在其他實施方式中，彎折式印刷電路板可包含有四層以上之線路。但其彎曲部仍包含有一層黏著層及一層預浸材。The bent printed circuit board shown in Fig. 3G has a total of four layers of wiring. In other embodiments, the flex printed circuit board can include more than four layers of circuitry. However, the curved portion still contains an adhesive layer and a layer of prepreg.
由此可知，本製造方法之製造成本與材料成本均低，且製備出的彎折式印刷電路板可作90°或180°彎折，具有良好的彎曲特性。It can be seen that the manufacturing cost and the material cost of the manufacturing method are both low, and the prepared bent printed circuit board can be bent at 90° or 180°, and has good bending characteristics.
雖然本發明已以實施方式揭露如上，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.
105．．．複合板105. . . Composite board
105a．．．第一區105a. . . First district
105b．．．第二區105b. . . Second district
110．．．硬式核心板110. . . Hard core board
110a．．．第一表面110a. . . First surface
110b．．．第二表面110b. . . Second surface
120．．．第一樹脂金屬箔120. . . First resin metal foil
122．．．第一黏著層122. . . First adhesive layer
124．．．第四金屬層124. . . Fourth metal layer
126．．．第四電路層126. . . Fourth circuit layer
130．．．第一預浸材130. . . First prepreg
140．．．第三金屬層140. . . Third metal layer
142．．．第三電路層142. . . Third circuit layer
150a．．．通孔150a. . . Through hole
160．．．導電層160. . . Conductive layer
170．．．硬板油墨170. . . Hard board ink
180．．．軟板油墨180. . . Soft board ink
190a．．．開口190a. . . Opening
200a．．．彎曲部200a. . . Bending
220．．．第二樹脂金屬箔220. . . Second resin metal foil
221．．．黏著層221. . . Adhesive layer
222．．．第二黏著層222. . . Second adhesive layer
224．．．第二金屬層224. . . Second metal layer
226．．．第二電路層226. . . Second circuit layer
230．．．第二預浸材230. . . Second prepreg
231．．．預浸材231. . . Prepreg
240．．．第一金屬層240. . . First metal layer
242．．．第一電路層242. . . First circuit layer
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂，所附圖式之說明如下：The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood.
第1A-1D圖係繪示依照本發明一實施方式的一種彎折式印刷電路板之製造方法的各製程階段的剖面示意圖。1A-1D is a cross-sectional view showing each process stage of a method of manufacturing a bent printed circuit board according to an embodiment of the present invention.
第2圖係繪示依照本發明一實施方式的一種彎折式印刷電路板之製造步驟流程圖。2 is a flow chart showing the manufacturing steps of a bent printed circuit board according to an embodiment of the present invention.
第3A-3G圖係繪示依照本發明一實施方式的一種彎折式印刷電路板之製造方法的各製程階段示意圖。3A-3G are schematic views showing respective process stages of a method of manufacturing a bent printed circuit board according to an embodiment of the present invention.
105a．．．第一區105a. . . First district
105b．．．第二區105b. . . Second district
110．．．硬式核心板110. . . Hard core board
122．．．第一黏著層122. . . First adhesive layer
126．．．第四電路層126. . . Fourth circuit layer
130．．．第一預浸材130. . . First prepreg
142．．．第三電路層142. . . Third circuit layer
160．．．導電層160. . . Conductive layer
170．．．硬板油墨170. . . Hard board ink
180．．．軟板油墨180. . . Soft board ink
190a．．．開口190a. . . Opening
200a．．．彎曲部200a. . . Bending
222．．．第二黏著層222. . . Second adhesive layer
226．．．第二電路層226. . . Second circuit layer
230．．．第二預浸材230. . . Second prepreg
242．．．第一電路層242. . . First circuit layer
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| CN201110338678.7A CN103096647B (en) | 2011-10-31 | 2011-10-31 | The manufacture method of folding type printed circuit board (PCB) |
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| WO2014207822A1 (en) * | 2013-06-25 | 2014-12-31 | 株式会社メイコー | Printed wiring board |
| WO2015079713A1 (en) | 2014-01-14 | 2015-06-04 | 株式会社メイコー | Printed circuit board |
| CN106163080B (en) * | 2015-04-14 | 2018-08-31 | 常熟精元电脑有限公司 | Flexible circuit board |
| CN106714453B (en) * | 2016-12-21 | 2019-04-02 | 江门崇达电路技术有限公司 | A kind of false rigid-flex combined board and preparation method thereof |
| CN108990320A (en) * | 2018-08-02 | 2018-12-11 | 瑞声光电科技（苏州）有限公司 | Flexible circuit board and preparation method thereof |
| KR20200106342A (en) * | 2019-03-04 | 2020-09-14 | 삼성전기주식회사 | Printed Circuit Board and manufacturing method for the same |
| KR102268389B1 (en) * | 2019-09-11 | 2021-06-23 | 삼성전기주식회사 | Printed circuit board and antenna module comprising the same |
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| DE4003344C1 (en) * | 1990-02-05 | 1991-06-13 | Fa. Carl Freudenberg, 6940 Weinheim, De | |
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| JPH08125342A (en) * | 1994-10-21 | 1996-05-17 | Nec Corp | Flexible multilayered wiring board and its manufacture |
| JP3176858B2 (en) * | 1996-12-11 | 2001-06-18 | 日本メクトロン株式会社 | Double-sided copper-clad printed wiring board |
| JP2003031950A (en) * | 2001-07-12 | 2003-01-31 | Sony Corp | Multilayered wiring board and manufacturing method therefor |
| JP2004031682A (en) * | 2002-06-26 | 2004-01-29 | Sony Corp | Method of manufacturing printed wiring board |
| KR100512688B1 (en) * | 2003-11-21 | 2005-09-07 | 대덕전자 주식회사 | Method of manufacturing capacitor-embedded printed circuit board |
| CN101072468A (en) * | 2006-05-11 | 2007-11-14 | 冠品化学股份有限公司 | Flexible printed circuit board substrate |
| AT10029U1 (en) * | 2007-02-16 | 2008-07-15 | Austria Tech & System Tech | METHOD FOR PRODUCING A RIGID FLEXIBLE PCB AND RIGID FLEXIBLE PCB |
| AT11664U1 (en) * | 2007-02-16 | 2011-02-15 | Austria Tech & System Tech | METHOD FOR REMOVING A PARTIAL AREA OF A SURFACE MATERIAL LAYER AND MULTILAYER STRUCTURE AND USE HIEFÜR |
| US20100155109A1 (en) * | 2008-12-24 | 2010-06-24 | Ibiden Co., Ltd. | Flex-rigid wiring board and method for manufacturing the same |
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| CN103096647A (en) | 2013-05-08 |
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